CN108463089A - Be gas-cooled radiator and system - Google Patents
Be gas-cooled radiator and system Download PDFInfo
- Publication number
- CN108463089A CN108463089A CN201710090295.XA CN201710090295A CN108463089A CN 108463089 A CN108463089 A CN 108463089A CN 201710090295 A CN201710090295 A CN 201710090295A CN 108463089 A CN108463089 A CN 108463089A
- Authority
- CN
- China
- Prior art keywords
- water conservancy
- conservancy diversion
- air
- electronic component
- air cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
Abstract
A kind of air cooling radiator is to be adjacent to electronic component and radiate to it.The radiator that is gas-cooled includes water conservancy diversion carrier and gas pump.Water conservancy diversion carrier includes the first and second surface, water conservancy diversion chamber, air guide end opening and connectivity slot.Air guide end opening is set on first surface, and water conservancy diversion chamber is recessed to be connected in first surface and with air guide end opening, and connectivity slot is communicated in water conservancy diversion chamber and corresponding electronic component.Gas pump is set to first surface, and closes air guide end opening.By driving gas pump, air-flow is imported into water conservancy diversion chamber via air guide end opening, air-flow is made to be discharged through connectivity slot, to provide lateral airflow to electronic component, and heat exchange is carried out with electronic component.
Description
【Technical field】
This case be about a kind of air cooling radiator, it is espespecially a kind of to provide certain driving air-flow using gas pump to radiate
Air cooling radiator and air cooling cooling system.
【Background technology】
With the development of science and technology various electronic equipments such as portable computer, tablet computer, industrial computer, portable logical
Device, audio and video player etc. are interrogated towards lightening, portable and dynamical trend development, these electronic equipments have in it
Limit must configure various high integrations or high-power electronic component in inner space, in order to make the arithmetic speed of electronic equipment
Faster with it is with better function, the electronic component of electronic equipment internal will generate more thermal energy when running, and lead to high temperature.
In addition, these electronic equipments are largely all designed as frivolous, the flat and compact external form of tool, and not additional inner space is used
Electronic component in cooling, therefore in electronic equipment is vulnerable to the influence of thermal energy, high temperature, and then cause interference with or be damaged etc.
Problem.
In general, the radiating mode of electronic equipment internal can be divided into active heat dissipation and passive heat radiation.It is active to dissipate
Hot generally use tube-axial fan or blast type fan are set to electronic equipment internal, by tube-axial fan or blowing-type wind
Certain driving air-flow is fanned, heat energy transfer caused by electronic equipment internal electronic component radiates in order to realizing.However, axial-flow type wind
Fan and blast type fan will produce larger noise in running, and its volume is larger is not easy to be thinned and minimize, moreover
The service life of tube-axial fan and blast type fan is shorter, therefore traditional tube-axial fan and blast type fan and is not suitable for
Heat dissipation is realized in lightening and portable electronic equipment.
Furthermore many electronic components can utilize for example surface mount technology (Surface Mount Technology,
SMT), the technologies such as Selective Soldering (Selective Soldering) are welded in printed circuit board (Printed Circuit
Board, PCB) on, however the electronic component welded using aforementioned welding manner, it is in high thermal energy, high temperature in through a long time
It under environment, is easy that electronic component is made to be separated with printed circuit board, and most of electronic component also non-refractory, if electronics is first
Part is for a long time under high thermal energy, hot environment, and the performance stability for easily leading to electronic component declines and reduced lifetime.
Fig. 1 is for the structural schematic diagram of traditional heat-dissipating mechanism.As shown in Figure 1, traditional heat-dissipating mechanism is dissipated for a passive type
Heat engine structure comprising thermal transfer plate 12, the thermal transfer plate 12 are by a heat-conducting glue 13 and 11 phase of electronic component to be radiated
Fitting, heat conduction path is formed by by heat-conducting glue 13 and thermal transfer plate 12, electronic component 11 can be made using heat transfer and
Free convection mode reaches heat dissipation.However, the radiating efficiency of aforementioned cooling mechanism is poor, application demand cannot be satisfied.
In view of this, it is really necessary to develop a kind of air cooling radiator, to solve prior art problem encountered.
【Invention content】
This case is designed to provide a kind of air cooling radiator and system, various electronic equipments is can be applied to, with right
The electronic component of electronic equipment internal carries out crosswind thermal convection current heat dissipation, in order to heat radiation efficiency, reduces noise, makes electronic equipment
The performance of internal electronic element is stable and prolongs the service life, and without being superimposed radiator on electronic component, can make whole electricity
Sub- device thickness reaches lightening.
The another object of this case is to provide a kind of air cooling radiator and system can be according to electricity with function of temperature control
The temperature change of sub- equipment internal electronic element, controls the running of gas pump, in order to heat radiation efficiency, and extends air cooling and dissipates
The service life of thermal.
