TWI554869B - Signal input device - Google Patents

Signal input device Download PDF

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TWI554869B
TWI554869B TW103143073A TW103143073A TWI554869B TW I554869 B TWI554869 B TW I554869B TW 103143073 A TW103143073 A TW 103143073A TW 103143073 A TW103143073 A TW 103143073A TW I554869 B TWI554869 B TW I554869B
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Taiwan
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input device
signal input
support member
plate
opening
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TW103143073A
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Chinese (zh)
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TW201621536A (en
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吳府融
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英業達股份有限公司
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Description

訊號輸入裝置 Signal input device

本發明係關於一種訊號輸入裝置,特別係關於一種形成有一腔室的訊號輸入裝置。 The present invention relates to a signal input device, and more particularly to a signal input device formed with a chamber.

隨著電子裝置逐漸朝向「輕、薄、短、小」之設計概念發展,其內部之電子元件體積亦趨於微型化。惟,於電子元件體積趨於微型化的同時,其單位面積的密集度隨之提高,故相關電子元件所產生之熱量亦隨之增加。由於過高的溫度將嚴重影響電子裝置運作的穩定性與效率,並造成電子元件的壽命縮短。是以,如何有效地散熱業已成為電子裝置設計上的一大重點。 As electronic devices gradually move toward the design concept of "light, thin, short, and small", the size of electronic components inside them tends to be miniaturized. However, as the volume of electronic components tends to be miniaturized, the density per unit area increases, so the amount of heat generated by the related electronic components also increases. Excessive temperature will seriously affect the stability and efficiency of the operation of electronic devices, and shorten the life of electronic components. Therefore, how to effectively dissipate heat has become a major focus in the design of electronic devices.

習知技術中,由於輸入裝置亦隨著電子裝置微型化,其內部產生之熱量亦隨之增加。然而,習知的輸入裝置往往不具有良好的散熱設計,當使用者使用輸入裝置時,輸入裝置內部的熱量將直接傳導至鍵盤,導致鍵盤溫度升高。經過長時間地使用後,鍵盤表面過熱,進而影響使用者使用上的舒適度。 In the prior art, since the input device is also miniaturized with the electronic device, the amount of heat generated inside it also increases. However, conventional input devices often do not have a good heat dissipation design. When the user uses the input device, the heat inside the input device is directly transmitted to the keyboard, resulting in an increase in keyboard temperature. After a long period of use, the surface of the keyboard is overheated, which in turn affects the comfort of the user.

承前所述,如何提升輸入裝置的散熱效率,並同時可避免其熱量傳導至表面,造成輸入裝置的表面過熱而影響使用上的舒適度,其重要性可見一斑。 As mentioned above, the importance of how to improve the heat dissipation efficiency of the input device and at the same time avoiding the conduction of heat to the surface and causing the surface of the input device to overheat and affect the comfort of use can be seen.

有鑑於此,本發明提供一種訊號輸入裝置,於散熱的同時,亦 可避免熱量傳導至訊號輸入裝置之表面。 In view of this, the present invention provides a signal input device for simultaneously dissipating heat. Heat can be prevented from being conducted to the surface of the signal input device.

本發明所揭露的一種訊號輸入裝置,包含有一外殼、一輸入本體以及支撐件。外殼具有至少一通氣孔,並形成有一容置空間。熱源位於容置空間。支撐件支撐輸入本體。其中,支撐件形成有一腔室,腔室具有一第一開孔及一第二開孔。該第一開孔及該第二開孔與外界氣體連通。 A signal input device disclosed in the present invention comprises a casing, an input body and a support member. The outer casing has at least one vent hole and is formed with an accommodating space. The heat source is located in the accommodating space. The support supports the input body. Wherein, the support member is formed with a chamber having a first opening and a second opening. The first opening and the second opening are in communication with the outside air.

由於本發明所揭露的訊號輸入裝置包含有支撐件,且支撐件形成有一腔室,以令熱量可自通氣孔排出。此外,本發明所揭露的訊號輸入裝置另可包含有一風扇以及一出風口,風扇可驅動一氣流自通氣孔進入腔室,並自出風口排出。基此,可避免熱量傳導至輸入本體。 Since the signal input device disclosed in the present invention includes a support member, and the support member is formed with a chamber to allow heat to be discharged from the vent hole. In addition, the signal input device disclosed in the present invention may further include a fan and an air outlet, and the fan may drive an air flow from the vent hole into the chamber and be discharged from the air outlet. Based on this, heat can be prevented from being conducted to the input body.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

