201250160 四、指定代表圖： (一） 本案指定代表圖為：第（1)圖。 (二） 本代表圖之元件符號簡單說明： 1 LED模組 2 内散熱器 3 熱管組 4 壞狀均熱板 5 外散熱器 6 熱管支架 7 均熱板 21 氣流通道 22 内散熱器凹槽 51 氣流通道 五、本案若有化學式時，請揭示最能顯示發明特徵的化學式： 六、發明說明： 【發明所屬之技術領域】 201250160 本發明係有關-種LED燈具，特別是—種大功率_燈具。 【先前技術】 在戶内外廣場、體育場、各種商業廣場以及工業工廠、礦場等 大型場所或公路，會㈣大功率燈具進行照明，以使場所内能獲得 足夠的光線，供人們進行娛樂或工作活動。而隨著LED照明的普及， 為尋求更為節能環保及長壽命的照明方案，目前在大型場合所應該 用的大功率照明燈具，已逐漸由更為符合要求的LED所取代，這類 LED照明燈，通常可稱為大功率LED照明燈具。眾所周知，LED在散 熱性能上要求十分嚴格，過高的溫度會導致LED發光效率衰減，而 LED運作所產生的廢熱若無法有效散出，則會直接對LED的壽命造成 致命性的影響；尤其是各種超大功率的LED，其散熱問題尤為關鍵， 若無，有效的對這類大功率LED進行散熱，則會造成熱量堆積，嚴 重影響發光效率及使用壽命，並且還存在安全隱患。針對各種大型 場所，單個LED燈具的功率高達500W至1000W，將實現十分理想的 照明效果，然而，現有技術中的散熱模組，一般至多僅能夠配對於 100W至2〇〇w的LED燈具使用，對於更大功率的LED燈具，其散熱性 能將達不到要求’可見，尋求一種更加有效的散熱方案，是十分有 必要的。 【發明内容】 本發明的目的在於提供一種大功LED燈具，提供適合的散熱性 能’可實現更大功率照明的應用。 201250160 本發明為解*其技術問題㈣㈣技術方案是： 一種大功LED燈具，其中包括： 一 LED模組； -筒狀内散熱H，沿軸向設有複數個能夠籍由所接收之熱量而 產生煙固效應的氣流通道； -熱管組，由複數個呈U形f折之鮮所組成，其巾熱管的u 形中段相互拼合成-平整面以固定LED模組，熱管的u形端組成一 套置於内散熱器外並與内散熱器外壁貼合的環狀，其中平整面位於 内散熱器-端，並儘量不阻擋住内散熱器的氣流通道； 經.聲折至環形的均熱板，包覆于熱管組的環狀外，並與每熱管 外側貼合；以及 一套裝於均熱板外的外散熱器，其中 所述内散熱|§外壁沿軸向開設有複數個凹槽，所述複數個熱管 的u形端相匹配安裝於凹槽内；凹槽呈圓弧狀，熱管與凹槽相貼合 的一側為圓弧面，熱管與均熱板相貼合。 LED模組工作所產生熱量，傳遞給熱管组，籍由熱管組的平整面 呈維線料散至熱官的U形端，並分別傳導至内散熱器及均熱板， 均熱板藉此呈二維面發散熱量至外散熱器，以實現内散熱器及外散 熱器同時散熱。 作為-種改進方案，LED模組可通過均熱板安置㈣述熱管組的 平整面。 此外’為了進—步的加強散熱能力，LED模組與熱管組之間，可 201250160 增加使用一均熱板。 作為上述方案的進一步改進，熱管組的平整面與内散熱器之間 設置有熱管支架，熱管支架正面面設置有安置熱管的u形中段之紋 路’熱管支架背面與内散熱器端部緊密貼合。 其中的外散熱器外周沿軸向設置有若干能夠籍由均熱板所傳遞 之熱量而產生煙囪效應的氣流通道。 作為另一種可選方案，其中的外散熱器外周設置有散熱鰭片。 本發明的有益效果是：本發明所提供的散熱結構中，熱管組及 均熱板能夠快速的將LED模組所產生的熱量傳遞給内 '外散熱器， 並由籍由散熱器的煙囪效應，實現快速熱交換，本發明熱量傳導快 速，且通過内、外散熱器實現同時散熱，散熱效果十分理想，經由 實驗，可應用於500〜1000W之超大功率的LED燈具照明，並能夠保 證穩定的散熱及長期的使用壽命。 【實施方式】 如圖1所不，本發明提供的大功率燈具之第一種典型實施 例’結構主要包括LED模組1、内散熱器2、熱管組3、均熱板4及 外散熱器5。 LED模組1採用大功率元件，結構上可由若干排布在一起的 LED，集裝於-基板而形成，⑽卫作中產生的熱量需要及時傳導及 發散’基板作為ϋ定安裝結構，並相作為LED模組丨的接電結構， 並用於將熱量傳導給熱管組3;熱管組3作為熱傳導元器件，目的是 201250160 為了將由led抬^ , 中，該熱管組3有^傳遞，來的熱量快速、有效的傳導出去，其 成為三部分，？個熱官31組成，每—熱管31均呈11形彎折 端，若干執^]間部分為U形中段和沿u形中段兩側分佈的u形 3〇，.該平整i /u形端相互拼合或焊接.在-起形成一平整面 形端共同位於平^ =定⑽· 1的部位；若干鮮31_ 在整體形狀上么 側’並相對於平整面30沿周向分佈， 筒形内散熱器、r—如同圓形圍搁的環狀搁結構，該環狀搁套置於 接典㈣县之外’並與内散熱器2的外壁貼合，如此平整面3〇 圍^環=根據熱管的特性，呈一維的線性發散-形端所共同 成的環狀襴，並傳遞到内散熱器2，由内散熱器2發散出去。 立：彳示為本發明第二種典型的實施例，其中增加了-在内 部具備氣㈣㈣化性騒航實_賴傳導的均熱板了，均熱板 :固定LED模組1 ’外形一般至平面片狀，其優勢在於作為哪 1的女置面的同時，可獲得更優越的導熱性能，以實現對Up 模組1之熱量的快速傳導。 本發明的結構中，燈具各種配件，如電源模組，可以設置於筒 狀内散熱器2的中部孔内，實現隱藏安裝，而導線連接則由孔端引 出’，接在LED模組1上。 參照圖3，本發明中’内散熱器2呈一筒狀，並沿軸向設有氣流 通道21，在與熱管組3裝配完成後，熱管組3所形成的平整面30剛 好位於内散熱器2 —端，此外保證平整面30及其所安置的LED模組 1儘量不阻擋住内散熱器2的氣流通道21，如此内散熱器2在接受 201250160 熱管組3所傳遞的熱量後，會藉此在氣流通道21產生煙囪效應，達 到較好的散熱效果，其狀態如圖2所示；而在實際產品中，可儘量 保也熱管31所形成的環狀欄之間距平均，同時保證内散熱器2的通 道21也呈平均分佈，如此實現熱量的合理分佈及發散。 而作為優選方案，可在熱管組3的平整面3〇與内散熱器2之間 °又置有熱官支架6,如圖4所示，熱管支架6正面面設置有安置熱管 的形中段之凹槽形紋路61，以實現和平整面3〇附近的熱管31的 緊密結合固定，熱管支架6背面則與内散熱器2端部緊密貼合，熱 管支架6利於熱量更佳有效的傳導，同時還能作為到裝配固定的中 間部件，使得結構更為穩定及合理。 上述為本發明通過内散熱器2散熱的結構，而除此外，在熱管 3中所有熱管31之υ形端所形成的環狀欄外，還包覆有經折彎而 成的^形均熱板4,該均熱板4内側壁與每一熱管31之υ形端貼合， 形成良好的傳導結構，藉此熱管31上的熱量除了傳遞給内側的内散 熱器2外，還傳遞給外側的環形均熱板4，並經由均熱板4呈二維的 平面均勻發散熱量；而在均熱板4外，套裝有外散熱器5，該外散熱 器5接收均熱板4所傳遞的熱量，通過空氣流動而散發出去，整體 在夕卜部形成良好的散熱結構。 熱管的通常形狀為一圓管形，本發明中需要進行折彎工藝大致 形成U形，而且需要多個拼裝在一起應用，分別形成一安置平整面 Q /\ 及U形端的環狀欄，因此最好還要對熱管3丨進行壓裝整形，以更 好的和相關元器件貼合裝配，藉此來達到更好的熱傳導效果。