CN206251547U - Air cooling heat abstractor and system - Google Patents

Air cooling heat abstractor and system Download PDF

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Publication number
CN206251547U
CN206251547U CN201621265395.9U CN201621265395U CN206251547U CN 206251547 U CN206251547 U CN 206251547U CN 201621265395 U CN201621265395 U CN 201621265395U CN 206251547 U CN206251547 U CN 206251547U
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CN
China
Prior art keywords
air
water conservancy
conservancy diversion
electronic component
end opening
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Expired - Fee Related
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CN201621265395.9U
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Chinese (zh)
Inventor
陈世昌
廖家淯
韩永隆
黄启峰
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Microjet Technology Co Ltd
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Microjet Technology Co Ltd
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Priority to CN201621265395.9U priority Critical patent/CN206251547U/en
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Abstract

A kind of air cooling heat abstractor and system, it is to be adjacent to electronic component and it is radiated.Air cooling heat abstractor includes water conservancy diversion carrier and gas pump.Water conservancy diversion carrier includes first and second surface, two side, water conservancy diversion chamber, air guide end opening and multiple stream guidance grooves.The first surface and the second surface are respectively arranged at the upper and lower surface of the two side, the air guide end opening is disposed on the first surface, the water conservancy diversion chamber runs through the second surface, and be connected with the air guide end opening, the plurality of stream guidance groove is arranged at this and wherein side wall and is connected with the water conservancy diversion chamber, and to should electronic component.Gas pump is arranged at first surface, and closing air guide end opening.By gas pump is driven, air-flow is imported into water conservancy diversion chamber, and air-flow is discharged through multiple stream guidance grooves, there is provided lateral airflow to electronic component simultaneously carries out heat exchange.

Description

Air cooling heat abstractor and system
【Technical field】
This case be on a kind of air cooling heat abstractor, it is espespecially a kind of to provide drive air-flow to be radiated using gas pump Air cooling heat abstractor and air cooling cooling system.
【Background technology】
With the development of science and technology various electronic equipments such as portable computer, panel computer, industrial computer, portable logical News device, audio and video player etc. are towards lightening, portable and dynamical trend development, and these electronic equipments are limited in its Various integrations high or high-power electronic component must be configured in inner space, in order that the arithmetic speed of electronic equipment is faster With it is with better function, the electronic component of electronic equipment internal will produce more heat energy when running, and cause high temperature.Additionally, These electronic equipments major part is all designed as frivolous, flat and has compact external form, and is used to radiate without extra inner space Cooling, therefore the electronic component in electronic equipment is vulnerable to the influence of heat energy, high temperature, and then the problems such as cause interference with or be damaged.
In general, the radiating mode of electronic equipment internal can be divided into active radiating and passive heat radiation.It is active to dissipate It is hot that electronic equipment internal is generally arranged at using tube-axial fan or blast type fan, by tube-axial fan or blast type fan Air-flow is driven, the heat energy transfer produced by electronic equipment internal electronic component radiates in order to realization.However, tube-axial fan And blast type fan can produce larger noise in running, and its volume is larger is difficult to be thinned and minimizes, moreover axle stream The service life of formula fan and blast type fan is shorter, thus traditional tube-axial fan and blast type fan be not particularly suited for it is frivolous Radiating is realized in change and portable electronic equipment.
Furthermore, many electronic components can using such as surface mount technology (Surface Mount Technology, SMT), the technology such as Selective Soldering (Selective Soldering) is welded in printed circuit board (PCB) (Printed Circuit Board, PCB) on, but the electronic component welded using foregoing welding manner, in through being in heat energy high, high temperature ring for a long time Under border, electronic component is easily set to be separated with printed circuit board (PCB), and most of electronic component also non-refractory, if electronic component is long Time is under heat energy high, hot environment, and the stable performance degree for being easily caused electronic component declines and reduced lifetime.
It is the structural representation of traditional heat-dissipating mechanism that Fig. 1 is.As shown in figure 1, traditional heat-dissipating mechanism is for a passive type dissipates Heat engine structure, it includes thermal transfer plate 12, and the thermal transfer plate 12 is by a heat-conducting glue 13 electronic component 11 phase to be radiated with Laminating, by the heat conduction path that heat-conducting glue 13 and thermal transfer plate 12 are formed, electronic component 11 can be made using heat transfer and Free convection mode reaches radiating.However, the radiating efficiency of foregoing cooling mechanism is poor, it is impossible to meet application demand.
In view of this, it is necessary to develop a kind of air cooling heat abstractor in fact, to solve prior art problem encountered.
