CN206224363U - Air cooling heat abstractor - Google Patents

Abstract

This case provides a kind of air cooling heat abstractor, for electronic element radiating.Air cooling heat abstractor includes water conservancy diversion carrier, it includes first surface, second surface, chamber, air guide end opening and multiple stream guidance grooves, wherein the chamber of water conservancy diversion carrier runs through first surface and second surface, air guide end opening is arranged at first surface and is connected with chamber, multiple stream guidance grooves are arranged at second surface and are connected with chamber, and make electronic component be to be placed in chamber.Air cooling heat abstractor further includes gas pump, its first surface for being arranged at water conservancy diversion carrier, and closing air guide end opening.Air-flow is imported into chamber via air guide end opening by driving gas pump, and heat exchange is carried out to electronic component, and discharged the air-flow after heat exchange is carried out with electronic component via multiple stream guidance grooves.

Description

Air cooling heat abstractor

【Technical field】

This case be on a kind of air cooling heat abstractor, it is espespecially a kind of to provide drive air-flow to be radiated using gas pump Air cooling heat abstractor.

【Background technology】

With the development of science and technology various electronic equipments such as portable computer, panel computer, industrial computer, portable logical News device, audio and video player etc. are towards lightening, portable and dynamical trend development, and these electronic equipments are limited in its Various integrations high or high-power electronic component must be configured in inner space, in order that the arithmetic speed of electronic equipment is faster With it is with better function, the electronic component of electronic equipment internal will produce more heat energy when running, and cause high temperature.Additionally, These electronic equipments major part is all designed as frivolous, flat and has compact external form, and is used to radiate without extra inner space Cooling, therefore the electronic component in electronic equipment is vulnerable to the influence of heat energy, high temperature, and then the problems such as cause interference with or be damaged.

In general, the radiating mode of electronic equipment internal can be divided into active radiating and passive heat radiation.It is active to dissipate It is hot that electronic equipment internal is generally arranged at using tube-axial fan or blast type fan, by tube-axial fan or blast type fan Air-flow is driven, the heat energy transfer produced by electronic equipment internal electronic component radiates in order to realization.However, tube-axial fan And blast type fan can produce larger noise in running, and its volume is larger is difficult to be thinned and minimizes, moreover axle stream The service life of formula fan and blast type fan is shorter, thus traditional tube-axial fan and blast type fan be not particularly suited for it is frivolous Radiating is realized in change and portable electronic equipment.

Furthermore, many electronic components can using such as surface mount technology (Surface Mount Technology, SMT), the technology such as Selective Soldering (Selective Soldering) is welded in printed circuit board (PCB) (Printed Circuit Board, PCB) on, but the electronic component welded using foregoing welding manner, in through being in heat energy high, high temperature ring for a long time Under border, electronic component is easily set to be separated with printed circuit board (PCB), and most of electronic component also non-refractory, if electronic component For a long time under heat energy high, hot environment, the stable performance degree for being easily caused electronic component declines and reduced lifetime.

It is the structural representation of traditional heat-dissipating mechanism that Fig. 1 is.As shown in figure 1, traditional heat-dissipating mechanism is for a passive type dissipates Heat engine structure, it includes thermal transfer plate 12, and the thermal transfer plate 12 is by a heat-conducting glue 13 electronic component 11 phase to be radiated with Laminating, by the heat conduction path that heat-conducting glue 13 and thermal transfer plate 12 are formed, electronic component 11 can be made using heat transfer and Free convection mode reaches radiating.However, the radiating efficiency of foregoing cooling mechanism is poor, it is impossible to meet application demand.

In view of this, it is necessary to develop a kind of air cooling heat abstractor in fact, to solve prior art problem encountered.

【Utility model content】

The purpose of this case is to provide a kind of air cooling heat abstractor, and it can be applied to various electronic equipments, be set with to electronics Standby internal electronic component is circulated formula thermal convection current radiating, in order to heat radiation efficiency, reduces noise, and make electronic equipment internal The stable performance of electronic component simultaneously increases the service life.

The another object of this case is to provide a kind of air cooling heat abstractor, and it has function of temperature control, can be according to electronic equipment The temperature change of internal electronic element, controls the running of gas pump, in order to heat radiation efficiency, and extends air cooling heat abstractor Service life.

It is that the one broader pattern of implementing of this case is a kind of air cooling heat abstractor of offer, for electronics up to above-mentioned purpose Element radiating, the air cooling heat abstractor is included：Water conservancy diversion carrier, including first surface, second surface, chamber, air guide end opening with And multiple stream guidance grooves, its middle chamber runs through first surface and second surface, air guide end opening be arranged at first surface and with Chamber is connected, and multiple stream guidance grooves are arranged at second surface and are connected with chamber, and wherein electronic component is to be placed in chamber Room；And gas pump, it is arranged at the first surface of water conservancy diversion carrier, and closing air guide end opening, wherein by driving gas pump, with Air-flow is imported into chamber via air guide end opening, and heat exchange is carried out to electronic component, and heat exchange will be carried out with electronic component Air-flow afterwards is discharged via multiple stream guidance grooves.