在本 201250160 發明的種優選方案中，内散熱器2外壁表面沿軸向開設有若干凹 槽22…、g組3中複數個熱管31的u形端對應安裝於凹槽22内， 爲于更好的相配合，優選將凹槽Μ製成圓弧狀，相應的熱管31 與凹槽22相貼合的一側為圓弧面，兩者實現緊密的貼合，如此在不 必更改.’、、e的外形’簡化工藝的前提下，不但使得熱管組3牢固的 和内散熱器2定位’而且使得兩者貼合緊密而令熱傳導達到最優； 而由於環狀攔外貼合部件為均熱板4 ,在均熱板4側壁的形狀不方便 更改叹置’因此作為優選的方案可將熱管與均熱板4相貼合的 号學制S平面’以同樣達到最優的接觸效果，如此—來，則熱管 31的減面形狀如圖5巾所示，為—溝槽型與金屬燒結的複合結構， 其中一側為與内散熱器2的凹槽22配合的圓弧形，另一侧則為與均 熱板4内側壁貼合的平面。 均熱板4收接收的熱量，需經由外散熱器5發散出去，外散熱 器5與空氣接觸的面積越大，則散熱效果越好，如圖6所示，本發 明優選採用的一種方案中’外散熱器5外周沿轴向設置有若干氣流 通道έΐ，該氣流通道51籍由均熱板4所傳遞之熱量，能夠產生煙囪 效應’以增加空氣流動速度，如此實現了快速的熱傳遞；如圖7所 示’在本發明的另一種優選方案中，外散熱器5外周設置有散熱鰭 片52,而散熱鰭片也可以相互連接，在具有較大的散熱面積的同時， 同樣具備煙匈效應的優勢。 本發明根據上述結構，可應用於超高功率的LED燈具，如圖8 所示：表示了本發明的等效熱阻散熱路徑，可知LED模組1工作時 201250160 產生的熱量，其傳導路線為：首先依次經由Led模組】、均熱板7、 熱管組3及均熱板4’熱管組3在導熱過程中，可等效為—熱超導， 起到熱量快速傳導的作用，而經由熱管組3的熱量則分為兩路， 其卜路為傳遞給㈣熱器2，最終由内散熱器2與空氣熱交換實現 散熱’另-路則通過另一個等效的熱超導均熱板4傳導熱量後，傳 遞給外散熱器5，最終由外散熱器5空氣熱交換實現散熱。可見，本 發明的方案，相當於兩個具備兩個並聯的散熱部，由於其針對唯一 的LED模組1進行散熱，因此散熱效果十分理想。 在燈具安裝後，具有LED模組i的-側大致朝向下方以進行照 =，因此LED模組b作時產生熱量，除由均熱板7、熱管"、熱 管絲6、内散熱器2均熱板4及外散熱器5傳遞外在靠近⑽模 組1的-側，較冷㈣氣遇熱上升，經由内散熱器2和/或外散熱器 5的氣流通道所產生的煙囱效應，經由内散熱器2、外散熱器5氣流 通道及表面，销將㈣《 2、外㈣Μ切歸錄，形成熱 空氣’最終從氣流通道的上方口流出，如此迴圈，即可實現良好的 散熱效果。 .應注意的是，上述只是闡述了本發明較優的實施方式，因此並 不視為本發明唯-的保護範圍，·_瞭_是在不脫離本發明的保 護範圍内，對於本發明所屬技術領域中具有通常知識者而言仍得 _變化及修改。因此，本發明所揭_施例，而 疋以後附申4專·圍之文字記載為准，即不偏離本發 範圍所為之均等變化與修飾，_本發明之涵蓋範圍。 201250160 【圖式簡單說明】 下面結合附圖和具體實施方式進行進一步的說明： 圖1為本發明大功LED燈具第一種實施例的拆分結構示意圖； 圖2為本發明大功率散熱模組的正面結構示意圖； 圖3為本發明中内散熱器的立體結構示意圖； 圖4為本發明中熱管支架的立體結構示意圖； 圖5為熱管的橫截面結構示意圖； 圖6為外散熱器第一種實施例的正面結構示意圖； 圖7為外散熱器第二種實施例的正面結構示意圖； 圖8為本發明的等效熱阻散熱路徑圖； 圖9為本發明大功LED燈具第二種實施例的拆分結構示意圖。 【主要元件符號說明】 1 LED模組 2 内散熱器 3 熱管組 4 環狀均熱板 5 外散熱器 6 熱管支架 7 均熱板 21 氣流通道 22 内散熱器凹槽 31 熱管 51 氣流通道 61 凹槽201250160 IV. Designated representative map: (1) The representative representative of the case is: (1). (2) The symbol of the symbol of this representative figure is simple: 1 LED module 2 inner heat sink 3 heat pipe group 4 bad heat equalizing plate 5 outer heat sink 6 heat pipe bracket 7 heat equalizing plate 21 air flow channel 22 inner heat sink groove 51 Airflow channel 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 6. Invention Description: [Technical field of invention] 201250160 The present invention relates to a kind of LED lamp, especially a kind of high power_lamp . [Prior Art] In large indoor places such as indoor and outdoor squares, stadiums, various commercial plazas, industrial factories, mines, etc., (4) high-power lamps will be illuminated so that enough light can be obtained in the venue for people to entertain or work. activity. With the popularization of LED lighting, in order to seek more energy-saving and environmentally-friendly and long-life lighting solutions, the high-power lighting fixtures that should be used in large-scale occasions have gradually been replaced by more suitable LEDs. Lamps, often referred to as high-power LED lighting fixtures. As we all know, LEDs are very strict in heat dissipation performance. Excessive temperature will cause LED luminous efficiency to attenuate, and if the waste heat generated by LED operation cannot be effectively dissipated, it will directly have a fatal impact on LED life; especially The heat dissipation problem of various super-power LEDs