M341931 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種LED (發光二極體）之散熱技術，特別 是一種適用於高亮度或高功率LED之散熱結構及其所應用之發 光模組。 【先前技術】 由於LED具有省電、壽命長及濃霧中可視性高等優點，因 此LED的運用逐漸被產業所重視，尤其是照明及與光源有關的 產品，如交通號諸、車用照明及背光光源等，近年來逐一問世。 世界上許多國家已逐漸計畫於未來將以LED照明的技術取代傳 統照明的技術，藉以降低可用能源之消耗；惟，高亮度或高功率 LED在發展上亦遇到不少瓶頸，如散熱問題，當所產生的亮度越 高、功率越高時，所要解決的散熱問題也就越嚴重。 一般於發光用品中，若採用高功率或高亮度LED時，其散 熱方式係在供LED架設之電路板的另一面設置一散熱座，散熱 座具有多個用以促進散熱效率的散熱鰭片，使LED所產生的熱 源經電路板及散熱座而散出。惟，一般的電路板大多採用導熱係 數較低的熱源材質構成，其導熱效果及耐熱效果有限，且散熱座 的散熱鰭片往往會佔用相當龐大的體積，使得發光用品必須設置 頜外的各置空間來容置散熱座，如此一來，LED輕薄短小的特色 就無法發揮，甚至因散熱座而造成重量增加或空間配置不易的問 題。 ，知另有一種技術係於散熱座設置印刷電路，以供複數lED 直接烊接於散熱座上，例如美國專利US5,857,767即為將複數 LED直接焊接在一散熱座之技術。此種直接將LED焊接於散熱 5 M341931 座的，式固然具有較好之散熱效果，但在散熱座上設置印刷電路 散熱座^ LED陣列的數量及位置等相關規袼就無法變更， 月b適用在單一用途上，無法廣泛地同時適用於不同容置空間的 燈具上，例如同一種散熱座及其LED無法同時用在車輛大燈及 尾燈，另外，當散熱座上之LED陣列某一顆LED 修更換將相當的不枝。 ^時其、准 【新型内容】 “為了解決上述問題，本創作目的之一係提供一種LED發光 之散熱結構，藉由複數散熱片環列於LED周緣，使 $所產生的熱源，可透過散熱片直接對外散出，在實施 最八有散熱與易於空間配置的優點。 構，作/的之—係提供—種led發光模組及led之散熱結 導光之紐制的設計將兼具有提冑散熱效率及 -基座呈ί述目的，+㈣—貫施例 <—赞賴組包含： -細，且上表面形成有電源電路；至少- LED ;以及至少 座ilj，散熱結構包含：—承載部以供設置LED，承載部係設置於基 部==且LED電性連接電源電路;以及複數個散熱片環設於承載 P周緣明繞該LED，且雜片的延伸方向對應LED的光源面向。 置一 ^作另:實施，LED之散熱結構包含：一承載部以供設 的㈣W以及複數個散熱片％設於承栽部周緣以··，且散^ 的延伸方向對應LED的光源面向。 …乃 M341931 【實施方式】 第1圖所示為本創作第一實施例LED之散熱結構示意圖， 如圖所示，散熱結構10包括一承載部12及複數個散熱片14呈 瓣狀環列於承載部12周緣，承載部12係供設置LED 16，使多 個散熱片14圍繞LED 16，於此實施例中’承載部12及多個散 熱片14係由一金屬板件一體沖壓而成，且多個散熱片14的延伸 方向對應所設置之LED 16的光源面向。 第2圖所示為LED與散熱結構組合完成剖視圖，其中LED 16的頂面為光源產生面，底面設有導熱部161，二側設有電氣導 腳162，LED 16與散熱結構10組合時，係使導熱部161與承載 部12連接，且電氣導腳162自兩散熱片14之間隙中穿出，以供 電性連接至電源電路（圖中未示）。 第3圖所示為本創作第二實施例LED之散熱結構示意圖， 第二實施例與第一實施例之差異在於，第二實施例之散熱結構20 的承載部22上設有複數個穿透區221，以便適用於另一設計之 LED 26，如圖所示，LED 26之電氣導腳262係設於LED 26之底M341931 VIII, new description: [New technology field] This creation is related to the heat dissipation technology of LED (light-emitting diode), especially a heat-dissipation structure suitable for high-brightness or high-power LED and its application group. [Prior Art] Because LED has the advantages of power saving, long life and high visibility in dense fog, the application of LED is gradually paid attention to by the industry, especially lighting and light source related products, such as traffic number, vehicle lighting and backlight. Light sources, etc., have come out one by one in recent years. Many countries in the world have gradually planned to replace traditional lighting technology with LED lighting technology in the future to reduce the consumption of available energy. However, high-brightness or high-power LEDs also encounter many bottlenecks in development, such as heat dissipation. When the brightness produced is higher and the power is higher, the heat dissipation problem to be solved becomes more serious. Generally, in a light-emitting article, if a high-power or high-brightness LED is used, the heat dissipation method is to provide a heat sink on the other side of the circuit board for LED mounting, and the heat sink has a plurality of heat-dissipating fins for promoting heat dissipation efficiency. The heat source generated by the LED is radiated through the circuit board and the heat sink. However, most of the common circuit boards are made of a heat source material with a low thermal conductivity, and the heat conduction effect and heat resistance are limited, and the heat dissipation fins of the heat sink often occupy a relatively large