CN206442659U - Air cooling heat abstractor - Google Patents

Abstract

A kind of air cooling heat abstractor, for electronic element radiating, air cooling heat abstractor to include bearing substrate, gas pump and radiator.Bearing substrate includes air guide end opening and thermal transfer plate, and wherein thermal transfer plate is arranged at upper surface, and correspondence air guide end opening is set, and electronic component is arranged in thermal transfer plate.Gas pump is fixedly arranged on the lower surface of bearing substrate, and correspondence closing air guide end opening.Radiator is arranged on electronic component.Through driving gas pump, gas is flowed into air guide end opening, and heat exchange is carried out to thermal transfer plate, in order to the radiating for realizing electronic component.

Description

Air cooling heat abstractor

【Technical field】

This case be on a kind of air cooling heat abstractor, it is espespecially a kind of to provide driving air-flow using gas pump to be radiated Air cooling heat abstractor.

【Background technology】

With the development of science and technology various electronic equipments such as portable computer, tablet personal computer, industrial computer, portable logical Device, audio and video player etc. are interrogated towards lightening, portable and dynamical trend development, these electronic equipments are limited in its Various high integrations or high-power electronic component must be configured in inner space, in order that the arithmetic speed of electronic equipment is faster With it is with better function, the electronic component of electronic equipment internal will produce more heat energy when running, and cause high temperature.In addition, These electronic equipments are largely all designed as frivolous, flat and have compact external form, and without extra inner space for radiating Cooling, therefore the electronic component in electronic equipment is vulnerable to the influence of heat energy, high temperature, and then the problems such as cause interference with or be damaged.

In general, the radiating mode of electronic equipment internal can be divided into active radiating and passive heat radiation.It is active to dissipate It is hot that electronic equipment internal is generally arranged at using tube-axial fan or blast type fan, by tube-axial fan or blast type fan Air-flow is driven, the heat energy transfer produced by electronic equipment internal electronic component radiates in order to realizing.However, tube-axial fan And blast type fan can produce larger noise in running, and its volume is larger is difficult to be thinned and minimizes, moreover axle stream The service life of formula fan and blast type fan is shorter, thus traditional tube-axial fan and blast type fan be not particularly suited for it is frivolous Radiating is realized in change and portable electronic equipment.

Furthermore, many electronic components can using such as surface mount technology (Surface Mount Technology, SMT), the technology such as Selective Soldering (Selective Soldering) is welded in printed circuit board (PCB) (Printed Circuit Board, PCB) on, but the electronic component welded using foregoing welding manner, in through being in high heat energy, high temperature ring for a long time Under border, easily electronic component is set to be separated with printed circuit board (PCB), and most of electronic component also non-refractory, if electronic component is long Time is under high heat energy, hot environment, and the performance stability for being easily caused electronic component declines and reduced lifetime.

Fig. 1 is for the structural representation of traditional heat-dissipating mechanism.As shown in figure 1, traditional heat-dissipating mechanism is dissipated for a passive type Heat engine structure, it includes thermal transfer plate 12, and the thermal transfer plate 12 is by a heat-conducting glue 13 electronic component 11 phase to be radiated with one Laminating, the heat conduction path formed by heat-conducting glue 13 and thermal transfer plate 12, electronic component 11 can be made using heat transfer and Free convection mode reaches radiating.However, the radiating efficiency of foregoing cooling mechanism is poor, it is impossible to meet application demand.

In view of this, it is necessary to develop a kind of air cooling heat abstractor in fact, to solve prior art problem encountered.

【Utility model content】

The purpose of this case is to provide a kind of air cooling heat abstractor, and it can be applied to various electronic equipments, to be set to electronics Standby internal electronic component is radiated, in order to heat radiation efficiency, reduces noise, and make the property of electronic equipment internal electronic component It can stablize and increase the service life.

The another object of this case is to provide a kind of air cooling heat abstractor, and it has function of temperature control, can be according to electronic equipment The temperature change of internal electronic element, controls the running of gas pump, in order to heat radiation efficiency, and extends air cooling heat abstractor Service life.

