CN206517729U - Air cooling heat abstractor - Google Patents

Abstract

A kind of air cooling heat abstractor, to electronic element radiating, air cooling heat abstractor is included：Carrier, including air flow passage, air guide end opening and exhaust end opening, wherein carrier enclosure lid electronic component and make electronic component be located at air flow passage in；And gas pump, comprising：Resonance plate, with hollow bore；Piezo-activator, it is corresponding with resonance plate to set；And cover plate, with side wall, bottom plate and opening portion, side wall is to surround base portion peripheral and be convexly equipped on bottom plate and form accommodation space with bottom plate, and resonance plate and piezo-activator are disposed in accommodation space, opening portion is disposed on the wall of side, first chamber is formed between the bottom plate and resonance plate of its cover plate, the side wall common definition of the resonance plate and the cover plate goes out one and confluxed chamber.

Description

Air cooling heat abstractor

【Technical field】

This case be on a kind of air cooling heat abstractor, it is espespecially a kind of to provide driving air-flow using gas pump to be radiated Air cooling heat abstractor.

【Background technology】

With the development of science and technology various electronic equipments such as portable computer, tablet personal computer, industrial computer, portable logical Device, audio and video player etc. are interrogated towards lightening, portable and dynamical trend development, these electronic equipments are limited in its Various high integrations or high-power electronic component must be configured in inner space, in order that the arithmetic speed of electronic equipment is faster With it is with better function, the electronic component of electronic equipment internal will produce more heat energy when running, and cause high temperature.In addition, These electronic equipments are largely all designed as frivolous, flat and have compact external form, and without extra inner space for radiating Cooling, therefore the electronic component in electronic equipment is vulnerable to the influence of heat energy, high temperature, and then the problems such as cause interference with or be damaged.

In general, the radiating mode of electronic equipment internal can be divided into active radiating and passive heat radiation.It is active to dissipate It is hot that electronic equipment internal is generally arranged at using tube-axial fan or blast type fan, by tube-axial fan or blast type fan Air-flow is driven, the heat energy transfer produced by electronic equipment internal electronic component radiates in order to realizing.However, tube-axial fan And blast type fan can produce larger noise in running, and its volume is larger is difficult to be thinned and minimizes, moreover axle stream The service life of formula fan and blast type fan is shorter, thus traditional tube-axial fan and blast type fan be not particularly suited for it is frivolous Radiating is realized in change and portable electronic equipment.

Furthermore, many electronic components can using such as surface mount technology (Surface Mount Technology, SMT), the technology such as Selective Soldering (Selective Soldering) is welded in printed circuit board (PCB) (Printed Circuit Board, PCB) on, but the electronic component welded using foregoing welding manner, in through being in high heat energy, high temperature ring for a long time Under border, easily electronic component is set to be separated with printed circuit board (PCB), and most of electronic component also non-refractory, if electronic component is long Time is under high heat energy, hot environment, and the performance stability for being easily caused electronic component declines and reduced lifetime.

Fig. 1 is for the structural representation of known cooling mechanism.As shown in Figure 1, it is known that cooling mechanism is dissipated for a passive type Heat engine structure, it includes thermal transfer plate 12, and the thermal transfer plate 12 is by a heat-conducting glue 13 electronic component 11 phase to be radiated with one Laminating, the heat conduction path formed by heat-conducting glue 13 and thermal transfer plate 12, electronic component 11 can be made using heat transfer and Free convection mode reaches radiating.However, the radiating efficiency of foregoing cooling mechanism is poor, it is impossible to meet application demand.

In view of this, it is necessary to develop a kind of air cooling heat abstractor in fact, to solve prior art problem encountered.

【Utility model content】

The purpose of this case is to provide a kind of air cooling heat abstractor, and it can be applied to various electronic equipments, to be set to electronics Standby internal electronic component is radiated, in order to heat radiation efficiency, reduces noise, and make the property of electronic equipment internal electronic component It can stablize and increase the service life.

