TW201430278A - A light emitting device, which has a light emitting diode - Google Patents

A light emitting device, which has a light emitting diode Download PDF

Info

Publication number
TW201430278A
TW201430278A TW102103358A TW102103358A TW201430278A TW 201430278 A TW201430278 A TW 201430278A TW 102103358 A TW102103358 A TW 102103358A TW 102103358 A TW102103358 A TW 102103358A TW 201430278 A TW201430278 A TW 201430278A
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
circuit board
emitting
board base
Prior art date
Application number
TW102103358A
Other languages
Chinese (zh)
Inventor
Po-Wen Chi
Original Assignee
Light Of The World Internat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Light Of The World Internat Co Ltd filed Critical Light Of The World Internat Co Ltd
Priority to TW102103358A priority Critical patent/TW201430278A/en
Publication of TW201430278A publication Critical patent/TW201430278A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0207Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/066Heatsink mounted on the surface of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Abstract

A light emitting device, which has a light emitting diode, includes a light emitting diode module, a circuit board, a lamp holder, and a heat dissipating component. The light emitting diode module has a light emitting diode, one side of the circuit board is provided with the light emitting diode module, one side of the lamp holder is provided on the other side of the circuit board, and the heat dissipating component is provided on the other side of the lamp holder, wherein a first tin layer is provided between the light emitting diode module and the circuit board, a second tin layer or a first graphite layer is provided between the circuit board and the lamp holder, and a second graphite layer is provided between the lamp holder and the heat dissipating component. The waste heat will be discharged, so that life duty of the light emitting device is extended.