In order to achieve the above object, a broader implementation pattern of this case is to provide a kind of air cooling radiator, it is that neighbour sets one
Electronic component, to the electronic element radiating, which includes：One water conservancy diversion carrier, including a first surface,
One second surface, a water conservancy diversion chamber, an air guide end opening and a connectivity slot, wherein first surface and the second surface are
Correspond setting, which is disposed on the first surface, the water conservancy diversion chamber it is recessed in the first surface and with
The air guide end opening is connected, which is communicated in the water conservancy diversion chamber and the corresponding electronic component；And a gas pump, if
It is placed on the first surface of the water conservancy diversion carrier, and closes the air guide end opening, which includes：One resonance plate has one
Hollow bore；One piezoelectric actuator, setting corresponding with the resonance plate；And a cover board, there is one side wall, a bottom plate and one
Opening portion, the side wall are to surround the base portion peripheral and be convexly equipped on the bottom plate and form an accommodating space with the bottom plate, and this is total
It shakes piece and the piezoelectric actuator is disposed in the accommodating space, which is disposed on the side wall, wherein the cover board
A first chamber is formed between the bottom plate and the resonance plate, the side wall common definition of the resonance plate and the cover board goes out a confluence
Chamber；Wherein by the gas pump is driven, air-flow is imported into the water conservancy diversion chamber via the air guide end opening, air-flow is made to penetrate
The connectivity slot is discharged, and to provide a lateral airflow to the electronic component, and carries out heat exchange with the electronic component.
In order to achieve the above object, another broader implementation pattern of this case is to provide a kind of air cooling cooling system, to one
Electronic element radiating, the air cooling cooling system include：Multiple air cooling radiators, are adjacent to the electronic component, and each respectively
The air cooling radiator includes：One water conservancy diversion carrier a, including first surface, a second surface, a water conservancy diversion chamber, an air guide end
Opening and a connectivity slot, wherein first surface and the second surface is to correspond setting, which is to set
It is placed in the first surface, which is connected with the air guide end opening, which is communicated in the water conservancy diversion chamber and correspondence
The electronic component；And a gas pump, it is set to the first surface of the water conservancy diversion carrier, and close the air guide end opening, the gas
Body pumps：One resonance plate has a hollow bore；One piezoelectric actuator, setting corresponding with the resonance plate；And one lid
Plate, have one side wall, a bottom plate and an opening portion, the side wall be surround the base portion peripheral and be convexly equipped on the bottom plate and with this
Bottom plate forms an accommodating space, and the resonance plate and the piezoelectric actuator are disposed in the accommodating space, which is to set
It is placed on the side wall, wherein forms a first chamber between the bottom plate and the resonance plate of the cover board, the resonance plate and the cover board
The side wall common definition go out a confluence chamber；Wherein by the gas pump for driving each air cooling radiator, by gas
It flows through and corresponding each water conservancy diversion chamber is imported by each air guide end opening, air-flow is made to be discharged through each connectivity slot, with
Multiple lateral airflows are provided to the electronic component, and heat exchange is carried out with the electronic component.
【Description of the drawings】
Fig. 1 is the structural schematic diagram of traditional heat-dissipating mechanism.
Fig. 2 is the cross-sectional view of the air cooling radiator of this case preferred embodiment.
Fig. 3 A and 3B are water conservancy diversion carrier shown in Fig. 2 in the structural schematic diagram of different visual angles.
Fig. 4 is the cross-sectional view of the air cooling cooling system of another preferred embodiment of this case.
Fig. 5 A and 5B are respectively decomposition texture schematic diagram of the gas pump in different visual angles of this case preferred embodiment.
Fig. 6 A are for the positive structure schematic of the piezoelectric actuator of this case preferred embodiment.
Fig. 6 B are for the structure schematic diagram of the piezoelectric actuator of this case preferred embodiment.
Fig. 6 C are for the cross-sectional view of the piezoelectric actuator of this case preferred embodiment.
Fig. 7 A to 7D are the start process schematics for the gas pump of this case preferred embodiment.
Fig. 8 is the control system configuration diagram of the air cooling radiator of this case preferred embodiment.
【Specific implementation mode】
Embodying some exemplary embodiments of this case features and advantages will in detail describe in the explanation of back segment.It should be understood that
Various variations can be had in different aspects by being this case, all not depart from the range of this case, and explanation therein and figure
Show and is inherently illustrated as being used, and nand architecture is in limitation this case.
Fig. 2 is the cross-sectional view of the air cooling radiator of this case preferred embodiment, and Fig. 3 A and 3B are shown in Fig. 2
Water conservancy diversion carrier in the structural schematic diagram of different visual angles.As shown in Fig. 2,3A and 3B, the air cooling radiator 2 of this case can be applied
In an electronic equipment, such as, but not limited to portable computer, tablet computer, industrial computer, portable communication device, audio-visual broadcast
Device is put, to radiate to electronic component 3 to be radiated in electronic equipment.The air cooling radiator 2 of this case is carried comprising water conservancy diversion
Body 20 and gas pump 21.Water conservancy diversion carrier 20 is opened including first surface 20a, second surface 20b, water conservancy diversion chamber 200, air guide end
Mouthfuls 201 and connectivity slot 202, the first surface 20a and second surface 20b of wherein water conservancy diversion carrier 20 be correspond setting, and
Air guide end opening 201 is disposed on first surface 20a, water conservancy diversion chamber 200 also it is recessed on first surface 20a and and air guide
End opening 201 is connected, and connectivity slot 202 is communicated in water conservancy diversion chamber 200 and corresponds to electronic component 3.Gas pump 21 is that group is set
On the first surface 20a of water conservancy diversion carrier 20, and close air guide end opening 201.Wherein by driving gas pump 21, with
Air-flow is imported to the water conservancy diversion chamber 200 of water conservancy diversion carrier 20 via air guide end opening 201, and keeps gas fast via connectivity slot 202
Speed outflow, and provide lateral airflow to electronic component 3 and carry out heat exchange, in order to the heat dissipation realized to electronic component 3.