It is that another broader implementation pattern of this case is a kind of air cooling heat abstractor of offer, for electricity up to above-mentioned purpose Subcomponent is radiated, and air cooling heat abstractor is included：Water conservancy diversion carrier, including first surface, second surface, chamber, air guide end opening with And multiple stream guidance grooves, its middle chamber runs through first surface and second surface, air guide end opening be arranged at first surface and with Chamber is connected, and multiple stream guidance grooves are arranged at second surface and are connected with chamber, and wherein electronic component is to be placed in chamber Room；Radiator, is attached at electronic component, and positioned at chamber；And gas pump, it is arranged at the first surface of water conservancy diversion carrier, and envelope Air guide end opening is closed, wherein by gas pump is driven, air-flow is imported into chamber via air guide end opening, and electronic component is entered Row heat exchange, and discharged the air-flow after heat exchange is carried out with electronic component via multiple stream guidance grooves.

It is that the another broader implementation pattern of this case is a kind of air cooling heat abstractor of offer, for electricity up to above-mentioned purpose Subcomponent is radiated, and air cooling heat abstractor is included：Water conservancy diversion carrier, including first surface, second surface, chamber, air guide end opening with And multiple stream guidance grooves, its middle chamber runs through first surface and second surface, air guide end opening be arranged at first surface and with Chamber is connected, and multiple stream guidance grooves are arranged at second surface and are connected with chamber, and wherein electronic component is to be placed in chamber Room；Heat conduction tubing string, is attached at the surface of electronic component, and positioned at chamber；And gas pump, it is arranged at the first table of water conservancy diversion carrier Face, and closing air guide end opening, wherein by gas pump is driven, air-flow is imported into chamber via air guide end opening, and to electricity Subcomponent carries out heat exchange, and is discharged the air-flow after heat exchange is carried out with electronic component via multiple stream guidance grooves.

【Brief description of the drawings】

Fig. 1 is the structural representation of traditional heat-dissipating mechanism.

Fig. 2A is the structural representation of the air cooling heat abstractor of this case first embodiment.

Fig. 2 B are the air cooling heat abstractor shown in Fig. 2A in the structural representation of Section A-A.

Fig. 3 is the structural representation of the water conservancy diversion carrier shown in Fig. 2A.

Fig. 4 is the structural representation of the air cooling heat abstractor of this case second embodiment.

Fig. 5 is the structural representation of the air cooling heat abstractor of this case 3rd embodiment.

Fig. 6 A and 6B are respectively the gas pump of this case preferred embodiment in the decomposition texture schematic diagram of different visual angles.

Fig. 7 is the cross-sectional view of the piezo-activator shown in Fig. 6 A and 6B.

Fig. 8 is the cross-sectional view of the gas pump shown in Fig. 6 A and 6B.

Fig. 9 A to 9E figures are the flowage structure figure of the gas pump start shown in Fig. 6 A and 6B.

Figure 10 is the configuration diagram of the air cooling heat abstractor of this case fourth embodiment.

【Specific embodiment】

Embodying this pattern characteristics will in detail describe with some exemplary embodiments of advantage in the explanation of back segment.It should be understood that This case can have various changes, its scope for all not departing from this case, and explanation therein and diagram in different aspects Inherently it is illustrated as being used, and nand architecture is in limitation this case.