Description

Light-emitting device with light-emitting diode
The present invention relates to the design of a light-emitting device, and more particularly to a light-emitting device having a light-emitting diode of a heat dissipating component.
A Light-Emitting Diode (LED) is a light-emitting semiconductor electronic component that emits light by converting electrical energy into light energy. The light-emitting device that emits light by using the light-emitting diode has the advantages of high luminous efficiency, long life, no breakage, and fast reaction speed, and thus gradually replaces the conventional tungsten filament lamp, the fluorescent lamp, and the power-saving light bulb.
The circuit of the light-emitting diode generates a lot of waste heat when the light is emitted. However, in the case of a high temperature, the light-emitting diode is drastically lowered by the high temperature, and thus a lot of power is consumed. The resulting accumulation of waste heat causes the temperature to rise further, forming a vicious circle, which further shortens the service life of the light-emitting diode. Therefore, it is important to effectively dissipate waste heat, so that a light-emitting device that uses a light-emitting diode to emit light is provided with a heat dissipating member to discharge waste heat.
The thermally conductive layer between each of the component layers in the illumination device is typically coated with a layer of thermally conductive paste to aid in thermal conduction to enhance the heat dissipation efficiency of the discrete components. However, the properties of the thermal paste gradually deteriorate, harden and deteriorate with the use time, so the heat conduction effect thereof also deteriorates, so that the effect of waste heat discharge is deteriorated, and the luminous efficiency of the light-emitting diode of the light-emitting device is further caused. Reducing, such as Luminous Decay, may even cause damage to the illuminating device.
Accordingly, it is an object of the present invention to provide a light-emitting diode The illuminating device is used to extend the service life of the illuminating device to improve the problems of the prior art.
The technical means for solving the problems of the prior art is to provide a light-emitting device having a light-emitting diode, comprising a light-emitting diode module, a circuit board base, a light cup and a heat dissipating component. The light emitting diode module has a light emitting diode. A light emitting diode module is disposed on one side of the circuit board base. One of the lamp cups is disposed on the other side of the circuit board base. The heat dissipating component is disposed adjacent to the other side of the lamp cup, wherein a first tin layer is disposed between the light emitting diode module and the circuit board base, and a second tin layer is disposed between the circuit board base and the lamp cup A first graphite layer and a second graphite layer are disposed between the lamp cup and the heat dissipating component.
In an embodiment of the invention, the first tin layer and the second tin layer are applied by printing and coating.
In an embodiment of the invention, the first tin layer and the second tin layer are disposed by reflow soldering.
In an embodiment of the invention, the circuit board base is a metal core printed circuit board.
In an embodiment of the invention, the heat dissipating component is a metal heat sink.
In an embodiment of the invention, the surface of the heat dissipating component has a heat dissipating fin.
In an embodiment of the invention, the metal fins are attached to the second graphite layer.
In an embodiment of the invention, the circuit board base, the lamp cup and the heat dissipating component are screwed by a first screw member.
In an embodiment of the invention, the lamp cup and the heat dissipating component are screwed by a second screw member.
Through the technical means adopted by the invention, the bonding of the light emitting diode and the circuit board base is more tightly fixed by the tin layer, and the tin layer and the graphite have the characteristics of low thermal resistance and high thermal conductivity, and do not change with time. Deteriorating while maintaining good heat dissipation The rate is to effectively conduct waste heat to extend the service life of the illuminating device.
The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.
100, 100a, 100b‧‧‧Lighting device with light emitting diode
1‧‧‧Lighting diode module
11‧‧‧Lighting diode
12‧‧‧ pins
2‧‧‧Board base
21‧‧‧Contacts
3‧‧‧light cup
4‧‧‧Heat components
41‧‧‧Heat fins
5a‧‧‧ first tin layer
5b‧‧‧Second tin layer
6a‧‧‧First graphite layer
6b‧‧‧Second graphite layer
7a‧‧‧First screw member
7b‧‧‧Second screw member
1 is a cross-sectional view showing a light-emitting device having a light-emitting diode according to a first embodiment of the present invention; and FIG. 2 is a cross-sectional view showing a light-emitting device having a light-emitting diode according to a second embodiment of the present invention. Figure 3 is a cross-sectional view showing a light-emitting device having a light-emitting diode according to a third embodiment of the present invention.
Referring to Fig. 1, there is shown a cross-sectional view of a light-emitting device having a light-emitting diode according to a first embodiment of the present invention. The light emitting device 100 with the light emitting diode according to the first embodiment of the present invention includes a light emitting diode module 1, a circuit board base 2, a light cup 3, a heat dissipating component 4, and a first tin layer 5a. a first graphite layer 6a and a second graphite layer 6b.
The LED module 1 has a light-emitting diode 11 and two pins 12 . The two pins 12 are electrically connected to the positive and negative contacts 21 of the circuit board base 2 to electrically illuminate the LEDs 11 . In this embodiment, the circuit board base 2 is a metal core printed circuit board (MCPCB). The structure of the metal core printed circuit board is composed of a circuit layer, a dielectric layer, and a Dielectric Layer. And the base layer is composed of. The insulating layer is a layer of insulating material with low thermal resistance and high thermal conductivity, and the base layer is a metal substrate, usually aluminum or copper. Therefore, the printed circuit board of the metal core can dissipate heat in addition to the heat conduction effect. Of course, the invention is not limited thereto, and the circuit board base 2 may also be a conventional printed circuit board. The light-emitting diode 11 is bonded to one side of the circuit board base 2 through the first tin layer 5a. In this embodiment, the first tin layer 5a It is applied between the light-emitting diode 11 and the contact surface of the circuit board base 2 by printing and coating. Preferably, the solder paste is printed on the entire contact surface of the LED body 11 and the circuit board base 2, and the LED body 11 and the circuit board base 2 are reflowed by reflow soldering. The welding is combined, because the entire contact surface is welded, so that the combination of the light-emitting diode 11 and the circuit board base 2 is more tight. Moreover, the heat conduction effect of the first tin layer 5a is quite good and does not deteriorate and harden with time.
The other side of the circuit board base 2 is adjacent to one side of the lamp cup 3. The lamp cup 3 is used to fix and protect the LED module 1 and the circuit board base 2. Preferably, the lamp cup 3 is made of a material having good heat conduction and good heat dissipation, such as aluminum metal or ceramics, to assist heat dissipation. In a preferred embodiment, a light cover is also placed over the light emitting diode 11 to increase the protective effect. The first graphite layer 6a is disposed between the circuit board base 2 and the lamp cup 3. The first graphite layer 6a is made of graphite. The graphite is a material with low thermal resistance, high thermal conductivity, and poor electrical conductivity, so the first The graphite layer 6a can effectively conduct heat of the circuit board base 2 to the lamp cup 3 while protecting the circuit board base 2 from being affected by the electric charge transmitted from the lamp cup 3. Furthermore, graphite does not deteriorate and harden over time.
The other side of the lamp cup 3 is adjacent to the heat dissipating member 4. In the present embodiment, the heat dissipating member 4 is a metal fin. The second graphite layer 6b is disposed between the lamp cup 3 and the heat dissipating member 4, and the second graphite layer 6b is made of graphite, so that the heat of the lamp cup 3 can be efficiently conducted to the heat dissipating member 4.
Furthermore, the circuit board base 2, the lamp cup 3 and the heat dissipating component 4 are locked and screwed by a first screw member 7a, thereby making the circuit board base 2, the first graphite layer 6a, the lamp cup 3, and the first The two graphite layers 6b and the heat dissipating member 4 can be closely adhered to enhance the heat conduction effect. In the embodiment, the first screw member 7a includes a screw and a nut.
With the above technical means, waste heat will be effectively conducted and discharged, so that the service life of the light-emitting device can be prolonged, and because of the improvement of heat conduction and heat dissipation, the heat-dissipating component can use a smaller heat-dissipating component, such as a metal heat sink. So you can save material or simplify the structure.
Referring to Fig. 2, there is shown a cross-sectional view of a light-emitting device having a light-emitting diode according to a second embodiment of the present invention. The light-emitting device 100a having the light-emitting diode according to the second embodiment of the present invention is different from the light-emitting device 100 having the light-emitting diode of the first embodiment in that a circuit board base 2 and the lamp cup 3 are provided with a first The tin layer 5b is not the first graphite layer. The second tin layer 5b is disposed in the same manner as the first tin layer 5a, and will not be described again. By soldering the second tin layer 5b, the circuit board base 2 and the lamp cup 3 can be tightly combined, and in addition to the better heat conduction effect, it is not required to be screwed by the first screw member 7a, so only need The lamp cup 3 and the heat dissipating member 4 can be locked by a second screw member 7b, and the soldering effect is even better than that of the screw.
Referring to Fig. 3, there is shown a cross-sectional view of a light-emitting device having a light-emitting diode according to a third embodiment of the present invention. The light-emitting device 100b having the light-emitting diode according to the third embodiment of the present invention is different from the light-emitting device 100 having the light-emitting diode of the first embodiment in that the surface of the heat dissipating member 4 of the present embodiment has heat-dissipating fins 41. The area in contact with the air is increased by the heat dissipation fins 41 to increase the rate of heat dissipation, thereby effectively reducing the temperature of the light-emitting device.
In summary, the light-emitting device with the light-emitting diode of the present invention provides a longer service life and better heat dissipation effect, and is more suitable for various situations.
The above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other improvements according to the above description, but these changes still belong to the inventive spirit of the present invention and the patents defined below. In the scope.
100‧‧‧Lighting device with light-emitting diode
1‧‧‧Lighting diode module
11‧‧‧Lighting diode
12‧‧‧ pins
2‧‧‧Board base
21‧‧‧Contacts
3‧‧‧light cup
4‧‧‧Heat components
5a‧‧‧ first tin layer
6a‧‧‧First graphite layer
6b‧‧‧Second graphite layer
7a‧‧‧First screw member