In this present embodiment, electronic component 3 is disposed on a bearing substrate 4, and wherein bearing substrate 4 can be but unlimited
In printed circuit board.The part of bearing substrate 4 is to be connected with water conservancy diversion carrier 20 and closed communication slot 202, implies that water conservancy diversion carrier
20 be to be connected to bearing substrate 4 and be adjacent to electronic component 3.In this present embodiment, electronic component 3 corresponds to water conservancy diversion carrier
Multiple interconnecting part exhaust outlet 204b of 20 connectivity slot 202.
Fig. 2 and Fig. 3 A are please referred to, as shown, the water conservancy diversion carrier 20 of the present embodiment further setting air inlet duct 205,
Wherein air inlet duct 205, which is also recessed, is set to the first surface 20a of water conservancy diversion carrier 20, and is communicated in the side of water conservancy diversion chamber 200,
It is too small and cause to avoid the gap between water conservancy diversion chamber 200 and gas pump 21 so that gas circulates and enters in gas pump 21
Air inlet is ineffective.In addition, air inlet duct 205 also can be used to an accommodating electric installation (not shown), electric installation be can be but
It is not limited to electric wire, and is electrically connected with gas pump 21, to provide power supply to gas pump 21, and the setting of the electric installation is not
As for the overall structure height for increasing air cooling radiator 2, in order to the lightening of realization air cooling radiator.
Please refer to Fig. 2 Fig. 3 B, as shown, the connectivity slot 202 of the water conservancy diversion carrier 20 of the present embodiment further includes confluence
There is confluence portion opening 203a, confluence portion opening 203a to be communicated in for portion 203 and multiple interconnecting parts 204, wherein confluence portion 203
Between water conservancy diversion chamber 200 and confluence portion 203, so that confluence portion 203 is connected with water conservancy diversion chamber 200；Multiple interconnecting parts 204 have
There are multiple interconnecting part opening 204a and interconnecting part exhaust outlet 204b, and interconnecting part opening 204a is connected with confluence portion 203,
So that multiple interconnecting parts 204 are connected with confluence portion 203.And in this present embodiment, confluence portion 203 further includes an inclined-plane 203c,
Inclined-plane 203c is arranged corresponding to multiple interconnecting part 205b, and if Fig. 3 A and Fig. 3 B are as it can be seen that through the oblique of this confluence portion 203
The setting of face 203c can make the area of the confluence portion opening 203a in confluence portion 203 be more than the area of confluence portion bottom 203b；It is
After gas is imported water conservancy diversion chamber 200 by gas pump 21 via air guide end opening 201, air-flow to be made to be passed through by water conservancy diversion chamber 200
It is flowed into the confluence portion 203 of connectivity slot 202 by confluence portion opening 203a, and made in air flow collection through inclined-plane 203c, simultaneously
Increase air-flow flow rate, then air-flow is flowed into via interconnecting part opening 204a in multiple interconnecting parts 204 again, and by multiple companies
Logical portion exhaust outlet 204b discharges, to carry out heat exchange with the electronic component 3 for being adjacent to water conservancy diversion carrier 20.
As shown in Fig. 2, in this present embodiment, gas pump 21 is for a piezoelectric actuated gas pump, to drive gas flow
It is dynamic.Gas pump 21 is that assembling is positioned on the first surface 20a of water conservancy diversion carrier 20, and closes the air guide end opening 201.It leads
The second surface 20b of stream carrier 20 is the part that fitting is set to bearing substrate 4, in other words, water conservancy diversion carrier 20 and gas pump 21
Assembly be that the cover is engaged on bearing substrate 4, be disposed adjacent with electronic component 3, and make multiple connections of connectivity slot 202
Portion 204 corresponds to the electronic component 3.Air guide end opening 201 and water conservancy diversion chamber 200 are closed by gas pump 21 and bearing substrate 4,
Air guide end opening 201, water conservancy diversion chamber 200 and the definition of connectivity slot 202 can be made to form closed runner, whereby to electronic component 3
Heat dissipation, in order to heat radiation efficiency.It is emphasized that this case is not limited with forming closed runner, other runner forms are also
It can adjust and change according to practical application request.