volume, so that the light-emitting articles must be placed outside the jaws. Space to accommodate the heat sink, so that the LED light and short features can not be played, or even due to the heat sink, the weight is increased or the space configuration is not easy. Another technique is to set up a printed circuit on the heat sink to directly connect the plurality of lEDs to the heat sink. For example, US Patent No. 5,857,767 is a technology for directly soldering a plurality of LEDs to a heat sink. This type of LED directly soldered to the heat sink 5 M341931, although it has a good heat dissipation effect, but the layout of the printed circuit heat sink on the heat sink ^ the number and position of the LED array can not be changed, the month b applies In a single use, it cannot be widely applied to lamps with different accommodating spaces at the same time. For example, the same heat sink and its LEDs cannot be used in the headlights and taillights of the vehicle at the same time. In addition, when the LED array on the heat sink is an LED Repairing the replacement will be quite awkward. ^时时,准 [New Content] "In order to solve the above problems, one of the purposes of this creation is to provide a heat-dissipating structure for LED light-emitting, by which a plurality of heat-dissipating rings are arranged on the periphery of the LED, so that the heat source generated by the heat-dissipating heat can be dissipated. The film is directly distributed to the outside, and it has the advantages of the most eight heat dissipation and easy space configuration. The structure of the LED light-emitting module and the LED heat-dissipating light guide are also designed. To improve the heat dissipation efficiency and the pedestal for the purpose of the simplification, the + (four) - the embodiment of the <-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- : the carrying portion is provided for setting the LED, the carrying portion is disposed at the base == and the LED is electrically connected to the power supply circuit; and a plurality of heat sink rings are disposed on the periphery of the bearing P to circumscribe the LED, and the extending direction of the chip corresponds to the LED The light source is facing. The heat dissipation structure of the LED includes: a bearing portion for providing (four) W and a plurality of heat sinks % disposed at the periphery of the bearing portion, and the extending direction of the LED corresponds to the LED The light source is facing. ... is M341931 The first embodiment shows a heat dissipation structure of the LED of the first embodiment of the present invention. As shown in the figure, the heat dissipation structure 10 includes a bearing portion 12 and a plurality of fins 14 arranged in a valvular ring shape on the periphery of the bearing portion 12. The carrying portion 12 is configured to provide the LED 16 so that the plurality of fins 14 surround the LED 16. In this embodiment, the carrying portion 12 and the plurality of fins 14 are integrally stamped from a metal plate member, and a plurality of heat sinks are formed. The extending direction of the sheet 14 corresponds to the direction of the light source of the LED 16 provided. Fig. 2 is a cross-sectional view showing the combination of the LED and the heat dissipating