The another object of this case is to provide a kind of air cooling heat abstractor, and it has function of temperature control, can be according to electronic equipment The temperature change of internal electronic element, controls the running of gas pump, in order to heat radiation efficiency, and extends air cooling heat abstractor Service life.

For up to above-mentioned purpose, this case provides a kind of air cooling heat abstractor, to electronic element radiating, air cooling heat abstractor Comprising：Carrier, including air flow passage, air guide end opening and exhaust end opening, wherein carrier enclosure lid electronic component and make electricity Subcomponent is located in air flow passage；And gas pump, comprising：Resonance plate, with hollow bore；Piezo-activator, together The piece that shakes is corresponding to be set；And cover plate, with side wall, bottom plate and opening portion, side wall is to surround base portion peripheral and be convexly equipped in bottom plate Accommodation space above and with bottom plate is formed, and resonance plate and piezo-activator are disposed in accommodation space, opening portion is disposed on On the wall of side, first chamber is formed between the bottom plate and resonance plate of its cover plate, the side wall of the resonance plate and the cover plate is common One is defined to conflux chamber；Wherein, the cover plate of gas pump, piezo-activator and resonance plate are sequentially from top to bottom to stack to be fixedly arranged on On carrier, and close air guide end opening, when piezo-activator it is driven to carry out gas collection operation when, gas is the opening by cover plate Portion, which is imported, is collected to the chamber that confluxes, and the hollow bore for flowing through resonance plate works as piezo-activator into temporary in first chamber It is driven to be exhausted during operation, gas be by first chamber flow through resonance plate hollow bore and this conflux chamber and discharge To air guide end opening, air-flow is imported into air flow passage via air guide end opening and heat exchange is carried out to electronic component, and The air-flow after heat exchange will be carried out with electronic component via exhaust end opening discharge.

【Brief description of the drawings】

Fig. 1 is the structural representation of known cooling mechanism.

Fig. 2A is the structural representation of the air cooling heat abstractor of the preferred embodiment of this case first.

Fig. 2 B are Fig. 2A in the structural representation in A-A ' sections.

Fig. 3 is the cross section structure schematic diagram of the air cooling heat abstractor of the preferred embodiment of this case second.

Fig. 4 A are the back side decomposition texture schematic diagram of the gas pump of the preferred embodiment of this case first.

Fig. 4 B are the positive decomposition texture schematic diagram of the gas pump of the preferred embodiment of this case first.

Fig. 5 is the cross-sectional view of the piezo-activator of the preferred embodiment of this case first.

Fig. 6 A~6D is the start process schematic of the gas pump for the preferred embodiment of this case first.

Fig. 7 is the configuration diagram of the air cooling heat abstractor of the preferred embodiment of this case the 3rd.

【Embodiment】

Embodying some exemplary embodiments of this pattern characteristics and advantage will in detail describe in the explanation of back segment.It should be understood that This case can have various changes in different aspects, and it does not all depart from the scope of this case, and explanation therein and schema Inherently it is illustrated as being used, not for limitation this case.

Fig. 2A, 2B are referred to, Fig. 2A is the structural representation of the air cooling heat abstractor of the preferred embodiment of this case first.Fig. 2 B It is Fig. 2A in the structural representation in A-A ' sections.As illustrated, the air cooling heat abstractor 2 of this case can be applied to an electronic equipment, Such as, but not limited to portable computer, tablet personal computer, industrial computer, portable communication device, audio and video player, to be set to electronics Standby interior electronic component 3 to be radiated is radiated.The air cooling heat abstractor 2 of this case includes carrier 20 and gas pump 22, wherein Carrier 20 includes air guide end opening 23, exhaust end opening 24 and air ventilation passage 25.Carrier 20 is that cover is placed on electronic component 3, and the electronic component 3 is located in air flow passage 25.Gas pump 22 is fixedly arranged on carrier 20, and assembling is positioned at and led Gas end opening 23, and close the air guide end opening 23.Wherein by driving gas pump 22, by air-flow via air guide end opening 23 import air flow passage 25 and carry out heat exchange to electronic component 3, and the gas after heat exchange will be carried out with the electronic component 3 Flow through and discharged by exhaust end opening 24, in order to the radiating realized to electronic component 3.