Fig. 2A is the structural representation of the air cooling heat abstractor of this case first embodiment, and Fig. 2 B are that the air cooling shown in Fig. 2A dissipates Hot charging is placed in the structural representation of Section A-A, and the structural representation that Fig. 3 is the water conservancy diversion carrier shown in Fig. 2A.Such as Fig. 2A, Shown in 2B and 3, the air cooling heat abstractor 2 of this case can be applied to an electronic equipment, such as but not limited to portable computer, flat board electricity Brain, industrial computer, portable communication device, audio and video player, dissipate with to electronic component 3 to be radiated in electronic equipment Heat.The air cooling heat abstractor 2 of this case includes water conservancy diversion carrier 20, gas pump 22.Water conservancy diversion carrier 20 includes first surface 20a, second Surface 20b, chamber 201, air guide end opening 202 and multiple stream guidance grooves 203, its middle chamber 201 is through first surface 20a and second surface 20b, air guide end opening 202 is arranged at first surface 20a and is connected with chamber 201.Multiple stream guidances Groove 203 is disposed on second surface 20b, is circulated to supplied gas, and one end of each of which stream guidance groove 203 is to be communicated in Chamber 201, and the other end of each stream guidance groove 203 is to extend to the side wall 204 of water conservancy diversion carrier 20 and be communicated with the outside Logical, the side wall 204 of water conservancy diversion carrier 20 forms multiple exhaust end openings 205 whereby.The chamber 201 of water conservancy diversion carrier 20 is to be installed with electronics Element 3.Gas pump 22 is fixedly arranged on the first surface 20a of water conservancy diversion carrier 20, and assembling is positioned at air guide end opening 202, and And close the air guide end opening 202.Wherein by gas pump 22 is driven, air-flow is imported into water conservancy diversion via air guide end opening 202 The chamber 201 of carrier 20 simultaneously carries out heat exchange to electronic component 3, and is passed through the air-flow after heat exchange is carried out with the electronic component 3 Discharged by multiple stream guidance grooves 203, in order to the radiating realized to electronic component 3.

In some embodiments, water conservancy diversion carrier 20 can be but be not limited to a framework.In the present embodiment, air guide end opening 202 is the middle section for being located at first surface 20a.Electronic component 3 is disposed on a bearing substrate 4, and wherein bearing substrate 4 can For but be not limited to printed circuit board (PCB).Bearing substrate 4 is connected with the second surface 20b of water conservancy diversion carrier 20, and makes electronics unit Part 3 is placed in the chamber 201 of water conservancy diversion carrier 20.Multiple stream guidance grooves 203 are disposed on second surface 20b, and with radial Mode stretches out.In some embodiments, the exhaust end opening 205 that the other end of multiple stream guidance grooves 203 is formed is Positioned at multiple side walls 204 and multiple edge 207 of water conservancy diversion carrier 20, can make whereby air-flow in the periphery of water conservancy diversion carrier 20 to Outer discharge.

In the present embodiment, it is a piezoelectric actuated gas pump that gas pump 22 is, dynamic to drive gas flow.Gas pump 22 is It is fixedly arranged on the first surface 20a of water conservancy diversion carrier 20, and assembling is positioned at air guide end opening 202, and close the air guide end and open Mouth 202.Bearing substrate 4 is the second surface 20b that laminating is arranged at water conservancy diversion carrier 20, in other words water conservancy diversion carrier 20 and gas pump 22 Assembly be that cover lid is engaged on bearing substrate 4, and make electronic component 3 and be placed in the chamber 201 of water conservancy diversion carrier 20.Borrow Air guide end opening 202 is closed by gas pump 22 and bearing substrate 4, air guide end opening 202, chamber 201 and multiple water conservancy diversion can be made The definition of air discharge duct 203 forms closed runner, can concentrate whereby and electronic component 3 is radiated, in order to heat radiation efficiency.It should be emphasized that It is that this case is not limited with forming closed runner, other runner forms can also be adjusted and change according to practical application request.When So, in another embodiment (not shown), water conservancy diversion carrier 20 may also set up a holding part, in the periphery of air guide end opening 202, imply that Holding part is the groove that first surface 20a caves inward, and in the periphery of air guide end opening 202, the direct-assembling of gas pump 22 is in accommodating Air guide end opening 202 is closed in portion, can also equally implement the thermolysis of above-mentioned air cooling heat abstractor 2.Such gas pump 22 it is recessed put the design being assembled in holding part, to reduce the whole height of air cooling heat abstractor 2, and can reach lightening effect Really.

In the present embodiment, gas pump 22 is dynamic to drive gas flow, by gas by air cooling heat abstractor 2 outside Portion is imported in chamber 201 via air guide end opening 202.When gas pump 22 introduces gas into chamber 201, gas and chamber are imported Electronic component 3 in room 201 carries out heat exchange, and promotes the air-flow in chamber 201 quickly to flow, and promotes the air-flow after heat exchange Heat energy is drained into the outside of air cooling heat abstractor 2 via multiple stream guidance grooves 203 of water conservancy diversion carrier 20.Because gas pump 22 is Continuously start makes electronic component 3 to carry out heat exchange with the gas being continuously introduced into, while after making heat exchange to import gas Gas is discharged via multiple stream guidance grooves 203 of water conservancy diversion carrier 20, the radiating to electronic component 3 can be realized whereby, and can carry High heat dissipation efficiency, and then increase stable performance degree and the life-span of electronic component 3.

