CN212910536U - Liquid cooling heat dissipation module and electronic equipment - Google Patents

Abstract

The utility model belongs to the technical field of the cooling system technique and specifically relates to a liquid cooling heat dissipation module and electronic equipment, including at least one power pump, the power pump configuration is on heat dissipation return circuit's runner, the power pump with the runner all forms to the paster structure, and the runner includes runner layer and panel layer, the runner layer includes the base plate and forms guiding gutter on the base plate, the panel layer includes at least one deck panel, the panel closing cap the guiding gutter to the runner can form to the paster structure, makes things convenient for the miniaturized design of product.

Description

Liquid cooling heat dissipation module and electronic equipment

Technical Field

The utility model relates to a cooling system technical field, specific field is a liquid cooling heat dissipation module and electronic equipment.

Background

With the vigorous development in the fields of microelectronics, micromachines, micro-optics and the like and the development and application of large-scale and super-large-scale integrated circuits, the power consumption of products is continuously increased, and the problems of heat conduction and heat dissipation in narrow spaces are increasingly prominent.

The current heat dissipation technology mainly includes metal heat dissipation, air-cooled heat dissipation, liquid-cooled heat dissipation, and gas-liquid phase change heat dissipation, wherein the liquid cooling is better to provide higher cooling power by using the circulation working medium thereof far larger than the unit volume heat capacity of gas, and will also become the mainstream heat dissipation mode in the future heat dissipation field. The liquid cooling heat radiation system of the single-phase liquid working medium only utilizes sensible heat of liquid, fully utilizes latent heat of the working medium based on phase change heat transfer of the liquid working medium, can rapidly and uniformly distribute heat at a heat source to a heat radiation surface of a radiator, and has better heat transfer and heat radiation effects.

The existing single-phase liquid cooling heat dissipation module basically comprises a power pump, a radiator, a heat exchanger (a liquid storage tank) and a pipeline, and meanwhile, in order to reduce noise, the power pump mostly adopts a centrifugal pump, the heat dissipation module is large in size and not easy to arrange a narrow heat dissipation space, and a passive liquid cooling heat dissipation system based on liquid working medium phase change generally comprises a heat absorber, an evaporation cavity, a condensation cavity, a liquid storage cavity and a liquid absorption core. The active liquid cooling heat dissipation system based on the phase change of the liquid working medium introduces a driving device or replaces a liquid suction core with the driving device, the structure is looser and more complex, and the microminiaturization process is difficult.

SUMMERY OF THE UTILITY MODEL

The invention aims to provide a liquid cooling heat dissipation module to solve the problems of large volume and high microminiaturization process difficulty of a heat dissipation system in the prior art.

In order to achieve the above object, the utility model provides a following technical scheme: a liquid cooling heat dissipation module comprises at least one power pump, wherein the power pump is arranged on a flow channel of a heat dissipation loop, and the power pump and the flow channel are both formed into a patch structure.

According to an embodiment of the present invention, the power pump includes:

the pump cavity is provided with a fluid inlet and a fluid outlet which are communicated with the flow channel;

a vibration plate covering the pump chamber, the vibration plate pressing a fluid in the pump chamber by vibration;

the fluid valve is arranged at the fluid inlet and the fluid outlet of the pump cavity, the fluid valve arranged at the fluid inlet only supplies fluid to flow into the pump cavity in one direction, and the fluid valve arranged at the fluid outlet only supplies fluid to flow out of the pump cavity in one direction.

According to the utility model discloses an embodiment, the runner includes:

the flow channel layer comprises a substrate and a flow guide groove formed on the substrate;

the panel layer comprises at least one layer of panel, and the panel covers the diversion trench.

According to the utility model discloses an embodiment, be configured on the panel layer with the notes liquid mouth of runner intercommunication, it is sealed by the apron to annotate the liquid mouth.

According to the utility model discloses an embodiment, the guiding gutter is one at least.

According to the utility model discloses an embodiment, the guiding gutter is for passing through the groove, the panel layer includes first panel and second panel, the configuration between first panel and the second panel the runner layer, just first panel, second panel with pass through the groove cooperation and form the runner.