For up to above-mentioned purpose, a broader pattern of implementing of this case is provides a kind of air cooling heat abstractor, for electronics Element radiating, air cooling heat abstractor is included:Bearing substrate, comprising upper surface, lower surface, air guide end opening and thermal transfer plate, Wherein thermal transfer plate is arranged at upper surface and is disposed on corresponding to air guide end opening, and electronic component in thermal transfer plate；Gas Body pump, gas pump is for piezoelectric actuated gas pump, to be fixedly arranged on the lower surface of bearing substrate, and correspondence closing air guide end opening, gas Body pump is included：Resonance plate, with a hollow bore；Piezo-activator, it is corresponding with the resonance plate to set；And cover plate, have Side wall, bottom plate and opening portion, the side wall are to surround the base portion peripheral and be convexly equipped on the bottom plate, and are housed with bottom plate formation one Space, and the resonance plate and the piezo-activator be disposed in the accommodation space, the opening is arranged on the side wall, the resonance The side wall common definition of piece and the cover plate goes out one and confluxed chamber；Wherein, when piezo-activator is driven to carry out gas collection operation When, gas is first to be collected to the chamber that confluxes by the opening of cover plate, then flow to first chamber by the hollow bore of resonance plate and keep in, when Piezo-activator is driven to be exhausted during operation, and gas is first to be flowed into lead by the hollow bore of resonance plate by first chamber Gas end opening, and heat exchange is carried out to thermal transfer plate.

【Brief description of the drawings】

Fig. 1 is the structural representation of traditional heat-dissipating mechanism.

Fig. 2A is the structural representation of the air cooling heat abstractor of this case preferred embodiment.

Fig. 2 B are the air cooling heat abstractor shown in Fig. 2A in the structural representation at another visual angle.

Fig. 3 is the air cooling heat abstractor shown in Fig. 2A in the structural representation in AA sections.

Fig. 4 A and 4B are respectively the gas pump of this case preferred embodiment in the decomposition texture schematic diagram of different visual angles.

Fig. 5 A are the positive structure schematics of the piezo-activator for this case preferred embodiment.

Fig. 5 B are the structure schematic diagrams of the piezo-activator for this case preferred embodiment.

Fig. 5 C are the cross-sectional views of the piezo-activator for this case preferred embodiment.

Fig. 6 is to be the air cooling heat abstractor shown in Fig. 2 B in BB cross-section profile schematic diagrames.

Fig. 7 A are to be the air cooling heat abstractor shown in Fig. 2 B in CC cross-section profile schematic diagrames.

Fig. 7 B to 7D are the start process schematics of the gas pump for this case preferred embodiment.

Fig. 8 is the control system configuration diagram of the air cooling heat abstractor of this case preferred embodiment.

【Embodiment】

Embodying some exemplary embodiments of this pattern characteristics and advantage will in detail describe in the explanation of back segment.It should be understood that This case can have various changes in different aspects, and it does not all depart from the scope of this case, and explanation therein and diagram Inherently it is illustrated as being used, and nand architecture is in limitation this case.

