TWI686538B - Air cooling heat dissipation device - Google Patents

Abstract

An air cooling heat dissipation device is disclosed and is for dissipating heat to an electronic device. The air cooling heat dissipation device comprises a diversion carrier, and the diversion carrier comprises a first surface, a second surface, a chamber, an inlet opening, and a plurality of diversion vent grooves, wherein the chamber of the diversion carrier penetrates the first surface and the second surface, the inlet opening is disposed on the first surface and communicates with the chamber. A plurality of diversion vent grooves is disposed on the second surface and communicates with the chamber, and the electronic device is disposed within the chamber. The air cooling heat dissipation device further comprises an air pump, which is disposed on the first surface of the diversion carrier and closes the inlet opening. By driving the air pump, the air flows into the chamber via the inlet opening and makes heat exchanged with the electronic device, and the air is discharged by a plurality of diversion vent grooves after heat exchanged with the electronic device.

Description

Air-cooled heat sink

This case relates to an air-cooled heat dissipation device, especially an air-cooled heat dissipation device that uses a gas pump to provide a driving air flow for heat dissipation.

With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, audio-visual players, etc. have developed towards a trend toward thinner, thinner, portable, and high-efficiency. The limited internal space must be equipped with various high-integration or high-power electronic components. In order to make the electronic device operate faster and more powerful, the electronic components inside the electronic device will generate more heat during operation, and Cause high temperature. In addition, most of these electronic devices are designed to be light, thin, flat and compact, and there is no additional internal space for heat dissipation and cooling. Therefore, electronic components in electronic devices are susceptible to thermal energy and high temperature, which may cause interference or interference. Loss and other issues.

Generally speaking, the heat dissipation methods inside the electronic device can be divided into active heat dissipation and passive heat dissipation. Active heat dissipation usually uses an axial fan or a blast fan installed inside the electronic device, and the air flow is driven by the axial fan or the blast fan to transfer the heat energy generated by the electronic components inside the electronic device to achieve heat dissipation . However, the axial fan and the blast fan will generate large noise during operation, and their large size is not easy to be thin and miniaturized. In addition, the service life of the axial fan and the blast fan is shorter. Therefore, traditional axial fans and blast fans are not suitable for heat dissipation in thin and thin and portable electronic devices.

In addition, many electronic components use surface mount technology (Surface Mount) Technology, SMT), selective soldering (Selective Soldering) and other technologies are soldered on the Printed Circuit Board (PCB). However, the electronic components soldered by the aforementioned soldering method are exposed to high heat and high temperature environment for a long time. , It is easy to make electronic components detached from the printed circuit board, and most electronic components are not resistant to high temperature. If the electronic components are exposed to high heat and high temperature for a long time, the performance stability of the electronic components will be reduced and the life will be shortened.

Figure 1 is a schematic diagram of the structure of a conventional heat dissipation mechanism. As shown in FIG. 1, the conventional heat dissipation mechanism is a passive heat dissipation mechanism, which includes a heat conduction plate 12 which is bonded to an electronic component 11 to be dissipated by a heat conductive adhesive 13 and a heat conductive adhesive 13 and the heat conduction path formed by the heat conduction plate 12 can enable the electronic component 11 to achieve heat dissipation through heat conduction and natural convection. However, the heat dissipation efficiency of the aforementioned heat dissipation mechanism is poor and cannot meet the application requirements.

In view of this, it is necessary to develop an air-cooled heat dissipation device to solve the problems faced by the prior art.

The purpose of this case is to provide an air-cooled heat dissipation device that can be applied to various electronic equipment to circulate heat convection heat to the electronic components inside the electronic equipment, so as to improve the heat dissipation efficiency, reduce noise, and make the electronic components inside the electronic equipment Stable performance and extended service life.

Another object of this case is to provide an air-cooled heat dissipation device that has a temperature control function that can control the operation of the gas pump according to the temperature change of electronic components inside the electronic equipment to improve heat dissipation performance and extend the use of the air-cooled heat dissipation device life.

To achieve the above purpose, one of the broader implementation aspects of this case is to provide an air-cooled heat dissipation device for dissipating heat from electronic components. The air-cooled heat dissipation device includes: a flow guide carrier, including the first table A surface, a second surface, a chamber, an air guide end opening, and a plurality of air guide vents, wherein the chamber penetrates the first surface and the second surface, and the air guide end opening is provided on the first surface and communicates with the chamber, A plurality of deflector exhaust grooves are provided on the second surface and communicate with the chamber, wherein the electronic components are accommodated in the chamber; and the gas pump is provided on the first surface of the deflector carrier and closes the gas guide opening Among them, by driving the gas pump, the air flow is introduced into the chamber through the air guide end opening, and the electronic components are heat exchanged, and the air flow after heat exchange with the electronic components is discharged through a plurality of guide exhaust slots.

