TWM544195U - Air-cooling heat dissipation device - Google Patents

Description

Air cooling device

The present invention relates to an air-cooling heat dissipating device, and more particularly to an air-cooling heat dissipating device that uses a gas pump to provide a driving airflow for heat dissipation.

With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, video players, etc. have been trending toward thin, portable, high-performance, and these electronic devices are In the limited internal space, various high-accumulation or high-power electronic components must be configured. In order to make the electronic device faster and more powerful, the electronic components inside the electronic device will generate more heat during operation, and Causes high temperatures. In addition, most of these electronic devices are designed to be thin, flat, and compact, and have no additional internal space for heat dissipation. Therefore, electronic components in electronic devices are susceptible to heat and high temperatures, which may cause interference or interference. Damage and other issues.

Generally speaking, the heat dissipation method inside the electronic device can be divided into active heat dissipation and passive heat dissipation. The active heat dissipation is usually disposed inside the electronic device by using an axial fan or a blower fan, and the airflow is driven by the axial fan or the blower fan to transfer the heat energy generated by the electronic components inside the electronic device to achieve heat dissipation. . However, axial fans and blower fans generate large noise during operation, and their bulk is not easy to be thinner and smaller, and axial fans and blower fans have a shorter service life. Therefore, the traditional axial flow fan and the blower fan are not suitable for heat dissipation in thin and light portable and portable electronic devices.

Furthermore, many electronic components are soldered to a printed circuit board (PCB) using techniques such as Surface Mount Technology (SMT) and Selective Soldering, but soldered by the soldering method described above. The electronic components are easily separated from the printed circuit board after being in a high thermal energy and high temperature environment for a long time, and most of the electronic components are not resistant to high temperatures. If the electronic components are in a high heat and high temperature environment for a long time, It is easy to cause the performance stability of electronic components to decrease and the lifespan to be shortened.

Figure 1 is a schematic view of the structure of a conventional heat dissipating mechanism. As shown in FIG. 1 , the conventional heat dissipating mechanism is a passive heat dissipating mechanism, and includes a heat conducting plate 12 which is bonded to an electronic component 11 to be dissipated by a thermal conductive adhesive 13 to conduct heat. The heat conduction path formed by the glue 13 and the heat conduction plate 12 allows the electronic component 11 to dissipate heat by heat conduction and natural convection. However, the heat dissipation mechanism of the foregoing heat dissipation mechanism is inferior and cannot meet the application requirements.

In view of this, it is necessary to develop an air-cooling heat sink to solve the problems faced by the prior art.

The purpose of the present invention is to provide an air-cooling heat dissipating device, which can be applied to various electronic devices to dissipate heat from electronic components inside the electronic device, improve heat dissipation performance, reduce noise, and stabilize and extend the performance of electronic components inside the electronic device. Service life.

Another object of the present invention is to provide an air-cooling heat dissipating device having a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, improve the heat dissipation performance, and prolong the use of the air cooling device. life.

In order to achieve the above object, the present invention provides an air-cooling heat dissipating device for dissipating heat from an electronic component, the air-cooling heat dissipating device comprising: a carrier, including an air flow passage, an air-conducting end opening and an exhaust end opening, wherein the carrier covers the electronic component and Having the electronic component in the airflow passage; and gas pumping, comprising: a resonator having a hollow hole; a piezoelectric actuator disposed corresponding to the resonator; and a cover having a side wall, a bottom plate, and an opening, the side wall Surrounding the periphery of the bottom plate, protruding from the bottom plate and forming an accommodating space with the bottom plate, and the resonant piece and the piezoelectric actuator are disposed in the accommodating space, and the opening portion is disposed on the side wall, wherein the bottom plate of the cover plate and the resonance Forming a first chamber between the sheets, the resonance piece and the side wall of the cover plate jointly define a confluence chamber; wherein the gas pumped cover plate, the piezoelectric actuator and the resonance piece are sequentially The lower stack is fixed on the carrier and closes the air-conducting end opening. When the piezoelectric actuator is driven to perform the air collecting operation, the gas system is introduced into the collecting chamber from the opening of the cover plate, and flows through the common The hollow hole of the piece enters the first cavity temporarily, and when the piezoelectric actuator is driven to perform the exhausting operation, the gas system flows from the first cavity through the hollow hole of the resonator piece and the confluence chamber to be discharged to the guide The air end is opened to introduce the airflow into the airflow passage through the air guide end opening and exchange heat with the electronic component, and the airflow after heat exchange with the electronic component is discharged through the exhaust end opening.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and drawings are intended to be illustrative and not limiting.