1、2‧‧‧訊號輸入裝置 1, 2‧‧‧ signal input device

10、20‧‧‧外殼 10, 20‧‧‧ shell

101、201‧‧‧通氣孔 101, 201‧‧‧ vents

102、202‧‧‧容置空間 102, 202‧‧‧ accommodating space

103、203‧‧‧底板 103, 203‧‧‧ bottom plate

104、204‧‧‧側板 104, 204‧‧‧ side panels

105、205‧‧‧延伸板 105, 205‧‧‧ extension board

11、21‧‧‧熱源 11, 21‧‧‧ heat source

12、22‧‧‧承載板 12, 22‧‧‧ carrying board

121、221‧‧‧凹槽 121, 221‧‧‧ grooves

13、23‧‧‧輸入本體 13, 23‧‧‧ Input ontology

14、24、34‧‧‧支撐件 14, 24, 34‧‧‧ Supports

141、241‧‧‧第一表面 141, 241‧‧‧ first surface

1411、2411、3411‧‧‧第一凸部 1411, 2411, 3411‧‧‧ first convex

1412、2412、3412‧‧‧第一凹部 1412, 2412, 3412‧‧‧ first recess

142、242、342‧‧‧第二表面 142, 242, 342‧‧‧ second surface

1421、2421、3421‧‧‧第二凸部 1421, 2421, 3421‧‧‧ second convex

1422、2422、3422‧‧‧第二凹部 1422, 2422, 3422‧‧‧ second recess

143‧‧‧腔室 143‧‧ ‧ chamber

1431、2441‧‧‧第一開孔 1431, 2441‧‧‧ first opening

206‧‧‧出風口 206‧‧‧air outlet

243、343‧‧‧第二開孔 243, 343‧‧‧ second opening

244、344‧‧‧腔室 244, 344‧‧ ‧ chamber

25‧‧‧風扇 25‧‧‧Fan

H1‧‧‧第一熱氣流 H1‧‧‧First hot air flow

H2‧‧‧第二熱氣流 H2‧‧‧second hot air flow

C‧‧‧冷氣流 C‧‧‧Cold airflow

W‧‧‧混合氣流 W‧‧‧ mixed airflow

L‧‧‧長度 L‧‧‧ length

I‧‧‧寬度 I‧‧‧Width

第1圖係依據本發明第一實施例所述之訊號輸入裝置的立體示意圖。 1 is a perspective view of a signal input device according to a first embodiment of the present invention.

第2圖係依據第1圖沿割面線AA’之剖面示意圖。 Fig. 2 is a schematic cross-sectional view along the cut line AA' according to Fig. 1.

第3圖係依據本發明第一實施例所述之訊號輸入裝置的散熱示意圖。 Figure 3 is a schematic diagram of heat dissipation of a signal input device according to a first embodiment of the present invention.

第4圖係依據本發明第二實施例所述之訊號輸入裝置的剖面示意圖。 Figure 4 is a cross-sectional view showing a signal input device according to a second embodiment of the present invention.

第5圖係依據本發明第二實施例所述之訊號輸入裝置的散熱示意圖。 Figure 5 is a schematic diagram of heat dissipation of a signal input device according to a second embodiment of the present invention.

第6圖係依據本發明第三實施例所述之支撐件的上視圖。 Figure 6 is a top plan view of a support member in accordance with a third embodiment of the present invention.

第7圖係依據第6圖沿割面線BB’之剖面示意圖。 Fig. 7 is a schematic cross-sectional view taken along line BB' of Fig. 6.

需注意的是,本說明書中關於方位的描述性用語(如:「上」、 「下」、「外」、「內」等等),僅為例示或相對性的用語,需依據使用者的不同或係依據使用方式的差異,而作概念性地調整,其並非列舉或絕對性的用語,合先說明。 It should be noted that the descriptive terminology of the orientation in this specification (eg, "upper", "Bottom", "outside", "inside", etc.) are merely examples of terms or relatencies. They should be conceptually adjusted depending on the user or based on the difference in usage. It is not enumerated or absolute. Sexual terms, first explained.

請參見第1圖以及第2圖。第1圖係依據本發明第一實施例所述之訊號輸入裝置的立體示意圖。第2圖係依據第1圖延割面線AA’之剖面示意圖。如圖所示,於本實施例中,本發明之訊號輸入裝置1設置於一外部空間,並包含有一外殼10、一熱源11、一承載板12、一輸入本體13以及一支撐件14。 Please refer to Figure 1 and Figure 2. 1 is a perspective view of a signal input device according to a first embodiment of the present invention. Fig. 2 is a schematic cross-sectional view showing the face line AA' according to Fig. 1. As shown in the figure, in the present embodiment, the signal input device 1 of the present invention is disposed in an external space and includes a casing 10, a heat source 11, a carrier plate 12, an input body 13, and a support member 14.

