CN209909625U - High-power LED lamp and radiator thereof - Google Patents
High-power LED lamp and radiator thereof Download PDFInfo
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- CN209909625U CN209909625U CN201920877644.7U CN201920877644U CN209909625U CN 209909625 U CN209909625 U CN 209909625U CN 201920877644 U CN201920877644 U CN 201920877644U CN 209909625 U CN209909625 U CN 209909625U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 61
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- 238000005452 bending Methods 0.000 claims description 7
- 241000255925 Diptera Species 0.000 claims description 4
- 210000004907 gland Anatomy 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
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- 238000010438 heat treatment Methods 0.000 abstract description 8
- 241001465382 Physalis alkekengi Species 0.000 abstract description 4
- 230000037396 body weight Effects 0.000 abstract description 4
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000002791 soaking Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
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- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a high-power LED lamp and radiator thereof, it comprises radiator, light-emitting component, power supply module and support. The utility model discloses an use the shape to be hollow columnar heating panel that has a heat superconducting pipe way as the radiator, heat source base plate and heating panel extension contact are good, the inside helical structure that is of cavity, heat radiating area is big, LED chip heat can be fast even spread to whole heat dissipation cavity on, compare in conventional radiator, the soaking is good, increase with the external difference in temperature, effective heat radiating area further promotes, the heat-sinking capability and the heat exchange efficiency of LED lamp have been improved greatly, reduce lamp body weight and improve lighting device's reliability and stability by a wide margin, reduce the light decay and the energy consumption of lamps and lanterns by a wide margin.
Description
Technical Field
The utility model relates to a LED lamp illumination field, in particular to high-power LED lamp and radiator thereof.
Background
With the development of society, LED lamps are becoming more popular because of their advantages of long life, low consumption, miniaturization, directionality, no light source pollution, and being able to light on, off, and flash instantly. However, the high-power LED lamp generates a large amount of heat when emitting light, the heat dissipation of the LED lamp chip used at present is based on the traditional heat transfer mechanism and the corresponding heat transfer technology, the heat dissipation area is concentrated near the local part of the LED light source, the heat dissipation effect is poor, and the heat dissipation efficiency is low, so that the light attenuation of the high-power LED lamp is high, and the service effect and the service life of the high-power LED lamp are affected.
The traditional method for increasing the heat dissipation effect of the LED lamp is as follows: the lamp generally adopts a large number of radiating fins and fins or adds a heating pipe or a vapor chamber in the lamp to enhance the radiating effect, so that the whole lamp has larger weight, complex internal design, more heat transfer interfaces and larger thermal resistance, and finally the cost is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-power LED lamp and radiator thereof mainly solves the not good, the big, the complicated problem of design of radiating effect that exists among the above-mentioned technique. The utility model discloses use high-efficient heat transfer technique as the core, unite light, electricity, carry out the integrated design, reduce lamp body weight and improve lighting device's reliability and stability by a wide margin, reduce the light decay and the energy consumption of lamps and lanterns by a wide margin.
In order to achieve the above and other related objects, the present invention provides a high power LED lamp and a heat sink thereof, which comprises a heat sink, a light emitting assembly, a power assembly and a bracket; the radiator comprises at least one radiating plate; the power supply assembly comprises a lamp holder and a lamp cover; the light-emitting component consists of a heat source substrate, an LED chip, a lens/glass and a lens/glass gland; the radiator is positioned between the lamp cap and the light-emitting component; the bracket keeps the radiator stable in structure, and connects the lamp holder part with the radiator and the light-emitting component together to form a complete LED lamp.
The radiator is a hollow cylindrical cavity formed by spirally bending and processing at least one radiating plate; the heat dissipation plate is internally provided with a closed heat superconducting pipeline, and a heat transfer working medium is filled in the heat superconducting pipeline; the heat dissipation plate is provided with an extending end, and after the heat dissipation plate is spirally bent into a hollow cylindrical framework, the extending end of the heat dissipation plate is connected with the heat source substrate; the heat dissipation plate is characterized in that the extending end of the heat dissipation plate is provided with a heat superconducting pipeline, one end of the heat superconducting pipeline on the extending end of the heat dissipation plate is closed, and the other end of the heat superconducting pipeline is communicated with the heat superconducting pipeline on the main body part of the heat dissipation plate.