structure, wherein the top surface of the LED 16 is a light source generating surface, and the bottom surface is provided with a heat conducting portion 161, and the two sides are provided. The electrical lead 162 is provided. When the LED 16 is combined with the heat dissipating structure 10, the heat conducting portion 161 is connected to the carrying portion 12, and the electrical lead 162 is passed through the gap between the two fins 14 to be electrically connected to the power supply circuit ( FIG. 3 is a schematic view showing the heat dissipation structure of the LED of the second embodiment of the present invention. The difference between the second embodiment and the first embodiment lies in the bearing portion 22 of the heat dissipation structure 20 of the second embodiment. A plurality of penetration zones 221 are provided for application Another design of the LED 26, as shown in FIG, LED electrical conductivity of 26,262 foot-based LED substrate 26 provided in the
面，當LED%之導熱部261與承載部22連接時，如第4圖所示， 電氣導腳262可自穿透區221穿出，以供電性連接至電源電路（圖 中未示）。 在本創作中 時所產生之埶源，可自導熱部傳向 承載部，並直接透過散埶^ …、片斜外散出，由於散軌片係環列於LED 周緣，因此不會佔用太多翱认 w m、、π 員外的空間，在實施上兼具有散熱與易 於空間配置的優點，尤其滴田# 牡貝他工| .^ ^ ^ 、用於配置空間較小的實施環境上；另 及政熱片之間具有間隙，令熱源可同時 猎由對流效應對外散出，進 而&向散熱效率。 7 M341931 另外’承栽部及散熱片之材質除了為上述之金屬材質外，亦 — 可由導熱層及導熱層外表面所塗佈之金屬反射層所構成，使得本 創作散熱結構之散熱片兼具有散熱及導光的效果。 第5圖所示為本創作散熱結構應用至一 LED發光模組示意 圖，如圖所示，LED發光模組3〇包括一基座32、複數散熱結構 10及複數LED 16，基座32具有一上表面32卜且上表面321形 成有電源電路322及複數個凹槽323,於此實施例中，基座32 -包含一基板34及一鰭片座36,鰭片座％具有多個散熱鰭片361， • 帛以作為—散熱器，且基板34設置於·鰭片座36上，而電源電路 322及凹槽323即形成於基板34上。 接續上述說明，複數個散熱結構1〇設置於基座32上，豆中 每-散熱結構H)包括-承載部12及複數個散熱片14呈瓣狀環 列於承載部12周緣，於此實施例中，承載部12的底緣具有一突 出部38突出散熱片14的底緣，請同時參閱第6圖，藉由突出部 38嵌設於凹槽323中使散熱結構10與基板34連接；複數 分別設置於複數個散熱結構ίο之承載部12上，且LED 16之電 氣導腳162自兩散熱片14之間隙中穿出而與電源電路322導接， • 以使LED 16與電源電路322形成電氣連接，令LED 16能透過 - 電源電路322以串聯（圖上未示）或並聯之控制而產生對應的光 ‘ 源、，且LED 16所產生的熱源可同時透過散熱片14及經過基板 34藉由鰭片座36來進行散熱。 於另-實施例中，基座係可直接為鰭片座，以省略基板的設 _ 計而於鰭片座之上表面形成電源電路，使LED所產生之熱源不 • 需經過基板，即可透過散熱片及鰭片座來進行散熱。於又I實'施 • 例中，上述散熱結構之承載部係可由基座之上表面提供，即fED 直接設置於基座之上表面，且LED之電氣導腳電性連接電源電 路，而散熱片則直接設置於基座上表面且呈瓣狀環列於承載部周 緣0 8 M341931 另一方面，散熱結構與基座的結合除了為上述嵌入的設計之 外，如第7圖所示，亦可直接使散熱結構10之承載部12的底面 平設於基板34或鰭片座之上表面，且由承載部12的底緣延設複 數散熱片14呈瓣狀環列於承載部12周緣，每一承載部12上分 別承載一 LED 16，且LED 16之電氣導腳自兩散熱片14之間隙 中穿出而與電源電路322導接，以使LED 16與電源電路322形 成電氣連接，令LED 16能透過電源電路322之控制而產生對應 的光源。 綜合上述，在本創作中，由於複數散熱片係緊鄰LED設置， 佔用空間較小，因此在配置空間有限而不可設置散熱器的前提 下，仍可藉由散熱片來進行散熱；另一方面，當實施環境允許可 設置散熱器時，本創作之散熱片更可大幅提昇LED的散熱效果。 再者，瓣狀環列之散熱片亦具備有導光之效果，且散熱片的設置 角度可依據LED的光源面向做調整，進而具備有實用性高之優 點。 以上所述之實施例僅係為說明本創作之技術思想及特點，其 目的在使熟習此項技藝之人士能夠瞭解本創作之内容並據以實 施，當不能以之限定本創作之專利範圍，即大凡依本創作所揭示 之精神所作之均等變化或修飾，仍應涵蓋在本創作之專利範圍 内0 9 M341931 【圖式簡單說明】 第1圖所示為本創作第一實施例LED之散熱結構示意圖。 第2圖所示為第1圖所示之LED與散熱結構組合完成剖視圖 第3圖所示為本創作第二實施例LED之散熱結構示意圖。 第4圖所示為第3圖所示之LED與散熱結構組合完成剖視圖 第5圖所示為本創作散熱結構應用至一 LED發光模組示意圖 第6圖所示為本創作一實施例之LED發光模組剖視圖。 第7圖所示為本創作另一實施例之LED發光模組剖視圖。 【主要元件符號說明】 10、20 散熱結構 12、22 承載部 14、24 散熱片 16、26 LED 16 卜 261 導熱部 162、262 電氣導腳 221 穿透區 30 LED發光模組 32 基座 321 上表面 322 電源電路 M341931 323 凹槽 34 基板 36 鰭片座 361 散熱鰭片 38 突出部When the heat conducting portion 261 of the LED% is connected to the carrying portion 22, as shown in Fig. 4, the electrical lead 262 can pass through the penetration region 221 to be electrically connected to the power supply circuit (not shown). In the present creation, the source of the source can be transmitted from the heat conducting portion to the carrying portion, and