TW201832637A - Air cooling heat dissipation device - Google Patents

Abstract

An air cooling heat dissipation device is disclosed and is for dissipating heat to an electronic device. The air-cooling heat dissipation device comprises a carrier substrate, an air pump, and a radiator. The carrier substrate comprises an inlet opening and a heat conduction plate, wherein the heat conduction plate is disposed on a top surface of the carrier substrate which is corresponding to the inlet opening, and the electronic device is disposed on the heat conduction plate. The air pump is fixed on a bottom surface of the carrier substrate, and closes the inlet opening correspondingly. The radiator is disposed on the electronic device. By driving the air pump, the air flows into the inlet opening and makes heat exchanged with the electronic device.

Description

Air cooling device

The present invention relates to an air-cooling heat dissipating device, and more particularly to an air-cooling heat dissipating device that uses a gas pump to provide a driving airflow for heat dissipation.

With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, video players, etc. have been trending toward thin, portable, high-performance, and these electronic devices are In the limited internal space, various high-accumulation or high-power electronic components must be configured. In order to make the electronic device faster and more powerful, the electronic components inside the electronic device will generate more heat during operation, and Causes high temperatures. In addition, most of these electronic devices are designed to be thin, flat, and compact, and have no additional internal space for heat dissipation. Therefore, electronic components in electronic devices are susceptible to heat and high temperatures, which may cause interference or interference. Damage and other issues.

Generally speaking, the heat dissipation method inside the electronic device can be divided into active heat dissipation and passive heat dissipation. The active heat dissipation is usually disposed inside the electronic device by using an axial fan or a blower fan, and the airflow is driven by the axial fan or the blower fan to transfer the heat energy generated by the electronic components inside the electronic device to achieve heat dissipation. . However, axial fans and blower fans generate large noise during operation, and their bulk is not easy to be thinner and smaller, and axial fans and blower fans have a shorter service life. Therefore, the traditional axial flow fan and the blower fan are not suitable for heat dissipation in thin and light portable and portable electronic devices.

Furthermore, many electronic components are soldered to a printed circuit board (PCB) using techniques such as Surface Mount Technology (SMT) and Selective Soldering, but soldered by the soldering method described above. The electronic components are easily separated from the printed circuit board after being in a high thermal energy and high temperature environment for a long time, and most of the electronic components are not resistant to high temperatures. If the electronic components are in a high heat and high temperature environment for a long time, It is easy to cause the performance stability of electronic components to decrease and the lifespan to be shortened.

Figure 1 is a schematic view of the structure of a conventional heat dissipation mechanism. As shown in FIG. 1 , the conventional heat dissipating mechanism is a passive heat dissipating mechanism, and includes a heat conducting plate 12 which is adhered to a electronic component 11 to be dissipated by a thermal conductive adhesive 13 by a thermal conductive adhesive. 13 and the heat conduction path formed by the heat conduction plate 12 allows the electronic component 11 to achieve heat dissipation by heat conduction and natural convection. However, the heat dissipation mechanism of the foregoing heat dissipation mechanism is inferior and cannot meet the application requirements.

In view of this, it is necessary to develop an air-cooling heat sink to solve the problems faced by the prior art.

The purpose of the present invention is to provide an air-cooling heat dissipating device, which can be applied to various electronic devices to dissipate heat from electronic components inside the electronic device, improve heat dissipation performance, reduce noise, and stabilize and extend the performance of electronic components inside the electronic device. Service life.

Another object of the present invention is to provide an air-cooling heat dissipating device having a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, improve the heat dissipation performance, and prolong the use of the air cooling device. life.