Claims (9)

  1. A light-emitting device having a light-emitting diode, comprising: a light-emitting diode module having a light-emitting diode; a circuit board base, wherein one side of the circuit board base is provided with the light-emitting diode mold a light cup having one side disposed adjacent to the other side of the circuit board base; and a heat dissipating component disposed adjacent to the other side of the light cup, wherein the light emitting diode module and A first tin layer is disposed between the circuit board base, and a second tin layer or a first graphite layer is disposed between the circuit board base and the lamp cup, and between the lamp cup and the heat dissipating component A second graphite layer is provided.
  2. A light-emitting device having a light-emitting diode according to claim 1, wherein the first tin layer and the second tin layer are coated by a printing coating method.
  3. The light-emitting device having the light-emitting diode according to claim 2, wherein the first tin layer and the second tin layer are disposed by reflow soldering.
  4. A light-emitting device having a light-emitting diode according to claim 1, wherein the circuit board base is a metal core printed circuit board.
  5. The illuminating device having the illuminating diode according to claim 1, wherein the heat dissipating component is a metal heat sink.
  6. The illuminating device having the illuminating diode according to claim 1, wherein the surface of the heat dissipating component has a heat dissipating fin.
  7. The illuminating device having the illuminating diode according to claim 1, wherein the metal fin is attached to the second graphite layer.
  8. The illuminating device with a light-emitting diode according to claim 1, wherein the circuit board base, the lamp cup, and the heat dissipating component are screwed by a first screw member.
  9. A light-emitting device having a light-emitting diode according to claim 1, wherein the light cup The heat dissipating component is screwed with a second screw member.
TW102103358A 2013-01-29 2013-01-29 A light emitting device, which has a light emitting diode TW201430278A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102103358A TW201430278A (en) 2013-01-29 2013-01-29 A light emitting device, which has a light emitting diode