is especially critical. If there is no effective heat dissipation for such high-power LEDs, heat accumulation will occur, which will seriously affect the luminous efficiency and service life, and there are still potential safety hazards. For a variety of large-scale locations, the power of a single LED luminaire can be as high as 500W to 1000W, which will achieve a very good lighting effect. However, the cooling module of the prior art can generally only be used with LED luminaires for 100W to 2〇〇w. For more powerful LED luminaires, the heat dissipation performance will not meet the requirements'. It is very necessary to find a more effective heat dissipation solution. SUMMARY OF THE INVENTION It is an object of the present invention to provide a high power LED luminaire that provides suitable heat dissipation performance for applications that enable greater power illumination. 201250160 The present invention is a solution to the technical problem (4) (4) The technical solution is: A high-power LED lamp, which comprises: an LED module; - a cylindrical heat dissipation H, which is provided in the axial direction by a plurality of heats that can be generated by the received heat The airflow passage of the smoke solid effect; the heat pipe group consists of a plurality of U-shaped f-folded fresh, and the u-shaped middle section of the towel heat pipe is combined with each other to form a flat surface to fix the LED module, and the U-shaped end of the heat pipe constitutes a An annular ring disposed outside the inner heat sink and attached to the outer wall of the inner heat sink, wherein the flat surface is located at the inner heat sink end, and the air flow passage of the inner heat sink is not blocked as much as possible; a plate wrapped around the annular portion of the heat pipe group and attached to the outer side of each heat pipe; and an outer heat sink disposed outside the heat equalizing plate, wherein the inner heat dissipation|§ outer wall is provided with a plurality of grooves in the axial direction The u-shaped ends of the plurality of heat pipes are matched and installed in the grooves; the grooves are arc-shaped, and the side of the heat pipe and the groove is a circular arc surface, and the heat pipe is attached to the heat equalizing plate. The heat generated by the operation of the LED module is transmitted to the heat pipe group, and the flat surface of the heat pipe group is scattered to the U-shaped end of the heat official, and is respectively transmitted to the inner heat sink and the heat equalizing plate, and the heat equalizing plate is used The two-dimensional surface radiates heat to the external heat sink to achieve heat dissipation at the same time as the inner heat sink and the outer heat sink. As an improvement scheme, the LED module can be placed through the soaking plate (4) to describe the flat surface of the heat pipe group. In addition, in order to enhance the heat dissipation capability of the step-by-step, between the LED module and the heat pipe group, a uniform hot plate can be added to the 201250160. As a