CN108463087A - Be gas-cooled radiator - Google Patents

Be gas-cooled radiator Download PDF

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Publication number
CN108463087A
CN108463087A CN201710090050.7A CN201710090050A CN108463087A CN 108463087 A CN108463087 A CN 108463087A CN 201710090050 A CN201710090050 A CN 201710090050A CN 108463087 A CN108463087 A CN 108463087A
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CN
China
Prior art keywords
air
electronic component
end opening
resonance plate
gas pump
Prior art date
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Granted
Application number
CN201710090050.7A
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Chinese (zh)
Other versions
CN108463087B (en
Inventor
陈世昌
廖家淯
黄启峰
韩永隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microjet Technology Co Ltd
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Microjet Technology Co Ltd
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Priority to CN201710090050.7A priority Critical patent/CN108463087B/en
Publication of CN108463087A publication Critical patent/CN108463087A/en
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Publication of CN108463087B publication Critical patent/CN108463087B/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Reciprocating Pumps (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A kind of air cooling radiator, to electronic element radiating, air cooling radiator includes:Carrier, including air flow passage, air guide end opening and exhaust end opening, wherein carrier the cover electronic component and make electronic component be located in air flow passage;And gas pump, including:Resonance plate has hollow bore;Piezoelectric actuator, setting corresponding with resonance plate;And cover board, with side wall, bottom plate and opening portion, side wall is to surround base portion peripheral and be convexly equipped on bottom plate and form accommodating space with bottom plate, and resonance plate and piezoelectric actuator are disposed in accommodating space, opening portion is disposed on side wall, first chamber is formed between the bottom plate and resonance plate of its cover plate, the side wall common definition of the resonance plate and the cover board goes out a confluence chamber.

Description

Be gas-cooled radiator
【Technical field】
This case be about a kind of air cooling radiator, it is espespecially a kind of using gas pump to provide certain driving air-flow to radiate Be gas-cooled radiator.
【Background technology】
With the development of science and technology various electronic equipments such as portable computer, tablet computer, industrial computer, portable logical Device, audio and video player etc. are interrogated towards lightening, portable and dynamical trend development, these electronic equipments are limited in its Various high integrations or high-power electronic component must be configured in inner space, in order to make the arithmetic speed of electronic equipment faster With it is with better function, the electronic component of electronic equipment internal will generate more thermal energy when running, and lead to high temperature.In addition, These electronic equipments are largely all designed as frivolous, the flat and compact external form of tool, and not additional inner space is for radiating It is cooling, therefore the electronic component in electronic equipment is vulnerable to the influence of thermal energy, high temperature, and then the problems such as cause interference with or be damaged.
In general, the radiating mode of electronic equipment internal can be divided into active heat dissipation and passive heat radiation.It is active to dissipate Hot generally use tube-axial fan or blast type fan are set to electronic equipment internal, by tube-axial fan or blast type fan Certain driving air-flow radiates heat energy transfer caused by electronic equipment internal electronic component in order to realizing.However, tube-axial fan And blast type fan will produce larger noise in running, and its volume is larger is not easy to be thinned and minimize, moreover axis stream The service life of formula fan and blast type fan is shorter, thus traditional tube-axial fan and blast type fan be not particularly suited for it is frivolous Heat dissipation is realized in change and portable electronic equipment.
Furthermore many electronic components can utilize for example surface mount technology (Surface Mount Technology, SMT), the technologies such as Selective Soldering (Selective Soldering) are welded in printed circuit board (Printed Circuit Board, PCB) on, however the electronic component welded using aforementioned welding manner, it is in high thermal energy, high temperature ring in through a long time It under border, is easy that electronic component is made to be separated with printed circuit board, and most of electronic component also non-refractory, if electronic component is long Time is under high thermal energy, hot environment, and the performance stability for easily leading to electronic component declines and reduced lifetime.