Please refer to FIG. 2A and FIG. 2B. FIG. 2A is a schematic structural view of the air-cooling heat dissipating device according to the first preferred embodiment of the present invention. Fig. 2B is a schematic view showing the structure of Fig. 2A in the A-A' section. As shown in the figure, the air-cooling heat sink 2 of the present invention can be applied to an electronic device such as, but not limited to, a portable computer, a tablet computer, an industrial computer, a portable communication device, a video player, and the like. The heat-dissipating electronic component 3 dissipates heat. The air-cooling heat sink 2 of the present invention comprises a carrier 20 and a gas pump 22, wherein the carrier 20 includes an air-conducting end opening 23, an exhaust end opening 24, and a gas flow passage 25. The carrier 20 is covered by the electronic component 3, and the electronic component 3 is placed in the airflow passage 25. The gas pump 22 is fixed to the carrier 20, and is assembled and positioned at the air guiding end opening 23, and the air guiding end opening 23 is closed. The air pump 22 is driven to introduce the airflow into the airflow passage 25 through the air guide opening 23 and exchange heat with the electronic component 3, and the airflow after heat exchange with the electronic component 3 is opened through the exhaust end. 24 discharge, 俾 to achieve heat dissipation to the electronic component 3.

In some embodiments, the carrier 20 is formed by assembling the plurality of heat shields 26, and the plurality of heat shields 26 define the gas flow passage 25, the air guide opening 23, and the exhaust end opening. twenty four. The gas pump 22 is fixed to the heat shield 26 of the carrier 20. The carrier 20 covers the electronic component 3, and the air guide opening 23 is provided corresponding to the electronic component 3. In some embodiments, the electronic component 3 has a first surface 3a and a second surface 3b, and is disposed on the heat conduction plate 4 with the second surface 3b, and can dissipate heat through the heat conduction path of the heat conduction plate 4, and In some embodiments, the carrier substrate 4 and the second surface 3b of the electronic component 3 are further coated with a thermal conductive adhesive 5, that is, the electronic component 3 is disposed on the carrier substrate 4 through the second surface 3b and the thermal conductive adhesive 5 stacked. , but not limited to this. The heat shield 26 of the carrier 20 is connected to the heat transfer plate 4. The heat transfer plate 4 is made of a material having a high heat transfer coefficient, such as, but not limited to, artificial graphite.

In the present embodiment, the gas pump 22 is a piezoelectrically actuated gas pump for driving the gas flow to introduce the gas from the outside of the air-cooling heat sink 2 into the gas flow channel 25 via the air-conducting end opening 23. . When the gas pump 22 introduces the gas into the gas circulation passage 25, the introduced gas exchanges heat with the electronic component 3 in the carrier 20, and pushes the gas in the gas circulation passage 25 to flow rapidly, thereby causing the heat flow after the heat exchange to pass the heat energy through The exhaust end opening 24 is exhausted to the outside of the air cooling heat sink 2. Since the gas pump 22 is continuously operated to introduce a gas, the electronic component 3 can exchange heat with the continuously introduced gas, and at the same time, the heat-exchanged airflow is discharged through the exhaust end opening 24, whereby the electronic component 3 can be realized. The heat dissipation can improve the heat dissipation performance, thereby increasing the performance stability and the life of the electronic component 3.