further improvement of the above solution, a heat pipe bracket is disposed between the flat surface of the heat pipe group and the inner heat sink, and a front surface of the heat pipe bracket is provided with a U-shaped middle section of the heat pipe. The back of the heat pipe bracket is closely fitted with the inner heat sink end. . The outer circumference of the outer radiator is axially disposed with a plurality of air passages capable of generating a chimney effect by heat transferred from the heat equalizing plate. As another alternative, the outer heat sink is provided with heat dissipation fins on the outer circumference. The beneficial effects of the invention are: in the heat dissipation structure provided by the invention, the heat pipe group and the heat equalizing plate can quickly transfer the heat generated by the LED module to the inner and outer heat sink, and the chimney effect by the heat sink The invention realizes rapid heat exchange, and the heat conduction of the invention is fast, and the heat dissipation is realized by the inner and outer heat sinks, and the heat dissipation effect is very ideal. Through experiments, it can be applied to the ultra-high power LED lamp illumination of 500~1000W, and can ensure stable. Cooling and long life. [Embodiment] As shown in FIG. 1, the first exemplary embodiment of the high-power lamp provided by the present invention mainly includes an LED module 1, an inner heat sink 2, a heat pipe group 3, a heat equalizing plate 4, and an outer heat sink. 5. The LED module 1 adopts a high-power component, and the structure can be formed by a plurality of LEDs arranged together, and is assembled on the substrate. (10) The heat generated in the weizhou needs to be conducted and diverged in time as the substrate is mounted and fixed. As the electrical connection structure of the LED module, and used to conduct heat to the heat pipe group 3; the heat pipe group 3 as a heat conduction component, the purpose is 201250160, in order to be lifted by the LED, the heat pipe group 3 has the heat transferred Passing quickly and efficiently, it becomes three parts,? A heat official 31 is composed, and each heat pipe 31 has an 11-shaped bent end, and a part of the middle portion is a U-shaped middle portion and a u-shaped 3 分布 distributed along both sides of the u-shaped middle portion. The flat i / u-shaped end Inserting or welding each other. Forming a flat surface at the same position is located at a position where the flat surface is flat (10)·1; some fresh 31_ are laterally 'on the overall shape' and distributed circumferentially with respect to the flat surface 30, within the cylindrical shape Radiator, r—like an annular ring structure with a circular enclosure, which is placed outside the county (4) and attached to the outer wall of the inner radiator 2, so that the flat surface is 3 According to the characteristics of the heat pipe, a one-dimensional linear divergence-shaped end is formed by a ring-shaped turn, and is transmitted to the inner heat sink 2, and is radiated by the inner heat sink 2. Li: