CN108281401A - Three-dimensional chip integrated circuit cooling system - Google Patents
Three-dimensional chip integrated circuit cooling system Download PDFInfo
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- CN108281401A CN108281401A CN201710006786.1A CN201710006786A CN108281401A CN 108281401 A CN108281401 A CN 108281401A CN 201710006786 A CN201710006786 A CN 201710006786A CN 108281401 A CN108281401 A CN 108281401A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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Abstract
This case provides a kind of three-dimensional chip integrated circuit cooling system, to radiate to three-dimensional chip integrated circuit.Three-dimensional chip integrated circuit is to be stacked with by main core lamella and multiple intermediate core lamellas, and have multiple flow microchannels.Three-dimensional chip integrated circuit cooling system includes carrier and fluid pump.Carrier is correspondingly arranged in the side of three-dimensional chip integrated circuit, has and imports end opening, discharge end opening and fluid channel.Fluid pump is fixedly arranged on carrier, and closes importing end opening.The fluid for by driven fluid pump, fluid being imported by importing end opening, being discharged by discharge end opening by fluid channel, and discharge end opening is made to be discharged flows into the flow microchannel of three-dimensional chip integrated circuit, and heat exchange is carried out with intermediate core lamella or host lamella.
Description
【Technical field】
This case is espespecially a kind of to provide driving fluid stream using fluid pump about a kind of three-dimensional chip integrated circuit cooling system
The dynamic three-dimensional chip integrated circuit cooling system to radiate.
【Background technology】
With the development of science and technology various electronic equipments such as portable computer, tablet computer, industrial computer, portable logical
Device, audio and video player etc. are interrogated towards lightening, portable and dynamical trend development, these electronic equipments are limited in its
Various high integrations or high-power electronic component must be configured in inner space, in order to make the arithmetic speed of electronic equipment faster
With it is with better function, the electronic component of electronic equipment internal will generate more thermal energy when running, and lead to high temperature.In addition,
These electronic equipments are largely all designed as frivolous, the flat and compact external form of tool, and not additional inner space is for radiating
It is cooling, therefore the electronic component in electronic equipment is vulnerable to the influence of thermal energy, high temperature, and then the problems such as cause interference with or be damaged.
In recent years since, three-dimensional chip integrated circuit (3D IC) has been widely utilized in smart mobile phone or tablet computer
In equal portable electronic products.Three-dimensional chip integrated circuit is made of multiple two-dimentional chips, is to utilize wire bonding skill
Art is engaged, such as：(WAFER-LEVEL PACKAGING, WLP), stacked package stacking is laminated in wafer-level packaging
Technologies such as (PAKAGE ON PACKAGE, POP) by multiple wire bondings between each two-dimentional chip, then penetrate multiple chips
Stacked in multi-layers is constituted.The size of three-dimensional chip integrated circuit is minimum, and with slimming, light weight and cost is low, performance is high,
The advantages that battery consumption is low and speed is fast.
The cooling integrated mode of traditional three-dimensional chip is through setting Heat Conduction Material on three-dimensional chip integrated circuit
It radiates, such as：Graphite flake, sheet metal, heat pipe or other Heat Conduction Materials etc..However, radiating mode above-mentioned is to belong to
The heat dissipation of passive type, merely with heat transfer and free convection to reach heat dissipation effect, radiating efficiency is poor, cannot be satisfied application
Demand.
In view of this, it is really necessary to develop a kind of three-dimensional chip integrated circuit cooling system, to solve prior art institute face
The problem of facing.
【Invention content】
This case is designed to provide a kind of three-dimensional chip integrated circuit cooling system, can be applied to various electronics and sets
It is standby, it is radiated with the three-dimensional chip integrated circuit to electronic equipment internal, in order to heat radiation efficiency, reduces noise, and make electricity
The performance of sub- equipment interior three-dimensional chip integrated circuit is stable and prolongs the service life.
In order to achieve the above object, a broader implementation pattern of this case is to provide a kind of three-dimensional chip integrated circuit cooling system
System, to radiate to three-dimensional chip integrated circuit, three-dimensional chip integrated circuit is by main core lamella and multiple intermediate chips
Layer is stacked with, with multiple contacts between each adjacent intermediate core lamella and between host lamella and intermediate core lamella
Lead electrical communication, and make to form fluid between each adjacent intermediate core lamella and between host lamella and intermediate core lamella
Microchannel, three-dimensional chip integrated circuit cooling system include：Carrier is correspondingly arranged in the side of three-dimensional chip integrated circuit, tool
Have and imports end opening, discharge end opening and fluid channel；And fluid pump, it is fixedly arranged on carrier, and close importing end opening,
In by driven fluid pump, fluid is imported by importing end opening, is discharged by discharge end opening by fluid channel, and make row
The fluid for going out end opening discharge flows into each flow microchannel of three-dimensional chip integrated circuit, with intermediate core lamella and host lamella
Carry out heat exchange.
In order to achieve the above object, another broader implementation pattern of this case is to provide a kind of three-dimensional chip integrated circuit cooling system
System, to radiate to three-dimensional chip integrated circuit, three-dimensional chip integrated circuit is by main core lamella and multiple intermediate chips
Layer is stacked with, with multiple contacts between each adjacent intermediate core lamella and between host lamella and intermediate core lamella
Lead electrical communication, and make to form fluid between each adjacent intermediate core lamella and between host lamella and intermediate core lamella
Microchannel, three-dimensional chip integrated circuit cooling system include：Carrier is adjacent to the side of three-dimensional chip integrated circuit, has and leads
Enter end opening, discharge end opening and fluid channel；Shell rubber moulding, including inlet opening, outflow opening and accommodating space, shell glue
Mould the cover closes three-dimensional chip integrated circuit, and three-dimensional chip integrated circuit is made to be set to accommodating space, and wherein inlet opening corresponds to
It is arranged and is communicated in discharge end opening；And fluid pump, it is fixedly arranged on carrier, and close importing end opening, wherein by driving
Fluid pump is imported fluid by importing end opening, and shell glue is flowed by discharge end opening and inlet opening by fluid channel
The accommodating space of mould, then make fluid by three-dimensional chip integrated circuit each flow microchannel flow into, with intermediate core lamella and
Host lamella carries out heat exchange, and the fluid after carry out heat exchange is made to be flowed out via multiple flow microchannels, by shell rubber moulding
It is external that outflow opening is expelled to three-dimensional chip integrated circuit.
