M340408 八、新型說明： 【新型所屬之技術領域】 * 本新型涉及一種發光二極體燈具，尤指一種具 •有散熱裝置的發光二極體燈具。 【先前技術】 隨著科學技術的進步，從一般鎢絲燈發展到現 在的冷陰極螢光燈管（Cold Cathode Fluorescent 鲁 Lamp，CCFL)及發光二極體（LightEmittingDiode， LED )，皆是朝向體積縮小及扁平化的方向發展。 而目前CCFL因為體積幾乎是不能再縮小，而 且CCFL升壓到600伏特電壓時會發生幹擾，另外 CCFL會造成汞污染的問題，使得部分國家也將予 以禁用。而LED具有環保、亮度高、省電、壽命 長等諸多特點，所以LED將漸漸取代CCFL。惟， 現今的高亮度LED所產生的局部熱量較大，若要 參取代CCFL作為照明產品，則必須要有合適的散熱 設計；否則會造成LED發光效率降低及壽命縮短 ，等問題，所以現今LED封裝結構多利用金屬承載 基板（Metal Core Print Circuit Board，MCPCB )作 為散熱媒介，但LED仍無法以高密集度方式設置， 原因在於散熱能力仍無法有效突破，因此有關 散熱是目前業界亟需克服的難題。 【新型内容】 鑒於此，有必要提供一種散熱良好、工作穩定 7 M340408 的發光二極體燈具。 一種發光二極體燈具，包括一燈座、一散熱衣 .置、一燈帽和一安裝在該燈帽内的發光二極體’ 4 -散熱裝置位於該燈座與燈帽之間並將兩者連接。^ 散熱裝置包括一扇框、一設於該扇框内的葉輪、一 與該葉輪相對設置的散熱模組，該扇框的雨端分別 與該燈座和燈帽連接固定。該散熱模組包括一散熱 I器和一熱管。該散熱器包括一柱狀的導熱體、設於 該導熱體上的複數散熱片、以及形成於該導熱體内 的一安裝孔。該熱管包括一蒸發段和一冷凝段。該 蒸發^又與該發光二極體接觸。該冷凝段穿置於‘熱 體的安襄孔中。 本新型發光二極體燈具中將冷凝段穿置於導 熱體的安裝孔中，使冷凝段的外周面被導熱體緊緊 包裹’兩者之間具有較大的結合面積即熱交換面 _積。因此，冷凝段上的熱量可迅速地傳導至導熱體 上’既可確保冷凝段具有較低的溫度而提高熱管的 放率’又可確保熱量快速傳遞到散熱器上而充分地 利用政熱器進行散熱。如此，發光二極體運行時所 產生的熱量可及時、快速地散發到外部環境中去， 從而可確保發光二極體工作于正常的溫度範圍 内’提昇燈具的照明效果。 【實施方式】 下面將結合圖式對本新型實施例作進一步之 8 M340408 詳細說明。 如圖1至2所不’本新型的發光二極體燈具 ίο包括k座ι〇0、一導熱板200、一散熱裝置 300、一燈帽400和一發光二極體5〇〇，該發光二M340408 VIII. New description: [New technical field] * This new type relates to a light-emitting diode lamp, especially a light-emitting diode lamp with a heat sink. [Prior Art] With the advancement of science and technology, from the development of general tungsten filament lamps to the current cold cathode fluorescent lamps (Cold Cathode Fluorescent Lu Lamp, CCFL) and Light Emitting Diode (LED), all are oriented toward volume. The direction of shrinking and flattening. At present, the CCFL can hardly shrink because of the volume, and the CCFL will increase to 600 volts, and the CCFL will cause mercury pollution, which will be banned in some countries. LEDs have many characteristics such as environmental protection, high brightness, power saving, long life, etc., so LED will gradually replace CCFL. However, today's high-brightness LEDs generate a large amount of local heat. If you want to replace CCFL as a lighting product, you must have a proper heat dissipation design; otherwise, LED lighting efficiency will decrease and life will be shortened, so today's LEDs The package structure uses the Metal Core Print Circuit Board (MCPCB) as the heat dissipation medium, but the LED cannot be set in a high-density manner. The reason is that the heat dissipation capability cannot be effectively broken. Therefore, the heat dissipation is urgently needed in the industry. problem. [New content] In view of this, it is necessary to provide a light-emitting diode lamp with good heat dissipation and stable operation 7 M340408. A light-emitting diode lamp includes a lamp holder, a heat sink, a lamp cap, and a light-emitting diode mounted in the lamp cap. 4 - a heat sink is located between the lamp holder and the lamp cap and Both are connected. The heat dissipating device comprises a frame, an impeller disposed in the fan frame, and a heat dissipating module disposed opposite the impeller, wherein the rain end of the fan frame is respectively fixedly connected to the lamp holder and the lamp cap. The heat dissipation module includes a heat sink and a heat pipe. The heat sink includes a columnar heat conductor, a plurality of heat sinks disposed on the heat conductor, and a mounting hole formed in