M366028 五、新型說明： 【新型所屬之技術領域】 本創作係有關於一種照明裝置，尤指一種發光二極體 之照明裝置。 【先前技術】 發光二極體（Light Emitting Diode, LED)具有省電及壽命 .長等優點，加上亮度不斷的提升，因此被廣泛的應用於電 \ _子裝置與室内、外照明燈具。 使用於室内或室外之照明燈具，多使用高功率之發光 二極體（High Brightness Light-Emitting Diode)，並將複數個發光 二極體組合成一發光二極體燈模組，以增加其照射範圍及 光照度。然而，在光照度提高的同時，無可避免地提高了 其所產生的熱量，加上發光二極體的财熱度較一般之白熾 燈泡來的差，尤其是高功率發光二極體，其本身產生之高 溫熱源不僅容易造成發光二極體周圍積存熱量，導致發光 效率的降低，更可能影響發光二極體的壽命，並造成燈具 電路基板過熱及燈具受損。因此，需藉助散熱模組將發光 二極體產生之高溫熱量移除，以使發光二極體能在一較低 的溫度下發光。故如何將發光二極體產生的高熱量即時地 且迅速地加以排出，避免影響發光二極體之效率及壽命， 已成為目前各照明燈具業者急欲解決的一個重要問題。 然而，習知之發光二極體燈具在散熱結構的設計上， 大多將多數發光二極體元件先設置於電路板上，再將電路 板與包含有散熱鰭片、熱管以及散熱基板等構件之散熱模 M366028 組組合，來將熱導離，因而使得整體燈具的體積較大，並 且，發光二極體元件之熱量需經過電路板才會到達散熱= 組之散熱基板上才能產生熱傳導，因其 、 熱效率不佳。 導速度反以致散 【新型内容】 雲於先前技術所述’本創作之一目的，在於提供一種 將發二極體之熱源面可直接貼覆於均溫板之發光二極體照 明裝置，使由該發光二極體所產生之熱能可直接迅速被均 溫板吸收並導離進行散熱作用。該發光二極體照明裝置包 含一均溫板、一電路板以及至少一發光二極體。^ ^ 該均溫板係包含一金屬中空殼體、一貼附於該殼體内 壁之一毛細組織，以及填注於該殼體内部之一工作液體， 另該均溫板之一表面形成有至少一個凸出部。該凸出部之 頂面設置有一導熱錫層，用以輔助將熱能導離。 該電路板，具有至少一穿孔，供該凸出部對應貫穿。 該電路板包含有一絕緣層及一導電層，其中該導電層又可 區分為設置於該絕緣層上方之—㈣層，以及位於該銅箱 層上表面之一導電錫層。 該等發光二極體係為表面黏著式發光二極體，對應表 觸地設置於該凸出部上。各該發光二極體包含—發光2米 體晶粒、一基座、一貫設於該基座且分別接觸該發光二木 體晶粒及該凸出部之導熱柱，以及二導電接腳，該二導, 接腳分別電連接至該電路板之該導電層，另該等發=二^ 體間係以串聯之方式電連接。 _ M366028 本創作藉由形成於該灼、々 於兮m-心 板之該等凸出部’直接接觸 於该專^一極體之導熱柱，使由該等發光二極體晶粒所 產生的熱能能夠快速傳導至該均温板，並透過該均溫板將 該熱能導離。另外，由於均溫板本身之體積較散敎、 熱管小，散熱效果又較好，因此可達成減少該等發光-極 體發光效率衰減的問題並延長該等發光二極體的使用^ 0 t【實施方式】 > ㉟合參閲第-圖，分別為本創作之發光二極體 置之外觀示意圖。該發光二極體照明裝置包含：__均 10、一電路板20，以及至少-發光二極體30。 Μ -中空金屬殼體’ 一貼附於該殼體内壁之一毛細紐織Μ， 以及一填注於該殼體内部之工作液體16，另於該均溫板ι〇 之一表面形成有至少-凸出部12。於本實例中，該均 10係使用-圓形殼體，於實際實施時，該均溫板ι〇則可為 方形，、多邊形或其他不規則形狀。該凸出部12之頂面設置 有一導熱錫層18，用以辅助將熱能導離。 該電路板20具有至少一穿孔22，供該凸出部12對應穿 J申該穿孔22而出。該電路板2G包含—絕緣層％與一導電層 _ 26 ’其中3亥導電層26又可區分為設置於該絕緣層％上方之 一銅箔層262 ，以及位於該銅箔層262上方之—導電錫声 264。 曰 配合參閱第二圖為第三圖，分別為本創作之發光二極 照明裝置之立體分解圖與剖面圖。其中該均溫板10包含 5 M366028 一配合參閱第四圖，該發光二極體3〇係為一表面黏著式 發光二極體，對應接觸地設置於該凸出部12上。各該發光 :極體30包含二導電接腳32、-發光二極體晶粒34、-基 座36，以及一貫設於該基座36且分別接觸該發光二極體= =4及該凸出部12之導熱㈣。其中該發光二極體％之底 部，布有薄錫，可與該凸出部12之導電錫層18以直接加熱 錫焊之方式結合；該二導電接腳32之底面塗有錫膏，分別 對應連接至該電路板2Q之導電錫層脱，可透過加熱錫浑I 之方式、·，α合，且該等發光二極體3〇係以串聯方式相互電連 接。該導熱柱38係平貼於該凸出部12之該導熱锡層18，用 '字心《光—極體晶粒34所發出之熱能經由接觸於該導熱 柱38之該凸出部12傳遞至該均溫板忉。 ’、、、 ^貫際操作時，當該發光二極體照明裝置被啟動時，該 等發光二極體30會被點亮’而位於該等發光二極體3。内部 之發光二極體晶粒34隨即開始產生熱能。該由發光二極體 晶粒34產生的熱能經由該基絲傳導至該導熱㈣，經由 〜導熱柱38傳導至$凸出部12頂端之該導熱錫層μ，再透 過形成於該均溫板1G上之凸出部12傳導至該均溫板⑺之一 側，形成-高溫側’其中該高溫侧為裝設有發光二極體3〇 之一側。 當該均溫板10接收到由該等發光二極體晶粒私所產生 二熱能時’該均溫板10内部之工作液㈣會因吸收熱能： 產生汽化現象，並該工作液體16會汽化為氣態。該帶有敛 此之氣體會經由對流作用傳遞至該均溫板此另—側，形 M366028 j一低溫側。由於該低溫侧之溫度低於該高溫侧，因此該 帶有熱能之氣體便開始凝結回復為工作液體，並經由位於 汶均板10内壁之該毛細組織14流回該高溫側。該均溫板 1〇即疋藉由如此循環不息的汽化、凝結作用將由發光二極 體晶粒34所產生之熱能導離。 另外，由於均溫板屬於被動式散熱元件，亦即不需要 •耗費能源即可達成散熱的功效，加上均溫板本身為一平板 .結構，其導熱面積較習知之熱管大，因此可更快速的將熱 能由發熱源導離。 綜合以上所述，本創作藉由形成於該均溫板1〇之該等 凸出部12 ’直接接觸於該等發光二極體3〇之導熱㈣，使 由該等發光二極體晶粒34所產生的熱能快速地傳導㈣均 溫板H)，並透過該均温板10將該熱量導離，相較於習知發 ::極體元件之熱量需經過電路板才會到達散熱模組的； 式來說，散熱更有效率。另外，由於均溫板1〇本身之體積 車讀熱縛片、熱管小，散熱效果又較好，因此可達成減少 該寻發光二極體發光效率衰減的問題，並延長 極體的使用壽命。 寸&艽一 然以上所述者，僅為本創作之較 ^ J本創作實施之範圍，即凡依本創作申請專利範== IS:;修飾等，皆應仍屬本創作之專利涵蓋範圍意圖 【圖式簡單說明】 第-圖為本創作之發光二極體照明裝置之外觀示意圖。 7 M366028 第二圖為本創作之發光二極體照明裝置之立體分解圖。 第三圖為本創作之發光二極體照明裝置之剖面圖。 第四圖為第三圖之A部分放大詳圖。 【主要元件符號說明】 10 均溫板 26 導電層 12 凸出部 262 銅箔層 14 毛細組織 264 導電錫層 ^ 16 工作液體 30 發光二極體 _ 18 導熱錫層. 32 導電接腳 20 電路板 34 發光二極體晶粒 22 穿孔 36 基座 24 絕緣層 38 導熱柱 8M366028 V. New description: [New technical field] This creation is about a lighting device, especially a lighting device for a light-emitting diode. [Prior Art] Light Emitting Diode (LED) has the advantages of power saving and long life, and the brightness is continuously improved. Therefore, it is widely used in electric devices and indoor and outdoor lighting. For indoor or outdoor lighting, use High Brightness Light-Emitting Diode, and combine multiple LEDs into one LED lamp module to increase its