CN108112214B - Air cooling heat dissipation device - Google Patents

Abstract

The present application provides an air-cooled heat dissipation device for dissipating heat from an electronic component. The air-cooled heat dissipation device comprises a bearing substrate, an air pump and a heat sink. The bearing substrate comprises an upper surface, a lower surface, an air guide end opening and a heat conduction plate, the heat conduction plate is arranged on the upper surface and corresponds to the air guide end opening, and the electronic element is arranged on the heat conduction plate. The gas pump is fixedly arranged on the lower surface of the bearing substrate and corresponds to the opening of the closed gas guide end. The heat sink is disposed on the electronic component. By driving the air pump, the air flow is guided into the air guide end opening and carries out heat exchange on the heat conduction plate.

Description

Air cooling heat dissipation device

[ technical field ] A method for producing a semiconductor device

The present invention relates to an air-cooled heat dissipation device, and more particularly, to an air-cooled heat dissipation device using a gas pump to provide driving airflow for heat dissipation.

[ background of the invention ]

With the progress of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, video players, etc. have been developed towards being light, thin, portable and high-performance, and these electronic devices must be configured with various high-integration or high-power electronic components in their limited internal spaces, so that the electronic devices generate more heat energy during operation and cause high temperature in order to make the operation speed of the electronic devices faster and function more powerful. In addition, most of these electronic devices are designed to be thin, flat and compact, and have no additional internal space for heat dissipation and cooling, so that the electronic components in the electronic devices are susceptible to heat energy and high temperature, which may cause interference or damage.

Generally, the heat dissipation method inside the electronic device can be divided into active heat dissipation and passive heat dissipation. The active heat dissipation is usually implemented by disposing an axial fan or a blower fan inside the electronic device, and driving airflow by the axial fan or the blower fan to transfer heat energy generated by electronic components inside the electronic device. However, the axial flow fan and the blower fan generate relatively large noise during operation, and have relatively large volumes, which are not easy to be thinned and miniaturized, and the axial flow fan and the blower fan have relatively short service lives, so the conventional axial flow fan and the blower fan are not suitable for being used in light-weight, thin and portable electronic equipment to dissipate heat.

Furthermore, many electronic components are soldered on a Printed Circuit Board (PCB) by using Surface Mount Technology (SMT), Selective Soldering (Selective Soldering), etc., however, the electronic components soldered by the above Soldering method are easily separated from the PCB after being exposed to high heat energy and high temperature for a long time, and most of the electronic components are not resistant to high temperature, and if the electronic components are exposed to high heat energy and high temperature for a long time, the performance stability and the lifetime of the electronic components are easily reduced.

Fig. 1 is a schematic structural diagram of a conventional heat dissipation mechanism. As shown in fig. 1, the conventional heat dissipation mechanism is a passive heat dissipation mechanism, and includes a heat conduction plate 12, the heat conduction plate 12 is attached to an electronic component 11 to be dissipated by a heat conduction glue 13, and the electronic component 11 can dissipate heat by heat conduction and natural convection through a heat conduction path formed by the heat conduction glue 13 and the heat conduction plate 12. However, the heat dissipation efficiency of the heat dissipation mechanism is poor, and the application requirements cannot be met.

In view of the above, there is a need to develop an air-cooling heat dissipation device to solve the problems of the prior art.

[ summary of the invention ]

An object of the present invention is to provide an air-cooled heat dissipation device, which can be applied to various electronic devices to dissipate heat from electronic components inside the electronic devices, so as to improve heat dissipation efficiency, reduce noise, stabilize the performance of the electronic components inside the electronic devices, and prolong the service life.

Another objective of the present invention is to provide an air-cooled heat dissipation device, which has a temperature control function, and can control the operation of an air pump according to the temperature change of electronic components inside an electronic device, so as to enhance the heat dissipation performance and prolong the service life of the air-cooled heat dissipation device.