the heat conductor. The heat pipe includes an evaporation section and a condensation section. The evaporation is in contact with the light-emitting diode. The condensing section is placed in the ampule of the 'hot body. In the novel light-emitting diode lamp, the condensation section is placed in the mounting hole of the heat conductor, so that the outer peripheral surface of the condensation section is tightly wrapped by the heat conductor. The heat exchange surface has a large joint area. . Therefore, the heat on the condensation section can be quickly transmitted to the heat conductor 'both to ensure that the condensation section has a lower temperature and increase the rate of heat pipe', and to ensure the rapid transfer of heat to the radiator and make full use of the heat exchanger Cool down. In this way, the heat generated by the operation of the LED can be quickly and quickly dissipated into the external environment, thereby ensuring that the LED operates in a normal temperature range to enhance the illumination of the fixture. [Embodiment] Hereinafter, the present embodiment will be further described in detail with reference to the drawings. As shown in FIGS. 1 to 2, the novel light-emitting diode lamp ίο includes a k-square 〇0, a heat-conducting plate 200, a heat sink 300, a lamp cap 400, and a light-emitting diode 5, which emits light. two
極體500以現有的方式安裝在該燈帽4〇〇内。該導 熱板200疋由具有良好熱傳導性的材料如銅等製 成，並貼覆在該發光二極體5〇〇上。該導熱板2〇〇 吸收發光二極體500產生的熱量，並將熱量傳遞給 與其接觸的散熱裝置3 00。該散熱裝置300位於該 燈座100與該燈帽400之間並將兩者固定連接。 該散熱裝置300包括一扇框310、一設於該扇 框310内的葉輪3 20、一位於該葉輪3 2〇上方的散 熱模組3 3 0。 該扇框3 1 0包括一圓筒狀的殼體3 1 2和沿該殼 體312周緣對稱設置的四個延伸臂314，該四個延 •伸臂314從該殼體312的上端豎直向上延伸並指向 «亥力且帽4〇〇。該殼體312的底端可以與燈座1〇〇的 上端相互配合，並可通過膠水枯接等方式將殼體 • 312安裝在該燈座1〇〇上。該四個延伸臂314插入 並固定在該燈帽400内，如此，該燈座1〇〇、燈帽 400和扇框310即可組裝在一起。優選地，每一延 伸臂314的内側壁上設有一加強肋316，用以提高 延伸臂3 14的強度。 該扇框3 10還包括一圓形的支撐板3 1 7和自該 9 M340408 支撐板3 17的周緣向外延伸的複數連接肋3 1 8。該 支撐板317設於該扇框310底部的中心並通過連接 •肋318固定在殼體312上。該支撐板317用於支撐 • ΰ亥葉輪320。該葉輪320包括一輪轂322及由該輪 轂3 2 2周邊向外呈放射狀延伸的複數葉片3 2 4。該 葉輪3 20可通過現有的方式設於該支撐板317上， 並可在扇框310内旋轉從而產生強制氣流吹向散 熱模組3 3 0。The pole body 500 is mounted in the lamp cap 4 in the existing manner. The heat conducting plate 200 is made of a material having good thermal conductivity such as copper or the like, and is attached to the light emitting diode 5''. The heat conducting plate 2 吸收 absorbs the heat generated by the light emitting diode 500 and transfers the heat to the heat sink 300 in contact therewith. The heat sink 300 is located between the socket 100 and the lamp cap 400 and is fixedly connected. The heat dissipating device 300 includes a fan frame 310, an impeller 3 20 disposed in the fan frame 310, and a heat dissipation module 303 above the impeller 32. The frame 3 1 0 includes a cylindrical casing 31 and two extending arms 314 symmetrically disposed along the circumference of the casing 312. The four extending arms 314 are vertically upward from the upper end of the casing 312. Extend and point to «Hai Li and Cap 4〇〇. The bottom end of the housing 312 can cooperate with the upper end of the socket 1 ,, and the housing 312 can be mounted on the socket 1 by glue or the like. The four extension arms 314 are inserted and fixed in the lamp cap 400, so that the lamp holder 1〇〇, the lamp cap 400 and the fan frame 310 can be assembled. Preferably, a reinforcing rib 316 is provided on the