TWI572069B - Light device and heat dissipating sheet - Google Patents

Description

Light-emitting device and heat sink

The present invention relates to a light-emitting device, and more particularly to a light-emitting device having a heat sink.

At present, most lighting devices and various electronic products use light emitting diodes (LEDs) as the main light source. When the light-emitting diode emits light, the energy consumed is converted into heat energy except for 20%. Further, when the temperature of the entire light-emitting diode rises and overheats, the luminous efficiency of the light-emitting diode is affected, and the life of the light-emitting diode is attenuated and the chromaticity at the time of light emission is shifted.

However, the circuit board on which the light-emitting diode is currently disposed has a space limitation, and the circuit board has many small and tight copper wire layouts, which makes the heat dissipation of the light-emitting diode more difficult. Due to the small and tight copper layout on the top surface of the board, the general heat sink can only be placed on the back side of the board and cannot directly derive the heat energy emitted by the LED. In addition, even if a part of the heat sink is disposed on the top surface of the circuit board, there is a problem that affects the light quality of the light-emitting device. Therefore, in the case where the circuit board on which the light-emitting diode is provided has many fine and tight copper wire layouts, how to effectively dissipate the heat energy generated when the light-emitting diode emits light, thereby avoiding affecting the luminous efficiency of the light-emitting diode And light quality, increase the service life of the light-emitting diode and reduce the chromaticity shift The question is really an important issue.

Taiwan Patent Publication No. I337240 discloses a light source module including a circuit board, a plurality of light emitting elements, and a heat dissipating component. Taiwan Patent Publication No. M426044 discloses a backlight module comprising a carrier, a copper wiring layer, a light emitting diode element, a reflective layer, an extended heat conducting layer, a light guiding plate and a bottom reflecting sheet. Taiwan Patent Publication No. M457392 discloses a package structure of a light-emitting element. The light-emitting diode is disposed on a double-sided circuit board, and the double-sided circuit board is connected to the heat-conductive substrate, and the light-emitting diode is located in the through hole of the heat-conductive substrate.

The present invention provides a light emitting device to solve the problems of the prior art.

Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a light emitting device including a substrate, a light emitting unit, and a heat sink. The substrate has a first surface. The light emitting unit is disposed on the first surface of the substrate, and the light emitting unit has at least two pins. The heat sink includes an adhesive layer, a first heat conductive layer, and a first reflective layer. The adhesive layer is adhered to the first surface of the substrate. The first heat conducting layer is disposed on the adhesive layer and adjacent to one of the two pins of the light emitting unit. The first reflective layer is disposed on the first heat conductive layer, wherein the first heat conductive layer is located between the first reflective layer and the adhesive layer.

In an embodiment of the invention, the light emitting device further includes a conducting portion that connects the pin of the light emitting unit adjacent to the pin of the first heat conducting layer and the first heat conducting layer of the heat sink.

In an embodiment of the invention, the first reflective layer is bonded to the first guide Hot layer.

In an embodiment of the invention, the first heat conducting layer is made of a metal material.

In an embodiment of the invention, the first reflective layer is made of polyethylene terephthalate (PET).

In an embodiment of the invention, the heat sink has an opening, and the light emitting unit is received in the opening.

In an embodiment of the invention, the heat sink has an extending portion away from the one end of the light emitting unit, and the bottom surface of the extending portion forms an angle with the bottom surface of the first heat conducting layer.

In an embodiment of the invention, the included angle is greater than 90 degrees.

In an embodiment of the invention, the extension portion has a second heat conduction layer and a second reflection layer, the second heat conduction layer is connected to the first heat conduction layer, the second reflection layer is connected to the first reflection layer, and the second reflection layer is disposed on the second On the thermal layer.

In an embodiment of the invention, the light emitting device further includes a lens combination disposed above the light emitting surface of the light emitting unit.

In order to achieve one or a part or all of the above or other purposes, another embodiment of the present invention provides a heat sink for a light-emitting device having a substrate and a light-emitting unit, the heat sink including an adhesive layer, a first heat-conducting layer, and The first reflective layer. The adhesive layer is used to adhere to the first surface of the substrate. The first heat conducting layer is disposed on the adhesive layer to be adjacent to the at least one pin of the light emitting unit. The first reflective layer is disposed on the first heat conductive layer, wherein the first heat conductive layer is located between the first reflective layer and the adhesive layer.

In another embodiment of the invention, the first reflective layer is bonded to the first thermally conductive layer.

In another embodiment of the invention, the first heat conducting layer is made of a metal material.

In another embodiment of the invention, the first reflective layer is made of polyethylene terephthalate (PET).

