丄丄 九、發明說明： 【發明所屬之技術領域】 器。本發明涉及-種散熱器，特別係—種發光二極體散熱 【先前技術】 發光二極體（Light Emitting Di〇de，簡稱㈣），係—種 =發光器件’它係利用半導體晶片作為發光器件，在 1導體中藉由載流子發生複合放出過剩之能量而引起光子 =:直接發出紅、藍等各種顏色之光，發光二極體照明 。口係利用發光二極體作為光源製造出來之照明器具，廣 泛用於通訊、照明、交通、戶外看板等領域。惟，高亮度、 :功率發光二極體會因溫度之升高而導致發光效率明顯下 曰’甚至造成兀件之損壞，於照明領域該問題更加突出。 疋以丄如何將發光二極體之1作溫度保持在範圍内以 ，免剐j現象之發生’係高功率LED燈應用必需解決之問 =目刖，業界通常做法係在發光二極體電路板之下方貼 °又，熱益以散發其熱量，如美國專利US6,517,218B2號即 揭路了-種發光二極體散熱器，其包括—基板及自該基板 L伸而出之夕數散熱鰭片，由基板吸收LED熱量傳到散 .”、·*、曰片依罪政熱鰭片向周圍轄射熱量之方式進行散熱。 提问其政熱效率，一般需增加散熱鰭片數量或增大散 …1片尺寸，但如此—來使得發光二極體散熱器及整個照 明裝置之體積增大、增重。 【發明内容】 7 1331198 有鑒於此，有必要提供一種發光二極體散熱器，其可 、以有限之體積獲得較佳之散熱效果，進而保證發光二極體 .穩定高效地工作。 -種發光一極體散熱器，包括一供發光二極體模組貼 a又之基板及其上延伸出之複數散熱，所述散熱韓片包 括分別由基板兩相反表面延伸出之第一散熱籍片及第二散 熱韓片，各籍片間分別形成有氣流通道，所述基板之兩侧 設有複數向其内延伸且至少切斷部分第一散熱歸片和第二 散熱鰭片之切口。 相對於習知技術，本發明的散熱鰭片形成於發光二極 體散熱Is的基板之相對兩面上，增加發光二極體散熱器之 散熱面積；另’由於基板之兩側設有複數向其内延伸且切 f部分散熱鰭片之切口，既減輕發光二極體散熱器之重 量，又增強空氣在散熱鰭片間之自然對流，從而在不增加 發光二極體散熱器體積和散熱鰭片密度之前提下提升發光 鲁二極體散熱器之散熱效率。 x 【實施方式】 參閱圖1至圖3,為本發明一優選實施例中之發光二極 體散熱器10，用於對發光二極體模組2〇進行。該 二極體模組20 —般係作為一燈具（圖未示）之光源: 前述發光二極體模組20緊密貼設於該發光二極體散熱 器1〇底面，其包括相互並列平行之複數電路板22和複數 發光二極體24,該等發光二極體24均勻裝設於該電路板 22上並與該電路板22電性連接。 8 1331198 該發光二極體散熱器ίο採用高導熱率之金屬或合金， 如銅、鋁或銅鋁合金材料製成，其包括一大致呈矩形平板 狀之基板12及從該基板12表面垂直延伸而出之複數散熱 *-、曰片14。該基板12具有一底面120和與該底面120相對之 一頂面122。該等散熱鰭片14包括分別形成於該基板12 之頂面122上之第一散熱鰭片144及底面上之苐二散 曰片142。該等散熱鰭片14相互平行並列排列於基板12 上，於第一散熱鰭片144間形成複數第一氣流通道14〇，於 第一散熱鰭片142間形成複數第二氣流通道141。該等發光 f極體模組20平行並列貼設於基板12之底面120之_間 部分，第二散熱鰭片142平行並列分佈於前述複數組發光 一極體模組20之兩側。該基板12兩相對侧邊上分別開設 f複數切口 16’該等切口 16沿與第一散熱鰭片144及第二 政…曰片142重直之方向向基板12内延伸並將部分第一散 熱韓片144及第二散熱趙片142切斷。在本實施例中，該 等切口 16向内延伸至基板12上最内側之第二散熱鰭片142 所在位置，且該等切口沿基板12兩相對邊中垂線對稱。於 基板12頂面122上還設有複數切斷第一散熱鰭片144之溝 槽該等溝槽18沿與切口 16平行之方向延伸，形成複 數第三氣流通道18G。該等第三氣流通道⑽分別於兩切口 16直接連通。在本實施例中，第一散熱鰭片144及第二散 熱鰭片142之高度沿與切口 16及溝槽18平行之方向由基 板12外側位置向内高度遞增，即中部之第一散埶疑 * 比兩側之高（參見圖3)。整個發光二極體散熱器日1〇沿基 1331198 板12兩相對側邊之中垂線對稱。該發光二極體散熱器10 於基板12上還形成有複數通孔124用於將發光二極體模組 20安裝於基板12之底面120上。 此外，可以於該基板12之頂面122上方安裝一個風扇 (圖未示）以提供吹向發光二極體散熱器10之冷卻氣流。 請參閱圖4，當發光二極體模組20工作時，其產生之 熱量首先被與之相連之發光二極體散熱器10之基板12吸 收，隨之被傳導至形成於基板12上之散熱鰭片14,熱量由 該等散熱鰭片14散發到周圍空氣中去，從而有效地對發光 二極體模組20進行散熱。在本實施例中，當冷卻氣流吹向 基板12之頂面122時，一部分冷卻氣流沿著第一散熱鰭片 144間之第一氣流通道140流動並由該基板12之兩個較短 侧邊方向流出，另外一部分氣流會沿著複數溝槽18形成之 第三氣流通道180流動並由基板12之兩個較長側邊方向流 出，還有一部分氣流藉由複數切口 16流入基板12底面120 φ上之第二散熱鰭片142間形成之第二氣流通道141並經基 板12之兩個較短側邊方向流出。藉此，冷卻氣流將藉由三 條氣流通道流經發光二極體散熱器10，最後由四個方向流 出並帶走發光二極體模組20工作時產生之熱量。該等切口 16使得第一氣流通道140、第二氣流通道141及第三氣流 通道180交匯成相通之氣流通道，大大增強了發光二極體 散熱器10之散熱鰭片14間的空氣對流。另，該發光二極 體散熱器10之散熱鰭片14形成於基板12之相對兩面，增 加了發光二極體散熱器10之有效散熱面積。是以，本發明 1331198 於不增加發光 二極體散数琴之社心 …亞 < 體積和散熱鰭片密度之條件 下而具有更高的散熱效率。 、 综上所述’本發明符合發明專利要件，麦依法提出專 利申請。惟’以上所述者僅為本發明之較佳實施例，舉凡 熱悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或邊化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1為本發明一優選實施例中發光二極體散熱器之倒 置視圖。 圖2為圖1中發光二極體散熱器之立體圖。 圖3為圖2中發光二極體散熱器之側視圖。 圖4為圖2中發光二極體散熱器標出氣流走向之俯視 【主要元件符號說明】 發光二極體散熱器 10 散熱鳍片 14 基板底面 120 第―氣流通道 140 苐二散熱鰭片 142 溝槽 18 發光二極體模組 20 發光二極體 24 基板 切口 基板頂面 12 16 122 第一散熱鰭片144 第二氣流通道 18〇 電路板 n 通孔 124 11九 九, invention description: [Technical field to which the invention belongs]. The invention relates to a heat sink, in particular to a light-emitting diode heat dissipation [Prior Art] Light Emitting Diode (referred to as (4)), a type of light-emitting device, which uses a semiconductor wafer as a light-emitting device In