To achieve the above object, a broader aspect of the present invention is to provide an air-cooling heat dissipation device for dissipating heat from an electronic component, the air-cooling heat dissipation device comprising: the bearing substrate comprises an upper surface, a lower surface, an air guide end opening and a heat conduction plate, wherein the heat conduction plate is arranged on the upper surface and corresponds to the air guide end opening, and the electronic element is arranged on the heat conduction plate; the gas pump is fixedly arranged on the lower surface of the bearing substrate and corresponds to the opening of the closed gas guide end; and a heat sink disposed on the electronic component; wherein, by driving the air pump, the air flow is guided into the air guide end opening and carries out heat exchange on the heat conduction plate.

[ description of the drawings ]

Fig. 1 is a schematic structural diagram of a conventional heat dissipation mechanism.

Fig. 2A is a schematic structural diagram of an air-cooled heat dissipation device according to a first embodiment of the disclosure.

Fig. 2B is a schematic structural view of the air-cooled heat dissipation apparatus shown in fig. 2A at a cross section a-a.

Fig. 3A and 3B are schematic exploded views of a gas pump according to a preferred embodiment of the present invention from different viewing angles.

Fig. 4 is a schematic cross-sectional view of the piezoelectric actuator shown in fig. 3A and 3B.

Fig. 5 is a schematic cross-sectional view of the gas pump shown in fig. 3A and 3B.

Fig. 6A to 6E are flow chart diagrams illustrating the operation of the gas pump shown in fig. 3A and 3B.

Fig. 7 is a schematic configuration diagram of an air-cooled heat dissipation apparatus according to a second embodiment of the disclosure.

[ embodiment ] A method for producing a semiconductor device

Exemplary embodiments that embody features and advantages of this disclosure are described in detail below in the detailed description. It will be understood that the present disclosure is capable of various modifications without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

Fig. 2A is a schematic structural view of an air-cooled heat dissipation device according to a first embodiment of the disclosure, and fig. 2B is a schematic structural view of the air-cooled heat dissipation device shown in fig. 2A on a cross section a-a. As shown in fig. 2A and 2B, the air-cooled heat dissipation device 2 of the present disclosure can be applied to an electronic device, such as but not limited to a portable computer, a tablet computer, an industrial computer, a portable communication device, and an audio/video player, to dissipate heat of an electronic component 3 to be dissipated in the electronic device. The air-cooled heat dissipation device 2 comprises a carrier substrate 20, an air pump 22 and a heat sink 26, wherein the carrier substrate 20 comprises an upper surface 20a, a lower surface 20b, an air guide end opening 23 and a heat conduction plate 25. The carrier substrate 20 may be, but is not limited to, a printed circuit board for carrying and disposing the electronic components 3 and the gas pump 22. The air guide end opening 23 of the carrier substrate 20 penetrates the upper surface 20a and the lower surface 20 b. The gas pump 22 is fixed on the lower surface 20b of the supporting substrate 20, and is assembled and positioned at the gas guiding end opening 23, and closes the gas guiding end opening 23. The heat conduction plate 25 is disposed on the upper surface 20a of the carrier substrate 20 and is assembled and positioned on the air guide end opening 23, and a gap G is formed between the heat conduction plate 25 and the carrier substrate 20 for air to flow through. The electronic component 3 is disposed on the heat conduction plate 25, and one surface of the electronic component 3 is attached to the heat conduction plate 25, and the heat can be dissipated through the heat conduction path of the heat conduction plate 25. The heat sink 26 is disposed on the electronic component 3 and attached to the other surface of the electronic component 3. The heat dissipation of the electronic component 3 is realized by driving the air pump 22 to guide the air flow into the air guide end opening 23 and perform heat exchange on the heat conduction plate 25.

In the present embodiment, the heat sink 26 includes a base 261 and a plurality of heat dissipation sheets 262, the base 261 is attached to the other surface of the electronic component 3, and the plurality of heat dissipation sheets 262 are vertically connected to the base 261. By the arrangement of the heat sink 26, the heat dissipation area can be increased, so that the heat generated by the electronic component 3 can be conducted away through the heat conduction path of the heat sink 26.

