CN108112214A - Be gas-cooled radiator - Google Patents

Abstract

This case provides a kind of air cooling radiator, for electronic element radiating.The radiator that is gas-cooled includes bearing substrate, gas pump and radiator.Wherein bearing substrate includes upper and lower surface, air guide end opening and thermal transfer plate, and thermal transfer plate is arranged at upper surface and is disposed on corresponding to air guide end opening and electronic component in thermal transfer plate.Gas pump is fixedly arranged on the lower surface of bearing substrate, and corresponding closing air guide end opening.Radiator is arranged on the electronic component.By driving gas pump, air-flow is imported into air guide end opening and heat exchange is carried out to thermal transfer plate.

Description

Be gas-cooled radiator

【Technical field】

This case be on a kind of air cooling radiator, it is espespecially a kind of using gas pump to provide certain driving air-flow to radiate Be gas-cooled radiator.

【Background technology】

With the development of science and technology various electronic equipments such as portable computer, tablet computer, industrial computer, portable logical Device, audio and video player etc. are interrogated towards lightening, portable and dynamical trend development, these electronic equipments are limited in its Various high integrations or high-power electronic component must be configured in inner space, in order to make the arithmetic speed of electronic equipment faster With it is with better function, the electronic component of electronic equipment internal will generate more thermal energy when running, and cause high temperature.In addition, These electronic equipments are largely all designed as frivolous, the flat and compact external form of tool, and are used to radiate without additional inner space Cooling, therefore the electronic component in electronic equipment is vulnerable to the influence of thermal energy, high temperature, and then the problems such as cause interference with or be damaged.

In general, the radiating mode of electronic equipment internal can be divided into active heat dissipation and passive heat radiation.It is active to dissipate Hot generally use tube-axial fan or blast type fan are arranged at electronic equipment internal, by tube-axial fan or blast type fan Certain driving air-flow by heat energy transfer caused by electronic equipment internal electronic component, radiates in order to realizing.However, tube-axial fan And blast type fan can generate larger noise in running, and its volume is larger is not easy to be thinned and minimize, moreover axis stream The service life of formula fan and blast type fan is shorter, thus traditional tube-axial fan and blast type fan be not particularly suited for it is frivolous Heat dissipation is realized in change and portable electronic equipment.

Furthermore many electronic components can utilize for example surface mount technology (Surface Mount Technology, SMT), the technologies such as Selective Soldering (Selective Soldering) are welded in printed circuit board (PCB) (Printed Circuit Board, PCB) on, however the electronic component welded using foregoing welding manner, it is in high thermal energy, high temperature ring in through a long time Under border, easily electronic component is made to be separated with printed circuit board (PCB), and most of electronic component also non-refractory, if electronic component is long Time is under high thermal energy, hot environment, easily leads to the decline of performance stability and the reduced lifetime of electronic component.

Fig. 1 is for the structure diagram of traditional heat-dissipating mechanism.As shown in Figure 1, traditional heat-dissipating mechanism is dissipated for a passive type Heat engine structure, including thermal transfer plate 12, which is by a heat-conducting glue 13 and 11 phase of electronic component to be radiated Fitting, by the heat conduction path that heat-conducting glue 13 and thermal transfer plate 12 are formed, electronic component 11 can be made using heat transfer and Free convection mode reaches heat dissipation.However, the radiating efficiency of foregoing cooling mechanism is poor, application demand can not be met.

In view of this, it is really necessary to develop a kind of air cooling radiator to solve prior art problem encountered.

【The content of the invention】

This case is designed to provide a kind of air cooling radiator, various electronic equipments is can be applied to, to be set to electronics Standby internal electronic component radiates, and in order to heat radiation efficiency, reduces noise, and makes the property of electronic equipment internal electronic component It can stablize and prolong the service life.

The another object of this case is to provide a kind of air cooling radiator, can be according to electronic equipment with function of temperature control The temperature change of internal electronic element controls the running of gas pump, in order to heat radiation efficiency and extends air cooling radiator Service life.

