CN204929525U - High -efficient electron device heat abstractor - Google Patents
High -efficient electron device heat abstractor Download PDFInfo
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- CN204929525U CN204929525U CN201520692455.4U CN201520692455U CN204929525U CN 204929525 U CN204929525 U CN 204929525U CN 201520692455 U CN201520692455 U CN 201520692455U CN 204929525 U CN204929525 U CN 204929525U
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Abstract
The utility model discloses a high -efficient electron device heat abstractor, its characterized in that: heat abstractor including the heat dissipation main part with set up heat in the heat dissipation main part, the main part of will dispelling the heat the radiating fin to the environment in that scatters and disappears, the electron device chip is fixed in the heat dissipation main part, the heat dissipation main part is by at least a set of general the heat of electron device chip carries out the ordinary heat pipe of initial absorption and sets up according to predetermined arranging the high -efficient heat transfer structure that pulsation heat pipe around the ordinary heat pipe, that be used for further absorption heat constitutes. The utility model discloses the characteristics separately of the ordinary heat pipe of make full use of and pulsation heat pipe, compound collaborative work together makes whole device have superstrong heat transfer capacity, has characteristics such as simple structure, light, save material.
Description
Technical field
The utility model relates to technical field of heat dissipation, specifically a kind of efficent electronic device heat abstractor.
Background technology
Along with the development of modern science and technology, electronic device is gradually to miniaturized, integrated direction development, and high-performance, high-power electronic device must cause density of heat flow rate to increase substantially, and therefore propose higher requirement to heat radiation.Current New-type computer chip density of heat flow rate can reach 100W/cm
2, gross power is more than 300W.In addition, because the performance of electronic devices and components and life-span are all subject to the impact of working temperature, normal working temperature scope is-5 DEG C ~ 65 DEG C, when exceeding this normal working temperature, the performance of electronic device and life-span can decline greatly, therefore require to keep temperature equalization, so need more effective heat dissipation design to electronic devices and components surface.Related Experimental Study shows, after semiconductor electronic component exceedes the working temperature of setting, every raised temperature 10 DEG C, causes the reliability decrease 50% of system.Therefore, the heat dissipation problem of electronic devices and components has become the subject matter of restriction new technique development in a lot of fields, how to solve electronic devices and components efficiently radiates heat problem, has become the focus that industry is paid close attention to.Such as, light-emitting diode (LED, Light-EmittingDiode) has the advantages such as brightness is high, power consumption is low, long service life because of it, and the field such as lighting and electronic installation that is widely used in is as illuminating source.LED is also progressively replacing traditional fluorescent lamp; And the heat spreader structures of LED lamp product on existing market is generally made up of parts such as aluminium base, radiating fin and links, by heat conduction to realize the heat radiation to LED.These radiators are feasible to low-power LED lamp, but for high-capacity LED, are that the heat that cannot be produced fast distributes, cause the temperature of LED chip to raise, and then greatly reduce the performance and used life of LED by means of only heat conduction.
Utility model content
According to the technical problem that the too high heat radiation of electronic device wick temperature of above-mentioned proposition is slow, and provide a kind of efficent electronic device heat abstractor.The utility model mainly utilizes the efficient heat transfer structure arranging around general heat pipe and be made up of pulsating heat pipe, thus plays rapid heat dissipation, extends the effects such as electronic device useful life.
The technological means that the utility model adopts is as follows:
A kind of efficent electronic device heat abstractor, it is characterized in that: described heat abstractor comprise heat sink body and be arranged on described heat sink body, by the heat loss of described heat sink body to the radiating fin in environment, electronic device chip is fixed on described heat sink body; Described heat sink body is arranged on by least one group of general heat pipe heat of described electronic device chip being carried out initial absorption with according to the arrangement preset the efficient heat transfer structure that pulsating heat pipe around described general heat pipe, that be used for absorbing heat further forms.
Further, according to the arrangement preset, described pulsating heat pipe refers to that described pulsating heat pipe is arranged on outside, the inner side of described general heat pipe or alternately arranges with described general heat pipe.
Further, described pulsating heat pipe adopts serpentine coil to be arranged in around described general heat pipe.
Heat sink body described in the utility model, can adjust the arrangement, quantity etc. of general heat pipe and pulsating heat pipe in real time, be not limited to above-mentioned form according to the true heat gain value of electronic device chip.
The heat dissipating method of above-mentioned efficent electronic device heat abstractor, the heat sent from electronic device chip is received by the heat sink body be made up of general heat pipe and pulsating heat pipe, then is lost in environment by the radiating fin be arranged on described heat sink body.
Comparatively prior art is compared, the radiating mode that the utility model combines with pulsating heat pipe mainly through general heat pipe, thus the heat sent by electronic device is delivered on whole heat sink body fast, a large amount of radiating fins that heat is arranged by heat sink body outer surface are again lost in environment and go, and the temperature of such electronic device chip will be obtained effective control.