In order to achieve the above object, one of the more general embodiments of the present invention provides an air-cooling heat dissipating device for dissipating heat from an electronic component. The air-cooling heat dissipating device comprises: a carrier substrate including an upper surface, a lower surface, an air-conducting end opening, and heat conduction. a plate, wherein the heat conducting plate is disposed on the upper surface and corresponds to the air guiding end opening, and the electronic component is disposed on the heat conducting plate; the gas pumping, the gas pumping is piezoelectrically actuated gas pumping, is fixed on the carrier substrate a lower surface, corresponding to the closed air guiding end opening, the gas pump comprises: a resonant piece having a hollow hole; a piezoelectric actuator disposed corresponding to the resonant piece; and a cover plate having a side wall, a bottom plate and an opening portion, The side wall is disposed on the bottom of the bottom plate and protrudes from the bottom plate, and forms an accommodating space with the bottom plate. The resonant plate and the piezoelectric actuator are disposed in the accommodating space, and the opening is disposed in the accommodating space. On the side wall, the resonant plate and the side wall of the cover jointly define a confluence chamber; wherein when the piezoelectric actuator is driven for the gas gathering operation, the gas system is first assembled by the opening of the cover The confluence chamber is further flowed from the hollow hole of the resonator piece to the first chamber for temporary storage. When the piezoelectric actuator is driven to perform the exhaust operation, the gas system first flows from the first chamber through the hollow hole of the resonator piece. The air guiding end is open and heat exchange is performed on the heat conducting plate.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not to be construed as a limitation.

Please refer to FIG. 2A, FIG. 2B and FIG. 3A. FIG. 2A is a schematic structural view of the air-cooling heat dissipating device according to the preferred embodiment of the present invention, and FIG. 2B is a view of the air-cooling heat dissipating device shown in FIG. 2A in another view. The schematic diagram of the structure, and Fig. 3 is a schematic view showing the structure of the air-cooling heat dissipating device shown in Fig. 2A in the AA cross section. As shown in the figure, the air-cooling heat sink 2 of the present invention can be applied to an electronic device such as, but not limited to, a portable computer, a tablet computer, an industrial computer, a portable communication device, a video player, and the like. The heat-dissipating electronic component 3 dissipates heat. The air cooling device 2 of the present invention includes a carrier substrate 20, a gas pump 21, and a heat sink 26, wherein the carrier substrate 20 includes an upper surface 20a, a lower surface 20b, an air guiding end opening 23, and a heat conducting plate 25. The carrier substrate 20 can be, but not limited to, a printed circuit board for carrying and disposing the electronic component 3 and the gas pump 21. The air guide end opening 23 of the carrier substrate 20 penetrates the upper surface 20a and the lower surface 20b. The gas pump 21 is fixed to the lower surface 20b of the carrier substrate 20, the corresponding assembly is positioned at the air guiding end opening 23, and the air guiding end opening 23 is closed. The heat conduction plate 25 is disposed on the upper surface 20a of the carrier substrate 20, and is assembled and positioned on the air conduction end opening 23, and has a gap G between the heat conduction plate 25 and the carrier substrate 20 for gas circulation. In this embodiment, the heat conduction plate 25 further has a plurality of heat dissipation fins 25a disposed on the surface of the heat conduction plate 25 and disposed adjacent to the air conduction end opening 23, but not limited thereto, to increase the heat dissipation area. In turn, the heat dissipation efficiency is improved. The electronic component 3 is disposed on the heat conduction plate 25, and one surface of the electronic component 3 is attached to the heat conduction plate 25, and is radiated through the heat conduction path of the heat conduction plate 25. The heat sink 26 is disposed on the electronic component 3 and attached to the other surface of the electronic component 3. The heat pumping of the electronic component 3 is achieved by driving the gas pump 21 to introduce the gas flow into the gas-conducting end opening 23 and exchange heat with the heat-conducting plate 25.

In this embodiment, the heat sink 26 includes a base 261 and a plurality of heat sinks 262. The base 261 is attached to the other surface of the electronic component 3. The plurality of heat sinks 262 are vertically connected to the base 261. By the arrangement of the heat sink 26, the heat dissipation area can be increased, so that the thermal energy generated by the electronic component 3 can be guided away via the heat conduction path of the heat sink 26.

