CN206251549U - Air cooling heat abstractor - Google Patents

Abstract

This case provides a kind of air cooling heat abstractor, for electronic element radiating.Air cooling heat abstractor includes bearing substrate, gas pump and radiator.Wherein bearing substrate includes upper and lower surface, air guide end opening and thermal transfer plate, and thermal transfer plate is arranged at upper surface and is disposed in thermal transfer plate corresponding to air guide end opening, and electronic component.Gas pump is fixedly arranged on the lower surface of bearing substrate, and correspondence closing air guide end opening.Radiator is arranged on the electronic component.By gas pump is driven, air-flow is imported into air guide end opening and heat exchange is carried out to thermal transfer plate.

Description

Air cooling heat abstractor

【Technical field】

This case be on a kind of air cooling heat abstractor, it is espespecially a kind of to provide drive air-flow to be radiated using gas pump Air cooling heat abstractor.

【Background technology】

With the development of science and technology various electronic equipments such as portable computer, panel computer, industrial computer, portable logical News device, audio and video player etc. are towards lightening, portable and dynamical trend development, and these electronic equipments are limited in its Various integrations high or high-power electronic component must be configured in inner space, in order that the arithmetic speed of electronic equipment is faster With it is with better function, the electronic component of electronic equipment internal will produce more heat energy when running, and cause high temperature.Additionally, These electronic equipments major part is all designed as frivolous, flat and has compact external form, and is used to radiate without extra inner space Cooling, therefore the electronic component in electronic equipment is vulnerable to the influence of heat energy, high temperature, and then the problems such as cause interference with or be damaged.

In general, the radiating mode of electronic equipment internal can be divided into active radiating and passive heat radiation.It is active to dissipate It is hot that electronic equipment internal is generally arranged at using tube-axial fan or blast type fan, by tube-axial fan or blast type fan Air-flow is driven, the heat energy transfer produced by electronic equipment internal electronic component radiates in order to realization.However, tube-axial fan And blast type fan can produce larger noise in running, and its volume is larger is difficult to be thinned and minimizes, moreover axle stream The service life of formula fan and blast type fan is shorter, thus traditional tube-axial fan and blast type fan be not particularly suited for it is frivolous Radiating is realized in change and portable electronic equipment.

Furthermore, many electronic components can using such as surface mount technology (Surface Mount Technology, SMT), the technology such as Selective Soldering (Selective Soldering) is welded in printed circuit board (PCB) (Printed Circuit Board, PCB) on, but the electronic component welded using foregoing welding manner, in through being in heat energy high, high temperature ring for a long time Under border, electronic component is easily set to be separated with printed circuit board (PCB), and most of electronic component also non-refractory, if electronic component is long Time is under heat energy high, hot environment, and the stable performance degree for being easily caused electronic component declines and reduced lifetime.

It is the structural representation of traditional heat-dissipating mechanism that Fig. 1 is.As shown in figure 1, traditional heat-dissipating mechanism is for a passive type dissipates Heat engine structure, it includes thermal transfer plate 12, and the thermal transfer plate 12 is by a heat-conducting glue 13 electronic component 11 phase to be radiated with Laminating, by the heat conduction path that heat-conducting glue 13 and thermal transfer plate 12 are formed, electronic component 11 can be made using heat transfer and Free convection mode reaches radiating.However, the radiating efficiency of foregoing cooling mechanism is poor, it is impossible to meet application demand.

In view of this, it is necessary to develop a kind of air cooling heat abstractor in fact to solve prior art problem encountered.

【Utility model content】

The purpose of this case is to provide a kind of air cooling heat abstractor, and it can be applied to various electronic equipments, be set with to electronics Standby internal electronic component is radiated, and in order to heat radiation efficiency, reduces noise, and make the property of electronic equipment internal electronic component Can stablize and increase the service life.

The another object of this case is to provide a kind of air cooling heat abstractor, and it has function of temperature control, can be according to electronic equipment The temperature change of internal electronic element, controls the running of gas pump, in order to heat radiation efficiency, and extends air cooling heat abstractor Service life.