The gas pump 22 is a piezo-actuated gas pump for driving a gas flow to introduce gas from outside the air-cooled heat sink 2 into the gas guide opening 23. In some embodiments, the carrier substrate 20 further includes at least one reflow groove 24, and the reflow groove 24 penetrates the upper surface 20a and the lower surface 20b and is disposed adjacent to the periphery of the heat conduction plate 25. When the gas pump 22 introduces gas into the gas guide end opening 23, the introduced gas flow exchanges heat with the heat conductive plate 25 disposed on the upper surface 20a of the carrier substrate 20, and pushes the gas in the gap G between the carrier substrate 20 and the heat conductive plate 25 to rapidly flow, so that the heat exchanged gas flow discharges heat energy through the gap G, wherein a part of the gas flow flows back to the lower surface 20b of the carrier substrate 20 through the back flow through groove 24, and is subsequently used by the gas pump 22 to cool. In addition, part of the air flow flows along the periphery of the heat conduction plate 25 toward the heat sink 26, and flows through the heat dissipation fins 261 of the heat sink 26 after cooling, so as to accelerate the heat dissipation of the electronic component 3. Since the gas pump 22 is continuously operated to introduce the gas, the electronic component 3 can exchange heat with the continuously introduced gas and simultaneously discharge the heat exchanged gas, thereby achieving heat dissipation of the electronic component 3, improving heat dissipation efficiency, and further increasing performance stability and life of the electronic component 3.

Fig. 3A and 3B are exploded structural diagrams of a gas pump according to a preferred embodiment of the present invention at different viewing angles, fig. 4 is a sectional structural diagram of the piezoelectric actuator shown in fig. 3A and 3B, and fig. 5 is a sectional structural diagram of the gas pump shown in fig. 3A and 3B, respectively. As shown in fig. 3A, 3B, 4 and 5, the gas pump 22 is a piezoelectric-actuated gas pump, and includes a gas inlet plate 221, a resonator plate 222, a piezoelectric actuator 223, insulating sheets 2241 and 2242, a conducting sheet 225, and the like, wherein the piezoelectric actuator 223 is disposed corresponding to the resonator plate 222, and the gas inlet plate 221, the resonator plate 222, the piezoelectric actuator 223, the insulating sheet 2241, the conducting sheet 225, the other insulating sheet 2242, and the like are sequentially stacked, and the assembled cross-sectional view is as shown in fig. 5.

In the present embodiment, the air inlet plate 221 has at least one air inlet hole 221a, wherein the number of the air inlet holes 221a is preferably 4, but not limited thereto. The air inlet hole 221a penetrates through the air inlet plate 221, so that air can flow from the air inlet hole 221a into the air pump 22 by the action of atmospheric pressure outside the device. The air inlet plate 221 has at least one bus hole 221b for corresponding to the at least one air inlet hole 221a on the other surface of the air inlet plate 221. The center of the bus bar hole 221b is provided with a center concave part 221c, and the center concave part 221c is communicated with the bus bar hole 221b, so that the gas entering the bus bar hole 221b from the at least one gas inlet hole 221a can be guided and converged to the center concave part 221c, and the gas transmission is realized. In the present embodiment, the air inlet plate 221 has an air inlet hole 221a, a bus bar hole 221b and a central recess 221c, which are integrally formed, and a bus chamber for bus gas is correspondingly formed at the central recess 221c for temporary storage of the gas. In some embodiments, the air inlet plate 221 may be made of, for example, but not limited to, stainless steel. In other embodiments, the depth of the bus chamber formed by the central recess 221c is the same as the depth of the bus bar hole 221b, but not limited thereto. The resonator plate 222 is made of a flexible material, but not limited thereto, and the resonator plate 222 has a hollow hole 2220 corresponding to the central recess 221c of the inlet plate 221 for gas to flow through. In other embodiments, the resonator plate 222 may be made of a copper material, but not limited thereto.

The piezoelectric actuator 223 is formed by assembling a suspension plate 2231, an outer frame 2232, at least one support 2233 and a piezoelectric sheet 2234, wherein the piezoelectric sheet 2234 is attached to a first surface 2231c of the suspension plate 2231 for applying a voltage to generate a deformation to drive the suspension plate 2231 to vibrate in a bending manner, and the at least one support 2233 is connected between the suspension plate 2231 and the outer frame 2232, in this embodiment, the support 2233 is connected between the suspension plate 2231 and the outer frame 2232, two ends of the support 2233 are respectively connected to the outer frame 2232 and the suspension plate 2231 for providing an elastic support, and at least one gap 2235 is further provided between the support 2233, the suspension plate 2231 and the outer frame 2232 for providing a gas flow. It should be emphasized that the shapes and numbers of the suspension plate 2231, the outer frame 2232 and the support 2233 are not limited to the above embodiments and can be varied according to the actual application. The outer frame 2232 is disposed around the outer side of the suspension plate 2231, and has a conductive pin 2232c protruding outward for power connection, but not limited thereto.

