CN206402609U - Air cooling heat abstractor - Google Patents

Abstract

This case provides a kind of air cooling heat abstractor, includes carrier, scrollwork airflow radiating device, gas pump and channel connector.Carrier is arranged at the side of electronic component, including air guide end opening and exhaust end opening；Scrollwork airflow radiating device is attached on electronic component, and the structure with scrollwork gas channel is constituted by the conductor wires and heat-conducting plate of scroll；Gas pump closes air guide end opening, and define to form a chamber with carrier on carrier；Channel connector is connected between carrier and scrollwork gas channel；Gas is sent to the chamber of carrier by driving gas pump, gas is sent in scrollwork gas channel through channel connector by the exhaust end opening, scrollwork quick flow is formed, to carry out heat exchange to electronic component, and the air-flow after heat exchange is discharged via the exhaust port of scrollwork airflow radiating device.

Description

Air cooling heat abstractor

【Technical field】

This case be on a kind of air cooling heat abstractor, it is espespecially a kind of to provide driving air-flow using gas pump to be radiated Air cooling heat abstractor.

【Background technology】

With the development of science and technology various electronic equipments such as portable computer, tablet personal computer, industrial computer, portable logical Device, audio and video player etc. are interrogated towards lightening, portable and dynamical trend development, these electronic equipments are limited in its Various high integrations or high-power electronic component must be configured in inner space, in order that the arithmetic speed of electronic equipment is faster With it is with better function, the electronic component of electronic equipment internal will produce more heat energy when running, and cause high temperature.In addition, These electronic equipments are largely all designed as frivolous, flat and have compact external form, and without extra inner space for radiating Cooling, therefore the electronic component in electronic equipment is vulnerable to the influence of heat energy, high temperature, and then the problems such as cause interference with or be damaged.

In general, the radiating mode of electronic equipment internal can be divided into active radiating and passive heat radiation.It is active to dissipate It is hot that electronic equipment internal is generally arranged at using tube-axial fan or blast type fan, by tube-axial fan or blast type fan Air-flow is driven, the heat energy transfer produced by electronic equipment internal electronic component radiates in order to realizing.However, tube-axial fan And blast type fan can produce larger noise in running, and its volume is larger is difficult to be thinned and minimizes, moreover axle stream The service life of formula fan and blast type fan is shorter, thus traditional tube-axial fan and blast type fan be not particularly suited for it is frivolous Radiating is realized in change and portable electronic equipment.

Furthermore, many electronic components can using such as surface mount technology (Surface Mount Technology, SMT), the technology such as Selective Soldering (Selective Soldering) is welded in printed circuit board (PCB) (Printed Circuit Board, PCB) on, but the electronic component welded using foregoing welding manner, in through being in high heat energy, high temperature ring for a long time Under border, easily electronic component is set to be separated with printed circuit board (PCB), and most of electronic component also non-refractory, if electronic component is long Time is under high heat energy, hot environment, and the performance stability for being easily caused electronic component declines and reduced lifetime.

Fig. 1 is for the structural representation of traditional heat-dissipating mechanism.As shown in figure 1, traditional heat-dissipating mechanism is dissipated for a passive type Heat engine structure, it includes thermal transfer plate 12, and the thermal transfer plate 12 is by a heat-conducting glue 13 electronic component 11 phase to be radiated with one Laminating, the heat conduction path formed by heat-conducting glue 13 and thermal transfer plate 12, electronic component 11 can be made using heat transfer and Free convection mode reaches radiating.However, the radiating efficiency of foregoing cooling mechanism is poor, it is impossible to meet application demand.

In view of this, it is necessary to develop a kind of air cooling heat abstractor in fact, to solve prior art problem encountered.

【Utility model content】

The purpose of this case is to provide a kind of air cooling heat abstractor, and it can be applied to various electronic equipments, and can pass through whirlpool Roll up quick flow and forced heat radiation is carried out with the thermal source of the heat production to electronic equipment internal, in order to heat radiation efficiency, reduce noise, and The performance of electronic equipment internal electronic component is set to stablize and increase the service life.

The another object of this case is to provide a kind of air cooling heat abstractor, and it has function of temperature control, can be according to electronic equipment The temperature change of internal thermal source, controls the running of gas pump, in order to heat radiation efficiency, and extends making for air cooling heat abstractor Use the life-span.

For up to above-mentioned purpose, a broader pattern of implementing of this case is provides a kind of air cooling heat abstractor, for electronics Element radiating, comprising：One carrier, is arranged at the side of the electronic component, and including an air guide end opening and an exhaust end opening； One scrollwork airflow radiating device, is attached on the electronic component, and it is to form scroll by a conductor wires, and is covered with a heat-conducting plate It is placed on thereon, an exhaust port is provided with the structure with a scrollwork gas channel, the heat-conducting plate to constitute, with corresponding to this A center-side inside scrollwork gas channel；One gas pump, is fixedly arranged on the carrier, and closes the air guide end opening, and with this Carrier common definition one chamber of formation；And a channel connector, it is connected to exhaust end opening and the scrollwork gas of the carrier Between the scrollwork gas channel of flow heat dissipation device, to be sent gas；By the gas pump is driven, the chamber of the carrier is sent Gas, and discharged by the exhaust end opening of the carrier, gas is sent to the scrollwork airflow radiating via the channel connector In the scrollwork gas channel of device, to form a scrollwork quick flow, and heat exchange is carried out to the electronic component, and will be with the electricity Subcomponent carries out the air-flow after heat exchange and discharged via the exhaust port of the scrollwork airflow radiating device.

For up to above-mentioned purpose, another broader implementation pattern of this case is provides a kind of air cooling heat abstractor, to one Electronic element radiating, comprising：One carrier, is arranged at the side of the electronic component, and including an air guide end opening and an exhaust end Opening；One scrollwork airflow radiating device, is attached on the heat conducting material that the electronic component is contacted, it is by a conductor wires Scroll is formed, and with heat-conducting plate covering thereon, is set with constituting on the structure with a scrollwork gas channel, the heat-conducting plate An exhaust port is equipped with, with corresponding to the center-side inside the scrollwork gas channel；One gas pump, is fixedly arranged on the carrier, And the air guide end opening is closed, and form a chamber with the carrier common definition；And a channel connector, it is connected to the carrier The exhaust end opening and the scrollwork airflow radiating device the scrollwork gas channel between, to be sent gas；By the driving gas Body pump, gas is sent to the chamber of the carrier, and is discharged by the exhaust end opening of the carrier, will via the channel connector Gas is sent in the scrollwork gas channel of the scrollwork airflow radiating device, to form a scrollwork quick flow, and the heat is passed Lead material and carry out heat exchange, the heat penetration that the electronic component is produced crosses the heat conducting material and carries out heat exchange, and by heat exchange Air-flow afterwards is discharged via the exhaust port of the scrollwork airflow radiating device.