In the present embodiment, the gas pump 21 is a piezoelectrically actuated gas pump for driving the gas flow to introduce the gas from the outside of the air-cooling heat sink 2 into the air-conducting end opening 23. In some embodiments, the carrier substrate 20 further includes at least one recirculation through groove 24 extending through the upper surface 20a and the lower surface 20b and adjacent to the periphery of the heat conduction plate 25. When the gas pump 21 introduces the gas into the air guide opening 23, the introduced air stream exchanges heat with the heat conduction plate 25 disposed on the upper surface 20a of the carrier substrate 20, and pushes the gap G between the carrier substrate 20 and the heat conduction plate 25. The gas flows rapidly, causing the gas stream after the heat exchange to discharge the heat energy through the gap G, wherein part of the gas stream will be returned to the lower surface 20b of the carrier substrate 20 via the return flow through groove 24, and used for cooling the subsequent gas pump 21 for use. In addition, part of the airflow flows along the circumference of the heat conduction plate 25 toward the heat sink 26, and after cooling, flows through the heat sink 261 of the heat sink 26 to accelerate heat dissipation to the electronic component 3. Since the gas pump 21 is continuously operated to introduce a gas, the electronic component 3 can exchange heat with the continuously introduced gas, and at the same time, the heat-exchanged gas is discharged, whereby heat dissipation to the electronic component 3 can be achieved, and the heat can be improved. The heat dissipation performance further increases the performance stability and life of the electronic component 3.

Please refer to FIG. 4A and FIG. 4B. FIG. 4A is a schematic diagram showing the front exploded structure of the gas pump of the preferred embodiment of the present invention, and FIG. 4B is a schematic view showing the rear exploded structure of the gas pump of the preferred embodiment of the present invention. In the present embodiment, the gas pump 21 is a piezoelectrically actuated gas pump for driving gas flow. As shown, the gas pump 21 of the present invention includes elements such as a resonator piece 212, a piezoelectric actuator 213, and a cover plate 216. The resonator piece 212 is disposed corresponding to the piezoelectric actuator 213 and has a hollow hole 2120 disposed in the central area of the resonator piece 212, but is not limited thereto. The piezoelectric actuator 213 has a suspension plate 2131, an outer frame 2132, and a piezoelectric ceramic plate 2133. The suspension plate 2131 has a central portion 2131c and a peripheral portion 2131d. When the piezoelectric ceramic plate 2133 is driven by a voltage, the suspension plate 2131 can be The central portion 2131c is bent and vibrated to the outer peripheral portion 2131d. The outer frame 2132 is disposed on the outer side of the suspension plate 2131 and has at least one bracket 2132a and a conductive pin 2132b. However, not limited thereto, each bracket 2132a is disposed on The suspension plate 2131 and the outer frame 2132 are connected to the suspension plate 2131 and the outer frame 2132 to provide elastic support. The conductive pins 2132b are outwardly protruded from the outer frame 2132 for For the power supply connection, the piezoelectric ceramic plate 2133 is attached to the second surface 2131b of the suspension plate 2131 for receiving an applied voltage to generate deformation to drive the suspension plate 2131 to bend and vibrate. The cover plate 216 has a side wall 2161, a bottom plate 2162 and an opening portion 2163. The side wall 2161 is disposed on the bottom plate 2162 around the periphery of the bottom plate 2162, and forms a receiving space 216a with the bottom plate 2162 for the resonant piece 212 and the piezoelectric body. The opening portion 2163 is disposed on the side wall 2161, and the conductive pin 2132b of the outer frame 2132 and the conductive pin 2151 of the conductive piece 215 protrude outward through the opening portion 2163 to protrude from the cover plate. In addition to 216, in order to connect with external power supply, but not limited to this.