Fig. 4 is the cross section structure schematic diagram of the air cooling heat abstractor of this case second embodiment.As shown in figure 4, the present embodiment Air cooling heat abstractor 2a it is similar to the air cooling heat abstractor 2 shown in Fig. 2 B, and identical element numbers represent identical structure, Element and function, repeat no more in this.Compared to the air cooling heat abstractor 2 shown in Fig. 2 B, the air cooling heat abstractor of the present embodiment 2a further includes a radiator 25, is connected in the surface of electronic component 3 and in chamber 201.Radiator 25 includes a bottom Seat 251 and multiple fin 252, base 251 are attached at the surface of electronic component 3, and multiple fin 252 are to be vertically connected at bottom Seat 251.By the setting of radiator 25, area of dissipation can be increased, make the heat energy produced by electronic component 3 can be via radiator 25 And heat exchange is carried out with the gas imported in chamber 201, in order to heat radiation efficiency.

Fig. 5 is the cross section structure schematic diagram of the air cooling heat abstractor of this case 3rd embodiment.As shown in figure 5, the present embodiment Air cooling heat abstractor 2b it is similar to the air cooling heat abstractor 2 shown in Fig. 2 B, and identical element numbers represent identical structure, Element and function, repeat no more in this.Compared to the air cooling heat abstractor 2 shown in Fig. 2 B, the air cooling heat abstractor of the present embodiment 2b includes a heat conduction tubing string 26, is connected in the surface of electronic component 3 and in chamber 201.Heat conduction tubing string 26 is attached at The surface of electronic component 3, and heat conduction tubing string 26 is as made by the Heat Conduction Material of tool high thermal conductivity coefficient.In some embodiments, lead One end of heat pipe post 26 is to extend the outside of water conservancy diversion carrier 20 by the side wall 204 of water conservancy diversion carrier 20 to sit heat exchange, and heat conduction tubing string 26 other end extends to the surface of electronic component 3 and is in contact with electronic component 3.By the setting of heat conduction tubing string 26, can make Heat energy produced by electronic component 3 can more quickly carry out heat exchange via heat conduction tubing string 26 with the gas in chamber 201, in order to Heat radiation efficiency.

Fig. 6 A and 6B are respectively the gas pump of this case preferred embodiment in the decomposition texture schematic diagram of different visual angles, and Fig. 7 is The cross-sectional view of the piezo-activator shown in Fig. 6 A and 6B, and the section that Fig. 8 is the gas pump shown in Fig. 6 A and 6B Structural representation.As shown in Fig. 6 A, 6B, 7 and 8, it is a piezoelectric actuated gas pump that gas pump 22 is, and including inlet plate 221, altogether Shake the structures such as piece 222, piezo-activator 223, insulating trip 2241,2242 and conducting strip 225, wherein piezo-activator 223 is right Should be set in resonance plate 222, and make inlet plate 221, resonance plate 222, piezo-activator 223, insulating trip 2241, conducting strip 225 and the grade of another insulating trip 2242 sequentially stack setting, its profile being completed is as shown in Figure 8.

In the present embodiment, inlet plate 221 has an at least air admission hole 221a, and wherein the quantity of air admission hole 221a is with 4 For preferable, but it is not limited.Air admission hole 221a is through inlet plate 221, and atmospheric pressure is complied with from outside device to supplied gas Effect and among this at least an air admission hole 221a inflow gas pump 22.Have at least one to conflux round on inlet plate 221 221b, is correspondingly arranged at least air admission hole 221a with another surface of inlet plate 221.In the center of the round 221b that confluxes That, with central recess 221c, and central recess 221c is connected with the round 221b that confluxes at exchange, whereby can by from this extremely The gas that a few air admission hole 221a enters the round 221b that confluxes is guided and confluxed and is concentrated to central recess 221c, to realize that gas is passed Pass.In the present embodiment, inlet plate 221 has integrally formed air admission hole 221a, conflux round 221b and central recess 221c, And a chamber that confluxes for confluxing gas is correspondingly formed at central recess 221c, it is temporary with supplied gas.In some embodiments, The material of inlet plate 221 can be constituted by such as but not limited to stainless steel.In other embodiments, by the central recess The depth of the chamber that confluxes constituted at 221c is identical with the depth of the round 221b that confluxes, but is not limited.Resonance plate 222 is It is made up of a flexible materials, but is not limited, and in having a hollow bore 2220 on resonance plate 222, is corresponded to The central recess 221c of inlet plate 221 and set so that gas circulate.In other embodiments, resonance plate 222 is can be by one Copper material is constituted, but is not limited.