Preferably, the heat radiator comprises n spirally bent heat radiation plates, wherein n is more than or equal to 1.
Preferably, the spiral shape of the heat dissipation plate is a mosquito coil type spiral, and the spiral bending angles and degrees of the heat dissipation plate are the same.
Preferably, the cross-sectional shape of the radiator cavity is circular, rectangular with round corners, square or polygonal.
Preferably, each heat dissipation plate is provided with at least one extending end, the extending end is integrally formed with the main body part of the heat dissipation plate, and the extending end of the heat dissipation plate is connected with the heat source substrate.
Preferably, the high-power LED lamp support upper cover and the support bottom plate are respectively provided with a channel corresponding to the cavity spiral structure, and the channels are used for keeping the radiator cavity structure stable.
Preferably, the light emitting assembly is mounted on the heat source substrate, the LED chip is mounted on the heat source substrate, and the lens/glass covers the periphery of the LED chip and is fixed on the heat source substrate through the lens/glass pressing cover.
Preferably, the material of the heat source substrate is copper, copper alloy, aluminum alloy, ceramic or glass fiber.
Preferably, the heat sink comprises at least one heat dissipation plate spirally bent in a mosquito coil shape; the heat dissipation plate is internally provided with a closed heat superconducting pipeline, and a heat transfer working medium is filled in the heat superconducting pipeline; each heat dissipation plate is provided with at least one extending end, the extending end and the main body part of the heat dissipation plate are integrally formed, and the extending end of the heat dissipation plate is connected with the heat source substrate; the heat dissipation plate is characterized in that the extending end of the heat dissipation plate is provided with a heat superconducting pipeline, one end of the heat superconducting pipeline on the extending end of the heat dissipation plate is closed, and the other end of the heat superconducting pipeline is communicated with the heat superconducting pipeline on the main body part of the heat dissipation plate.
As above, the utility model discloses a high-power LED lamp and radiator thereof has following beneficial effect: the utility model discloses an use the outside to be hollow columnar heating panel that has a heat superconducting pipe way as the radiator, heat source base plate and heating panel contact are good, the inside helical structure that is of cavity, heat radiating area is big, LED chip heat can be fast even spread to whole heat dissipation cavity on, compare in conventional radiator, the soaking is good, increase with the external difference in temperature, effective heat radiating area further promotes, the heat-sinking capability and the heat exchange efficiency of LED lamp have been improved greatly, reduce lamp body weight and improve lighting device's reliability and stability by a wide margin, reduce the light decay and the energy consumption of lamps and lanterns by a wide margin.
Drawings
Fig. 1 shows an exploded schematic view of a high power LED lamp according to the present invention.
Fig. 2 shows a schematic structural diagram of a high-power LED lamp according to the present invention.
Fig. 3 is an expanded view of the heat dissipating plate of the heat dissipating device of the present invention.
Fig. 4A-4B illustrate bottom views of different profile heat sink structures according to the present invention.
In the figure: 11-lamp cap, 12-lamp cap, 21-bracket upper cover, 22-bracket strip, 23-bracket bottom plate, 24-bayonet, 31-heat dissipation plate, 311-first extension end, 312-second extension end, 313-third extension end, 314-heat superconducting pipeline, 41-heat source substrate, 42-LED chip, 43-lens/glass and 44-lens/glass gland.
Detailed Description
The embodiments of the present invention will be described in detail with reference to the specific embodiments, and other advantages and effects of the invention will be apparent to those skilled in the art from the disclosure herein, and the invention may be embodied or applied in other different forms without departing from the spirit of the invention.
Referring to fig. 1 to 4, it should be noted that the drawings provided in the present embodiment are only schematic illustrations for explaining the basic idea of the present invention, and although the drawings show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Referring to fig. 1 to 4, the present invention provides a high power LED lamp, which includes a power module, a heat sink, a heating module and a bracket; the power supply assembly comprises a lamp holder 11 and a lamp cover 12; the heat sink includes at least one heat dissipation plate 31; the light-emitting component consists of a heat source substrate 41, an LED chip 42, a lens/glass 43 and a lens/glass gland 44; the heat sink is located between the lamp cover 12 and the light emitting assembly.