The suspension plate 2231 has a stepped structure (as shown in fig. 4), that is, the second surface 2231b of the suspension plate 2231 further has a convex portion 2231a, and the convex portion 2231a can be, but is not limited to, a circular convex structure. The convex portions 2231a of the suspension plate 2231 are coplanar with the second surface 2232a of the outer frame 2232, the second surface 2231b of the suspension plate 2231 and the second surface 2233a of the support 2233 are also coplanar, and a specific depth is provided between the convex portions 2231a of the suspension plate 2231 and the second surface 2232a of the outer frame 2232 and the second surface 2231b of the suspension plate 2231 and the second surface 2232a of the support 2233. The first surface 2231c of the suspension 2231, the first surface 2232b of the frame 2232 and the first surface 2233b of the support 2233 are flat and coplanar, and the piezoelectric sheet 2234 is attached to the flat first surface 2231c of the suspension 2231. In other embodiments, the suspension plate 2231 may also be a square structure with a flat surface and a plate shape, which can be varied according to the actual implementation. In some embodiments, the suspension plate 2231, the support 2233, and the frame 2232 can be integrally formed, and can be made of a metal plate, such as but not limited to stainless steel. In still other embodiments, the side length of the piezoelectric sheet 2234 is less than the side length of the suspension plate 2231. In other embodiments, the length of the piezoelectric sheet 2234 is equal to the length of the suspension plate 2231, and is also designed to be a square plate-shaped structure corresponding to the suspension plate 2231, but not limited thereto.

The insulating sheet 2241, the conducting sheet 225 and the insulating sheet 2242 of the gas pump 22 are sequentially disposed under the piezoelectric actuator 223, and the shape thereof substantially corresponds to the shape of the outer frame 2232 of the piezoelectric actuator 223. In some embodiments, the insulating sheets 2241, 2242 are made of insulating material, such as but not limited to plastic, to provide insulating function. In other embodiments, the conductive sheet 225 may be made of a conductive material, such as but not limited to a metal material, to provide an electrical conduction function. In this embodiment, a conductive pin 225a may also be disposed on the conductive sheet 225 to achieve the electrical connection function.

In the present embodiment, the gas pump 22 is formed by stacking the gas inlet plate 221, the resonator plate 222, the piezoelectric actuator 223, the insulating plate 2241, the conducting plate 225 and the insulating plate 2242 in sequence, and a gap h is formed between the resonator plate 222 and the piezoelectric actuator 223, in the present embodiment, a filling material, such as but not limited to a conductive adhesive, is filled in the gap h between the resonator plate 222 and the periphery of the outer frame 2232 of the piezoelectric actuator 223, so that the depth of the gap h can be maintained between the resonator plate 222 and the convex portion 2231a of the suspension plate 2231 of the piezoelectric actuator 223, and further the gas flow can be guided to flow more rapidly, and the contact interference between the convex portion 2231a of the suspension plate 2231 and the resonator plate 222 can be reduced because the convex portion 2231a of the suspension plate 2231 and the resonator plate 222 keep a proper distance, so. In other embodiments, the height of the outer frame 2232 of the high voltage electric actuator 223 can be increased to increase a gap when the outer frame is assembled with the resonator plate 222, but not limited thereto.

In the present embodiment, after the air inlet plate 221, the resonator plate 222 and the piezoelectric actuator 223 are assembled in sequence, the resonator plate 222 has a movable portion 222a and a fixed portion 222b, the movable portion 222a and the air inlet plate 221 thereon together form a chamber for collecting gas, a first chamber 220 is further formed between the resonator plate 222 and the piezoelectric actuator 223 for temporarily storing gas, the first chamber 220 is communicated with the chamber at the central recess 221c of the air inlet plate 221 through the hollow hole 2220 of the resonator plate 222, and two sides of the first chamber 220 are communicated with the air guide end opening 23 disposed therebelow through the gap 2235 between the supports 2233 of the piezoelectric actuator 223.