In order to achieve the above object, a broader pattern of implementing of this case is to provide a kind of air cooling radiator, for electronics Element radiating, air cooling radiator include：Bearing substrate it includes upper surface, lower surface, air guide end opening and thermal transfer plate, Wherein thermal transfer plate is arranged at upper surface and is disposed on corresponding to air guide end opening and electronic component in thermal transfer plate；Gas Body pumps the lower surface for being fixedly arranged on the bearing substrate, and corresponding closing air guide end opening；And radiator, it is arranged at electronic component On；Wherein, by driving gas pump, air-flow is imported into air guide end opening and heat exchange is carried out to thermal transfer plate.

【Description of the drawings】

Fig. 1 is the structure diagram of traditional heat-dissipating mechanism.

Fig. 2A is the structure diagram of the air cooling radiator of this case first embodiment.

Fig. 2 B are the air cooling radiator shown in Fig. 2A in the structure diagram of Section A-A.

Fig. 3 A and 3B are respectively decomposition texture schematic diagram of the gas pump in different visual angles of this case preferred embodiment.

Fig. 4 is the cross-sectional view of the piezoelectric actuator shown in Fig. 3 A and 3B.

Fig. 5 is the cross-sectional view of the gas pump shown in Fig. 3 A and 3B.

Fig. 6 A to 6E are the flowage structure figure of the gas pump start shown in Fig. 3 A and 3B.

Fig. 7 is the configuration diagram of the air cooling radiator of this case second embodiment.

【Embodiment】

Embodying some exemplary embodiments of this case features and advantages will in detail describe in the explanation of back segment.It should be understood that This case can have various variations in different aspects, all not depart from the scope of this case, and explanation therein and diagram It is inherently illustrated as being used, and nand architecture is in limitation this case.

Fig. 2A is the structure diagram of the air cooling radiator of this case first embodiment and Fig. 2 B are gas shown in Fig. 2A Cooling and radiation device is in the structure diagram of Section A-A.As shown in figs. 2 a and 2b, the air cooling radiator 2 of this case can be applied to one Electronic equipment, such as, but not limited to portable computer, tablet computer, industrial computer, portable communication device, audio and video player, To radiate to electronic component 3 to be radiated in electronic equipment.The air cooling radiator 2 of this case includes bearing substrate 20, gas Body pump 22 and radiator 26, wherein bearing substrate 20 include upper surface 20a, lower surface 20b, air guide end opening 23 and heat and pass Guide plate 25.Bearing substrate 20 can be but be not limited to printed circuit board (PCB), to carry and set electronic component 3 and gas pump 22.It holds The air guide end opening 23 of carried base board 20 is through upper surface 20a and lower surface 20b.Gas pump 22 is fixedly arranged on bearing substrate 20 Lower surface 20b, and assembling is positioned at air guide end opening 23, and close the air guide end opening 23.Thermal transfer plate 25, which is arranged at, holds On the upper surface 20a of carried base board 20, and assembling is positioned on air guide end opening 23, and is had between thermal transfer plate 25 and bearing substrate 20 There is clearance G, circulate to supplied gas.Electronic component 3 is disposed in thermal transfer plate 25, and a surface of electronic component 3 attaches In thermal transfer plate 25, and the heat conduction path that can pass through thermal transfer plate 25 radiates.Radiator 26 is disposed on electronics member On part 3, and it is attached at another surface of electronic component 3.Wherein, by driving gas pump 22, air-flow is imported into air guide end and is opened Mouth 23 simultaneously carries out heat exchange to thermal transfer plate 25, in order to the heat dissipation realized to electronic component 3.

In this present embodiment, radiator 26 includes a pedestal 261 and multiple cooling fins 262, and pedestal 261 is attached at electronics member Another surface of part 3, multiple cooling fins 262 are to be vertically connected at pedestal 261.By the setting of radiator 26, can increase scattered Hot area makes thermal energy caused by electronic component 3 can be via the heat conduction path diversion of radiator 26.