外殼10具有至少一通氣孔101,且外殼10之內部形成有一容置空間102。其中,至少一通氣孔101與容置空間102係相互連通。於本實施例中,外殼10包含有一底板103、一側板104以及一延伸板105。此外,至少一通氣孔101之數量為二。然而,本發明對於通氣孔101之數量並不加以限制。 The outer casing 10 has at least one vent hole 101, and an accommodating space 102 is formed inside the outer casing 10. The at least one vent hole 101 and the accommodating space 102 are in communication with each other. In the embodiment, the outer casing 10 includes a bottom plate 103, a side plate 104 and an extension plate 105. Further, the number of at least one vent hole 101 is two. However, the present invention does not limit the number of vent holes 101.

詳細以言,外殼10之底板103與側板104相互連接,底板103並與側板104共同圍繞出容置空間102。外殼10之延伸板105係連接於側板104,並覆蓋住部分之容置空間102。再者,外殼10之材質為塑膠。此外,二通氣孔101皆貫穿於外殼10之延伸板105,以令外部空間與容置空間102之間相互連通。 In detail, the bottom plate 103 of the outer casing 10 and the side plate 104 are connected to each other, and the bottom plate 103 and the side plate 104 together surround the accommodating space 102. The extension plate 105 of the outer casing 10 is connected to the side plate 104 and covers a portion of the accommodation space 102. Furthermore, the material of the outer casing 10 is plastic. In addition, the two vent holes 101 are penetrated through the extension plate 105 of the outer casing 10 to allow the external space and the accommodating space 102 to communicate with each other.

熱源11位於容置空間102內,並於訊號輸入裝置1運作時產生熱量。於本實施例中,熱源11為設有一中央處理器(central processing unit,CPU)之一電路板。於實際應用中,凡於訊號輸入裝置1運作時產生熱量者,皆屬本發明熱源11之範疇,本領域具有通常知識者應能了解。是以,本發明關於熱源11之種類以及熱量產生之原理,並不加以贅述。 The heat source 11 is located in the accommodating space 102 and generates heat when the signal input device 1 operates. In this embodiment, the heat source 11 is a circuit board provided with a central processing unit (CPU). In practical applications, those who generate heat when the signal input device 1 operates are in the scope of the heat source 11 of the present invention, and those skilled in the art should be able to understand. Therefore, the present invention relates to the type of heat source 11 and the principle of heat generation, and will not be described again.

承載板12裝設於外殼10,並遮蓋容置空間102。於本實施例中, 承載板12具有一凹槽121,並裝設於外殼10之延伸板105。此外,於本實施例中承載板12之材質相同於延伸板105之材質,二者皆為塑膠。然而,承載板12之材質並非僅限於塑膠,舉例而言,承載板12之材質可為金屬(如:鐵),以加強承載板12之承載強度。 The carrier plate 12 is mounted on the outer casing 10 and covers the accommodation space 102. In this embodiment, The carrier plate 12 has a recess 121 and is mounted on the extension plate 105 of the outer casing 10. In addition, in the embodiment, the material of the carrier plate 12 is the same as that of the extension plate 105, and both of them are plastic. However, the material of the carrier 12 is not limited to plastic. For example, the material of the carrier 12 may be metal (eg, iron) to enhance the bearing strength of the carrier 12 .

輸入本體13疊設於承載板12。於本實施例中,輸入本體13係設置於承載板12之凹槽121,並向上凸出於承載板12,以利使用者輸入至少一電子訊號。此外,上述提及之二通氣孔101即分別位於輸入本體13之相對二側。然而,二通氣孔101並不限於位於輸入本體13之相對二側,舉例來說,二通氣孔101亦可皆位於輸入本體13之相同的一側。是以,關於各通氣孔101與輸入本體13之間的相對位置,本發明於此並不加以限制。 The input body 13 is stacked on the carrier board 12. In this embodiment, the input body 13 is disposed on the recess 121 of the carrying board 12 and protrudes upward from the carrying board 12 for the user to input at least one electronic signal. In addition, the vent holes 101 mentioned above are respectively located on opposite sides of the input body 13. However, the two vent holes 101 are not limited to the opposite sides of the input body 13. For example, the two vent holes 101 may also be located on the same side of the input body 13. Therefore, the present invention is not limited thereto as to the relative position between each of the vent holes 101 and the input body 13.