inner side wall of each of the extension arms 314 for increasing the strength of the extension arm 314. The frame 3 10 further includes a circular support plate 317 and a plurality of connecting ribs 3 1 8 extending outwardly from the periphery of the 9 M 340 408 support plate 317. The support plate 317 is disposed at the center of the bottom of the sash frame 310 and is fixed to the housing 312 by a connecting rib 318. The support plate 317 is used to support the 叶轮 叶轮 impeller 320. The impeller 320 includes a hub 322 and a plurality of blades 3 24 extending radially outwardly from the periphery of the hub 32 2 . The impeller 3 20 can be disposed on the support plate 317 in a conventional manner, and can be rotated in the fan frame 310 to generate a forced air flow to the heat dissipation module 310.
I 請參考圖3，該散熱模組3 3 0包括一呈υ型的 熱管332和二相同的散熱器334。該熱管332包括 一蒸發段3320和二大致平行的冷凝段3322。該蒸 發段33 20呈扁平狀，其底面3324是平的，且該底 面3 324與該導熱板200直接接觸。該二冷凝段3322 自該蒸發段3 3 2 0的兩端垂直延伸而出並分別伸入 到該二散熱器3 3 4内部。 | 該二散熱器334並列、間隔設置，每一散熱器 3 34包括一圓柱狀的導熱體3340及複數從該導熱 ‘ 體3340的外側壁面呈放射狀延伸出來的散熱片 • 3342。該散熱器334還包括形成於該導熱體334〇 上的一安裝孔3 3 4 6，該安裝孔3 3 4 6沿該導熱體 3 3 40的軸線方向延伸。在本實施例中，該安裝孔 3 346沿該導熱體3340的軸線方向延伸並貫穿該導 熱體3340。該安裝孔3346的孔徑與冷凝段3322 的直徑相適應，以供冷凝段3322緊密地穿置其 M340408 中。冷凝段3322穿置於導熱體3340的安裝孔3346 中，其外周面與安裝孔3346的内壁面之間緊密配 . 合（例如，過盈配合），而與導熱體3340結合成一 上述燈具10使用過程中，發光二極體500產 生的熱量被導熱板200吸收，導熱板2〇〇吸收的熱 量通過熱管332傳遞到導熱體3340上，再通過散 熱片3342散發到外部環境中去。而且，葉輪32〇 旋轉產生的強制氣流吹向散熱片3342，從而提昇 散熱片3342與外部環境之間的熱交換速度。如 此’發光二極體500運行時所產生的熱量可通過散 熱震置300散發。 由於冷凝段3 3 2 2的外周面被導熱體3 3 4 0緊緊 包裹，兩者之間具有較大的結合面積即熱交換面 積’故冷凝段上3322的熱量可迅速地傳導至導熱 體3340上，既可確保冷凝段3322具有較低的溫度 :提高熱管332的效率，又可確保熱量快速傳遞到 政熱器334上而充分地利用散熱器刊4進行散熱。 此叙光一極體5 〇 〇運行時所產生的熱量可及 時、快速地散發到外部環境中去，從而可;^保發光 〜極體 500工作于正堂沾、、西命伙 吊的服度乾圍内，提昇燈具 1 υ的照明效果。 ^外，通過在散熱器334下方設置葉輪320， σ β咼散熱片3342與外部環境之間的熱交換速 11 M340408 度，加速熱i的散發，提高散熱模組3 3 〇的散熱效 率。此外，被散熱片3342加熱的空氣可通過延伸 •臂314之間較大的通道快速地流動到燈具丄〇的外 -部’降低燈具1 〇内部的溫度，進一步提高散熱裝 置3 00的效率。 圖4所示為本新型另一實施例中發光二極體 燈具使用的散熱模組330a，該散熱模組33〇a可取 着代别述的散熱模組3 3 0用以冷卻發光二極體5 〇 〇。 該散熱模組330a包括一呈u型的熱管332a和一散 熱3 34a。該熱管332a包括一蒸發段3320a和二 大致平行的冷凝段3 3 2 2 a。該蒸發段3 3 2 0 a呈扁平 狀’其底面是平的，且該底面與該導熱板2〇〇直接 接觸。該二冷凝段3322a自該蒸發段332〇a的兩端 垂直延伸而出並伸入到該散熱器3 3 4 a内部。 该散熱器334a括一柱狀導熱體3340a及從該 籲導熱體3 3 4 0 a的外側壁面呈放射狀延伸出來的複 數政熱片3342a。該導熱體3340a在垂直於其轴線 •方向上的截面圖形近似為橢圓形。該散熱器3 3 4 a 還包括形成於該柱狀導熱體3340a上的二安裝孔 3346a，該二安裝孔3346a沿該導熱體3340a的軸 線方向延伸。在本實施例中，該二安裝孔3346a沿 該導熱體3340a的軸線方向延伸並貫穿該導熱體 3340a。熱管332a的冷凝段3322a分別穿置於導熱 體3340a的安裝孔3346a中，且冷凝段3322a的外 12 M340408 周面與安裝孔3 3 4 6 a的内壁面之間緊密配合（例 如，過盈配合）’而與導熱體3340a結合成一體。 ' 優選地，可將該二安裝孔3346a分別設置在該導熱 - 體3340在垂直於其軸線方向上的橢圓形截面的二 焦點處，這樣設置可令冷凝段3322a上的熱量快 速、均勻地分佈到整個導熱體3340a上，進而充分 利用散熱片3342a進行散熱。 如上所述’熱管332a的兩個冷凝段3322a均 緊密地安裝在同一散熱器334a的導熱體3340a 上，極大地增加了冷凝段3 3 2 2 a與導熱體3 3 4 0 a之 間的熱交換面積。如此，冷凝段3322a可將蒸發段 33 20a吸收的熱量快速地傳導在導熱體3340a上， 從而使蒸發段3320a具有較低的溫度以便將發光 二極體5 0 0產生的熱量及時吸收。此外，通過將導 熱體3340a設置成橢圓柱狀，可增大導熱體3340a φ與散熱片3342a之間的接觸面積，有利於將導熱體 3340a上的熱量傳導至散熱片3342a上，這樣設 ，置’既可確保冷凝段3322a上的熱量快速被導熱體 -3340a吸收’又可確保導熱體3340a與散熱片3342a 之間具有較大的結合面積以加速熱量的散發。 图5所示為本新型另一實施例中發光二極體 、^使用的散熱模組330b，該散熱模組330b可取 代4述的政熱模組3 3 0用以冷卻發光二極體5 0 0。 "亥政熱模組33〇b包括一直熱管332b和一散熱 13 M340408 器334b。該熱管33 2b包括一平的端面33 20b，用 以與上述的導熱板200接觸。該散熱器334b包括 一圓柱狀的導熱體3340b及從該導熱體3340b的外 側壁面呈放射狀延伸出來的複數散熱片3342b。該 散熱器330b還包括形成於該導熱體334〇b上的一 安裝孔3346b，該安裝孔3346b沿該導熱體334〇b 的軸線方向延伸。在本實施例中，該安裝孔3346匕 沿該導熱體3340b的軸線方向延伸並貫穿該導熱 體3340b。该安裝孔3346b的孔徑與熱管33汕的 直徑相適應，以供熱管332b緊密 與導熱體3鳩結合成一體。 牙置其中，而 綜上所述，本新型符合新型專利之要 =提出專利中請。