Gas pump 22 is for a piezoelectric actuated gas pump, is moved to drive gas flow, by gas by air cooling radiator 2 Outside import in air guide end opening 23.In some embodiments, bearing substrate 20 further includes at least one reflux wears groove 24, this time It flows through slot 24 and is through upper surface 20a and lower surface 20b, and be adjacent to the periphery of thermal transfer plate 25.When gas pump 22 is by gas When importing air guide end opening 23, the thermal transfer plate 25 for the upper surface 20a for importing air-flow and being arranged at bearing substrate 20 carries out heat It exchanges, and the gas in the clearance G between bearing substrate 20 and thermal transfer plate 25 is promoted quickly to flow, promote the air-flow after heat exchange Thermal energy to be discharged via clearance G, which part air-flow will be back to the lower surface 20b of bearing substrate 20 via reflux wears groove 24, And it is utilized in cooling down follow-up supplied gas pump 22.In addition, fraction is then along the periphery of thermal transfer plate 25 towards the direction of radiator 26 It flows, and the cooling fin 261 of radiator 26 is flowed through after cooling, in order to the heat dissipation accelerated to electronic component 3.Since gas pump 22 is Continuously start makes electronic component 3 that can carry out heat exchange with the gas being continuously introduced into import gas, while after making heat exchange Gas is discharged, and can realize the heat dissipation to electronic component 3 whereby, and can improve heat dissipation, and then increases the performance of electronic component 3 Stability and service life.

Fig. 3 A and 3B are respectively decomposition texture schematic diagram of the gas pump in different visual angles of this case preferred embodiment, and Fig. 4 is The cross-sectional view and Fig. 5 of piezoelectric actuator shown in Fig. 3 A and 3B are the section of the gas pump shown in Fig. 3 A and 3B Structure diagram.As shown in Fig. 3 A, 3B, 4 and 5, gas pump 22 be for a piezoelectric actuated gas pump, and including inlet plate 221, altogether It shakes the structures such as piece 222, piezoelectric actuator 223, insulating trip 2241,2242 and conductive sheet 225, wherein piezoelectric actuator 223 is pair It should be set in resonance plate 222, and make inlet plate 221, resonance plate 222, piezoelectric actuator 223, insulating trip 2241, conductive sheet 225 and 2242 grade of another insulating trip sequentially stack setting, the sectional view being completed is as shown in Figure 5.

In this present embodiment, inlet plate 221 has an at least air admission hole 221a, and wherein the quantity of air admission hole 221a is with 4 To be preferable, but not limited to this.Air admission hole 221a is through inlet plate 221, and atmospheric pressure is complied with from outside device to supplied gas Effect and from an at least air admission hole 221a inflow gas pump 22 in.There is at least one confluence round on inlet plate 221 221b, to this with 221 another surface of inlet plate, at least an air admission hole 221a is correspondingly arranged.In the center of confluence round 221b It is with central recess 221c at exchange, and central recess 221c is connected with confluence round 221b, whereby can will be from this extremely The gas that a few air admission hole 221a enters confluence round 221b guide and converged and is concentrated to central recess 221c, to realize gas biography It passs.In this present embodiment, inlet plate 221 has integrally formed air admission hole 221a, confluence round 221b and central recess 221c, And the confluence chamber of a confluence gas is correspondingly formed at central recess 221c, it is kept in supplied gas.In some embodiments, The material of inlet plate 221 can be formed by such as, but not limited to stainless steel.In other embodiments, by the central recess The depth of the confluence chamber formed at 221c is identical with the depth for the round 221b that converges, and but not limited to this.Resonance plate 222 is It is made of a flexible materials, but not limited to this, and in having a hollow bore 2220 on resonance plate 222, corresponds to The central recess 221c of inlet plate 221 and set so that gas circulate.In other embodiments, resonance plate 222 is can be by one Copper material is formed, and but not limited to this.

Piezoelectric actuator 223 is by a suspension board 2231, at least an outline border 2232, a stent 2233 and a piezoelectric patches 2234 assemble jointly, wherein, which is attached at the first surface 2231c of suspension board 2231, to apply Voltage generate deformation with drive 2231 bending vibration of suspension board and this at least a stent 2233 is to be connected to suspension board 2231 And between outline border 2232, in this present embodiment, which be connected between suspension board 2231 and outline border 2232, Its two-end-point is to be connected to outline border 2232, suspension board 2231, to provide resilient support, and in stent 2233, suspension board With more an at least gap 2235 between 2231 and outline border 2232, circulate to supplied gas.It is emphasized that suspension board 2231, The kenel and quantity of outline border 2232 and stent 2233 are not limited with previous embodiment, and can be changed according to practical application request.Separately Outside, outline border 2232 is the conductive connecting pin 2232c around the outside for being arranged at suspension board 2231, and with an outside projection, to For electrical connection, but not limited to this.