Fig. 1 is for the structural schematic diagram of known cooling mechanism.As shown in Figure 1, it is known that cooling mechanism is dissipated for a passive type Heat engine structure comprising thermal transfer plate 12, the thermal transfer plate 12 are by a heat-conducting glue 13 and 11 phase of electronic component to be radiated Fitting, heat conduction path is formed by by heat-conducting glue 13 and thermal transfer plate 12, electronic component 11 can be made using heat transfer and Free convection mode reaches heat dissipation.However, the radiating efficiency of aforementioned cooling mechanism is poor, application demand cannot be satisfied.
In view of this, it is really necessary to develop a kind of air cooling radiator, to solve prior art problem encountered.
【Invention content】
This case is designed to provide a kind of air cooling radiator, various electronic equipments is can be applied to, to be set to electronics Standby internal electronic component radiates, and in order to heat radiation efficiency, reduces noise, and make the property of electronic equipment internal electronic component It can stablize and prolong the service life.
The another object of this case is to provide a kind of air cooling radiator, can be according to electronic equipment with function of temperature control The temperature change of internal electronic element controls the running of gas pump, in order to heat radiation efficiency, and extends air cooling radiator Service life.
In order to achieve the above object, this case provides a kind of air cooling radiator, to electronic element radiating, be gas-cooled radiator Including:Carrier, including air flow passage, air guide end opening and exhaust end opening, wherein carrier the cover electronic component and make electricity Subcomponent is located in air flow passage;And gas pump, including:Resonance plate has hollow bore;Piezoelectric actuator, together The corresponding setting of the piece that shakes;And cover board, there is side wall, bottom plate and opening portion, side wall is to surround base portion peripheral and be convexly equipped in bottom plate Accommodating space above and with bottom plate is formed, and resonance plate and piezoelectric actuator are disposed in accommodating space, opening portion is disposed on On side wall, first chamber is formed between the bottom plate and resonance plate of cover plate, the side wall of the resonance plate and the cover board is common Define a confluence chamber;Wherein, the cover board, piezoelectric actuator and resonance plate of gas pump are sequentially from top to bottom to stack to be fixedly arranged on On carrier, and close air guide end opening, when piezoelectric actuator it is driven to carry out gas collection operation when, gas is the opening by cover board Portion imports and is collected to the confluence chamber, and the hollow bore for flowing through resonance plate enters in first chamber and keeps in, and works as piezoelectric actuator It is driven operation is exhausted when, gas be by first chamber flow through resonance plate hollow bore and the confluence chamber and be discharged To air guide end opening, air-flow is imported into air flow passage via air guide end opening and heat exchange is carried out to electronic component, and The air-flow after heat exchange will be carried out with electronic component via exhaust end opening discharge.
【Description of the drawings】
Fig. 1 is the structural schematic diagram of known cooling mechanism.
Fig. 2A is the structural schematic diagram of the air cooling radiator of the first preferred embodiment of this case.
Fig. 2 B are Fig. 2A in the structural schematic diagram in the sections A-A '.
Fig. 3 is the cross section structure schematic diagram of the air cooling radiator of the second preferred embodiment of this case.
Fig. 4 A are the back side decomposition texture schematic diagram of the gas pump of the first preferred embodiment of this case.
Fig. 4 B are the positive decomposition texture schematic diagram of the gas pump of the first preferred embodiment of this case.
Fig. 5 is the cross-sectional view of the piezoelectric actuator of the first preferred embodiment of this case.
Fig. 6 A~6D are for the start process schematic of the gas pump of the first preferred embodiment of this case.
Fig. 7 is the configuration diagram of the air cooling radiator of this case third preferred embodiment.
【Specific implementation mode】
Embodying some exemplary embodiments of this case features and advantages will in detail describe in the explanation of back segment.It should be understood that This case can have various variations in different aspects, all not depart from the range of this case, and explanation therein and schema It is inherently illustrated as being used, not for limitation this case.
