M381030 四、 指定代表圖： (一) 本案指定代表圖為：第（一）圖。 (二) 本代表圖之元件符號簡單說明： 1 散熱鰭片組 111 散熱鰭片 112 卡扣凹口 113 穿孔 114 氣流通孔 12 鋼性導熱材 13 撓性超導體 131 撓性管體 132 作動流體 五、 新型說明： 【新型所屬之技術領域】 本創作係有關一種散熱裝置，尤指一種能夠有效提升 散熱鰭片之熱傳導效率，並增加散熱鰭片空氣對流速率之 散熱裝置。 【先前技術】 按，目前利用發光二極體作為照明用途時，仍必須有 相當數量的發光二極體同時運作，方得以達到傳統白熾燈 泡或日光燈管之亮度表現效果；這些數量不等之發光二極 M381030 體係以特定排列方式建構在一基板上，一般基板多係為印 刷電路板（PCB)，印刷電路板之材料特性並不利於發光二 極體元件與散熱座之間得熱傳導。 因此一般使用發光二極體之照明燈具運作一段時間 之後’其基板上的發光二極體即會發生嚴重聚熱之現象， +但無法保持發光一極體之照度’更會因此降低發光二極 體元件之使用壽命。以致於，類似使用發光二極體之照明 燈具’多會在基板上或是燈具外部設有散熱鰭片，以期透 鲁過散熱鰭片之設計，能夠借助空氣對流之方式達到散熱效 果。 ’、、、 由於散熱鰭片主要利用空氣對流達到散熱效果，目前 以單固相的金屬材料所製成之散熱鰭片，由於其熱傳導係 數幾乎為固定值看來（銅及鋁的係數值分別約393W/mk 及238W/mk)，單純僅靠散熱鰭片空氣對流達到散熱效果 之散熱裝置’似乎已不足以應付發光二極體照明燈^因為 晶片過熱所衍生的課題。 -【新型内容】 有鑑於此，本創作即在提供一種能夠有欵提升散熱罐 片之熱傳導效率’並增加散熱鰭片空氣對流迷率之散熱裝 置’為其主要目的者。 為達上揭目的，本創作之散熱裝置係在各組散熱韓片 組基部設有至少一鋼性導熱材延伸於各散熱鳍片之間，另 有至少一撓性超導體穿設於各散熱鰭片之間，該至少一撓 3 M381030 端係與該至少一鋼性導熱材相焊接’·以及， 在各=鰭片之相對應位置設有至少—氣流通孔。 體，藉由作係、在—撓性管體内部填充有作動流 = 作動机體相變化過程中吸收與散出大量潛熱的循 秣仃、續性的熱傳輸，以致撓性超導體可在溫度幾乎 ，持不變的狀況下扮演快速傳輸大量熱能的導熱效果，以 提升散熱鰭片之熱料效率。以及，配合在各氣流通孔之 作用下，可相對增加散熱鰭片之空氣對流速率。 【實施方式】 本創作之特點，可參閱本案圖式及實施例之詳細說明 而獲得清楚地瞭解。 如第一圖及第二圖所示，本創作之散熱裝置係包括 有·至少一組散熱鰭片組11、至少一鋼性導熱材12，以 及至少一撓性超導體13 ;其中：各組散熱·鰭片組Η係在 各散熱缠片111之片體基部相對應設有至少一卡扣四口 112供該至少一鋼性導熱材12相對嵌入，各散熱鰭片in 之片體上並相對應設有至少一穿孔113供該至少一撓性 超導體13穿置，以及在各散熱鰭片π!之片體上相對應 設有至少一氣流通孔114供做為氣流進出各組散熱鰭片 組11之通道。 該至少一鋼性導熱材12係相對配置於各組散熱鳍片 組11基部並延伸於各散熱鰭片m之片體之間，其係為 相對敌入各散熱鰭片111之卡扣凹口 112中之銅製方形桿 M381030 •狀結構體，並於桿體上預設有若干定位點121供各散熱鰭 片111定位之用。 該至少一撓性超導體13係相對穿置於各散熱鰭片 111之片體之間，其一端並與該至少一鋼性導熱材12相 焊接；於實施時，該至少一撓性超導體13係具有一撓性 管體131，並於該撓性管體131内部填充有作動流體132, 該撓性管體131係相對穿過各散熱鰭片111之穿孔113， 並由該撓性管體131之一端與該至少一鋼性導熱材12相 籲焊接。 另外，如第三圖及第四圖所示，整體散熱裝置係進一 步包括有一導熱固定座14,該導熱固定座14之頂面設有 至少一定位凹部141，供該至少一組散熱鰭片組11嵌入， 使得以增加整體散熱裝置之結構強度，並透過該導熱固定 座14與使用對象（如圖所示之發光二極體燈具20)之熱源 接觸。 整體散熱裝置於使用時，即利用各組散熱鰭片組11 _所產生之空氣對流達到散熱效果，並藉由各組散熱鰭片組 .11之撓性超導體13内部作動流體132相變化過程中吸收 與散出大量潛熱的循環，進行連續性的熱傳輸，以致撓性 超導體13可在溫度幾乎保持不變的狀況下扮演快速傳輸 大量熱能的導熱效果，以提升散熱鰭片111之熱傳導效 率。以及，可配合在各氣流通孔114之作用下，相對增加 散熱鰭片111之空氣對流速率。 綜上所述，本創作提供一較佳可行之散熱裝置，爰依 5 M381030 法提呈新型專利之申請；本創作之技術内容及技術特點巳 揭示如上，然而熟悉本項技術之人士仍可能基於本創作之 揭示而作各種不背離本案創作精神之替換及修飾。因此， 本創作之保護範圍應不限於實施例所揭示者，而應包括各 種不背離本創作之替換及修飾，並為以下之申請專利範圍 所涵蓋。 【圖式簡單說明】 第一圖係為本創作第一實施例之外觀結構圖。 第二圖係為本創作中鋼性導熱材與撓性超導體之外觀結 構圖。 第三圖係為本創作第一實施例之結構分解圖。 第四圖係為本創作第二實施例之使用狀態參考圖。 【主要元件符號說明 11 散熱鰭片組 111 散熱鰭片 112 卡扣凹口 113 穿孔 114 氣流通孔 12 鋼性導熱材 121 定位點 13 撓性超導體 131 撓性管體 132 作動流體 14 導熱固定座 141 定位凹部 20 發光二極體燈具M381030 IV. Designated representative map: (1) The representative representative of the case is: (1). (2) Brief description of the component symbols of the representative diagram: 1 Heat sink fin set 111 Heat sink fin 112 Buckle recess 113 Pierce 114 Air flow hole 12 Steel heat conductor 13 Flexible superconductor 131 Flexible pipe body 132 Actuating fluid five New type of description: [New technical field] This creation is related to a heat sink, especially a heat sink that can effectively improve the heat transfer efficiency of the fins and increase the air convection rate of the fins. [Prior Art] According to the current use of light-emitting diodes for lighting purposes, a certain number of light-emitting diodes must still be operated at the same time to achieve the brightness performance of traditional incandescent bulbs or fluorescent tubes; The two-pole M381030 system is constructed on a substrate in a specific arrangement. Generally, the substrate is mostly a printed circuit board (PCB). The material characteristics of the printed circuit board are not favorable for heat conduction between the light-emitting diode element and the heat sink. Therefore, after a lighting fixture of a light-emitting diode is used for a