For up to above-mentioned purpose, the another broader implementation pattern of this case is provides a kind of air cooling heat abstractor, for one Electronic element radiating, comprising：Two carriers, are arranged at the two opposite sides of the electronic component, and respectively include an air guide end opening and one It is vented end opening；One scrollwork airflow radiating device, is attached on the electronic component, and it is to form scroll by two conductor wires, and With heat-conducting plate covering thereon, it is provided with an exhaust on the structure with a pair of scrollwork gas channel, the heat-conducting plate to constitute Opening, with corresponding to the center-side inside this pair of scrollwork gas channel；Two gas pumps, are fixedly arranged on its corresponding load respectively On body, and each correspondence closes the air guide end opening of the carrier, and forms a chamber with the carrier common definition respectively；And two Channel connector, is connected to the exhaust end opening of its corresponding carrier and this pair of scrollwork of the scrollwork airflow radiating device Between gas channel, to be sent gas；By the two gas pump is driven, to be sent gas to the chamber of the carrier respectively, and Discharged by the exhaust end opening of the carrier, gas is sent to this pair of the scrollwork airflow radiating device via the channel connector In scrollwork gas channel, to form a pair of scrollwork quick flow, and heat exchange is carried out to electronic component, and will be with the electronic component The air-flow after heat exchange is carried out to discharge via the exhaust port of the scrollwork airflow radiating device.

For up to above-mentioned purpose, another broader implementation pattern of this case is provides a kind of air cooling heat abstractor, to one Electronic element radiating, comprising：Two carriers, are arranged at the two opposite sides of the electronic component, and respectively include an air guide end opening and one It is vented end opening；One scrollwork airflow radiating device, is attached on the heat conducting material that the electronic component is contacted, it is led by two Body wire rod formation scroll, and with heat-conducting plate covering thereon, to constitute the structure with a pair of scrollwork gas channel, this is led An exhaust port is provided with hot plate, with corresponding to the center-side inside this pair of scrollwork gas channel；Two gas pumps, it is solid respectively On its corresponding carrier, and each correspondence closes the air guide end opening of the carrier, and jointly fixed with the carrier respectively Justice forms a chamber；And two channel connectors, it is connected to exhaust end opening and the scrollwork of its corresponding carrier Between this pair of scrollwork gas channel of airflow radiating device, to be sent gas；By the two gas pump is driven, with respectively to the carrier The chamber delivery gas, and by the carrier the exhaust end opening discharge, gas is sent to this via the channel connector In this pair of scrollwork gas channel of scrollwork airflow radiating device, to form a pair of scrollwork quick flow, and the heat conducting material is entered Row heat exchange, the heat penetration that the electronic component is produced crosses the heat conducting material and carries out heat exchange, and by the air-flow after heat exchange Discharged via the exhaust port of the scrollwork airflow radiating device.

【Brief description of the drawings】

Fig. 1 is the structural representation of traditional heat-dissipating mechanism.

Fig. 2 is the structural representation of the air cooling heat abstractor of the preferred embodiment of this case first.

Fig. 3 is the structural representation of the scrollwork airflow radiating device of the air cooling heat abstractor shown in Fig. 2

Fig. 4 is the configuration diagram of the control system of the air cooling heat abstractor shown in Fig. 2.

Fig. 5 is the structural representation of the air cooling heat abstractor of the preferred embodiment of this case second.

Fig. 6 A and 6B are respectively point of the gas pump in different visual angles of the air cooling heat abstractor of the preferred embodiment of this case first Solution structure schematic diagram.

Fig. 7 is the cross-sectional view of the piezo-activator of the gas pump shown in Fig. 6 A and 6B.

Fig. 8 is the cross-sectional view of the gas pump shown in Fig. 6 A and 6B.

Fig. 9 A to 9E are the flowage structure figure of the gas pump start shown in Fig. 6 A and 6B.

Figure 10 is the structural representation of the air cooling heat abstractor of the preferred embodiment of this case the 3rd.

Figure 11 is the structural representation of the scrollwork airflow radiating device of the air cooling heat abstractor shown in Figure 10.

Figure 12 is the structural representation of the air cooling heat abstractor of the preferred embodiment of this case the 4th.

【Embodiment】

Embodying some exemplary embodiments of this pattern characteristics and advantage will in detail describe in the explanation of back segment.It should be understood that This case can have various changes in different aspects, and it does not all depart from the scope of this case, and explanation therein and diagram Inherently it is illustrated as being used, and nand architecture is in limitation this case.

Referring to Fig. 2, its structural representation for the air cooling heat abstractor of the preferred embodiment of this case first.As shown in Fig. 2 The air cooling heat abstractor 2 of this case can be applied to an electronic equipment, such as, but not limited to portable computer, tablet personal computer, industrial electro Brain, portable communication device, audio and video player ... etc., but be not limited, and enter to the thermal source to heat production in electronic equipment Row radiating, by taking the present embodiment as an example, the thermal source of the heat production is the electronic component A shown in figure, and in the present embodiment, heat production The more permeable heat-conducting mediums of electronic component A, for example：Heat-conducting glue C, to be attached at another heat conducting material, for example：Heat transfer Plate B, on, whereby, the heat penetration produced by can making electronic component A is crossed thermal transfer plate B and radiated in the way of conducting, while more may be used Through the air cooling heat abstractor 2 of this case to carry out forced heat radiation more efficiently.In the present embodiment, air cooling heat abstractor 2 is wrapped Containing carrier 20, scrollwork airflow radiating device 21, gas pump 22 and channel connector 23, wherein carrier 20 is disposed on electronic component A side, and including air guide end opening 202 and exhaust end opening 203；And scrollwork airflow radiating device 21 is then attached and is arranged in electricity On subcomponent A, and scrollwork airflow radiating device 21 is made up of heat-conducting plate 210 and conductor wires 211, and it is by conductor wires 211 form scroll, and are covered thereon with the heat-conducting plate 210 of thin type, to constitute the structure with scrollwork gas channel 211a, And exhaust port 210a is more set on heat-conducting plate 210, (such as to scheme corresponding to the center-side 211b inside scrollwork gas channel 211a Shown in 3)；Gas pump 22 is fixedly arranged on carrier 20, and assembling is positioned on the air guide end opening 202 of carrier 20, and closing should Air guide end opening 202, and the gas pump 22 be and the common definition of carrier 20 formation one chamber 201；Channel connector 23 is then corresponded to It is connected between the exhaust end opening 203 of carrier 20 and the scrollwork gas channel 211a of scrollwork airflow radiating device 21, to be sent gas Body.By driving gas pump 22, gas is sent to the chamber 201 of carrier 20, air-flow is imported into load via air guide end opening 202 In body 20, then discharged by exhaust end opening 203, and gas is sent to scrollwork airflow radiating device 21 via channel connector 23 In scrollwork gas channel 211a, to form a scrollwork quick flow, and heat exchange is carried out to electronic component A, and will be with the electronics Element A carries out the air-flow after heat exchange and discharged via the exhaust port 210a of scrollwork airflow radiating device 21, first to electronics in order to realizing Part A radiating.