支撐件14位於承載板12及底板103之間。亦即是說,承載板12係裝設於支撐件14與輸入本體13之間。支撐件14具有相對的一第一表面141以及一第二表面142,並形成有一腔室143。第一表面141面對殼體10之底板103,並包含一第一凸部1411及一第一凹部1412。第二表面142背向第一表面141,並包含一第二凸部1421及一第二凹部1422。其中,第一凹部1412平行第二凸部1422。此外,第一凸部1411、第一凹部1412、第二凸部1421及一第二凹部1422之形成,可加強支撐件34之結構強度。腔室143具有二第一開孔1431,二第一開孔1431與二通氣孔101連通,且與外界氣體連通。此外,於本實施例中,支撐件14之材質係金屬。 The support member 14 is located between the carrier plate 12 and the bottom plate 103. That is to say, the carrier 12 is mounted between the support member 14 and the input body 13. The support member 14 has a first surface 141 and a second surface 142 opposite to each other and is formed with a chamber 143. The first surface 141 faces the bottom plate 103 of the housing 10 and includes a first protrusion 1411 and a first recess 1412. The second surface 142 faces away from the first surface 141 and includes a second protrusion 1421 and a second recess 1422. The first recess 1412 is parallel to the second protrusion 1422. In addition, the formation of the first convex portion 1411, the first concave portion 1412, the second convex portion 1421 and a second concave portion 1422 can strengthen the structural strength of the support member 34. The chamber 143 has two first openings 1431, and the two first openings 1431 communicate with the two vents 101 and communicate with the outside air. Further, in the present embodiment, the material of the support member 14 is metal.

至此,上開內容係關於本發明之訊號輸入裝置1中各構件之介紹。關於訊號輸入裝置1之散熱方式,請參見下述,併請參見第3圖。其中,第3圖係依據本發明第一實施例所述之訊號輸入裝置的散熱示意圖。 Up to this point, the above content is an introduction to each component in the signal input device 1 of the present invention. For the heat dissipation method of the signal input device 1, refer to the following, and see Figure 3. FIG. 3 is a schematic diagram of heat dissipation of the signal input device according to the first embodiment of the present invention.

如第3圖所示,當使用者使用訊號輸入裝置1時,熱源11產生熱量,並產生至少一第一熱氣流H1。至少一第一熱氣流H1上升,並熱接觸於支撐件14之第一表面141。 As shown in FIG. 3, when the user uses the signal input device 1, the heat source 11 generates heat and generates at least one first hot gas flow H1. At least one first hot gas stream H1 rises and is in thermal contact with the first surface 141 of the support member 14.

當至少一第一熱氣流H1熱接觸於支撐件14之第一表面141時,由於本實施例中支撐件14之材質係金屬,故支撐件14會將至少一第一熱氣流H1之熱量自第一表面141傳導至腔室143,接著,並於腔室143中產生至少一第二熱氣流H2。 When the at least one first hot air flow H1 is in thermal contact with the first surface 141 of the support member 14, since the material of the support member 14 in the embodiment is metal, the support member 14 will heat the at least one first hot air flow H1. The first surface 141 is conducted to the chamber 143, and then at least a second hot gas stream H2 is generated in the chamber 143.

由於腔室143中充滿空氣,空氣為良好之熱絕緣體。此外,腔室143藉由二第一開孔1431以及二通氣孔101與外部空間相互連通,至少一第二熱氣流H2將朝各第一開孔1431以及各通氣孔101處對流。 Since the chamber 143 is filled with air, the air is a good thermal insulator. In addition, the chamber 143 communicates with the external space through the two first openings 1431 and the two vent holes 101, and at least one second hot gas flow H2 will convect toward the first openings 1431 and the vent holes 101.

最後,至少一第二熱氣流H2通過各通氣孔101,而對流至外部空間,以排除訊號輸入裝置1內之熱量(熱源11產生之熱量),而達致隔離熱源11與輸入本體13的效果,並產生散熱之功效。 Finally, at least one second hot gas stream H2 passes through each of the vent holes 101 and convects to the external space to eliminate the heat in the signal input device 1 (the heat generated by the heat source 11), thereby achieving the effect of isolating the heat source 11 and the input body 13. And produce the effect of heat dissipation.

請參見第4圖。第4圖係依據本發明第二實施例所述之訊號輸入裝置的剖面示意圖。如圖所示,於本實施例中,本發明之訊號輸入裝置2設置於一外部空間,並包含有一外殼20、一熱源21、一承載板22、一輸入本體23、一支撐件24以及一風扇25。 See Figure 4. Figure 4 is a cross-sectional view showing a signal input device according to a second embodiment of the present invention. As shown in the figure, in the present embodiment, the signal input device 2 of the present invention is disposed in an external space, and includes a casing 20, a heat source 21, a carrier plate 22, an input body 23, a support member 24, and a Fan 25.