Fig. 3 is a schematic cross-sectional view showing the air-cooling heat dissipating device of the second embodiment of the present invention. As shown in FIG. 3, the air-cooling heat dissipating device 2a of the present embodiment is similar to the air-cooling heat dissipating device 2 shown in FIG. 2B, and the same component numbers denote the same structures, elements, and functions, and will not be described again. The air-cooling heat dissipating device 2a of the present embodiment further includes a heat sink 27 connected to the first surface 3a of the electronic component 3 and located in the gas flow passage 25, as compared with the air-cooling heat dissipating device 2 shown in FIG. The heat sink 27 includes a base 271 and a plurality of heat sinks 272. The base 271 is attached to the surface of the electronic component 3, and a plurality of heat sinks 272 are vertically connected to the base 271. By the arrangement of the heat sink 27, the heat dissipation area can be increased, and the heat energy generated by the electronic component 3 can be exchanged with the gas in the gas flow passage 25 via the heat sink 27 to improve the heat dissipation performance.

Please refer to FIG. 4A and FIG. 4B. FIG. 4A is a schematic view showing the rear exploded structure of the gas pump according to the first preferred embodiment of the present invention, and FIG. 4B is a front exploded view showing the gas pump of the first preferred embodiment of the present invention. As shown, the gas pump 22 of the present invention includes elements such as a resonator piece 221, a piezoelectric actuator 222, and a cover plate 226. The resonator piece 221 has a hollow hole 221a which is provided corresponding to the air guide end opening 23 of the carrier 20. The piezoelectric actuator 222 has components such as a suspension plate 2221, an outer frame 2222, a piezoelectric element 2223, and at least one bracket 2224 for receiving a voltage to drive the gas pump 22. The cover plate 226 has a side wall 2261, a bottom plate 2262, and an opening portion 2263. The side wall 2261 is protruded from the bottom plate 2262 and protrudes from the bottom plate 2262, and forms a receiving space 226a with the bottom plate 2262 for the resonant piece 221 and the piezoelectric body. The actuator 222 is disposed therein, and the opening portion 2263 is disposed on the sidewall 2261 for the conductive pin 2222a of the outer frame 2222 to protrude outwardly through the opening portion 2263 to protrude outside the cover plate 226 to facilitate external power supply. Connected, but not limited to this. In the present embodiment, the suspension plate 2221 has a central portion 2221c and an outer peripheral portion 2221d. When the piezoelectric element 2223 is driven by a voltage, the suspension plate 2221 can be flexibly vibrated from the central portion 2221c to the outer peripheral portion 2221d, and the outer frame 2222 is circumferentially disposed in suspension. The outer side of the board 2221 has a conductive pin 2222a. The conductive pin 2222a is outwardly protruded from the outer frame 2222 for power connection, but is not limited thereto. The piezoelectric element 2223 has a length of one side that is less than or equal to the side length of the suspension plate 2221, but is not limited thereto, and the piezoelectric element 2223 is attached to the second surface 2221b of the suspension plate 2221 for receiving The voltage is applied to deform to drive the suspension plate 2221 to bend and vibrate. At least one bracket 2224 is disposed between the suspension plate 2221 and the outer frame 2222, and the two ends of each bracket 2224 are connected to the suspension plate 2221 and the outer frame 2222 to provide elastic support.

In this embodiment, the gas pump 22 of the present invention further includes two insulating sheets 223, 225 and a conductive sheet 224, but not limited thereto, wherein the two insulating sheets 223 and 225 are respectively disposed on the conductive sheet 224. Up and down, the shape is substantially corresponding to the outer frame 2222 of the piezoelectric actuator 222, and is made of an insulating material, such as plastic, for insulation, but not limited thereto, the conductive sheet 224 It is made of a conductive material, such as a metal, for electrical conduction, and its shape also corresponds to the outer frame 2222 of the piezoelectric actuator 222, but is not limited thereto. In this embodiment, a conductive pin 224a is also disposed on the conductive sheet 224 for electrical conduction. The conductive pin 224a also passes through the opening of the cover 226, such as the conductive pin 2222a of the outer frame 2222. Portion 2263 protrudes beyond cover 226 to facilitate connection to an external power source.