the device, the photons are caused by the combined release of excess energy by the carriers in one conductor. The photons are directly emitted with red, blue, and the like, and the light-emitting diodes are illuminated. The lighting system manufactured by using the light-emitting diode as a light source is widely used in communications, lighting, transportation, outdoor billboards and the like. However, the high-brightness, power-emitting diodes may cause a significant decrease in luminous efficiency due to an increase in temperature, which may even cause damage to the components, which is more prominent in the field of illumination.疋 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 高 高 高 高 高 高 高The lower part of the board is attached to the heat source to dissipate the heat. For example, in US Pat. No. 6,517,218 B2, a light-emitting diode heat sink comprising a substrate and a mile from the substrate L The heat sink fins are absorbed by the substrate to transfer the heat of the LEDs to the dispersion.”,·*, and the scorpion film heats the heat fins according to the sinister heat fins. Asking about the thermal efficiency of the heat, generally need to increase the number of heat sink fins or increase Large size... 1 size, but so - to increase the volume and weight of the light-emitting diode heat sink and the entire lighting device. [Invention] 7 1331198 In view of this, it is necessary to provide a light-emitting diode radiator It can obtain a better heat dissipation effect in a limited volume, thereby ensuring stable and efficient operation of the light-emitting diode. - A light-emitting one-pole heat sink, including a substrate for a light-emitting diode module and Plural The heat-dissipating Korean film comprises a first heat-dissipating film and a second heat-dissipating film extending from opposite surfaces of the substrate, respectively, wherein airflow channels are respectively formed between the pieces, and the plurality of sides of the substrate are provided with a plurality of The heat sink fins of the present invention are formed on the opposite sides of the substrate of the heat-dissipating Is of the light-emitting diode, and the light-emitting fins are formed on the opposite sides of the substrate of the light-emitting diode Is, and the light-emitting fins are formed in the light-emitting diodes. The heat dissipation area of the diode heat sink; the other is because the two sides of the substrate are provided with a plurality of slits extending inwardly and cutting the fins of the fin portion, thereby reducing the weight of the light emitting diode heat sink and enhancing the air in the heat sink fin Natural convection between the sheets, so as to improve the heat dissipation efficiency of the illuminating Lu diode radiator before increasing the size of the light-emitting diode heat sink and the heat sink fin density. x [Embodiment] Referring to Figures 1 to 3, In a preferred embodiment of the present invention, the LED package 10 is used for the LED module 2. The diode module 20 is generally used as a light source for a lamp (not shown): The aforementioned illumination The polar body module 20 is closely attached to the bottom surface of the light emitting diode heat sink 1 , and includes a plurality of circuit boards 22 and a plurality of light emitting diodes 24 that are parallel to each other. The light emitting diodes 24 are uniformly disposed on the bottom surface of the light emitting diodes. The circuit board 22 is electrically connected to the circuit board 22. 