外殼20具有至少一通氣孔201以及一出風口206,且外殼20之內部形成有一容置空間202。於本實施例中,外殼20包含有一底板203、一側板204以及一延伸板205。此外,於本實施例中,至少一通氣孔201之數量為二。 The outer casing 20 has at least one vent hole 201 and an air outlet 206, and an accommodating space 202 is formed inside the outer casing 20. In the embodiment, the outer casing 20 includes a bottom plate 203, a side plate 204, and an extension plate 205. In addition, in the embodiment, the number of the at least one vent hole 201 is two.

外殼20之底板203與側板204相互連接,底板203並與側板204共同圍繞出容置空間202。外殼20之延伸板205係連接於側板204,並覆蓋住 部分之容置空間202。延伸板205之材質為塑膠。此外,二通氣孔201皆位於外殼20之延伸板205,並貫穿延伸板205,出風口206位於外殼20之側板204,並貫穿側板204。是以,二通氣孔201與出風口206皆令外部空間與容置空間202之間相互連通。 The bottom plate 203 of the outer casing 20 and the side plate 204 are connected to each other, and the bottom plate 203 and the side plate 204 together surround the accommodating space 202. The extension plate 205 of the outer casing 20 is connected to the side plate 204 and covered Part of the accommodation space 202. The material of the extension plate 205 is plastic. In addition, the two vents 201 are located in the extension plate 205 of the outer casing 20 and extend through the extension plate 205. The air outlet 206 is located at the side plate 204 of the outer casing 20 and penetrates the side plate 204. Therefore, both the vent hole 201 and the air outlet 206 allow the external space and the accommodating space 202 to communicate with each other.

熱源21位於容置空間202內,並於訊號輸入裝置2運作時產生熱量。於本實施例中,熱源21亦為一中央處理器。 The heat source 21 is located in the accommodating space 202 and generates heat when the signal input device 2 operates. In this embodiment, the heat source 21 is also a central processing unit.

承載板22裝設於外殼20,並遮蓋容置空間202。於本實施例中,承載板22具有一凹槽221,並裝設於外殼20之延伸板205。此外,於本實施例中,承載板22之材質相同於外殼20之材質,二者皆為塑膠。 The carrier plate 22 is mounted on the outer casing 20 and covers the accommodation space 202. In this embodiment, the carrier plate 22 has a recess 221 and is mounted on the extension plate 205 of the outer casing 20. In addition, in the embodiment, the material of the carrier plate 22 is the same as that of the outer casing 20, and both of them are plastic.

輸入本體23疊設於承載板22。於本實施例中,輸入本體23係設置於承載板22之凹槽221,並向上凸出於承載板22,以利使用者輸入至少一電子訊號。此外,上述提及之二通氣孔201即分別位於輸入本體23之相對二側。 The input body 23 is stacked on the carrier plate 22. In this embodiment, the input body 23 is disposed on the recess 221 of the carrying board 22 and protrudes upward from the carrying board 22 for the user to input at least one electronic signal. In addition, the vent holes 201 mentioned above are respectively located on opposite sides of the input body 23.

支撐件24具有相對的一第一表面241、第二表面242,以及一第二開孔243。第一表面241面對殼體20之底板203,第二表面242背向第一表面241。第二開孔243貫穿支撐件24。 The support member 24 has a first surface 241, a second surface 242, and a second opening 243. The first surface 241 faces the bottom plate 203 of the housing 20 and the second surface 242 faces away from the first surface 241. The second opening 243 extends through the support member 24.

支撐件24位於承載板22及底板203之間。亦即是說,承載板22係裝設於支撐件24與輸入本體23之間。支撐件24具有相對的一第一表面241以及一第二表面242,並形成有一腔室244。於本實施例中,第一表面241面對殼體20之底板203,並包含一第一凸部2411及一第一凹部2412。第二表面242背向第一表面241,並包含一第二凸部2421及一第二凹部2422。其中,第一凹部2412平行第二凸部2422。腔室244具有二第一開孔2431以及一第二開孔243。二第一開孔2431與二通氣孔201連通,且與外界氣體連通。此外, 支撐件24之材質亦為金屬。 The support member 24 is located between the carrier plate 22 and the bottom plate 203. That is to say, the carrier 22 is mounted between the support member 24 and the input body 23. The support member 24 has a first surface 241 and a second surface 242 opposite to each other and is formed with a chamber 244. In this embodiment, the first surface 241 faces the bottom plate 203 of the housing 20 and includes a first protrusion 2411 and a first recess 2412. The second surface 242 faces away from the first surface 241 and includes a second protrusion 2421 and a second recess 2422. The first recess 2412 is parallel to the second protrusion 2422. The chamber 244 has two first openings 2431 and a second opening 243. The two first openings 2431 are in communication with the second vents 201 and are in communication with the outside air. In addition, The material of the support member 24 is also metal.