惟以上所述者僅為本新型之好 只施例，舉凡熟悉本案技藝之人士， 榖么I Referring to FIG. 3, the heat dissipation module 305 includes a heat pipe 332 of a υ type and a heat sink 334 of the same type. The heat pipe 332 includes an evaporation section 3320 and two substantially parallel condensation sections 3322. The evaporation section 33 20 is flat, its bottom surface 3324 is flat, and the bottom surface 3 324 is in direct contact with the heat conducting plate 200. The two condensation sections 3322 extend perpendicularly from opposite ends of the evaporation section 3 3 2 0 and extend into the interior of the two heat sinks 3 3 4 , respectively. The two heat sinks 334 are arranged side by side and spaced apart. Each heat sink 3 34 includes a cylindrical heat conductor 3340 and a plurality of heat sinks 3342 extending radially from the outer wall surface of the heat conducting body 3340. The heat sink 334 further includes a mounting hole 3 3 4 6 formed on the heat conductor 334 , and the mounting hole 3 3 4 6 extends along the axial direction of the heat conductor 3 3 40. In the present embodiment, the mounting hole 3 346 extends in the axial direction of the heat conductor 3340 and penetrates the heat conductor 3340. The aperture of the mounting aperture 3346 is adapted to the diameter of the condensing section 3322 for the condensing section 3322 to closely penetrate into its M340408. The condensing section 3322 is inserted into the mounting hole 3346 of the heat conductor 3340, and the outer peripheral surface thereof is closely matched with the inner wall surface of the mounting hole 3346 (for example, an interference fit), and is combined with the heat conductor 3340 to form a lamp 10 as described above. During the process, the heat generated by the light-emitting diode 500 is absorbed by the heat conducting plate 200, and the heat absorbed by the heat conducting plate 2 is transferred to the heat conducting body 3340 through the heat pipe 332, and then radiated to the external environment through the heat sink 3342. Moreover, the forced air flow generated by the rotation of the impeller 32 is blown toward the fins 3342, thereby increasing the heat exchange speed between the fins 3342 and the external environment. Thus, the heat generated by the operation of the light-emitting diode 500 can be dissipated through the thermal shock 300. Since the outer peripheral surface of the condensation section 3 3 2 2 is tightly wrapped by the heat conductor 3 3 4 0, the heat exchange area between the two is large, so the heat of the 3322 on the condensation section can be quickly transmitted to the heat conductor. On the 3340, it is ensured that the condensation section 3322 has a lower temperature: the efficiency of the heat pipe 332 is increased, and the heat is quickly transferred to the heat exchanger 334 to fully utilize the heat sink 4 for heat dissipation. The heat generated by this Supreme Body 5 〇〇 can be dissipated into the external environment in a timely and rapid manner, so that the illuminating illuminator ~ the polar body 500 works in the Zhengtang dip, and the Ximing sling is dry. In the enclosure, the lighting effect of the luminaire is increased. In addition, by providing the impeller 320 under the heat sink 334, the heat exchange speed between the σβ咼 heat sink 3342 and the external environment is 11 M340408 