Fig. 2A, 2B are please referred to, Fig. 2A is the structural schematic diagram of the air cooling radiator of the first preferred embodiment of this case.Fig. 2 B It is Fig. 2A in the structural schematic diagram in the sections A-A '.As shown, the air cooling radiator 2 of this case can be applied to an electronic equipment, Such as, but not limited to portable computer, tablet computer, industrial computer, portable communication device, audio and video player, to be set to electronics Standby interior electronic component 3 to be radiated radiates.The air cooling radiator 2 of this case includes carrier 20 and gas pump 22, wherein Carrier 20 includes air guide end opening 23, exhaust end opening 24 and air ventilation passage 25.Carrier 20 is the cover in electronic component 3, and the electronic component 3 is made to be located in air flow passage 25.Gas pump 22 is to be fixedly arranged on carrier 20, and assembling is positioned at and leads Gas end opening 23, and close the air guide end opening 23.Wherein by driving gas pump 22, by air-flow via air guide end opening 23 import air flow passage 25 and carry out heat exchange to electronic component 3, and the gas after heat exchange will be carried out with the electronic component 3 It flows through and is discharged by exhaust end opening 24, in order to the heat dissipation realized to electronic component 3.
In some embodiments, carrier 20 is to be connected with group by multiple thermal insulation board 26 and formed, and multiple thermal insulation boards 26 are fixed Justice forms the air ventilation passage 25, the air guide end opening 23 and the exhaust end opening 24.Gas pump 22 is to be fixedly arranged on carrier 20 Thermal insulation board 26 on.20 the cover of the carrier electronic component 3, and air guide end opening 23 is correspondingly arranged with electronic component 3.In some In embodiment, wherein electronic component 3 is with first surface 3a and second surface 3b, and is to be set to hot biography with second surface 3b On guide plate 4, and the heat conduction path that can pass through thermal transfer plate 4 radiates, and in some embodiments, bearing substrate 4 and electricity Heat-conducting glue 5 can be more coated between the second surface 3b of subcomponent 3, that is, electronic component 3 is through its second surface 3b and heat-conducting glue 5 It stacks and is set on bearing substrate 4, but be not limited thereto.The thermal insulation board 26 of carrier 20 is connected to thermal transfer plate 4.Heat transfer Plate 4 is made of high heat-conduction coefficient material, which can be to be such as, but not limited to electrographite.
In this present embodiment, gas pump 22 be for a piezoelectric actuated gas pump, it is dynamic to drive gas flow, by gas by The outside of air cooling radiator 2 is imported via air guide end opening 23 in air ventilation passage 25.When gas pump 22 introduces gas into When air ventilation passage 25, imported gas carries out heat exchange with the electronic component 3 in carrier 20, and pushes air ventilation passage Gas in 25 quickly flows, and promotes the air-flow after heat exchange that thermal energy is drained into air cooling radiator 2 via exhaust end opening 24 It is external.Since gas pump 22 is continuously start to import gas, make electronic component 3 that can carry out heat with the gas being continuously introduced into It exchanges, while the air-flow after heat exchange being made to be discharged via exhaust end opening 24, can realize the heat dissipation to electronic component 3 whereby, and Heat dissipation can be improved, and then increase performance stability and the service life of electronic component 3.
Fig. 3 is the cross section structure schematic diagram of the air cooling radiator of this case second embodiment.As shown in figure 3, the present embodiment Air cooling radiator 2a to shown in Fig. 2 B be gas-cooled radiator 2 it is similar, and identical element numbers represent identical structure, Element and function, repeat no more in this.Compared to the radiator 2 that is gas-cooled shown in Fig. 2 B, the air cooling radiator of the present embodiment 2a further includes a radiator 27, is connected in the first surface 3a of electronic component 3 and in air ventilation passage 25.Heat dissipation Device 27 includes a pedestal 271 and multiple cooling fins 272, and pedestal 271 is attached at the surface of electronic component 3, and multiple cooling fins 272 are It is vertically connected at pedestal 271.By the setting of radiator 27, heat dissipation area can be increased, make caused by electronic component 3 that thermal energy can Heat exchange is carried out with the gas in air ventilation passage 25 via radiator 27, in order to heat radiation efficiency.