directly spread out through the diffuser, and the strip is scattered obliquely. Since the loose track is arranged on the periphery of the LED, it does not occupy too much. More recognition of wm, π outside the space, in the implementation of both heat dissipation and easy space configuration advantages, especially the drop field # 贝 贝 other work | . ^ ^ ^, for the implementation of a small space configuration environment; In addition, there is a gap between the political heat film, so that the heat source can be simultaneously escorted by the convection effect, and then the heat dissipation efficiency. 7 M341931 In addition to the metal material mentioned above, the material of the bearing part and the heat sink can also be composed of a metal reflective layer coated on the outer surface of the heat conductive layer and the heat conductive layer, so that the heat sink of the heat dissipation structure of the present invention has both It has the effect of heat dissipation and light guiding. FIG. 5 is a schematic view showing the application of the heat dissipation structure to an LED lighting module. As shown in the figure, the LED lighting module 3 includes a base 32, a plurality of heat dissipation structures 10, and a plurality of LEDs 16, and the base 32 has a The upper surface 32 and the upper surface 321 are formed with a power supply circuit 322 and a plurality of recesses 323. In this embodiment, the base 32 includes a substrate 34 and a fin holder 36. The fin holder has a plurality of heat sink fins. The sheet 361, • is used as a heat sink, and the substrate 34 is disposed on the fin holder 36, and the power supply circuit 322 and the recess 323 are formed on the substrate 34. Following the above description, a plurality of heat dissipation structures 1 are disposed on the base 32. Each of the heat dissipation structures H) includes a carrier portion 12 and a plurality of fins 14 arranged in a valvular shape on the periphery of the carrier portion 12. In the example, the bottom edge of the carrying portion 12 has a protruding portion 38 protruding from the bottom edge of the heat sink 14. Please refer to FIG. 6 at the same time, and the heat dissipating structure 10 is connected to the substrate 34 by the protruding portion 38 being embedded in the recess 323; The plurality of capacitors 162 are respectively disposed on the carrier 12 of the plurality of heat dissipation structures, and the electrical leads 162 of the LEDs 16 pass through the gap between the two heat sinks 14 to be connected to the power circuit 322, so that the LEDs 16 and the power circuit 322 are connected. An electrical connection is formed to enable the LED 16 to pass through the power supply circuit 322 to generate a corresponding light source in series (not shown) or in parallel, and the heat source generated by the LED 16 can simultaneously pass through the heat sink 14 and through the substrate. The heat is dissipated by the fin holder 36. In another embodiment, the pedestal can be directly a fin holder, and a power supply circuit is formed on the upper surface of the fin holder to omit the design of the substrate, so that the heat source generated by the LED does not need to pass through the substrate. Cooling through the heat sink and fin holder. In the example of the present invention, the carrying portion of the heat dissipation structure can be provided by the upper surface of the base, that is, the fED is directly disposed on the upper surface of the base, and the electrical lead of the LED is electrically connected to the power supply circuit, and the heat is dissipated. The sheet is directly disposed on the upper surface of the base and is arranged in a lobed ring on the periphery of the bearing portion. 