In the present embodiment, the gas pump 21 of the present invention further includes two insulating sheets 2141, 2142 and a conductive sheet 215, but not limited thereto, wherein the two insulating sheets 2141 and 2142 are respectively disposed on the conductive sheet 215. The shape is substantially corresponding to the outer frame 2132 of the piezoelectric actuator 213, and is composed of an insulating material, such as plastic, for insulation, but not limited thereto, and the conductive sheet 215 is It is made of a conductive material, such as a metal, for electrical conduction, and its shape also corresponds to the outer frame 2132 of the piezoelectric actuator 213, but is not limited thereto. In this embodiment, a conductive pin 2151 may be disposed on the conductive sheet 215 for electrical conduction.

Please refer to FIGS. 5A, 5B, and 5C. FIG. 5A is a front view of the piezoelectric actuator of the preferred embodiment of the present invention, and FIG. 5B is a rear structure of the piezoelectric actuator of the preferred embodiment of the present invention. FIG. 5C is a schematic cross-sectional view showing the piezoelectric actuator of the preferred embodiment of the present invention. As shown in the figure, in the present embodiment, the suspension plate 2131 of the present invention has a stepped surface structure, that is, a convex portion 2131e is further formed on the central portion 2131c of the first surface 2131a of the suspension plate 2131, and the convex portion 2131e is a The circular raised structure is not limited thereto. In some embodiments, the suspension plate 2131 may also be a plate-shaped square that is flat on both sides. As shown in FIG. 5C, the convex portion 2131e of the suspension plate 2131 is coplanar with the first surface 2132c of the outer frame 2132, and the first surface 2131a of the suspension plate 2131 and the first surface 2132a' of the bracket 2132a are also coplanar. In addition, the convex portion 2131e of the suspension plate 2131 and the first surface 2132c of the outer frame 2132 and the first surface 2131a of the suspension plate 2131 and the first surface 2132a' of the bracket 2132a have a specific depth. As for the second surface 2131b of the suspension plate 2131, as shown in FIGS. 5B and 5C, the second surface 2132d of the outer frame 2132 and the second surface 2132a of the bracket 2132a are flat and planar, and the pressure is The electric ceramic plate 2133 is attached to the second surface 2131b of the flat suspension plate 2131. In other embodiments, the shape of the suspension plate 2131 may also be a double-sided flat plate-like square structure, not In this embodiment, the suspension plate 2131, the outer frame 2132, and the bracket 2132a may be integrally formed, and may be composed of a metal plate, for example, may be made of stainless steel. The material is composed of, but not limited to, in this embodiment, the gas pump 21 of the present invention further has at least one gap 2134 between the suspension plate 2131, the outer frame 2132 and the bracket 2132a for gas to pass therethrough.

Next, the internal structure of the gas pump 21 after the assembly is completed, please refer to FIG. 6 and FIG. 7A, and FIG. 6 is a cross-sectional view of the air-cooling heat dissipating device shown in FIG. 2A in the BB section, FIG. 7A. It is a cross-sectional view of the CC cross section shown in Figure 2B. As shown in the figure, the gas pump 21 of the present invention is sequentially stacked from top to bottom by a cover plate 216, an insulating sheet 2142, a conductive sheet 215, an insulating sheet 2141, a piezoelectric actuator 213, a resonator piece 212, and the like. And after the stacked piezoelectric actuator 213, the insulating sheet 2141, the conductive sheet 215, and the other insulating sheet 2142 are glued to form a colloid 218, thereby filling the periphery of the accommodating space 216a of the cover 216. seal. After the assembly, the gas pump 21 is a quadrangular structure, but it is not limited thereto, and its shape may be changed according to actual needs. In addition, in the embodiment, only the conductive pins 2151 (not shown) of the conductive sheet 215 and the conductive pins 2132b of the piezoelectric actuator 213 (shown in FIG. 6 ) are protruded from the cover 216 . In addition, it is convenient to connect to an external power supply, but it is not limited to this. The assembled gas pump 21 forms a first chamber 217b between the cover plate 216 and the resonator piece 212.