To achieve the above purpose, another broader implementation of the present case is to provide an air-cooled heat dissipation device for dissipating heat from electronic components. The air-cooled heat dissipation device includes: a flow guide carrier, including a first surface, a second surface, and a chamber , An air guide end opening and a plurality of guide air exhaust slots, wherein the chamber penetrates the first surface and the second surface, the air guide end opening is provided on the first surface and communicates with the chamber, and a plurality of guide air exhaust slots are provided On the second surface and communicating with the chamber, wherein the electronic component is accommodated in the chamber; the radiator is attached to the electronic component and is located in the chamber; and the gas pump is provided on the first surface of the flow guide carrier, And closing the air guide end opening, wherein the gas pump is driven to introduce the air flow into the chamber through the air guide end opening, and heat exchange is performed on the electronic component, and the air flow after heat exchange with the electronic component is passed through a plurality of guides Exhaust through the exhaust slot.

In order to achieve the above purpose, another broader implementation of the present case is to provide an air-cooled heat dissipation device for dissipating heat from electronic components. The air-cooled heat dissipation device includes: a flow guide carrier, including a first surface, a second surface, and a chamber , An air guide end opening and a plurality of guide air exhaust slots, wherein the chamber penetrates the first surface and the second surface, the air guide end opening is provided on the first surface and communicates with the chamber, and a plurality of guide air exhaust slots are provided It is on the second surface and communicates with the chamber, where the electronic components are accommodated in the chamber; the heat conduction column is attached to the surface of the electronic component and is located in the chamber; and the gas pump is provided on the first side of the flow guide A surface, and the opening of the gas guide end is closed, wherein the gas flow is driven into the chamber through the gas guide end opening by driving the gas pump, and the electron The components perform heat exchange, and the airflow after heat exchange with the electronic components is discharged through a plurality of guide exhaust slots.

11: Electronic components

12: Heat conduction plate

13: Thermal conductive adhesive

2, 2a, 2b, 2c: air-cooled heat sink

20: Diversion carrier

20a: first surface

20b: Second surface

201: chamber

202: air guide opening

203: Diversion exhaust slot

204: side wall

205: exhaust end opening

207: corner

21: Control system

211: Control unit

212: Temperature sensor

22: Gas pump

220: first chamber

221: Air intake plate

221a: Air inlet

221b: busbar hole

221c: central recess

222: Resonance film

222a: movable part

222b: fixed part

2220: Hollow hole

223: Piezo actuator

2231: Suspended board

2231a: convex part

2231b: Second surface

2231c: First surface

2232: Outer frame

2232a: Second surface

2232b: first surface

2232c: conductive pin

2233: Bracket

2233a: Second surface

2233b: First surface

2234: Piezoelectric film

2235: gap

2241, 2242: insulating sheet

225: conductive sheet

225a: conductive pin

25: radiator

251: Base

252: Heat sink

26: Heat transfer column

3: Electronic components

4: carrier substrate

Figure 1 is a schematic structural view of a conventional heat dissipation mechanism.

FIG. 2A is a schematic structural diagram of the air-cooled heat dissipation device according to the first embodiment of the present invention.

FIG. 2B is a schematic structural view of the air-cooled heat dissipation device shown in FIG. 2A in the AA section.

Figure 3 is a schematic diagram of the structure of the diversion carrier shown in Figure 2A.

FIG. 4 is a schematic structural diagram of an air-cooled heat dissipation device according to the second embodiment of the present invention.

FIG. 5 is a schematic structural diagram of an air-cooled heat dissipation device according to a third embodiment of the present invention.

Figures 6A and 6B are respectively schematic diagrams of the exploded structure of the gas pump according to the preferred embodiment of the present invention at different viewing angles.

FIG. 7 is a schematic sectional view of the piezoelectric actuator shown in FIGS. 6A and 6B.

Figure 8 is a schematic diagram of the cross-sectional structure of the gas pump shown in Figures 6A and 6B.

9A to 9E are flow structure diagrams of the gas pump operation shown in FIGS. 6A and 6B.

FIG. 10 is a schematic structural diagram of an air-cooled heat dissipation device according to the fourth embodiment of the present invention.

Some typical embodiments embodying the characteristics and advantages of this case will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different forms, and they all do not deviate from the scope of this case, and the descriptions and illustrations therein are essentially used for explanation, not for limiting the case.