degrees, the heat i is dissipated, and the heat dissipation efficiency of the heat dissipation module 3 3 提高 is improved. In addition, the air heated by the fins 3342 can be quickly moved to the outside of the luminaire by the larger passage between the extension arms 314 to lower the temperature inside the luminaire 1 ,, further improving the efficiency of the heat dissipating device 300. FIG. 4 is a schematic diagram of a heat dissipation module 330a used in a light-emitting diode lamp according to another embodiment of the present invention. The heat dissipation module 33A can take a heat dissipation module 303 for cooling the light-emitting diode. 5 〇〇. The heat dissipation module 330a includes a U-shaped heat pipe 332a and a heat dissipation 3 34a. The heat pipe 332a includes an evaporation section 3320a and two substantially parallel condensation sections 3 3 2 2 a. The evaporation section 3 3 2 0 a is flat. The bottom surface thereof is flat, and the bottom surface is in direct contact with the heat conducting plate 2A. The two condensation sections 3322a extend perpendicularly from both ends of the evaporation section 332a and extend into the interior of the heat sink 3 34a. The heat sink 334a includes a columnar heat conductor 3340a and a plurality of fins 3342a extending radially from the outer wall surface of the heat conductor 3 3 40a. The cross-sectional pattern of the heat conductor 3340a in a direction perpendicular to its axis is approximately elliptical. The heat sink 3 3 4 a further includes two mounting holes 3346a formed in the columnar heat conductor 3340a, and the two mounting holes 3346a extend in the axial direction of the heat conductor 3340a. In the present embodiment, the two mounting holes 3346a extend in the axial direction of the heat conductor 3340a and penetrate the heat conductor 3340a. The condensation section 3322a of the heat pipe 332a is respectively inserted into the mounting hole 3346a of the heat conductor 3340a, and the outer surface of the outer 12 M340408 of the condensation section 3322a is closely fitted with the inner wall surface of the mounting hole 3 3 4 6 a (for example, an interference fit) '' and integrated with the heat conductor 3340a. Preferably, the two mounting holes 3346a are respectively disposed at the two focal points of the elliptical cross section of the heat conducting body 3340 in a direction perpendicular to the axial direction thereof, so that the heat on the condensation section 3322a can be quickly and evenly distributed. The entire heat conductor 3340a is used, and the heat sink 3342a is utilized to dissipate heat. As described above, the two condensation sections 3322a of the heat pipe 332a are closely mounted on the heat conductor 3340a of the same heat sink 334a, greatly increasing the heat between the condensation section 3 3 2 2 a and the heat conductor 3 3 4 0 a. Exchange area. Thus, the condensing section 3322a can quickly conduct the heat absorbed by the evaporation section 33 20a on the heat conductor 3340a, so that the evaporation section 3320a has a lower temperature to absorb the heat generated by the illuminating diode 500 in time. In addition, by providing the heat conductor 3340a in an elliptical column shape, the contact area between the heat conductor 3340a φ and the heat sink 3342a can be increased, which is advantageous for conducting heat on the heat conductor 3340a to the heat sink 3342a. 