【Utility model content】
The purpose of this case is to provide a kind of air cooling heat abstractor and system, and it can be applied to various electronic equipments, with right The electronic component of electronic equipment internal carries out crosswind thermal convection current radiating, in order to heat radiation efficiency, reduces noise, makes in electronic equipment The stable performance of portion's electronic component simultaneously increases the service life, and without being superimposed radiator on electronic component, can make overall electronics Device thickness reaches lightening.
The another object of this case is to provide a kind of air cooling heat abstractor and system, and it has function of temperature control, can be according to electricity The temperature change of sub- device interior electronic component, controls the running of gas pump, in order to heat radiation efficiency, and extension air cooling radiating The service life of device.
It is that, up to above-mentioned purpose, to provide a kind of air cooling heat abstractor, it is to be adjacent to a broader pattern of implementing of this case Electronic component, is used to electronic element radiating, and air cooling heat abstractor is included:Water conservancy diversion carrier, comprising first surface, second surface, Two side, water conservancy diversion chamber, holding part, air guide end opening and multiple stream guidance grooves, the wherein first surface and second table Face is respectively arranged at the upper and lower surface of the two side, and the air guide end opening is disposed on the first surface, and the water conservancy diversion chamber runs through The second surface, and being connected with the air guide end opening, the plurality of stream guidance groove is arranged at this and wherein side wall and is led with this Stream chamber is connected, and to should electronic component;And gas pump, it is arranged at the first surface of water conservancy diversion carrier, and closing air guide End opening, wherein by gas pump is driven, air-flow is imported into water conservancy diversion chamber via air guide end opening, makes air-flow be led through multiple Stream air discharge duct discharge, heat exchange is carried out to provide lateral airflow to electronic component and with electronic component.
It is that, up to above-mentioned purpose, another broader implementation pattern of this case is used to electricity to provide a kind of air cooling cooling system Subcomponent is radiated, and air cooling cooling system is included:Multiple air cooling heat abstractors, are adjacent to electronic component respectively, and each air cooling dissipates Thermal is included:Water conservancy diversion carrier, comprising first surface, second surface, two side, water conservancy diversion chamber, holding part, air guide end opening with And multiple stream guidance grooves, wherein first surface and the second surface be respectively arranged at the upper and lower surface of the two side, and this is led Gas end opening is disposed on the first surface, and the water conservancy diversion chamber runs through the second surface, and is connected with the air guide end opening, should Multiple stream guidance grooves are arranged at this and wherein side wall and are connected with the water conservancy diversion chamber, and to should electronic component;And gas Body pump, is arranged at the first surface of water conservancy diversion carrier, and closing air guide end opening, wherein by gas pump is driven, air-flow is passed through Water conservancy diversion chamber is imported by air guide end opening, air-flow is discharged through multiple stream guidance grooves, to provide lateral airflow to electronics unit Part.
【Brief description of the drawings】
Fig. 1 is the structural representation of traditional heat-dissipating mechanism.
Fig. 2A is the structural representation of the air cooling heat abstractor of this case first embodiment.
Fig. 2 B are the air cooling heat abstractor shown in Fig. 2A in the structural representation of Section A-A.
Fig. 3 A and 3B are the water conservancy diversion carrier shown in Fig. 2A in the structural representation of different visual angles.
Fig. 4 is the configuration diagram of the air cooling cooling system of this case preferred embodiment.
Fig. 5 A and 5B are respectively the gas pump of this case preferred embodiment in the decomposition texture schematic diagram of different visual angles.
Fig. 6 is the cross-sectional view of the piezo-activator shown in Fig. 5 A and 5B.
Fig. 7 is the cross-sectional view of the gas pump shown in Fig. 5 A and 5B.
Fig. 8 A to 8E are the flowage structure figure of the gas pump start shown in Fig. 5 A and 5B.
Fig. 9 is the configuration diagram of the air cooling heat abstractor of this case second embodiment.
【Specific embodiment】
Embodying this pattern characteristics will in detail describe with some exemplary embodiments of advantage in the explanation of back segment.It should be understood that This case can have various changes, its scope for all not departing from this case, and explanation therein and diagram in different aspects Inherently it is illustrated as being used, and nand architecture is in limitation this case.