In some embodiments, carrier 20 is can be but not be limited to a frame structure, and its apparent size is corresponded roughly to Gas pump 22, but be not limited, and correspondingly cover can cover on the gas pump 22, and make its air guide end opening 202 and gas pump 22 Correspondence connection is set, so that the carrier 20 can form chamber 201 with the common definition of gas pump 22, for airflow.As schemed Show, the exhaust end opening 203 of carrier 20 is disposed on the one side of carrier 20, and is connected with one end of channel connector 23 Logical, in the present embodiment, channel connector 23, which is, to be a connecting pipe line, but is not limited；Therefore the one of channel connector 23 End is connected to the exhaust end opening 203 of carrier 20, and the other end is then with the scrollwork gas channel 211a's of scrollwork airflow radiating device 21 Introducing port 211c (as shown in Figure 3) is connected, whereby, after gas pump 22 drives, then can connect air-flow through passage from carrier 20 Connect device 23 and be delivered in the scrollwork gas channel 211a of scrollwork airflow radiating device 21, to carry out heat exchange to electronic component A.Such as Preceding described, in the present embodiment, electronic component A second surface A2 is to attach through heat-conducting glue C and be arranged at thermal transfer plate B On, and can pass through the passive radiating that thermal transfer plate B heat conduction path is conducted.And in some embodiments, gas pump 22 Also it can in the lump be correspondingly arranged on thermal transfer plate B, but be not limited.And thermal transfer plate B is by high heat-conduction coefficient material It is made, the high heat-conduction coefficient material for example can be but not be limited to electrographite.

In the present embodiment, gas pump 22 be for a piezoelectric actuated gas pump, it is dynamic to drive gas flow, by gas by The outside of air cooling heat abstractor 2 is inputted via the entrance 22a of gas pump 22, through the piezoelectric actuated of gas pump 22, to produce foot Enough air pressure, and promote gas rapidly to be imported via the air guide end opening 202 of carrier 20 in chamber 201, then opened by exhaust end Mouth 203 is discharged, and gas is sent in the scrollwork gas channel 211a of scrollwork airflow radiating device 21 via channel connector 23, To form a scrollwork quick flow, and pass through this scrollwork quick flow to carry out heat exchange to electronic component A, then promote heat exchange It is outside that air-flow afterwards is expelled to air cooling heat abstractor 2 via the exhaust port 210a of scrollwork airflow radiating device 21.And, such as scheme Shown in 2, because gas pump 22 is continuously start, it with it is constantly to import cold air to be, makes electronic component A can be with continuously leading The scrollwork quick flow entered carries out heat exchange, may achieve circulating thermal convection current heat abstractor whereby, while can more improve radiating Efficiency, and then increase electronic component A performance stability and the life-span.

Please refer to Fig. 2 and Fig. 3, wherein Fig. 3 is the knot of the scrollwork airflow radiating device of the air cooling heat abstractor shown in Fig. 2 Structure schematic diagram.As shown in figure 3, the scrollwork airflow radiating device 21 of this case is made up of heat-conducting plate 210 and conductor wires 211, its The center of middle heat-conducting plate 210 is provided with exhaust port 210a, and to supplied gas outflow, and conductor wires 211 then bend to scrollwork Shape, and assembling corresponding with heat-conducting plate 210, and then to constitute the structure with scrollwork gas channel 211a, the scrollwork gas channel 211a is that introducing port 211c is connected with channel connector 23, and center-side with introducing port 211c and center-side 211b 211b then corresponds to the exhaust port 210a of heat-conducting plate 210.By taking the present embodiment as an example, the assembling mode of scrollwork airflow radiating device 21 It is to adopt so that conductor wires 211 first are bent into scroll, and is attached directly to the first surface A1 of the electronic component A as thermal source On, then by heat-conducting plate 210 correspondence be covered in the conductor wires 211 of scroll, by the line footpath of the conductor wires 211 with as Scrollwork gas channel 211a's separates, while through the lidstock of heat-conducting plate 210, to constitute the scrollwork airflow radiating device of this case 21, this processing procedure is not only simple, easy to implement, and is available for the producer to accommodate vertical height in response in electronic equipment casing, And then the thickness of slab of the line footpath of optional suitable conductor wires and slim heat-conducting plate is configured to required scrollwork air-flow with group Radiator 21.Whereby, then can be saturating after gas is sent to the introducing port 211c of scrollwork airflow radiating device 21 by channel connector 23 Scrollwork gas channel 211a is crossed to guide and limit the flow direction of gas, in order to one scrollwork quick flow of formation, and due to this whirlpool It is directly to be contacted with electronic component A first surface A1 to roll up quick flow, is efficiently can to carry out hot friendship with electronic component A Change, then the row for making the gas after heat exchange be sent to heat-conducting plate 210 by scrollwork gas channel 211a center-side 211b correspondences Gas opening 210a, to discharge outside air cooling heat abstractor 2.

In some embodiments, the material of conductor wires 211 and heat-conducting plate 210 can be but not be limited to metallic conductor material, For example：Copper, but be not limited.And, the heat-conducting plate 210 is can be but not be limited to a slim heat-conducting plate 210, and its plate is thick The preferred values of degree is 1mm, but is not limited, and the preferred values of the line footpath of the conductor wires 211 can be then 2mm, also not with this It is limited, through the collocation of the panel thickness and the line footpath height of conductor wires 211 of these heat-conducting plates 210, then may make up and be applied to The whole height of the present embodiment is 3mm scrollwork airflow radiating device 21, and the scrollwork airflow radiating device 21 being so thinned is extremely suitable for Slimming and Miniaturization Design trend.Certainly, as it was previously stated, the panel thickness of the heat-conducting plate 210 of scrollwork airflow radiating device 21 with The line footpath height of conductor wires 211 is can to appoint according to situation is actually applied and apply change, is not limited thereto.

Please refer to the configuration diagram for the control system that Fig. 2 and Fig. 4, Fig. 4 are the air cooling heat abstractor shown in Fig. 2. In the present embodiment, air cooling heat abstractor 2 has more control system, the running to control air cooling heat abstractor 2；In this implementation In example, the framework of the control system is as shown in figure 4, comprising control unit 24 and temperature sensor 25, but to be not limited；Its Middle control unit 24 is electrically connected with gas pump 22, the running to correspondence control gas pump 22.In the present embodiment, the temperature Sensor 25 is also electrically connected with control unit 24, and it is mainly to detect the temperature of thermal source 26, and export a corresponding sensing Signal is controlled by control unit 24 start of the gas pump 22 to control unit 24.In some embodiments, thermal source 26 is Can be that the electronic component A of heat production is contacted with electronic component A thermal transfer plate B or the device of other heat production, not with This is limited.As shown in Fig. 2 when the thermal source 26 is for electronic component A, then the position set by temperature sensor 25 is as neighbouring In electronic component A, the temperature near electronic component A is sensed with correspondence, or be that it can also be attached directly to electronic component On A, directly to sense electronic component A temperature, and a sensing signal is exported to control unit 24.When control unit 24 is received After the sensing signal transmitted to temperature sensor 25, the sensing signal that it then can be according to temperature sensor 25 judges the electricity Whether subcomponent A temperature is higher than a temperature threshold value；When control unit 24 judges that electronic component A temperature is higher than the temperature During threshold value, then it can correspond to and send a control signal to gas pump 22, be operated with enable gas pump 22, whereby drive gas pump 22 Stream of taking offence quickly flows to scrollwork airflow radiating device 21 through channel connector 23, to carry out heat exchange to electronic component A, by electricity The heat energy that subcomponent A is produced is removed to outside air cooling heat abstractor 2 rapidly；Meanwhile, cold air is also constantly inhaled by gas pump 22 again Enter, so to carry out lasting heat exchange circulation, so that electronic component A effectively cooling and can reduce temperature.Conversely, when control When unit 24 processed judges that electronic component A temperature is less than the temperature threshold value, then another corresponding control signal can be sent extremely Gas pump 22, is operated with stopping gas pump 22, and the continued operation of gas pump 22 can be avoided whereby and causes reduced lifetime, and reduction is extra Energy consume.Therefore through the setting of this control system, the running of gas pump 22 is not only can control, while can more be directed to Thermal source carries out temperature control, and as making the gas pump 22 of air cooling heat abstractor 2 can be forced when electronic component A temperature overheatings Cooling, and decommissioned in after the reduction of electronic component A temperature, the continued operation of gas pump 22 can be avoided whereby and is caused the life-span Shorten, reduce the consume of extra energy, can also make electronic component A in being operated under a preferred temperature environment, improve electronic component A Stability.