In this present embodiment, gas pump 21 is dynamic to drive gas flow, by gas by air cooling radiator 2 except
Portion is imported via air inlet duct 205 and air guide end opening 201 in water conservancy diversion chamber 200, and air-flow is made quickly to be arranged via connectivity slot 202
Go out.When gas pump 21 introduces gas into water conservancy diversion chamber 200, and keep air-flow quick via multiple interconnecting parts 204 of connectivity slot 202
When outflow, the lateral airflow that is provided by the electronic component 3 on bearing substrate 4 and will make its ambient gas form convection current,
Heat exchange is carried out in order to electronic component 3, and makes the air-flow after heat exchange that thermal energy is taken away electronic component 3.Since gas pump 21 is
Continuously start to be to export gas, makes electronic component 3 that can carry out heat exchange with continuous derived gas, while after making heat exchange
Gas through continuous rapid convective and far from electronic component 3, can realize the heat dissipation to electronic component 3 whereby, and can be improved
Heat dissipation keeps single unit system lightening, and then increases performance stability and the service life of electronic component 3.
Fig. 4 is the cross-sectional view of the air cooling cooling system of another preferred embodiment of this case.As shown in figure 4, air cooling
Cooling system 5 includes multiple groups of air cooling radiators 2 ', 2 ", to radiate simultaneously to electronic component 3.And the present embodiment
Air cooling cooling system 5 in each air cooling radiator 2 ', 2 " structure be it is identical as air cooling radiator 2 shown in Fig. 2,
And structure having the same, element and function, therefore repeated no more in this.In this present embodiment, air cooling cooling system 5 includes two
Group air cooling radiator 2 ', 2 ", which is all set on bearing substrate 4, and adjacent respectively sets
It is placed in electronic component 3, and keeps the connectivity slot 202 ', 202 " of the water conservancy diversion carrier 20 ', 20 " of air cooling radiator 2 ', 2 " all corresponding
In electronic component 3.In some embodiments, which is be adjacent to electronic component 3 two opposite
Side, and the slot 202 ', 202 " that each communicates with of the respective water conservancy diversion carrier 20 ', 20 " of two groups of air cooling radiators 2 ', 2 " is point
Not Dui Yingyu electronic component 3 two opposite sides side.When the respective gas pump 21 ', 21 " of two groups of air cooling radiators 2 ', 2 " drives
Gas flow when, two groups of air cooling radiators 2 ', 2 " at the same by gas by outside it via respective air guide end opening 201 ',
201 " import in its corresponding water conservancy diversion chamber 200 ', 200 ", and generate air-flow via respective connectivity slot 202 ', 202 "
Confluence portion 203 ', 203 " flow into its corresponding multiple interconnecting part 204 ', 204 ", then by respective interconnecting part exhaust outlet
204b ', 204b " are quickly discharged, and provide lateral airflow in the different sides of electronic component 3, promote the electricity on bearing substrate 4
3 ambient gas of subcomponent accelerates convection current and carries out heat exchange with electronic component 3, can further improve to electronic component 3 whereby
Heat dissipation, and then increase electronic component 3 performance stability and the service life.It is emphasized that the gas of air cooling cooling system 5
The quantity of cooling and radiation device with configuration be not limited with above-described embodiment, quantity with configuration can according to practical application request and
Appoint and applies variation.
Fig. 5 A, 5B are please referred to, Fig. 5 A, 5B are the gas pumps for this case preferred embodiment in the decomposition texture of different visual angles
Schematic diagram.In this present embodiment, gas pump 21 be for a piezoelectric actuated gas pump, it is dynamic to drive gas flow.As shown,
The gas pump 21 of this case includes the elements such as resonance plate 212, piezoelectric actuator 213, cover board 216.Resonance plate 212 corresponds to press
Electric actuator 213 is arranged, and has a hollow bore 2120, is set to 212 central area of resonance plate, but not limited to this.Pressure
Electric actuator 213 has suspension board 2131, outline border 2132 and piezoelectric ceramic plate 2133, wherein suspension board 2131 has central part
2131c and peripheral part 2131d, when piezoelectric ceramic plate 2133 is driven by voltage, suspension board 2131 can by central part 2131c to
Peripheral part 2131d bending vibrations, outline border 2132 are to surround the outside for being set to suspension board 2131, and have an at least holder
A 2132a and conductive connecting pin 2132b, but not limited to this, and each holder 2132a is disposed on suspension board 2131 and outline border
Between 2132, and the both ends of each holder 2132a are that connection suspension board 2131 and outline border 2132 are led with providing resilient support
Electric pin 2132b be convex be set to outline border 2132 on, to for electrical connection be used, piezoelectric ceramic plate 2133 be attached at it is outstanding
The second surface 2131b of kickboard 2131 generates deformation to receive applied voltage, to drive 2131 bending vibration of suspension board.
Cover board 216 has side wall 2161, bottom plate 2162 and opening portion 2163, and side wall 2161 is to surround 2162 periphery of bottom plate and be convexly equipped in
On bottom plate 2162, and accommodating space 216a is collectively formed with bottom plate 2162, is set with for resonance plate 212 and piezoelectric actuator 213
It is placed in one, opening portion 2163 is disposed on side wall 2161, is passed outwards through with for the conductive connecting pin 2132b of outline border 2132
Opening portion 2163 and protrude from except cover board 216, in order to be connect with external power supply, but not limited to this.