Refer to the structural representation for the air cooling heat abstractor that Fig. 2A, Fig. 2 B and Fig. 3 Fig. 2A are this case preferred embodiment, figure 2B is that the air cooling heat abstractor shown in Fig. 2A radiates in the structural representation at another visual angle, and Fig. 3 for the air cooling shown in Fig. 2A It is installed on the structural representation in AA sections.As illustrated, the air cooling heat abstractor 2 of this case can be applied to an electronic equipment, such as But portable computer, tablet personal computer, industrial computer, portable communication device, audio and video player are not limited to, with electronic equipment Electronic component 3 to be radiated is radiated.The air cooling heat abstractor 2 of this case includes bearing substrate 20, gas pump 21 and radiating Device 26, wherein bearing substrate 20 include upper surface 20a, lower surface 20b, air guide end opening 23 and thermal transfer plate 25.Carry base Plate 20 can be but be not limited to printed circuit board (PCB), to carry and set electronic component 3 and gas pump 21.The air guide of bearing substrate 20 End opening 23 is through upper surface 20a and lower surface 20b.Gas pump 21 is the lower surface 20b for being fixedly arranged on bearing substrate 20, correspondence Assembling is positioned at air guide end opening 23, and closes the air guide end opening 23.Thermal transfer plate 25 is arranged at the upper of bearing substrate 20 On the 20a of surface, assembling be positioned on air guide end opening 23, and between thermal transfer plate 25 and bearing substrate 20 have clearance G, with for Gas circulates.In the present embodiment, thermal transfer plate 25 is had more on multiple fin 25a, the surface for being arranged at thermal transfer plate 25, And be adjacent to air guide end opening 23 and set, but be not limited, to increase area of dissipation, and then improving heat radiation efficiency.Electricity Subcomponent 3 is disposed in thermal transfer plate 25, and a surface of electronic component 3 is attached at thermal transfer plate 25, and can pass through heat The heat conduction path of conductive plate 25 is radiated.Radiator 26 is disposed on electronic component 3, and is attached at electronic component 3 Another surface.Wherein, by driving gas pump 21, air-flow is imported into air guide end opening 23 and hot friendship is carried out to thermal transfer plate 25 Change, in order to the radiating realized to electronic component 3.

In the present embodiment, radiator 26 includes a base 261 and multiple fin 262, and base 261 is attached at electronics member Another surface of part 3, multiple fin 262 are to be vertically connected at base 261.By the setting of radiator 26, it can increase scattered Hot area, make heat energy produced by electronic component 3 can via radiator 26 heat conduction path diversion.

In the present embodiment, gas pump 21 be for a piezoelectric actuated gas pump, it is dynamic to drive gas flow, by gas by The outside of air cooling heat abstractor 2 is imported in air guide end opening 23.In some embodiments, bearing substrate 20 is further included at least one time Groove 24 is flowed through, the backflow wears groove 24 is through upper surface 20a and lower surface 20b, and is adjacent to the periphery of thermal transfer plate 25.Work as gas When body pump 21 introduces gas into air guide end opening 23, import air-flow and be arranged at the upper surface 20a of bearing substrate 20 heat biography Guide plate 25 carries out heat exchange, and promotes the gas in the clearance G between bearing substrate 20 and thermal transfer plate 25 quickly to flow, and promotes heat Air-flow after exchange discharges heat energy via clearance G, and which part air-flow will be back to bearing substrate 20 via backflow wears groove 24 Lower surface 20b, and utilized in cooling down follow-up supplied gas pump 21.In addition, fraction then along thermal transfer plate 25 periphery towards dissipate The direction flowing of hot device 26, and in the fin 261 that radiator 26 is flowed through after cooling, in order to the radiating accelerated to electronic component 3.By In gas pump 21 is continuously start to import gas, the gas that electronic component 3 can be with being continuously introduced into is set to carry out heat exchange, simultaneously The gas after heat exchange is discharged, the radiating to electronic component 3 can be realized whereby, and heat dissipation can be improved, and then increases electricity The performance stability of subcomponent 3 and life-span.