In some embodiments, carrier 20 is to be connected with group by the plurality of thermal insulation board 26 and formed, and multiple thermal insulation boards 26 are fixed Justice forms the air ventilation passage 25, the air guide end opening 23 and the exhaust end opening 24.Gas pump 22 is to be fixedly arranged on carrier 20 Thermal insulation board 26 on.The cover of carrier 20 covers the electronic component 3, and air guide end opening 23 is correspondingly arranged with electronic component 3.In some In embodiment, it, with first surface 3a and second surface 3b, and is to be arranged at hot biography with second surface 3b that wherein electronic component 3, which is, On guide plate 4, and the heat conduction path of permeable thermal transfer plate 4 is radiated, and in some embodiments, bearing substrate 4 and electricity Heat-conducting glue 5 can be more scribbled between the second surface 3b of subcomponent 3, that is, electronic component 3 is through its second surface 3b and heat-conducting glue 5 Stack and be arranged on bearing substrate 4, but be not limited thereto.The thermal insulation board 26 of carrier 20 is connected to thermal transfer plate 4.Heat transfer Plate 4 is made up of high heat-conduction coefficient material, and the high heat-conduction coefficient material can be such as, but not limited to electrographite.

In the present embodiment, gas pump 22 be for a piezoelectric actuated gas pump, it is dynamic to drive gas flow, by gas by The outside of air cooling heat abstractor 2 is imported in air ventilation passage 25 via air guide end opening 23.When gas pump 22 is introduced gas into During air ventilation passage 25, import gas and carry out heat exchange with the electronic component 3 in carrier 20, and promote air ventilation passage Gas in 25 quickly flows, and promotes the air-flow after heat exchange that heat energy is drained into air cooling heat abstractor 2 via exhaust end opening 24 It is outside.Because gas pump 22 is continuously start to import gas, the gas that electronic component 3 can be with being continuously introduced into is set to carry out heat Exchange, while making the air-flow after heat exchange be discharged via exhaust end opening 24, the radiating to electronic component 3 can be realized whereby, and Heat dissipation can be improved, and then increases performance stability and the life-span of electronic component 3.

Fig. 3 is the cross section structure schematic diagram of the air cooling heat abstractor of this case second embodiment.As shown in figure 3, the present embodiment Air cooling heat abstractor 2a it is similar to the air cooling heat abstractor 2 shown in Fig. 2 B, and identical element numbers represent identical structure, Element and function, are repeated no more in this.Compared to the air cooling heat abstractor 2 shown in Fig. 2 B, the air cooling heat abstractor of the present embodiment 2a further includes a radiator 27, is connected in the first surface 3a of electronic component 3 and in air ventilation passage 25.Radiating Device 27 includes a base 271 and multiple fin 272, and base 271 is attached at the surface of electronic component 3, and multiple fin 272 are It is vertically connected at base 271.By the setting of radiator 27, area of dissipation can be increased, the heat energy produced by making electronic component 3 can Heat exchange is carried out with the gas in air ventilation passage 25 via radiator 27, in order to heat radiation efficiency.