Please refer to FIG. 5. FIG. 5 is a cross-sectional structural view of the piezoelectric actuator according to the first preferred embodiment of the present invention. As shown in the figure, in the present embodiment, the suspension plate 2221 of the present invention is a stepped surface structure, that is, a convex portion 2221e is further formed on the central portion 2221c of the first surface 2221a of the suspension plate 2221, and the convex portion 2221e is a The circular raised structure is not limited thereto. In some embodiments, the suspension plate 2221 may also be a plate-shaped square that is flat on both sides. The convex portion 2221e of the suspension plate 2221 is coplanar with the first surface 2222b of the outer frame 2222, and the first surface 2221a of the suspension plate 2221 and the first surface 2224a of the bracket 2224 are also coplanar, and the convex portion of the suspension plate 2221 The first surface 2222b of the 2221e and the outer frame 2222 has a specific depth between the first surface 2221a of the suspension plate 2221 and the first surface 2224a of the bracket 2224. The second surface 2221b of the suspension plate 2221 is flush with the second surface 2222c of the outer frame 2222 and the second surface 2224b of the bracket 2224, and the piezoelectric element 2223 is attached to the flat suspension plate. At the second surface 2221b of 2221. In other embodiments, the shape of the suspension plate 2221 may also be a double-sided flat plate-like square structure, and is not limited thereto, and may be changed according to actual application conditions. In some embodiments, the suspension plate 2221, the outer frame 2222, and the bracket 2224 may be integrally formed, and may be formed of a metal plate, such as stainless steel, but not limited thereto. In this embodiment, the gas pump 22 of the present invention further has at least one gap 2225 between the suspension plate 2221, the outer frame 2222 and the bracket 2224 for gas to pass therethrough.

The operation flow of the gas pump 22 in this case is further described below. Please refer to FIGS. 6A-6D, wherein the 6A-6D diagram is a schematic diagram of the operation of the gas pump in the first preferred embodiment of the present invention. First, as shown in FIG. 6A, the structure of the gas pump 22 is as described above, in order from the cover plate 226, the other insulating sheet 225, the conductive sheet 224, the insulating sheet 223, the piezoelectric actuator 222, and the resonator piece. 221 stacked assemblies are positioned, and the laminated piezoelectric actuator 222, the insulating sheet 223, the conductive sheet 224, and the other insulating sheet 225 are glued to form a colloid 218, thereby filling the cover 226. The circumference of the accommodation space 226a is completed to complete the sealing. A gap g0 is formed between the resonator piece 221 and the piezoelectric actuator 222, and the resonance piece 221 and the side wall 2261 of the cover plate 226 jointly define a confluence chamber 227a between the resonance piece 221 and the bottom plate 2262 of the cover plate 226. There is then a first chamber 227b. When the gas pump 22 has not been driven by a voltage, the positions of its components are as shown in Fig. 6A.

Next, as shown in Fig. 6B, when the piezoelectric actuator 222 of the gas pump 22 is vibrated upward by the voltage, the gas enters the gas pump 22 from the opening portion 2263 of the cap plate 226 and is collected into the confluence. The chamber 227a then flows upward into the first chamber 227b via the hollow hole 221a on the resonator piece 221, and the resonance piece 221 is resonated by the resonance of the suspension plate 2221 of the piezoelectric actuator 222. That is, the resonant piece 221 is deformed upward, that is, the resonant piece 221 is slightly convex upward at the hollow hole 221a.