Fig. 4 A, 4B are referred to, Fig. 4 A are the positive decomposition texture schematic diagram of the gas pump for this case preferred embodiment, Fig. 4 B It is the back side decomposition texture schematic diagram of the gas pump for this case preferred embodiment.In the present embodiment, gas pump 21 is for a pressure Electric actuation gas pump, it is dynamic to drive gas flow.As illustrated, the gas pump 21 of this case includes resonance plate 212, piezo-activator 213rd, the element such as cover plate 216.Resonance plate 212 corresponds to piezo-activator 213 and set, and with a hollow bore 2120, if The central area of resonance plate 212 is placed in, but is not limited.Piezo-activator 213 has suspension board 2131, housing 2132 and piezoelectricity Ceramic wafer 2133, wherein, suspension board 2131 has central part 2131c and peripheral part 2131d, when piezoelectric ceramic plate 2133 is by voltage During driving, suspension board 2131 can be by central part 2131c to peripheral part 2131d flexural vibrations, and housing 2132 is outstanding around being arranged at The outside of kickboard 2131, and with an an at least support 2132a and conductive connecting pin 2132b, but be not limited, each support 2132a is disposed between suspension board 2131 and housing 2132, and each support 2132a two ends be connection suspension board 2131 and Housing 2132, to provide resilient support, conductive connecting pin 2132b is that convex is located on housing 2132, and to power, connection is used, Piezoelectric ceramic plate 2133 is the second surface 2131b for being attached at suspension board 2131, and deformation is produced to receive applied voltage, with Drive the flexural vibrations of suspension board 2131.Cover plate 216 has side wall 2161, bottom plate 2162 and opening portion 2163, and side wall 2161 is ring It is convexly equipped in around the periphery of bottom plate 2162 on bottom plate 2162, and accommodation space 216a is collectively forming with bottom plate 2162, with for resonance Piece 212 and piezo-activator 213 are disposed therein, and opening portion 2163 is disposed on side wall 2161, with for housing 2132 The conductive connecting pin 2151 of conductive connecting pin 2132b and conducting strip 215 passes outwards through opening portion 2163 and protruded from outside cover plate 216, In order to be connected with external power source, but it is not limited.

In the present embodiment, the gas pump 21 of this case further includes two insulating trips 2141,2142 and a conducting strip 215, but simultaneously It is not limited, wherein, two insulating trips 2141,2142 are to be respectively arranged at conducting strip about 215, and its profile is to correspond roughly to The housing 2132 of piezo-activator 213, and be made up of the material that can be insulated, for example：Plastic cement, is used with carrying out insulation, but All it is not limited, conducting strip 215 is then as made by conductive material, for example：Metal, conduct being used, and outside it Shape is also the housing 2132 for corresponding roughly to piezo-activator 213, but is all not limited.In the present embodiment, conducting strip Also a conductive connecting pin 2151 can be set on 215, conduct being used.

5A, 5B, 5C figure are referred to, Fig. 5 A are the Facad structure signals for the piezo-activator of this case preferred embodiment Figure, Fig. 5 B are the structure schematic diagrams of the piezo-activator for this case preferred embodiment, and Fig. 5 C are for this case preferred embodiment Piezo-activator cross-sectional view.As illustrated, in the present embodiment, the suspension board 2131 of this case is for cascaded surface Structure, i.e., in having more a convex portion 2131e, and convex portion on the first surface 2131a of suspension board 2131 central part 2131c 2131e is a circular protrusions structure, but is not limited thereto, and in some embodiments, suspension board 2131 also can be two-sided smooth Tabular square.Again as shown in Figure 5 C, the convex portion 2131e of suspension board 2131 is total to the first surface 2132c of housing 2132 Plane, and the first surface 2131a and support 2132a of suspension board 2131 first surface 2132a ' are also copline, in addition, outstanding The convex portion 2131e of the kickboard 2131 and first surface 2132c of housing 2132 and suspension board 2131 first surface 2131a and support It is that there is a certain depth between 2132a first surface 2132a '.As for the second surface 2131b of suspension board 2131, then such as Shown in Fig. 5 B and Fig. 5 C, itself and the second surface 2132d and support 2132a of housing 2132 second surface 2132a " are smooth Coplanar structure, and piezoelectric ceramic plate 2133 is then attached at the second surface 2131b of this smooth suspension board 2131.In another In a little embodiments, the kenel of suspension board 2131 also can be a two-sided smooth tabular square structure, be not limited thereto, can be according to According to the facts border applies situation and appoints and apply change.In some embodiments, suspension board 2131, housing 2132 and support 2132a are to be Integrally formed structure, and can be made up of a metallic plate, it can be for example made up of stainless steel, but be not limited.Again In the present embodiment, this case gas pump 21 has more an at least space between suspension board 2131, housing 2132 and support 2132a 2134, pass through to supplied gas.