Figure 2A is a schematic structural diagram of the air-cooled heat dissipation device of the first embodiment of the present case, and Figure 2B is The structure diagram of the air-cooled heat dissipation device shown in FIG. 2A at the AA cross section, and FIG. 3 is the structure diagram of the diversion carrier shown in FIG. 2A. As shown in Figures 2A, 2B, and 3, the air-cooled heat dissipation device 2 of this case can be applied to an electronic device, such as but not limited to a portable computer, tablet computer, industrial computer, portable communication device, audio-visual player, In order to dissipate the electronic components 3 to be dissipated in the electronic equipment. The air-cooled heat dissipation device 2 in this case includes a flow guide carrier 20 and a gas pump 22. The flow guiding carrier 20 includes a first surface 20a, a second surface 20b, a chamber 201, a gas guiding end opening 202, and a plurality of flow guiding exhaust grooves 203, wherein the chamber 201 penetrates the first surface 20a and the second surface 20b, The gas guide opening 202 is provided on the first surface 20 a and communicates with the chamber 201. A plurality of deflector exhaust grooves 203 are provided on the second surface 20b for gas circulation, wherein one end of each deflector exhaust groove 203 communicates with the chamber 201, and each of the deflector exhaust grooves 203 The other end extends to the side wall 204 of the flow guiding carrier 20 and communicates with the outside, whereby the side wall 204 of the flow guiding carrier 20 forms a plurality of exhaust end openings 205. The cavity 201 of the diversion carrier 20 houses the electronic component 3. The gas pump 22 is fixed on the first surface 20a of the flow guiding carrier 20, and is assembled and positioned at the gas guiding end opening 202, and closes the gas guiding end opening 202. By driving the gas pump 22, the gas flow is introduced into the cavity 201 of the flow guide carrier 20 through the gas guide end opening 202 and the heat exchange is performed on the electronic component 3, and the gas flow after heat exchange with the electronic component 3 is passed A plurality of deflector exhaust slots 203 are discharged to achieve heat dissipation of the electronic component 3.

In some embodiments, the diversion carrier 20 may be, but not limited to, a frame. In this embodiment, the gas guide opening 202 is located in the central area of the first surface 20a. The electronic component 3 is disposed on a carrier substrate 4, where the carrier substrate 4 can be, but is not limited to, a printed circuit board. The carrier substrate 4 is connected to the second surface 20 b of the flow guide carrier 20, and the electronic component 3 is accommodated in the chamber 201 of the flow guide carrier 20. A plurality of deflector exhaust grooves 203 are provided on the second surface 20b and extend outward in a radial manner. In some embodiments, the exhaust end opening 205 formed at the other end of the plurality of deflector exhaust slots 20 a is located on the plurality of sides of the diversion carrier 20 The wall 204 and the plurality of corners 207 can make the air flow discharged around the periphery of the guide carrier 20.

In this embodiment, the gas pump 22 is a piezoelectrically actuated gas pump to drive the gas flow. The gas pump 22 is fixed on the first surface 20a of the flow guiding carrier 20, and is assembled and positioned at the gas guiding end opening 202, and closes the gas guiding end opening 202. The carrier substrate 4 is attached to the second surface 20b of the diversion carrier 20, in other words, the combined system cover of the diversion carrier 20 and the gas pump 22 is bonded to the carrier substrate 4, and the electronic component 3 is accommodated in the The fluid carrier 20 is in the chamber 201. By closing the gas guide end opening 202 by the gas pump 22 and the carrier substrate 4, the gas guide end opening 202, the chamber 201, and the plurality of guide gas exhaust grooves 203 can be defined to form a closed flow channel, thereby focusing on the electron Element 3 dissipates heat to improve the heat dissipation efficiency. It should be emphasized that this case is not limited to the formation of closed flow channels, and other flow channel forms can also be adjusted and changed according to actual application requirements. Of course, in another embodiment (not shown), the diversion carrier 20 may also be provided with an accommodating portion at the periphery of the air-guiding end opening 202, which means that the accommodating portion is a groove recessed inwardly of the first surface 20a At the periphery of the air guide end opening 202, the gas pump 22 is directly assembled on the accommodating portion to close the air guide end opening 202, and the heat dissipation effect of the air-cooled heat dissipation device 2 can also be implemented. In this way, the design in which the gas pump 22 is concavely assembled in the accommodating portion reduces the overall height of the air-cooling heat dissipation device 2 and can achieve the effect of thinning and thinning.

In the present embodiment, the gas pump 22 is used to drive the gas flow, so that the gas is introduced into the chamber 201 from the outside of the air-cooled heat dissipation device 2 through the gas guide opening 202. When the gas pump 22 introduces the gas into the chamber 201, the introduced gas exchanges heat with the electronic component 3 in the chamber 201, and promotes the rapid flow of the gas flow in the chamber 201, so that the heat flow after the heat exchange will guide the heat energy through the guide The plurality of deflector exhaust slots 203 of the flow carrier 20 are discharged to the outside of the air-cooled heat sink 2. Since the gas pump 22 is continuously operated to introduce gas, the electronic component 3 can perform heat exchange with the continuously introduced gas, and at the same time, the heat-exchanged gas is discharged through the plurality of guide exhaust grooves 203 of the guide carrier 20. Thereby, the heat dissipation of the electronic component 3 can be realized, and the Improve the heat dissipation efficiency, thereby increasing the performance stability and life of the electronic component 3.

FIG. 4 is a schematic cross-sectional structure diagram of an air-cooled heat dissipation device according to the second embodiment of the present invention. As shown in FIG. 4, the air-cooled heat dissipation device 2a of this embodiment is similar to the air-cooled heat dissipation device 2 shown in FIG. 2B, and the same element numbers represent the same structure, elements, and functions, and are not repeated here. Compared with the air-cooled heat dissipation device 2 shown in FIG. 2B, the air-cooled heat dissipation device 2 a of this embodiment further includes a heat sink 25 connected to the surface of the electronic component 3 and located in the chamber 201. The heat sink 25 includes a base 251 and a plurality of heat sinks 252, the base 251 is attached to the surface of the electronic component 3, and the plurality of heat sinks 252 are vertically connected to the base 251. With the arrangement of the heat sink 25, the heat dissipation area can be increased, so that the heat energy generated by the electronic component 3 can exchange heat with the gas introduced into the chamber 201 through the heat sink 25 to improve the heat dissipation performance.