period of time, the phenomenon of severe heat accumulation on the light-emitting diode on the substrate may occur, but the illuminance of the light-emitting body may not be maintained, thereby reducing the light-emitting diode. The service life of the body components. Therefore, similar lighting fixtures using light-emitting diodes will have heat-dissipating fins on the substrate or outside the lamp, in order to thoroughly pass through the design of the heat-dissipating fins, and the heat-dissipating effect can be achieved by means of air convection. ',,,, because the heat sink fins mainly use air convection to achieve heat dissipation, the heat sink fins made of single solid phase metal materials are almost fixed values because of their thermal conductivity (the coefficient values of copper and aluminum are respectively About 393W/mk and 238W/mk), the heat sink that relies solely on the heat dissipation of the fins to achieve the heat dissipation effect seems to be insufficient to cope with the problem caused by the overheating of the LED. - [New content] In view of this, the present invention is to provide a heat dissipating device capable of improving the heat transfer efficiency of the heat dissipating fins and increasing the air convection of the fins. In order to achieve the above, the heat dissipation device of the present invention is provided with at least one steel heat conduction material extending between the heat dissipation fins at the base of each group of heat dissipation Korean sheets, and at least one flexible superconductor is disposed on each heat dissipation fin. Between the sheets, the at least one trimming 3 M381030 end is welded to the at least one steel heat conductive material and the at least one air flow through hole is provided at a corresponding position of each of the fins. Body, by the system, the inside of the flexible pipe body is filled with the actuating flow = the heat transfer that absorbs and disperses a large amount of latent heat during the change of the body phase, so that the flexible superconductor can be at the temperature Almost, under constant conditions, it plays a thermal transfer effect that rapidly transfers a large amount of heat to improve the heat efficiency of the fins. And, in cooperation with the airflow through holes, the air convection rate of the heat dissipation fins can be relatively increased. [Embodiment] The characteristics of this creation can be clearly understood by referring to the detailed description of the drawings and the embodiments. As shown in the first and second figures, the heat dissipation device of the present invention includes at least one set of heat dissipation fins 11, at least one steel heat conductive material 12, and at least one flexible superconductor 13; wherein: each group of heat dissipation The fin assembly is provided with at least one buckle four 112 at the base of each of the heat dissipation dies 111 for the at least one steel heat conductive material 12 to be relatively embedded, and the heat dissipation fins are in phase with each other. Correspondingly, at least one through hole 113 is disposed for the at least one flexible superconductor 13 to be disposed, and at least one airflow through hole 114 is correspondingly disposed on each of the heat dissipation fins π! 11 channel. The at least one steel heat conductive material 12 is disposed opposite to the base of each of the heat dissipation fin sets 11 and extends between the heat dissipation fins m, and is a snap recess corresponding to