Then the internal structure external structure of this case gas pump 21 after explanation is completed, refers to Fig. 6 and Fig. 7 A, Fig. 6 be for Air cooling heat abstractor shown in Fig. 2A is in BB cross-section profile schematic diagrames, and Fig. 7 A are to be cut for the air cooling heat abstractor shown in Fig. 2 B in CC Face diagrammatic cross-section.As illustrated, the gas pump 21 of this case is sequentially by cover plate 216, insulating trip 2142, conducting strip 215, insulation Piece 2141, piezo-activator 213, resonance plate 212 and element is waited from top to bottom to stack, and in the piezo-activator after combination stacked 213rd, insulating trip 2141, conducting strip 215, the surrounding of another insulating trip 2142 give gluing formation colloid 218, and then fill up cover plate 216 accommodation space 216a periphery and complete sealing.Gas pump 21 after being completed is the structure for quadrangle, but not As limit, its shape can appoint according to actual demand applies change.In addition, in the present embodiment, the conduction of only conducting strip 215 connects The conductive connecting pin 2132b protrusions (as shown in Figure 6) of pin 2151 (not shown) and piezo-activator 213 are arranged at outside cover plate 216, with It is easy to be connected with external power source, but is also not limited.Gas pump 21 after assembling between cover plate 216 and resonance plate 212 then Form first chamber 217b.

After gas pump 21 and bearing substrate 20 are completed, held as shown in figure 3, the side wall 2161 of cover plate 216 is resisted against On the lower surface 20b of carried base board 20, and air guide end opening 23 is closed, and side wall 2161, the resonance plate 212 through cover plate 216 are common With defining the chamber 217a that confluxes, then as shown in fig. 6, by the opening portion 2163 of cover plate 216 and ft connection, and then can be from outer Portion's environment carries out gas collection.In the present embodiment, have between the resonance plate 212 and piezo-activator 213 of the gas pump 21 of this case There is gap g0, and be to insert conductive material in the g0 of gap, for example：Conducting resinl, but be not limited thereto, resonance plate can be made whereby 212 and piezo-activator 213 suspension board 2131 convex portion 2131e between keep gap g0 depth, and then can guide Air-flow more quickly flows, and the convex portion 2131e because of suspension board 2131 and resonance plate 212 keep suitable distance make to be in contact with each other it is dry Relate to reduction, promote lower noise, in other embodiments, also can by the housing 2132 for increasing piezo-activator 213 height Degree, so that it increases by a gap when being assembled with resonance plate 212, but is also not limited.Whereby, when piezo-activator 213 is driven Move to carry out during gas collection operation, gas is first to be collected to the chamber 217a that confluxes by the opening portion 2163 of cover plate 216, and is further passed through First chamber 217b is flow to by the hollow bore 2120 of resonance plate 212 to keep in, when piezo-activator 213 is driven to be exhausted During operation, gas is that elder generation flow to the chamber 217a that confluxes by first chamber 217b by the hollow bore 2120 of resonance plate 212, is flowed into In air guide end opening 23, air-flow is set to carry out heat exchange with thermal transfer plate 25.

The start flow of this case gas pump 21 further explained below, please refer to Fig. 7 A~7D, wherein Fig. 7 B~7D It is the start process schematic of the gas pump for this case preferred embodiment.First, as shown in Figure 7 A, the structure of gas pump 21 be as It is foregoing, it is sequentially by cover plate 216, another insulating trip 2142, conducting strip 215, the piezo-activator 213 of insulating trip 2141 and resonance plate 212 stack assembly positioning are formed, and are with gap g0, and resonance plate 212 between resonance plate 212 and piezo-activator 213 And the common definition of side wall 2161 of cover plate 216 goes out the chamber 217a that confluxes, between resonance plate 212 and piezo-activator 213 then With first chamber 217b.When gas pump 21 is not yet driven by voltage, the position of its each element is as shown in Figure 7 A.