Referring to Fig. 5, its structural representation for the air cooling heat abstractor of the preferred embodiment of this case second.As shown in figure 5, Air cooling heat abstractor 2 ' equally includes carrier 20 ', scrollwork airflow radiating device 21 ', gas pump 22 ' and channel connector 23 ', its Middle carrier 20 ' is also arranged at electronic component A side, and including air guide end opening 202 ' and exhaust end opening 203 '；Scrollwork gas Flow heat dissipation device 21 ' is also made up of heat-conducting plate 210 ' and conductor wires 211 '；Gas pump 22 ' is also fixedly arranged on carrier 20 ', and with The common definition of carrier 20 ' formation chamber 201 '；And channel connector 23 ' is the exhaust end opening that correspondence is communicated in carrier 20 ' Between 203 ' and the scrollwork gas channel 211a ' of scrollwork airflow radiating device 21 '.It is the carrier 20 ', whirlpool with the present embodiment The structure and annexation of volume gas flow heat dissipation device 21 ', gas pump 22 ' and channel connector 23 ' substantially with previous embodiment phase Together, only in the present embodiment, scrollwork airflow radiating device 21 ' is disposed on the heat conducting material that electronic component A is contacted, i.e., heat is passed On guide plate B, it is non-to be directly arranged on electronic component A to imply that it, but by electronic component A and its thermal transfer plate connected B is collectively treated as thermal source, and scrollwork airflow radiating device 21 ' is arranged to thermal transfer plate B first surface B1, and thermal transfer plate B Another relative second surface B2 be then through a heat-conducting medium, for example：Heat-conducting glue C, to be attached at the second of electronic component A In surface A 2.

In the present embodiment, it is attached at though scrollwork airflow radiating device 21 ' is correspondence assembling on thermal transfer plate B, so such as preceding institute State, be air-flow can be imported in chamber 202 ' via the air guide end opening 202 ' of carrier 20 ' after gas pump 22 ' is piezoelectric actuated, Discharged again by exhaust end opening 203 ', and gas is sent to via channel connector 23 ' scrollwork of scrollwork airflow radiating device 21 ' In gas channel 211a ', to form a scrollwork quick flow, and to carrying out heat exchange as the thermal transfer plate B of heat conducting material, Heat exchange is carried out so that the electronic component A heat penetrations produced are crossed into thermal transfer plate B, and the air-flow after heat exchange is dissipated via scrollwork air-flow Exhaust port 210a ' the discharges of hot device 21 ', in order to the radiating realized to electronic component A and thermal transfer plate B.Thus embodiment is visible, Position set by scrollwork airflow radiating device 21 ' is not limited to be attached directly on electronic component A, and it also can pass through and sets In the heat conducting material contacted with electronic component A, for example：Thermal transfer plate B, on, the heat produced by thermal source is promptly removed, The thermal source that equally can reach the heat production to electronic equipment internal carries out forced heat radiation, in order to heat radiation efficiency, the work(such as reduction noise Effect.Also, in the present embodiment, air cooling heat abstractor 2 ' equally can pass through the temperature sensor 25 ' that is arranged on thermal transfer plate B with Thermal transfer plate B temperature is detected, and sensing signal is sent to control unit (not shown), and then to control gas pump 22 ' Running, to reach the purpose of temperature adjusting, position and the related company of control system that these right temperature sensors 25 ' are set Connect relation and make flowing mode and be described in detail in previous embodiment, therefore repeated no more in this.

Dissipated please refer to the air cooling that Fig. 6 A, Fig. 6 B, Fig. 7 and Fig. 8, Fig. 6 A and 6B are respectively the preferred embodiment of this case first The gas pump of thermal is in the decomposition texture schematic diagram of different visual angles, and Fig. 7 is the piezoelectric actuated of the gas pump shown in Fig. 6 A and 6B The cross-sectional view of device, and the cross-sectional view that Fig. 8 is the gas pump shown in Fig. 6 A and 6B.Such as Fig. 6 A, 6B, 7 And shown in 8, the gas pump 22 of air cooling heat abstractor 2 is for a piezoelectric actuated gas pump, and including inlet plate 221, resonance plate 222nd, the structure such as piezo-activator 223, insulating trip 2241,2242 and conducting strip 225, wherein piezo-activator 223 is corresponded to Resonance plate 222 and set, and make inlet plate 221, resonance plate 222, piezo-activator 223, insulating trip 2241, conducting strip 225 and Another grade of insulating trip 2242 sequentially stacks setting, and its profile being completed is as shown in Figure 8.

In the present embodiment, inlet plate 221 has an at least air admission hole 221a, and wherein air admission hole 221a quantity is with 4 To be preferable, but it is not limited.Air admission hole 221a is through inlet plate 221, and atmospheric pressure is complied with from outside device to supplied gas Effect and from entrance 22a along along this at least an air admission hole 221a inflow gas pump 22.Converged on inlet plate 221 with least one Round 221b is flowed, is correspondingly arranged at least air admission hole 221a with another surface of inlet plate 221.In the round 221b that confluxes Center exchange at be that, with central recess 221c, and central recess 221c is connected with the round 221b that confluxes, whereby can be by Guide and conflux from least air admission hole 221a gases for entering the round 221b that confluxes and be concentrated to central recess 221c, to realize Gas is transmitted.In the present embodiment, inlet plate 221 has integrally formed air admission hole 221a, conflux round 221b and central fovea Portion 221c, and a chamber that confluxes for confluxing gas is correspondingly formed at central recess 221c, it is temporary with supplied gas.In some realities Apply in example, the material of inlet plate 221 can be constituted by such as, but not limited to stainless steel.In other embodiments, by this The depth of the chamber that confluxes constituted at central recess 221c is identical with the depth for the round 221b that confluxes, but is not limited.Altogether The piece 222 that shakes is made up of a flexible materials, but is not limited, and on resonance plate 222 have a hollow bore 2220, Correspond to the central recess 221c of inlet plate 221 and set, so that gas circulates.In other embodiments, resonance plate 222 It is that can be made up of a copper material, but is not limited.