Fig. 2A is the structural representation of the air cooling heat abstractor of this case first embodiment, and Fig. 2 B are that the air cooling shown in Fig. 2A dissipates Hot charging is placed in the structural representation of Section A-A, and Fig. 3 A and 3B are water conservancy diversion carrier shown in Fig. 2A in the structure of different visual angles Schematic diagram.As shown in Fig. 2A, 2B, 3A and 3B, the air cooling heat abstractor 2 of this case can be applied to an electronic equipment, for example but not limit In portable computer, panel computer, industrial computer, portable communication device, audio and video player, with to waiting to radiate in electronic equipment Electronic component 3 radiated.The air cooling heat abstractor 2 of this case includes water conservancy diversion carrier 20 and gas pump 22.Water conservancy diversion carrier 20 Including first surface 20a, second surface 20b, water conservancy diversion chamber 200, air guide end opening 201, holding part 202, multiple stream guidances Groove 203 and two side 204a, 204b.Wherein, first surface 20a and second surface 20b are respectively arranged at the two side The upper and lower surface of 204a, 204b, and the air guide end opening 201 sets and connected on first surface 20a water conservancy diversion chamber 200, holding part 202 is recessed in first surface 20a and in the periphery of air guide end opening 201, implies that holding part 202 concaves for first surface 20a Sunken groove, in the periphery of air guide end opening 201.Water conservancy diversion chamber 200 runs through second surface 20b, and air guide end opening 201 and water conservancy diversion Chamber 200 is connected.Multiple stream guidance grooves 203 are disposed on wherein side wall 204b, and be communicated in water conservancy diversion chamber 200 and Air cooling heat abstractor 2 is outside.Gas pump 22 is that assembling is positioned in the holding part 202 of water conservancy diversion carrier 20, and closes air guide End opening 201.Wherein by gas pump 22 is driven, air-flow is imported the water conservancy diversion of water conservancy diversion carrier 20 via air guide end opening 201 Chamber 200, and gas is quickly flowed out via multiple stream guidance grooves 203, and provide lateral airflow to electronic component 3 and enter Row heat exchange, in order to the radiating realized to electronic component 3.
In the present embodiment, electronic component 3 is disposed on a bearing substrate 4, and wherein bearing substrate 4 can be but be not limited to Printed circuit board (PCB).The part of bearing substrate 4 is to be connected with water conservancy diversion carrier 20 and closed stream lending chamber 200, implies that water conservancy diversion carrier 20 is to be connected to bearing substrate 4 and be adjacent to electronic component 3.In the present embodiment, electronic component 3 corresponds to water conservancy diversion carrier 20 Multiple stream guidance grooves 203 multiple exhaust end opening 203a.
In the present embodiment, it is a piezoelectric actuated gas pump that gas pump 22 is, dynamic to drive gas flow.Gas pump 22 is It is fixedly arranged in the holding part 202 of water conservancy diversion carrier 20, and assembling is positioned at air guide end opening 201, and close the air guide end opening 201.The second surface 20b of water conservancy diversion carrier 20 is that laminating is arranged at the part of bearing substrate 4, in other words, water conservancy diversion carrier 20 and gas The assembly of body pump 22 is that cover lid is engaged on bearing substrate 4, is disposed adjacent with electronic component 3, and makes multiple stream guidance grooves 203 pairs should electronic component 3.By gas pump 22 and the closing air guide of bearing substrate 4 end opening 201 and water conservancy diversion chamber 200, can make Air guide end opening 201, water conservancy diversion chamber 200 and the definition of multiple stream guidance grooves 203 form closed runner, whereby to electronics unit Part 3 radiates, in order to heat radiation efficiency.It is emphasized that this case is not limited with forming closed runner, other runner forms are also Can be adjusted and change according to practical application request.Certainly, in another embodiment (not shown), water conservancy diversion carrier 20 can also be not provided with Holding part 202, the direct-assembling of gas pump 22 can also equally be implemented above-mentioned in air guide end opening 201 is closed on first surface 20a Air cooling heat abstractor 2 thermolysis.
In the present embodiment, gas pump 22 is dynamic to drive gas flow, by gas by the outside of air cooling heat abstractor 2 Imported in water conservancy diversion chamber 200 via air guide end opening 201, and air-flow is quickly discharged via stream guidance groove 203.When gas pump 22 introduce gas into water conservancy diversion chamber 200, and when air-flow is quickly flowed out via multiple stream guidance grooves 203, what is provided is lateral Air-flow is by the electronic component 3 passed through on bearing substrate 4 and its ambient gas is formed convection current, and hot friendship is carried out in order to electronic component 3 Change, and make the air-flow after heat exchange that heat energy is taken away into electronic component 3.Due to gas pump 22 be continuously start to derive gas, Electronic component 3 is set to carry out heat exchange with continuous derived gas, while making the continuous rapid convective of the gas permeation after heat exchange And away from electronic component 3, the radiating to electronic component 3 can be realized whereby, and heat dissipation can be improved, make single unit system frivolous Change, and then increase stable performance degree and the life-span of electronic component 3.