FIG. 5 is a schematic cross-sectional structural diagram of an air-cooled heat dissipation device according to a third embodiment of the present invention. As shown in FIG. 5, the air-cooled heat dissipation device 2b of this embodiment is similar to the air-cooled heat dissipation device 2 shown in FIG. 2B, and the same component numbers represent the same structure, components, and functions, and are not repeated here. Compared with the air-cooled heat dissipation device 2 shown in FIG. 2B, the air-cooled heat dissipation device 2b of this embodiment includes a heat conducting pipe column 26 connected to the surface of the electronic component 3 and located in the chamber 201. The heat pipe column 26 is attached to the surface of the electronic component 3, and the heat pipe column 26 is made of a heat conductive material with a high thermal conductivity. In some embodiments, one end of the heat conducting tube 26 extends from the side wall 204 of the guide carrier 20 to the outside of the guide carrier 20 for heat exchange, and the other end of the heat conducting tube 26 extends to the surface of the electronic component 3 The element 3 is in contact. With the arrangement of the heat transfer pipe column 26, the heat energy generated by the electronic component 3 can be exchanged with the gas in the chamber 201 through the heat transfer pipe column 26 more quickly to improve the heat dissipation performance.

Figures 6A and 6B are respectively schematic diagrams of the exploded structure of the gas pump according to the preferred embodiment of the present invention at different viewing angles, Figure 7 is a schematic sectional view of the piezoelectric actuator shown in Figures 6A and 6B, and Figure 8 It is a schematic diagram of the cross-sectional structure of the gas pump shown in FIGS. 6A and 6B. As shown in Figures 6A, 6B, 7 and 8, the gas pump 22 is a piezoelectrically actuated gas pump, And includes the intake plate 221, the resonance sheet 222, the piezoelectric actuator 223, the insulating sheet 2241, 2242 and the conductive sheet 225 and other structures, wherein the piezoelectric actuator 223 is provided corresponding to the resonance sheet 222, and the intake air The board 221, the resonance sheet 222, the piezoelectric actuator 223, the insulating sheet 2241, the conductive sheet 225, and the other insulating sheet 2242 are stacked in this order. The assembled cross-sectional view is shown in FIG.

In this embodiment, the air inlet plate 221 has at least one air inlet hole 221a. The number of the air inlet holes 221a is preferably four, but not limited thereto. The air inlet hole 221a penetrates through the air inlet plate 221 for the gas to flow into the gas pump 22 from the at least one air inlet hole 221a in compliance with the atmospheric pressure from outside the device. The air inlet plate 221 has at least one bus bar hole 221b for correspondingly positioning the at least one air inlet hole 221a on the other surface of the air inlet plate 221. A central recessed portion 221c is provided at the central communication point of the busbar hole 221b, and the central recessed portion 221c communicates with the busbar hole 221b, thereby guiding and converging the gas entering the busbar hole 221b from the at least one inlet hole 221a Concentrate to the central recess 221c to achieve gas transfer. In this embodiment, the air inlet plate 221 has an integrally formed air inlet hole 221a, a bus bar hole 221b, and a central recess 221c, and a confluent chamber for a confluent gas is formed at the central recess 221c for temporary storage of gas . In some embodiments, the material of the air inlet plate 221 may be, for example, but not limited to, stainless steel. In some other embodiments, the depth of the confluence chamber formed by the central recess 221c is the same as the depth of the confluence hole 221b, but it is not limited thereto. The resonant sheet 222 is made of a flexible material, but not limited to this, and has a hollow hole 2220 on the resonant sheet 222, which is provided corresponding to the central concave portion 221c of the air intake plate 221 to allow gas to circulate . In other embodiments, the resonance plate 222 may be made of a copper material, but not limited to this.

The piezoelectric actuator 223 is assembled by a suspension plate 2231, an outer frame 2232, at least one bracket 2233, and a piezoelectric sheet 2234, wherein the piezoelectric sheet 2234 is attached to the first of the suspension board 2231 The surface 2231c is used to apply voltage to generate deformation to drive the suspension board 2231 bending vibration, and the at least one bracket 2233 is connected between the suspension plate 2231 and the outer frame 2232. In this embodiment, the bracket 2233 is connected between the suspension plate 2231 and the outer frame 2232 at both ends They are respectively connected to the outer frame 2232 and the suspension plate 2231 to provide elastic support, and further have at least one gap 2235 between the bracket 2233, the suspension plate 2231 and the outer frame 2232, and the at least one gap 2235 is connected to the air guide end opening 202 Connected for gas circulation. It should be emphasized that the type and number of the suspension board 2231, the outer frame 2232, and the bracket 2233 are not limited to the foregoing embodiments, and may vary according to actual application requirements. In addition, the outer frame 2232 is disposed around the outer side of the suspension board 2231, and has a conductive pin 2232c protruding outward for power connection, but not limited thereto.