Piezo-activator 223 is by a suspension board 2231, at least a housing 2232, a support 2233 and a piezoelectric patches 2234 assemble jointly, wherein, the piezoelectric patches 2234 is attached at the first surface 2231c of suspension board 2231, is used to apply Voltage produces deformation to drive the flexural vibrations of suspension board 2231, and an at least support 2233 is to be connected to suspension board Between 2231 and housing 2232, in the present embodiment, the support 2233 is to be connected in suspension board 2231 and housing 2232 Between, its two-end-point is to be connected to housing 2232, suspension board 2231, to provide resilient support, and in support 2233, suspension An at least space 2235 is had more between plate 2231 and housing 2232, an at least space 2235 is and the phase of air guide end opening 202 Connection, circulates to supplied gas.It is emphasized that the kenel and quantity of suspension board 2231, housing 2232 and support 2233 are not It is limited with previous embodiment, and can be changed according to practical application request.In addition, housing 2232 be around be arranged at suspension board 2231 it Outside, and with the conductive connecting pin 2232c of an outside projection, the use of the connection that is used to power, but be not limited.

Suspension board 2231 is the structure (as shown in Figure 7) for a cascaded surface, is implied that in the second surface of suspension board 2231 2231b has more a convex portion 2231a, and convex portion 2231a can be but not be limited to a circular protrusions structure.The convex portion of suspension board 2231 2231a is the second surface 2232a coplines with housing 2232, and suspension board 2231 second surface 2231b and support 2233 Second surface 2233a also be copline, and the suspension board 2231 convex portion 2231a and the second surface 2232a of housing 2232 It is that there is a certain depth between the second surface 2231b of suspension board 2231 and the second surface 2232a of support 2233.Suspend The first surface 2231c of plate 2231, it is with the first surface 2232b of housing 2232 and the first surface 2233b of support 2233 Smooth coplanar structure, and piezoelectric patches 2234 is then attached at the first surface 2231c of this smooth suspension board 2231.In another In some embodiments, the kenel of suspension board 2231 also can be a two-sided smooth tabular square structure, be not limited thereto, can Appoint and apply change according to situation is actually applied.In some embodiments, suspension board 2231, support 2233 and housing 2232 are can The structure being formed in one, and can be made up of a metallic plate, such as but not limited to stainless steel is constituted.Again in other In embodiment, the length of side of piezoelectric patches 2234 is less than the length of side of the suspension board 2231.In other embodiments, piezoelectric patches 2234 length of side is equal to the length of side of suspension board 2231, and same design is the square tabular knot corresponding with suspension board 2231 Structure, but be not limited thereto.

The insulating trip 2241 of gas pump 22, conducting strip 225 and another insulating trip 2242 are sequentially to be correspondingly arranged in piezoelectricity cause Under dynamic device 223, and its form approximately corresponds to the form of the housing 2232 of piezo-activator 223.In some embodiments In, insulating trip 2241,2242 is made up of isolation material, such as but not limited to plastic cement, in order to offer insulation function.In other In embodiment, conducting strip 225 can be made up of conductive material, such as but not limited to metal material, and function is conducted to provide.In In the present embodiment, a conductive connecting pin 225a also can be set on conducting strip 225, to realize conducting function.

In the present embodiment, gas pump 22 is sequentially by inlet plate 221, resonance plate 222, piezo-activator 223, insulating trip 2241st, the stacking such as conducting strip 225 and another insulating trip 2242 is formed, and is tool between resonance plate 222 and piezo-activator 223 There is a gap h, be the gap h between the periphery of housing 2232 of resonance plate 222 and piezo-activator 223 in the present embodiment In insert a filling material, such as but not limited to conducting resinl so that the suspension board 2231 of resonance plate 222 and piezo-activator 223 Convex portion 2231a between can maintain the depth of gap h, and then air-flow can be guided more quickly flow, and because of suspension board 2231 Convex portion 2231a and resonance plate 222 keep the suitable distance interference that makes to contact with each other to reduce, promoting noise to produce can be lowered.In In other embodiments, also can be by the height of the housing 2232 for increasing piezo-activator 223, so that it is 222 groups with resonance plate Increase by a gap during dress, but be not limited.

In the present embodiment, resonance plate 222 has an a movable part 222a and fixed part 222b, when inlet plate 221, resonance Piece 222 can be collectively forming at movable part 222a with after piezo-activator 223 sequentially corresponding assembling with inlet plate 221 thereon One chamber for confluxing gas, and a first chamber 220 is more formed between resonance plate 222 and piezo-activator 223, it is configured to temporarily store Gas, and first chamber 220 be through resonance plate 222 hollow bore 2220 and with the central recess 221c of inlet plate 221 at Chamber be connected, and first chamber 220 both sides then by the space 2235 between the support 2233 of piezo-activator 223 with The air guide end opening 202 being arranged under it is connected.