The back side decomposition texture schematic diagram for the gas pump that Fig. 4 A and 4B, Fig. 4 A are the preferred embodiment of this case first is referred to, Fig. 4 B are the positive decomposition texture schematic diagram of the gas pump of the preferred embodiment of this case first.As illustrated, the gas pump 22 of this case Include the elements such as resonance plate 221, piezo-activator 222, cover plate 226.Resonance plate 221 has a hollow bore 221a, is correspondence Set in the air guide end opening 23 of carrier 20.Piezo-activator 222 has suspension board 2221, housing 2222, piezoelectric element 2223 and the grade element of at least one support 2224, drive gas pump 22 to receive to apply voltage.Cover plate 226 has side wall 2261st, bottom plate 2262 and opening portion 2263, side wall 2261 is to surround the periphery of bottom plate 2262 and be convexly equipped on bottom plate 2262, and with bottom Plate 2262 is collectively forming accommodation space 226a, is disposed therein with for resonance plate 221 and piezo-activator 222, opening portion 2263 are disposed on side wall 2261, pass outwards through opening portion 2263 with the conductive connecting pin 2222a for housing 2222 and protrude Outside cover plate 226, in order to be connected with external power source, but it is not limited.In the present embodiment, during suspension board 2221 has Center portion 2221c and peripheral part 2221d, when piezoelectric element 2223 is driven by voltage, suspension board 2221 can by central part 2221c to Peripheral part 2221d flexural vibrations, housing 2222 is to surround the outside for being arranged at suspension board 2221, and with a conductive connecting pin 2222a, conductive connecting pin 2222a are that convex is located on housing 2222, to the use for connection of powering, but are not limited.Piezoelectricity Element 2223 has a length of side, and the length of side is less than or equal to the length of side of suspension board 2221, but is not limited, and piezoelectric element 2223 be the second surface 2221b for being attached at suspension board 2221, deformation is produced to receive applied voltage, to drive suspension board 2221 flexural vibrations.At least a support 2224 is disposed between suspension board 2221 and housing 2222, and the 2224 of each support Two ends be connection suspension board 2221 and housing 2222, to provide resilient support.

In the present embodiment, the gas pump 22 of this case further includes two insulating trips 223,225 and a conducting strip 224, but simultaneously It is not limited, wherein, two insulating trips 223,225 are to be respectively arranged at conducting strip about 224, and its profile is to correspond roughly to pressure The housing 2222 of electric actuator 222, and be made up of the material that can be insulated, for example：Plastic cement, with the use insulated, but all It is not limited, conducting strip 224 is then as made by conductive material, for example：Metal, conduct being used, and its profile Also it is the housing 2222 for corresponding roughly to piezo-activator 222, but is all not limited.In the present embodiment, conducting strip 224 On a conductive connecting pin 224a also can be set, conduct and be used, conductive connecting pin 224a is also such as the conductive connecting pin of housing 2222 2222a passes outwards through the opening portion 2263 of cover plate 226 and protruded from outside cover plate 226, in order to be connected with external power source.

Referring to Fig. 5, cross-sectional views of the Fig. 5 for the piezo-activator of the preferred embodiment of this case first.As schemed Show, in the present embodiment, the suspension board 2221 of this case is the structure for cascaded surface, i.e., in the first surface 2221a of suspension board 2221 Central part 2221c on have more a convex portion 2221e, and convex portion 2221e is a circular protrusions structure, but is not limited thereto, In some embodiments, suspension board 2221 also can be two-sided smooth tabular square.The convex portion 2221e of suspension board 2221 be with The first surface 2222b coplines of housing 2222, and the first surface 2221a and the first surface of support 2224 of suspension board 2221 2224a is also copline, in addition, the convex portion 2221e and the first surface 2222b and suspension board of housing 2222 of suspension board 2221 It is that there is a certain depth between 2221 first surface 2221a and the first surface 2224a of support 2224.As for suspension board 2221 second surface 2221b, it is to be with the second surface 2222c of housing 2222 and the second surface 2224b of support 2224 Smooth coplanar structure, and piezoelectric element 2223 is then attached at the second surface 2221b of this smooth suspension board 2221.In In other embodiments, the kenel of suspension board 2221 also can be a two-sided smooth tabular square structure, be not limited thereto, It can appoint according to situation is actually applied and apply change.In some embodiments, suspension board 2221, housing 2222 and support 2224 are can The structure being formed in one, and can be made up of a metallic plate, it can be for example made up of stainless steel, but be not limited. Again in the present embodiment, this case gas pump 22 is empty with more at least one between suspension board 2221, housing 2222 and support 2224 Gap 2225, passes through to supplied gas.