The second typical embodiment of the present invention is shown, in which a heat-receiving plate with a gas (four) (four) chemical 騒 实 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ As for the flat sheet shape, the advantage is that as the female surface of the 1st, the superior thermal conductivity can be obtained to achieve rapid conduction of heat to the Up module 1. In the structure of the present invention, various accessories of the lamp, such as a power module, may be disposed in the middle hole of the cylindrical inner heat sink 2 to realize hidden installation, and the wire connection is led out from the hole end, and is connected to the LED module 1 . Referring to Fig. 3, in the present invention, the inner heat sink 2 has a cylindrical shape and is provided with an air flow passage 21 in the axial direction. After being assembled with the heat pipe group 3, the flat surface 30 formed by the heat pipe group 3 is located just inside the heat sink. 2 - end, in addition, to ensure that the flat surface 30 and the LED module 1 disposed therein do not block the air flow passage 21 of the inner heat sink 2 as much as possible, so that the inner heat sink 2 will borrow after receiving the heat transferred by the heat pipe group 3 of 201250160 This produces a chimney effect in the airflow passage 21, achieving a better heat dissipation effect, and its state is as shown in FIG. 2. In the actual product, the distance between the annular columns formed by the heat pipe 31 can be ensured as much as possible while ensuring internal heat dissipation. The channels 21 of the device 2 are also evenly distributed, thus achieving a reasonable distribution and divergence of heat. As a preferred solution, a heat official bracket 6 may be disposed between the flat surface 3 of the heat pipe group 3 and the inner heat sink 2. As shown in FIG. 4, the front surface of the heat pipe bracket 6 is provided with a middle portion of the heat pipe. The groove-shaped groove 61 is fixed to fix the heat pipe 31 near the flat surface 3〇, and the back surface of the heat pipe bracket 6 is closely adhered to the end of the inner heat sink 2, and the heat pipe bracket 6 facilitates better heat conduction. It can also be used as an intermediate part to the assembly to make the structure more stable and reasonable. The above is the structure for dissipating heat through the inner heat sink 2, and in addition, in addition to the annular column formed by the meandering ends of all the heat pipes 31 in the heat pipe 3, the curved heat-generating plate is also covered. 4. The inner side wall of the heat equalizing plate 4 is in contact with the meandering end of each heat pipe 31 to form a good conductive structure, whereby the heat on the heat pipe 31 is transmitted to the outer side in addition to the inner inner heat sink 2 The annular heat equalizing plate 4 is uniformly radiated by the heat equalizing plate 4 in a two-dimensional plane; and outside the heat equalizing plate 4, an outer heat sink 5 is received, and the outer heat sink 5 receives the heat transferred by