In order to achieve the above object, another broader implementation pattern of this case is to provide a kind of three-dimensional chip integrated circuit cooling system
System, to radiate to three-dimensional chip integrated circuit, three-dimensional chip integrated circuit is by main core lamella and multiple intermediate chips
Layer is stacked with, with multiple contacts between each adjacent intermediate core lamella and between host lamella and intermediate core lamella
Lead electrical communication, and make to form fluid between each adjacent intermediate core lamella and between host lamella and intermediate core lamella
Microchannel, three-dimensional chip integrated circuit cooling system include：Carrier is adjacent to the side of three-dimensional chip integrated circuit, has and leads
Enter end opening, discharge end opening and fluid channel, is opened wherein discharge end opening is correspondingly arranged and is communicated in the inflow of shell rubber moulding
Mouthful；Shell rubber moulding, including inlet opening and accommodating space, shell rubber moulding the cover closes three-dimensional chip integrated circuit, makes three-dimensional core
Piece integrated circuit is set to accommodating space, and wherein inlet opening is correspondingly arranged and is communicated in discharge end opening；Fluid pump is fixedly arranged on
On carrier, and close importing end opening；And fluid reservoir, it closes and is communicated in fluid pump, to store fluid；Its
In, by driven fluid pump, fluid is imported into end opening by fluid reservoir, is opened by outlet side by fluid channel
Mouth flows into the inlet opening of shell rubber moulding, and fluid is then made to be flowed by each flow microchannel of three-dimensional chip integrated circuit, with
Intermediate core lamella and host lamella carry out heat exchange, stop operating by fluid pump, make the fluid reflux after carry out heat exchange extremely
In fluid reservoir.
【Description of the drawings】
Figure 1A is the structural schematic diagram of the three-dimensional chip integrated circuit cooling system of the first preferred embodiment of this case.
Figure 1B is the cross-sectional view of three-dimensional chip integrated circuit cooling system shown in figure 1A.
Fig. 2A and 2B is respectively the fluid pump of the first preferred embodiment of this case in the decomposition texture schematic diagram of different visual angles.
Fig. 3 is the cross-sectional view of piezoelectric actuator shown in Fig. 2A and 2B.
Fig. 4 is the cross-sectional view of fluid pump shown in Fig. 2A and 2B.
Fig. 5 A to 5E are the flowage structure figure of fluid pump start shown in Fig. 2A and 2B.
Fig. 6 is the configuration diagram of the control system of the three-dimensional chip integrated circuit cooling system of the first preferred embodiment of this case.
Fig. 7 is the structural schematic diagram of the three-dimensional chip integrated circuit cooling system of the first preferred embodiment of this case.
Fig. 8 A are the structural schematic diagram of the three-dimensional chip integrated circuit cooling system of this case second embodiment.
Fig. 8 B are the cross-sectional view of three-dimensional chip integrated circuit cooling system shown in Fig. 8 A.
Fig. 8 C are the configuration diagram of the control system of the three-dimensional chip integrated circuit cooling system of this case second embodiment.
Fig. 9 A are the structural schematic diagram of the three-dimensional chip integrated circuit cooling system of this case 3rd embodiment.
Fig. 9 B are the cross-sectional view of three-dimensional chip integrated circuit cooling system shown in Fig. 9 A.
Fig. 9 C are the configuration diagram of the control system of the three-dimensional chip integrated circuit cooling system of this case 3rd embodiment.
【Specific implementation mode】
Embodying some exemplary embodiments of this case features and advantages will in detail describe in the explanation of back segment.It should be understood that
This case can have various variations in different aspects, all not depart from the range of this case, and explanation therein and diagram
It is illustrated as being used in itself, and nand architecture is in limitation this case.
A and Figure 1B is please referred to Fig.1, Figure 1A is the three-dimensional chip integrated circuit cooling system of the first preferred embodiment of this case
Structural schematic diagram and the cross-sectional view that Figure 1B is three-dimensional chip integrated circuit cooling system shown in figure 1A.Such as figure
Shown in 1A and 1B, the three-dimensional chip integrated circuit cooling system 1 of this case can be applied to an electronic equipment, can such as, but not limited to take
Formula computer, tablet computer, industrial computer, portable communication device, audio and video player, with to three-dimensional to be radiated in electronic equipment
Chip integrated circuit 2 radiates.Figure 1B is the diagrammatic cross-section in the sections AA for Figure 1A.Three-dimensional chip integrated circuit 2 is to set
It is placed on substrate 3, and is adjacent to three-dimensional chip integrated circuit cooling system 1.Three-dimensional chip integrated circuit 2 is by main core lamella 20
It is stacked with multiple intermediate core lamellas 21, between each adjacent intermediate core lamella 21 and among host lamella 20 and one
With 22 electrical communication of multiple contact leads between chip layer 21, and make between each adjacent intermediate core lamella 21 and host lamella
20 and one form flow microchannel 23 between intermediate core lamella 21.The three-dimensional chip integrated circuit cooling system 1 of this case includes to carry
Body 11 and fluid pump 12, wherein carrier 11 include to import end opening 13, discharge end opening 14 and fluid channel 15.Fluid pump 12
It is to be fixedly arranged on carrier 11, and assembling is positioned at and imports end opening 13, and close the importing end opening 13.Wherein by driving
Fluid pump 12 is imported fluid by importing end opening 13, is discharged by discharge end opening 14 by fluid channel 15, and make discharge
The fluid that end opening 14 is discharged flows into each flow microchannel 23 of three-dimensional chip integrated circuit 2, with multiple intermediate core lamellas 21
And one host lamella 21 carry out heat exchange, in order to realizing heat dissipation to three-dimensional chip integrated circuit 2.
In this present embodiment, carrier 11 is to be connected with group by multiple partition board 16 and formed, and the definition of multiple partition boards 16 is formed
Import end opening 13, discharge end opening 14 and fluid channel 15.Fluid pump 12 is fixedly arranged on the partition board 16 of carrier 11.Carrier 11
It is to be disposed adjacent in the side of three-dimensional chip integrated circuit 2, and be discharged that end opening 14 is corresponding with three-dimensional chip integrated circuit 2 to be set
It sets.In this present embodiment, it is for a gas to carry out cooling fluid, but not limited to this, can be according to required heat dissipation
Effect is adjusted.
In this present embodiment, fluid pump 12 be for a piezoelectric actuated fluid pump, to drive fluid to flow, by fluid by
The outside of three-dimensional chip integrated circuit cooling system 1 is imported via end opening 13 is imported in fluid channel 15.When fluid pump 12 will
When fluid imports fluid channel 15, the rapid flow of fluid in fluid channel 15 is pushed, and be discharged via discharge end opening 14, institute
Discharge fluid flows into the flow microchannel 23 of the adjacent three-dimensional chip integrated circuit 2 set, is led with multiple intermediate core lamellas 21 and one
Bigpian layer 20 carry out heat exchange, and promote the fluid after heat exchange by flow microchannel 23 drain into three-dimensional chip integrated circuit 2 it
It is external.Since fluid pump 12 is continuously start to import fluid, make three-dimensional chip integrated circuit 2 that can continuously be carried out with fluid
Heat exchange, while the fluid after heat exchange being made to be discharged by flow microchannel 23, it can be realized whereby to three-dimensional chip integrated circuit 2
Heat dissipation, and heat dissipation can be improved, and then increase performance stability and the service life of three-dimensional chip integrated circuit 2.