The radiator comprises at least one hollow cylindrical cavity formed by a radiating plate 31, the hollow cylindrical cavity is formed by spirally bending and processing the plate-shaped radiating plate 31, a closed heat superconducting pipeline 314 is arranged in the radiating plate 31, and a heat transfer working medium (not shown) is filled in the heat superconducting pipeline 314; the heat dissipation plate 31 has a first protruding end 311 and a second protruding end 312, and after the heat dissipation plate is spirally bent into a hollow cylindrical cavity, the protruding end 311 of the heat dissipation plate is connected with the heat source substrate 41; the heat dissipation plate extending end 311 has a heat superconducting pipe 314 therein, and the heat superconducting pipe on the heat dissipation plate extending end is closed at one end and communicated with the heat superconducting pipe of the main body portion of the heat dissipation plate at the other end.
It is understood that the closed thermal superconducting pipe 314 is in the shape of a hexagonal honeycomb, a polygonal shape, a circular shape, a zigzag shape, or any combination of any one or more of these patterns. The filled heat transfer working medium can be gas or liquid or a mixture of gas and liquid, such as water, oil, refrigerant and the like. The heat dissipation plate 31 filled with the heat transfer working medium has the characteristics of heat absorption, high heat transfer rate and good temperature uniformity, can quickly absorb heat in the working process of the LED lamp, and uniformly spreads the heat.
As an example, referring to fig. 3, the protruding structure corresponding to the heat superconducting pipe 314 is a double-side expanding structure on the heat dissipation plate 31, and in other embodiments, the protruding structure may also be a single-side expanding structure or a double-side flat structure.
As an example, the heat sink includes n pieces of the spirally bent heat dissipation plates 31, where the specific value of n can be selected according to actual needs, and preferably, n ≧ 1 in this embodiment.
As an example, referring to fig. 1, fig. 2 and fig. 4, the heat dissipation plate 31 in the heat sink is a spiral bending structure and is a mosquito coil type spiral; the spiral bending angles and degrees of the heat dissipation plates are the same, and the heat dissipation plates in the hollow cylindrical cavity are not in contact with each other and are only in contact with the outermost periphery of the cavity.
Referring to fig. 4A to 4B, the shape of the cavity and the number of heat dissipation plates may be set according to actual needs, the bottom view of the heat dissipation cavity may be rectangular with rounded corners, and the cavity includes 2 heat dissipation plates as shown in fig. 4A; the bottom view of the heat dissipation cavity can also be circular, and the cavity comprises 3 heat dissipation plates, as shown in fig. 4B. Fig. 4A to 4B are only two examples, and the shape of the bottom view of the heat dissipation cavity in the present invention is not limited thereto.
As an example, referring to fig. 1, the bracket upper cover 21 and the bracket bottom plate 23 have a groove structure corresponding to the spiral structure of the heat dissipation cavity to fix the heat dissipation cavity; the bracket strip 22 is fixed with the bracket upper cover 21 and the bracket bottom plate 23 through bayonets, bolts and nuts or strong glue.
As an example, referring to fig. 2, the LED chip is mounted on the heat source substrate, and the LED chip, the lens/glass cover, and the lens/glass cover are sequentially mounted on the heat source substrate.
As an example, the heat source substrate 41 should be a material having good heat conductivity; in this embodiment, the heat source carrier is made of copper, copper alloy, aluminum alloy, ceramic, or glass fiber.
To sum up, the utility model discloses a high-power LED lamp and radiator thereof has following beneficial effect: the utility model discloses an use the outside to be hollow columnar heating panel that has a heat superconducting pipe way as the radiator, heat dissipation base plate and heating panel contact are good, the inside helical structure that is of cavity, heat radiating area is big, LED chip heat can be fast even spread to whole heat dissipation cavity on, compare in conventional radiator, the soaking is good, increase with the external difference in temperature, effective heat radiating area further promotes, the heat-sinking capability and the heat exchange efficiency of LED lamp have been improved greatly, reduce lamp body weight and improve lighting device's reliability and stability by a wide margin, reduce the light decay and the energy consumption of lamps and lanterns by a wide margin.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be accomplished by those skilled in the art without departing from the spirit and scope of the present invention shall be covered by the appended claims.