Thereafter, as shown in FIG. 6C, at this time, the piezoelectric actuator 13 is vibrated downward to the initial position, and the convex portion 2221e of the suspension plate 2221 of the piezoelectric actuator 222 is brought close to the resonance piece 221, prompting The gas in the lower half of the first chamber 227b is pushed to the sides and flows upward through the gap 2225 of the piezoelectric actuator 222 to flow into the upper chamber 227b of the upper half. It can be seen from this embodiment that when the resonator piece 221 performs vertical reciprocating vibration, the gap g0 between the resonator piece 221 and the piezoelectric actuator 222 can be increased by the maximum distance of the vertical displacement, in other words, The gap g0 provided between the resonator piece 221 and the piezoelectric actuator 222 allows the resonance piece 221 to generate a larger displacement up and down when it resonates.

Further, as shown in FIG. 6D, the piezoelectric actuator 222 vibrates downward again, and the resonance piece 221 is also subjected to the resonance of the vibration of the piezoelectric actuator 222, and the resonance piece 221 is also vibrated downward to urge the upper half. The gas in the first chamber 227b of the layer is pushed to the both sides and flows downward through the gap 2225 of the piezoelectric actuator 222 to flow to the hollow hole 221a of the resonator piece 221 to be compressed and discharged to form a compression. The airflow is directed to the air-conducting end opening 23 of the carrier substrate 20 to dissipate the heat-conducting plate 4.

Finally, the resonator piece 221 will return to the initial position, that is, as shown in FIG. 6A, and then continue to circulate in the order of the 6A to 6D through the above-described operation flow, and the gas will continuously pass through the opening portion 2263 of the cover plate 226. The flow enters the confluence chamber 227a, flows into the first chamber 227b, and then flows into the confluence chamber 227a from the first chamber 227b, so that the airflow continuously flows into the air guide opening 23, thereby enabling stable gas transfer. In other words, when the gas pump 22 of the present invention operates, the gas system sequentially flows through the opening portion 2263 of the cover plate 226, the confluence chamber 227a, the first chamber 227b, the confluence chamber 227a, and the air guide opening 23, The gas pump 22 of the present invention can pass through a single component, that is, the cover plate 226, and is designed by using the opening portion 2263 of the cover plate 226, thereby reducing the number of components of the gas pump 22 and simplifying the overall process.

Please refer to FIG. 7. FIG. 7 is a schematic structural diagram of an air-cooling heat dissipating device according to a third preferred embodiment of the present invention. The air-cooling heat dissipating device 2 of the present embodiment has a temperature control function, and further includes a control system 21 including a control unit 211 and a temperature sensor 212, wherein the control unit 211 is electrically connected to the gas pump 22, To control the operation of the gas pump 22. The temperature sensor 212 is disposed in the carrier 20 and adjacent to the electronic component 3 for sensing the temperature in the vicinity of the electronic component 3 or directly attached to the electronic component 3 to sense the temperature of the electronic component 3. The temperature sensor 212 is electrically connected to the control unit 211, senses the temperature of the electronic component 3, and transmits the sensing signal to the control unit 211. The control unit 211 determines whether the temperature of the electronic component 3 is higher than a temperature threshold according to the sensing signal of the temperature sensor 212. When the control unit 211 determines that the temperature of the electronic component 3 is higher than the temperature threshold, the control unit 211 issues a The control signal is applied to the gas pump 22 to operate the gas pump 22, whereby the gas pump 22 drives the airflow to dissipate heat from the electronic component 3, thereby cooling the electronic component 3 and lowering the temperature. When the control unit 211 determines that the temperature of the electronic component 3 is lower than the temperature threshold, a control signal is sent to the gas pump 22 to stop the operation of the gas pump 22, thereby preventing the gas pump 22 from continuing to operate and causing the life. Shorten and reduce the loss of extra energy. Therefore, through the setting of the control system 21, the gas pump 22 of the air-cooling heat sink 2 can be cooled and cooled when the temperature of the electronic component 3 is overheated, and stops after the temperature of the electronic component 3 is lowered, thereby avoiding the gas pump. The continued operation of the Pu 22 results in a shortened life span, reducing the consumption of additional energy, and also allowing the electronic component 3 to operate in a preferred temperature environment to improve the stability of the electronic component 3.