Fig. 4 A and 4B are please referred to, Fig. 4 A are the back side decomposition texture schematic diagram of the gas pump of the first preferred embodiment of this case, Fig. 4 B are the positive decomposition texture schematic diagram of the gas pump of the first preferred embodiment of this case.As shown, the gas pump 22 of this case Including the elements such as resonance plate 221, piezoelectric actuator 222, cover board 226.Resonance plate 221 has a hollow bore 221a, is corresponding It is arranged in the air guide end opening 23 of carrier 20.Piezoelectric actuator 222 has suspension board 2221, outline border 2222, piezoelectric element 2223 and at least one equal element of holder 2224, drive gas pump 22 to receive to apply voltage.Cover board 226 has side wall 2261, bottom plate 2262 and opening portion 2263, side wall 2261 be surround 2262 periphery of bottom plate and be convexly equipped on bottom plate 2262, and with bottom Accommodating space 226a is collectively formed in plate 2262, is disposed therein with for resonance plate 221 and piezoelectric actuator 222, opening portion 2263 are disposed on side wall 2261, pass outwards through opening portion 2263 with the conductive connecting pin 2222a for outline border 2222 and protrude Except cover board 226, in order to be connect with external power supply, but not limited to this.In this present embodiment, during suspension board 2221 has Center portion 2221c and peripheral part 2221d, when piezoelectric element 2223 is driven by voltage, suspension board 2221 can by central part 2221c to Peripheral part 2221d bending vibrations, outline border 2222 are to surround the outside for being set to suspension board 2221, and have a conductive connecting pin 2222a, conductive connecting pin 2222a are that convex is set on outline border 2222, to for electrical connection, but not limited to this.Piezoelectricity There is element 2223 length of side, the length of side to be less than or equal to the length of side of suspension board 2221, and but not limited to this, and piezoelectric element 2223 be the second surface 2221b for being attached at suspension board 2221, deformation is generated to receive applied voltage, to drive suspension board 2221 bending vibrations.At least a holder 2224 is disposed between suspension board 2221 and outline border 2222, and the 2224 of each holder Both ends be connection suspension board 2221 and outline border 2222, to provide resilient support.
Again in this present embodiment, the gas pump 22 of this case further includes two insulating trips 223,225 and a conductive sheet 224, but simultaneously It is not limited, wherein two insulating trips 223,225 are to be respectively arranged at about 224 conductive sheet, and shape is to correspond roughly to press The outline border 2222 of electric actuator 222, and be made of the material that can be insulated, such as:Plastic cement, with the use to insulate, but all Be not limited, conductive sheet 224 be then made by conductive material, such as:Metal, conduct being used, and its shape Also it is to correspond roughly to the outline border 2222 of piezoelectric actuator 222, but be all not limited.Again in this present embodiment, conductive sheet 224 On a conductive connecting pin 224a can be also set, conduct being used, conductive connecting pin 224a also as outline border 2222 conductive connecting pin 2222a passes outwards through the opening portion 2263 of cover board 226 and protrudes from except cover board 226, in order to be connect with external power supply.
Referring to Fig. 5, Fig. 5 is the cross-sectional view of the piezoelectric actuator of the first preferred embodiment of this case.As schemed Show, in this present embodiment, the suspension board 2221 of this case is the structure for cascaded surface, i.e., in 2221 first surface 2221a of suspension board Central part 2221c on have more a protrusion 2221e, and protrusion 2221e is a circular protrusions structure, but is not limited thereto, In some embodiments, suspension board 2221 also can be two-sided smooth plate square.The protrusion 2221e of suspension board 2221 be with The first surface 2222b of outline border 2222 is coplanar, and the first surface of the first surface 2221a of suspension board 2221 and holder 2224 2224a is also coplanar, in addition, the first surface 2222b and suspension board of the protrusion 2221e of suspension board 2221 and outline border 2222 It is that there is a certain depth between 2221 first surface 2221a and the first surface 2224a of holder 2224.As for suspension board 2221 second surface 2221b is to be with the second surface 2224b of the second surface 2222c of outline border 2222 and holder 2224 Smooth coplanar structure, and piezoelectric element 2223 is then attached at the second surface 2221b of this smooth suspension board 2221.In In other embodiments, the kenel of suspension board 2221 also can be a two-sided smooth plate square structure, be not limited thereto, It can appoint according to situation is actually applied and apply variation.In some embodiments, suspension board 2221, outline border 2222 and holder 2224 are can It is integrally formed structures, and can be made of a metallic plate, such as can be made of stainless steel, but not limited to this. Again in this present embodiment, this case gas pump 22 is empty with more at least one between suspension board 2221, outline border 2222 and holder 2224 Gap 2225, to for gas to pass through.