The start flow of this case gas pump 22 further explained below, schemes please refer to 6A~6D, wherein 6A~ 6D figures are the start process schematics of the gas pump for the preferred embodiment of this case first.First, as shown in Figure 6A, gas pump 22 Structure is it has been observed that for sequentially by cover plate 226, another insulating trip 225, conducting strip 224, insulating trip 223, piezo-activator 222 And 221 stack assembly positioning of resonance plate are formed, and in the piezo-activator 222 after combination stacked, insulating trip 223, conducting strip 224th, the surrounding of another insulating trip 225 gives gluing formation colloid 218, and then fills up the accommodation space 226a of cover plate 226 week Edge and complete sealing.It is with gap g0, and resonance plate 221 and cover plate 226 between resonance plate 221 and piezo-activator 222 The common definition of side wall 2261 go out to conflux chamber 227a, then have first between the bottom plate 2262 of resonance plate 221 and cover plate 226 Chamber 227b.When gas pump 22 is not yet driven by voltage, the position of its each element is as shown in Figure 6A.

Then as shown in Figure 6B, when the piezo-activator 222 of gas pump 22 is vibrated upwards by voltage actuation, gas meeting Entered by the opening portion 2263 of cover plate 226 in gas pump 22, and be pooled to the chamber 227a that confluxes, then again via resonance plate 221 On hollow bore 221a flow upwardly into first chamber 227b, while suspension of the resonance plate 221 by piezo-activator 222 Plate 2221 resonance influence also can with carry out reciprocating vibration, i.e., resonance plate 221 with upward deformation, i.e., resonance plate 221 is in Upward dimpling at hollow bore 221a.

Thereafter, then as shown in Figure 6 C, now piezo-activator 13 is to vibrate back initial position downwards, and make piezo-activator The convex portion 2221e of 222 suspension board 2221 promotes the gas in lower half storey first chamber 227b to push close to resonance plate 221 Circulation is passed through in the space 2225 flowed to both sides and pass through piezo-activator 222 upwards, to flow to upper half storey first chamber 227b It is interior temporary.Thus aspect is implemented visible, when resonance plate 221 carries out vertical reciprocating vibration, being can be by resonance plate 221 and pressure Gap g0 between electric actuator 222 is to increase the ultimate range of its vertical displacement, in other words, in resonance plate 221 and piezoelectricity The gap g0 of setting between actuator 222 can make resonance plate 221 to produce upper and lower displacement by a larger margin when resonance.

Again as shown in Figure 6 D, piezo-activator 222 is vibrated still further below, and resonance plate 221 by piezo-activator 222 due to being shaken Dynamic resonant interaction, resonance plate 221 also can with downward vibration, promote the gas in upper half storey first chamber 227b to push to two Side is flowed and passes through the space 2225 of piezo-activator 222 passes through circulation downwards, to flow to the hollow bore 221a of resonance plate 221 Place and compress discharge, form one compressed air stream and sentenced to the air guide end opening 23 of bearing substrate 20 thermal transfer plate 4 is dissipated Heat.

Finally, resonance plate 221 can be repositioned to initial position, i.e., as shown in Figure 6A, and then pass through foregoing start flow, by Fig. 6 A~6D order persistent loop, gas can constantly flow into the chamber 227a that confluxes via the opening portion 2263 of cover plate 226, First chamber 227b is flowed into again, and is then flowed into by first chamber 227b in the chamber 227a that confluxes, and air-flow is continuously flowed into air guide In end opening 23, and then transmission gas can be stablized.In other words, when the gas pump 22 of this case is operated, gas is sequentially to flow through The opening portion 2263 of cover plate 226, the chamber 227a that confluxes, first chamber 227b, conflux chamber 227a and air guide end opening 23, therefore The gas pump 22 of this case can pass through single element, i.e. cover plate 226, and the structure design of the opening portion 2263 using cover plate 226, energy The number of elements for reducing gas pump 22 is enough reached, simplifies effect of overall process.

