TWI451606B - Light-emitting module provided with heat-dissipation channel - Google Patents

Description

Light-emitting module with heat dissipation channel

The invention relates to a light emitting diode packaging technology, in particular to a light emitting module which can be applied to a light emitting diode lamp by using a chip on board (COB) technology.

Light-emitting diodes (LEDs) are characterized by long life, power saving, and durability. Therefore, LED lighting devices are a trend of green energy environmental protection development and will be widely used in the future. Among them, the heat dissipation of LEDs has always been a problem in the service life of LED lighting devices. Generally, high-brightness LED lamps usually use a light-emitting module, which usually includes several LED chip packages, and is directly soldered on a general circuit substrate or an aluminum substrate. In order to increase the heat dissipation effect, an additional heat-dissipating member is additionally provided. However, how to effectively solve the heat dissipation problem and improve the heat dissipation efficiency has always been an important issue in this technical field.

In order to solve the above problems, an object of the present invention is to provide a light-emitting module having a heat-dissipating channel, wherein a dot-package area of each light-emitting diode chip has a heat-dissipating channel, and the heat-dissipating efficiency of the light-emitting module can be improved by convection heat dissipation. .

In order to achieve the above object, a light-emitting module with a heat dissipation channel according to an embodiment of the invention includes: a plate-shaped substrate having a plurality of wafer carriers disposed on an upper surface of the plate-shaped substrate, wherein the plate-shaped base The material of the material is a high thermal conductive material; a circuit substrate is directly stacked on the upper surface of the plate substrate, wherein the circuit substrate is correspondingly provided with a plurality of openings to expose a plurality of wafer carriers; at least one LED chip, The system is disposed on each of the wafer carriers; a plurality of wires are electrically connected to each of the LED chips and the circuit substrate; and a packaging material covers each of the LED chips, each wafer carrier, a plurality of wires, forming a plurality of dot package regions with a portion of the circuit substrate, wherein at least two through holes are passed through the circuit substrate and the upper surface of the plate substrate at a plurality of dot package regions; and a heat sink is attached to a lower surface of the plate-shaped substrate, wherein the heat sink has a gap with a lower surface of the plate-shaped substrate below the plurality of dot package regions; and the gap is in communication with the two through holes and under the plurality of dot package regions Forming a heat dissipating air convection channel.

The purpose, technical contents, features, and effects achieved by the present invention will become more apparent from the detailed description of the appended claims.

The detailed description is as follows, and the preferred embodiment is not intended to limit the invention. 1A and 1B are schematic diagrams of a light emitting module according to an embodiment of the invention. 1A is a top plan view of the plate-like substrate 10 and the circuit substrate 20 of FIG. 1B.

In this embodiment, referring to FIG. 1A and FIG. 1B, the light-emitting module with heat dissipation channel of the present invention includes a plate-shaped substrate 10. A plurality of wafer carriers 12 are disposed on the upper surface of the plate substrate 10. A circuit substrate 20 is directly stacked on the upper surface of the plate-like substrate 10. The circuit substrate 20 has a plurality of openings 22 disposed corresponding to each wafer carrier 12 and exposing the wafer carrier 12. In the present embodiment, the upper surface of the wafer carrier 12 is at the same level as the upper surface of the circuit substrate 20 (as shown in FIG. 1B). However, it can be understood that the upper surface of the wafer carrier 12 may be convex or higher than the surface of the corresponding circuit substrate 20 (as shown in FIG. 4).

Following the above description, at least one LED chip 30 is disposed on each of the wafer carriers 12. The LED chip 30 and the circuit board 20 are electrically connected by a plurality of wires 40. The encapsulation material 50 covers each of the LED wafers 30, each wafer carrier 12, the wires 40, and a portion of the circuit substrate 20 to form a plurality of dot package regions 52, respectively.

The at least two through holes 60 are disposed through the circuit board 20 and the upper and lower surfaces of the plate-like substrate 10 adjacent to the dot package region 52. Next, a heat sink 70 is attached to the lower surface of the plate-like substrate 10. The heat sink 70 has a gap 80 with the lower surface of the plate substrate 10 below the dot package region 52. The gap 80 is in communication with the two through holes 60 and forms a heat dissipation channel for air convection below the dot package region 52. In the present embodiment, the thickness of the plate-like substrate 10 below the dot package region 52 is smaller than the thickness of the plate-like substrate 10 of the other regions, and thus the plate-like substrate 10 and the heat sink 70 constitute the gap 80.