After the gas pump 21 is assembled with the carrier substrate 20, as shown in FIG. 3, the side wall 2161 of the cover plate 216 abuts against the lower surface 20b of the carrier substrate 20, and closes the air-conducting end opening 23, and passes through the cover plate. The side wall 2161 of the 216 and the resonator piece 212 collectively define the confluence chamber 217a. Further, as shown in Fig. 6, the opening portion 2163 of the cover plate 216 communicates with the outside, thereby collecting air from the external environment. In this embodiment, the resonator plate 212 of the gas pump 21 of the present invention has a gap g0 between the piezoelectric actuator 213 and the piezoelectric material 213, and the conductive material is filled in the gap g0, for example, conductive adhesive, but not Therefore, the resonance piece 212 and the convex portion 2131e of the suspension plate 2131 of the piezoelectric actuator 213 are maintained at a depth of a gap g0, thereby guiding the airflow to flow more rapidly, and the suspension plate 2131 The convex portion 2131e is kept at an appropriate distance from the resonant piece 212 to reduce the mutual contact interference, thereby causing the noise to decrease. In other embodiments, the height of the outer frame 2132 can be increased by adding the high voltage electric actuator 213. A gap is added when assembling the resonator piece 212, but is not limited thereto. Thereby, when the piezoelectric actuator 213 is driven to perform the air collecting operation, the gas system is first collected by the opening portion 2163 of the cover plate 216 to the confluence chamber 217a, and further flows through the hollow hole 2120 of the resonance piece 212 to the first A chamber 217b is temporarily stored. When the piezoelectric actuator 213 is driven to perform an exhaust operation, the gas system first flows from the first chamber 217b through the hollow hole 2120 of the resonator 212 to the confluence chamber 217a, and flows into the air guide. In the end opening 23, the air flow is exchanged with the heat conduction plate 25.

The operation flow of the gas pump 21 in this case is further described below. Please refer to the drawings 7A to 7D at the same time, wherein the 7B-7D diagram is a schematic diagram of the operation process of the gas pump of the preferred embodiment of the present invention. First, as shown in FIG. 7A, the structure of the gas pump 21 is as described above, in order from the cover plate 216, the other insulating sheet 2142, the conductive sheet 215, the insulating sheet 2141, the piezoelectric actuator 213, and the resonator 212. The stacked assembly is positioned to have a gap g0 between the resonant piece 212 and the piezoelectric actuator 213, and the resonant piece 212 and the side wall 2161 of the cover plate 216 jointly define the confluent chamber 217a on the resonant piece 212 and The piezoelectric actuator 213 has a first chamber 217b between them. When the gas pump 21 has not been driven by the voltage, the position of each element is as shown in Fig. 7A.

Next, as shown in Fig. 7B, when the piezoelectric actuator 213 of the gas pump 21 is vibrated upward by the voltage, the gas enters the gas pump 21 from the opening portion 2163 of the cap plate 216, and is collected into the confluence. The chamber 217a then flows upward into the first chamber 217b via the hollow hole 2120 on the resonator piece 212, and the resonance piece 212 is resonated by the resonance of the suspension plate 2131 of the piezoelectric actuator 213. That is, the resonant piece 212 is deformed upward, that is, the resonant piece 212 is slightly convex upward at the hollow hole 2120.

Thereafter, as shown in FIG. 7C, at this time, the piezoelectric actuator 213 is vibrated downward to the initial position, at which time the convex portion 2131e of the suspension plate 2131 of the piezoelectric actuator 213 is close to the resonance piece 212. The micro-convex portion is upwardly raised at the hollow hole 2120, thereby causing the gas in the gas pump 21 to temporarily accumulate to the upper first chamber 217b.