Fig. 9 A to 9E are the flowage structure figure of the gas pump start shown in Fig. 6 A and 6B.Fig. 8, Fig. 9 A to Fig. 9 E are referred to, The start process description of the gas pump of this case is as follows.When gas pump 22 carries out start, piezo-activator 223 is by voltage actuation With support 2233 as fulcrum, the reciprocating vibration of vertical direction is carried out.As shown in Figure 9 A, when piezo-activator 223 is caused by voltage When moving and vibrating downwards, it is light, thin laminated structure to be due to resonance plate 222, is when piezo-activator 223 vibrates, to be total to Shake piece 222 also can with resonance carry out vertical reciprocating vibration, the as part of the corresponding central recess 221c of resonance plate 222 Also can with flexural vibrations deformation, i.e. the part of correspondence central recess 221c is the movable part 222a for resonance plate 222, be with When piezo-activator 223 is bent downwardly vibration, now the movable part 222a of the corresponding central recess 221c of resonance plate 222 can be because of gas Body bring into and push and the vibration of piezo-activator 223 drive, and as piezo-activator 223 is bent downwardly vibration shape Become, then gas is entered by least air admission hole 221a on inlet plate 221, and conflux round 221b to be pooled to through at least one Center central recess 221c at, then via the hollow bore 2220 being correspondingly arranged with central recess 221c on resonance plate 222 to Under flow into first chamber 220.Thereafter, due to being driven by the vibration of piezo-activator 223, resonance plate 222 also can be total to Shake and carry out vertical reciprocating vibration, as shown in Figure 9 B, now the movable part 222a of resonance plate 222 also with downward vibration, And attach contact at piezo-activator 223 suspension board 2231 convex portion 2231a on, make the convex portion 2231a of suspension board 2231 with The spacing of the chamber that confluxes between outer region and the fixed part 222b of the both sides of resonance plate 222 will not diminish, and by this resonance The deformation of piece 222, to compress the volume of first chamber 220, and closes the middle flow space of first chamber 220, promotes in it Gas is pushed and flowed to both sides, and then passes through stream downwards by the space 2235 between the support 2233 of piezo-activator 223 It is dynamic.Afterwards, as shown in 9C figures, the movable part 222a of resonance plate 222 is bent upwards vibration deformation, and returns back to initial position, And piezo-activator 223 is driven to vibrate upwards by voltage, the volume of so same extruding first chamber 220, only now due to Piezo-activator 223 is upward lifting, so that the gas in first chamber 220 can flow towards both sides, and then drives gas Constantly an at least air admission hole 221a from inlet plate 221 enters, then flows into the chamber that central recess 221c is formed.It Afterwards, as shown in 9D figures, the resonance plate 222 is resonated upwards by the vibration of the upward lifting of piezo-activator 223, now resonance plate 222 movable part 222a also with upward vibration, an and then mitigation of gases at least air admission hole constantly from inlet plate 221 221a enters, then flows into the chamber that central recess 221c is formed.Finally, as shown in 9E figures, the movable part of resonance plate 222 222a also returns back to initial position.Thus implement aspect and understand that, when resonance plate 222 carries out vertical reciprocating vibration, being can By it with the gap h between piezo-activator 223 to increase the ultimate range of its vertical displacement, in other words, in two structure Between gap h is set the resonance plate 222 can be produced upper and lower displacement by a larger margin when resonance.Therefore through this gas pump Barometric gradient is produced in 22 runner design, makes gas flow at high rates, and enter the resistance difference of outgoing direction through runner, by gas Transmitted to outlet side by suction side, to complete gas conveying operation, even if in the state of outlet side has air pressure, still having the ability to hold It is continuous to push air into air guide end chamber 23a, and Jing Yin effect is can reach, the start of gas pump 22 of Fig. 9 A to 9E is so repeated, Gas pump 22 can be made to produce the gas transport of an ecto-entad.

From the above, through the start of above-mentioned gas pump 22, the chamber 201 of water conservancy diversion carrier 20 is introduced gas into, makes to be led Enter gas carries out heat exchange with electronic component 3, and promotes the gas in chamber 201 quickly to flow, and promotes the gas after heat exchange Air cooling heat abstractor 2 is drained at multiple stream guidance grooves 203 by heat energy via water conservancy diversion carrier 20 outside, it is scattered to improve whereby The efficiency of heat cooling, and then increase stable performance degree and the life-span of electronic component 3.