In summary, the present invention provides an air-cooling heat dissipating device, which can be applied to various electronic devices to dissipate heat from internal electronic components, improve heat dissipation performance, reduce noise, and stabilize and prolong the performance of electronic components inside electronic devices. life. In addition, the air-cooling heat dissipating device of the present case has a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, improve the heat dissipation performance, and prolong the service life of the heat dissipating device.

This case has been modified by people who are familiar with this technology, but it is not intended to be protected by the scope of the patent application.

11‧‧‧Electronic components

12‧‧‧heat transfer board

13‧‧‧thermal adhesive

2, 2a‧‧‧ air cooling device

20‧‧‧ Carrier

21‧‧‧Control system

211‧‧‧Control unit

212‧‧‧temperature sensor

218‧‧ ‧ colloid

22‧‧‧ gas pump

221‧‧‧Resonance film

221a‧‧‧ hollow holes

222‧‧‧ Piezoelectric Actuator

2221‧‧‧suspension plate

2221a‧‧‧The first surface of the suspension plate

2221b‧‧‧Second surface of the suspension plate

2221c‧‧‧ Central Department

2221d‧‧‧The outer part

2221e‧‧‧ convex

2222‧‧‧Front frame

2222a, 224a‧‧‧ conductive pins

2222b‧‧‧ first surface of the outer frame

2222c‧‧‧ second surface of the outer frame

2223‧‧‧Piezoelectric components

2224‧‧‧ bracket

2224a‧‧‧The first surface of the bracket

2224b‧‧‧Second surface of the bracket

2225‧‧‧ gap

223, 225‧‧ ‧ insulating sheet

224‧‧‧Electrical sheet

226‧‧‧ cover

226a‧‧‧ accommodating space

2261‧‧‧ side wall

2262‧‧‧floor

2263‧‧‧ openings

227a‧‧ ‧ confluence chamber

227b‧‧‧ first chamber

23‧‧‧ Air conduction opening

24‧‧‧Exhaust end opening

25‧‧‧ gas circulation channel

26‧‧‧Insulation board

27‧‧‧ radiator

271‧‧‧Base

272‧‧‧ Heat sink

3‧‧‧Electronic components

3a‧‧‧The first surface of the electronic component

3b‧‧‧ second surface of electronic components

4‧‧‧heat transfer plate

5‧‧‧thermal adhesive

A-A’‧‧‧ tangential direction

G0‧‧‧ gap

Figure 1 is a schematic view showing the structure of a conventional heat dissipation mechanism. 2A is a schematic structural view of the air-cooling heat dissipating device of the first preferred embodiment of the present invention. Fig. 2B is a schematic view showing the structure of Fig. 2A in the A-A' section. FIG. 3 is a schematic cross-sectional view showing the air-cooling heat dissipating device of the second preferred embodiment of the present invention. 4A is a schematic view showing the rear exploded structure of the gas pump of the first preferred embodiment of the present invention. 4B is a front exploded view of the gas pump of the first preferred embodiment of the present invention. Fig. 5 is a schematic cross-sectional view showing the piezoelectric actuator of the first preferred embodiment of the present invention. 6A to 6D are schematic views showing the operation process of the gas pump of the first preferred embodiment of the present invention. Figure 7 is a schematic view showing the structure of the air-cooling heat dissipating device of the third preferred embodiment of the present invention.