In this present embodiment, the gas pump 21 of this case further includes two insulating trips 2141,2142 and a conductive sheet 215, but simultaneously
It is not limited, wherein two insulating trips 2141,2142 are to be respectively arranged at about 215 conductive sheet, and shape is to be generally corresponding to
In the outline border 2132 of piezoelectric actuator 213, and be made of the material that can be insulated, such as：Plastic cement is used with carrying out insulation,
But be all not limited, conductive sheet 215 be then made by conductive material, such as：Metal, conduct being used, and its
Shape is also to correspond roughly to the outline border 2132 of piezoelectric actuator 213, but be all not limited.Again in this present embodiment, conductive
One conductive connecting pin 2151 can be also set on piece 215, and conduct being used, conductive connecting pin 2151 is also as outline border 2132 being led
Electric pin 2132b passes outwards through the opening portion 2163 of cover board 216 and protrudes from except cover board 216, in order to connect with external power supply
It connects.
Please refer to Fig. 6 A, 6B, 6C, Fig. 6 A be for the positive structure schematic of the piezoelectric actuator of this case preferred embodiment,
Fig. 6 B are for the structure schematic diagram of the piezoelectric actuator of this case preferred embodiment, and Fig. 6 C are for this case preferred embodiment
The cross-sectional view of piezoelectric actuator.As shown, in this present embodiment, the suspension board 2131 of this case is for cascaded surface
Structure, i.e., in having more a protrusion 2131e, and protrusion on the central part 2131c of 2131 first surface 2131a of suspension board
2131e is a circular protrusions structure, but is not limited thereto, and in some embodiments, suspension board 2131 also can be two-sided smooth
Plate square.Again as shown in Figure 6 C, the protrusion 2131e of suspension board 2131 is total with the first surface 2132c of outline border 2132
Plane, and the first surface 2132a ' of the first surface 2131a and holder 2132a of suspension board 2131 are also coplanar, in addition,
The first surface 2131a of the protrusion 2131e of the suspension board 2131 and first surface 2132c of outline border 2132 and suspension board 2131 and
It is that there is a certain depth between the first surface 2132a ' of holder 2132a.As for the second surface 2131b of suspension board 2131,
Then as shown in Fig. 6 B and Fig. 6 C, the second surface 2132a " with the second surface 2132d and holder 2132a of outline border 2132 is
Smooth coplanar structure, and piezoelectric ceramic plate 2133 is then attached at the second surface 2131b of this smooth suspension board 2131
Place.In other embodiments, the kenel of suspension board 2131 also can be a two-sided smooth plate square structure, not with
This is limited, and can appoint according to situation is actually applied and apply variation.In some embodiments, suspension board 2131, outline border 2132 and branch
Frame 2132a be can be integrally formed structures, and can be made of a metallic plate, such as can be made of stainless steel, but
It is not limited.Again in this present embodiment, this case gas pump 21 is between suspension board 2131, outline border 2132 and holder 2132a
With more an at least gap 2134, to for gas to pass through.
The start flow of this case gas pump 21 further explained below, please refer to Fig. 7 A~7D, Fig. 7 A~7D are
For the start process schematic of the gas pump of this case preferred embodiment.First, as shown in Figure 7 A, the structure of gas pump 21 be as
It is aforementioned, for sequentially by cover board 216, another insulating trip 2142, conductive sheet 215,2141 piezoelectric actuator 213 of insulating trip and resonance
212 stack assembly of piece position, and piezoelectric actuator 213 after combination stacked, insulating trip 2141, conductive sheet 215,
The surrounding of another insulating trip 2142 gives gluing and forms colloid 218, and then fills up the periphery of the accommodating space 216a of cover board 216
And complete sealing.It is and resonance plate 212 and cover board 216 with gap g0 between resonance plate 212 and piezoelectric actuator 213
2161 common definition of side wall goes out confluence chamber 217a, then has the first chamber between resonance plate 212 and piezoelectric actuator 213
Room 217b.When gas pump 21 is not yet driven by voltage, the position of each element, that is, as shown in Figure 7 A.
Then as shown in Figure 7 B, when the piezoelectric actuator 213 of gas pump 21 is vibrated upwards by voltage actuation, gas
It can be entered in gas pump 21 by the opening portion 2163 of cover board 216, and be pooled to confluence chamber 217a, then again via resonance plate
Hollow bore 2120 on 212 is flowed upwardly into first chamber 217b, while resonance plate 212 is by piezoelectric actuator 213
The resonance of suspension board 2131 influence also can with carry out reciprocating vibration, i.e., resonance plate 212 with upward deformation, i.e. resonance plate
212 at hollow bore 2120 upward dimpling.
Thereafter, then as seen in figure 7 c, piezoelectric actuator 213 is to vibrate back initial position downwards at this time, piezoelectric actuated at this time
The 2131 upper convex portion 2131e of suspension board of device 213, and close to resonance plate 212 at hollow bore 2120 upward dimpling part,
And then promotes in gas pump 21 gas up half storey first chamber 217b is temporary.