Further, as shown in FIG. 7D, the piezoelectric actuator 213 vibrates downward again, and the resonance piece 212 is vibrated by the vibration of the piezoelectric actuator 213, and the resonance piece 212 is also vibrated downward. The downward deformation of the resonator piece 212 compresses the volume of the first chamber 217b, thereby causing the gas in the upper half of the first chamber 217b to push to flow to both sides and pass through the gap 2134 of the piezoelectric actuator 213 to circulate downward. And flowing to the hollow hole 2120 of the resonator piece 212 to be compressed and discharged, forming a compressed airflow to the air-conducting end opening 23 of the carrier substrate 20 to dissipate the heat-conducting plate 25. It can be seen from this embodiment that when the resonant piece 212 performs vertical reciprocating vibration, the gap g0 between the resonant piece 212 and the piezoelectric actuator 213 can be increased by the maximum distance of the vertical displacement, in other words, The gap g0 provided between the movable piece 212 and the piezoelectric actuator 213 can cause the resonance piece 212 to generate a larger vertical displacement when it resonates.

Finally, the resonant piece 212 will return to the initial position, that is, as shown in FIG. 7A, and then continue to circulate through the steps 7A to 7D through the aforementioned operation flow, and the gas will continuously pass through the opening portion 2163 of the cover plate 216. The flow enters the confluence chamber 217a, flows into the first chamber 217b, and then flows into the confluence chamber 217a from the first chamber 217b, so that the airflow continuously flows into the air guide opening 23, thereby enabling stable gas transfer. In other words, when the gas pump 21 of the present invention operates, the gas system sequentially flows through the opening portion 2163 of the cover plate 216, the confluence chamber 217a, the first chamber 217b, the confluence chamber 217a, and the air guide opening 23, The gas pump 21 of the present invention can pass through a single component, that is, the cover plate 216, and is designed by using the opening portion 2163 of the cover plate 216, thereby reducing the number of components of the gas pump 21 and simplifying the overall process.

As described above, the gas is introduced into the air-conducting end opening 23 of the carrier substrate 20 by the operation of the gas pump 21, the airflow flows into the gap G, and the heat-conducting plate 25 to which the introduced gas and the electronic component 3 are connected is heated. Exchanging, and continuously pushing the gas in the gap G to flow rapidly, the heat exchanged gas is caused to discharge heat energy to the outside of the gap G, thereby improving the efficiency of heat dissipation cooling, thereby increasing the performance stability and life of the electronic component 3. In addition, by rapidly flowing the gas out of the gap G, the gas convection around the radiator 26 is indirectly increased, and the efficiency of heat dissipation cooling can also be increased.

Please refer to Fig. 8. Fig. 8 is a schematic structural view of the control system of the air-cooling heat dissipating device of the present invention. As shown in the figure, the air-cooling heat dissipating device 2 of the preferred embodiment of the present invention has a temperature control function, and further includes a control system 5, wherein the control system 5 further includes a control unit 51 and a temperature sensor 52, wherein the control unit 51 is It is electrically connected to the gas pump 21 to control the operation of the gas pump 21. The temperature sensor 52 is electrically connected to the control unit 51, and is disposed adjacent to the electronic component 3 for sensing the temperature in the vicinity of the electronic component 3, or directly attached to the electronic component 3 to sense the temperature of the electronic component 3, but not This is limited and the sensing signal can be transmitted to the control unit 51. The control unit 51 determines whether the temperature of the electronic component 3 is higher than a temperature threshold according to the sensing signal of the temperature sensor 52. When the control unit 51 determines that the temperature of the electronic component 3 is higher than the temperature threshold, the control unit 51 issues a The control signal is applied to the gas pump 21 so that the gas pump 21 operates, whereby the gas pump 21 drives the airflow to cool the electronic component 3, and the electronic component 3 is cooled to cool and lower the temperature. When the control unit 51 determines that the temperature of the electronic component 3 is lower than the temperature threshold, a control signal is sent to the gas pump 21 to stop the operation of the gas pump 21, thereby preventing the gas pump 21 from continuing to operate and causing the life. Shorten and reduce the loss of extra energy. Therefore, through the setting of the control system 5, the gas pump 21 of the air-cooling heat sink 2 can be cooled and cooled when the temperature of the electronic component 3 is overheated, and stops after the temperature of the electronic component 3 is lowered, thereby avoiding the gas pump. The continued operation of the Pu 21 results in a shortened life span, reducing the loss of additional energy, and also allowing the electronic component 3 to operate in a preferred temperature environment to improve the stability of the electronic component 3.