Piezo-activator 223 is by a suspension board 2231, at least a housing 2232, a support 2233 and a piezoelectric patches 2234 assemble jointly, wherein, the piezoelectric patches 2234 is attached at the first surface 2231c of suspension board 2231, to apply Voltage produces deformation to drive the flexural vibrations of suspension board 2231, and an at least support 2233 is to be connected to suspension board 2231 And between housing 2232, in the present embodiment, the support 2233 is connected between suspension board 2231 and housing 2232, Its two-end-point is to be connected to housing 2232, suspension board 2231, to provide resilient support, and in support 2233, suspension board An at least space 2235 is had more between 2231 and housing 2232, an at least space 2235 is connected with air guide end opening 202 It is logical, to supplied gas circulation.It is emphasized that the kenel and quantity of suspension board 2231, housing 2232 and support 2233 not with Previous embodiment is limited, and can change according to practical application request.In addition, housing 2232 is to surround to be arranged at outside suspension board 2231 Side, and the conductive connecting pin 2232c with an outside projection, to the use for connection of powering, but are not limited.

Suspension board 2231 is the structure (as shown in Figure 7) for a cascaded surface, is implied that in the second surface of suspension board 2231 2231b has more a convex portion 2231a, and convex portion 2231a can be but not be limited to a circular protrusions structure.The convex portion of suspension board 2231 2231a is the second surface 2232a coplines with housing 2232, and the second surface 2231b and support 2233 of suspension board 2231 Second surface 2233a be also copline, and the convex portion 2231a and the second surface 2232a of housing 2232 of the suspension board 2231 It is that there is a certain depth between the second surface 2231b of suspension board 2231 and the second surface 2233a of support 2233.Suspend The first surface 2231c of plate 2231, it is with the first surface 2232b of housing 2232 and the first surface 2233b of support 2233 Smooth coplanar structure, and piezoelectric patches 2234 is then attached at the first surface 2231c of this smooth suspension board 2231.In another In some embodiments, the kenel of suspension board 2231 also can be a two-sided smooth tabular square structure, be not limited thereto, can Appoint according to situation is actually applied and apply change.In some embodiments, suspension board 2231, support 2233 and housing 2232 are can The structure being formed in one, and can be made up of a metallic plate, such as, but not limited to stainless steel is constituted.Again in other In embodiment, the length of side of piezoelectric patches 2234 is less than the length of side of the suspension board 2231.In other embodiments, piezoelectric patches 2234 length of side is equal to the length of side of suspension board 2231, and same design is the square tabular knot corresponding with suspension board 2231 Structure, but be not limited thereto.

Insulating trip 2241, conducting strip 225 and another insulating trip 2242 of gas pump 22 are sequentially to be correspondingly arranged in piezoelectricity cause Under dynamic device 223, and its form approximately corresponds to the form of the housing 2232 of piezo-activator 223.In some embodiments, Insulating trip 2241,2242 is made up of isolation material, such as, but not limited to plastic cement, in order to offer insulation function.In other realities Apply in example, conducting strip 225 can be made up of conductive material, such as, but not limited to metal material, function is conducted to provide.Yu Ben In embodiment, a conductive connecting pin 225a also can be set on conducting strip 225, function is conducted to realize.

In the present embodiment, gas pump 22 is sequentially by inlet plate 221, resonance plate 222, piezo-activator 223, insulating trip 2241st, conducting strip 225 and another insulating trip 2242 etc. are stacked and formed, and are tools between resonance plate 222 and piezo-activator 223 There is a gap h, be the gap h between the periphery of housing 2232 of resonance plate 222 and piezo-activator 223 in the present embodiment In insert a filling material, such as, but not limited to conducting resinl so that the suspension board 2231 of resonance plate 222 and piezo-activator 223 Convex portion 2231a between can maintain gap h depth, and then air-flow can be guided more quickly flow, and because of suspension board 2231 Convex portion 2231a and resonance plate 222 keep the suitable distance interference that makes to be in contact with each other to reduce, promoting noise to produce can be lowered.In In other embodiments, also can by the housing 2232 for increasing piezo-activator 223 height so that it is 222 groups with resonance plate Increase by a gap during dress, but be not limited.

In the present embodiment, resonance plate 222 has an a movable part 222a and fixed part 222b, when inlet plate 221, resonance Piece 222 at movable part 222a with inlet plate 221 thereon with that after piezo-activator 223 sequentially corresponding assembling, can be collectively forming One chamber for confluxing gas, and a first chamber 220 is more formed between resonance plate 222 and piezo-activator 223, it is configured to temporarily store Gas, and first chamber 220 be through resonance plate 222 hollow bore 2220 and with the central recess 221c of inlet plate 221 Chamber be connected, and the both sides space 2235 then between the support 2233 of piezo-activator 223 of first chamber 220 and with The air guide end opening 202 being arranged under it is connected.

Fig. 9 A to 9E are the flowage structure figure of the gas pump start shown in Fig. 6 A and 6B.Fig. 8, Fig. 9 A to Fig. 9 E are referred to, The start process description of the gas pump of this case is as follows.When gas pump 22 carries out start, piezo-activator 223 is by voltage actuation It is fulcrum with support 2233, carries out the reciprocating vibration of vertical direction.As shown in 9A figures, when piezo-activator 223 is by voltage Actuating and when vibrating downwards, due to resonance plate 222 be for light, thin laminated structure, be with when piezo-activator 223 vibrates, Resonance plate 222 also can with resonance and carry out vertical reciprocating vibration, the as corresponding central recess 221c of resonance plate 222 portion Point also can with flexural vibrations deformation, i.e. the part of correspondence central recess 221c is the movable part 222a for resonance plate 222, is With when piezo-activator 223 is bent downwardly vibration, now the corresponding central recess 221c of resonance plate 222 movable part 222a can be because Gas is brought into and pushed and drive that piezo-activator 223 vibrates, and as piezo-activator 223 is bent downwardly vibration shape Become, then an at least air admission hole 221a of the gas on inlet plate 221 enters, and confluxes round 221b to be pooled to through at least one Center central recess 221c at, then via the hollow bore 2220 being correspondingly arranged on resonance plate 222 with central recess 221c to Under flow into first chamber 220.Thereafter, due to being driven by the vibration of piezo-activator 223, resonance plate 222 also can be total to Shake and carry out vertical reciprocating vibration, as shown in 9B figures, now the movable part 222a of resonance plate 222 also with downwards shake It is dynamic, and attach on the convex portion 2231a of the suspension board 2231 for contacting at piezo-activator 223, make the convex portion 2231a of suspension board 2231 The spacing of the chamber that confluxes between region in addition and the fixed part 222b of the both sides of resonance plate 222 will not diminish, and common by this Shake the deformation of piece 222, to compress the volume of first chamber 220, and close the middle flow space of first chamber 220, promote in it Gas push and flowed to both sides, and then passed through downwards by the space 2235 between the support 2233 of piezo-activator 223 Flowing.Afterwards, as shown in Figure 9 C, the movable part 222a of resonance plate 222 is bent upwards vibration deformation, and returns back to initial position, And piezo-activator 223 is driven to vibrate upwards by voltage, the volume of so same extruding first chamber 220, only now due to Piezo-activator 223 is upward lifting, so that the gas in first chamber 220 can flow towards both sides, and then drives gas Constantly enter from least air admission hole 221a on inlet plate 221, then flow into the chamber that central recess 221c is formed.It Afterwards, as shown in 9D figures, the resonance plate 222 is resonated upwards by the vibration of the upward lifting of piezo-activator 223, now resonance plate 222 movable part 222a also with upward vibration, and then mitigation of gases is constantly from least air admission hole on inlet plate 221 221a enters, then flows into the chamber that central recess 221c is formed.Finally, as shown in fig. 9e, the movable part of resonance plate 222 222a also returns back to initial position.Thus implement aspect and understand that, when resonance plate 222 carries out vertical reciprocating vibration, being can By its gap h between piezo-activator 223 to increase the ultimate range of its vertical displacement, in other words, in two structure Between set gap h that resonance plate 222 can be made to produce upper and lower displacement by a larger margin when resonance.Therefore through this gas pump Barometric gradient is produced in 22 runner design, makes gas flow at high rates, and enters the resistance difference of outgoing direction through runner, by gas Transmitted by suction side to outlet side, to complete gas conveying operation, in the state of outlet side has air pressure, still have the ability to hold It is continuous to push air into air guide end chamber 23a, and Jing Yin effect is can reach, the gas pump 22 for so repeating 9A to 9E figures is made It is dynamic, you can gas pump 22 is produced the gas transport of an ecto-entad.