It is that the one broader pattern of implementing of this case is a kind of air cooling heat abstractor of offer, for electronics up to above-mentioned purpose Element radiating, air cooling heat abstractor is included：It includes upper surface, lower surface, air guide end opening and thermal transfer plate to bearing substrate, Wherein thermal transfer plate is arranged at upper surface and is disposed in thermal transfer plate corresponding to air guide end opening, and electronic component；Gas Body pump is fixedly arranged on the lower surface of the bearing substrate, and correspondence closing air guide end opening；And radiator, it is arranged at electronic component On；Wherein, by gas pump is driven, air-flow is imported into air guide end opening and heat exchange is carried out to thermal transfer plate.

【Brief description of the drawings】

Fig. 1 is the structural representation of traditional heat-dissipating mechanism.

Fig. 2A is the structural representation of the air cooling heat abstractor of this case first embodiment.

Fig. 2 B are the air cooling heat abstractor shown in Fig. 2A in the structural representation of Section A-A.

Fig. 3 A and 3B are respectively the gas pump of this case preferred embodiment in the decomposition texture schematic diagram of different visual angles.

Fig. 4 is the cross-sectional view of the piezo-activator shown in Fig. 3 A and 3B.

Fig. 5 is the cross-sectional view of the gas pump shown in Fig. 3 A and 3B.

Fig. 6 A to 6E are the flowage structure figure of the gas pump start shown in Fig. 3 A and 3B.

Fig. 7 is the configuration diagram of the air cooling heat abstractor of this case second embodiment.

【Specific embodiment】

Embodying this pattern characteristics will in detail describe with some exemplary embodiments of advantage in the explanation of back segment.It should be understood that This case can have various changes, its scope for all not departing from this case, and explanation therein and diagram in different aspects Inherently it is illustrated as being used, and nand architecture is in limitation this case.

Fig. 2A is the structural representation of the air cooling heat abstractor of this case first embodiment, and Fig. 2 B are the gas shown in Fig. 2A Cooling and radiation device is in the structural representation of Section A-A.As shown in figs. 2 a and 2b, the air cooling heat abstractor 2 of this case can be applied to one Electronic equipment, such as but not limited to portable computer, panel computer, industrial computer, portable communication device, audio and video player, Radiated with to electronic component 3 to be radiated in electronic equipment.The air cooling heat abstractor 2 of this case includes bearing substrate 20, gas Body pump 22 and radiator 26, wherein bearing substrate 20 include that upper surface 20a, lower surface 20b, air guide end opening 23 and heat are passed Guide plate 25.Bearing substrate 20 can be but be not limited to printed circuit board (PCB), be used to carry and set electronic component 3 and gas pump 22.Hold The air guide end opening 23 of carried base board 20 is through upper surface 20a and lower surface 20b.Gas pump 22 is fixedly arranged on bearing substrate 20 Lower surface 20b, and assembling is positioned at air guide end opening 23, and close the air guide end opening 23.Thermal transfer plate 25 is arranged at holds On the upper surface 20a of carried base board 20, and assembling is positioned on air guide end opening 23, and is had between thermal transfer plate 25 and bearing substrate 20 There is clearance G, circulated to supplied gas.Electronic component 3 is disposed in thermal transfer plate 25, and a surface of electronic component 3 attaches In thermal transfer plate 25, and the heat conduction path of permeable thermal transfer plate 25 is radiated.Radiator 26 is disposed on electronics unit On part 3, and it is attached at another surface of electronic component 3.Wherein, by gas pump 22 is driven, air-flow is imported into air guide end and is opened Mouth 23 simultaneously carries out heat exchange to thermal transfer plate 25, in order to the radiating realized to electronic component 3.

In the present embodiment, radiator 26 includes a base 261 and multiple fin 262, and base 261 is attached at electronics unit Another surface of part 3, multiple fin 262 are to be vertically connected at base 261.By the setting of radiator 26, can increase scattered Hot area, makes the heat energy produced by electronic component 3 can be via the heat conduction path diversion of radiator 26.