Again as illustrated in fig. 7d, piezoelectric actuator 213 vibrates still further below, and resonance plate 212 is due to by piezoelectric actuator 213
The resonant interaction of vibration, resonance plate 212 also can with downward vibration, by this resonance plate 212 downward deformation compress the first chamber
The volume of room 217b, so promote the gas in upper half storey first chamber 217b push flow and pass through to both sides it is piezoelectric actuated
Circulation is passed through in the gap 2134 of device 213 downwards, compresses discharge to flow at the hollow bore 2120 of resonance plate 212, is formed
One compressed gas flows to the first water conservancy diversion chamber 202 of carrier 20 via air guide end opening 204.Thus state sample implementation is as it can be seen that when altogether
When the piece 212 that shakes carries out vertical reciprocating vibration, being can be by the gap g0 between resonance plate 212 and piezoelectric actuator 213 to increase
Add the maximum distance of its vertical displacement, in other words, the gap g0 of the setting between oscillating plate 12 and piezoelectric actuator 213 can
Make resonance plate 212 that can generate upper and lower displacement by a larger margin when resonance.
Finally, resonance plate 212 can be repositioned to initial position, i.e., as shown in Figure 7 A, and then penetrate start flow above-mentioned,
By the sequence persistent loop of Fig. 7 A~7D, gas can constantly flow into confluence chamber via the opening portion 2163 of cover board 216
217a, then first chamber 217b is flowed into, and then flowed into confluence chamber 217a by first chamber 217b, make air-flow continuous flow
Enter in air guide end opening 204, and then transmission gas can be stablized.In other words, when the gas pump of this case 21 operates, gas is
Opening portion 2163, confluence chamber 217a, first chamber 217b, confluence chamber 217a and the air guide end of the cover board 216 sequentially flowed through
Opening 204, therefore the gas pump 21 of this case can pass through single element, i.e. cover board 216, and utilize the opening portion 2163 of cover board 216
The effect of structure design can reach the number of elements for reducing gas pump 21, simplify overall process.
From the above, through the start of above-mentioned gas pump 21, by gas via the air guide end opening 201 of water conservancy diversion carrier 20
It imports in water conservancy diversion chamber 200, and rapidly imports air-flow in multiple interconnecting parts 204 via the confluence portion 203 of connectivity slot 202,
Again by multiple interconnecting part exhaust outlet 204b promptly by air-flow dispatch to electronic component 3, so that imported gas and electronics member
Part 3 carries out heat exchange, whereby to improve the efficiency of cooling, and then increases performance stability and the service life of electronic component 3.
Referring to Fig. 8, Fig. 8 is the configuration diagram of the control system of the air cooling radiator of this case.As shown, this
The air cooling radiator 2 of case preferred embodiment is to further include control system 6, wherein control system 6 more with function of temperature control
Including control unit 61 and temperature sensor 62, wherein control unit 61 are electrically connected with gas pump 21, to control gas pump 21
Running.Temperature sensor 62 can then be adjacent to the periphery of electronic component 3, for sensing the temperature of electronic component 3.Yu Ben
In embodiment, temperature sensor 62 is electrically connected to control unit 51, senses the temperature near electronic component 3, or directly paste
Sensing 3 temperature of electronic component on electronic component 3 is invested, and sensing signal is transmitted to control unit 61.Control unit 61 according to
According to the sensing signal of temperature sensor 62, judge whether the temperature of the electronic component 3 is higher than a temperature threshold value, when control is single
When member 61 judges that the temperature of the electronic component 3 is higher than the temperature threshold value, a control signal is sent out to gas pump 21, with enable
Gas pump 21 operates, and makes the flowing of 61 certain driving air-flow of gas pump to carry out cooling to electronic component 3 whereby, so that electronics is first
3 cooling of part simultaneously reduces temperature.When control unit 61 judges that the temperature of the electronic component 3 is less than the temperature threshold value, hair
Go out a control signal to can avoid 21 continued operation of gas pump to stop the running of gas pump 21 to gas pump 21 whereby and lead to the longevity
Life shortens, and reduces the consume of additional energy.Therefore through the setting of control system 6, make the gas of air cooling radiator 2
Pump 21 can carry out cooling when 3 temperature overheating of electronic component, and stop operating after the reduction of 3 temperature of electronic component, whereby
Can avoid 21 continued operation of gas pump and lead to reduced lifetime, reduce the consume of additional energy, can also make electronic component 3 in
It is operated under one preferred temperature environment, improves the stability of electronic component 3.
In conclusion a kind of air cooling radiator of this case offer and system, can be applied to various electronic equipments, with right
The electronic component of electronic equipment internal carries out crosswind thermal convection current heat dissipation, in order to heat radiation efficiency, reduces noise, makes electronic equipment
The performance of internal electronic element is stable and prolongs the service life, and without being superimposed radiator on electronic component, can make whole electricity
Sub- device thickness reaches lightening.In addition, the air cooling radiator and system of this case can be according to electricity with function of temperature control
The temperature change of sub- equipment internal electronic element, controls the running of gas pump, in order to heat radiation efficiency, and extends heat dissipation dress
The service life set.