8 1331198 The light emitting diode heat sink is made of a high thermal conductivity metal or alloy, such as copper, aluminum or copper aluminum alloy material, which comprises a substantially a rectangular flat substrate 12 and a plurality of heat dissipation fins and fins 14 extending perpendicularly from the surface of the substrate 12. The substrate 12 has a bottom surface 120 and a top surface 122 opposite to the bottom surface 120. The heat sink fins The first heat dissipation fins 144 are formed on the top surface 122 of the substrate 12 and the second heat dissipation fins 142 are formed on the bottom surface of the substrate 12. The heat dissipation fins 14 are arranged side by side in parallel with each other on the substrate 12 for heat dissipation. A plurality of first air flow channels 14 形成 are formed between the fins 144 , and a plurality of second air flow channels 141 are formed between the first heat dissipation fins 142 . The illuminating body modules 20 are arranged in parallel on the bottom portion 120 of the substrate 12 in parallel, and the second heat dissipating fins 142 are arranged side by side in parallel on the two sides of the plurality of illuminating monopole modules 20. The two opposite sides of the substrate 12 are respectively provided with a plurality of slits 16'. The slits 16 extend in the direction perpendicular to the first fins 144 and the second fins 142 to the substrate 12 and partially dissipate the heat. The sheet 144 and the second heat radiation film 142 are cut. In the present embodiment, the slits 16 extend inwardly to the position of the innermost second heat dissipating fins 142 on the substrate 12, and the slits are symmetric along the perpendicular sides of the opposite sides of the substrate 12. A plurality of grooves for cutting the first heat dissipation fins 144 are further disposed on the top surface 122 of the substrate 12. The grooves 18 extend in a direction parallel to the slits 16 to form a plurality of third gas flow passages 18G. The third air flow passages (10) are in direct communication with the two slits 16, respectively. In this embodiment, the heights of the first heat dissipation fins 144 and the second heat dissipation fins 142 are increased in the direction parallel to the slits 16 and the grooves 18 from the outer side of the substrate 12, that is, the first part of the middle portion is dissected. * Higher than both sides (see Figure 3). The entire light-emitting diode heat sink is symmetrical along the vertical line of the two opposite sides of the base 1331198. The LED package 10 has a plurality of through holes 124 formed on the substrate 12 for mounting the LED module 20 on the bottom surface 120 of the substrate 12. Additionally, a fan (not shown) may be mounted over the top surface 122 of the substrate 12 to provide a cooling airflow