Suspension board 2231 is the structure (as shown in Figure 4) for a cascaded surface, is implied that in the second surface of suspension board 2231 2231b has more a protrusion 2231a, and protrusion 2231a can be but not be limited to a circular protrusions structure.The protrusion of suspension board 2231 2231a is the second surface 2232a coplines with outline border 2232, and the second surface 2231b of suspension board 2231 and stent 2233 Second surface 2233a also for copline, and the second surface 2232a of the protrusion 2231a of the suspension board 2231 and outline border 2232 It is that there is a certain depth between the second surface 2231b of suspension board 2231 and the second surface 2232a of stent 2233.It suspends The first surface 2231c of plate 2231 is with the first surface 2232b of outline border 2232 and the first surface 2233b of stent 2233 Smooth coplanar structure, and piezoelectric patches 2234 is then attached at the first surface 2231c of this smooth suspension board 2231.In another In some embodiments, the kenel of suspension board 2231 also can be a two-sided smooth plate square structure, be not limited thereto, can Appoint according to situation is actually applied and apply variation.In some embodiments, suspension board 2231, stent 2233 and outline border 2232 are can The structure being integrally formed, and can be made of a metallic plate, such as, but not limited to stainless steel is formed.Again in other In embodiment, the length of side of piezoelectric patches 2234 is less than the length of side of the suspension board 2231.In other embodiments, piezoelectric patches 2234 length of side is equal to the length of side of suspension board 2231, and same design is and the corresponding square plate knot of suspension board 2231 Structure, but be not limited thereto.

Insulating trip 2241, conductive sheet 225 and another insulating trip 2242 of gas pump 22 are sequentially to be correspondingly arranged in piezoelectricity cause Under dynamic device 223, and its form approximately corresponds to the form of the outline border 2232 of piezoelectric actuator 223.In some embodiments, Insulating trip 2241,2242 is made of isolation material, such as, but not limited to plastic cement, in order to offer insulation function.In other realities It applies in example, conductive sheet 225 can be made of conductive material, such as, but not limited to metal material, and function is conducted to provide.Yu Ben In embodiment, a conductive connecting pin 225a on conductive sheet 225 can be also set, function is conducted to realize.

In this present embodiment, gas pump 22 is sequentially by inlet plate 221, resonance plate 222, piezoelectric actuator 223, insulating trip 2241st, conductive sheet 225 and another insulating trip 2242 etc. stack, and are tools between resonance plate 222 and piezoelectric actuator 223 There is a gap h, be the gap h between resonance plate 222 and 2232 periphery of outline border of piezoelectric actuator 223 in this present embodiment In insert a filling material, such as, but not limited to conducting resinl, so that the suspension board 2231 of resonance plate 222 and piezoelectric actuator 223 Protrusion 2231a between can maintain the depth of gap h, and then air-flow can be guided and more quickly flowed, and because of suspension board 2231 Protrusion 2231a and resonance plate 222 the suitable distance interference that makes to be in contact with each other is kept to reduce, promote noise generation that can be lowered.In It, also can be by the height for the outline border 2232 for increasing piezoelectric actuator 223, so that it is 222 groups with resonance plate in other embodiments Increase by a gap during dress, but not limited to this.

In this present embodiment, after inlet plate 221, resonance plate 222 are with the sequentially corresponding assembling of piezoelectric actuator 223, in altogether The piece 222 that shakes has and can be collectively formed at a movable part 222a and a fixed part 222b, movable part 222a with inlet plate 221 thereon The chamber of one confluence gas, and a first chamber 220 is more formed between resonance plate 222 and piezoelectric actuator 223, it is configured to temporarily store Gas, and first chamber 220 be through resonance plate 222 hollow bore 2220 and at the central recess 221c of inlet plate 221 Chamber be connected, and the both sides of first chamber 220 then by the gap 2235 between the stent 2233 of piezoelectric actuator 223 and with The air guide end opening 23 being arranged under it is connected.