Please refer to Fig. 2A to Fig. 4, Fig. 2A and 2B are respectively that the fluid pump of the first preferred embodiment of this case is regarded in difference
The decomposition texture schematic diagram at angle, Fig. 3 are that the cross-sectional view of piezoelectric actuator and Fig. 4 shown in Fig. 2A and 2B are figure
The cross-sectional view of fluid pump shown in 2A and 2B.As shown in the figure of 2A, 2B, 3 and 4, fluid pump 12 is caused for a piezoelectricity
Dynamic fluid pump, and include a deflector 121, a resonance plate 122, a piezoelectric actuator 123, two insulating trip 124a, 124b and one
The structures such as conductive sheet 125, wherein piezoelectric actuator 123 corresponds to resonance plate 122 and is arranged, and makes deflector 121, resonance plate
122, piezoelectric actuator 123, insulating trip 124a, conductive sheet 125 and another insulating trip 124b etc. sequentially stack setting, and group installs
At sectional view be as shown in Figure 4.
In this present embodiment, deflector 121 has an at least deflector hole 121a, and wherein the quantity of deflector hole 121a is with 4
To be preferable, but not limited to this.Deflector hole 121a is through deflector 121, with for fluid from outside device via this at least one
In deflector hole 121a incoming fluids pump 12.On deflector 121 have at least one confluence round 121b, to deflector 121
At least a deflector hole 121a is correspondingly arranged for this of another surface.It is with central recess at the center exchange of confluence round 121b
121c, and central recess 121c is connected with confluence round 121b, whereby can will at least a deflector hole 121a enters remittance from this
The fluid of stream round 121b, which guides and converges, is concentrated to central recess 121c, to realize that fluid transmits.In this present embodiment, water conservancy diversion
Plate 121 has integrally formed deflector hole 121a, confluence round 121b and central recess 121c, and is at central recess 121c
It is correspondingly formed the confluence chamber of a confluence fluid, so that fluid is temporary.In some embodiments, the material of deflector 121 can be
Such as, but not limited to stainless steel is constituted.In other embodiments, by the confluence constituted at central recess 121c
The depth of chamber is identical as the confluence depth of round 121b, and but not limited to this.Resonance plate 122 is by a flexible materials institute structure
At but not limited to this, and in having a hollow bore 122c on resonance plate 122, corresponds to the central recess of deflector 121
121c and be arranged so that fluid circulate.In other embodiments, resonance plate 122 be can be made of a copper material, but not with
This is limited.
Piezoelectric actuator 123 is by a suspension board 1231, an outline border 1232, at least a holder 1233 and a piezoelectric patches
1234 assemble jointly, wherein the piezoelectric patches 1234 is attached at the first surface 1231c of suspension board 1231, to apply
Voltage generate deformation with drive 1231 bending vibration of suspension board and this at least a holder 1233 is to be connected to suspension board 1231
And between outline border 1232, in this present embodiment, which be connected between suspension board 1231 and outline border 1232,
Its two-end-point is to be connected to outline border 1232, suspension board 1231, to provide resilient support, and in holder 1233, suspension board
An at least gap 1235 is had more between 1231 and outline border 1232, which be connected with importing end opening 13
It is logical, led to for fluid stream.It is emphasized that suspension board 1231, the kenel of outline border 1232 and holder 1233 and quantity not with
Previous embodiment is limited, and can change according to practical application request.In addition, outline border 1232 is to surround to be set to except suspension board 1231
Side, and the conductive connecting pin 1232c with an outside projection, to for electrical connection, but not limited to this.
Suspension board 1231 is the structure (as shown in Figure 3) for a cascaded surface, is implied that in the second surface of suspension board 1231
1231b has more a protrusion 1231a, and protrusion 1231a can be but not be limited to a circular protrusions structure.The protrusion of suspension board 1231
1231a is, and the second surface 1231b and holder 1233 of suspension board 1231 coplanar with the second surface 1232a of outline border 1232
Second surface 2233a be also coplanar, and the second surface 1232a of the protrusion 1231a of the suspension board 1231 and outline border 1232
It is that there is a certain depth between the second surface 1231b of suspension board 1231 and the second surface 1233a of holder 1233.It suspends
The first surface 1231c of plate 1231 is with the first surface 1232b of outline border 1232 and the first surface 1233b of holder 1233
Smooth coplanar structure, and piezoelectric patches 1234 is then attached at the first surface 1231c of this smooth suspension board 1231.In another
In some embodiments, the kenel of suspension board 1231 also can be a two-sided smooth plate square structure, be not limited thereto, can
Appoint according to situation is actually applied and apply variation.In some embodiments, suspension board 1231, holder 1233 and outline border 1232 are can
It is integrally formed structures, and can be made of a metallic plate, such as, but not limited to stainless steel is constituted.Again in other
In embodiment, the length of side of piezoelectric patches 1234 is less than the length of side of the suspension board 1231.In other embodiments, piezoelectric patches
1234 length of side is equal to the length of side of suspension board 1231, and same design is square plate knot corresponding with suspension board 1231
Structure, but be not limited thereto.
Insulating trip 124a, conductive sheet 125 and another insulating trip 124b of fluid pump 12 are sequentially to be correspondingly arranged in piezoelectricity cause
Under dynamic device 123, and its form approximately corresponds to the form of the outline border 1232 of piezoelectric actuator 123.In some embodiments,
Insulating trip 124a, 124b are made of isolation material, such as, but not limited to plastic cement, in order to offer insulation function.In other realities
It applies in example, conductive sheet 125 can be made of conductive material, such as, but not limited to metal material, and function is conducted to provide.Yu Ben
In embodiment, a conductive connecting pin 125a can be also set on conductive sheet 125, function is conducted to realize.
In this present embodiment, fluid pump 12 is sequentially by deflector 121, resonance plate 122, piezoelectric actuator 123, insulating trip
124a, conductive sheet 125 and another insulating trip 124b etc. are stacked, and are tools between resonance plate 122 and piezoelectric actuator 123
There is a gap h, is the gap h between resonance plate 122 and 1232 periphery of outline border of piezoelectric actuator 123 in this present embodiment
One filling material of middle filling, such as, but not limited to conducting resinl, so that the suspension board 1231 of resonance plate 122 and piezoelectric actuator 123
Protrusion 1231a between can maintain the depth of gap h, and then fluid can be guided and more quickly flowed, and because of suspension board 1231
Protrusion 1231a and resonance plate 122 keep the suitable distance interference that makes to be in contact with each other to reduce, promote noise generation that can be lowered.In
It, also can be by the height for the outline border 1232 for increasing piezoelectric actuator 123, so that it is 122 groups with resonance plate in other embodiments
Increase by a gap when dress, but not limited to this.
In this present embodiment, after deflector 121, resonance plate 122 are with the sequentially corresponding assembling of piezoelectric actuator 123, in altogether
The piece 122 that shakes has and can be collectively formed with deflector 121 thereon at a movable part 122a and a fixed part 122b, movable part 122a
The chamber of one confluence fluid, and a first chamber 120 is more formed between resonance plate 122 and piezoelectric actuator 123, it is configured to temporarily store
Fluid, and first chamber 120 be hollow bore 122c through resonance plate 122 and at the central recess 121c of deflector 121
Chamber be connected, and the both sides of first chamber 120 then by the gap 1235 between the holder 1233 of piezoelectric actuator 123 and with
The importing end opening 13 being set under it is connected.