From the above, through the start of above-mentioned gas pump 22, gas is imported into carrier from the air guide end opening 202 of carrier 20 In 20 chamber 201, then discharged by exhaust end opening 203, and gas is sent to scrollwork air-flow via channel connector 23 and dissipated In the scrollwork gas channel 211a of hot device 21, to form a scrollwork quick flow, and to a thermal source, for example：Electronic component A or Thermal transfer plate B carries out heat exchange, and the air-flow after heat exchange is discharged via the exhaust port 210a of scrollwork airflow radiating device 21 It is outside to air cooling heat abstractor 2, whereby to improve the efficiency of cooling, and then increase electronic component A performance stability And the life-span.

Please refer to the structural representation of Figure 10 and Figure 11, Figure 10 for the air cooling heat abstractor of the preferred embodiment of this case the 3rd Figure, Figure 11 is the structural representation of the scrollwork airflow radiating device of the air cooling heat abstractor shown in Figure 10.As shown in Figure 10, air cooling dissipates Thermal 3 is included：Two carrier 30 as one kind A, 30B, scrollwork airflow radiating device 31, two gas pump 32A, 32B, two channel connector 33A, 33B, wherein two carrier 30 as one kind A, 30B, two gas pump 32A, 32B, two channel connector 33A, 33B are identical and mutual correspondence The structure of setting, it is, gas pump identical with the structure of the carrier 20,20 ' of foregoing two embodiment to imply that each carrier 30 as one kind A, 30B 32A, 32B are also identical with the gas pump 22,22 ' of previous embodiment, and certain channel connector 33A, 33B, which are also similarly, is communicated in load Line construction between body 30A, 30B and scrollwork airflow radiating device 31, but be not limited.Only in the present embodiment, two carriers 30A, 30B are the two opposite sides for being correspondingly arranged in electronic component A respectively, and respectively include air guide end opening 302a, 302b and exhaust End opening 303a, 303b；And scrollwork airflow radiating device 31 be attach be arranged on electronic component A, and by two conductor wires 311, 312 (as shown in Figure 11) formed scroll, and covered thereon to constitute with a pair of scrollwork gas channel with heat-conducting plate 310 311a, 312a (as shown in Figure 11) structure；And the two gas pump 32A, 32B be fixedly arranged on respectively its corresponding carrier 30 as one kind A, On 30B, and each correspondence closing carrier 30 as one kind A, 30B air guide end opening 302a, 302b, and it is jointly fixed with carrier 30 as one kind A, 30B respectively Justice forms chamber 301a, 301b；And two channel connector 33A, 33B be connected to its corresponding carrier 30 as one kind A, 30B row Between gas end opening 303a, 303b and double scrollwork gas channel 311a, 312a of scrollwork airflow radiating device 31, to be sent gas； By driving two gas pump 32A, 32B, to be sent gas to carrier 30 as one kind A, 30B chamber 301a, 301b respectively, and by carrier 30A, 30B exhaust end opening 303a, 303b discharge, are sent to scrollwork air-flow by gas via channel connector 33A, 33B and dissipate In double scrollwork gas channel 311a, 312a of hot device 31, to form double scrollwork quick flows, and hot friendship is carried out to electronic component A Change, and arranged the air-flow after heat exchange is carried out with electronic component A via the exhaust end opening 310a of scrollwork airflow radiating device 31 Go out.

As shown in Figures 10 and 11, the scrollwork airflow radiating device 31 of this case be by the conductor wires 311 of heat-conducting plate 310 and two, 312 are constituted, and the center of wherein heat-conducting plate 310 is provided with exhaust port 310a, are flowed out to supplied gas, and two conductor wires 311st, 312 correspondences bend to scroll, and assembling corresponding with heat-conducting plate 310, and then have double scrollwork gas channels to constitute 311a, 312a structure, this couple of scrollwork gas channel 311a, 312a are that have two introducing port 311c, 312c and two center-sides 311b, 312b, two introducing port 311c, 312c are connections corresponding with channel connector 33A, 33B, and two center-sides respectively 311b, 312b then correspond to the exhaust port 310a in the center of heat-conducting plate 310 jointly.In the present embodiment, scrollwork airflow radiating device The conditions such as 31 assembling set-up mode and its dimensional height are similar with previous embodiment, therefore repeat no more.Whereby, setting is worked as , then can be by gas respectively through its corresponding load after the two gas pump 32A, 32B of electronic component A two opposite sides are piezoelectric actuated Body 30A, 30B exhaust end opening 303a, 303b and be sent to two channel connector 33A, 33B, then be each sent to scrollwork Two introducing port 311c, 312c of airflow radiating device 31, and gas is formed double whirlpools in this couple of scrollwork gas channel 311a, 312a Roll up quick flow, in order to can directly to electronic component A carry out heat exchange, and will with the electronic component A progress heat exchange after air-flow Discharged via the exhaust end opening 310a of scrollwork airflow radiating device 31.Well imagine, this pair of scrollwork quick flow is compared to single whirlpool Volume quick flow more can rapidly, efficiently take away the heat energy produced by electronic component A, be with through the present embodiment two gas of setting Body pump 32A, 32B and the scrollwork airflow radiating device 31 with double scrollwork gas channel 311a, 312a, then it is more effective to lift gas The cooling efficiency of cooling and radiation device 3.