Figure 10 is the configuration diagram of the air cooling heat abstractor of the preferred embodiment of this case the 3rd.As shown in Figure 10, this implementation The air cooling heat abstractor 2c of example is similar to the air cooling heat abstractor 2 shown in Fig. 2 B, and identical element numbers represent identical knot Structure, element and function, repeat no more in this.Compared to the air cooling heat abstractor 2 shown in Fig. 2 B, the air cooling radiating dress of the present embodiment It is that, with function of temperature control, it further includes control system 21 to put 2c, and the control system 21 includes control unit 211 and temperature sensor 212, wherein control unit 21 is electrically connected with gas pump 22, to control the running of gas pump 22.Temperature sensor 212 is to set In in the chamber 201 of water conservancy diversion carrier 20, and electronic component 3 is adjacent to, for sensing the temperature of electronic component 3.TEMP Device 212 is electrically connected to control unit 21, the temperature near sensing electronic component 3, or is attached directly to feel on electronic component 3 The temperature of electronic component 3 is surveyed, and sensing signal is transmitted to control unit 211.Control unit 211 is according to temperature sensor 212 Whether sensing signal, judge the temperature of the electronic component 3 higher than a temperature threshold value, when control unit 211 judges electronics unit When the temperature of part 3 is higher than the temperature threshold value, a control signal to gas pump 22 is sent, operated with enable gas pump 22, whereby Gas pump 22 is set to drive the air current flow to carry out cooling with to electronic component 3, so that the cooling of electronic component 3 and reducing temperature Degree.When control unit 211 judges that the temperature of the electronic component 3 is less than the temperature threshold value, a control signal to gas is sent Pump 22, is operated with stopping gas pump 22, the continued operation of gas pump 22 can be avoided whereby and causes reduced lifetime, reduces extra energy The consume of amount.Therefore through the setting of control system 21, making the gas pump 22 of air cooling heat abstractor 2 in the temperature mistake of electronic component 3 Cooling can be carried out when hot, and is decommissioned in after the reduction of the temperature of electronic component 3, the continued operation of gas pump 22 can be avoided whereby And cause reduced lifetime, and the consume of extra energy is reduced, can also make electronic component 3 in being operated under a preferred temperature environment, carry The stability of electronic component high 3.

In sum, this case provides a kind of air cooling heat abstractor, and it can be applied to various electronic equipments with to its inside Electronic element radiating, in order to heat radiation efficiency, reduces noise, and make the stable performance of electronic equipment internal electronic component and extend Service life.Additionally, the air cooling heat abstractor of this case, it has function of temperature control, can be according to electronic equipment internal electronic component Temperature change, controls the running of gas pump, in order to heat radiation efficiency, and the service life for extending heat abstractor.

This case appointed as person familiar with the technology apply craftsman think and be it is all as modify, so neither take off such as attached claim Be intended to Protector.

【Symbol description】

11：Electronic component

12：Thermal transfer plate

13：Heat-conducting glue

2、2a、2b、2c：Air cooling heat abstractor

20：Water conservancy diversion carrier

20a：First surface

20b：Second surface

201：Chamber

202：Air guide end opening

203：Stream guidance groove

204：Side wall

205：Exhaust end opening

207：Corner

21：Control system

211：Control unit

212：Temperature sensor

22：Gas pump

220：First chamber

221：Inlet plate

221a：Air admission hole

221b：Conflux round

221c：Central recess

222：Resonance plate

222a：Movable part

222b：Fixed part

2220：Hollow bore

223：Piezo-activator

2231：Suspension board

2231a：Convex portion

2231b：Second surface

2231c：First surface

2232：Housing

2232a：Second surface

2232b：First surface

2232c：Conductive connecting pin

2233：Support

2233a：Second surface

2233b：First surface

2234：Piezoelectric patches

2235：Space

2241、2242：Insulating trip

225：Conducting strip

225a：Conductive connecting pin

25：Radiator

251：Base

252：Fin

26：Heat conduction tubing string

3：Electronic component

4：Bearing substrate.

Claims (12)

1. a kind of air cooling heat abstractor, for an electronic element radiating, it is characterised in that the air cooling heat abstractor is included：

One water conservancy diversion carrier, including a first surface, a second surface, a chamber, an air guide end opening and multiple stream guidances Groove, the wherein chamber run through the first surface and the second surface, the air guide end opening be arranged at the first surface and with the chamber Room is connected, and the plurality of stream guidance groove is arranged at the second surface and is connected with the chamber, and wherein the electronic component is to hold It is placed in the chamber；And

One gas pump, is arranged at the first surface of the water conservancy diversion carrier, and closes the air guide end opening, wherein by the driving gas Body pump, the chamber is imported by air-flow via the air guide end opening, and heat exchange is carried out to the electronic component, and will be with the electronics Element carries out the air-flow after heat exchange and is discharged via the plurality of stream guidance groove.

2. air cooling heat abstractor as claimed in claim 1, it is characterised in that it further includes a bearing substrate, carries with the water conservancy diversion The second surface of body is connected, and wherein the electronic component is disposed on the bearing substrate.

3. air cooling heat abstractor as claimed in claim 2, it is characterised in that its water conservancy diversion carrier further sets and houses Portion, is the groove that the first surface caves inward, in air guide end opening periphery, the gas pump direct-assembling on the holding part, And close the air guide end opening.