Fig. 6A to 6E are flow chart diagrams illustrating the operation of the gas pump shown in fig. 3A and 3B. Referring to fig. 5 and fig. 6A to 6E, the operation flow of the gas pump of the present invention is briefly described as follows. When the gas pump 22 is operated, the piezoelectric actuator 223 is actuated by a voltage to perform reciprocating vibration in the vertical direction with the support 2233 as a fulcrum. As shown in fig. 6A, when the piezoelectric actuator 223 is actuated by a voltage to vibrate downward, because the resonance sheet 222 is a light and thin sheet-like structure, when the piezoelectric actuator 223 vibrates, the resonance sheet 222 also vibrates vertically in a reciprocating manner along with the resonance, that is, the part of the resonance sheet 222 corresponding to the central recess 221c also deforms along with the bending vibration, that is, the part corresponding to the central recess 221c is the movable part 222a of the resonance sheet 222, so that when the piezoelectric actuator 223 vibrates in a downward bending manner, the movable part 222a of the resonance sheet 222 corresponding to the central recess 221c is driven by the entrainment and pushing of the gas and the vibration of the piezoelectric actuator 223, and along with the bending vibration deformation of the piezoelectric actuator 223 in a downward bending manner, the gas enters from at least one gas inlet hole 221a on the gas inlet plate 221, and passes through at least one bus hole 221b to be collected at the central recess 221c, and then flows down into the first chamber 220 through the hollow hole 2220 of the resonance plate 222, which is provided corresponding to the central recess 221 c. Thereafter, the resonator plate 222 is driven by the vibration of the piezoelectric actuator 223 to perform vertical reciprocating vibration along with the resonance, as shown in fig. 6B, at this time, the movable portion 222a of the resonator plate 222 also vibrates downward along with the vibration and is attached to and abutted against the convex portion 2231a of the suspension plate 2231 of the piezoelectric actuator 223, so that the distance between the confluence chamber between the region other than the convex portion 2231a of the suspension plate 2231 and the fixed portions 222B at both sides of the resonator plate 222 is not decreased, and the deformation of the resonator plate 222 compresses the volume of the first chamber 220 and closes the middle flow space of the first chamber 220, so that the gas in the first chamber is pushed to flow to both sides, and further flows downward through the gap 2235 between the supports 2233 of the piezoelectric actuator 223. Then, as shown in fig. 6C, the movable portion 222a of the resonator plate 222 is bent and vibrated to return to the initial position, and the piezoelectric actuator 223 is driven by the voltage to vibrate upwards, so as to press the volume of the first chamber 220, but at this time, the piezoelectric actuator 223 is lifted upwards, so that the gas in the first chamber 220 flows towards two sides, and the gas continuously enters from the at least one air inlet hole 221a of the air inlet plate 221 and then flows into the chamber formed by the central recess 221C. Then, as shown in fig. 6D, the resonance plate 222 resonates upward due to the upward vibration of the piezoelectric actuator 223, and the movable portion 222a of the resonance plate 222 vibrates upward, so as to slow down the gas from continuously entering from the at least one gas inlet hole 221a of the gas inlet plate 221, and then flowing into the chamber formed by the central recess 221 c. Finally, as shown in fig. 6E, the movable portion 222a of the resonator plate 222 also returns to the initial position. In this embodiment, when the resonator plate 222 performs vertical reciprocating vibration, the maximum distance of the vertical displacement can be increased by the gap h between the resonator plate and the piezoelectric actuator 223, in other words, the gap h between the two structures can enable the resonator plate 222 to generate a larger vertical displacement at the time of resonance. Therefore, a pressure gradient is generated in the flow channel design of the gas pump 22, so that the gas flows at a high speed, and the gas is transmitted from the suction end to the discharge end through the impedance difference in the inlet and outlet directions of the flow channel, so as to complete the gas transmission operation, even if the discharge end has the gas pressure, the gas can still be continuously pushed into the gas flow channel 25, and the silencing effect can be achieved, so that the gas pump 22 can generate the gas transmission from the outside to the inside by repeating the operation of the gas pump 22 in fig. 6A to 6E.