風扇25設置於容置空間202,並位於外殼20之底板203與支撐件24之間。於本實施例中,支撐件24貼合風扇25,且第二開孔243連通風扇25之入風口。此外,風扇25之位置亦對應於外殼20之出風口206。於本實施例中,風扇25為一吸氣風扇,以驅動氣流自通氣孔201進入腔室244,並自出風口206排出(詳請先參見第5圖)。 The fan 25 is disposed in the accommodating space 202 and located between the bottom plate 203 of the outer casing 20 and the support member 24. In this embodiment, the support member 24 is attached to the fan 25, and the second opening 243 is connected to the air inlet of the fan 25. In addition, the position of the fan 25 also corresponds to the air outlet 206 of the outer casing 20. In the present embodiment, the fan 25 is an air suction fan to drive the airflow from the vent hole 201 into the chamber 244 and from the air outlet 206 (see FIG. 5 for details).

至此,上開內容係關於本發明之訊號輸入裝置2中各構件之介紹。關於訊號輸入裝置2之散熱方式,請參見下述,併請參見第5圖。其中,第5圖係依據本發明第二實施例所述之訊號輸入裝置的散熱示意圖。 Up to this point, the above content is an introduction to each component in the signal input device 2 of the present invention. For the heat dissipation method of the signal input device 2, please refer to the following, and see Figure 5. 5 is a schematic diagram of heat dissipation of a signal input device according to a second embodiment of the present invention.

如第5圖所示,當使用者使用訊號輸入裝置2時,熱源21產生熱量,並產生至少一第一熱氣流H1。至少一第一熱氣流H1上升,並熱接觸於支撐件24之第一表面241。 As shown in FIG. 5, when the user uses the signal input device 2, the heat source 21 generates heat and generates at least a first hot gas flow H1. At least one first hot gas stream H1 rises and is in thermal contact with the first surface 241 of the support member 24.

當至少一第一熱氣流H1熱接觸於第一表面241時,由於本實施例中支撐件24之材質係金屬,故支撐件24會將至少一第一熱氣流H1之熱量自第一表面241傳導至腔室244,接著,並於腔室244中產生至少一第二熱氣流H2。 When the at least one first hot air flow H1 is in thermal contact with the first surface 241, since the material of the support member 24 is metal in the embodiment, the support member 24 will heat the at least one first hot air flow H1 from the first surface 241. Conducted to chamber 244, and then at least a second stream of hot gas H2 is produced in chamber 244.

同時,風扇25可驅動外部空間中之至少一冷氣流C,自二通氣孔201進入腔室244,並朝向第二開孔243流動。由於外部空間之溫度小於容置空間202內之溫度,故至少一冷氣流C進入腔室244時,可同時降低訊號輸入裝置2之溫度。此外,風扇25亦可驅動腔室244中之至少一第二熱氣流H2朝向第二開孔243流動。 At the same time, the fan 25 can drive at least one cold airflow C in the outer space, enter the chamber 244 from the second vent 201, and flow toward the second opening 243. Since the temperature of the external space is lower than the temperature in the accommodating space 202, when at least one cold airflow C enters the chamber 244, the temperature of the signal input device 2 can be simultaneously lowered. In addition, the fan 25 can also drive at least one second hot gas stream H2 in the chamber 244 to flow toward the second opening 243.

最後,至少一混合氣流W(包含至少一第二熱氣流H2以及至 少一冷氣流C)通過第二開孔243,並自出風口206排出,以達到散熱之效果。 Finally, at least one mixed gas stream W (including at least one second hot gas stream H2 and One less cold airflow C) passes through the second opening 243 and is discharged from the air outlet 206 to achieve the effect of heat dissipation.

請參見第6圖以及第7圖。第6圖係依據本發明第三實施例所述之支撐件的上視圖。第7圖係依據第6圖沿割面線BB’之剖面示意圖。 See Figure 6 and Figure 7. Figure 6 is a top plan view of a support member in accordance with a third embodiment of the present invention. Fig. 7 is a schematic cross-sectional view taken along line BB' of Fig. 6.