Then as shown in Figure 7 B, when the piezo-activator 213 of gas pump 21 is vibrated upwards by voltage actuation, gas meeting Entered by the opening portion 2163 of cover plate 216 in gas pump 21, and be pooled to the chamber 217a that confluxes, then again via resonance plate 212 On hollow bore 2120 flow upwardly into first chamber 217b, while suspension of the resonance plate 212 by piezo-activator 213 Plate 2131 resonance influence also can with carry out reciprocating vibration, i.e., resonance plate 212 with upward deformation, i.e., resonance plate 212 is in Upward dimpling at hollow bore 2120.

Thereafter, then as seen in figure 7 c, now piezo-activator 213 is to vibrate back initial position downwards, now piezoelectric actuated The upper convex portion 2131e of suspension board 2131 of device 213, and close to resonance plate 212 at hollow bore 2120 upward dimpling part, enter And promote in gas pump 21 gas up half storey first chamber 217b is kept in.

Again as illustrated in fig. 7d, piezo-activator 213 is vibrated still further below, and resonance plate 212 by piezo-activator 213 due to being shaken Dynamic resonant interaction, resonance plate 212 also can with downward vibration, by this resonance plate 212 downward deformation compress first chamber 217b volume, and then promote the gas in upper half storey first chamber 217b to push piezo-activator is flowed and passed through to both sides Circulation is passed through in 213 space 2134 downwards, compresses discharge to flow at the hollow bore 2120 of resonance plate 212, forms one Compressed air stream is sentenced to the air guide end opening 23 of bearing substrate 20 to radiate to thermal transfer plate 25.Thus aspect is implemented visible, When resonance plate 212 carries out vertical reciprocating vibration, be can be between resonance plate 212 and piezo-activator 213 gap g0 To increase the ultimate range of its vertical displacement, in other words, the gap of setting between common moving plate 212 and piezo-activator 213 G0 can make resonance plate 212 to produce upper and lower displacement by a larger margin when resonance.

Finally, resonance plate 212 can be repositioned to initial position, i.e., as shown in Figure 7 A, and then pass through foregoing start flow, by The order persistent loop of 7A~7D figures, gas can constantly flow into the chamber that confluxes via the opening portion 2163 of cover plate 216 217a, then first chamber 217b is flowed into, and then flowed into by first chamber 217b in the chamber 217a that confluxes, continuously flow into air-flow In air guide end opening 23, and then transmission gas can be stablized.In other words, when the gas pump 21 of this case is operated, gas is sequentially The opening portion 2163 of the cover plate 216 flowed through, the chamber 217a that confluxes, first chamber 217b, conflux chamber 217a and air guide end opening 23, therefore the gas pump 21 of this case can pass through single element, i.e. cover plate 216, and set using the structure of the opening portion 2163 of cover plate 216 Meter, can reach the number of elements for reducing gas pump 21, simplify effect of overall process.

From the above, through the start of above-mentioned gas pump 21, the air guide end opening 23 of bearing substrate 20 is introduced gas into, is made Air-flow flows into clearance G, and the thermal transfer plate 25 for making imported gas be connected with electronic component 3 carries out heat exchange, and persistently pushes away Gas in dynamic clearance G quickly flows, and promotes the gas after heat exchange that heat energy is outside via clearance G is drained into, whereby to carry The efficiency of high cooling, and then increase performance stability and the life-span of electronic component 3.In addition, quickly flowing row by gas Go out clearance G outside, the increase ambient gas convection current of radiator 26, can also increase the efficiency of cooling indirectly.