Fig. 4 is the configuration diagram of the air cooling cooling system of this case preferred embodiment.As shown in figure 4, air cooling cooling system 5 Comprising multiple group air cooling heat abstractor 2 ', 2 ", it is used to radiate an electronic component 3.The gas of the air cooling cooling system 5 of the present embodiment Cooling and radiation device 2 ', 2 " are identical with the air cooling heat abstractor 2 shown in Fig. 2 B, and identical element numbers represent identical structure, Element and function, repeat no more in this.In the present embodiment, air cooling cooling system 5 includes two groups of air cooling heat abstractors 2 ', 2 ", Two groups of air cooling heat abstractors 2 ', 2 " are all arranged on bearing substrate 4, and are disposed adjacent respectively in electronic component 3, and make air cooling The stream guidance groove 203 of the water conservancy diversion carrier 20 of heat abstractor 2 ', 2 " all corresponds to electronic component 3.In some embodiments, this two Group air cooling heat abstractor 2 ', 2 " is the two opposite sides side for being adjacent to electronic component 3, and two groups of air cooling heat abstractors 2 ', 2 " The respective stream guidance groove 203 of respective water conservancy diversion carrier 20 is the two opposite sides side for corresponding respectively to electronic component 3.When two groups of air cooling When the respective drive gas flow of gas pump 22 of heat abstractor 2 ', 2 " is dynamic, two groups of air cooling heat abstractors 2 ', 2 " while by gas by it Outside is imported in respective water conservancy diversion chamber 200 via respective air guide end opening 201, and produces air-flow via respective stream guidance groove 203 quick discharges, and different sides in electronic component 3 provide lateral airflow, promote the electronic component 3 weeks on bearing substrate 4 Enclose gas to accelerate convection current and carry out heat exchange with electronic component 3, the radiating effect to electronic component 3 can be further improved whereby Can, and then increase stable performance degree and the life-span of electronic component 3.It is emphasized that the air cooling heat abstractor of air cooling cooling system 5 Quantity be not limited with above-described embodiment with configuration, its quantity can appoint according to practical application request and applies change with configuration.
Fig. 5 A and 5B are respectively the gas pump of this case preferred embodiment in the decomposition texture schematic diagram of different visual angles, and Fig. 6 is The cross-sectional view of the piezo-activator shown in Fig. 5 A and 5B, and the section that Fig. 7 is the gas pump shown in Fig. 5 A and 5B Structural representation.As shown in Fig. 5 A, 5B, 6 and 7, it is a piezoelectric actuated gas pump that gas pump 22 is, and including inlet plate 221, altogether Shake the structures such as piece 222, piezo-activator 223, insulating trip 2241,2242 and conducting strip 225, wherein piezo-activator 223 is right Should be set in resonance plate 222, and make inlet plate 221, resonance plate 222, piezo-activator 223, insulating trip 2241, conducting strip 225 and the grade of another insulating trip 2242 sequentially stack setting, its profile being completed is as shown in Figure 7.
In the present embodiment, inlet plate 221 has an at least air admission hole 221a, and wherein the quantity of air admission hole 221a is with 4 For preferable, but it is not limited.Air admission hole 221a is through inlet plate 221, and atmospheric pressure is complied with from outside device to supplied gas Effect and among this at least an air admission hole 221a inflow gas pump 22.Have at least one to conflux round on inlet plate 221 221b, is correspondingly arranged at least air admission hole 221a with another surface of inlet plate 221.In the center of the round 221b that confluxes That, with central recess 221c, and central recess 221c is connected with the round 221b that confluxes at exchange, whereby can by from this extremely The gas that a few air admission hole 221a enters the round 221b that confluxes is guided and confluxed and is concentrated to central recess 221c, to realize that gas is passed Pass.In the present embodiment, inlet plate 221 has integrally formed air admission hole 221a, conflux round 221b and central recess 221c, And a chamber that confluxes for confluxing gas is correspondingly formed at central recess 221c, it is temporary with supplied gas.In some embodiments, The material of inlet plate 221 can be constituted by such as but not limited to stainless steel.In other embodiments, by the central recess The depth of the chamber that confluxes constituted at 221c is identical with the depth of the round 221b that confluxes, but is not limited.Resonance plate 222 is It is made up of a flexible materials, but is not limited, and in having a hollow bore 2220 on resonance plate 222, is corresponded to The central recess 221c of inlet plate 221 and set so that gas circulate.In other embodiments, resonance plate 222 is can be by one Copper material is constituted, but is not limited.
Piezo-activator 223 is by a suspension board 2231, at least a housing 2232, a support 2233 and a piezoelectric patches 2234 assemble jointly, wherein, the piezoelectric patches 2234 is attached at the first surface 2231c of suspension board 2231, is used to apply Voltage produces deformation to drive the flexural vibrations of suspension board 2231, and an at least support 2233 is to be connected to suspension board 2231 And between housing 2232, in the present embodiment, the support 2233 is connected between suspension board 2231 and housing 2232, Its two-end-point is to be connected to housing 2232, suspension board 2231, to provide resilient support, and in support 2233, suspension board An at least space 2235 is had more between 2231 and housing 2232, an at least space 2235 is connected with air guide end opening 201 It is logical, circulated to supplied gas.It is emphasized that the kenel and quantity of suspension board 2231, housing 2232 and support 2233 not with Previous embodiment is limited, and can change according to practical application request.In addition, housing 2232 is to surround to be arranged at outside suspension board 2231 Side, and with the conductive connecting pin 2232c of an outside projection, the connection that is used to power is used, but is not limited.