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW102103358A TW201430278A (en) 2013-01-29 2013-01-29 A light emitting device, which has a light emitting diode
CN201310053019.8A CN103972379A (en) 2013-01-29 2013-02-19 Light-emitting device having light-emitting diode
PCT/CN2013/076791 WO2014127594A1 (en) 2013-01-29 2013-06-05 Light-emitting device having light-emitting diode

Publications (1)

Publication Number Publication Date
TW201430278A true TW201430278A (en) 2014-08-01

Family

ID=51241654

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102103358A TW201430278A (en) 2013-01-29 2013-01-29 A light emitting device, which has a light emitting diode

Country Status (3)

Country Link
CN (1) CN103972379A (en)
TW (1) TW201430278A (en)
WO (1) WO2014127594A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587270B (en) * 2015-11-20 2017-06-11 友達光電股份有限公司 Display apparatus, and thermal and electrical conductive device thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104501120A (en) * 2014-11-25 2015-04-08 福建省辉尚光电科技有限公司 Novel LED lamp heat-radiating structure
CN106972096A (en) * 2016-10-26 2017-07-21 湾城公司 A kind of heat-dissipating structure body and application
CN112205089A (en) * 2018-05-20 2021-01-08 阿贝亚技术有限责任公司 Low-temperature light-emitting diode

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2440838B1 (en) * 2009-06-10 2016-09-28 Shirish Devidas Deshpande Customizable, long lasting, thermally efficient, environment friendly, solid-state lighting apparatuses
CN101740712A (en) * 2009-12-17 2010-06-16 上海靖耕照明电器有限公司 LED (Liquid Emitting Diode) crystal grain fixing method
CN102234410B (en) * 2010-04-28 2013-12-25 上海合复新材料科技有限公司 Heat-conducting thermosetting molding composite material and application thereof
CN202308069U (en) * 2011-11-04 2012-07-04 汪荃 LED module group of large power
CN102644866A (en) * 2012-03-07 2012-08-22 厦门天力源光电科技有限公司 LED (Light-Emitting Diode) lamp bulb with good heat radiation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587270B (en) * 2015-11-20 2017-06-11 友達光電股份有限公司 Display apparatus, and thermal and electrical conductive device thereof

Also Published As

Publication number Publication date
CN103972379A (en) 2014-08-06
WO2014127594A1 (en) 2014-08-28

Similar Documents

Publication Publication Date Title
US8071998B2 (en) Light emitting assembly
CN101776248B (en) Lamp and illumination device thereof
JP4866975B2 (en) LED lamp and lighting fixture
JP2011096594A (en) Bulb type led lamp
KR101367360B1 (en) Flexible heat dissipating substrate for led lighting module and led lighting module with the same
TW201430278A (en) A light emitting device, which has a light emitting diode
EP2184790A1 (en) Light emitting diode and llght source module having same
TWI575785B (en) Light emitting device
TWI572818B (en) Heat dispersion structure and manufacturing method thereof
KR101028357B1 (en) LED Lighting Device Having Radiating Structure
KR100943074B1 (en) Lamp with light emitting diodes using alternating current
TW201616699A (en) Circuit board for driving flip-chip light emitting chip and light emitting module comprising the same
KR101244854B1 (en) Dissipative assembly to emit the heat caused from LED blub lights
US8517569B2 (en) Illumination device
US20130235553A1 (en) Illumination device
KR100910746B1 (en) An apparatus for radiating heat of led lamp
RU79717U1 (en) LED light source
JP2011086618A (en) Illumination device
RU2638027C1 (en) Light-emitting module
RU172194U1 (en) Light-radiating module
KR100914859B1 (en) Led module having radiation funetion
KR20130068796A (en) Lamp with light emitting diodes
TWI648885B (en) Light emitting device
JP2011086615A (en) Illumination device
TWM419221U (en) LEDpack Heat-dissipation structure