illumination range. And illuminance. However, while the illuminance is increased, the heat generated by it is inevitably increased, and the heat of the light-emitting diode is worse than that of an ordinary incandescent light bulb, especially a high-power light-emitting diode, which itself generates The high-temperature heat source not only easily causes heat accumulated around the light-emitting diodes, but also causes a decrease in luminous efficiency, which is more likely to affect the life of the light-emitting diode and cause overheating of the lamp circuit board and damage of the lamp. Therefore, the heat-dissipating module is required to remove the high-temperature heat generated by the light-emitting diode, so that the light-emitting diode can emit light at a lower temperature. Therefore, how to quickly and quickly discharge the high heat generated by the light-emitting diode to avoid affecting the efficiency and life of the light-emitting diode has become an important problem that various lighting manufacturers are eager to solve. However, in the design of the heat dissipation structure of the conventional light-emitting diode lamp, most of the light-emitting diode components are first disposed on the circuit board, and then the heat dissipation fins, heat pipes, and heat-dissipating components are disposed on the circuit board. The M366028 group is combined to guide the heat away, thus making the overall luminaire bulky, and the heat of the illuminating diode component needs to pass through the circuit board to reach the heat dissipation = heat dissipation on the heat sink substrate, because of Thermal efficiency is not good. The guide speed is reversed to dissipate [new content] The cloud is described in the prior art. One of the purposes of the present invention is to provide a light-emitting diode lighting device in which the heat source surface of the hair-emitting diode can be directly attached to the temperature equalizing plate. The heat energy generated by the light-emitting diode can be directly absorbed by the temperature equalizing plate and guided away to perform heat dissipation. The LED lighting device comprises a temperature equalizing plate, a circuit board and at least one light emitting diode. ^ ^ The temperature equalizing plate comprises a metal hollow casing, a capillary structure attached to an inner wall of the casing, and a working liquid filled in the interior of the casing, and another surface of the temperature equalizing plate is formed There is at least one projection. The top surface of the projection is provided with a thermal conductive tin layer to assist in guiding the thermal energy away. The circuit board has at least one through hole for the protrusion to pass through. The circuit board comprises an insulating layer and a conductive layer, wherein the conductive layer is further divided into a (four) layer disposed above the insulating layer and a conductive tin layer on an upper surface of the copper box layer. The light-emitting diode system is a surface-adhesive light-emitting diode, and is disposed on the protruding portion correspondingly to the surface. Each of the light-emitting diodes includes a light-emitting 2-meter crystal grain, a susceptor, a heat-conducting column uniformly disposed on the pedestal and respectively contacting the light-emitting two-wood crystal grain and the protruding portion, and two conductive pins. The two leads are electrically connected to the conductive layer of the circuit board, and the two sides are electrically connected in series. _ M366028 This creation is made by the