the heat equalizing plate 4. It is emitted by the air flow, and the whole body forms a good heat dissipation structure at the outer portion. The general shape of the heat pipe is a round tube shape. In the present invention, the bending process is generally required to form a U shape, and a plurality of assembling pieces are required to be applied together to form a ring-shaped column for positioning the flat surface Q /\ and the U-shaped end, and thus It is also necessary to press-fit the heat pipe 3丨 to better fit the assembled components to achieve better heat conduction. In a preferred embodiment of the invention of the present invention, the outer wall surface of the inner heat sink 2 is provided with a plurality of grooves 22 in the axial direction. The u-shaped ends of the plurality of heat pipes 31 in the group 3 are correspondingly mounted in the grooves 22, for further Preferably, the groove is formed into an arc shape, and the side of the corresponding heat pipe 31 and the groove 22 is a circular arc surface, and the two are closely fitted, so that it is not necessary to change. The e-shape's 'simplified process' not only makes the heat pipe group 3 firm and the inner heat sink 2 positioned' but also makes the two close together and optimizes the heat conduction; The hot plate 4, in the shape of the side wall of the heat equalizing plate 4, is inconvenient to change the sigh'. Therefore, as a preferred solution, the heat pipe can be combined with the soaking plate 4 to achieve the optimal contact effect. - The shape of the heat pipe 31 is reduced as shown in FIG. 5, which is a composite structure of a groove type and a metal sintered body, wherein one side is a circular arc shape matching the groove 22 of the inner heat sink 2, and the other is The side is a plane that fits the inner side wall of the heat equalizing plate 4. The heat received by the heat equalizing plate 4 needs to be dissipated through the outer heat sink 5. The larger the area of the outer heat sink 5 in contact with the air, the better the heat dissipation effect. As shown in FIG. 6, the present invention preferably adopts a scheme. The outer circumference of the outer radiator 5 is provided with a plurality of air flow passages 轴向 in the axial direction, and the air flow passages 51 generate heat by the heat transfer plate 4 to generate a chimney effect to increase the air flow speed, thus achieving rapid heat transfer; As shown in FIG. 7 , in another preferred embodiment of the present invention, the outer heat sink 5 is provided with heat dissipation fins 52 on the outer circumference, and the heat dissipation fins may be connected to each other, and have a large heat dissipation area, and also have smoke. The advantage of the Hungarian effect. According to the above structure, the invention can be applied to an ultra-high power LED lamp, as shown in FIG. 8 : the equivalent thermal resistance heat dissipation path of the present invention is shown, and the heat generated by the LED module 1 during operation 201250160 is known, and the conduction route is