Fig. 5 A to 5E are the flowage structure figure of fluid pump start shown in Fig. 2A and 2B.Fig. 4, Fig. 5 A to Fig. 5 E are please referred to,
The start process description of the fluid pump of this case is as follows.When fluid pump 12 carry out start when, piezoelectric actuator 123 by voltage actuation and
It is fulcrum with holder 1233, carries out the reciprocating vibration of vertical direction.As shown in Figure 5A, when piezoelectric actuator 123 is caused by voltage
It is dynamic and when vibrating downwards, be when piezoelectric actuator 123 vibrate, to be total to since resonance plate 122 is for light, thin laminated structure
Shake piece 122 also can with resonance and carry out vertical reciprocating vibration, as resonance plate 122 corresponds to the part of central recess 121c
Also can with bending vibration deformation, i.e. the part of correspondence central recess 121c is the movable part 122a for resonance plate 122, be with
When piezoelectric actuator 123 is bent downwardly vibration, the movable part 122a of the correspondence central recess of resonance plate 122 121c can be because of stream at this time
The drive of body brought into and pushed and piezoelectric actuator 123 vibrates, and as piezoelectric actuator 123 is bent downwardly vibration shape
Become, then fluid is entered by at least deflector hole 121a on deflector 121, and through at least one confluence round 121b to be pooled to
Center central recess 121c at, then via the hollow bore 122c being correspondingly arranged with central recess 121c on resonance plate 122 to
Under flow into first chamber 120.Thereafter, due to being driven by 123 vibration of piezoelectric actuator, resonance plate 122 also can be total to
Shake and carry out vertical reciprocating vibration, as shown in Figure 5 B, at this time the movable part 122a of resonance plate 122 also with downward vibration,
And attach contact at piezoelectric actuator 123 suspension board 1231 protrusion 1231a on, make the protrusion 1231a of suspension board 1231 with
The spacing of confluence chamber between the fixed part 122b of outer 122 both sides of region and resonance plate will not become smaller, and by this resonance
The deformation of piece 122 to compress the volume of first chamber 120, and is closed 120 middle flow space of first chamber, is promoted in it
Fluid is pushed to be flowed to both sides, and then passes through stream downwards by the gap 1235 between the holder 1233 of piezoelectric actuator 123
It is dynamic.Later, as shown in Figure 5 C, the movable part 122a of resonance plate 122 is bent upwards vibration deformation, and returns back to initial position, and
Piezoelectric actuator 123 is driven by voltage to vibrate upwards, the so same volume for squeezing first chamber 120, only at this time due to pressure
Electric actuator 123 is to be lifted upwards so that the fluid in first chamber 120 can be flowed towards both sides, and fluid constantly from
An at least deflector hole 121a on deflector 121 enters, then flows into central recess 121c and be formed by chamber.Later, as schemed
Shown in 5D, which is resonated upwards by the vibration that piezoelectric actuator 123 is lifted upwards, and resonance plate 122 is movable at this time
Portion 122a also with upward vibration, and then slow down fluid and constantly enter from at least deflector hole 121a on deflector 121, then
Central recess 121c is flowed into be formed by chamber.Finally, as shown in fig. 5e, the movable part 122a of resonance plate 122 is also returned back to
Initial position, thus state sample implementation is that can be caused by itself and piezoelectricity it is found that when resonance plate 122 carries out vertical reciprocating vibration
Gap h between dynamic device 123 is to increase the maximum distance of its vertical displacement, in other words, gap h is arranged between two structure
It can make resonance plate 122 that can generate upper and lower displacement by a larger margin when resonance.Therefore in the runner design through this fluid pump 12
Barometric gradient is generated, fluid high-speed is made to flow, and is transmitted to fluid by suction side into the resistance difference of outgoing direction through runner
Outlet side, even if in the state that outlet side has pressure, still has the ability persistently to push fluid into stream to complete fluid conveying operation
Body channel 15, and mute effect is can reach, so repeat 12 start of fluid pump of Fig. 5 A to 5E, you can fluid pump 12 is made to generate
The fluid of one ecto-entad transmits.
From the above, through the start of above-mentioned fluid pump 12, fluid channel 15 is directed fluid into and via discharge end opening
14 export fluid, make derived from fluid flow into the flow microchannel 23 of three-dimensional chip integrated circuit 2 and carry out heat exchange, and promote
Make the fluid after heat exchange that thermal energy to be quickly discharged to 1 outside of three-dimensional chip integrated circuit cooling system, whereby to improve heat dissipation
Cooling efficiency, and then increase performance stability and the service life of three-dimensional chip integrated circuit 2.
It is the three-dimensional chip integrated circuit cooling system of the first preferred embodiment of this case please refer to Fig. 6 and Fig. 7, Fig. 6
Control system configuration diagram, Fig. 7 be the first preferred embodiment of this case three-dimensional chip integrated circuit cooling system knot
Structure schematic diagram.As shown in fig. 6, in other embodiments, three-dimensional chip integrated circuit cooling system 1 has more function of temperature control,
Imply that it more may include control system 10, but not limited to this.Control system 10 includes control unit 101 and temperature sensor
102, wherein control unit 101 is electrically connected with fluid pump 12, to control the running of fluid pump 12.Temperature sensor 102 is can
It is neighbouring to be set to around three-dimensional chip integrated circuit 2 (position i.e. as shown in Figure 7), or be that can be attached directly to three-dimensional
The temperature of three-dimensional chip integrated circuit 2, setting side are sensed on the host lamella 20 or intermediate core lamella 21 of chip integrated circuit 2
Formula is not limited.Temperature sensor 102 is electrically connected to control unit 101, the temperature of sensing three-dimensional chip integrated circuit 2
Degree, and sensing signal is transmitted to control unit 101.Sensing signal of the control unit 101 according to temperature sensor 102 judges
Whether the temperature of three-dimensional chip integrated circuit 2 is higher than a temperature threshold value, when control unit 101 judges the integrated electricity of the three-dimensional chip
When the temperature on road 2 is higher than the temperature threshold value, a control signal is sent out to fluid pump 12, is operated with enable fluid pump 12, whereby
Fluid pump 12 is set to drive fluid flowing to carry out cooling to three-dimensional chip integrated circuit 2, so that three-dimensional chip integrated circuit 2
Cooling simultaneously reduces temperature.When control unit 101 judges that the temperature of the three-dimensional chip integrated circuit 2 is less than the temperature threshold value
When, it sends out a control signal and can avoid 12 continued operation of fluid pump to stop the running of fluid pump 12 to fluid pump 12 whereby and lead
Reduced lifetime is caused, the consume of additional energy is reduced.Therefore through the setting of control system 10, make three-dimensional chip integrated circuit
The fluid pump 12 of cooling system 1 can carry out cooling when three-dimensional chip 2 temperature overheating of integrated circuit, and in three-dimensional chip collection
It stops operating after being reduced at 2 temperature of circuit, can avoid 12 continued operation of fluid pump whereby and lead to reduced lifetime, reduce additional
The consume of energy can also be such that three-dimensional chip integrated circuit 2 is operated under a preferred temperature environment, improve three-dimensional chip integrated circuit
2 stability.