In another embodiment of the invention, the heat sink has an opening for receiving the light emitting unit.

In another embodiment of the present invention, at least one end portion of the heat sink has an extension portion, and a bottom surface of the extension portion forms an angle with the bottom surface of the first heat conduction layer.

In another embodiment of the invention, the included angle is greater than 90 degrees.

In another embodiment of the present invention, the extending portion has a second heat conductive layer and a second reflective layer, the second heat conductive layer is connected to the first heat conductive layer, the second reflective layer is connected to the first reflective layer, and the second reflective layer is disposed on the first On the thermal layer.

In summary, the heat sink and the light emitting unit of the light emitting device of the embodiment of the present invention are disposed on the same surface of the substrate, the heat sink is directly disposed on one side of the light emitting unit, and the first heat conducting layer of the heat sink is adjacent to the light emitting unit. The heat energy emitted by the light emitting unit can be directly transmitted or dissipated to the external environment via the substrate. Therefore, the light-emitting device of the embodiment of the invention can effectively dissipate the heat energy generated when the light-emitting unit emits light, thereby preventing the light-emitting unit from being lowered due to excessive temperature and the phenomenon that the light-emitting wavelength is shifted. In addition, the adhesive layer of the heat sink can be directly adhered to the surface of the substrate, so that the heat sink can be easily disposed on the substrate. Further, the first reflective layer of the heat sink can effectively reflect the light beam emitted by a part of the light emitting unit to the light exiting surface of the light emitting device to ensure the light output quality of the entire light emitting device, and can avoid the color shift problem. In addition, the heat sink may further be provided with an extension portion to increase the heat convection space of the entire light-emitting device to improve the heat dissipation efficiency of the heat sink.

100, 300, 500, 600, 700, 900, 1000‧‧‧ illuminating devices

110‧‧‧Substrate

112‧‧‧ first surface

120‧‧‧Lighting unit

122‧‧‧ pins

124‧‧‧Lighting chip

130‧‧‧ Heat sink

130a‧‧‧ openings

132‧‧‧Adhesive layer

134‧‧‧First thermal conduction layer

134a‧‧‧ bottom

136‧‧‧First reflective layer

138‧‧‧Extension

138a‧‧‧ bottom

139a‧‧‧second thermal layer

139b‧‧‧second reflective layer

140‧‧‧Transmission Department

150‧‧‧ lens combination

Θ‧‧‧ angle

The description of the present invention and other objects, features, advantages and embodiments will be more apparent and understood. FIG. 1 is a perspective view of a light-emitting device in accordance with an embodiment of the present invention.

2 is a side elevational view of the light emitting device of FIG. 1.

3 is a perspective view of a light emitting device according to another embodiment of the present invention.

4 is a side elevational view of the light emitting device of FIG. 3.

FIG. 5 is a side elevational view of a light emitting device according to still another embodiment of the present invention.

FIG. 6 is a perspective view of a light emitting device according to still another embodiment of the present invention.

FIG. 7 is a perspective view of a light emitting device according to still another embodiment of the present invention.

FIG. 8 is a schematic side view showing the light emitting device of FIG. 7.

FIG. 9 is a perspective view of a light emitting device according to still another embodiment of the present invention.

FIG. 10 is a perspective view of a light emitting device according to still another embodiment of the present invention.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. therefore, The directional terminology used is for the purpose of illustration and not limitation.

1 and FIG. 2, FIG. 1 is a schematic perspective view of a light-emitting device according to an embodiment of the invention, and FIG. 2 is a schematic side view of the light-emitting device of FIG. As shown in FIGS. 1 and 2, the light-emitting device 100 includes a substrate 110, a light-emitting unit 120, and a heat sink 130. The substrate 110 has a first surface 112, and the light emitting unit 120 is disposed on the first surface 112 of the substrate 110. The light emitting unit 120 has at least two pins 122 and a light emitting chip 124. The light emitting chip 124 can be received by the pin 122. Electrical energy to illuminate. In this embodiment, the substrate 110 may be a flexible printed circuit board (FPCB) or a printed circuit board (PCB), but is not limited thereto. In addition, in this embodiment, the light emitting unit 120 may be a light emitting diode, but is not limited thereto.