It is a piezoelectric actuated gas pump that gas pump 22 is, dynamic to drive gas flow, by gas by air cooling heat abstractor 2 Outside import in air guide end opening 23.In some embodiments, bearing substrate 20 further includes at least one backflow wears groove 24, this time Flow through groove 24 and be through upper surface 20a and lower surface 20b, and be adjacent to the periphery of thermal transfer plate 25.When gas pump 22 is by gas When importing air guide end opening 23, import air-flow carries out heat with the thermal transfer plate 25 of the upper surface 20a for being arranged at bearing substrate 20 Exchange, and promote the gas in the clearance G between bearing substrate 20 and thermal transfer plate 25 quickly to flow, promote the air-flow after heat exchange Heat energy is discharged via clearance G, which part air-flow will be back to the lower surface 20b of bearing substrate 20 via backflow wears groove 24, And utilized in follow-up supplied gas pump 22 is cooled down.Additionally, fraction is then along the periphery of thermal transfer plate 25 towards the direction of radiator 26 Flowing, and in the fin 261 of radiator 26 is flowed through after cooling, in order to the radiating accelerated to electronic component 3.Because gas pump 22 is Continuously start makes electronic component 3 to carry out heat exchange with the gas being continuously introduced into, while after making heat exchange to import gas Gas is discharged, and the radiating to electronic component 3 can be realized whereby, and can improve heat dissipation, and then increases the performance of electronic component 3 Stability and life-span.

Fig. 3 A and 3B are respectively the gas pump of this case preferred embodiment in the decomposition texture schematic diagram of different visual angles, and Fig. 4 is The cross-sectional view of the piezo-activator shown in Fig. 3 A and 3B, and the section that Fig. 5 is the gas pump shown in Fig. 3 A and 3B Structural representation.As shown in Fig. 3 A, 3B, 4 and 5, it is a piezoelectric actuated gas pump that gas pump 22 is, and including inlet plate 221, altogether Shake the structures such as piece 222, piezo-activator 223, insulating trip 2241,2242 and conducting strip 225, wherein piezo-activator 223 is right Should be set in resonance plate 222, and make inlet plate 221, resonance plate 222, piezo-activator 223, insulating trip 2241, conducting strip 225 and the grade of another insulating trip 2242 sequentially stack setting, its profile being completed is as shown in Figure 5.

In the present embodiment, inlet plate 221 has an at least air admission hole 221a, and wherein the quantity of air admission hole 221a is with 4 For preferable, but it is not limited.Air admission hole 221a is through inlet plate 221, and atmospheric pressure is complied with from outside device to supplied gas Effect and from this at least an air admission hole 221a inflow gas pump 22.Have at least one to conflux round on inlet plate 221 221b, is correspondingly arranged at least air admission hole 221a with another surface of inlet plate 221.In the center of the round 221b that confluxes That, with central recess 221c, and central recess 221c is connected with the round 221b that confluxes at exchange, whereby can by from this extremely The gas that a few air admission hole 221a enters the round 221b that confluxes is guided and confluxed and is concentrated to central recess 221c, to realize that gas is passed Pass.In the present embodiment, inlet plate 221 has integrally formed air admission hole 221a, conflux round 221b and central recess 221c, And a chamber that confluxes for confluxing gas is correspondingly formed at central recess 221c, it is temporary with supplied gas.In some embodiments, The material of inlet plate 221 can be constituted by such as but not limited to stainless steel.In other embodiments, by the central recess The depth of the chamber that confluxes constituted at 221c is identical with the depth of the round 221b that confluxes, but is not limited.Resonance plate 222 is It is made up of a flexible materials, but is not limited, and in having a hollow bore 2220 on resonance plate 222, is corresponded to The central recess 221c of inlet plate 221 and set so that gas circulate.In other embodiments, resonance plate 222 is can be by one Copper material is constituted, but is not limited.

Piezo-activator 223 is by a suspension board 2231, at least a housing 2232, a support 2233 and a piezoelectric patches 2234 assemble jointly, wherein, the piezoelectric patches 2234 is attached at the first surface 2231c of suspension board 2231, is used to apply Voltage produces deformation to drive the flexural vibrations of suspension board 2231, and an at least support 2233 is to be connected to suspension board 2231 And between housing 2232, in the present embodiment, the support 2233 is connected between suspension board 2231 and housing 2232, Its two-end-point is to be connected to housing 2232, suspension board 2231, to provide resilient support, and in support 2233, suspension board An at least space 2235 is had more between 2231 and housing 2232, is circulated to supplied gas.It is emphasized that suspension board 2231, The kenel and quantity of housing 2232 and support 2233 are not limited with previous embodiment, and can be changed according to practical application request.Separately Outward, housing 2232 is to surround the outside for being arranged at suspension board 2231, and with the conductive connecting pin 2232c of an outside projection, is used to The use of power supply connection, but be not limited.