The start flow of this case gas pump 22 further explained below is schemed please refer to 6A~6D, wherein 6A~ 6D figures are for the start process schematic of the gas pump of the first preferred embodiment of this case.First, as shown in Figure 6A, gas pump 22 Structure is it has been observed that for sequentially by cover board 226, another insulating trip 225, conductive sheet 224, insulating trip 223, piezoelectric actuator 222 And 221 stack assembly of resonance plate position, and piezoelectric actuator 222, insulating trip 223, conductive sheet after combination stacked 224, the surrounding of another insulating trip 225 gives gluing and forms colloid 218, and then fills up the week of the accommodating space 226a of cover board 226 Edge and complete to seal.It is with gap g0, and resonance plate 221 and cover board 226 between resonance plate 221 and piezoelectric actuator 222 2261 common definition of side wall go out to converge chamber 227a, then have first between resonance plate 221 and the bottom plate 2262 of cover board 226 Chamber 227b.When gas pump 22 is not yet driven by voltage, the position of each element, that is, as shown in Figure 6A.
Then as shown in Figure 6B, when the piezoelectric actuator 222 of gas pump 22 is vibrated upwards by voltage actuation, gas meeting Entered in gas pump 22 by the opening portion 2263 of cover board 226, and be pooled to confluence chamber 227a, then again via resonance plate 221 On hollow bore 221a flow upwardly into first chamber 227b, while resonance plate 221 is by the suspension of piezoelectric actuator 222 Plate 2221 resonance influence also can with carry out reciprocating vibration, i.e., resonance plate 221 with upward deformation, i.e., resonance plate 221 is in Upward dimpling at hollow bore 221a.
Thereafter, then as shown in Figure 6 C, piezoelectric actuator 13 is to vibrate back initial position downwards, and make piezoelectric actuator at this time The protrusion 2221e of 222 suspension board 2221 promotes the gas in lower half storey first chamber 227b to push close to resonance plate 221 Circulation is passed through in the gap 2225 flowed to both sides and pass through piezoelectric actuator 222 upwards, to flow to upper half storey first chamber 227b It is interior temporary.Thus for state sample implementation as it can be seen that when resonance plate 221 carries out vertical reciprocating vibration, being can be by resonance plate 221 and pressure Gap g0 between electric actuator 222 is to increase the maximum distance of its vertical displacement, in other words, in resonance plate 221 and piezoelectricity The gap g0 of setting between actuator 222 can make resonance plate 221 that can generate upper and lower displacement by a larger margin when resonance.
Again as shown in Figure 6 D, piezoelectric actuator 222 vibrates still further below, and resonance plate 221 by piezoelectric actuator 222 due to being shaken Dynamic resonant interaction, resonance plate 221 also can with downward vibration, promote the gas in upper half storey first chamber 227b to push to two Side is flowed and passes through the gap 2225 of piezoelectric actuator 222 passes through circulation downwards, to flow to the hollow bore 221a of resonance plate 221 Place and compress discharge, formed one compressed air stream at the air guide end opening 23 of bearing substrate 20 to be dissipated to thermal transfer plate 4 Heat.
Finally, resonance plate 221 can be repositioned to initial position, i.e., as shown in Figure 6A, and then penetrate start flow above-mentioned, by The sequence persistent loop of Fig. 6 A~6D, gas can constantly flow into confluence chamber 227a via the opening portion 2263 of cover board 226, First chamber 227b is flowed into again, and is then flowed into confluence chamber 227a by first chamber 227b, and air-flow is made to continuously flow into air guide In end opening 23, and then transmission gas can be stablized.In other words, when the gas pump of this case 22 operates, gas is sequentially to flow through Cover board 226 opening portion 2263, confluence chamber 227a, first chamber 227b, confluence chamber 227a and air guide end opening 23, therefore The gas pump 22 of this case can pass through single element, i.e. cover board 226, and the structure design of the opening portion 2263 using cover board 226, energy The effect of enough reaching the number of elements for reducing gas pump 22, simplifying overall process.