相異於第二實施例,本實施例之支撐件34的第一凸部3411、第一凹部3412、第二凸部3421及一第二凹部3422,係呈放射狀排列。如此,除了可加強支撐件34之結構強度外,亦可達致氣流導槽的功效。於本實施例中,第一凸部3411及第二凸部3421之橫切面為一長方形,長度L介於2mm至5mm之間,寬度I介於0.3mm至0.5mm之間。然而,關於第一凸部3411、第一凹部3412、第二凸部3421及第二凹部3422之排列方式與形狀,使用者可依其需求作不同的調整與改良,本發明並不加以限制。 Different from the second embodiment, the first convex portion 3411, the first concave portion 3412, the second convex portion 3421 and the second concave portion 3422 of the support member 34 of the embodiment are arranged radially. In this way, in addition to strengthening the structural strength of the support member 34, the effect of the air flow guide groove can also be achieved. In this embodiment, the cross-section of the first convex portion 3411 and the second convex portion 3421 is a rectangle, the length L is between 2 mm and 5 mm, and the width I is between 0.3 mm and 0.5 mm. However, regarding the arrangement and shape of the first convex portion 3411, the first concave portion 3412, the second convex portion 3421, and the second concave portion 3422, the user can make various adjustments and improvements according to the needs thereof, and the present invention is not limited thereto.

當風扇(未顯示於圖中)運作時,腔室344中之至少一氣流F即可沿第一凸部3411、第一凹部3412、第二凸部3421及第二凹部3422流至第二開孔343,以利後續排出熱源(未顯示於圖中)產生之熱量。 When the fan (not shown) operates, at least one airflow F in the chamber 344 can flow along the first convex portion 3411, the first concave portion 3412, the second convex portion 3421, and the second concave portion 3422 to the second opening. Hole 343 is used to facilitate the subsequent generation of heat generated by a heat source (not shown).

於本實施例中,除第一凸部3411、第一凹部3412、第二凸部3421及第二凹部3422之排列方式外,其他未提及之部分皆近似於第二實施例(詳請參見第4圖至第5圖以及前文),故在此不予贅述。 In this embodiment, except for the arrangement of the first convex portion 3411, the first concave portion 3412, the second convex portion 3421, and the second concave portion 3422, other unmentioned portions are similar to the second embodiment (see also Figures 4 to 5 and the previous section), so I will not repeat them here.

綜上所述,習知技術中,由於輸入裝置亦隨著電子裝置微型化,其內部產生之熱量亦隨之增加。然而,習知的輸入裝置往往不具有良好的散熱設計,當使用者使用輸入裝置時,輸入裝置內部的熱量將直接傳導至鍵盤,導致鍵盤溫度升高。經過長時間地使用後,鍵盤表面過熱,進而影響使用者使用上的舒適度。相較於此,由於本發明所揭露的訊號輸入裝置包含有支撐件,且支撐件形成有腔室,以令熱量可自通氣孔排出。此外,本發明所揭露的訊號輸 入裝置另可包含有一風扇以及一出風口,風扇可驅動一氣流自通氣孔進入腔室,並自出風口排出。基此,亦可避免熱量傳導至輸入本體。 In summary, in the prior art, since the input device is also miniaturized with the electronic device, the heat generated inside thereof is also increased. However, conventional input devices often do not have a good heat dissipation design. When the user uses the input device, the heat inside the input device is directly transmitted to the keyboard, resulting in an increase in keyboard temperature. After a long period of use, the surface of the keyboard is overheated, which in turn affects the comfort of the user. In contrast, the signal input device disclosed in the present invention includes a support member, and the support member is formed with a chamber to allow heat to be discharged from the vent hole. In addition, the signal transmission disclosed in the present invention The inlet device may further comprise a fan and an air outlet, the fan driving an air flow from the vent hole into the chamber and discharging from the air outlet. Based on this, heat can also be prevented from being conducted to the input body.

雖然本發明的實施例揭露如上所述,然並非用以限定本發明,任何熟習相關技藝者,在不脫離本發明的精神和範圍內,舉凡依本發明申請範圍所述的形狀、構造、特徵及數量當可做些許的變更,因此本發明的專利保護範圍須視本說明書所附的申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, configurations, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