Further, the heat sink 130 may be disposed on the first surface 112 of the substrate 110, that is, the heat sink 130 and the light emitting unit 120 are disposed on the same side of the substrate 110, wherein the heat sink 130 includes an adhesive layer 132, first The heat conductive layer 134 and the first reflective layer 136. The adhesive layer 132 of the heat sink 130 is adhered to the first surface 112 of the substrate 110. The first heat conducting layer 134 is disposed on the adhesive layer 132 and adjacent to one of the two pins 122 of the light emitting unit 120, so that the heat energy emitted by the light emitting unit 120 can be transmitted from the pin 122 to the substrate 110 to be dissipated to the outside. The environment and the thermal energy can be transmitted from the pin 122 to the first heat conducting layer 134 to dissipate to the external environment. The heat energy emitted by the light emitting unit 120 can be simultaneously dissipated to the external environment via the first heat conducting layer 134 and the substrate 110, and may have Higher heat dissipation efficiency. In addition, the first reflective layer 136 is disposed on the first heat conductive layer 134 , that is, the first heat conductive layer 134 is located between the first reflective layer 136 and the adhesive layer 132 . Since the first reflective layer 136 is disposed on the first heat conductive layer 134, the first reflective layer 136 can partially emit the light emitting unit. The light beams emitted from 120 are reflected to collectively emit light toward the direction in which the light-emitting device 100 is scheduled to emit light to maintain the luminous efficiency of the entire light-emitting device 100. In this embodiment, the first reflective layer 136 can be adhered to the first heat conductive layer 134 via an adhesive, but is not limited thereto. In other embodiments, the first reflective layer 136 and the first heat conductive layer 134 may also be connected to each other by other means, such as hot pressing, stamping, and coating.

In addition, the first heat conduction layer 134 of the embodiment may be made of a metal material. Further, the material of the first heat conduction layer 134 may be selected from materials with high thermal conductivity, such as gold, silver, copper, iron, aluminum, etc., to improve the efficiency of transferring heat energy to the external environment, but not limited thereto. On the other hand, the first reflective layer 136 of the present embodiment is made of a material having a high reflectivity of the reflected light beam, and may be, for example, polyethylene terephthalate (PET), but not limited thereto. Further, when the first heat conducting layer 134 is made of a yellowish metal material (for example, gold or copper), if the light beam emitted by the light emitting unit 120 is directly reflected by the first heat conducting layer 134, a yellowish light beam is generated, resulting in a light emitting device. 100 will have a local yellowish beam, resulting in uneven light. Therefore, the first reflective layer 136 is disposed on the first heat conducting layer 134, and the light beam emitted by the light emitting unit 120 is reflected by the first reflective layer 136 to maintain the original color, thereby solving the problem of uneven color shift. In addition, the adhesive layer 132 may be made of a non-thermally conductive adhesive material such as an organic or inorganic adhesive.

Please refer to FIG. 3 and FIG. 4. FIG. 3 is a schematic perspective view of a light emitting device according to another embodiment of the present invention. 4 is a side elevational view of the light emitting device of FIG. 3. As shown in FIG. 3 and FIG. 4 , the light-emitting device 300 of the present embodiment further includes a conductive portion 140 that connects the pin 122 of the light-emitting unit 120 adjacent to the first heat-conducting layer 134 and the first heat-conducting layer of the heat sink 130 . 134. In other words, the first heat conducting layer 134 of the heat sink 130 is conductive The portion 140 is connected to the pin 122 of the light-emitting unit 120, so that the heat generated when the light-emitting unit 120 emits light can be directly transmitted to the conductive portion 140 through the pin 122 to be dissipated to the external environment, or the heat can be transmitted to the conductive portion through the pin 122. The 140 is further conducted to the first heat conduction layer 134 of the heat sink 130 to dissipate to the external environment, and the heat energy can also be transmitted from the pin 122 to the substrate 110 to dissipate to the external environment, and the heat energy emitted by the light emitting unit 120 can be simultaneously transmitted. The portion 140, the first heat conducting layer 134, and the substrate 110 are dissipated to the external environment, which can further improve heat dissipation efficiency. In this embodiment, the conductive portion 140 can be, for example, solder, heat-dissipating film or heat-dissipating glue, but is not limited thereto.

Please refer to FIG. 5, which is a side view of a light emitting device according to still another embodiment of the present invention. As shown in FIG. 5, in the embodiment, at least one end portion of the heat sink 130 of the light emitting device 500 may have an extending portion 138, and the bottom surface 138a of the extending portion 138 and the bottom surface 134a of the first heat conductive layer 134 may form an angle θ. , wherein the angle θ can be greater than 90 degrees, but not limited thereto. Since the bottom surface 138a of the extension portion 138 forms an included angle θ with the bottom surface 134a of the first heat conduction layer 134, that is, the extension portion 138 is suspended above the first surface 112 of the substrate 110, so that the bottom portion of the extension portion 138 is heated. The convection space can increase the heat dissipation efficiency of the entire heat sink 130. In this embodiment, the extending portion 138 is disposed at an end of the heat sink 130 away from the light emitting unit 120, but is not limited thereto.