heat-radiating columns formed in the radiant and 兮m-cores directly contacting the heat-conducting column of the monopole body to be produced by the illuminating diode dies The thermal energy can be quickly conducted to the temperature equalization plate and the thermal energy is conducted away through the temperature equalization plate. In addition, since the temperature of the temperature equalizing plate itself is smaller than that of the heat pipe and the heat pipe is small, the heat dissipation effect is good, so that the problem of reducing the luminous efficiency of the light-emitting body can be reduced and the use of the light-emitting diodes can be prolonged. [Embodiment] > 35 refers to the first figure, which is a schematic view of the appearance of the light-emitting diode of the present invention. The LED lighting device comprises: a __10, a circuit board 20, and at least a light-emitting diode 30. Μ - hollow metal casing 'a capillary woven fabric attached to one of the inner walls of the casing, and a working liquid 16 filled in the interior of the casing, and at least one surface of the temperature equalizing plate is formed at least - Projection 12. In the present example, the uniform system uses a circular casing. In actual implementation, the temperature equalization plate may be square, polygonal or other irregular shape. The top surface of the projection 12 is provided with a thermal conductive tin layer 18 for assisting in guiding thermal energy away. The circuit board 20 has at least one through hole 22 for the protrusion 12 to be correspondingly formed. The circuit board 2G includes an insulating layer % and a conductive layer _ 26 ', wherein the 3H conductive layer 26 can be further divided into a copper foil layer 262 disposed above the insulating layer %, and located above the copper foil layer 262 - Conductive tin sound 264.配合 Referring to the second figure, the third figure is an exploded view and a cross-sectional view of the illuminated two-pole lighting device. The temperature equalizing plate 10 includes 5 M366028. Referring to the fourth figure, the light emitting diode 3 is a surface-adhesive light emitting diode disposed on the protruding portion 12 correspondingly. Each of the illuminants: the pole body 30 includes two conductive pins 32, a light-emitting diode die 34, a pedestal 36, and is disposed on the pedestal 36 and respectively contacts the illuminating diode ==4 and the convex The heat conduction of the outlet 12 (four). The bottom of the light-emitting diode is provided with a thin tin, and can be combined with the conductive tin layer 18 of the protruding portion 12 by direct heating soldering; the bottom surface of the two conductive pins 32 is coated with solder paste, respectively Corresponding to the conductive tin layer connected to the circuit board 2Q, it can be heated by the method of heating the tin-bismuth I, and the light-emitting diodes 3 are electrically connected to each other in series. The heat conducting post 38 is affixed to the heat conductive tin layer 18 of the protruding portion 12, and the heat energy emitted by the "light-pole body die 34" is transmitted through the protruding portion 12 contacting the heat conducting post 38. To the average temperature plate. When the light-emitting diodes are activated, the light-emitting diodes 30 are illuminated and placed in the light-emitting diodes 3 during the continuous operation. The inner light-emitting diode die 34 then begins to generate thermal energy. The heat energy generated by the light-emitting diode die 34 is conducted to the heat