0 8 M341931 On the other hand, the combination of the heat dissipation structure and the base is in addition to the above embedded design, as shown in FIG. The bottom surface of the bearing portion 12 of the heat dissipation structure 10 can be directly disposed on the upper surface of the substrate 34 or the fin seat, and a plurality of fins 14 extending from the bottom edge of the carrying portion 12 are arranged in a lobed shape on the periphery of the bearing portion 12. Each of the carrying portions 12 carries an LED 16 and the electrical leads of the LED 16 pass through the gap between the two fins 14 to be electrically connected to the power circuit 322 to electrically connect the LED 16 with the power circuit 322. The LED 16 can be controlled by the power circuit 322 to produce a corresponding light source. In summary, in the present invention, since the plurality of heat sinks are disposed adjacent to the LEDs and occupy a small space, the heat sink can still be used for heat dissipation on the premise that the configuration space is limited and the heat sink cannot be disposed; When the implementation environment allows for the installation of a heat sink, the heat sink of this creation can greatly enhance the heat dissipation effect of the LED. Furthermore, the fins of the lobed ring array also have the effect of guiding light, and the setting angle of the fins can be adjusted according to the light source direction of the LED, thereby having the advantage of high practicality. The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equal change or modification made by the spirit of this creation should still be covered in the patent scope of this creation. 0 9 M341931 [Simple description of the drawing] Figure 1 shows the heat dissipation of the LED of the first embodiment of the present invention. Schematic. Fig. 2 is a cross-sectional view showing the combination of the LED and the heat dissipation structure shown in Fig. 1. Fig. 3 is a schematic view showing the heat dissipation structure of the LED of the second embodiment. FIG. 4 is a cross-sectional view showing the combination of the LED and the heat dissipation structure shown in FIG. 3. FIG. 5 is a schematic view showing the application of the heat dissipation structure to an LED light-emitting module. FIG. 6 is a view showing the LED of an embodiment of the present invention. A cross-sectional view of the light module. FIG. 7 is a cross-sectional view showing an LED lighting module according to another embodiment of the present invention. [Main component symbol description] 10, 20 heat dissipation structure 12, 22 bearing part 14, 24 heat sink 16, 26 LED 16 261 heat conduction part 162, 262 electrical lead 221 penetration area 30 LED light module 32 base 321 Surface 322 Power Circuit M341931 323 Groove 34 Substrate 36 Fin Holder 361 Heat Sink 38 Projection