Claims (11)
1. A high-power LED lamp is characterized in that the high-power LED lamp consists of a radiator, a light-emitting component, a power supply component and a bracket; the radiator comprises at least one spirally bent radiating plate; the power supply assembly comprises a lamp holder and a lamp cover; the light-emitting component consists of a heat source substrate, an LED chip, a lens/glass and a lens/glass gland; the radiator is positioned between the lamp cap and the light-emitting component; the bracket fixes the radiator structure and connects the lamp head part with the radiator and the light-emitting component together;
the radiator is a hollow cylindrical cavity formed by spirally bending and processing a radiating plate; the heat dissipation plate is internally provided with a closed heat superconducting pipeline, and a heat transfer working medium is filled in the heat superconducting pipeline; the lower part of the heat dissipation plate is provided with at least one extending end.
2. The high power LED lamp in claim 1, wherein the heat sink comprises n spiral-curved heat dissipation plates, wherein n is greater than or equal to 1.
3. The high-power LED lamp according to claim 2, wherein the heat dissipation plate in the heat sink is a mosquito coil type spiral structure; the spiral bending angles and degrees of the heat dissipation plates are the same.
4. The high power LED lamp in claim 3, wherein each heat spreader has at least one protruding end, the protruding end is integrally formed with the main body of the heat spreader, and the protruding end of the heat spreader is connected to the heat source substrate.
5. The high power LED lamp in claim 4, wherein the heat dissipating plate has a heat superconducting pipe on the protruding end, and the heat superconducting pipe is closed at one end and is communicated with the heat superconducting pipe on the main body part of the heat dissipating plate at the other end.
6. The high-power LED lamp as claimed in claim 5, wherein the bracket upper cover and the bracket bottom plate of the high-power LED lamp have channels corresponding to the spiral structure of the cavity for keeping the structure of the cavity stable.
7. The high power LED lamp in claim 6, wherein the cross-sectional shape of the cavity is circular, oval, rectangular with rounded corners, square or polygonal.
8. The high power LED lamp in claim 7, wherein the LED chip is mounted on the heat source substrate, and the lens/glass cover covers the periphery of the LED chip in turn and is fixed on the heat source substrate through the lens/glass cover pressing cover.
9. The high power LED lamp in claim 8, wherein the heat source substrate is made of copper, copper alloy, aluminum alloy, ceramic or glass fiber.
10. A radiator is characterized in that the radiator comprises at least one radiating plate which is spirally bent in a mosquito-repellent incense shape; the heat dissipation plate is internally provided with a closed heat superconducting pipeline, and the heat superconducting pipeline is filled with a heat transfer working medium.
11. The heat sink as claimed in claim 10, wherein each of the heat dissipating plates has at least one protruding end integrally formed with a main portion of the heat dissipating plate, the protruding end of the heat dissipating plate being connected to the heat source substrate; the heat dissipation plate is characterized in that the extending end of the heat dissipation plate is provided with a heat superconducting pipeline, one end of the heat superconducting pipeline is closed, and the other end of the heat superconducting pipeline is communicated with the heat superconducting pipeline of the main body part of the heat dissipation plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920877644.7U CN209909625U (en) | 2019-06-12 | 2019-06-12 | High-power LED lamp and radiator thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920877644.7U CN209909625U (en) | 2019-06-12 | 2019-06-12 | High-power LED lamp and radiator thereof |
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| Publication Number | Publication Date |
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| CN209909625U true CN209909625U (en) | 2020-01-07 |
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| CN201920877644.7U Active CN209909625U (en) | 2019-06-12 | 2019-06-12 | High-power LED lamp and radiator thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110159958A (en) * | 2019-06-12 | 2019-08-23 | 深圳市嘉名科技有限公司 | A kind of high-powered LED lamp and its radiator |
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- 2019-06-12 CN CN201920877644.7U patent/CN209909625U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110159958A (en) * | 2019-06-12 | 2019-08-23 | 深圳市嘉名科技有限公司 | A kind of high-powered LED lamp and its radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Jiaming New Technology Co.,Ltd. Assignor: SHENZHEN KARMING TECHNOLOGIES CO.,LTD. Contract record no.: X2022440020019 Denomination of utility model: A high-power LED lamp and its radiator Granted publication date: 20200107 License type: Exclusive License Record date: 20221028 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Jiaming New Technology Co.,Ltd. Assignor: SHENZHEN KARMING TECHNOLOGIES CO.,LTD. Contract record no.: X2022440020019 Denomination of utility model: A high-power LED light and its heat sink Granted publication date: 20200107 License type: Exclusive License Record date: 20221028 |
|
| EE01 | Entry into force of recordation of patent licensing contract |