The floating plate 2231 is a stepped surface structure (as shown in FIG. 7), which means that the second surface 2231b of the floating plate 2231 further has a convex portion 2231a. The convex portion 2231a may be, but not limited to, a circle Raised structure. The convex portion 2231a of the suspension plate 2231 is coplanar with the second surface 2232a of the outer frame 2232, and the second surface 2231b of the suspension plate 2231 and the second surface 2233a of the bracket 2233 are also coplanar, and the convex portion of the suspension plate 2231 There is a specific depth between 2231a and the second surface 2232a of the outer frame 2232, the second surface 2231b of the suspension board 2231 and the second surface 2232a of the bracket 2233. The first surface 2231c of the suspension board 2231, the first surface 2232b of the outer frame 2232 and the first surface 2233b of the bracket 2233 are flat coplanar structures, and the piezoelectric sheet 2234 is attached to the flat suspension board 2231 At the first surface 2231c. In some other embodiments, the shape of the suspension board 2231 may also be a flat square structure with two sides flat, which is not limited thereto, and can be changed according to the actual application situation. In some embodiments, the suspension board 2231, the bracket 2233, and the outer frame 2232 can be an integrally formed structure, and can be composed of a metal plate, such as but not limited to stainless steel. In other embodiments, the side length of the piezoelectric sheet 2234 is smaller than the side length of the floating plate 2231. In some other embodiments, the side length of the piezoelectric sheet 2234 is equal to the side length of the suspension plate 2231, and is also designed as a square plate-like structure corresponding to the suspension plate 2231, but Not limited to this.

The insulating sheet 2241, the conductive sheet 225, and the other insulating sheet 2242 of the gas pump 22 are sequentially disposed under the piezoelectric actuator 223, and their shapes generally correspond to the outer frame 2232 of the piezoelectric actuator 223. Shape. In some embodiments, the insulating sheets 2241 and 2242 are made of insulating materials, such as but not limited to plastic, to provide an insulating function. In other embodiments, the conductive sheet 225 may be made of a conductive material, such as but not limited to a metal material, to provide an electrical conduction function. In this embodiment, a conductive pin 225a can also be provided on the conductive sheet 225 to achieve the electrical conduction function.

In this embodiment, the gas pump 22 is formed by sequentially stacking an air intake plate 221, a resonance plate 222, a piezoelectric actuator 223, an insulating plate 2241, a conductive plate 225, another insulating plate 2242, etc., and There is a gap h between the resonance plate 222 and the piezoelectric actuator 223. In this embodiment, a gap h is filled in the gap h between the circumference of the outer frame 2232 of the resonance plate 222 and the piezoelectric actuator 223 Filling material, such as, but not limited to, conductive glue, so that the depth of the gap h can be maintained between the resonance piece 222 and the convex portion 2231a of the floating plate 2231 of the piezoelectric actuator 223, which can guide the air flow to flow more quickly, And because the convex portion 2231a of the floating plate 2231 and the resonance sheet 222 are kept at an appropriate distance, the contact interference between them is reduced, and the noise generation can be reduced. In other embodiments, the height of the outer frame 2232 of the high-voltage electric actuator 223 can also be increased to increase a gap when it is assembled with the resonance plate 222, but not limited to this.

In this embodiment, the resonator plate 222 has a movable portion 222a and a fixed portion 222b. When the intake plate 221, the resonator plate 222 and the piezoelectric actuator 223 are assembled in sequence, the movable portion 222a can be connected to the movable portion 222a. The air inlet plate 221 forms a chamber for the confluent gas, and a first chamber 220 is formed between the resonance plate 222 and the piezoelectric actuator 223 for temporarily storing the gas, and the first chamber 220 is The cavity 2220 of the resonance plate 222 communicates with the cavity at the central recess 221c of the air intake plate 221, and the two sides of the first cavity 220 are separated by the gap 2235 between the bracket 2233 of the piezoelectric actuator 223 And with the gas guide opening 202 disposed under it Connected.