conduction (4) via the base wire, and is conducted to the heat conductive tin layer μ at the top end of the protrusion portion 12 via the heat conduction post 38, and then formed on the temperature equalization plate. The projection 12 on the 1G is conducted to one side of the temperature equalizing plate (7) to form a high temperature side, wherein the high temperature side is one side on which the light emitting diode 3 is mounted. When the temperature equalizing plate 10 receives the two thermal energy generated by the light-emitting diode crystals privately, the working liquid (4) inside the temperature equalizing plate 10 absorbs heat energy: a vaporization phenomenon occurs, and the working liquid 16 vaporizes. It is in a gaseous state. The gas with the condensation is transmitted to the other side of the temperature equalizing plate via convection, and the shape is M366028 j on a low temperature side. Since the temperature on the low temperature side is lower than the high temperature side, the heat-generating gas starts to condense and return to the working liquid, and flows back to the high temperature side via the capillary structure 14 located on the inner wall of the Wendu board 10. The temperature equalizing plate diverts the thermal energy generated by the light-emitting diode crystal grains 34 by the vaporization and condensation which are thus continuously circulated. In addition, since the temperature equalizing plate is a passive heat dissipating component, it does not need to be energy-consuming to achieve heat dissipation, and the temperature equalizing plate itself is a flat plate structure, and its heat conducting area is larger than a conventional heat pipe, so it can be faster. The heat is conducted away from the heat source. In summary, the present invention directly contacts the heat conducting (four) of the light emitting diodes 3 ′ by the protrusions 12 ′ formed on the temperature equalizing plate 1 , to make the light emitting diode dies The heat generated by 34 rapidly conducts (4) the temperature equalizing plate H), and conducts the heat through the temperature equalizing plate 10, compared with the conventional hair: the heat of the polar body component needs to pass through the circuit board to reach the heat dissipation module. In other words, heat dissipation is more efficient. In addition, since the temperature of the uniform temperature plate 1 itself is small, the heat pipe is small, and the heat dissipation effect is good, the problem of reducing the luminous efficiency of the light-emitting diode can be reduced, and the service life of the polar body is prolonged. In the case of the above, it is only the scope of the creation of this creation, that is, the patent application of this creation == IS:; modification, etc., should still be covered by the patent of this creation. Scope Intent [Simple description of the diagram] The first diagram is a schematic diagram of the appearance of the illuminated LED lighting device. 7 M366028 The second picture is an exploded view of the illuminated LED lighting device. The third figure is a cross-sectional view of the illuminated LED lighting device. The fourth picture is an enlarged detail of part A of the third figure. [Main component symbol description] 10 Temperature plate 26 Conductive layer 12 Projection 262 Copper foil layer 14 Capillary structure 264 Conductive tin layer ^ 16 Working liquid 30 Light-emitting diode _ 18 Thermal conductive tin layer. 32 Conductive pin 20 Circuit board 34 Light-emitting diode die 22 Perforation 36 Base 24 Insulation 38 Heat-conducting column 8