Suspension board 2231 is the structure (as shown in Figure 4) for a cascaded surface, is implied that in the second surface of suspension board 2231 2231b has more a convex portion 2231a, and convex portion 2231a can be but not be limited to a circular protrusions structure.The convex portion of suspension board 2231 2231a is the second surface 2232a coplines with housing 2232, and suspension board 2231 second surface 2231b and support 2233 Second surface 2233a also be copline, and the suspension board 2231 convex portion 2231a and the second surface 2232a of housing 2232 It is that there is a certain depth between the second surface 2231b of suspension board 2231 and the second surface 2232a of support 2233.Suspend The first surface 2231c of plate 2231, it is with the first surface 2232b of housing 2232 and the first surface 2233b of support 2233 Smooth coplanar structure, and piezoelectric patches 2234 is then attached at the first surface 2231c of this smooth suspension board 2231.In another In some embodiments, the kenel of suspension board 2231 also can be a two-sided smooth tabular square structure, be not limited thereto, can Appoint and apply change according to situation is actually applied.In some embodiments, suspension board 2231, support 2233 and housing 2232 are can The structure being formed in one, and can be made up of a metallic plate, such as but not limited to stainless steel is constituted.Again in other In embodiment, the length of side of piezoelectric patches 2234 is less than the length of side of the suspension board 2231.In other embodiments, piezoelectric patches 2234 length of side is equal to the length of side of suspension board 2231, and same design is the square tabular knot corresponding with suspension board 2231 Structure, but be not limited thereto.

The insulating trip 2241 of gas pump 22, conducting strip 225 and another insulating trip 2242 are sequentially to be correspondingly arranged in piezoelectricity cause Under dynamic device 223, and its form approximately corresponds to the form of the housing 2232 of piezo-activator 223.In some embodiments, Insulating trip 2241,2242 is made up of isolation material, such as but not limited to plastic cement, in order to offer insulation function.In other realities Apply in example, conducting strip 225 can be made up of conductive material, such as but not limited to metal material, function is conducted to provide.Yu Ben In embodiment, a conductive connecting pin 225a also can be set on conducting strip 225, to realize conducting function.

In the present embodiment, gas pump 22 is sequentially by inlet plate 221, resonance plate 222, piezo-activator 223, insulating trip 2241st, the stacking such as conducting strip 225 and another insulating trip 2242 is formed, and is tool between resonance plate 222 and piezo-activator 223 There is a gap h, be the gap h between the periphery of housing 2232 of resonance plate 222 and piezo-activator 223 in the present embodiment In insert a filling material, such as but not limited to conducting resinl so that the suspension board 2231 of resonance plate 222 and piezo-activator 223 Convex portion 2231a between can maintain the depth of gap h, and then air-flow can be guided more quickly flow, and because of suspension board 2231 Convex portion 2231a and resonance plate 222 keep the suitable distance interference that makes to contact with each other to reduce, promoting noise to produce can be lowered.In In other embodiments, also can be by the height of the housing 2232 for increasing piezo-activator 223, so that it is 222 groups with resonance plate Increase by a gap during dress, but be not limited.

In the present embodiment, after inlet plate 221, resonance plate 222 are with the sequentially corresponding assembling of piezo-activator 223, in altogether The piece 222 that shakes has an a movable part 222a and fixed part 222b, can be collectively forming with inlet plate 221 thereon at movable part 222a One chamber for confluxing gas, and a first chamber 220 is more formed between resonance plate 222 and piezo-activator 223, it is configured to temporarily store Gas, and first chamber 220 be through resonance plate 222 hollow bore 2220 and with the central recess 221c of inlet plate 221 at Chamber be connected, and first chamber 220 both sides then by the space 2235 between the support 2233 of piezo-activator 223 with The air guide end opening 23 being arranged under it is connected.