Figure 12 is referred to, it is the structural representation of the air cooling heat abstractor of the preferred embodiment of this case the 4th.Such as Figure 12 institutes Show, air cooling heat abstractor 3 ' equally includes two carrier 30 as one kind A ', 30B ', scrollwork airflow radiating device 31 ', two gas pump 32A ', 32B ' And two channel connector 33A ', 33B ', wherein two carrier 30 as one kind A ', 30B ' be also correspondingly arranged in the two relative of electronic component A Side, and respectively include air guide end opening 302a ', 302b ' and exhaust end opening 303a ', 303b '；Scrollwork airflow radiating device 31 ' also by Heat-conducting plate 310 ' and two conductor wires 311 ', 312 ' are constituted, and with double scrollwork gas channel 311a ', 312a '；Gas pump 32A ', 32B ' are also fixedly arranged on its corresponding carrier 30 as one kind A ', 30B ' respectively, and respectively with carrier 30 as one kind A ', 30B ' common definitions Form chamber 301a ', 301b '；And two channel connector 33A ', 33B ' are connected to its corresponding carrier 30 as one kind A ', 30B ' Exhaust end opening 303a ', 303b ' and scrollwork airflow radiating device 31 ' double scrollwork gas channel 311a ', 312a ' between；It is So that in the present embodiment, two carrier 30 as one kind A ', 30B ', scrollwork airflow radiating device 31 ', two gas pump 32A ', 32B ' and two lead to Road connector 33A ', 33B ' structure and annexation are substantially identical with previous embodiment, only in the present embodiment, scrollwork air-flow Radiator 31 ' is disposed on the heat conducting material that electronic component A is contacted, i.e. thermal transfer plate B, implies that it is non-directly to set It is placed on electronic component A, but electronic component A and its thermal transfer plate B connected is collectively treated as thermal source, and by scrollwork air-flow Radiator 31 ' is arranged on thermal transfer plate B, to carry out heat exchange.

Therefore in the present embodiment, after two gas pump 32A ', 32B ' are piezoelectric actuated, being can be by air-flow respectively via two loads Body 30A ', 30B ' air guide end opening 302a ', 302b ' are imported in chamber 302a ', 302b ', then by exhaust end opening 303a ', 303b ' is discharged, and gas is sent into the double of scrollwork airflow radiating device 31 ' via two channel connector 33A ', 33B ' respectively In scrollwork gas channel 311a ', 312a ', to form double scrollwork quick flows, and to the thermal transfer plate B as heat conducting material Heat exchange is carried out, the electronic component A heat penetrations produced are crossed into thermal transfer plate B carries out heat exchange, and the air-flow after heat exchange is passed through Discharged by the exhaust port 310a ' of scrollwork airflow radiating device 31 ', in order to the radiating realized to electronic component A and thermal transfer plate B.

From these foregoing embodiments, the air cooling heat abstractor of this case mainly through gas pump arrange in pairs or groups corresponding carrier and Channel connector forms scrollwork quick flow, and then thermal source is forced to deliver the gas in scrollwork airflow radiating device Radiate, so position, its form, size ... set by the quantity or scrollwork airflow radiating device of the gas pump set by it etc., It can appoint according to situation is actually applied and apply change, be not limited with foregoing implementation aspect.And no matter implement in which in aspect, It is both transparent for setting temperature sensor near heating sources, to monitor heat source temperature, and is sustainably fed back to the sensing signal In control unit, to carry out corresponding control to gas pump, and then the temperature of electronic equipment internal electronic component can be effectively adjusted Degree.

In summary, this case provides a kind of air cooling heat abstractor, and it can be applied to various electronic equipments with to its inside Electronic element radiating, and scrollwork quick flow is can pass through with the circulating pressure of the thermal source progress of the heat production to electronic equipment internal Radiating, in order to heat radiation efficiency, reduces noise, and the performance of electronic equipment internal electronic component is stablized and is extended using the longevity Life.In addition, the air cooling heat abstractor of this case there is light, thin, small volume, it is easy to set up in slimming and miniaturized electronic devices Advantage, and it has more function of temperature control, and temperature change that can be according to electronic equipment internal electronic component controls the fortune of gas pump Make, in order to the service life of heat radiation efficiency, and extension heat abstractor.

This case appointed as person familiar with the technology apply craftsman think and be it is all as modify, so neither take off such as attached claim Be intended to Protector.

【Symbol description】

11：Electronic component

12：Thermal transfer plate

13：Heat-conducting glue

2、2’、3、3’：Air cooling heat abstractor

20、20’、30A、30B、30A’、30B’：Carrier

201、201’、301a、301b、301a’、301b’：Chamber

202、202’、302a、302b、302a’、302b’：Air guide end opening

203、203’、303a、303b、303a’、303b’：It is vented end opening

21、21’、31、31’：Scrollwork airflow radiating device

210、210’、310、310’：Heat-conducting plate

210a、210a’、310a、310a’：Exhaust port

211、211’、311、312、311’、312’：Conductor wires

211a、211a’：Scrollwork gas channel

211b、311b、312b：Center-side

211c、311c、312c：Introducing port

22、22’、32A、32B、32A’、32B’：Gas pump

22a：Entrance

220：First chamber

221：Inlet plate

221a：Air admission hole

221b：Conflux round

221c：Central recess

222：Resonance plate

222a：Movable part

222b：Fixed part

2220：Hollow bore

223：Piezo-activator

2231：Suspension board

2231a：Convex portion

2231b：Second surface

2231c：First surface

2232：Housing

2232a：Second surface

2232b：First surface

2232c：Conductive connecting pin

2233：Support

2233a：Second surface

2233b：First surface

2234：Piezoelectric patches

2235：Space

2241、2242：Insulating trip

225：Conducting strip

225a：Conductive connecting pin

23、23’、33A、33B、33A’、33B’：Channel connector

24：Control unit

25、25’：Temperature sensor

26：Thermal source

311a、312a、311a’、312a’：Double scrollwork gas channels

A：Electronic component

A1：The first surface of electronic component

A2：The second surface of electronic component

B：Thermal transfer plate

B1：The first surface of thermal transfer plate

B2：The second surface of thermal transfer plate

C：Heat-conducting glue

Claims (10)

1. a kind of air cooling heat abstractor, to an electronic element radiating, it is characterised in that include：

One carrier, is arranged at the side of the electronic component, and including an air guide end opening and an exhaust end opening；

One scrollwork airflow radiating device, is attached on the electronic component, and it forms scroll by a conductor wires, and with a heat-conducting plate Covering thereon, an exhaust port is provided with to constitute the structure with a scrollwork gas channel, on the heat-conducting plate, with corresponding to A center-side inside the scrollwork gas channel；

One gas pump, is fixedly arranged on the carrier, and closes the air guide end opening, and forms a chamber with the carrier common definition； And

One channel connector, is connected to the exhaust end opening of the carrier and the scrollwork gas channel of the scrollwork airflow radiating device Between, to be sent gas；

By the gas pump is driven, gas is sent to the chamber of the carrier, and discharged by the exhaust end opening of the carrier, warp Gas is sent in the scrollwork gas channel of the scrollwork airflow radiating device by the channel connector, it is quick to form a scrollwork Air-flow, and heat exchange is carried out to the electronic component, and the air-flow after heat exchange will be carried out with the electronic component via the scrollwork gas The exhaust port discharge of flow heat dissipation device.