The feed flow that the heat transfer theory of pulsating heat pipe determines its fire end liquid film has adaptive mechanism, and pulsating heat pipe is once start, and along with the increase of heating power, in pulsating heat pipe, the ripple frequency of working medium strengthens rapidly, and the heat-transfer capability of pulsating heat pipe also strengthens thereupon.When density of heat flow rate is very large, when evaporating very fast, air bubble expansion is very fast too, makes liquid can be back to fire end in time.Therefore, not easily dryout, can high heat flux be transmitted.And under low power conditions, pulsating heat pipe difficulty in starting, and general heat pipe in lower-wattage work, can have good heat transfer property, the heat that electronic device chip produces can be spread soon and come.Simultaneously along with the diffusion of heat, pulsating heat pipe, along with the rising of environment temperature, starts being very easy to of becoming.The utility model makes full use of general heat pipe the features with pulsating heat pipe, and be combined with each other collaborative work, makes whole device will have superpower heat-transfer capability.
In the utility model, comparatively conventional electronics heat abstractor is compared, and can effectively reduce electronic device chip temperature, has the features such as structure is simple, light, saving material simultaneously, is conducive to the overall weight and the material cost that reduce electronic device radiating device.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is the utility model embodiment 1, and heat sink body is the schematic diagram I of column structure.
Fig. 2 is the utility model embodiment 1, and heat sink body is the schematic diagram II of column structure.
Fig. 3 is the layout viewing of the pulsating heat pipe in Fig. 1.
The schematic diagram of Fig. 4 to be heat sink body of the present utility model be block structure.
Fig. 5 is the utility model embodiment 2, the cutaway view that general heat pipe and pulsating heat pipe are alternately arranged.
Fig. 6 be in Fig. 5 A-A to cutaway view.
Fig. 7 is the utility model embodiment 2, the structural representation that general heat pipe and pulsating heat pipe are alternately arranged.
Fig. 8 is the utility model embodiment 3, general heat pipe for organize cylindrical tube more, the snakelike cutaway view being arranged in the upper and lower both sides of general heat pipe of pulsating heat pipe.
Fig. 9 be in Fig. 8 B-B to cutaway view.
Figure 10 be in Fig. 8 C-C to cutaway view.
Figure 11 is the utility model embodiment 3, general heat pipe for organize cylindrical tube more, the snakelike structural representation being arranged in the upper and lower both sides of general heat pipe of pulsating heat pipe.
Figure 12 is the utility model embodiment 4, and general heat pipe is square block shape pipe, the snakelike cutaway view being arranged in the upper and lower both sides of general heat pipe of pulsating heat pipe.
Figure 13 be in Figure 12 D-D to cutaway view.
Figure 14 is the utility model embodiment 4, and general heat pipe is square block shape pipe, the snakelike structural representation being arranged in the upper and lower both sides of general heat pipe of pulsating heat pipe.
Figure 15 is the utility model embodiment 5, and pulsating heat pipe is placed in the cutaway view inside general heat pipe with upper and lower two-layer snakelike arrangement mode.
Figure 16 be in Figure 15 E-E to cutaway view.
Figure 17 is the utility model embodiment 5, and pulsating heat pipe is with the structural representation of upper and lower two-layer snakelike arrangement mode.
Figure 18 is the embodiment of the present invention 6, and heat sink body is column structure, and pulsating heat pipe is arranged in general heat pipe and forms the integrally-built schematic diagram of heat sink body.
In figure: 1, radiating fin 2, general heat pipe 3, pulsating heat pipe 4, electronic device chip.
Embodiment
A kind of efficent electronic device heat abstractor, described heat abstractor comprise heat sink body and be arranged on described heat sink body, by the heat loss of described heat sink body to the radiating fin 1 in environment, electronic device chip 4 is fixed on described heat sink body; Described heat sink body is arranged on by least one group of general heat pipe 2 heat of described electronic device chip 4 being carried out initial absorption with according to the arrangement preset the efficient heat transfer structure that pulsating heat pipe 3 around described general heat pipe 2, that be used for absorbing further heat forms.
According to the arrangement preset, described pulsating heat pipe 3 refers to that described pulsating heat pipe 3 is arranged on outside, the inner side of described general heat pipe 2 or alternately arranges with described general heat pipe 2.
Described pulsating heat pipe 3 adopts serpentine coil to be arranged in around described general heat pipe 2.
Embodiment 1
As Figure 1-3, heat sink body is column structure, and radiating fin 1 is evenly distributed on the outside of heat sink body, and described electronic device chip 4 is arranged on one end of described heat sink body column structure, during use, can arrange other Circumscribed structures at this end.Described general heat pipe 2 forms the column structure of heat sink body, and as heat initial absorption unit, namely described pulsating heat pipe 3 grows the U-shaped inwall side being evenly arranged in described general heat pipe 2, as the further absorptive unit of heat with snakelike arrangement closely.