Fig. 6 A to 6E are the flowage structure figure of the gas pump start shown in Fig. 3 A and 3B.Fig. 5, Fig. 6 A to Fig. 6 E are referred to, The start process description of the gas pump of this case is as follows.When gas pump 22 carries out start, piezo-activator 223 is by voltage actuation With support 2233 as fulcrum, the reciprocating vibration of vertical direction is carried out.As shown in Figure 6A, when piezo-activator 223 is caused by voltage When moving and vibrating downwards, it is light, thin laminated structure to be due to resonance plate 222, is when piezo-activator 223 vibrates, to be total to Shake piece 222 also can with resonance carry out vertical reciprocating vibration, the as part of the corresponding central recess 221c of resonance plate 222 Also can with flexural vibrations deformation, i.e. the part of correspondence central recess 221c is the movable part 222a for resonance plate 222, be with When piezo-activator 223 is bent downwardly vibration, now the movable part 222a of the corresponding central recess 221c of resonance plate 222 can be because of gas Body bring into and push and the vibration of piezo-activator 223 drive, and as piezo-activator 223 is bent downwardly vibration shape Become, then gas is entered by least air admission hole 221a on inlet plate 221, and conflux round 221b to be pooled to through at least one Center central recess 221c at, then via the hollow bore 2220 being correspondingly arranged with central recess 221c on resonance plate 222 to Under flow into first chamber 220.Thereafter, due to being driven by the vibration of piezo-activator 223, resonance plate 222 also can be total to Shake and carry out vertical reciprocating vibration, as shown in Figure 6B, now the movable part 222a of resonance plate 222 also with downward vibration, And attach contact at piezo-activator 223 suspension board 2231 convex portion 2231a on, make the convex portion 2231a of suspension board 2231 with The spacing of the chamber that confluxes between outer region and the fixed part 222b of the both sides of resonance plate 222 will not diminish, and by this resonance The deformation of piece 222, to compress the volume of first chamber 220, and closes the middle flow space of first chamber 220, promotes in it Gas is pushed and flowed to both sides, and then passes through stream downwards by the space 2235 between the support 2233 of piezo-activator 223 It is dynamic.Afterwards, as shown in Figure 6 C, the movable part 222a of resonance plate 222 is bent upwards vibration deformation, and returns back to initial position, and Piezo-activator 223 is driven to vibrate upwards by voltage, the volume of so same extruding first chamber 220, only now due to pressure Electric actuator 223 is upward lifting so that the gas in first chamber 220 can flow towards both sides, and gas constantly from An at least air admission hole 221a on inlet plate 221 enters, then flows into the chamber that central recess 221c is formed.Afterwards, as schemed Shown in 6D, the resonance plate 222 is resonated upwards by the vibration of the upward lifting of piezo-activator 223, and now resonance plate 222 is movable Portion 222a also with upward vibration, and then mitigation of gases constantly an at least air admission hole 221a from inlet plate 221 enters, then In the chamber that inflow central recess 221c is formed.Finally, as illustrated in fig. 6e, the movable part 222a of resonance plate 222 is also returned back to Initial position.Thus implement aspect to understand, be that can be caused with piezoelectricity by it when resonance plate 222 carries out vertical reciprocating vibration The gap h between device 223 is moved to increase the ultimate range of its vertical displacement, in other words, gap h is set between two structure Resonance plate 222 can be made can produce upper and lower displacement by a larger margin when resonance.Therefore in through the runner design of this gas pump 22 Produce barometric gradient, make gas flow at high rates, and enter the resistance difference of outgoing direction through runner, by gas by suction side transmit to Outlet side, to complete gas conveying operation, even if in the state of outlet side has air pressure, still having the ability persistently to push air into gas Body circulation passage 25, and Jing Yin effect is can reach, so repeat the start of gas pump 22 of Fig. 6 A to 6E, you can make gas pump 22 Produce the gas transport of an ecto-entad.

From the above, through the start of above-mentioned gas pump 22, introduce gas into air guide end opening 23, make imported gas with Thermal transfer plate 25 carries out heat exchange, and promotes the air-flow in the clearance G between bearing substrate 20 and thermal transfer plate 25 quickly to flow, and promotees Make the gas after heat exchange that heat energy drained into air cooling heat abstractor 2 outside, whereby improving the efficiency of cooling, Jin Erzeng Power up stable performance degree and the life-span of subcomponent 3.