9A to 9E are flow structure diagrams of the gas pump operation shown in FIGS. 6A and 6B. Please refer to Fig. 8, Fig. 9A to Fig. 9E, the operation process of the gas pump in this case is briefly described as follows. When the gas pump 22 is actuated, the piezoelectric actuator 223 is actuated by a voltage and uses the bracket 2233 as a fulcrum to perform a reciprocating vibration in the vertical direction. As shown in FIG. 9A, when the piezoelectric actuator 223 is actuated by a voltage and vibrates downward, since the resonator plate 222 is a light and thin sheet-like structure, when the piezoelectric actuator 223 vibrates, The resonance plate 222 will also resonate and perform vertical reciprocating vibration, that is, the portion of the resonance plate 222 corresponding to the central concave portion 221c will also be deformed by bending vibration, that is, the portion corresponding to the central concave portion 221c is the movable of the resonance plate 222 The portion 222a is that when the piezoelectric actuator 223 bends and vibrates downward, the movable portion 222a corresponding to the central concave portion 221c of the resonance piece 222 at this time is driven by the entrainment and pushing of the gas and the vibration of the piezoelectric actuator 223 As the piezoelectric actuator 223 bends and vibrates downwards, the gas enters through the at least one air inlet hole 221a on the air inlet plate 221 and passes through the at least one bus bar hole 221b to be collected at the central central recess 221c Then, it flows down into the first chamber 220 through the hollow hole 2220 provided on the resonance sheet 222 corresponding to the central concave portion 221c. Thereafter, due to the vibration of the piezoelectric actuator 223, the resonance plate 222 will also resonate and perform vertical reciprocating vibration. As shown in FIG. 9B, the movable portion 222a of the resonance plate 222 will also follow Vibrate downward and attach to the convex portion 2231a of the floating plate 2231 of the piezoelectric actuator 223, so that the area between the area other than the convex portion 2231a of the floating plate 2231 and the fixed portions 222b on both sides of the resonance plate 222 The spacing of the chambers will not become smaller, and by the deformation of the resonance plate 222, the volume of the first chamber 220 is compressed, and the intermediate circulation space of the first chamber 220 is closed, so that the gas in it is pushed to both sides The flow then passes through the gap 2235 between the supports 2233 of the piezoelectric actuator 223 and traverses the flow downward. After that, as shown in FIG. 9C, the movable portion 222a of the resonance piece 222 bends and vibrates upward, and returns to the initial position, and the piezoelectric actuator 223 is driven by a voltage to vibrate upward, thus also squeezing the first chamber 220 However, at this time, because the piezoelectric actuator 223 is lifted upwards, the gas in the first chamber 220 will flow toward both sides, thereby driving the gas continuously from at least one inlet hole on the inlet plate 221 221a enters and then flows into the cavity formed by the central recess 221c. Then, as shown in FIG. 9D, the resonant plate 222 is resonated upward by the vibration of the piezoelectric actuator 223 lifting upward. At this time, the movable portion 222a of the resonant plate 222 also vibrates upward accordingly, thereby slowing the continuous self-inflow of gas At least one air inlet hole 221a on the gas plate 221 enters and then flows into the cavity formed by the central recess 221c. Finally, as shown in FIG. 9E, the movable portion 222a of the resonance piece 222 also returns to the initial position. It can be seen from the implementation form that when the resonator plate 222 performs vertical reciprocating vibration, the maximum distance of the vertical displacement can be increased by the gap h between it and the piezoelectric actuator 223. In other words, the two The gap h between the structures can cause the resonance plate 222 to move up and down more greatly when resonating. Therefore, a pressure gradient is generated in the design of the flow path through the gas pump 22, so that the gas flows at a high speed, and through the difference in impedance of the flow path in and out direction, the gas is transmitted from the suction end to the discharge end to complete the gas delivery operation. Even in the state of air pressure at the discharge end, it still has the ability to continue to push the gas into the gas guide chamber 23a, and can achieve the effect of mute, so repeating the operation of the gas pump 22 in FIGS. 9A to 9E, you can make The gas pump 22 produces a gas transmission from outside to inside.

As mentioned above, through the action of the above-mentioned gas pump 22, the gas is introduced into the chamber 201 of the diversion carrier 20, so that the introduced gas exchanges heat with the electronic component 3, and the gas in the chamber 201 flows quickly to promote The heat-exchanged gas discharges the heat energy to the outside of the air-cooled heat dissipation device 2 through the plurality of diversion exhaust slots 203 of the diversion carrier 20, thereby improving the efficiency of heat dissipation and cooling, and thereby increasing the performance stability of the electronic component 3 And life.

FIG. 10 is a schematic diagram of the structure of an air-cooled heat dissipation device according to the third preferred embodiment of the present invention. As shown in FIG. 10, the air-cooled heat dissipation device 2c of this embodiment is similar to the air-cooled heat dissipation device 2 shown in FIG. 2B, and the same element numbers represent the same structure, elements, and functions, and are not repeated here. Compared with the air-cooled heat sink 2 shown in FIG. 2B, the air-cooled heat sink of this embodiment 2c has a temperature control function, which further includes a control system 21 including a control unit 211 and a temperature sensor 212, wherein the control unit 21 is electrically connected to the gas pump 22 to control the operation of the gas pump 22 . The temperature sensor 212 is disposed in the chamber 201 of the diversion carrier 20 and is adjacent to the electronic component 3 for sensing the temperature of the electronic component 3. The temperature sensor 212 is electrically connected to the control unit 21, senses the temperature near the electronic component 3, or directly attached to the electronic component 3 to sense the temperature of the electronic component 3, and transmits the sensing signal to the control unit 211. The control unit 211 determines whether the temperature of the electronic component 3 is higher than a temperature threshold according to the sensing signal of the temperature sensor 212. When the control unit 211 determines that the temperature of the electronic component 3 is higher than the temperature threshold, it sends out a The control signal is sent to the gas pump 22 to enable the gas pump 22 to operate, thereby enabling the gas pump 22 to drive the air flow to dissipate heat and cool the electronic component 3 so as to cool the electronic component 3 and reduce the temperature. When the control unit 211 determines that the temperature of the electronic component 3 is lower than the temperature threshold, it sends a control signal to the gas pump 22 to stop the operation of the gas pump 22, thereby avoiding the continuous operation of the gas pump 22 and resulting in life Shorten, reduce the consumption of extra energy. Therefore, through the setting of the control system 21, the gas pump 22 of the air-cooled heat dissipation device 2 can perform heat dissipation and cooling when the temperature of the electronic component 3 is overheated, and stop operation after the temperature of the electronic component 3 decreases, thereby avoiding the gas pump The continuous operation of the Pu 22 leads to a shortened life span and reduced consumption of additional energy. It can also enable the electronic component 3 to operate in a better temperature environment and improve the stability of the electronic component 3.