Referring to Fig. 7, configuration diagrams of the Fig. 7 for the air cooling heat abstractor of the preferred embodiment of this case the 3rd.The present embodiment Air cooling heat abstractor 2 be that, with function of temperature control, it further includes control system 21, the control system 21 include control unit 211 And temperature sensor 212, wherein control unit 211 is electrically connected with gas pump 22, to control the running of gas pump 22.Temperature is passed Sensor 212 is disposed in carrier 20, and is adjacent to electronic component 3, for the temperature near sensing electronic component 3, or It is attached directly on electronic component 3 sense the temperature of electronic component 3.Temperature sensor 212 is electrically connected to control unit 211, sense The temperature of electronic component 3 is surveyed, and sensing signal is transmitted to control unit 211.Control unit 211 is according to temperature sensor 212 Sensing signal, judge the electronic component 3 temperature whether be higher than a temperature threshold value, when control unit 211 judges the electronics When the temperature of element 3 is higher than the temperature threshold value, a control signal is sent to gas pump 22, is operated, borrowed with enable gas pump 22 This makes gas pump 22 drive air current flow to carry out cooling to electronic component 3, so that the cooling of electronic component 3 and reducing Temperature.When control unit 211 judges that the temperature of the electronic component 3 is less than the temperature threshold value, a control signal is sent to gas Body pump 22, is operated with stopping gas pump 22, and the continued operation of gas pump 22 can be avoided whereby and causes reduced lifetime, is reduced additionally The consume of energy.Therefore through the setting of control system 21, making the gas pump 22 of air cooling heat abstractor 2 in the temperature of electronic component 3 Cooling can be carried out during overheat, and is decommissioned in after the reduction of the temperature of electronic component 3, the persistently fortune of gas pump 22 can be avoided whereby Make and cause reduced lifetime, reduce the consume of extra energy, can also make electronic component 3 in running under a preferred temperature environment, Improve the stability of electronic component 3.

In summary, this case provides a kind of air cooling heat abstractor, and it can be applied to various electronic equipments with to its inside Electronic element radiating, in order to heat radiation efficiency, reduces noise, and the performance of electronic equipment internal electronic component is stablized and is extended Service life.In addition, the air cooling heat abstractor of this case, it has function of temperature control, can be according to electronic equipment internal electronic component Temperature change, controls the running of gas pump, in order to the service life of heat radiation efficiency, and extension heat abstractor.

This case appointed as those skilled in the art apply craftsman think and be it is all as modify, so neither take off such as attached claim Be intended to Protector.

【Symbol description】

11：Electronic component

12：Thermal transfer plate

13：Heat-conducting glue

2、2a：Air cooling heat abstractor

20：Carrier

21：Control system

211：Control unit

212：Temperature sensor

218：Colloid

22：Gas pump

221：Resonance plate

221a：Hollow bore

222：Piezo-activator

2221：Suspension board

2221a：The first surface of suspension board

2221b：The second surface of suspension board

2221c：Central part

2221d：Peripheral part

2221e：Convex portion

2222：Housing

2222a、224a：Conductive connecting pin

2222b：The first surface of housing

2222c：The second surface of housing

2223：Piezoelectric element

2224：Support

2224a：The first surface of support

2224b：The second surface of support

2225：Space

223、225：Insulating trip

224：Conducting strip

226：Cover plate

226a：Accommodation space

2261：Side wall

2262：Bottom plate

2263：Opening portion

227a：Conflux chamber

227b：First chamber

23：Air guide end opening

24：It is vented end opening

25：Air ventilation passage

26：Thermal insulation board

27：Radiator

271：Base

272：Fin

3：Electronic component

3a：The first surface of electronic component

3b：The second surface of electronic component

4：Thermal transfer plate

5：Heat-conducting glue

A-A’：Tangential direction

g0：Gap

Claims (7)