4. air cooling heat abstractor as claimed in claim 1, it is characterised in that it is a framework that the water conservancy diversion carrier is.

5. air cooling heat abstractor as claimed in claim 1, it is characterised in that the gas pump is a piezoelectric actuated gas pump.

6. air cooling heat abstractor as claimed in claim 5, it is characterised in that the piezoelectric actuated gas pump includes：

One inlet plate, confluxes with an at least air admission hole, at least one and round and constitutes a central recess for confluxing chamber, wherein An at least air admission hole supplies to import air-flow, the corresponding air admission hole of the round that confluxes, and guides the air-flow of the air admission hole to converge into this The chamber that confluxes that central recess is constituted；

One resonance plate, with a hollow hole corresponding to around the chamber that confluxes, and the hollow hole be a movable part；And

One piezo-activator, setting corresponding with the resonance plate；

Wherein, there is a gap to form a chamber between the resonance plate and the piezo-activator, so that the piezo-activator is driven When dynamic, air-flow is imported by an at least air admission hole for the inlet plate, the central recess be collected to through at least one round that confluxes, The hollow hole of the resonance plate is passed through, to enter in the chamber, is produced by the movable part of the piezo-activator and the resonance plate Resonance transfer air-flow.

7. air cooling heat abstractor as claimed in claim 6, it is characterised in that the piezo-activator is included：

One suspension board, with a first surface and a second surface, and flexible vibration；

One housing, around the outside for being arranged at the suspension board；

An at least support, is connected between the suspension board and the housing, to provide resilient support；And

One piezoelectric patches, with a length of side, the length of side is less than or equal to a length of side of the suspension board, and the piezoelectric patches is attached at this and hangs On one first surface of kickboard, to applied voltage driving the suspension board flexural vibrations.

8. air cooling heat abstractor as claimed in claim 7, it is characterised in that the suspension board is a square suspension board, and is had There is a convex portion.

9. air cooling heat abstractor as claimed in claim 7, it is characterised in that the piezoelectric actuated gas pump include a conducting strip, One first insulating trip and one second insulating trip, the wherein inlet plate, the resonance plate, the piezo-activator, first insulating trip, The conducting strip and second insulating trip sequentially stack setting.

10. air cooling heat abstractor as claimed in claim 1, it is characterised in that it further includes a control system, the control system Including：

One control unit, is electrically connected to the gas pump, to control the gas pump to operate；And

One temperature sensor, is electrically connected to the control unit and is adjacent to the electronic component, to sense a temperature of the electronic component Spend to export a sensing signal to the control unit；

Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door During threshold value, the control unit makes the gas pump enable, to drive air current flow, and when the control unit is in receiving the sensing Signal, and when judging the temperature of the electronic component less than the temperature threshold value, the control unit makes the gas pump decommission.

11. a kind of air cooling heat abstractors, for an electronic element radiating, the air cooling heat abstractor to be included：

One water conservancy diversion carrier, including a first surface, a second surface, a chamber, an air guide end opening and multiple stream guidances Groove, the wherein chamber run through the first surface and the second surface, the air guide end opening be arranged at the first surface and with the chamber Room is connected, and the plurality of stream guidance groove is arranged at the second surface and is connected with the chamber, and wherein the electronic component is to hold It is placed in the chamber；

One radiator, is attached at the electronic component, and positioned at the chamber；And

One gas pump, is arranged at the first surface of the water conservancy diversion carrier, and closes the air guide end opening, wherein by the driving gas Body pump, the chamber is imported by air-flow via the air guide end opening, and heat exchange is carried out to the electronic component, and will be with the electronics Element carries out the air-flow after heat exchange and is discharged via the plurality of stream guidance groove.

12. a kind of air cooling heat abstractors, for an electronic element radiating, it is characterised in that the air cooling heat abstractor is included：

One water conservancy diversion carrier, including a first surface, a second surface, a chamber, an air guide end opening and multiple stream guidances Groove, the wherein chamber run through the first surface and the second surface, the air guide end opening be arranged at the first surface and with the chamber Room is connected, and the plurality of stream guidance groove is arranged at the second surface and is connected with the chamber, and wherein the electronic component is to hold It is placed in the chamber；

One heat conduction tubing string, is attached at the surface of the electronic component, and positioned at the chamber；And

One gas pump, is arranged at the first surface of the water conservancy diversion carrier, and closes the air guide end opening, wherein by the driving gas Body pump, the chamber is imported by air-flow via the air guide end opening, and heat exchange is carried out to the electronic component, and will be with the electronics Element carries out the air-flow after heat exchange and is discharged via the plurality of stream guidance groove.