Suspension board 2231 is the structure (as shown in Figure 6) for a cascaded surface, is implied that in the second surface of suspension board 2231 2231b has more a convex portion 2231a, and convex portion 2231a can be but not be limited to a circular protrusions structure.The convex portion of suspension board 2231 2231a is the second surface 2232a coplines with housing 2232, and suspension board 2231 second surface 2231b and support 2233 Second surface 2233a also be copline, and the suspension board 2231 convex portion 2231a and the second surface 2232a of housing 2232 It is that there is a certain depth between the second surface 2231b of suspension board 2231 and the second surface 2232a of support 2233.Suspend The first surface 2231c of plate 2231, it is with the first surface 2232b of housing 2232 and the first surface 2233b of support 2233 Smooth coplanar structure, and piezoelectric patches 2234 is then attached at the first surface 2231c of this smooth suspension board 2231.In another In some embodiments, the kenel of suspension board 2231 also can be a two-sided smooth tabular square structure, be not limited thereto, can Appoint and apply change according to situation is actually applied.In some embodiments, suspension board 2231, support 2233 and housing 2232 are can The structure being formed in one, and can be made up of a metallic plate, such as but not limited to stainless steel is constituted.Again in other In embodiment, the length of side of piezoelectric patches 2234 is less than the length of side of the suspension board 2231.In other embodiments, piezoelectric patches 2234 length of side is equal to the length of side of suspension board 2231, and same design is the square tabular knot corresponding with suspension board 2231 Structure, but be not limited thereto.
The insulating trip 2241 of gas pump 22, conducting strip 225 and another insulating trip 2242 are sequentially to be correspondingly arranged in piezoelectricity cause Under dynamic device 223, and its form approximately corresponds to the form of the housing 2232 of piezo-activator 223.In some embodiments, Insulating trip 2241,2242 is made up of isolation material, such as but not limited to plastic cement, in order to offer insulation function.In other realities Apply in example, conducting strip 225 can be made up of conductive material, such as but not limited to metal material, function is conducted to provide.Yu Ben In embodiment, a conductive connecting pin 225a also can be set on conducting strip 225, to realize conducting function.
In the present embodiment, gas pump 22 is sequentially by inlet plate 221, resonance plate 222, piezo-activator 223, insulating trip 2241st, the stacking such as conducting strip 225 and another insulating trip 2242 is formed, and is tool between resonance plate 222 and piezo-activator 223 There is a gap h, be the gap h between the periphery of housing 2232 of resonance plate 222 and piezo-activator 223 in the present embodiment In insert a filling material, such as but not limited to conducting resinl so that the suspension board 2231 of resonance plate 222 and piezo-activator 223 Convex portion 2231a between can maintain the depth of gap h, and then air-flow can be guided more quickly flow, and because of suspension board 2231 Convex portion 2231a and resonance plate 222 keep the suitable distance interference that makes to contact with each other to reduce, promoting noise to produce can be lowered.In In other embodiments, also can be by the height of the housing 2232 for increasing piezo-activator 223, so that it is 222 groups with resonance plate Increase by a gap during dress, but be not limited.
In the present embodiment, resonance plate 222 has an a movable part 222a and fixed part 222b, when inlet plate 221, resonance Piece 222 can be collectively forming at movable part 222a with after piezo-activator 223 sequentially corresponding assembling with inlet plate 221 thereon One chamber for confluxing gas, and a first chamber 220 is more formed between resonance plate 222 and piezo-activator 223, it is configured to temporarily store Gas, and first chamber 220 be through resonance plate 222 hollow bore 2220 and with the central recess 221c of inlet plate 221 at Chamber be connected, and first chamber 220 both sides then by the space 2235 between the support 2233 of piezo-activator 223 with The air guide end opening 201 being arranged under it is connected.