As mentioned above, by the operation of the gas pump 22, the gas is introduced into the gas guide end opening 23, so that the introduced gas exchanges heat with the heat conduction plate 25, and the gas flow in the gap G between the carrier substrate 20 and the heat conduction plate 25 is pushed to flow rapidly, so as to make the heat exchanged gas discharge heat energy to the outside of the air-cooled heat dissipation device 2, thereby improving the efficiency of heat dissipation and cooling, and further increasing the performance stability and the service life of the electronic component 3.

Fig. 7 is a schematic configuration diagram of an air-cooled heat dissipation apparatus according to a third preferred embodiment of the present disclosure. As shown in fig. 7, the air-cooled heat dissipation device 2a of the present embodiment is similar to the air-cooled heat dissipation device 2 shown in fig. 2B, and the same reference numerals denote the same structures, elements, and functions, which are not described herein again. Compared to the air-cooled heat dissipation device 2 shown in fig. 2B, the air-cooled heat dissipation device 2a of the present embodiment has a temperature control function, and further includes a control system 21, where the control system 21 includes a control unit 211 and a temperature sensor 212, where the control unit 211 is electrically connected to the gas pump 22 to control the operation of the gas pump 22. The temperature sensor 212 is disposed in the air guide end opening 23 and adjacent to the electronic element 3 for sensing the temperature near the electronic element 3, or is directly attached to the electronic element 3 for sensing the temperature of the electronic element 3. The temperature sensor 212 is electrically connected to the control unit 211, senses the temperature of the electronic component 3, and transmits a sensing signal to the control unit 211. The control unit 211 determines whether the temperature of the electronic component 3 is higher than a temperature threshold according to the sensing signal of the temperature sensor 212, and when the control unit 211 determines that the temperature of the electronic component 3 is higher than the temperature threshold, a control signal is sent to the air pump 22 to enable the air pump 22 to operate, so that the air pump 22 drives the airflow to cool the electronic component 3, thereby cooling the electronic component 3 and reducing the temperature. When the control unit 211 determines that the temperature of the electronic component 3 is lower than the temperature threshold, a control signal is sent to the gas pump 22 to stop the operation of the gas pump 22, so as to prevent the gas pump 22 from being operated continuously to shorten the service life and reduce the extra energy consumption. Therefore, through the arrangement of the control system 21, the gas pump 22 of the gas-cooled heat dissipation device 2a can perform heat dissipation and cooling when the temperature of the electronic element 3 is too high, and stop operating after the temperature of the electronic element 3 is reduced, thereby avoiding the reduction of the service life caused by the continuous operation of the gas pump 22, reducing the extra energy consumption, and also enabling the electronic element 3 to operate in a better temperature environment, and improving the stability of the electronic element 3.

In summary, the present disclosure provides an air-cooling heat dissipation device, which can be applied to various electronic devices to dissipate heat from electronic components therein, so as to improve heat dissipation efficiency, reduce noise, stabilize performance of the electronic components in the electronic devices, and prolong service life. In addition, the air cooling heat dissipation device has a temperature control function, and can control the operation of the air pump according to the temperature change of the electronic element in the electronic equipment, so as to improve the heat dissipation efficiency and prolong the service life of the air cooling heat dissipation device.

Various modifications may be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims.

[ notation ] to show

11: electronic component

12: heat conduction plate

13: heat-conducting glue

2. 2 a: air cooling heat dissipation device

20: bearing substrate

20 a: upper surface of

20 b: lower surface

21: control system

211: control unit

212: temperature sensor

22: gas pump

220: the first chamber

221: air inlet plate

221 a: air intake

221 b: bus bar hole

221 c: central concave part

222: resonance sheet

222 a: movable part

222 b: fixing part

2220: hollow hole

223: piezoelectric actuator

2231: suspension plate

2231 a: convex part

2231 b: second surface

2231 c: first surface

2232: outer frame

2232 a: second surface

2232 b: first surface

2232 c: conductive pin

2233: support frame

2233 a: second surface

2233 b: first surface 2234: piezoelectric patch

2235: voids

2241. 2242: insulating sheet

225: conductive sheet

225 a: conductive pin

23: opening of air guide end

24: exhaust end opening

25: heat conduction plate

26: heat radiator

261: base seat

262: heat sink

h: gap

G: gap

3: electronic component

Claims (10)