According to the utility model discloses an embodiment, the guiding gutter is the recess, the panel layer includes a panel, the panel with the recess cooperation forms the runner.

According to the utility model discloses an embodiment, the guiding gutter is for passing through groove and/or recess, the guiding gutter forms with the panel cooperation the runner.

According to the utility model provides an electronic equipment, including foretell liquid cooling system.

According to an embodiment of the present invention, the flow channel is attached to the electronic device to dissipate heat from its internal components.

Compared with the prior art, the invention has the beneficial effects that:

1) the power pump and the flow channel are designed to be of a patch structure, so that the miniaturization design of a product is facilitated;

2) the liquid-cooled heat dissipation module main body adopts a laminated film or thin plate structure, can be bent and shaped, ensures that a heat dissipation system is tightly attached to a surface heat source or a body heat source, and can effectively improve heat transfer and heat dissipation performance;

3) simple process, easy batch production and low cost.

Drawings

FIG. 1 is a schematic structural diagram of a power pump according to a first embodiment of the present invention;

FIG. 2 is a schematic diagram illustrating a suction state of the power pump according to the first embodiment of the present invention;

FIG. 3 is a schematic diagram illustrating a scheduling status of the power pump according to one embodiment of the present invention;

FIG. 4 is a schematic diagram of an integral vibrating plate structure according to a first embodiment of the present invention;

FIG. 5 is a schematic diagram of a split-type vibrating plate structure according to a first embodiment of the present invention;

FIG. 6 is a schematic structural view of an integral dual chamber pump according to a first embodiment of the present invention;

fig. 7 is a schematic structural diagram of a combined dual-chamber pump according to a first embodiment of the invention.

FIG. 8 is a schematic structural diagram of a power valve according to a first embodiment of the present invention;

FIG. 9 is a schematic view of a through-groove channel structure according to a first embodiment of the present invention;

fig. 10 is a schematic diagram of a groove flow channel structure in the first embodiment of the invention;

FIG. 11 is a schematic view of a mixing tank flow channel according to a first embodiment of the present invention;

FIG. 12 is a schematic view of a flow channel structure of a multilayer mixing tank according to one embodiment of the present invention;

FIG. 13 is a schematic diagram of a flexible flow channel structure according to a second embodiment of the present invention;

fig. 14 is a schematic structural view of a flow channel according to a second embodiment of the present invention;

FIG. 15 is a schematic view of a first driving manner of the power pump in the third embodiment of the present invention;

FIG. 16 is a schematic view of a second driving mode of the power pump in the third embodiment of the present invention;

fig. 17 is a schematic view of a third driving method of the power pump in the third embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

The first embodiment is as follows:

as shown in fig. 1 and 10, the liquid-cooled heat dissipation module of the present embodiment includes at least one power pump 1, where the power pump 1 is disposed on a flow channel 3 of a heat dissipation loop, and both the power pump and the flow channel 3 are formed as a patch structure.

According to an embodiment of the present invention, the power pump 1 includes the vibration plate 11, the fluid valve 15 and the pump cavity 12, wherein, the pump cavity 12 is provided with the fluid inlet 13 and the fluid outlet 14 communicated with the flow channel 3, the vibration plate 11 covers on the pump cavity 12, the fluid in the pump cavity 12 is squeezed by vibration, further, the fluid inlet 13 and the fluid outlet 14 of the pump cavity 12 are respectively provided with the fluid valve 15, the fluid valve 15 installed at the fluid inlet 13 is only used for one-way inflow of the fluid into the pump cavity 12, the fluid valve 15 installed at the fluid outlet 14 is only used for one-way outflow of the fluid out of the pump cavity 12, see fig. 2 and 3, its specific working principle: the volume of the pump chamber 12 is changed in size by the reciprocating motion of the vibration plate 11 and the fluid is made to flow directionally in cooperation with the fluid valve 15. The operation of the power pump can be divided into two processes of suction and discharge. When the vibration plate 11 bends upwards, the volume of the pump cavity 12 increases, the pressure in the cavity decreases, and under the action of the pressure difference between the two sides, the fluid valve 15 at the fluid inlet 13 is opened, the fluid valve 15 at the fluid outlet 14 is closed, and fluid flows into the pump cavity 12 from the fluid valve 15 at the fluid inlet 13, so that the fluid suction is completed; when the vibration plate 11 bends downward, the volume of the pump chamber 12 decreases, the pressure in the chamber increases, the fluid valve 15 at the mass outlet 14 opens, the fluid valve 15 at the mass inlet 13 closes, and the fluid discharge process is completed. When a continuous alternating signal is applied to the vibrating plate 11, the power pump completes continuous suction and drainage, and unidirectional flow of fluid is realized.