Fig. 8 A to 8E are the flowage structure figure of the gas pump start shown in Fig. 5 A and 5B.Fig. 7, Fig. 8 A to Fig. 8 E are referred to, The start process description of the gas pump of this case is as follows.When gas pump 22 carries out start, piezo-activator 223 is by voltage actuation With support 2233 as fulcrum, the reciprocating vibration of vertical direction is carried out.As shown in Figure 8 A, when piezo-activator 223 is caused by voltage When moving and vibrating downwards, it is light, thin laminated structure to be due to resonance plate 222, is when piezo-activator 223 vibrates, to be total to Shake piece 222 also can with resonance carry out vertical reciprocating vibration, the as part of the corresponding central recess 221c of resonance plate 222 Also can with flexural vibrations deformation, i.e. the part of correspondence central recess 221c is the movable part 222a for resonance plate 222, be with When piezo-activator 223 is bent downwardly vibration, now the movable part 222a of the corresponding central recess 221c of resonance plate 222 can be because of gas Body bring into and push and the vibration of piezo-activator 223 drive, and as piezo-activator 223 is bent downwardly vibration shape Become, then gas is entered by least air admission hole 221a on inlet plate 221, and conflux round 221b to be pooled to through at least one Center central recess 221c at, then via the hollow bore 2220 being correspondingly arranged with central recess 221c on resonance plate 222 to Under flow into first chamber 220.Thereafter, due to being driven by the vibration of piezo-activator 223, resonance plate 222 also can be total to Shake and carry out vertical reciprocating vibration, as shown in Figure 8 B, now the movable part 222a of resonance plate 222 also with downward vibration, And attach contact at piezo-activator 223 suspension board 2231 convex portion 2231a on, make the convex portion 2231a of suspension board 2231 with The spacing of the chamber that confluxes between outer region and the fixed part 222b of the both sides of resonance plate 222 will not diminish, and by this resonance The deformation of piece 222, to compress the volume of first chamber 220, and closes the middle flow space of first chamber 220, promotes in it Gas is pushed and flowed to both sides, and then passes through stream downwards by the space 2235 between the support 2233 of piezo-activator 223 It is dynamic.Afterwards, as shown in Figure 8 C, the movable part 222a of resonance plate 222 is bent upwards vibration deformation, and returns back to initial position, and Piezo-activator 223 is driven to vibrate upwards by voltage, the volume of so same extruding first chamber 220, only now due to pressure Electric actuator 223 is upward lifting, so that the gas in first chamber 220 can flow towards both sides, and then drives gas to hold An at least air admission hole 221a of the continuous ground from inlet plate 221 enters, then flows into the chamber that central recess 221c is formed.It Afterwards, as in fig. 8d, the resonance plate 222 is resonated upwards by the vibration of the upward lifting of piezo-activator 223, now resonance plate 222 movable part 222a also with upward vibration, an and then mitigation of gases at least air admission hole constantly from inlet plate 221 221a enters, then flows into the chamber that central recess 221c is formed.Finally, as illustrated in fig. 8e, the movable part of resonance plate 222 222a also returns back to initial position.Thus implement aspect and understand that, when resonance plate 222 carries out vertical reciprocating vibration, being can By it with the gap h between piezo-activator 223 to increase the ultimate range of its vertical displacement, in other words, in two structure Between gap h is set the resonance plate 222 can be produced upper and lower displacement by a larger margin when resonance.Therefore through this gas pump Barometric gradient is produced in 22 runner design, makes gas flow at high rates, and enter the resistance difference of outgoing direction through runner, by gas Transmitted to outlet side by suction side, to complete gas conveying operation, even if in the state of outlet side has air pressure, still having the ability to hold It is continuous to push air into water conservancy diversion chamber 200, and Jing Yin effect is can reach, the start of gas pump 22 of Fig. 8 A to 8E is so repeated, i.e., Gas pump 22 can be made to produce the gas transport of an ecto-entad.
From the above, through the start of above-mentioned gas pump 22, the water conservancy diversion chamber 200 of water conservancy diversion carrier 20 is introduced gas into, and Air-flow is set quickly to be discharged via stream guidance groove 203, the lateral airflow for being provided is by by the electronic component 3 on bearing substrate 4 And its ambient gas is formed convection current, heat exchange is carried out in order to electronic component 3, and make the air-flow after heat exchange that heat energy is taken away into electricity Subcomponent 3, whereby to improve the efficiency of cooling, and then increases stable performance degree and the life-span of electronic component 3.Fig. 9 is this The configuration diagram of the air cooling heat abstractor of case second embodiment.As shown in figure 9, the air cooling heat abstractor 2b of the present embodiment and figure Air cooling heat abstractor 2 shown in 2B is similar, and identical element numbers represent identical structure, element and function, in this no longer Repeat.Compared to the air cooling heat abstractor 2 shown in Fig. 2 B, the air cooling heat abstractor 2b of the present embodiment be with function of temperature control, its Control system 21 is further included, the control system 21 includes control unit 211 and temperature sensor 212, wherein control unit 211 is Electrically connected with gas pump 22, to control the running of gas pump 22.Temperature sensor 212 is disposed on bearing substrate 4, and neighbouring In electronic component 3, for sensing the temperature of electronic component 3.Temperature sensor 212 is electrically connected to control unit 211, sensing Temperature near electronic component 3, and sensing signal is transmitted to control unit 211.In some embodiments, temperature sensor 212 are attached directly on electronic component 3, to sense the temperature of electronic component 3, but are not limited.Control unit 211 is according to temperature The sensing signal of sensor 212 is spent, whether the temperature of the electronic component 3 is judged higher than a temperature threshold value, when control unit 211 When the temperature for judging the electronic component 3 is higher than the temperature threshold value, a control signal to gas pump 22 is sent, with enable gas pump 22 runnings, make the driving of gas pump 22 air current flow carry out cooling with to electronic component 3, so that electronic component 3 radiates whereby Cool down and reduce temperature.When control unit 211 judges that the temperature of the electronic component 3 is less than the temperature threshold value, a control is sent Signal processed is operated to gas pump 22 with stopping gas pump 22, the continued operation of gas pump 22 can be avoided whereby and causes reduced lifetime, Reduce the consume of extra energy.Therefore through the setting of control system 21, making the gas pump 22 of air cooling heat abstractor 2a in electricity Cooling can be carried out during 3 temperature overheating of subcomponent, and is decommissioned in after the reduction of the temperature of electronic component 3, gas can be avoided whereby The continued operation of body pump 22 and cause reduced lifetime, reduce the consume of extra energy, can also make electronic component 3 in a preferred temperature Operated under environment, improve the stability of electronic component 3.