Firstly, through the Led module, the soaking plate 7, the heat pipe group 3 and the heat equalizing plate 4' heat pipe group 3, in the heat conduction process, it can be equivalent to - thermal superconducting, which plays the role of rapid heat conduction, and The heat of the heat pipe group 3 is divided into two paths, and the road is transmitted to the (four) heat device 2, and finally the heat is exchanged by the inner heat sink 2 and the air to exchange heat. The other path is passed through another equivalent heat superconducting soaking heat. After the plate 4 conducts heat, it is transmitted to the outer heat sink 5, and finally heat is exchanged by the air heat exchange of the outer heat sink 5. It can be seen that the solution of the present invention is equivalent to two heat dissipating portions having two parallel connections, and the heat dissipating effect is ideal because it dissipates heat for the unique LED module 1. After the lamp is installed, the side with the LED module i is oriented substantially downward to perform illumination, so that the LED module b generates heat during the process, except for the heat equalizing plate 7, the heat pipe ", the heat pipe wire 6, and the inner heat sink 2 The heat equalizing plate 4 and the outer heat sink 5 transmit the chimney effect generated by the air passage of the inner radiator 2 and/or the outer radiator 5, which is externally close to the side of the module 10, and the cold (four) gas rises. Through the inner radiator 2, the outer radiator 5 air flow passage and the surface, the pin will (4) "2, the outer (four) cut and record, the formation of hot air 'finally out from the upper mouth of the airflow passage, so loop, you can achieve good heat radiation. It should be noted that the foregoing is merely a description of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention. Those of ordinary skill in the art still have to make changes and modifications. Therefore, the present invention is intended to be limited to the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a split structure of a first embodiment of a high power LED lamp according to the present invention; FIG. 2 is a schematic diagram of a high power heat dissipation module of the present invention. 3 is a schematic perspective view of the inner heat sink of the present invention; FIG. 4 is a schematic perspective view of the heat pipe support of the present invention; FIG. 5 is a schematic cross-sectional structural view of the heat pipe; FIG. 7 is a front view of a second embodiment of an outer heat sink; FIG. 8 is a schematic diagram of an equivalent thermal resistance heat dissipation path of the present invention; FIG. 9 is a second embodiment of a high power LED lamp according to the present invention; Schematic diagram of the split structure. [Main component symbol description] 1 LED module 2 Inner heat sink 3 Heat pipe group 4 Annular heat equalizing plate 5 Outer heat sink 6 Heat pipe bracket 7 Heat equalizing plate 21 Air flow passage 22 Inner radiator groove 31 Heat pipe 51 Air flow passage 61 Concave groove