Referring to Fig. 8, configuration diagrams of the Fig. 8 for the control system of the air cooling heat abstractor of this case.As illustrated, this case The air cooling heat abstractor 2 of preferred embodiment is that, with function of temperature control, it further includes control system 5, and wherein control system 5 is further included Control unit 51 and temperature sensor 52, wherein control unit 51 are electrically connected with gas pump 21, to control the fortune of gas pump 21 Make.Temperature sensor 52 is electrically connected to control unit 51, neighbouring to be arranged at electronic component 3, to sense near electronic component 3 Temperature, or be attached directly on electronic component 3 sense the temperature of electronic component 3, but be not limited, and can be by sensing signal Transmit to control unit 51.Sensing signal of the control unit 51 according to temperature sensor 52, judging the temperature of the electronic component 3 is It is no to be higher than a temperature threshold value, when control unit 51 judges that the temperature of the electronic component 3 is higher than the temperature threshold value, send one Control signal is operated to gas pump 21 with enable gas pump 21, gas pump 21 is driven air current flow with to electronic component 3 whereby Cooling is carried out, so that the cooling of electronic component 3 and reducing temperature.When control unit 51 judges the temperature of the electronic component 3 When degree is less than the temperature threshold value, a control signal is sent to gas pump 21, is operated with stopping gas pump 21, gas can be avoided whereby The continued operation of body pump 21 and cause reduced lifetime, reduce the consume of extra energy.Therefore through the setting of control system 5, making The gas pump 21 of air cooling heat abstractor 2 can carry out cooling when 3 temperature overheating of electronic component, and in the temperature of electronic component 3 Decommissioned after reduction, the continued operation of gas pump 21 can be avoided whereby and causes reduced lifetime, reduce the consume of extra energy, Also electronic component 3 can be made in being operated under a preferred temperature environment, the stability of electronic component 3 is improved.

In summary, this case provides a kind of air cooling heat abstractor, and it can be applied to various electronic equipments with to its inside Electronic element radiating, in order to heat radiation efficiency, reduces noise, and the performance of electronic equipment internal electronic component is stablized and is extended Service life.In addition, the air cooling heat abstractor of this case, it has function of temperature control, can be according to electronic equipment internal electronic component Temperature change, controls the running of gas pump, in order to the service life of heat radiation efficiency, and extension air cooling heat abstractor.

This case appointed as person familiar with the technology apply craftsman think and be it is all as modify, so neither take off such as attached claim Be intended to Protector.

【Symbol description】

11：Electronic component

12：Thermal transfer plate

13：Heat-conducting glue

2：Air cooling heat abstractor

20：Bearing substrate

20a：Upper surface

20b：Lower surface

21：Gas pump

212：Resonance plate

2120：Hollow bore

213：Piezo-activator

2131：Suspension board

2131a：First surface

2131b：Second surface

2131c：Central part

2131d：Peripheral part

2131e：Convex portion

2132：Housing

2132a：Support

2132a’：First surface

2132a”：Second surface

2132b：Conductive connecting pin

2132c：First surface

2132d：Second surface

2133：Piezoelectric ceramic plate

2134：Space

2141、2142：Insulating trip

215：Conducting strip

2151：Conductive connecting pin

216：Cover plate

216a：Accommodation space

2161：Side wall

2162：Bottom plate

2163：Opening portion

217b：First chamber

217a：Conflux chamber

218：Colloid

23：Air guide end opening

24：Flow back wears groove

25：Thermal transfer plate

25a：Fin

26：Radiator

261：Base

262：Fin

3：Electronic component

5：Control system

51：Control unit

52：Temperature sensor

g0、G：Gap

Claims (12)

1. a kind of air cooling heat abstractor, for an electronic element radiating, it is characterised in that the air cooling heat abstractor is included:

One bearing substrate, includes a upper surface, a lower surface, an air guide end opening and a thermal transfer plate, the wherein heat transfer Plate is arranged at the upper surface and is arranged at corresponding to the air guide end opening, and the electronic component in the thermal transfer plate；

One gas pump, the gas pump is piezoelectric actuated gas pump, is fixedly arranged on the lower surface of the bearing substrate, and correspondence closing should Air guide end opening, the gas pump is included：