2‧‧‧Air-cooling heat sink

20‧‧‧ Carrier

22‧‧‧ gas pump

23‧‧‧ Air conduction opening

24‧‧‧Exhaust end opening

25‧‧‧ gas circulation channel

26‧‧‧Insulation board

3‧‧‧Electronic components

3a‧‧‧The first surface of the electronic component

3b‧‧‧ second surface of electronic components

4‧‧‧heat transfer plate

5‧‧‧thermal adhesive

Claims (7)

An air-cooling heat dissipating device for dissipating heat from an electronic component, the air-cooling heat dissipating device comprising: a carrier comprising an air flow passage, an air guide opening and an exhaust end opening, wherein the carrier covers the electronic component And the electronic component is located in the airflow passage; and a gas pump comprises: a resonant plate having a hollow hole; a piezoelectric actuator disposed corresponding to the resonant plate; and a cover having a side wall, a bottom plate and an opening portion, the side wall is disposed on the bottom plate and protrudes from the bottom plate to form an accommodation space, and the resonant piece and the piezoelectric actuator are disposed on the bottom plate The opening portion is disposed on the side wall, wherein a first chamber is formed between the bottom plate of the cover plate and the resonant plate, and the resonant piece and the side wall of the cover plate jointly define a confluent cavity a chamber in which the gas pump is applied, the piezoelectric actuator and the resonant plate are sequentially stacked on the carrier from top to bottom, and the air conduction opening is closed when the piezoelectric The actuator is driven to collect gas The gas system is introduced into the confluence chamber by the opening portion of the cover plate, and flows through the hollow hole of the resonance piece into the first chamber for temporary storage, when the piezoelectric actuator is driven to perform During the exhausting operation, the gas system is discharged from the first chamber through the hollow hole of the resonator piece and the confluence chamber to the air guiding end opening to introduce the airflow into the airflow passage through the air guiding end opening and The electronic component is heat-exchanged, and the airflow that has undergone heat exchange with the electronic component is discharged through the exhaust end opening. The air-cooling heat dissipating device of claim 1, wherein the carrier comprises a plurality of heat insulating plates assembled to define the air flow passage, the air guiding end opening and the exhaust end opening, wherein the air guiding The end opening is disposed corresponding to the electronic component. The air-cooling heat dissipating device of claim 1, wherein the piezoelectric actuator comprises: a suspension plate having a first surface and a second surface and being bendable and vibrating; and an outer frame surrounding the setting On the outer side of the suspension plate; at least one bracket connected between the suspension plate and the outer frame to provide elastic support; and a piezoelectric element having a side length which is less than or equal to one side of the suspension plate Long, and the piezoelectric element is attached to the second surface of one of the suspension plates for applying a voltage to drive the suspension plate to bend and vibrate. The air-cooling heat dissipating device of claim 3, wherein the suspension plate is a square suspension plate and has a convex portion. The air-cooling heat dissipating device of claim 3, wherein the gas pump comprises a conductive sheet, a first insulating sheet and a second insulating sheet, wherein the resonant sheet, the piezoelectric actuator, the The first insulating sheet, the conductive sheet, the second insulating sheet and the cover are sequentially stacked from bottom to top. The air-cooling heat dissipating device of claim 5, wherein the outer frame of the piezoelectric actuator has a conductive pin, the conductive piece has a conductive pin, and the gas pump covers the cover The opening portion is disposed on the side wall, and the conductive pin of the outer frame and the conductive pin of the conductive sheet protrude outwardly from the opening portion to protrude outside the cover plate, so as to facilitate External power connection. The air-cooling heat dissipating device of claim 1, further comprising a control system comprising: a control unit electrically connected to the gas pump to control the gas pumping operation; and a temperature a sensor electrically connected to the control unit and adjacent to the electronic component to sense a temperature of the electronic component to output a sensing signal to the control unit; wherein, when the control unit receives the sensing Signaling, and determining that the temperature of the electronic component is greater than a temperature threshold, the control unit causes the gas pump to be actuated to drive the airflow, and when the control unit receives the sensing signal and determines the electronic When the temperature of the component is below the temperature threshold, the control unit stops the gas pump from operating.