Further, the extension portion 138 may further have a second heat conduction layer 139a and a second reflection layer 139b, wherein the second heat conduction layer 139a is connected to the first heat conduction layer 134, the second reflection layer 139b is connected to the first reflection layer 136, and the second The reflective layer 139b is disposed on the second heat conductive layer 139a. For example, the second reflective layer 139b can be adhered to the second heat conductive layer 139a through the adhesive, but is not limited thereto. In this embodiment, the first heat conductive layer 134 may be integrally formed with the second heat conductive layer 139a, and the first reflective layer 136 may be integrally formed with the second reflective layer 139b, but limit. Therefore, when the heat sink 130 has the extension portion 138, since the bottom of the second heat conduction layer 139a of the extension portion 138 is suspended on the first surface 112 of the substrate 110, the heat dissipation space below the second heat conduction layer 139a is increased. The heat dissipation efficiency of the entire heat sink 130 is improved. On the other hand, the second reflective layer 139b can also reflect the light beam emitted from the partial light emitting unit 120 together with the first reflective layer 136 to collectively emit light toward the predetermined light emitting direction of the light emitting device 500, and can maintain the overall light emitting of the light emitting device 500. effectiveness.

Please refer to FIG. 6 , which is a perspective view of a light emitting device according to still another embodiment of the present invention. As shown in FIG. 6, the heat sink 130 of the light-emitting device 600 of the present embodiment has an opening 130a, and the light-emitting unit 120 is housed in the opening 130a. In other words, the light emitting unit 120 can be substantially engaged with the opening 130a of the heat sink 130 such that each side of the light emitting unit 120 is adjacent to the heat sink 130, and the heat energy generated when the light emitting unit 120 emits light can be transmitted to On the heat sink 130. In this embodiment, the heat sink 130 has a circular shape, but is not limited thereto. In addition, the configuration of the opening 130a of the heat sink 130 corresponds to the configuration of the light emitting unit 120, but is not limited thereto.

Please refer to FIG. 7 and FIG. 8. FIG. 7 is a schematic perspective view of a light-emitting device according to another embodiment of the present invention, and FIG. 8 is a schematic side view of the light-emitting device of FIG. As shown in FIG. 7 and FIG. 8 , the heat sink 130 of the light-emitting device 700 of the present embodiment has an opening 130a for accommodating the light-emitting unit 120. Meanwhile, the heat sink 130 further has two extending portions 138, and the extending portion 138 The bottom surface 138a and the bottom surface 134a of the first heat conductive layer 134 may form an angle θ, wherein the angle θ may be greater than 90 degrees, but not limited thereto. Since the bottom surface 138a of the extension portion 138 and the bottom surface 134a of the first heat conduction layer 134 form an angle θ, that is, the extension portion 138 is suspended on the first surface 112 of the substrate 110, the heat convection is increased at the bottom of the extension portion 138. Space, but can increase The heat dissipation efficiency of the heat sink 130 as a whole is increased. In this embodiment, the two extending portions 138 are opposite to each other and extend from the end of the heat dissipating fins 130 away from the light emitting unit 120. However, in other embodiments, the position where the extending portion 138 is disposed is not limited thereto. Therefore, please refer to FIG. 9, which is a perspective view of a light emitting device according to still another embodiment of the present invention. As shown in FIG. 9 , the extending portion 138 of the heat sink 130 of the light-emitting device 900 of the present embodiment may also be exposed outside the substrate 110 , but not limited thereto.

Please refer to FIG. 10, which is a perspective view of a light emitting device according to still another embodiment of the present invention. As shown in FIG. 10 , in the embodiment, the light-emitting device 1000 further includes a lens assembly 150 . The lens assembly 150 is disposed above the light-emitting surface of the light-emitting unit 120 to increase the light-emitting effect of the light-emitting unit 120 . The space remaining on the first surface 112 of the substrate 110 after the lens assembly 150 is disposed. The heat sink 130 is disposed between the first surface 112 of the substrate 110 and the lens assembly 150. That is, the heat sink 130 of the present embodiment can make a highly efficient heat dissipation effect in a limited space on the first surface 112 of the substrate 110. In addition, the two extending portions 138 of the heat sink 130 extend beyond the position of the lens assembly 150 and are suspended on the first surface 112 of the substrate 110 to increase the heat dissipation efficiency of the heat sink 130 as a whole. 7. The embodiment of FIG. 8 and FIG. 9 is not described herein.