One resonance plate, with a hollow bore；

One piezo-activator, it is corresponding with the resonance plate to set；And

One cover plate, with side wall, a bottom plate and an opening portion, the side wall ring is convexly equipped on the bottom plate around the base portion peripheral, And an accommodation space is formed with the bottom plate, and the resonance plate and the piezo-activator are arranged in the accommodation space, the opening is set It is placed on the side wall, the side wall common definition of the resonance plate and the cover plate goes out one and confluxed chamber, and the resonance plate and the cover plate The bottom plate common definition go out a first chamber；And

One radiator, is arranged on the electronic component；

Wherein, when the piezo-activator it is driven to carry out gas collection operation when, gas first is collected to by the opening portion of the cover plate The chamber that confluxes, then the first chamber is flow to by the hollow bore of the resonance plate kept in, when the piezo-activator it is driven with When operation is exhausted, gas first flows into the air guide end opening by the first chamber by the hollow bore of the resonance plate, and Heat exchange is carried out to the thermal transfer plate.

2. air cooling heat abstractor as claimed in claim 1, it is characterised in that the air guide end opening of the bearing substrate is through The upper surface and the lower surface.

3. air cooling heat abstractor as claimed in claim 1, it is characterised in that have one between the thermal transfer plate and the bearing substrate Gap, to supply airflow.

4. air cooling heat abstractor as claimed in claim 1, it is characterised in that the thermal transfer plate attaches a table of the electronic component Face, and the radiator attaches another surface of the electronic component.

5. air cooling heat abstractor as claimed in claim 1, it is characterised in that the bearing substrate further includes an at least backflow and worn Groove, the backflow wears groove runs through the upper surface and the lower surface, and is adjacent to the periphery of the thermal transfer plate.

6. air cooling heat abstractor as claimed in claim 1, it is characterised in that the piezo-activator is included：

One suspension board, with a first surface and a second surface；

One housing, with an at least support, an at least support connect the suspension board and the housing and be arranged at the suspension board and Between the housing；And

One piezoelectric ceramic plate, is attached at the first surface of the suspension board, to apply voltage to drive the suspension plate benging to shake It is dynamic.

7. air cooling heat abstractor as claimed in claim 1, it is characterised in that have between the resonance plate and the piezo-activator One gap.

8. air cooling heat abstractor as claimed in claim 6, it is characterised in that the gas pump further includes an at least insulating trip and one Conducting strip, and an at least insulating trip and the conducting strip be sequentially arranged under the piezo-activator.

9. air cooling heat abstractor as claimed in claim 6, it is characterised in that between the support, the suspension board and the housing more Two-end-point with an at least space, and the support connects the housing and the suspension board respectively.

10. air cooling heat abstractor as claimed in claim 6, it is characterised in that the suspension board of the gas pump is in second table A convex portion is had more on face, and the convex portion is a cylindrical structure.

11. air cooling heat abstractor as claimed in claim 1, it is characterised in that the air cooling heat abstractor further includes a control system System, the control system includes：

One control unit, is electrically connected to the gas pump, to control the gas pump to operate；And

One temperature sensor, is electrically connected to the control unit and is adjacent to the electronic component, to sense a temperature of the electronic component Spend to export a sensing signal to the control unit；

Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door During threshold value, the control unit makes the gas pump enable, to drive air current flow, and when the control unit is in receiving the sensing Signal, and when judging the temperature of the electronic component less than the temperature threshold value, the control unit makes the gas pump decommission.

12. air cooling heat abstractor as claimed in claim 8, it is characterised in that the housing of the piezo-activator has one to lead Electric pin, the conducting strip has a conductive connecting pin, and the opening portion of the cover plate of the gas pump is arranged on the side wall, is used to The conductive connecting pin of the conductive connecting pin and the conducting strip for the housing passes outwards through the opening portion and protruded from outside the cover plate, In order to be connected with external power source.