【Symbol description】
11：Electronic component
12：Thermal transfer plate
13：Heat-conducting glue
2、2’、2”：Be gas-cooled radiator
20、20’、20”：Water conservancy diversion carrier
20a：First surface
20b：First surface
200、200’、200”：Water conservancy diversion chamber
201、201’、201”：Air guide end opening
202、202’、202”：Connectivity slot
203、203’、203”：Confluence portion
203a：Confluence portion is open
203b：Confluence portion bottom
203c：Inclined-plane
204、204’、204”：Interconnecting part
204a：Interconnecting part is open
204b、204b’、204b”：Interconnecting part exhaust outlet
205：Air inlet duct
21：Gas pump
212：Resonance plate
2120：Hollow bore
213：Piezoelectric actuator
2131：Suspension board
2131a：First surface
2131b：Second surface
2131c：Central part
2131d：Peripheral part
2131e：Protrusion
2132：Outline border
2132a：Holder
2132a’：First surface
2132a”：Second surface
2132b：Conductive connecting pin
2132c：First surface
2132d：Second surface
2133：Piezoelectric ceramic plate
2134：Gap
2141、2142：Insulating trip
215：Conductive sheet
2151：Conductive connecting pin
216：Cover board
216a：Accommodating space
2161：Side wall
2162：Bottom plate
2163：Opening portion
217b：First chamber
217a：Converge chamber
218：Colloid
3：Electronic component
4：Bearing substrate
5：Be gas-cooled cooling system
6：Control system
61：Control unit
62：Temperature sensor
g0：Gap
Claims (13)
1. a kind of air cooling radiator, neighbour set an electronic component, to the electronic element radiating, which is characterized in that the gas
Cooling and radiation device includes：
One water conservancy diversion carrier, including a first surface, a second surface, a water conservancy diversion chamber, an air guide end opening and a connectivity slot,
Wherein first surface and the second surface corresponds setting, which is set to the first surface, the diversion cavity
Room is recessed to be connected in the first surface and with the air guide end opening, which is communicated in the water conservancy diversion chamber and the corresponding electronics
Element；And
One gas pump is set on the first surface of the water conservancy diversion carrier, and closes the air guide end opening, which includes：
One resonance plate has a hollow bore；
One piezoelectric actuator, setting corresponding with the resonance plate；And
There is one cover board one side wall, a bottom plate and an opening portion, the side wall ring to be convexly equipped on the bottom plate simultaneously around the base portion peripheral
An accommodating space is formed with the bottom plate, and the resonance plate and the piezoelectric actuator are set in the accommodating space, which sets
It is placed on the side wall, wherein forms a first chamber between the bottom plate and the resonance plate of the cover board, the resonance plate and the cover board
The side wall common definition go out a confluence chamber；
Wherein by the gas pump is driven, air-flow is imported into the water conservancy diversion chamber via the air guide end opening, so that air-flow is penetrated should
Connectivity slot is discharged, and to provide a lateral airflow to the electronic component, and carries out heat exchange with the electronic component.
2. air cooling radiator as described in claim 1, which is characterized in that the air cooling radiator further includes a carrying base
Plate, the part of the bearing substrate are connected with the second surface of the water conservancy diversion carrier and close the connectivity slot, wherein electronics member
Part is set to the bearing substrate.
3. air cooling radiator as described in claim 1, which is characterized in that further one air inlet duct of setting of the carrier, it should be into
Air drain is recessed in the first surface, and is communicated in the side of the water conservancy diversion chamber, and supplied gas circulates and enters in the gas pump.
4. air cooling radiator as described in claim 1, which is characterized in that the connectivity slot further includes a confluence portion and multiple companies
Logical portion, and the confluence portion is connected with the water conservancy diversion chamber, multiple interconnecting part is connected with the confluence portion, which includes one
Inclined-plane, the inclined-plane are arranged corresponding to multiple interconnecting part.
5. air cooling radiator as claimed in claim 4, which is characterized in that the confluence portion is open comprising a confluence portion, the remittance
Stream portion open communication is between the water conservancy diversion chamber and the confluence portion, and the area of confluence portion opening is more than the confluence portion bottom
Area.
6. air cooling radiator as described in claim 1, which is characterized in that the gas pump is by the cover board, the piezoelectric actuator
And the resonance plate is sequentially to coping with folded setting positioning, when the piezoelectric actuator it is driven to carry out gas collection operation when, gas first by
It is temporary that the hollow bore of the resonance plate flow to the first chamber, when the piezoelectric actuator it is driven operation is exhausted when,
Gas first flows into the air guide end opening by the first chamber by the hollow bore of the resonance plate.
7. air cooling radiator as described in claim 1, which is characterized in that the piezoelectric actuator includes：
One suspension board has a first surface and a second surface；
One outline border, have an at least holder, an at least holder connect the suspension board and the outline border and be set to the suspension board and
Between the outline border；And
One piezoelectric ceramic plate is attached at the first surface of the suspension board, to apply voltage to drive the suspension plate benging to shake
It is dynamic.