'Also ensures that the heat on the condensation section 3322a is quickly absorbed by the heat conductor-3340a' and ensures a large bonding area between the heat conductor 3340a and the heat sink 3342a to accelerate heat dissipation. FIG. 5 is a schematic diagram of a heat dissipation module 330b for use in a light-emitting diode according to another embodiment of the present invention. The heat dissipation module 330b can replace the political thermal module 300 of the above description for cooling the light-emitting diode 5 0 0. "Haizhen thermal module 33〇b includes a constant heat pipe 332b and a heat sink 13 M340408 334b. The heat pipe 33 2b includes a flat end face 33 20b for contacting the heat conducting plate 200 described above. The heat sink 334b includes a cylindrical heat conductor 3340b and a plurality of fins 3342b extending radially from the outer wall surface of the heat conductor 3340b. The heat sink 330b further includes a mounting hole 3346b formed on the heat conductor 334b, and the mounting hole 3346b extends in the axial direction of the heat conductor 334b. In the present embodiment, the mounting hole 3346 延伸 extends in the axial direction of the heat conductor 3340b and penetrates the heat conductor 3340b. The diameter of the mounting hole 3346b is adapted to the diameter of the heat pipe 33'' so that the heat pipe 332b is tightly integrated with the heat conductor 3'. The tooth is placed in it, and in summary, the new type meets the requirements of the new patent. However, the above is only a good example of this new model. For those who are familiar with the skills of this case, what?
精神所作之等效修飾或變化，皆應 ：：新型 請專利範圍内。 風於Μ下之申 【圖式簡單說明】 圖 圖1是本新型-實施例中發光二極體燈具的立 中散熱模組的倒置、放大。 圖4疋本新型另一實施例中發光二極體产且 用的散熱模組的立體分解圖。 且/、吏 圖5是本新型另-實施例中發光二極體燈具使 14 M340408 用的散熱模組的立體圖。 【主要元件符號說明】Equivalent modifications or changes made by the spirit should be in the scope of the new patent. The wind is applied to the underarms. [Simplified illustration of the drawings] Fig. 1 is an inverted and enlarged vertical heat dissipation module of the light-emitting diode lamp of the present invention. 4 is an exploded perspective view of a heat dissipation module produced by a light-emitting diode according to another embodiment of the present invention. And/or FIG. 5 is a perspective view of a heat dissipation module for the 14 M340408 of the light-emitting diode lamp of the present invention. [Main component symbol description]
發光二 極 體燈具 10 燈 座 導熱板 200 散 熱裝置 扇框 310 殼 體 延伸臂 3 14 加 強肋 支撐板 3 17 連 接肋 葉輪 320 輪 轂 葉片 324 底 面 散熱模 組 330、 330a、 330b 熱管 332、 332a、 332b 蒸發段 3320、 3320a 冷凝段 3322、 3322a 散熱器 334、 334a、 334b 導熱體 3340、 3340a 、3340b 散熱片 3342、 3342a 、3342b 安裝孔 3346 ^ 3346a > 3346b 端面 3320b 燈 帽 發光二 極 體 500 400 100 300 312 316 318 322 3324 15LED illuminator 10 lamp holder thermal plate 200 heat sink fan frame 310 housing extension arm 3 14 rib support plate 3 17 connecting rib impeller 320 hub blade 324 bottom heat dissipation module 330, 330a, 330b heat pipe 332, 332a, 332b Evaporation section 3320, 3320a Condensation section 3322, 3322a Heat sink 334, 334a, 334b Heat conductor 3340, 3340a, 3340b Heat sink 3342, 3342a, 3342b Mounting hole 3346^3346a > 3346b End face 3320b Lamp cap LED 500 400 100 300 312 316 318 322 3324 15