Also, in some embodiments, the control unit 101 of control system 10 is the input voltage dimension of controllable fluid pump 12
A specific voltage is held, so that fluid pump 12 is exported maximum pressure, in order to reaching best radiating efficiency；Alternatively, the control of control system 10
Unit 101 also can control fluid pump 12 to accelerate driving or deceleration, so that fluid pump 12 is driven according to the demand of heat dissipation, borrows
The system temperature Detection ＆ Controling of this control system 10, and can avoid fluid pump 12 and continue working at high speed and lead to reduced lifetime,
The consume of additional energy is reduced, three-dimensional chip integrated circuit 2 can also operated under a preferred temperature environment, improves three-dimensional core
The stability of piece integrated circuit 2.
Please refer to the structure for the three-dimensional chip integrated circuit cooling system that Fig. 8 A and Fig. 8 B, Fig. 8 A are this case second embodiment
Schematic diagram and the cross-sectional view that Fig. 8 B are three-dimensional chip integrated circuit cooling system shown in Fig. 8 A.Such as Fig. 8 A and
Shown in Fig. 8 B, Fig. 8 B are the diagrammatic cross-section in the sections AA of Fig. 8 A, and the three-dimensional chip integrated circuit cooling system 4 of the present embodiment is also
To radiate to three-dimensional chip integrated circuit 2.Three-dimensional chip integrated circuit cooling system 4 includes carrier 41, fluid pump 42
And shell rubber moulding 47.Carrier 41 is the side for being adjacent to the three-dimensional chip integrated circuit 2, has and imports end opening 43, discharge
End opening 44 and fluid channel 45, wherein carrier 41 are to be connect for 46 groups by multiple partition boards, and define and import end opening 43, row
Go out end opening 44 and fluid channel 45.Fluid pump 42 is to be fixedly arranged on carrier 41, and close and import end opening 43, the wherein fluid
Pump 42 is imported in end opening 43 to direct fluid into for piezoelectric actuated fluid pump.Due to the carrier 41 and stream of the present embodiment
The structure of body pump 42, element are identical as the carrier of this case first embodiment and fluid pump as function, therefore are repeated no more in this.Only in
In the present embodiment, three-dimensional chip integrated circuit cooling system 4 further includes shell rubber moulding 47, and shell glued membrane 47 is closed to the cover
The three-dimensional chip integrated circuit 2.Shell glued membrane 47 includes inlet opening 47a, outflow opening 47b and accommodating space 47c, wherein flowing
Enter the discharge end opening 44 that the 47a that is open is correspondingly arranged and is communicated in carrier 41.By driven fluid pump 42, by fluid by importing
End opening 43 imports, and flows into the accommodating sky of shell rubber moulding 47 by discharge end opening 44 and inlet opening 47a by fluid channel 45
Between 47c, and fluid is made to flow into each flow microchannel 23 of three-dimensional chip integrated circuit 2, with multiple intermediate core lamellas 21 and
One host lamella 21 carries out heat exchange, and keeps the fluid after heat exchange three-dimensional via the outflow opening 47b discharges of shell rubber moulding 47
Except chip integrated circuit cooling system 4, in order to the heat dissipation realized to three-dimensional chip integrated circuit 2.
In addition, in this present embodiment, three-dimensional chip integrated circuit cooling system 4 more may include filtration system 48, filtering system
System 48 includes filter 48a, communicating pipe 48b and shell 48c.Shell 48c is closed according to lid in fluid pump 42, and defines one
The inner space 48d of inner space 48d, shell 48c are connected with fluid pump 42.Communicating pipe 48b be for but not to be limited to one hollow
The connectivity structure of tubulose is communicated between filter 48a and the inner space 48d of shell 48c.Filter 48a be for but it is unlimited
For a pneumatic filter, to be filtered to fluid.After wherein fluid is filtered via filter 48a, make filtered
Fluid is flowed into via communicating pipe 48b in the inner space 48d of shell 48c, then by fluid pump 42 by filtered fluid by interior
Portion space 48d is imported in end opening 43, so that filtered fluid radiates to three-dimensional chip integrated circuit 2.By
Filtration system 48 is set, fluid is made first to be filtered before radiating to three-dimensional chip integrated circuit 2, to avoid dust or is hanged
Floating particle is piled up in three-dimensional chip integrated circuit 2 or fluid pump 42, in order to heat radiation efficiency and element service life.Yu Benshi
It applies in example, is for a gas to carry out cooling fluid, but not limited to this, can be adjusted according to required heat dissipation effect
It is whole.
In other embodiments, filtration system 48 further includes filter screen 49.Filter screen 49 is can be but not be limited to one not
Become rusty steel filter screen, to close the outflow opening 47b for being set to shell glued membrane 47, to be filtered to fluid.In being dissipated
During heat is cooling, the pressure change that the accommodating space 47c of shell glued membrane 47 will produce, easily lead to filtered fluid by
In outflow opening 47b adverse currents to the accommodating space 47c of shell glued membrane 47.Therefore filter screen 49 is set in outflow by further closing
It is open on 47b, can avoid filtered fluid by outflow opening 47b adverse currents to the accommodating space 47c of shell glued membrane 47, in order to
Heat radiation efficiency and element service life.
It is the three-dimensional chip integrated circuit cooling system of this case second embodiment please refer to Fig. 8 A to Fig. 8 C, Fig. 8 C
The configuration diagram of control system.As shown, in some embodiments, three-dimensional chip integrated circuit cooling system 4 also has
Function of temperature control, and include a control system 40, which includes control unit 401 and temperature sensor 402, wherein controlling
Unit 401 processed is electrically connected with fluid pump 42, to control the running of fluid pump 42.Temperature sensor 402 is disposed on shell glue
The accommodating space 47c of film 47, and be arranged adjacent to around three-dimensional chip integrated circuit 2, or it is attached directly to three-dimensional core
The temperature of three-dimensional chip integrated circuit 2 is sensed on the host lamella 20 or intermediate core lamella 21 of piece integrated circuit 2.Temperature sensor
402 are electrically connected to control unit 401, the temperature of sensing three-dimensional chip integrated circuit 2, and sensing signal is transmitted to control list
Member 401.Sensing signal of the control unit 401 according to temperature sensor 402, judge three-dimensional chip integrated circuit 2 temperature whether
Higher than a temperature threshold value, when control unit 401 judges that the temperature of the three-dimensional chip integrated circuit 2 is higher than the temperature threshold value
When, a control signal is sent out to fluid pump 42, is operated with enable fluid pump 42, and fluid pump 42 is made to drive fluid flowing with right whereby
Three-dimensional chip integrated circuit 2 carries out cooling, so that 2 cooling of three-dimensional chip integrated circuit and reducing temperature.Work as control
When unit 401 judges that the temperature of the three-dimensional chip integrated circuit 2 is less than the temperature threshold value, a control signal is sent out to fluid pump
42, to stop the running of fluid pump 42, it can avoid 42 continued operation of fluid pump whereby and lead to reduced lifetime, reduce additional energy
Consume.Therefore through the setting of control system 40, make the fluid pump 42 of three-dimensional chip integrated circuit cooling system 1 in three-dimensional
Cooling can be carried out when 2 temperature overheating of chip integrated circuit, and stops fortune after the reduction of 2 temperature of three-dimensional chip integrated circuit
Make, can avoid 42 continued operation of fluid pump whereby and lead to reduced lifetime, reduce the consume of additional energy, can also make three-dimensional core
Piece integrated circuit 2 operates under a preferred temperature environment, improves the stability of three-dimensional chip integrated circuit 2.