Referring to Fig. 7, Fig. 7 is the configuration diagram of the air cooling radiator of this case third preferred embodiment.The present embodiment Air cooling radiator 2 be to further include control system 21 with function of temperature control, the control system 21 include control unit 211 And temperature sensor 212, wherein control unit 211 is electrically connected with gas pump 22, to control the running of gas pump 22.Temperature passes Sensor 212 is disposed in carrier 20, and is adjacent to electronic component 3, for the temperature near sensing electronic component 3, or It is attached directly to sense 3 temperature of electronic component on electronic component 3.Temperature sensor 212 is electrically connected to control unit 211, sense The temperature of electronic component 3 is surveyed, and sensing signal is transmitted to control unit 211.Control unit 211 is according to temperature sensor 212 Sensing signal, judge the electronic component 3 temperature whether be higher than a temperature threshold value, when control unit 211 judges the electronics When the temperature of element 3 is higher than the temperature threshold value, a control signal is sent out to gas pump 22, is operated, is borrowed with enable gas pump 22 This makes the flowing of 22 certain driving air-flow of gas pump to carry out cooling to electronic component 3, so that 3 cooling of electronic component and reducing Temperature.When control unit 211 judges that the temperature of the electronic component 3 is less than the temperature threshold value, a control signal is sent out to gas Body pump 22 can avoid 22 continued operation of gas pump whereby and lead to reduced lifetime, reduce additional to stop the running of gas pump 22 The consume of energy.Therefore through the setting of control system 21, make the gas pump 22 of air cooling radiator 2 in 3 temperature of electronic component Cooling can be carried out when overheat, and is stopped operating after the reduction of 3 temperature of electronic component, can avoid the persistently fortune of gas pump 22 whereby Make and lead to reduced lifetime, reduce the consume of additional energy, electronic component 3 can also operated under a preferred temperature environment, Improve the stability of electronic component 3.
In conclusion this case provides a kind of air cooling radiator, various electronic equipments are can be applied to its inside Electronic element radiating reduces noise in order to heat radiation efficiency, and keeps the performance of electronic equipment internal electronic component stable and extend Service life.In addition, the air cooling radiator of this case can be according to electronic equipment internal electronic component with function of temperature control Temperature change controls the running of gas pump, in order to heat radiation efficiency, and extends the service life of radiator.
This case appointed as those skilled in the art apply craftsman think and be it is all as modify, it is so neither de- such as attached claim Be intended to Protector.