Fig. 7 is the configuration diagram of the air cooling heat abstractor of the preferred embodiment of this case the 3rd.As shown in fig. 7, the present embodiment Air cooling heat abstractor 2a it is similar to the air cooling heat abstractor 2 shown in Fig. 2 B, and identical element numbers represent identical structure, Element and function, repeat no more in this.Compared to the air cooling heat abstractor 2 shown in Fig. 2 B, the air cooling heat abstractor of the present embodiment 2a is that, with function of temperature control, it further includes control system 21, and the control system 21 includes control unit 211 and temperature sensor 212, wherein control unit 211 is electrically connected with gas pump 22, to control the running of gas pump 22.Temperature sensor 212 is to set It is placed in air guide end opening 23, and is adjacent to electronic component 3, for the temperature near sensing electronic component 3, or directly against Invest the sensing temperature of electronic component 3 on electronic component 3.Temperature sensor 212 is electrically connected to control unit 211, senses electronics The temperature of element 3, and sensing signal is transmitted to control unit 211.Control unit 211 according to temperature sensor 212 sensing Whether signal, judge the temperature of the electronic component 3 higher than a temperature threshold value, when control unit 211 judges the electronic component 3 When temperature is higher than the temperature threshold value, a control signal to gas pump 22 is sent, operated with enable gas pump 22, gas is made whereby Pump 22 drives the air current flow to carry out cooling with to electronic component 3, so that the cooling of electronic component 3 and reducing temperature.When When control unit 211 judges that the temperature of the electronic component 3 is less than the temperature threshold value, a control signal to gas pump 22 is sent, Operated with stopping gas pump 22, the continued operation of gas pump 22 can be avoided whereby and causes reduced lifetime, reduce extra energy Consume.Therefore through the setting of control system 21, make the gas pump 22 of air cooling heat abstractor 2 when 3 temperature overheating of electronic component Cooling can be carried out, and is decommissioned in after the reduction of the temperature of electronic component 3, the continued operation of gas pump 22 can avoided whereby and is led Reduced lifetime is caused, the consume of extra energy is reduced, can also make electronic component 3 in being operated under a preferred temperature environment, improve electricity The stability of subcomponent 3.

In sum, this case provides a kind of air cooling heat abstractor, and it can be applied to various electronic equipments with to its inside Electronic element radiating, in order to heat radiation efficiency, reduces noise, and make the stable performance of electronic equipment internal electronic component and extend Service life.Additionally, the air cooling heat abstractor of this case, it has function of temperature control, can be according to electronic equipment internal electronic component Temperature change, controls the running of gas pump, in order to heat radiation efficiency, and extension air cooling heat abstractor service life,.

This case appointed as person familiar with the technology apply craftsman think and be it is all as modify, so neither take off such as attached claim Be intended to Protector.

【Symbol description】

11：Electronic component

12：Thermal transfer plate

13：Heat-conducting glue

2、2a：Air cooling heat abstractor

20：Bearing substrate

20a：Upper surface

20b：Lower surface

21：Control system

211：Control unit

212：Temperature sensor

22：Gas pump

220：First chamber

221：Inlet plate

221a：Air admission hole

221b：Conflux round

221c：Central recess

222：Resonance plate

222a：Movable part

222b：Fixed part

2220：Hollow bore

223：Piezo-activator

2231：Suspension board

2231a：Convex portion

2231b：Second surface

2231c：First surface

2232：Housing

2232a：Second surface

2232b：First surface

2232c：Conductive connecting pin

2233：Support

2233a：Second surface

2233b：First surface 2234：Piezoelectric patches

2235：Space

2241、2242：Insulating trip

225：Conducting strip

225a：Conductive connecting pin

23：Air guide end opening

24：Exhaust end opening

25：Thermal transfer plate

26：Radiator

261：Base

262：Fin

h：Gap

G：Gap

3：Electronic component

Claims (12)

1. a kind of air cooling heat abstractor, for an electronic element radiating, it is characterised in that the air cooling heat abstractor is included:

One bearing substrate, comprising a upper surface, a lower surface, an air guide end opening and a thermal transfer plate, the wherein heat transfer Plate is arranged at the upper surface and is disposed in the thermal transfer plate corresponding to the air guide end opening, and the electronic component；

One gas pump, is fixedly arranged on the lower surface of the bearing substrate, and correspondence closes the air guide end opening；And

One radiator, is arranged on the electronic component；

Wherein, by the gas pump is driven, air-flow is imported into the air guide end opening and heat exchange is carried out to the thermal transfer plate.