Similarly, control unit 401 is also electrically connected with filtration system 48.When fluid pump 42 starts operation, control is single
Member 401 sends a control signal to stream filtration system 48, and is driven through the filter 48a runnings of filter system 48, keeps fluid first
End opening 43 is imported via the filtering of stream filtration system 48 and then through fluid pump 42；When fluid pump 42 stops operating,
Control unit 401 sends a control signal to stream filtration system 48, and the filter 48a of stream filtration system 48 is made to stop operating.
Lead to reduced lifetime because of continuous operations to avoid stream filtration system 48 whereby, also can reach best cooling efficiency.
And the control unit 401 of control system 40 also can control the input voltage of fluid pump 42 to maintain a specific voltage,
Fluid pump 42 is set to export maximum pressure, in order to reaching best radiating efficiency；Alternatively, the control unit 401 of control system 40 is also controllable
Fluid pump 42 processed accelerates driving or deceleration, so that fluid pump 42 is driven according to the demand of heat dissipation, whereby control system 40
System temperature Detection ＆ Controling, and can avoid fluid pump 42 continue working at high speed and lead to reduced lifetime, reduce additional energy
The consume of amount can also be such that three-dimensional chip integrated circuit 2 is operated under a preferred temperature environment, improve three-dimensional chip integrated circuit 2
Stability.
Please refer to the structure for the three-dimensional chip integrated circuit cooling system that Fig. 9 A and Fig. 9 B, Fig. 9 A are this case 3rd embodiment
Schematic diagram and the cross-sectional view that Fig. 9 B are three-dimensional chip integrated circuit cooling system shown in Fig. 9 A.Such as Fig. 9 A and
Shown in Fig. 9 B, Fig. 9 B be Fig. 9 A in the diagrammatic cross-section in the sections AA, the three-dimensional chip integrated circuit cooling system 5 of the present embodiment is also
To radiate to the three-dimensional chip integrated circuit 2.Three-dimensional chip integrated circuit cooling system 5 includes carrier 51, fluid pump
52, shell rubber moulding 57 and fluid reservoir 59.Carrier 51 is the side for being adjacent to three-dimensional chip integrated circuit 2, has and leads
Entering end opening 53, discharge end opening 54 and fluid channel 55, carrier 51 is connect by 56 groups of multiple partition boards, with further fixed
Justice goes out to import end opening 53, discharge end opening 54 and fluid channel 55.Fluid pump 52 is to be fixedly arranged on carrier 51, and close importing
End opening 53, the wherein fluid pump 52 are imported in end opening 53 to direct fluid into for piezoelectric actuated fluid pump.Due to this
The carrier 51 of embodiment and the structure of fluid pump 52, element and function also with the carrier of this case first embodiment and fluid pump phase
Together, it therefore is repeated no more in this.Only in this present embodiment, three-dimensional chip integrated circuit cooling system 5 further include shell rubber moulding 57 and
Fluid reservoir 59.Shell rubber moulding 57 includes inlet opening 57a and accommodating space 57c, and the closing of 57 the cover of shell rubber moulding is three-dimensional
Chip integrated circuit 2, makes three-dimensional chip integrated circuit 2 be set to accommodating space 57c, and wherein inlet opening 57a is correspondingly arranged simultaneously
It is communicated in discharge end opening 54.Fluid reservoir 59 is closed and is communicated in fluid pump 52.Fluid reservoir 59 further includes storage
Deposit slot 59a, communicating pipe 59b and shell 59c.Shell 59c the covers are engaged in fluid pump 52, and define an inner space 59d, and
Inner space 59d is connected with fluid pump 52.Communicating pipe 59b be for but be not limited to the connectivity structure of a hollow tubular, be communicated in
Between accumulator tank 59a and the inner space 59d of shell 59c.Accumulator tank 59a is can be but not be limited to a closed hollow channel-shaped appearance
Structure is set, to store fluid.Wherein by driven fluid pump 52, the fluid of accumulator tank 59a will be placed in via communicating pipe
59b and inner space 59c imports end opening 53, and shell rubber moulding 57 is flowed by discharge end opening 54 by fluid channel 55
Inlet opening 57a then makes fluid be flowed by each flow microchannel 23 of three-dimensional chip integrated circuit 2, with each intermediate core
Lamella 21 or host lamella 20 carry out heat exchange.And stop operating by fluid pump 52, make the fluid reflux after carry out heat exchange
Into fluid reservoir 59, in order to the heat dissipation realized to three-dimensional chip integrated circuit 2.In this present embodiment, being cooled down
Fluid be for a gaseous coolant, such as：Gaseous coolant, air, hydrogen, carbon dioxide or inert gas etc.；Alternatively, with
With carry out cooling fluid be for a liquid coolant, such as：Liquid chlorofluorocarbons (CFCs) or other liquid refrigerants etc., but not
As limit, can be adjusted according to required heat dissipation effect.
Fig. 9 C are please referred to, Fig. 9 C are the control system of the three-dimensional chip integrated circuit cooling system of this case 3rd embodiment
Configuration diagram.In some embodiments, three-dimensional chip integrated circuit cooling system 5 also equally has function of temperature control, and includes
One control system 50, the control system 50 include control unit 501 and temperature sensor 502, and wherein control unit 501 is and stream
52 electrical connection of body pump, to control the running of fluid pump 52.Temperature sensor 502 is disposed on the accommodating space of shell glued membrane 57
57c, and be arranged adjacent to around three-dimensional chip integrated circuit 2, or it is attached directly to the master of three-dimensional chip integrated circuit 2
The temperature of three-dimensional chip integrated circuit 2 is sensed on Bigpian layer 20 or intermediate core lamella 21.Temperature sensor 502 is electrically connected to control
Unit 501 processed, the temperature of sensing three-dimensional chip integrated circuit 2, and sensing signal is transmitted to control unit 501.Control unit
501 sensing signal according to temperature sensor 502, judges whether the temperature of three-dimensional chip integrated circuit 2 is higher than a temperature threshold
Value sends out control letter when control unit 501 judges that the temperature of the three-dimensional chip integrated circuit 2 is higher than the temperature threshold value
Number to fluid pump 52, is operated with enable fluid pump 52, fluid pump 52 is made to drive fluid flowing with to the integrated electricity of three-dimensional chip whereby
Road 2 carries out cooling, so that 2 cooling of three-dimensional chip integrated circuit and reducing temperature.When control unit 501 judge this three
When tieing up the temperature of chip integrated circuit 2 less than the temperature threshold value, a control signal is sent out to fluid pump 52, to stop fluid pump
52 runnings, can avoid 52 continued operation of fluid pump whereby and lead to reduced lifetime, reduce the consume of additional energy, and make fluid
It is back in fluid reservoir 59.Therefore through the setting of control system 50, make three-dimensional chip integrated circuit cooling system 1
Fluid pump 52 can carry out cooling when three-dimensional chip 2 temperature overheating of integrated circuit, and in 2 temperature of three-dimensional chip integrated circuit
Degree stops operating after reducing, and can avoid 52 continued operation of fluid pump whereby and leads to reduced lifetime, reduces the consumption of additional energy
Damage, can also be such that three-dimensional chip integrated circuit 2 is operated under a preferred temperature environment, improve the stabilization of three-dimensional chip integrated circuit 2
Degree.