【Symbol description】
11:Electronic component
12:Thermal transfer plate
13:Heat-conducting glue
2、2a:Be gas-cooled radiator
20:Carrier
21:Control system
211:Control unit
212:Temperature sensor
218:Colloid
22:Gas pump
221:Resonance plate
221a:Hollow bore
222:Piezoelectric actuator
2221:Suspension board
2221a:The first surface of suspension board
2221b:The second surface of suspension board
2221c:Central part
2221d:Peripheral part
2221e:Protrusion
2222:Outline border
2222a、224a:Conductive connecting pin
2222b:The first surface of outline border
2222c:The second surface of outline border
2223:Piezoelectric element
2224:Holder
2224a:The first surface of holder
2224b:The second surface of holder
2225:Gap
223、225:Insulating trip
224:Conductive sheet
226:Cover board
226a:Accommodating space
2261:Side wall
2262:Bottom plate
2263:Opening portion
227a:Converge chamber
227b:First chamber
23:Air guide end opening
24:It is vented end opening
25:Air ventilation passage
26:Thermal insulation board
27:Radiator
271:Pedestal
272:Cooling fin
3:Electronic component
3a:The first surface of electronic component
3b:The second surface of electronic component
4:Thermal transfer plate
5:Heat-conducting glue
A-A’:Tangential direction
g0:Gap

Claims (7)

1. a kind of air cooling radiator, to an electronic element radiating, which is characterized in that the air cooling radiator includes:
One carrier, including an air flow passage, an air guide end opening and an exhaust end opening, wherein the carrier the cover electronics Element and the electronic component is made to be located in the air flow passage;And
One gas pump, including:
One resonance plate has a hollow bore;
One piezoelectric actuator, setting corresponding with the resonance plate;And
There is one cover board one side wall, a bottom plate and an opening portion, the side wall ring to be convexly equipped on the bottom plate simultaneously around the base portion peripheral An accommodating space is formed with the bottom plate, and the resonance plate and the piezoelectric actuator are set in the accommodating space, which sets It is placed on the side wall, wherein forms a first chamber between the bottom plate and the resonance plate of the cover board, the resonance plate and the cover board The side wall common definition go out a confluence chamber;
Wherein, cover board, the piezoelectric actuator and the resonance plate of the gas pump sequentially from top to bottom stack and are fixedly arranged on the carrier On, and close the air guide end opening, when the piezoelectric actuator it is driven to carry out gas collection operation when, gas is opened by this of the cover board Oral area importing be collected to the confluence chamber, and flow through the resonance plate the hollow bore enter the first chamber in keep in, when this Piezoelectric actuator it is driven operation is exhausted when, gas by the first chamber flow through the resonance plate the hollow bore and should Confluence chamber and be expelled to the air guide end opening, air-flow via air guide end opening is imported into the air flow passage and to the electricity Subcomponent carries out heat exchange, and is discharged the air-flow after heat exchange is carried out with the electronic component via the exhaust end opening.
2. air cooling radiator as described in claim 1, which is characterized in that the carrier includes that multiple heat-insulated board groups connect to define Form the air flow passage, the air guide end opening and the exhaust end opening, wherein the air guide end opening and the electronic component pair It should be arranged.
3. air cooling radiator as described in claim 1, which is characterized in that the piezoelectric actuator includes:
One suspension board has a first surface and a second surface, and flexible vibration;
One outline border, around the outside for being set to the suspension board;
An at least holder is connected between the suspension board and the outline border, to provide resilient support;And
One piezoelectric element has a length of side, which is less than or equal to a length of side of the suspension board, and the piezoelectric element is attached at On one second surface of the suspension board, to apply voltage to drive the suspension board bending vibration.
4. air cooling radiator as claimed in claim 3, which is characterized in that the suspension board is a square suspension board, and is had There is a protrusion.
5. as claimed in claim 3 air cooling radiator, which is characterized in that the piezoelectric actuated gas pump include a conductive sheet, One first insulating trip and one second insulating trip, the wherein resonance plate, the piezoelectric actuator, first insulating trip, the conductive sheet, Second insulating trip and the cover board sequentially from bottom to top stack setting.
6. air cooling radiator as described in claim 1, which is characterized in that the air cooling radiator further includes a control system System, the control system include:
One control unit is electrically connected to the gas pump, to control gas pump running;And
One temperature sensor is electrically connected to the control unit and is adjacent to the electronic component, to sense a temperature of the electronic component Degree is to export a sensing signal to the control unit;
Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door When threshold value, which makes the gas pump activate, and is flowed with certain driving air-flow, and when the control unit is in receiving the sensing Signal, and judge the electronic component the temperature be less than the temperature threshold value when, which makes the gas pump stop operating.
7. air cooling radiator as claimed in claim 5, which is characterized in that the outline border of the piezoelectric actuator has a conduction Pin, the conductive sheet have a conductive connecting pin, and the opening portion of the cover board of the gas pump is set on the side wall, with for The conductive connecting pin of the outline border and the conductive connecting pin of the conductive sheet pass outwards through the opening portion and protrude from except the cover board, with Convenient for being connect with external power supply.
CN201710090050.7A 2017-02-20 2017-02-20 Air cooling heat dissipation device Active CN108463087B (en)

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