It will be apparent from the above-described embodiments of the present invention that the application of the present invention has at least one of the following advantages. The heat sink of the light-emitting device of the embodiment of the present invention is disposed on the same surface of the substrate, the heat sink is directly disposed on one side of the light-emitting unit, and the first heat-conducting layer of the heat sink is adjacent to the light-emitting unit and can directly The heat energy emitted by the light-emitting unit is effectively transmitted or dissipated to the external environment via the substrate. Therefore, the light-emitting device of the embodiment of the invention can effectively The thermal energy generated when the illuminating unit emits light, thereby preventing the illuminating unit from being lowered due to excessive temperature and the phenomenon that the illuminating wavelength is shifted. In addition, the adhesive layer of the heat sink can be directly adhered to the surface of the substrate, so that the heat sink can be easily disposed on the substrate. Further, the first reflective layer of the heat sink can effectively reflect the light beam emitted by a part of the light emitting unit to the light exiting surface of the light emitting device to ensure the light output quality of the entire light emitting device, and can avoid the color shift problem. In addition, the heat sink may further be provided with an extension portion to increase the heat convection space of the entire light-emitting device to improve the heat dissipation efficiency of the heat sink.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention. In addition, the terms "first", "second" and the like mentioned in the specification or the scope of the claims are only used to name the elements or distinguish different embodiments or ranges, and are not intended to limit the number of elements. Upper or lower limit.

100‧‧‧Lighting device

110‧‧‧Substrate

112‧‧‧ first surface

120‧‧‧Lighting unit

130‧‧‧ Heat sink

Claims (18)

A light-emitting device comprising: a substrate having a first surface, the substrate being a circuit board; a light-emitting unit disposed on the first surface of the substrate, wherein the light-emitting unit has at least two pins, and the light-emitting unit is illuminated And a heat sink comprising: an adhesive layer adhered to the first surface of the substrate; a first heat conductive layer disposed on the adhesive layer and adjacent to the two pins of the light emitting unit And a first reflective layer disposed on the first heat conductive layer, wherein the first heat conductive layer is located between the first reflective layer and the adhesive layer. The illuminating device of claim 1, further comprising a conducting portion connecting the pin of the illuminating unit adjacent to the first heat conducting layer and the first heat conducting layer of the heat sink. The illuminating device of claim 1, wherein the first reflective layer is adhered to the first thermally conductive layer. The illuminating device of claim 1, wherein the first heat conducting layer is made of a metal material. The illuminating device of claim 1, wherein the first reflective layer is made of polyethylene terephthalate (PET). The illuminating device of claim 1, wherein the heat sink has an opening, and the illuminating unit is received in the opening. The illuminating device of claim 1, wherein the heat sink has an extending portion away from the one end of the light emitting unit, and a bottom surface of the extending portion forms an angle with a bottom surface of the first heat conducting layer. The illuminating device of claim 7, wherein the included angle is greater than 90 degrees. The illuminating device of claim 7, wherein the extending portion has a second heat conducting layer and a second reflecting layer, the second heat conducting layer is connected to the first heat conducting layer, and the second reflecting layer is connected to the first a reflective layer, and the second reflective layer is disposed on the second thermally conductive layer. The illuminating device of claim 1, further comprising a lens assembly disposed above the light emitting surface of the light emitting unit. A heat sink is suitable for a light-emitting device having a substrate and a light-emitting unit, the substrate is a circuit board, the light-emitting unit is a light-emitting diode, and the heat-dissipating film comprises: an adhesive layer for adhering to the substrate a first surface; a first heat conducting layer disposed on the adhesive layer to be adjacent to the at least one pin of the light emitting unit; and a first reflective layer disposed on the first heat conducting layer, wherein the first surface a guide The thermal layer is between the first reflective layer and the adhesive layer. The heat sink of claim 11, wherein the first reflective layer is bonded to the first heat conductive layer. The heat sink of claim 11, wherein the first heat conducting layer is made of a metal material. The heat sink of claim 11, wherein the first reflective layer is made of polyethylene terephthalate (PET). The heat sink of claim 11, wherein the heat sink has an opening for receiving the light emitting unit. The heat sink of claim 11, wherein at least one end of the heat sink has an extension portion, and a bottom surface of the extension portion forms an angle with a bottom surface of the first heat conduction layer. The heat sink of claim 16, wherein the angle is greater than 90 degrees. The heat sink of claim 16, wherein the extension has a second heat conductive layer and a second reflective layer, the second heat conductive layer is connected to the first heat conductive layer, and the second reflective layer is connected to the first heat conductive layer a reflective layer, and the second reflective layer is disposed on the second thermally conductive layer.