Since the LED chip 30 in the dot package region 52 emits light, heat is generated to form a hot spot to heat the air in the gap 80. The principle of convection by the hot and cold air causes the heat dissipation channel to form an autonomous thermal cycle. At the same time, the heat generated by the LED chip 30 can also be dissipated by the plate substrate 10 and the heat sink 70. Therefore, the light-emitting module of the invention can achieve good heat dissipation effect through heat conduction and heat dissipation and self-convection heat dissipation at the same time.

In the present embodiment, referring to FIG. 1B, the wafer carrier 12 protrudes from the plate-like substrate 10 and the opening 22 is inserted through the wafer carrier 12. It should be understood by those skilled in the art that the upper surface of the wafer carrier 12 is the same level as the upper surface of the circuit substrate 20 in this embodiment, but the wafer carrier is actually formed during the process of stacking the plate substrate 10 and the circuit substrate 20. The upper surface of the seat 12 may be slightly dimpled.

The plate-like substrate 10 of the present invention is a highly thermally conductive material such as a metal plate. In an embodiment, the circuit substrate 20 can be a printed circuit board. In an embodiment, the circuit substrate 20 may include an insulating layer, a wiring layer, and a solder resist layer.

In one embodiment, as shown in FIGS. 1A and 1B, the through holes 60 may be the same size. However, in one embodiment, as shown in FIGS. 2A and 2B, the through holes 60' may be of different sizes, and FIG. 2A is a top plan view of the plate substrate 10 and the circuit substrate 20 of FIG. 2B. In the present invention, the size or shape of the through hole size is not limited. In addition, the through hole can be designed differently for autonomous circulation of the fluid of the hot and cold air, for example, the through hole can be a vertical, non-perpendicular through hole or the like.

In the present invention, the upper surface of the wafer carrier 12 may be lower than the upper surface of the circuit substrate 20 or protrude from the upper surface of the circuit substrate 20. As shown in FIG. 3, in an embodiment, the wafer carrier 12 can be identical to the surface of the plate substrate 10. As shown in FIG. 4, in an embodiment, the upper surface of the wafer carrier 12 protrudes from the surface of the plate-like substrate 10.

Continuing to refer to FIG. 3 and FIG. 4, in various embodiments, the heat sink 70 below the dot package region 52 is provided with a recess 72 for forming a gap 80 with the lower surface of the plate substrate 10. Thus, the gap 80' communicates with the through hole 60 to form a heat dissipation channel below the dot package region 52.

In the above embodiments, those skilled in the art should understand that the density of the wafer carrier 12 or the LED chip 30 can be designed according to different light source requirements. In addition, in the present invention, the control chip can be integrated therein in the light emitting module. In this way, the light-emitting module has both the light-emitting unit and the control unit, which can effectively reduce the assembly components and assembly processes and costs of the lamp product. At the same time, controlling the operation of the wafer also generates heat, and the accumulation of heat does not easily reduce the service life of the product. The light-emitting module of the invention has excellent heat dissipation effect, and can simultaneously overcome the problem of controlling the heat dissipation of the wafer.

5A and 5B, wherein FIG. 5A is a top plan view of the plate substrate 10 and the circuit substrate 20 of FIG. 5B. In this embodiment, the control wafer 30' can be disposed on a control wafer carrier 12'. It is electrically connected to the circuit board 20 through a wire. Here, as with the wafer carrier 12 described above, the control wafer carrier 12' may be horizontally or protrudedly disposed on the surface of the plate substrate 10. Of course, the upper surface of the control wafer carrier 12' may be the same level or protruded from the surface of the corresponding circuit substrate 20 as the wafer carrier 12. The dot package region 52' after the control wafer 30' is packaged may also be provided with a through hole 60' and a gap 80' formed by the heat sink 70 to form a heat dissipation channel. The package structure of the control wafer 30' is similar to that of the LED chip, and details are not described herein.

In the present invention, both the plate substrate and the heat sink can provide direct heat dissipation effect regardless of the heat generated by the circuit in the wafer or the circuit substrate, and more importantly, the heat dissipation channel of the present invention provides autonomous convection heat dissipation to further enhance heat dissipation. effectiveness. In the present invention, the position where the wafer carrier is disposed on the plate-shaped substrate is not limited, and may be disposed according to different designs. For example, the wafer carrier is disposed at an edge region of the plate-shaped substrate to increase the light-emitting angle. In addition, in the above embodiments, although each of the dot package regions is provided with a heat dissipation channel, those skilled in the art should be able to understand that the present invention can provide a heat dissipation channel in each of the package regions or a portion of the dot package regions. Within the scope of the application.