In summary, this case provides an air-cooled heat dissipation device, which can be applied to various electronic equipment to dissipate heat to its internal electronic components, so as to improve the heat dissipation efficiency, reduce noise, and stabilize the performance of electronic components inside the electronic equipment and extend the use life. In addition, the air-cooled heat dissipation device in this case has a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic equipment, so as to improve the heat dissipation performance and extend the service life of the heat dissipation device.

This case must be modified by anyone familiar with this technology, such as Shi Jiangsi, but none of them are as protected as the scope of the patent application.

2: Air-cooled heat sink

20: Diversion carrier

20a: first surface

20b: first surface

201: chamber

202: air guide opening

203: Diversion exhaust slot

204: side wall

205: exhaust end opening

22: Gas pump

3: Electronic components

4: carrier substrate

Claims (9)

An air-cooled heat dissipation device is used for dissipating heat of an electronic component. The air-cooled heat dissipation device includes: a flow guide carrier, including a first surface, a second surface, a chamber, an air guide end opening, and a plurality of guides A gas exhaust groove, wherein the chamber penetrates the first surface and the second surface, the air guide end opening is provided on the first surface and communicates with the chamber, and the plurality of air guide exhaust grooves are provided on the The second surface communicates with the chamber, wherein the electronic component is accommodated in the chamber; and a gas pump is disposed on the first surface of the flow guide carrier and closes the gas guide end opening, the The gas pump is a piezoelectrically actuated gas pump. The piezoelectrically actuated gas pump further includes: an air inlet plate having at least one air inlet hole, at least one busbar hole, and a center forming a busbar chamber A concave portion, wherein the at least one air inlet hole is for introducing airflow, the busbar hole corresponds to the air inlet hole, and guides the airflow of the air inlet hole to converge to the confluence chamber formed by the central concave portion; The hollow hole corresponds to the confluence chamber, and a surrounding portion of the hollow hole is a movable part; and a piezoelectric actuator, which is provided corresponding to the resonant plate, and includes: a suspension plate having a first surface and a A second surface, which can bend and vibrate; an outer frame surrounding the outer side of the suspension plate; at least one bracket connected between the suspension plate and the outer frame to provide elastic support; and a piezoelectric sheet having One side length, the side length is less than or equal to one side length of the suspension plate, and the piezoelectric sheet is attached to the first surface of the suspension plate for applying voltage to drive the suspension plate bending vibration; Wherein, a gap is formed between the resonant plate and the piezoelectric actuator to form a cavity, so that when the piezoelectric actuator is driven, air flow is introduced from the at least one air inlet hole of the air inlet plate, Gather through the at least one busbar hole to the central recess, and then flow through the hollow hole of the resonant plate to enter the chamber, and the piezoelectric actuator and the movable portion of the resonant plate generate resonance transmission air flow; The gas pump is driven to introduce a gas flow into the chamber through the gas guide end opening and perform heat exchange on the electronic component, and the gas flow after heat exchange with the electronic component is exhausted through the plurality of flow guides The slot is discharged. The air-cooled heat dissipation device as described in item 1 of the patent application scope further includes a carrier substrate connected to the second surface of the flow guide carrier, wherein the electronic component is disposed on the carrier substrate. According to the air-cooling heat dissipation device described in item 2 of the patent application scope, the flow guiding carrier is further provided with an accommodating portion, which is a groove recessed inwardly on the first surface, and the gas pump is opened around the opening of the air guiding end It is directly assembled on the accommodating part, and closes the opening of the gas guide end. The air-cooled heat dissipation device as described in item 1 of the patent application scope, wherein the diversion carrier is a frame body. The air-cooled heat dissipation device as described in item 1 of the patent application scope, wherein the suspension plate is a square suspension plate and has a convex portion. An air-cooled heat dissipation device as described in item 1 of the patent application scope, wherein the piezoelectrically actuated gas pump includes a conductive sheet, a first insulating sheet, and a second insulating sheet, wherein the air inlet plate and the resonant sheet The piezoelectric actuator, the first insulating sheet, the conductive sheet and the second insulating sheet are stacked in sequence. The air-cooled heat dissipation device as described in item 1 of the scope of the patent application further includes a control system including: A control unit electrically connected to the gas pump to control the operation of the gas pump; and a temperature sensor electrically connected to the control unit and adjacent to the electronic component to sense a temperature of the electronic component To output a sensing signal to the control unit; wherein, when the control unit receives the sensing signal and determines that the temperature of the electronic component is greater than a temperature threshold, the control unit enables the gas pump To drive the air flow, and when the control unit receives the sensing signal and determines that the