2. air cooling heat abstractor as claimed in claim 1, it is characterised in that the air guide end opening of the bearing substrate is through The upper surface and the lower surface.

3. air cooling heat abstractor as claimed in claim 1, it is characterised in that have between the thermal transfer plate and the bearing substrate Gap, is used to supply airflow.

4. air cooling heat abstractor as claimed in claim 1, it is characterised in that the thermal transfer plate attaches a table of the electronic component Face, and the radiator attaches another surface of the electronic component.

5. air cooling heat abstractor as claimed in claim 1, it is characterised in that the bearing substrate further includes an at least backflow and wears Groove, the backflow wears groove is through the upper surface and the lower surface, and is adjacent to the periphery of the thermal transfer plate.

6. air cooling heat abstractor as claimed in claim 1, it is characterised in that the gas pump is a piezoelectric actuated gas pump.

7. air cooling heat abstractor as claimed in claim 6, it is characterised in that the piezoelectric actuated gas pump includes：

One inlet plate, confluxes with an at least air admission hole, at least one and round and constitutes a central recess for confluxing chamber, wherein An at least air admission hole supplies to import air-flow, the corresponding air admission hole of the round that confluxes, and guides the air-flow of the air admission hole to converge into this The chamber that confluxes that central recess is constituted；

One resonance plate, with a hollow hole corresponding to around the chamber that confluxes, and the hollow hole be a movable part；And

One piezo-activator, setting corresponding with the resonance plate；

Wherein, there is a gap to form a chamber between the resonance plate and the piezo-activator, so that the piezo-activator is driven When dynamic, air-flow is imported by an at least air admission hole for the inlet plate, the central recess be collected to through at least one round that confluxes, The hollow hole of the resonance plate is passed through, to enter in the chamber, is produced by the movable part of the piezo-activator and the resonance plate Resonance transfer air-flow.

8. air cooling heat abstractor as claimed in claim 7, it is characterised in that the piezo-activator is included：

One suspension board, with a first surface and a second surface, and flexible vibration；

One housing, around the outside for being arranged at the suspension board；

An at least support, is connected between the suspension board and the housing, to provide resilient support；And

One piezoelectric patches, with a length of side, the length of side is less than or equal to a length of side of the suspension board, and the piezoelectric patches is to be attached at On one first surface of the suspension board, to applied voltage driving the suspension board flexural vibrations.

9. air cooling heat abstractor as claimed in claim 8, it is characterised in that the suspension board is a square suspension board, and is had There is a convex portion.

10. air cooling heat abstractor as claimed in claim 7, it is characterised in that the piezoelectric actuated gas pump include a conducting strip, One first insulating trip and one second insulating trip, the wherein inlet plate, the resonance plate, the piezo-activator, first insulating trip, The conducting strip and second insulating trip are that sequentially stacking is set.

11. air cooling heat abstractors as claimed in claim 1, it is characterised in that it further includes a control system, the control system Including：

One control unit, is electrically connected to the gas pump, to control the gas pump to operate；And

One temperature sensor, is electrically connected to the control unit and is adjacent to the electronic component, to sense a temperature of the electronic component Spend to export a sensing signal to the control unit；

Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door During threshold value, the control unit makes the gas pump enable, to drive air current flow, and when the control unit is in receiving the sensing Signal, and when judging the temperature of the electronic component less than the temperature threshold value, the control unit makes the gas pump decommission.

12. air cooling heat abstractors as claimed in claim 1, it is characterised in that the radiator includes a base and multiple radiatings Piece, the wherein base are to be attached at the electronic component, and the plurality of fin is to be connected to the base.