In summary, the present invention provides an air-cooling heat dissipating device, which can be applied to various electronic devices to dissipate heat from internal electronic components, improve heat dissipation performance, reduce noise, and stabilize and prolong the performance of electronic components inside electronic devices. life. In addition, the air-cooling heat dissipating device of the present case has a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, improve the heat dissipation performance, and prolong the service life of the air cooling heat dissipating device.

This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.

11‧‧‧Electronic components

12‧‧‧heat transfer board

13‧‧‧thermal adhesive

2‧‧‧Air-cooling heat sink

20‧‧‧Loading substrate

20a‧‧‧ upper surface

20b‧‧‧ lower surface

21‧‧‧ gas pump

212‧‧‧Resonance film

2120‧‧‧ hollow holes

213‧‧‧ Piezoelectric Actuator

2131‧‧‧suspension plate

2131a‧‧‧ first surface

2131b‧‧‧ second surface

2131c‧‧‧ Central Department

2131d‧‧‧The outer part

2131e‧‧‧ convex

2132‧‧‧Front frame

2132a‧‧‧ bracket

2132a’‧‧‧ first surface

2132a”‧‧‧second surface

2132b‧‧‧Electrical pins

2132c‧‧‧ first surface

2132d‧‧‧ second surface

2133‧‧‧ Piezoelectric ceramic plate

2134‧‧‧ gap

2141, 2142‧‧‧Insulation

215‧‧‧Conductor

2151‧‧‧Electrical pins

216‧‧‧ cover

216a‧‧‧ accommodating space

2161‧‧‧ side wall

2162‧‧‧floor

2163‧‧‧ openings

217b‧‧‧ first chamber

217a‧‧ ‧ confluence chamber

218‧‧ ‧ colloid

23‧‧‧ Air conduction opening

24‧‧‧Reflow through slot

25‧‧‧heat transfer plate

25a‧‧ ‧ heat sink

26‧‧‧ radiator

261‧‧‧Base

262‧‧‧ Heat sink

3‧‧‧Electronic components

5‧‧‧Control system

51‧‧‧Control unit

52‧‧‧temperature sensor

G0, G‧‧‧ gap

Figure 1 is a schematic view of the structure of a conventional heat dissipation mechanism. 2A is a schematic structural view of the air-cooling heat dissipating device of the preferred embodiment of the present invention. Fig. 2B is a schematic view showing the structure of the air-cooling heat dissipating device shown in Fig. 2A at another viewing angle. Fig. 3 is a schematic view showing the structure of the air-cooling heat dissipating device shown in Fig. 2A in the AA cross section. 4A and 4B are respectively schematic views showing the decomposition structure of the gas pumped at different viewing angles in the preferred embodiment of the present invention. Fig. 5A is a schematic view showing the front structure of the piezoelectric actuator of the preferred embodiment of the present invention. Fig. 5B is a schematic view showing the structure of the back surface of the piezoelectric actuator of the preferred embodiment of the present invention. Fig. 5C is a schematic cross-sectional view showing the piezoelectric actuator of the preferred embodiment of the present invention. Figure 6 is a cross-sectional view of the air-cooling heat sink shown in Figure 2B taken along the line BB. Fig. 7A is a schematic cross-sectional view of the air-cooling heat dissipating device shown in Fig. 2B in the CC section. 7B to 7D are schematic views of the operation of the gas pumping of the preferred embodiment of the present invention. Figure 8 is a schematic view showing the structure of the control system of the air-cooling heat dissipating device of the preferred embodiment of the present invention.