2. air cooling heat abstractor as claimed in claim 1, it is characterised in that the gas pump is a piezoelectric actuated gas pump.

3. air cooling heat abstractor as claimed in claim 2, it is characterised in that the piezoelectric actuated gas pump includes：

One inlet plate, confluxes with an at least air admission hole, at least one and round and constitutes a central recess for confluxing chamber, wherein An at least air admission hole is for importing air-flow, the corresponding air admission hole of the round that confluxes, and guides the air-flow of the air admission hole to converge into this The chamber that confluxes that central recess is constituted；

One resonance plate, with a hollow hole corresponding to around the chamber that confluxes, and the hollow hole be a movable part；And

One piezo-activator, it is corresponding with the resonance plate to set；

Wherein, between the resonance plate and the piezo-activator there is a gap to form a chamber, so that the piezo-activator is driven When dynamic, air-flow is imported by an at least air admission hole for the inlet plate, the central recess be collected to through at least one round that confluxes, The hollow hole of the resonance plate is passed through, to enter in the chamber, is produced by the movable part of the piezo-activator and the resonance plate Resonance transfer air-flow.

4. air cooling heat abstractor as claimed in claim 3, it is characterised in that it is conductive that the piezoelectric actuated gas pump also includes one Piece, one first insulating trip and one second insulating trip, the wherein inlet plate, the resonance plate, the piezo-activator, first insulation Piece, the conducting strip and second insulating trip sequentially stack setting.

5. air cooling heat abstractor as claimed in claim 3, it is characterised in that the piezo-activator is included：

One suspension board, with a first surface and a second surface, and flexible vibration；

One housing, around the outside for being arranged at the suspension board；

An at least support, is connected between the suspension board and the housing, to provide resilient support；And

One piezoelectric patches, with a length of side, the length of side is less than or equal to a length of side of the suspension board, and the piezoelectric patches is to be attached at On one first surface of the suspension board, to apply voltage to drive the suspension board flexural vibrations.

6. air cooling heat abstractor as claimed in claim 5, it is characterised in that the suspension board is a square suspension board, and is had There is a convex portion.

7. air cooling heat abstractor as claimed in claim 1, it further includes a control system, and the control system includes：

One control unit, is electrically connected to the gas pump, to control the gas pump to operate；And

One temperature sensor, is electrically connected to the control unit and is adjacent to the electronic component, to sense a temperature of the electronic component Degree, and a sensing signal is exported to the control unit；

Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the electronic component is more than a temperature door During threshold value, the control unit makes the gas pump enable, to drive air current flow, and when the control unit is in receiving the sensing Signal, and when judging the temperature of the electronic component less than the temperature threshold value, the control unit makes the gas pump decommission.

8. a kind of air cooling heat abstractor, to an electronic element radiating, it is characterised in that include：

One carrier, is arranged at the side of the electronic component, and including an air guide end opening and an exhaust end opening；

One scrollwork airflow radiating device, is attached on the heat conducting material that the electronic component is contacted, it is by a conductor wires shape Into scroll, and with heat-conducting plate covering thereon, set with constituting on the structure with a scrollwork gas channel, the heat-conducting plate There is an exhaust port, with corresponding to the center-side inside the scrollwork gas channel；

One gas pump, is fixedly arranged on the carrier, and closes the air guide end opening, and forms a chamber with the carrier common definition； And

One channel connector, is connected to the exhaust end opening of the carrier and the scrollwork gas channel of the scrollwork airflow radiating device Between, to be sent gas；

By the gas pump is driven, gas is sent to the chamber of the carrier, and discharged by the exhaust end opening of the carrier, warp Gas is sent in the scrollwork gas channel of the scrollwork airflow radiating device by the channel connector, it is quick to form a scrollwork Air-flow, and heat exchange is carried out to the heat conducting material, the heat penetration that the electronic component is produced crosses the heat conducting material and carries out heat Exchange, and the air-flow after heat exchange is discharged via the exhaust port of the scrollwork airflow radiating device.

9. a kind of air cooling heat abstractor, for an electronic element radiating, it is characterised in that include：

Two carriers, are arranged at the two opposite sides of the electronic component, and respectively include an air guide end opening and an exhaust end opening；

One scrollwork airflow radiating device, is attached on the electronic component, and it forms scroll by two conductor wires, and with a heat-conducting plate Covering thereon, is provided with an exhaust port, with correspondence to constitute on the structure with a pair of scrollwork gas channel, the heat-conducting plate A center-side inside this pair of scrollwork gas channel；

Two gas pumps, are fixedly arranged on its corresponding carrier respectively, and each correspondence closes the air guide end opening of the carrier, and Respectively with the carrier common definition one chamber of formation；And

Two channel connectors, are connected to the exhaust end opening of its corresponding carrier and being somebody's turn to do for the scrollwork airflow radiating device Between double scrollwork gas channels, to be sent gas；

By the two gas pump is driven, to be sent gas to the chamber of the carrier respectively, and opened by the exhaust end of the carrier Gas, is sent in this pair of scrollwork gas channel of the scrollwork airflow radiating device, with shape by mouth discharge via the channel connector Into a pair of scrollwork quick flow, and heat exchange is carried out to electronic component, and the air-flow after heat exchange will be carried out with the electronic component Discharged via the exhaust port of the scrollwork airflow radiating device.

10. a kind of air cooling heat abstractor, to an electronic element radiating, it is characterised in that include：

Two carriers, are arranged at the two opposite sides of the electronic component, and respectively include an air guide end opening and an exhaust end opening；

One scrollwork airflow radiating device, is attached on the heat conducting material that the electronic component is contacted, it is by two conductor wires Scroll is formed, and with heat-conducting plate covering thereon, to constitute on the structure with a pair of scrollwork gas channel, the heat-conducting plate An exhaust port is provided with, with corresponding to the center-side inside this pair of scrollwork gas channel；

Two gas pumps, are fixedly arranged on its corresponding carrier respectively, and each correspondence closes the air guide end opening of the carrier, and Respectively with the carrier common definition one chamber of formation；And

Two channel connectors, are connected to the exhaust end opening of its corresponding carrier and being somebody's turn to do for the scrollwork airflow radiating device Between double scrollwork gas channels, to be sent gas；

By the two gas pump is driven, to be sent gas to the chamber of the carrier respectively, and opened by the exhaust end of the carrier Gas, is sent in this pair of scrollwork gas channel of the scrollwork airflow radiating device, with shape by mouth discharge via the channel connector Heat exchange is carried out into a pair of scrollwork quick flow, and to the heat conducting material, the heat penetration that the electronic component is produced crosses the heat Conductive material carries out heat exchange, and the air-flow after heat exchange is discharged via the exhaust port of the scrollwork airflow radiating device.