each of the heat dissipation fins 111. The copper square rod M381030 in the shape of 112 is a structural body, and a plurality of positioning points 121 are pre-positioned on the rod body for positioning the heat dissipation fins 111. The at least one flexible superconductor 13 is interposed between the sheets of the heat dissipation fins 111 and is welded to the at least one steel heat conductive material 12 at one end. In implementation, the at least one flexible superconductor 13 is The flexible tubular body 131 is filled with an actuating fluid 132. The flexible tubular body 131 is opposed to the through hole 113 of each of the heat radiating fins 111, and the flexible tubular body 131 is opposed to the flexible tubular body 131. One end is in contact with the at least one steel heat conductive material 12 for welding. In addition, as shown in the third and fourth figures, the overall heat dissipation device further includes a heat-conducting fixing seat 14 , and the top surface of the heat-conducting fixing seat 14 is provided with at least one positioning concave portion 141 for the at least one set of heat-dissipating fins The 11 is embedded so as to increase the structural strength of the overall heat sink and is in contact with the heat source of the object (such as the light-emitting diode lamp 20 shown) through the heat-conducting mount 14. When the overall heat dissipating device is in use, the air convection generated by each group of fins 11 _ is used to achieve a heat dissipating effect, and the internal working fluid 132 is changed by the flexible superconductor 13 of each group of fins. The cycle of absorbing and dissipating a large amount of latent heat is performed for continuous heat transfer, so that the flexible superconductor 13 can play a heat transfer effect of rapidly transferring a large amount of heat energy while maintaining the temperature almost unchanged, thereby improving the heat transfer efficiency of the heat radiating fins 111. Moreover, the air convection rate of the heat dissipation fins 111 can be relatively increased by the action of the airflow through holes 114. In summary, the present invention provides a better and feasible heat sink device, and submits a new patent application according to the 5 M381030 method; the technical content and technical features of the present invention are disclosed above, but those skilled in the art may still be based on The disclosure of this creation is a variety of alternatives and modifications that do not depart from the spirit of the creation of this case. Therefore, the scope of protection of the present invention is not limited to the embodiments disclosed, but includes various alternatives and modifications that do not depart from the present invention and are covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an external structure diagram of the first embodiment of the creation. The second figure is the appearance of the steel thermal conductive material and flexible superconductor in this creation. The third figure is an exploded view of the first embodiment of the creation. The fourth figure is a reference view of the use state of the second embodiment of the present creation. [Main component symbol description 11 Heat sink fin set 111 Heat sink fin 112 snap recess 113 Perforation 114 Air flow hole 12 Steel heat conductive material 121 Positioning point 13 Flexible superconductor 131 Flexible pipe body 132 Actuating fluid 14 Thermal heat shield 141 Positioning recess 20 light emitting diode lamp