In some embodiments, the control unit 501 of control system 50 can also control the input voltage dimension of fluid pump 52
A specific voltage is held, so that fluid pump 52 is exported maximum pressure, in order to reaching best radiating efficiency；Alternatively, the control of control system 50
Unit 501 also can control fluid pump 52 to accelerate driving or deceleration, so that fluid pump 52 is driven according to the demand of heat dissipation, borrows
This can avoid fluid pump 52 and continues working at high speed and lead to reduced lifetime, reduces the consume of additional energy, can also make three-dimensional core
Piece integrated circuit 2 operates under a preferred temperature environment, improves the stability of three-dimensional chip integrated circuit 2.
In conclusion this case provides a kind of three-dimensional chip integrated circuit cooling system, various three-dimensional chips are can be applied to
Integrated circuit with to its inside intermediate core lamella or host lamella radiate, in order to heat radiation efficiency, reduce noise, and make three-dimensional
The performance of chip integrated circuit is stable and prolongs the service life.In addition, the three-dimensional chip integrated circuit cooling system of this case, tool
There is function of temperature control, the running of fluid pump can be controlled according to the inside temperature change of three-dimensional chip integrated circuit, is imitated in order to heat radiation
Can, and extend the service life of radiator.
This case appointed as person familiar with the technology apply craftsman think and be it is all as modify, it is so neither de- such as attached claim
Be intended to Protector.
【Symbol description】
1：Three-dimensional chip integrated circuit cooling system
10：Control system
101：Control unit
102：Temperature sensor
11：Carrier
12：Fluid pump
120：First chamber
121：Deflector
121a：Deflector hole
121b：Converge round
121c：Central recess
122：Resonance plate
122a：Movable part
122b：Fixed part
122c：Hollow bore
123：Piezoelectric actuator
1231：Suspension board
1231a：Protrusion
1231b：Second surface
1231c：First surface
1232：Outline border
1232a：Second surface
1232b：First surface
1232c：Conductive connecting pin
1233：Holder
1233a：Second surface
1233b：First surface
1234：Piezoelectric patches
1235：Gap
124a、124b：Insulating trip
125：Conductive sheet
125a：Conductive connecting pin
13：Import end opening
14：End opening is discharged
15：Fluid channel
16：Partition board
2：Three-dimensional chip integrated circuit
21：Intermediate core lamella
22：Contact lead
23：Flow microchannel
3：Substrate
4：Three-dimensional chip integrated circuit cooling system
40：Control system
401：Control unit
402：Temperature sensor
41：Carrier
42：Fluid pump
43：Import end opening
44：End opening is discharged
45：Fluid channel
46：Partition board
47：Shell glued membrane
47a：Inlet opening
47b：Outflow opening
47c：Accommodating space
48：Filtration system
48a：Filter
48b：Communicating pipe
48c：Shell
48d：Inner space
49：Filter screen
5：Three-dimensional chip integrated circuit cooling system
50：Control system
501：Control unit
502：Temperature sensor
51：Carrier
52：Fluid pump
53：Import end opening
54：End opening is discharged
55：Fluid channel
56：Partition board
57：Shell glued membrane
57a：Inlet opening
57c：Accommodating space
59：Fluid reservoir
59a：Accumulator tank
59b：Communicating pipe
59c：Shell
59d：Inner space
Claims (14)
1. a kind of three-dimensional chip integrated circuit cooling system, to radiate to a three-dimensional chip integrated circuit, feature exists
In the three-dimensional chip integrated circuit is stacked with by a main core lamella and multiple intermediate core lamellas, in each adjacent this
Between between chip layer and between the host lamella and the intermediate core lamella with multiple contact lead electrical communications, and make each phase
A flow microchannel is formed between the adjacent intermediate core lamella and between the host lamella and the intermediate core lamella, the three-dimensional core
Piece integrated circuit cooling system includes：
One carrier is correspondingly arranged in the side of the three-dimensional chip integrated circuit, have one import end opening, one discharge end opening and
One fluid channel；And
One fluid pump is fixedly arranged on the carrier, and closes the importing end opening, wherein by the fluid pump is driven, by fluid
It is imported by the importing end opening, the stream for being discharged by the discharge end opening by the fluid channel, and the discharge end opening being made to be discharged
Body flows into each flow microchannel of the three-dimensional chip integrated circuit, and heat is carried out with the intermediate core lamella and the host lamella
It exchanges.
2. three-dimensional chip integrated circuit cooling system as described in claim 1, which is characterized in that the carrier includes multiple partition boards
Group connects to form the fluid channel, the importing end opening and the discharge end opening to define.
3. three-dimensional chip integrated circuit cooling system as described in claim 1, which is characterized in that the fluid pump causes for a piezoelectricity
Dynamic fluid pump.
4. three-dimensional chip integrated circuit cooling system as claimed in claim 3, which is characterized in that the piezoelectric actuated fluid pump packet
It includes：
One deflector, with an at least deflector hole, at least one confluence round and the central recess for constituting a confluence chamber, wherein
For an at least deflector hole for importing fluid, which corresponds to the deflector hole, and the fluid of the deflector hole is guided to converge into this
The confluence chamber that central recess is constituted；
There is one resonance plate a hollow hole to correspond to the confluence chamber, and be a movable part around the hollow hole；And
One piezoelectric actuator, setting corresponding with the resonance plate；
Wherein, between the resonance plate and the piezoelectric actuator there is a gap to form a chamber, so that the piezoelectric actuator is driven
When dynamic, fluid is made to be imported by an at least deflector hole for the deflector, the central recess is collected to through at least one confluence round,
The hollow hole for passing through the resonance plate is generated with entering in the chamber by the movable part of the piezoelectric actuator and the resonance plate
Resonance transfer fluid.