Fig. 6 A to 6E are the flowage structure figure of the gas pump start shown in Fig. 3 A and 3B.Fig. 5, Fig. 6 A to Fig. 6 E are referred to, The start process description of the gas pump of this case is as follows.When gas pump 22 carry out start when, piezoelectric actuator 223 by voltage actuation and It is fulcrum with stent 2233, carries out the reciprocating vibration of vertical direction.As shown in Figure 6A, when piezoelectric actuator 223 is caused by voltage It is dynamic and when vibrating downwards, be when piezoelectric actuator 223 vibrate, to be total to since resonance plate 222 is for light, thin laminated structure Shake piece 222 also can with resonance and carry out vertical reciprocating vibration, be the part that resonance plate 222 corresponds to central recess 221c Also can with bending vibration deformation, i.e. the part of correspondence central recess 221c is the movable part 222a for resonance plate 222, be with When piezoelectric actuator 223 is bent downwardly vibration, the movable part 222a of the correspondence central recess of resonance plate 222 221c can be because of gas at this time The drive brought into and pushed and piezoelectric actuator 223 vibrates of body, and as piezoelectric actuator 223 is bent downwardly vibration shape Become, then gas is entered by at least air admission hole 221a on inlet plate 221, and converges round 221b through at least one to be pooled to Center central recess 221c at, then via the hollow bore 2220 being correspondingly arranged on resonance plate 222 with central recess 221c to Under flow into first chamber 220.Thereafter, due to being driven by 223 vibration of piezoelectric actuator, resonance plate 222 also can be total to Shake and carry out vertical reciprocating vibration, as shown in Figure 6B, at this time the movable part 222a of resonance plate 222 also with downward vibration, And attach contact at piezoelectric actuator 223 suspension board 2231 protrusion 2231a on, make the protrusion 2231a of suspension board 2231 with The spacing of confluence chamber between the fixed part 222b of outer 222 both sides of region and resonance plate will not become smaller, and by this resonance The deformation of piece 222 to compress the volume of first chamber 220, and is closed 220 middle flow space of first chamber, is promoted in it Gas is pushed to be flowed to both sides, and then passes through stream downwards by the gap 2235 between the stent 2233 of piezoelectric actuator 223 It is dynamic.Afterwards, as shown in Figure 6 C, the movable part 222a of resonance plate 222 is bent upwards vibration deformation, and returns back to initial position, and Piezoelectric actuator 223 is driven by voltage to vibrate upwards, the so similary volume for squeezing first chamber 220, only at this time due to pressure Electric actuator 223 is upward lifting so that the gas in first chamber 220 can be flowed towards both sides, and gas constantly from An at least air admission hole 221a on inlet plate 221 enters, then flows into the chamber that central recess 221c is formed.Afterwards, as schemed Shown in 6D, which is resonated upwards by the vibration of 223 upward lifting of piezoelectric actuator, and resonance plate 222 is movable at this time Portion 222a also with upward vibration, and then mitigation of gases constantly from inlet plate 221 an at least air admission hole 221a enter, then It flows into the chamber that central recess 221c is formed.Finally, as illustrated in fig. 6e, the movable part 222a of resonance plate 222 is also returned back to Initial position.Thus embodiment aspect is understood, is that can be caused by itself and piezoelectricity when resonance plate 222 carries out vertical reciprocating vibration Gap h between dynamic device 223 is to increase the maximum range of its vertical displacement, in other words, gap h is set between two structure It can make resonance plate 222 that can generate upper and lower displacement by a larger margin when resonance.Therefore in the runner design through this gas pump 22 Barometric gradient is generated, makes gas flow at high rates, and is transmitted to gas by suction side into the resistance difference of outgoing direction through runner Outlet side to complete gas conveying operation, even if in a state that outlet side has air pressure, still has the ability persistently to push air into gas Body circulation passage 25, and mute effect is can reach, so repeat 22 start of gas pump of Fig. 6 A to 6E, you can make gas pump 22 Generate the gas transport of an ecto-entad.