It can be understood that, in the present invention, the arrangement of the wafer needs to be adhesively fixed to the wafer carrier, and the plate substrate is electrically isolated from the circuit substrate gap, and the material technology used is well known to those skilled in the art. No further explanation. Further, a highly reflective layer may be provided on the entire upper surface of the plate-like substrate. The material of the highly reflective layer can be metallic silver or other high reflectivity materials. Metallic silver provides a relatively good reflection effect and can be placed on a plate-like substrate by electroplating.

In summary, the present invention directly covers the surface of one of the plate-shaped substrates by the circuit substrate, and the circuit substrate and the LED chip can directly dissipate heat toward the plate-like substrate, and further, the plate-shaped substrate and the heat sink are disposed under the dot package region. A heat dissipation channel is formed to provide an autonomous convection heat dissipation. Therefore, the light-emitting module with the heat dissipation channel of the invention can effectively improve the heat dissipation efficiency of the light-emitting module

The embodiments described above are merely illustrative of the technical spirit and the features of the present invention, and the objects of the present invention can be understood by those skilled in the art, and the scope of the present invention cannot be limited thereto. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.

10. . . Plate substrate

12. . . Wafer carrier

12’. . . Control wafer carrier

20. . . Circuit substrate

twenty two. . . Opening

30. . . LED chip

30’. . . Control chip

40. . . wire

50. . . Packaging material

52. . . Point package area

52’. . . Point package area

60. . . Through hole

60’. . . Through hole

70. . . Heat sink

72. . . Groove

80. . . gap

80’. . . gap

1A and 1B are schematic views of an embodiment of the present invention.

2A and 2B are schematic views of an embodiment of the present invention.

Figure 3 is a schematic illustration of an embodiment of the invention.

Figure 4 is a schematic illustration of an embodiment of the invention.

5A and 5B are schematic views of an embodiment of the present invention.

10. . . Plate substrate

12. . . Wafer carrier

20. . . Circuit substrate

twenty two. . . Opening

30. . . LED chip

40. . . wire

50. . . Packaging material

52. . . Point package area

60. . . Through hole

70. . . Heat sink

80. . . gap

Claims (8)

A light-emitting module having a heat-dissipating channel, comprising: a plate-shaped substrate having a plurality of wafer carriers disposed on an upper surface of the plate-shaped substrate, wherein the material of the plate-shaped substrate is a high thermal conductive material; a circuit substrate is directly stacked on the upper surface of the plate substrate, wherein the circuit substrate is provided with a plurality of openings to expose the plurality of wafer carriers; at least one LED chip is disposed in each of the a plurality of wires electrically connected to each of the light emitting diode chips and the circuit substrate; a packaging material covering each of the light emitting diode chips, each of the wafer carriers, a plurality of wires, and a portion of the circuit substrate forming a plurality of dot package regions, wherein at least two through holes are passed through the circuit substrate and the upper surface of the plate substrate adjacent to the plurality of dot package regions; and a heat sink, Attaching to the lower surface of the plate-shaped substrate, wherein the heat sink has a gap with the lower surface of the plate-shaped substrate below the plurality of dot package regions; and the gap is connected to the two through holes One point package area Forming a heat dissipating air convection channels of the bottom. The light-emitting module with a heat dissipation channel according to claim 1, wherein the plurality of wafer carriers protrude from the plate-shaped substrate and the plurality of openings are provided for the plurality of wafer carriers to pass through. The light-emitting module with a heat-dissipating channel according to claim 2, wherein the upper surface of the plurality of wafer carriers is horizontally or protruded from the upper surface of the circuit substrate. The light-emitting module with a heat dissipation channel according to claim 1, wherein the upper surface of the plurality of wafer carriers is lower than the upper surface of the circuit substrate. The light-emitting module with a heat-dissipating channel according to claim 1, wherein the thickness of the plate-shaped substrate below the plurality of dot-package regions is smaller than the thickness of the plate-shaped substrate in other regions for forming the gap with the heat sink. . The light-emitting module with a heat dissipation channel according to claim 1, wherein the heat sink below the plurality of dot package regions is provided with a recess for forming the gap with the lower surface of the plate-shaped substrate. The light-emitting module with a heat dissipation channel according to claim 1, wherein the two through holes adjacent to the plurality of dot package regions may have different opening sizes. The illuminating module with a heat dissipation channel according to claim 1, further comprising a control chip disposed on a control wafer carrier and electrically connected to the circuit substrate, wherein the control wafer carrier can be lower, horizontal or protruding It is disposed on the surface of the plate-shaped substrate.