5. three-dimensional chip integrated circuit cooling system as claimed in claim 4, which is characterized in that the piezoelectric actuator includes：
One suspension board has a first surface and a second surface, and flexible vibration；
One outline border, around the outside for being set to the suspension board；
An at least holder is connected between the suspension board and the outline border, to provide resilient support；And
One piezoelectric patches has a length of side, which is less than or equal to a length of side of the suspension board, and the piezoelectric patches is attached at this and hangs
On one first surface of kickboard, to apply voltage to drive the suspension board bending vibration.
6. three-dimensional chip integrated circuit cooling system as claimed in claim 5, which is characterized in that the suspension board is a square
Suspension board, and there is a protrusion.
7. three-dimensional chip integrated circuit cooling system as claimed in claim 4, which is characterized in that the piezoelectric actuated fluid pump packet
Include a conductive sheet, two insulating trips, wherein the deflector, the resonance plate, the piezoelectric actuator, the insulating trip, the conductive sheet and another
One insulating trip is sequentially to stack setting.
8. three-dimensional chip integrated circuit cooling system as described in claim 1, which is characterized in that the three-dimensional chip integrated circuit
Cooling system further includes a control system, which includes：
One control unit is electrically connected to the fluid pump, to control fluid pump running；And
One temperature sensor is electrically connected to the control unit and is adjacent to the three-dimensional chip integrated circuit, to sense the three-dimensional core
One temperature of piece integrated circuit is to export a sensing signal to the control unit；
Wherein, when the control unit is in receiving the sensing signal, and judge that the temperature of the three-dimensional chip integrated circuit is more than
When one temperature threshold value, which makes the fluid pump enable, to drive fluid to flow, and works as the control list
Member is when receiving the sensing signal, and judge that the temperature of the three-dimensional chip integrated circuit is less than the temperature threshold value, the control
Unit processed makes the fluid pump stop operating.
9. three-dimensional chip integrated circuit cooling system as claimed in claim 8, which is characterized in that the control unit can control this
The input voltage of fluid pump maintains a specific voltage, and the fluid pump is made to export maximum pressure.
10. three-dimensional chip integrated circuit cooling system as claimed in claim 8, which is characterized in that the control module is controllable should
Fluid pump accelerates driving or deceleration.
11. a kind of three-dimensional chip integrated circuit cooling system, to radiate to a three-dimensional chip integrated circuit, the three-dimensional core
Piece integrated circuit is stacked with by a main core lamella and multiple intermediate core lamellas, between each adjacent intermediate core lamella
And with multiple contact lead electrical communications between the host lamella and the intermediate core lamella, and make each adjacent intermediate core
A flow microchannel is formed between lamella and between the host lamella and the intermediate core lamella, the three-dimensional chip integrated circuit is cold
But system includes：
One carrier is adjacent to the side of the three-dimensional chip integrated circuit, has one to import end opening, a discharge end opening and one stream
Body channel；
One shell rubber moulding, including an inlet opening, an outflow opening and an accommodating space, which closes the three-dimensional
Chip integrated circuit makes three-dimensional chip integrated circuit be set to the accommodating space, and wherein the inlet opening is correspondingly arranged and is connected to
In the discharge end opening；And
One fluid pump is fixedly arranged on the carrier, and closes the importing end opening, wherein by the fluid pump is driven, by fluid
It is imported by the importing end opening, being somebody's turn to do for the shell rubber moulding is flowed by the discharge end opening and the inlet opening by the fluid channel
Accommodating space then makes fluid be flowed by each flow microchannel of the three-dimensional chip integrated circuit, with the intermediate core lamella
And the host lamella carries out heat exchange, and the fluid after carry out heat exchange is made to be flowed out via multiple flow microchannel, by this
It is external that the outflow opening of shell rubber moulding is expelled to the three-dimensional chip integrated circuit.
12. three-dimensional chip integrated circuit cooling system as claimed in claim 11, which is characterized in that the integrated electricity of the three-dimensional chip
Line cooling system includes a filtration system, which includes a shell, a connecting pipe and a filter, and the housings close is simultaneously
Connection is set in the fluid pump, and defines an inner space, which be communicated between the filter and the shell, should
Filter is to be filtered fluid, and wherein fluid is filtered via the filter, and filtered fluid is via the connection
Pipe flows into the inner space of the shell, then filtered fluid is imported the importing by the inner space by the fluid pump
End opening.
13. three-dimensional chip integrated circuit cooling system as claimed in claim 12, which is characterized in that the filtration system includes one
Filter screen, closing are set to the outflow opening.
14. a kind of three-dimensional chip integrated circuit cooling system, to radiate to a three-dimensional chip integrated circuit, feature exists
In the three-dimensional chip integrated circuit is stacked with by a main core lamella and multiple intermediate core lamellas, and each adjacent is somebody's turn to do
With multiple contact lead electrical communications between intermediate core lamella and the host lamella and the intermediate core lamella, and make each adjacent
The intermediate core lamella between and the host lamella and the intermediate core lamella between form a flow microchannel, the three-dimensional chip
Integrated circuit cooling system includes：
One carrier is adjacent to the side of the three-dimensional chip integrated circuit, has one to import end opening, a discharge end opening and one stream
Body channel, wherein the discharge end opening are correspondingly arranged and are communicated in the inlet opening of the shell rubber moulding；
One shell rubber moulding, including an inlet opening and an accommodating space, which closes the integrated electricity of the three-dimensional chip
Road makes three-dimensional chip integrated circuit be set to the accommodating space, and wherein the inlet opening is correspondingly arranged and is communicated in the outlet side
Opening；
One fluid pump is fixedly arranged on the carrier, and closes the importing end opening；And
The fluid pump is closed and be communicated in one fluid reservoir, to store fluid；
Wherein, by the fluid pump is driven, fluid is imported into the importing end opening by the fluid reservoir, passes through the fluid
Channel is flowed into the inlet opening of the shell rubber moulding by the discharge end opening, then makes fluid by the three-dimensional chip integrated circuit
Each flow microchannel flows into, and carries out heat exchange with the intermediate core lamella and the host lamella, stops by the fluid pump
Running, makes in the fluid reflux to fluid reservoir after carry out heat exchange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710006786.1A CN108281401A (en) | 2017-01-05 | 2017-01-05 | Three-dimensional chip integrated circuit cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710006786.1A CN108281401A (en) | 2017-01-05 | 2017-01-05 | Three-dimensional chip integrated circuit cooling system |
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| Publication Number | Publication Date |
|---|---|
| CN108281401A true CN108281401A (en) | 2018-07-13 |
Family
ID=62800379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710006786.1A Pending CN108281401A (en) | 2017-01-05 | 2017-01-05 | Three-dimensional chip integrated circuit cooling system |
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| Country | Link |
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| CN (1) | CN108281401A (en) |
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| CN110621145A (en) * | 2019-10-08 | 2019-12-27 | 珠海格力电器股份有限公司 | Heat dissipation method and system for sealed cabinet |
| CN111151310A (en) * | 2018-11-07 | 2020-05-15 | 研能科技股份有限公司 | Micro-channel structure |
| US11478794B2 (en) | 2018-11-07 | 2022-10-25 | Micro Jet Technology Co., Ltd. | Micro channel structure |
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Application publication date: 20180713 |