From the above, through above-mentioned gas pump 22 start, introduce gas into air guide end opening 23, make imported gas and Thermal transfer plate 25 carries out heat exchange, and the air-flow in the clearance G between bearing substrate 20 and thermal transfer plate 25 is promoted quickly to flow, and promotees Make the gas after heat exchange that thermal energy drained into air cooling radiator 2 external, whereby to improve the efficiency of cooling, Jin Erzeng Power up performance stability and the service life of subcomponent 3.

Fig. 7 is the configuration diagram of the air cooling radiator of the 3rd preferred embodiment of this case.As shown in fig. 7, the present embodiment Similar and identical to the air cooling radiator 2 shown in Fig. 2 B radiator 2a element numbers of air cooling represent identical structure, Element and function, repeat no more in this.Compared to the air cooling radiator 2 shown in Fig. 2 B, the air cooling radiator of the present embodiment 2a is with function of temperature control, further includes control system 21, which includes control unit 211 and temperature sensor 212, wherein control unit 211 is electrically connected with gas pump 22, to control the running of gas pump 22.Temperature sensor 212 is to set It is placed in air guide end opening 23, and is adjacent to electronic component 3, paste for the temperature near sensing electronic component 3 or directly Invest sensing 3 temperature of electronic component on electronic component 3.Temperature sensor 212 is electrically connected to control unit 211, senses electronics The temperature of element 3, and sensing signal is transmitted to control unit 211.Sensing of the control unit 211 according to temperature sensor 212 Whether signal judges the temperature of the electronic component 3 higher than a temperature threshold value, when control unit 211 judges the electronic component 3 When temperature is higher than the temperature threshold value, a control signal is sent to gas pump 22, is operated with enable gas pump 22, makes gas whereby The flowing of 22 certain driving air-flows is pumped to carry out cooling to electronic component 3, so that 3 cooling of electronic component and reducing temperature.When When control unit 211 judges that the temperature of the electronic component 3 is less than the temperature threshold value, a control signal is sent to gas pump 22, It is operated with stopping gas pump 22,22 continued operation of gas pump can be avoided whereby and cause reduced lifetime, reduce additional energy Consume.Therefore through the setting of control system 21, make the gas pump 22 of air cooling radiator 2 when 3 temperature overheating of electronic component Cooling can be carried out, and is stopped operating after the reduction of 3 temperature of electronic component, 22 continued operation of gas pump can be avoided whereby and led Reduced lifetime is caused, the consume of additional energy is reduced, electronic component 3 can also operated under a preferred temperature environment, improves electricity The stability of subcomponent 3.

In conclusion this case provides a kind of air cooling radiator, various electronic equipments are can be applied to its inside Electronic element radiating in order to heat radiation efficiency, reduces noise, and makes the performance of electronic equipment internal electronic component stable and extend Service life.In addition, the air cooling radiator of this case, it, can be according to electronic equipment internal electronic component with function of temperature control Temperature change controls the running of gas pump, the service life for the radiator that is gas-cooled in order to heat radiation efficiency and extension,.

This case appointed as person familiar with the technology apply craftsman think and be it is all as modification, it is so neither de- such as attached claim Be intended to Protector.

【Symbol description】

11：Electronic component

12：Thermal transfer plate

13：Heat-conducting glue

2、2a：Be gas-cooled radiator

20：Bearing substrate

20a：Upper surface

20b：Lower surface

21：Control system

211：Control unit

212：Temperature sensor

22：Gas pump

220：First chamber

221：Inlet plate

221a：Air admission hole

221b：Converge round

221c：Central recess

222：Resonance plate

222a：Movable part

222b：Fixed part

2220：Hollow bore

223：Piezoelectric actuator

2231：Suspension board

2231a：Protrusion

2231b：Second surface

2231c：First surface

2232：Outline border

2232a：Second surface

2232b：First surface

2232c：Conductive connecting pin

2233：Stent

2233a：Second surface

2233b：First surface 2234：Piezoelectric patches

2235：Gap

2241、2242：Insulating trip

225：Conductive sheet

225a：Conductive connecting pin

23：Air guide end opening

24：It is vented end opening

25：Thermal transfer plate

26：Radiator

261：Pedestal

262：Cooling fin

h：Gap

G：Gap

3：Electronic component

Claims (12)