Embodiment 2
As shown in figs. 4-7, heat sink body is block structure, and radiating fin 1 is evenly distributed on one side surface, and described electronic device chip 4 is arranged on the described heat sink body opposite side relative with radiating fin 1 on the surface.General heat pipe 2 is the many groups of cylindrical tubes be arranged side by side, and described pulsating heat pipe 3 is arranged in described in every root between general heat pipe 2 with snakelike winding, and cutaway view is shown as staggered.
Embodiment 3
As illustrated in figs. 8-11, heat sink body is block structure, and radiating fin 1 is evenly distributed on one side surface, and described electronic device chip 4 is arranged on the described heat sink body opposite side relative with radiating fin 1 on the surface.General heat pipe 2 is the many groups of cylindrical tubes be arranged side by side, and described pulsating heat pipe 3 is with the snakelike both sides being up and down arranged in described general heat pipe 2, and also there is the distribution of pulsating heat pipe 3 left and right sides of described general heat pipe 2, thus ensures that heat absorption evenly.
Embodiment 4
As shown in figs. 12-14, heat sink body is block structure, and radiating fin 1 is evenly distributed on one side surface, and described electronic device chip 4 is arranged on the described heat sink body opposite side relative with radiating fin 1 on the surface.Described general heat pipe 2 be square block shape pipe, described pulsating heat pipe 3 with snakelike arrangement all with the both sides being up and down arranged in described general heat pipe 2, formation heat sink body block structure.
Embodiment 5
As seen in figs. 15-17, heat sink body is block structure, and radiating fin 1 is evenly distributed on one side surface, and described electronic device chip 4 is arranged on the described heat sink body opposite side relative with radiating fin 1 on the surface.Described general heat pipe 2 is configured for the hollow block structure holding described pulsating heat pipe 3, and described pulsating heat pipe is placed in inside described general heat pipe 2 with upper and lower two-layer snakelike arrangement mode.
Above-mentioned heat abstractor operationally, the heat sent from electronic device chip 4 is received by the heat sink body be made up of general heat pipe 2 and pulsating heat pipe 3, be delivered on whole heat sink body fast, the radiating fin 1 that heat is arranged by described heat sink body outer surface is again lost in environment, and the temperature of such electronic device chip 4 will be obtained effective control.
Embodiment 6
As shown in figure 18, heat sink body is column structure, and radiating fin 1 is evenly distributed on the outside of heat sink body, and described electronic device chip 4 is arranged on one end of described heat sink body column structure.On general heat pipe 2 inwall, boring forms the space for holding pulsating heat pipe 3, pulsating heat pipe 3 is placed in this space and forms heat sink body overall structure, general heat pipe 2 and pulsating heat pipe 3 can farthest become one by this kind of design, save material cost, alleviator overall weight.
The utility model is a kind of radiating mode of combining with pulsating heat pipe of general heat pipe mainly, be not limited to above-mentioned execution mode, the foregoing is only the utility model preferably embodiment, but protection range of the present utility model is not limited thereto, in the technical scope of the heat radiation combined with pulsating heat pipe by general heat pipe that any those skilled in the art of being familiar with disclose at the utility model, be equal to according to the technical solution of the utility model and utility model design thereof and replace or change, all should be encompassed within protection range of the present utility model.
Claims (3)
1. an efficent electronic device heat abstractor, it is characterized in that: described heat abstractor comprise heat sink body and be arranged on described heat sink body, by the heat loss of described heat sink body to the radiating fin in environment, electronic device chip is fixed on described heat sink body; Described heat sink body is arranged on by least one group of general heat pipe heat of described electronic device chip being carried out initial absorption with according to the arrangement preset the efficient heat transfer structure that pulsating heat pipe around described general heat pipe, that be used for absorbing heat further forms.
2. efficent electronic device heat abstractor according to claim 1, is characterized in that: according to the arrangement preset, described pulsating heat pipe refers to that described pulsating heat pipe is arranged on outside, the inner side of described general heat pipe or alternately arranges with described general heat pipe.
3. efficent electronic device heat abstractor according to claim 1 and 2, is characterized in that: described pulsating heat pipe adopts serpentine coil to be arranged in around described general heat pipe.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520692455.4U CN204929525U (en) | 2015-09-07 | 2015-09-07 | High -efficient electron device heat abstractor |
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| CN201520692455.4U CN204929525U (en) | 2015-09-07 | 2015-09-07 | High -efficient electron device heat abstractor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101756A (en) * | 2015-09-07 | 2015-11-25 | 大连海事大学 | Efficient heat radiating method and apparatus for electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101756A (en) * | 2015-09-07 | 2015-11-25 | 大连海事大学 | Efficient heat radiating method and apparatus for electronic device |
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