8. air cooling radiator as claimed in claim 7, which is characterized in that between the holder, the suspension board and the outline border more
With an at least gap, and the two-end-point of the holder is separately connected the outline border and the suspension board.
9. as claimed in claim 7 air cooling radiator, which is characterized in that the suspension board on the second surface have more one
Protrusion, and the protrusion is a cylindrical structure.
10. as claimed in claim 7 air cooling radiator, which is characterized in that the gas pump further include an at least insulating trip and
One conductive sheet, and an at least insulating trip and the conductive sheet are sequentially arranged under the piezoelectric actuator.
11. air cooling radiator as described in claim 1, further includes a control system, which includes：
One control unit is electrically connected to the gas pump, to control gas pump running；And
One temperature sensor is electrically connected to the control unit and is adjacent to the electronic component, to sense a temperature of the electronic component
Degree is to export a sensing signal to the control unit；
Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door
When threshold value, which makes the gas pump enable, is flowed with certain driving air-flow, and when the control unit is in receiving the sensing
Signal, and judge the electronic component the temperature be less than the temperature threshold value when, which makes the gas pump stop operating.
12. air cooling radiator as claimed in claim 10, which is characterized in that the outline border of the piezoelectric actuator has a conduction
Pin, which has a conductive connecting pin, and the opening portion of the cover board of the gas pump is set on side wall, with for this
The conductive connecting pin of outline border and the conductive connecting pin of the conductive sheet pass outwards through the opening portion and protrude from except the cover board, so as to
It is connect in external power supply.
13. a kind of air cooling cooling system, to an electronic element radiating, which is characterized in that the air cooling cooling system includes：
Multiple air cooling radiators are adjacent to the electronic component respectively, and each air cooling radiator includes：
One water conservancy diversion carrier, including a first surface, a second surface, a water conservancy diversion chamber, an air guide end opening and a connectivity slot,
Wherein first surface and the second surface corresponds setting, which is set to the first surface, the diversion cavity
Room is connected with the air guide end opening, which is communicated in the water conservancy diversion chamber and the corresponding electronic component；And
One gas pump, is set to the first surface of the water conservancy diversion carrier, and closes the air guide end opening, which includes：
One resonance plate has a hollow bore；
One piezoelectric actuator, setting corresponding with the resonance plate；And
There is one cover board one side wall, a bottom plate and an opening portion, the side wall ring to be convexly equipped on the bottom plate simultaneously around the base portion peripheral
An accommodating space is formed with the bottom plate, and the resonance plate and the piezoelectric actuator are set in the accommodating space, which sets
It is placed on the side wall, wherein forms a first chamber between the bottom plate and the resonance plate of the cover board, the resonance plate and the cover board
The side wall common definition go out a confluence chamber；
Wherein by the gas pump for driving each air cooling radiator, air-flow is imported via each air guide end opening
Corresponding each water conservancy diversion chamber makes air-flow be discharged through each connectivity slot, to provide multiple lateral airflows to electronics member
Part, and carry out heat exchange with the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710090295.XA CN108463089B (en) | 2017-02-20 | 2017-02-20 | Air-cooled heat dissipation device and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710090295.XA CN108463089B (en) | 2017-02-20 | 2017-02-20 | Air-cooled heat dissipation device and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108463089A true CN108463089A (en) | 2018-08-28 |
| CN108463089B CN108463089B (en) | 2020-04-07 |
Family
ID=63221961
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710090295.XA Active CN108463089B (en) | 2017-02-20 | 2017-02-20 | Air-cooled heat dissipation device and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108463089B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204634239U (en) * | 2015-03-20 | 2015-09-09 | 长春隆美科技发展有限公司 | A kind of driving type piezoelectric actuator heat radiation module |
| TWM529794U (en) * | 2016-01-29 | 2016-10-01 | Microjet Technology Co Ltd | Micro pneumatic driving apparatus |
| EP3079034A1 (en) * | 2015-04-07 | 2016-10-12 | Vestel Elektronik Sanayi ve Ticaret A.S. | Double-acting synthetic jet module for cooling of electronic devices |
| CN206585882U (en) * | 2017-02-20 | 2017-10-24 | 研能科技股份有限公司 | Air cooling heat abstractor and system |
-
2017
- 2017-02-20 CN CN201710090295.XA patent/CN108463089B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204634239U (en) * | 2015-03-20 | 2015-09-09 | 长春隆美科技发展有限公司 | A kind of driving type piezoelectric actuator heat radiation module |
| EP3079034A1 (en) * | 2015-04-07 | 2016-10-12 | Vestel Elektronik Sanayi ve Ticaret A.S. | Double-acting synthetic jet module for cooling of electronic devices |
| TWM529794U (en) * | 2016-01-29 | 2016-10-01 | Microjet Technology Co Ltd | Micro pneumatic driving apparatus |
| CN206585882U (en) * | 2017-02-20 | 2017-10-24 | 研能科技股份有限公司 | Air cooling heat abstractor and system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108463089B (en) | 2020-04-07 |
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