1. a kind of air cooling radiator, for an electronic element radiating, which is characterized in that the air cooling radiator includes:

One bearing substrate includes a upper surface, a lower surface, an air guide end opening and a thermal transfer plate, the wherein heat transfer Plate is arranged at the upper surface and is disposed on corresponding to the air guide end opening and the electronic component in the thermal transfer plate；

One gas pump is fixedly arranged on the lower surface of the bearing substrate, and corresponding closing air guide end opening；And

One radiator is arranged on the electronic component；

Wherein, by the gas pump is driven, air-flow is imported into the air guide end opening and to thermal transfer plate progress heat exchange.

2. air cooling radiator as described in claim 1, which is characterized in that the air guide end opening of the bearing substrate is through The upper surface and the lower surface.

3. air cooling radiator as described in claim 1, which is characterized in that have one between the thermal transfer plate and the bearing substrate Gap, to supply airflow.

4. air cooling radiator as described in claim 1, which is characterized in that the thermal transfer plate attaches a table of the electronic component Face, and the radiator attaches another surface of the electronic component.

5. air cooling radiator as described in claim 1, which is characterized in that the bearing substrate further includes at least one reflux and wears Slot, which is through the upper surface and the lower surface, and is adjacent to the periphery of the thermal transfer plate.

6. air cooling radiator as described in claim 1, which is characterized in that the gas pump is a piezoelectric actuated gas pump.

7. air cooling radiator as claimed in claim 6, which is characterized in that the piezoelectric actuated gas pump includes：

One inlet plate has an at least air admission hole, at least one confluence round and the central recess for forming a confluence chamber, wherein For an at least air admission hole for importing air-flow, which corresponds to the air admission hole, and the air-flow of the air admission hole is guided to converge into this The confluence chamber that central recess is formed；

There is one resonance plate a hollow hole to correspond to the confluence chamber, and be a movable part around the hollow hole；And

One piezoelectric actuator, setting corresponding with the resonance plate；

Wherein, between the resonance plate and the piezoelectric actuator there is a gap to form a chamber, so that the piezoelectric actuator is driven When dynamic, air-flow is made to be imported by an at least air admission hole for the inlet plate, the central recess is collected to through at least one confluence round, The hollow hole of the resonance plate is passed through, to enter in the chamber, is generated by the movable part of the piezoelectric actuator and the resonance plate Resonance transfer air-flow.

8. air cooling radiator as claimed in claim 7, which is characterized in that the piezoelectric actuator includes：

One suspension board has a first surface and a second surface, and flexible vibration；

One outline border, around the outside for being arranged at the suspension board；

An at least stent is connected between the suspension board and the outline border, to provide resilient support；And

One piezoelectric patches has a length of side, which is less than or equal to a length of side of the suspension board, and the piezoelectric patches is to be attached at On one first surface of the suspension board, to apply voltage to drive the suspension board bending vibration.

9. air cooling radiator as claimed in claim 8, which is characterized in that the suspension board is a square suspension board, and is had There is a protrusion.

10. as claimed in claim 7 air cooling radiator, which is characterized in that the piezoelectric actuated gas pump include a conductive sheet, One first insulating trip and one second insulating trip, the wherein inlet plate, the resonance plate, the piezoelectric actuator, first insulating trip, The conductive sheet and second insulating trip are sequentially to stack to set.

11. air cooling radiator as described in claim 1, which is characterized in that it further includes a control system, the control system Including：

One control unit is electrically connected to the gas pump, the gas pump to be controlled to operate；And

One temperature sensor is electrically connected to the control unit and is adjacent to the electronic component, to sense the one of electronic component temperature It spends to export a sensing signal to the control unit；

Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door During threshold value, which makes the gas pump enable, is flowed with certain driving air-flow and when the control unit is in receiving the sensing Signal, and judge the electronic component the temperature be less than the temperature threshold value when, which makes the gas pump stop operating.

12. air cooling radiator as described in claim 1, which is characterized in that the radiator includes a pedestal and multiple heat dissipations Piece, the wherein pedestal are to be attached at the electronic component, and the plurality of cooling fin is to be connected to the pedestal.