Claims (12)

An air-cooling heat dissipating device for dissipating heat to an electronic component, the air-cooling heat dissipating device comprising: a carrier substrate comprising an upper surface, a lower surface, an air guiding end opening, and a heat conducting plate, wherein the heat conducting plate is disposed on the An upper surface corresponding to the air-conducting end opening, and the electronic component is disposed on the heat-conducting plate; a gas pumping, the gas pumping is piezoelectrically actuated gas pumping, and is fixed on the carrier substrate a lower surface, and correspondingly closing the air guiding end opening, the gas pump comprises: a resonant piece having a hollow hole; a piezoelectric actuator disposed corresponding to the resonant piece; and a cover plate having a side wall a bottom plate and an opening portion, the side wall is protruded from the bottom of the bottom plate and protrudes from the bottom plate, and forms an accommodation space with the bottom plate, and the resonant piece and the piezoelectric actuator are disposed in the receiving portion In the space, the opening is disposed on the sidewall, the resonant plate and the sidewall of the cover collectively define a confluence chamber; and a heat sink disposed on the electronic component; wherein, the piezoelectric actuator Subject to When the gas gathering operation is performed, the gas system is first collected from the opening portion of the cover plate to the confluence chamber, and then the hollow hole of the resonance piece flows to the first chamber for temporary storage. When the actuator is driven to perform the exhausting operation, the gas system first flows into the air-conducting end opening through the hollow hole of the resonance piece from the first chamber, and heat-exchanges the heat-conducting plate. The air-cooling heat dissipating device of claim 1, wherein the air-conducting end opening of the carrier substrate extends through the upper surface and the lower surface. The air-cooling heat dissipating device of claim 1, wherein the heat conducting plate and the carrier substrate have a gap for airflow. The air-cooling heat dissipating device of claim 1, wherein the heat conducting plate is attached to a surface of the electronic component, and the heat sink is attached to the other surface of the electronic component. The air-cooling heat dissipating device of claim 1, wherein the carrier substrate further comprises at least one recirculation through groove extending through the upper surface and the lower surface and adjacent to the periphery of the heat conduction plate . The air-cooling heat dissipating device of claim 1, wherein the piezoelectric actuator comprises: a suspension plate having a first surface and a second surface; an outer frame having at least one bracket, the at least one bracket connected The suspension plate and the outer frame are disposed between the suspension plate and the outer frame; and a piezoelectric ceramic plate attached to the first surface of the suspension plate for applying a voltage to drive the suspension plate to bend and vibrate . The air-cooling heat sink of claim 6, wherein the resonator has a gap with the piezoelectric actuator. The air-cooling heat dissipating device of claim 6, wherein the bracket, the suspension plate and the outer frame further have at least one gap, and the two ends of the bracket are respectively connected to the outer frame and the suspension plate. The air-cooling heat dissipating device of claim 6, wherein the suspension plate of the gas pump further has a convex portion on the second surface, and the convex portion has a cylindrical structure. The air-cooling heat dissipating device of claim 7, wherein the gas pump further comprises at least one insulating sheet and a conductive sheet, and the at least one insulating sheet and the conductive sheet are sequentially disposed under the piezoelectric actuator . The air-cooling heat dissipating device of claim 10, wherein the piezoelectric actuator outer frame has a conductive pin, the conductive piece has a conductive pin, and the gas pumps the opening of the cover plate The conductive pin of the outer frame and the conductive pin of the conductive sheet protrude outwardly from the opening to protrude from the cover to facilitate connection with an external power source. The air-cooling heat dissipating device of claim 1, further comprising a control system comprising: a control unit electrically connected to the gas pump to control the gas pumping operation; and a temperature sensor Electrically connected to the control unit and adjacent to the electronic component to sense a temperature of the electronic component to output a sensing signal to the control unit; wherein, when the control unit receives the sensing signal, When the temperature of the electronic component is greater than a temperature threshold, the control unit enables the gas pump to drive the airflow, and when the control unit receives the sensing signal, and determines the electronic component When the temperature is below the temperature threshold, the control unit stops the gas pump from operating.