Specifically, the fluid in the flow passage 3 and flowing through the pump cavity 12 in this embodiment may be a single-phase working medium or a gas-liquid two-phase mixed working medium.

Specifically, the vibrating plate 11 of the present embodiment may be configured in an integral type or a separate type, as shown in fig. 4, the excitation unit 111a of the integral type vibrating plate 11 and the vibrating plate 112a are closely attached, the excitation unit 111a drives the vibrating plate 112b to generate vertical reciprocating deformation, as shown in fig. 5, the excitation unit 111b and the vibrating plate 112b of the separate type vibrating plate 11 are connected by a connecting portion 113, specifically, one end of the excitation unit 111b is fixed, and the other end thereof is hinged to the vibrating plate 112b by the connecting portion 113, and a periodic alternating current signal is applied to the excitation unit 111b, so that one end of the excitation unit 111b connected to the vibrating plate 112b generates upward and downward periodic bending deformation, thereby driving the vibrating plate 112b to generate vertical reciprocating deformation, and further generating periodic change in the volume of the pump chamber 12.

It should be noted that the power pump 1 in this embodiment may be a single-cavity pump, or may be a multi-cavity pump, such as an integral dual-cavity pump shown in fig. 6, or a combined dual-cavity pump shown in fig. 7.

The power pump 1 of this embodiment is preferably miniature piezoelectric diaphragm pump, and miniature piezoelectric diaphragm pump can highly integrated with heat transfer, heat dissipation function module and runner 3, need not to set up heat exchanger (liquid reserve tank) and external pipeline alone, and compact structure adapts to the user demand in narrow and small heat dissipation space.

The fluid valve 15 in this embodiment is preferably a cantilever beam type check valve, but other valve bodies, such as the power valve shown in fig. 8, may be used, as long as the check flow of the fluid can be controlled, and the valve is not limited thereto. Of course, the fluid valve 15 may be designed as one or more valves according to different control modes, and is not limited thereto.

As shown in fig. 9 to 12, the flow channel 3 of the present embodiment includes a flow channel layer 31 and a panel layer 32, the flow channel layer 31 includes a substrate 312 and a flow guide groove 311 formed on the substrate 312, and the panel layer 32 includes at least one panel, and the panel covers the flow guide groove 311.

The number of the guiding grooves 311 in this embodiment is at least one, when the number of the guiding grooves 311 is multiple, the multiple guiding grooves 311 may be mutually communicated and configured with a set of liquid cooling heat dissipation module, the multiple guiding grooves 311 may also be mutually independent, each guiding groove 311 is configured with a set of liquid cooling heat dissipation module, as long as the heat dissipation effect can be achieved, and the specific layout manner is not limited.

According to an embodiment of the flow channel 3 of the present invention, referring to fig. 9, the flow guiding groove 311 is a through groove 311a, the panel layer 32 includes a first panel 32a and a second panel 32b, the flow channel layer 31 is configured between the first panel 32a and the second panel 32b, and the first panel 32a, the second panel 32b and the through groove 311a are matched to form the flow channel 3. Specifically, the flow channel 3 is a basic flow channel 3 formed by sequentially laminating and bonding three layers of thin plates, and the first panel 32a, the flow channel layer 31 and the second panel 32b are respectively a flow channel upper plate, a through groove layer and a flow channel lower plate, wherein the flow channel upper plate is provided with a fluid inlet 13, a fluid outlet 14, a liquid injection port 51 and a cover plate 52; the through groove 311a is provided with a communicated groove which is completely formed in a through mode; the lower plate of the runner 3 is a thin plate without any features. Working medium is injected into the flow passage 3 through the injection port 51, and then is sealed by the cover plate 52, and the power pump 1 is communicated with the flow passage 3 to form a closed whole filled with the working medium.