1. An air-cooling heat dissipation device for dissipating heat from an electronic component, the air-cooling heat dissipation device comprising:

a carrier substrate including an upper surface, a lower surface, an air guide end opening, a heat conduction plate and a reflow through slot, wherein the heat conduction plate is arranged on the upper surface and corresponds to the air guide end opening, and the electronic element is arranged on the heat conduction plate; a gap is arranged between the heat conduction plate and the bearing substrate for the circulation of air flow, and the reflux through groove penetrates through the upper surface and the lower surface and is adjacently arranged on the periphery of the heat conduction plate;

the gas pump is fixedly arranged on the lower surface of the bearing substrate and correspondingly closes the opening of the gas guide end; and

a heat sink disposed on the electronic component;

wherein, by driving the air pump, the air flow is guided into the air guide end opening and carries out heat exchange on the heat conduction plate.

2. The air-cooled heat sink of claim 1, wherein the air-guiding opening of the carrier substrate extends through the upper surface and the lower surface.

3. The air-cooled heat dissipating device of claim 1, wherein the heat conducting plate is attached to one surface of the electronic component, and the heat sink is attached to the other surface of the electronic component.

4. The air-cooled heat sink of claim 1, wherein the gas pump is a piezo-actuated gas pump.

5. The air-cooled heat sink of claim 4, wherein the piezo-actuated gas pump comprises:

an air inlet plate, which is provided with at least one air inlet hole, at least one bus bar hole and a central concave part forming a confluence chamber, wherein the at least one air inlet hole is used for leading in air flow, the bus bar hole is corresponding to the air inlet hole, and the air flow of the air inlet hole is guided to converge to the confluence chamber formed by the central concave part;

a resonance sheet having a hollow hole corresponding to the confluence chamber, and a movable part around the hollow hole; and

a piezoelectric actuator, which is arranged corresponding to the resonance sheet;

wherein, a gap is arranged between the resonance sheet and the piezoelectric actuator to form a cavity, so that when the piezoelectric actuator is driven, airflow is guided in from the at least one air inlet hole of the air inlet plate, is collected to the central concave part through the at least one bus bar hole, and then flows through the hollow hole of the resonance sheet to enter the cavity, and resonance transmission airflow is generated by the piezoelectric actuator and the movable part of the resonance sheet.

6. The air-cooled heat sink of claim 5, wherein the piezoelectric actuator comprises:

a suspension plate having a first surface and a second surface and capable of bending and vibrating;

an outer frame surrounding the suspension plate;

at least one bracket connected between the suspension plate and the outer frame to provide elastic support; and

the piezoelectric sheet is attached to a first surface of the suspension plate and used for applying voltage to drive the suspension plate to vibrate in a bending mode.

7. The air-cooled heat sink of claim 6, wherein the suspension plate is a square suspension plate and has a convex portion.

8. The air-cooled heat sink of claim 5, wherein the piezoelectric actuated gas pump comprises a conductive plate, a first insulating plate and a second insulating plate, wherein the air inlet plate, the resonator plate, the piezoelectric actuator, the first insulating plate, the conductive plate and the second insulating plate are stacked in sequence.

9. The air-cooled heat sink of claim 1, further comprising a control system, the control system comprising:

a control unit electrically connected to the gas pump for controlling the operation of the gas pump; and

the temperature sensor is electrically connected with the control unit and is arranged adjacent to the electronic element so as to sense the temperature of the electronic element and output a sensing signal to the control unit;

when the control unit receives the sensing signal and judges that the temperature of the electronic element is greater than a temperature threshold value, the control unit enables the gas pump to drive airflow to flow, and when the control unit receives the sensing signal and judges that the temperature of the electronic element is lower than the temperature threshold value, the control unit stops the gas pump from operating.

10. The air-cooled heat dissipating device of claim 1, wherein the heat sink comprises a base and a plurality of fins, wherein the base is attached to the electronic component and the plurality of fins are connected to the base.

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