to the LED emitter 10. Referring to FIG. 4, when the LED module 20 is in operation, the heat generated by the LED module 20 is first absorbed by the substrate 12 of the LED emitter 10 connected thereto, and then transmitted to the heat dissipation formed on the substrate 12. The fins 14 are radiated from the heat dissipation fins 14 to the surrounding air, thereby effectively dissipating heat from the LED module 20. In the present embodiment, when the cooling airflow is blown toward the top surface 122 of the substrate 12, a portion of the cooling airflow flows along the first airflow passage 140 between the first heat dissipation fins 144 and is formed by the two shorter sides of the substrate 12. The direction flows out, and another part of the airflow flows along the third air flow passage 180 formed by the plurality of grooves 18 and flows out from the two longer sides of the substrate 12, and a part of the air flow flows into the bottom surface 120 of the substrate 12 through the plurality of slits 16 φ The second air flow channel 141 formed between the second heat dissipation fins 142 flows out through the two shorter sides of the substrate 12. Thereby, the cooling airflow will flow through the light emitting diode heatsink 10 through the three airflow channels, and finally flow out in four directions and take away the heat generated when the light emitting diode module 20 operates. The slits 16 allow the first air flow passage 140, the second air flow passage 141, and the third air flow passage 180 to merge into a communicating air passage, which greatly enhances air convection between the heat radiating fins 14 of the light emitting diode heat sink 10. In addition, the heat dissipation fins 14 of the light emitting diode heat sink 10 are formed on opposite sides of the substrate 12, thereby increasing the effective heat dissipation area of the light emitting diode heat sink 10. Therefore, the present invention 1331198 has higher heat dissipation efficiency without increasing the density of the light-emitting diodes and the density of the heat sink fins. In summary, the invention conforms to the patent requirements of the invention, and the patent application is filed by Mai. However, the above description is only the preferred embodiment of the present invention, and those skilled in the art will be able to cover the equivalent modifications or marginalizations in the spirit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an inverted view of a light emitting diode heat sink in accordance with a preferred embodiment of the present invention. 2 is a perspective view of the light emitting diode heat sink of FIG. 1. 3 is a side view of the light emitting diode heat sink of FIG. 2. 4 is a plan view of the flow direction of the light-emitting diode radiator of FIG. 2 [main component symbol description] light-emitting diode heat sink 10 heat-dissipating fin 14 substrate bottom surface 120 first air flow passage 140 second heat-dissipating fin 142 groove Slot 18 Light Emitting Diode Module 20 Light Emitting Body 24 Substrate Slit Substrate Top Surface 12 16 122 First Cooling Fin 144 Second Air Flow Channel 18 〇 Circuit Board n Through Hole 124 11