2‧‧‧訊號輸入裝置 2‧‧‧Signal input device

20‧‧‧外殼 20‧‧‧ Shell

201‧‧‧通氣孔 201‧‧‧Ventinel

202‧‧‧容置空間 202‧‧‧ accommodating space

203‧‧‧底板 203‧‧‧floor

204‧‧‧側板 204‧‧‧ side panels

205‧‧‧延伸板 205‧‧‧ Extension board

206‧‧‧出風口 206‧‧‧air outlet

21‧‧‧熱源 21‧‧‧heat source

22‧‧‧承載板 22‧‧‧Loading board

221‧‧‧凹槽 221‧‧‧ Groove

23‧‧‧輸入本體 23‧‧‧ Input ontology

24‧‧‧支撐件 24‧‧‧Support

241‧‧‧第一表面 241‧‧‧ first surface

2411‧‧‧第一凸部 2411‧‧‧First convex

2412‧‧‧第一凹部 2412‧‧‧First recess

242‧‧‧第二表面 242‧‧‧ second surface

2421‧‧‧第二凸部 2421‧‧‧second convex

2422‧‧‧第二凹部 2422‧‧‧Second recess

243‧‧‧第二開孔 243‧‧‧Second opening

244‧‧‧腔室 244‧‧‧ chamber

25‧‧‧風扇 25‧‧‧Fan

Claims (8)

一種訊號輸入裝置,包含:一外殼,具有至少一通氣孔,該外殼包含有一底板、一側板以及一延伸板,該底板與該側板相互連接,並與該側板共同圍繞出一容置空間,該延伸板連接於該側板;一輸入本體;一支撐件,支撐該輸入本體;以及一承載板,裝設於該支撐件與該輸入本體之間,且該承載板裝設於該延伸板;其中,該支撐件形成有一腔室,該腔室具有一第一開孔及一第二開孔,該第一開孔與外界氣體連通。 A signal input device comprises: a casing having at least one venting hole, the casing comprising a bottom plate, a side plate and an extension plate, the bottom plate and the side plate are connected to each other, and together with the side plate, surround an accommodating space, the extension The board is connected to the side panel; an input body; a support member for supporting the input body; and a carrier plate disposed between the support member and the input body, wherein the carrier board is mounted on the extension board; The support member is formed with a chamber having a first opening and a second opening, the first opening being in gas communication with the outside. 如請求項1所述之訊號輸入裝置,其中該第一開孔連通該至少一通氣孔。 The signal input device of claim 1, wherein the first opening communicates with the at least one vent. 如請求項1所述之訊號輸入裝置,更包含一風扇,設置於該容置空間。 The signal input device of claim 1 further includes a fan disposed in the accommodating space. 如請求項3所述之訊號輸入裝置,該支撐件貼合該風扇,該第二開孔連通該風扇之入風口。 The signal input device of claim 3, the support member is attached to the fan, and the second opening communicates with the air inlet of the fan. 如請求項1所述之訊號輸入裝置,其中該至少一通氣孔貫穿於該延伸板,並位於該輸入本體之一側。 The signal input device of claim 1, wherein the at least one vent hole extends through the extension plate and is located on one side of the input body. 如請求項1所述之訊號輸入裝置,其中該外殼更具有一出風口位於該側板,該出風口連通該容置空間。 The signal input device of claim 1, wherein the outer casing further has an air outlet at the side plate, and the air outlet communicates with the accommodating space. 如請求項5所述之訊號輸入裝置,其中該支撐件具有相對之第一表面及第二表面,該第一表面包含一第一凸部及一第一凹部,該第二表面包含一第二凸部及一第二凹部,該第一凸部平行該第二凹部,該第一凹部平行該第二凸部。 The signal input device of claim 5, wherein the support member has a first surface and a second surface, the first surface includes a first protrusion and a first recess, and the second surface includes a second a convex portion and a second concave portion, the first convex portion being parallel to the second concave portion, the first concave portion being parallel to the second convex portion. 如請求項1所述之訊號輸入裝置,其中該至少一通氣孔之數量為二,且分別位於該輸入本體之相對二側。 The signal input device of claim 1, wherein the number of the at least one vent holes is two and located on opposite sides of the input body.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101529359A (en) * 2006-11-01 2009-09-09 苹果公司 Thin, passive cooling system
CN203054726U (en) * 2012-11-26 2013-07-10 张虎 Notebook computer matched keyboard
TW201334244A (en) * 2012-02-14 2013-08-16 Lighten Corp Light-emitting module provided with heat-dissipation channel
TW201344405A (en) * 2012-04-27 2013-11-01 Wistron Corp Heat sink structure and electronic device having the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101529359A (en) * 2006-11-01 2009-09-09 苹果公司 Thin, passive cooling system
TW201334244A (en) * 2012-02-14 2013-08-16 Lighten Corp Light-emitting module provided with heat-dissipation channel
TW201344405A (en) * 2012-04-27 2013-11-01 Wistron Corp Heat sink structure and electronic device having the same
CN203054726U (en) * 2012-11-26 2013-07-10 张虎 Notebook computer matched keyboard

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