In sum, this case provides a kind of air cooling heat abstractor and system, and it can be applied to various electronic equipments, with to electricity The electronic component of sub- device interior carries out crosswind thermal convection current radiating, in order to heat radiation efficiency, reduces noise, makes electronic equipment internal The stable performance of electronic component simultaneously increases the service life, and without being superimposed radiator on electronic component, can set overall electronics Standby thickness reaches lightening.Additionally, the air cooling heat abstractor and system of this case, it has function of temperature control, can be according to electronic equipment The temperature change of internal electronic element, controls the running of gas pump, in order to heat radiation efficiency, and the use for extending heat abstractor Life-span.
【Symbol description】
11:Electronic component
12:Thermal transfer plate
13:Heat-conducting glue
2、2’、2”、2a:Air cooling heat abstractor
20:Water conservancy diversion carrier
20a:First surface
20b:First surface
200:Water conservancy diversion chamber
201:Air guide end opening
202:Holding part
203:Stream guidance groove
203a:Exhaust end opening
204a、204b:Side wall
21:Control system
211:Control unit
212:Temperature sensor
22:Gas pump
220:First chamber
221:Inlet plate
221a:Air admission hole
221b:Conflux round
221c:Central recess
222:Resonance plate
222a:Movable part
222b:Fixed part
2220:Hollow bore
223:Piezo-activator
2231:Suspension board
2231a:Convex portion
2231b:Second surface
2231c:First surface
2232:Housing
2232a:Second surface
2232b:First surface
2232c:Conductive connecting pin
2233:Support
2232a:Second surface
2232b:First surface
2234:Piezoelectric patches
2235:Space
2241、2242:Insulating trip
225:Conducting strip
225a:Conductive connecting pin
3:Electronic component
4:Bearing substrate
5:Air cooling cooling system

Claims (10)

1. a kind of air cooling heat abstractor, its neighbour sets an electronic component, is used to the electronic element radiating, it is characterised in that the gas Cooling and radiation device is included:
One water conservancy diversion carrier, comprising a first surface, a second surface, two side, a water conservancy diversion chamber, an air guide end opening and many Individual stream guidance groove, the wherein first surface and the second surface are respectively arranged at the upper and lower surface of the two side, the air guide end Opening is arranged at the first surface, and the water conservancy diversion chamber runs through the second surface, and is connected with the air guide end opening, the plurality of to lead Stream air discharge duct is arranged at this and wherein side wall and is connected with the water conservancy diversion chamber, and to should electronic component;And
One gas pump, is arranged at the first surface of the water conservancy diversion carrier, and close the air guide end opening;
Wherein by the gas pump is driven, air-flow is imported into the water conservancy diversion chamber via the air guide end opening, passing through air-flow should Multiple stream guidance groove discharges, to provide a lateral airflow to the electronic component, and carry out heat exchange with the electronic component.
2. air cooling heat abstractor as claimed in claim 1, it is characterised in that it further includes a bearing substrate, the bearing substrate Part be connected with the second surface of the water conservancy diversion carrier and close the water conservancy diversion chamber, the wherein electronic component is arranged at this and holds Carried base board.
3. air cooling heat abstractor as claimed in claim 1, it is characterised in that the water conservancy diversion carrier further sets a holding part, The holding part is recessed in the first surface, and in air guide end opening periphery, is disposed therein for the gas pump.
4. air cooling heat abstractor as claimed in claim 1, it is characterised in that the gas pump is a piezoelectric actuated gas pump.