temperature of the electronic component is lower than the temperature threshold, the control unit stops the gas pump. An air-cooled heat dissipation device is used for dissipating heat of an electronic component. The air-cooled heat dissipation device includes: a flow guide carrier, including a first surface, a second surface, a chamber, an air guide end opening, and a plurality of guides A gas exhaust groove, wherein the chamber penetrates the first surface and the second surface, the air guide end opening is provided on the first surface and communicates with the chamber, and the plurality of air guide exhaust grooves are provided on the The second surface is in communication with the chamber, wherein the electronic component is housed in the chamber; a heat sink attached to the electronic component is located in the chamber; and a gas pump is provided on the guide The first surface of the flow carrier and closing the opening of the gas conducting end, the gas pump is a piezoelectric actuated gas pump, the piezoelectric actuated gas pump further includes: an air inlet plate with at least one inlet The air hole, at least one busbar hole and a central recess forming a busbar chamber, wherein the at least one air inlet hole is used for introducing airflow, the busbar hole corresponds to the air inlet hole, and guides the airflow of the air inlet hole to converge to The confluence chamber constituted by the central recess; a resonant sheet having a hollow hole corresponding to the confluence chamber, and a movable portion around the hollow hole; and a piezoelectric actuator, which is in phase with the resonant sheet Corresponding settings, including: A suspension board, having a first surface and a second surface, and capable of flexing and vibrating; an outer frame is disposed around the outer side of the suspension board; at least one bracket is connected between the suspension board and the outer frame to Provide elastic support; and a piezoelectric sheet having a side length that is less than or equal to one side length of the suspension plate, and the piezoelectric sheet is attached to the first surface of the suspension plate for applying voltage To drive the flexural vibration of the suspension plate; wherein, there is a gap between the resonant plate and the piezoelectric actuator to form a cavity, so that when the piezoelectric actuator is driven, the air flow is caused by the air inlet plate The at least one air inlet hole is introduced, collected at the central recess through the at least one busbar hole, and then flows through the hollow hole of the resonant plate to enter the cavity. The piezoelectric actuator and the resonant plate The movable part generates resonance transmission airflow; by driving the gas pump, the airflow is introduced into the chamber through the air guide end opening, and heat exchange is performed on the electronic component, and the airflow after heat exchange with the electronic component It is discharged through the plurality of deflector exhaust grooves. An air-cooled heat dissipation device is used for dissipating heat of an electronic component. The air-cooled heat dissipation device includes: a flow guide carrier, including a first surface, a second surface, a chamber, an air guide end opening, and a plurality of guides A gas exhaust groove, wherein the chamber penetrates the first surface and the second surface, the air guide end opening is provided on the first surface and communicates with the chamber, and the plurality of air guide exhaust grooves are provided on the The second surface is in communication with the chamber, wherein the electronic component is accommodated in the chamber; a thermally conductive column attached to the surface of the electronic component and located in the chamber; and a gas pump, provided On the first surface of the flow guiding carrier, and closing the opening of the gas guiding end, the gas pump is a piezoelectrically actuated gas pump, and the piezoelectrically actuated gas pump further includes Including: an air inlet plate with at least one air inlet hole, at least one busbar hole and a central recess forming a busbar chamber, wherein the at least one air inlet hole is used to introduce airflow, and the busbar hole corresponds to the air inlet hole , And guide the airflow of the air inlet to the confluence chamber formed by the central recess; a resonant sheet having a hollow hole corresponding to the confluence chamber, and a movable portion around the hollow hole; and a The piezoelectric actuator is provided corresponding to the resonant sheet, and includes: a suspension plate having a first surface and a second surface, which can be bent and vibrated; an outer frame surrounding the outer side of the suspension plate; At least one bracket connected between the suspension plate and the outer frame to provide elastic support; and a piezoelectric plate having a side length that is less than or equal to one side length of the suspension plate, and the piezoelectric plate It is attached to the first surface of the suspension plate to apply voltage to drive the suspension plate to vibrate; wherein, a cavity is formed between the resonant plate and the piezoelectric actuator to form a cavity, so that the When the piezoelectric actuator is driven, the air flow is introduced from the at least one air inlet hole of the air inlet plate, collects to the central concave portion through the at least one busbar hole, and then flows through the hollow hole of the resonant sheet, to Entering the chamber, the piezoelectric actuator and the movable part of the resonant plate generate a resonance transmission airflow; by driving the gas pump, the airflow is introduced into the chamber through the air guide end opening, and the electron The components exchange heat, and the airflow after heat exchange with the electronic components is discharged through the plurality of deflector exhaust slots.

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