1. a kind of air cooling heat abstractor, to an electronic element radiating, it is characterised in that the air cooling heat abstractor is included：

One carrier, including an air flow passage, an air guide end opening and an exhaust end opening, wherein the carrier enclosure lid electronics Element and make the electronic component be located at the air flow passage in；And

One gas pump, comprising：

One resonance plate, with a hollow bore；

One piezo-activator, it is corresponding with the resonance plate to set；And

One cover plate, with side wall, a bottom plate and an opening portion, the side wall ring is convexly equipped on the bottom plate simultaneously around the base portion peripheral An accommodation space is formed with the bottom plate, and the resonance plate and the piezo-activator are arranged in the accommodation space, the opening portion is set It is placed on the side wall, wherein forms a first chamber between the bottom plate and the resonance plate of the cover plate, the resonance plate and the cover plate The side wall common definition go out one and conflux chamber；

Wherein, the cover plate of the gas pump, the piezo-activator and the resonance plate sequentially from top to bottom stack and are fixedly arranged on the carrier On, and close the air guide end opening, when the piezo-activator it is driven to carry out gas collection operation when, gas is opened by this of the cover plate Oral area imports and is collected to the chamber that confluxes, and flows through the hollow bore of the resonance plate and enter in the first chamber and keep in, when this Piezo-activator is driven to be exhausted during operation, and gas is flowed through the hollow bore of the resonance plate by the first chamber and is somebody's turn to do Conflux chamber and be expelled to the air guide end opening, air-flow is imported into the air flow passage and to the electricity via air guide end opening Subcomponent carries out heat exchange, and is discharged the air-flow after heat exchange is carried out with the electronic component via the exhaust end opening.

2. air cooling heat abstractor as claimed in claim 1, it is characterised in that the carrier connects to define including multiple thermal insulation board groups Form the air flow passage, the air guide end opening and the exhaust end opening, wherein the air guide end opening and the electronic component pair It should set.

3. air cooling heat abstractor as claimed in claim 1, it is characterised in that the piezo-activator is included：

One suspension board, with a first surface and a second surface, and flexible vibration；

One housing, around the outside for being arranged at the suspension board；

An at least support, is connected between the suspension board and the housing, to provide resilient support；And

One piezoelectric element, with a length of side, the length of side is less than or equal to a length of side of the suspension board, and the piezoelectric element is attached at On one second surface of the suspension board, to apply voltage to drive the suspension board flexural vibrations.

4. air cooling heat abstractor as claimed in claim 3, it is characterised in that the suspension board is a square suspension board, and is had There is a convex portion.

5. air cooling heat abstractor as claimed in claim 3, it is characterised in that the piezoelectric actuated gas pump include a conducting strip, One first insulating trip and one second insulating trip, the wherein resonance plate, the piezo-activator, first insulating trip, the conducting strip, Second insulating trip and the cover plate are sequentially from bottom to top stacked and set.

6. air cooling heat abstractor as claimed in claim 1, it is characterised in that the air cooling heat abstractor further includes a control system System, the control system includes：

One control unit, is electrically connected to the gas pump, to control the gas pump to operate；And

One temperature sensor, is electrically connected to the control unit and is adjacent to the electronic component, to sense a temperature of the electronic component Spend to export a sensing signal to the control unit；

Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door During threshold value, the control unit activates the gas pump, to drive air current flow, and when the control unit is in receiving the sensing Signal, and when judging the temperature of the electronic component less than the temperature threshold value, the control unit makes the gas pump decommission.

7. air cooling heat abstractor as claimed in claim 5, it is characterised in that the housing of the piezo-activator has a conduction Pin, the conducting strip has a conductive connecting pin, and the opening portion of the cover plate of the gas pump is arranged on the side wall, with for The conductive connecting pin of the housing and the conductive connecting pin of the conducting strip pass outwards through the opening portion and protruded from outside the cover plate, with It is easy to be connected with external power source.