5. air cooling heat abstractor as claimed in claim 4, it is characterised in that the piezoelectric actuated gas pump includes:
One inlet plate, confluxes with an at least air admission hole, at least one and round and constitutes a central recess for confluxing chamber, wherein An at least air admission hole supplies to import air-flow, the corresponding air admission hole of the round that confluxes, and guides the air-flow of the air admission hole to converge into this The chamber that confluxes that central recess is constituted;
One resonance plate, with a hollow hole corresponding to around the chamber that confluxes, and the hollow hole be a movable part;And
One piezo-activator, setting corresponding with the resonance plate;
Wherein, there is a gap to form a chamber between the resonance plate and the piezo-activator, so that the piezo-activator is driven When dynamic, air-flow is imported by an at least air admission hole for the inlet plate, the central recess be collected to through at least one round that confluxes, The hollow hole of the resonance plate is passed through, to enter in the chamber, is produced by the movable part of the piezo-activator and the resonance plate Resonance transfer air-flow.
6. air cooling heat abstractor as claimed in claim 5, it is characterised in that the piezo-activator is included:
One suspension board, with a first surface and a second surface, and flexible vibration;
One housing, around the outside for being arranged at the suspension board;
An at least support, is connected between the suspension board and the housing, to provide resilient support;And
One piezoelectric patches, with a length of side, the length of side is less than or equal to a length of side of the suspension board, and the piezoelectric patches is attached at this and hangs On one first surface of kickboard, to applied voltage driving the suspension board flexural vibrations.
7. air cooling heat abstractor as claimed in claim 6, it is characterised in that the suspension board is a square suspension board, and is had There is a convex portion.
8. air cooling heat abstractor as claimed in claim 5, it is characterised in that the piezoelectric actuated gas pump include a conducting strip, One first insulating trip and one second insulating trip, the wherein inlet plate, the resonance plate, the piezo-activator, first insulating trip, The conducting strip and second insulating trip are that sequentially stacking is set.
9. air cooling heat abstractor as claimed in claim 1, it is characterised in that it further includes a control system, the control system Including:
One control unit, is electrically connected to the gas pump, to control the gas pump to operate;And
One temperature sensor, is electrically connected to the control unit and is adjacent to the electronic component, to sense a temperature of the electronic component Spend to export a sensing signal to the control unit;
Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door During threshold value, the control unit makes the gas pump enable, to drive air current flow, and when the control unit is in receiving the sensing Signal, and when judging the temperature of the electronic component less than the temperature threshold value, the control unit makes the gas pump decommission.
10. a kind of air cooling cooling system, is used to an electronic element radiating, it is characterised in that the air cooling cooling system is included:
Multiple air cooling heat abstractors, are adjacent to the electronic component respectively, and each air cooling heat abstractor is included:
One water conservancy diversion carrier, comprising a first surface, a second surface, two side, a water conservancy diversion chamber, an air guide end opening and many Individual stream guidance groove, the wherein first surface and the second surface are respectively arranged at the upper and lower surface of the two side, the air guide end Opening is arranged at the first surface, and the water conservancy diversion chamber runs through the second surface, and is connected with the air guide end opening, the plurality of to lead Stream air discharge duct is arranged at this and wherein side wall and is connected with the water conservancy diversion chamber, and to should electronic component;And
One gas pump, is arranged at the first surface of the water conservancy diversion carrier, and closes the air guide end opening, wherein by the driving gas Body pump, the water conservancy diversion chamber is imported by air-flow via the air guide end opening, air-flow is discharged through the plurality of stream guidance groove, with One lateral airflow to the electronic component is provided.
CN201621265395.9U 2016-11-24 2016-11-24 Air cooling heat abstractor and system Expired - Fee Related CN206251547U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621265395.9U CN206251547U (en) 2016-11-24 2016-11-24 Air cooling heat abstractor and system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621265395.9U CN206251547U (en) 2016-11-24 2016-11-24 Air cooling heat abstractor and system

Publications (1)

Publication Number Publication Date
CN206251547U true CN206251547U (en) 2017-06-13

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CN201621265395.9U Expired - Fee Related CN206251547U (en) 2016-11-24 2016-11-24 Air cooling heat abstractor and system

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Country Link
CN (1) CN206251547U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108112213A (en) * 2016-11-24 2018-06-01 研能科技股份有限公司 Be gas-cooled radiator and system
CN109959760A (en) * 2017-12-25 2019-07-02 研能科技股份有限公司 The detection alarming method for power of volatile organic compounds

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108112213A (en) * 2016-11-24 2018-06-01 研能科技股份有限公司 Be gas-cooled radiator and system
CN109959760A (en) * 2017-12-25 2019-07-02 研能科技股份有限公司 The detection alarming method for power of volatile organic compounds

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