According to another embodiment of the flow channel 3 of the present invention, referring to fig. 10, the guiding groove 311 is a groove 311b, the panel layer 32 includes a panel, and the panel and the groove 311b cooperate to form the flow channel 3. The flow channel 3 is a basic flow channel formed by sequentially laminating and bonding a panel and a flow channel layer 31, the panel and the flow channel layer 31 are respectively a flow channel upper plate and a flow channel groove plate, wherein the flow channel upper plate is provided with a fluid inlet 13, a fluid outlet 14, a fluid injection port 51 and a cover plate 52, and the flow channel groove plate is provided with a communicated groove 311b with a certain depth. Working medium is injected into the flow passage 3 through the injection port 51, and then is sealed by the cover plate 52, and the power pump is communicated with the flow passage 3 to form a closed whole filled with the working medium.

Of course, in this embodiment, two kinds of flow channel 3 structures may be combined to also play a role in guiding flow. As shown in fig. 11, the mixing tank runner 3 is a basic runner formed by sequentially laminating and bonding three thin plates. The three layers of thin plates are respectively a flow channel upper plate, a through groove layer and a flow channel groove plate, wherein the flow channel upper plate is provided with a fluid inlet 13, a fluid outlet 14, a fluid injection port 51 and a cover plate 52, one side close to the through groove layer can be provided with a communicated groove 311b with a certain depth or not, the shape of the groove 311b is consistent with that of a groove of the through groove 311a layer, and the through groove layer is provided with a communicated groove formed by complete penetration; the runner duct plate is provided with a continuous recess 311b of a certain depth, and the shape of the recess 311b is identical to the groove penetrating the layer of the recess 311 a.

Of course, as shown in fig. 12, the flow channels 3 may be arranged as a composite of a plurality of layers of the basic flow channels 3.

The substrate 312 and/or the panel in this embodiment are thin plates or thin films, the thin plates or the thin films may be made of metal materials, polymer materials, composite materials, preferably polymer materials, such as PP, PPs, PET, and the like, and when the polymer materials are preferentially adopted for use in communication equipment or electromagnetic products, interference and shielding of communication signals and electromagnetic signals can be effectively avoided, and the application environment of current 5G signal transmission is matched.

In this embodiment, the fluid flowing through the flow passage 3 and the pump chamber 12 may be a single-phase working medium or a gas-liquid two-phase mixed working medium. When the heat productivity is not large, only the liquid working medium circularly flows to dissipate heat, and when the heat productivity is large, the liquid working medium is utilized to absorb and release latent heat to circularly dissipate heat.

Preferably, the external dimensions of the power pump 1 do not exceed 40mm x 10mm (length x width x thickness).

Preferably, the equivalent diameter of the flow channel 3 is 10 μm to 3 mm.

As can be seen from the above, the power pump and the flow channel of the present embodiment can be designed as a patch structure, thereby facilitating the miniaturization design of the product.

Example two:

as shown in fig. 13 to 14, in the present embodiment, an electronic device is provided, where the liquid cooling heat dissipation system is adopted, the flow channel 3 of the liquid cooling heat dissipation system of the present embodiment is formed as a flexible patch, the patch is attached to the housing 4 of the electronic device to dissipate heat of internal components thereof, the heat conduction, heat dissipation and heat insulation areas can be freely planned according to application scenarios, a metal film can be applied to the area requiring heat conduction and heat dissipation, and a heat insulation film can be applied to the area requiring heat insulation.

Example three:

as shown in fig. 15, the liquid-cooled heat dissipation module in this embodiment is substantially the same as the first embodiment, except that: the power pump 1c is designed as an electrostatically driven power pump. Alternatively, as shown in fig. 16, the power pump 1d is designed as a bimetal drive power pump, or, as shown in fig. 17, the power pump 1e is designed as a shape memory alloy drive power pump, that is, the power pump of the present invention may be variously modified, and the excitation means of the power pump may be of a piezoelectric type, an electrostatic type, an electrohydraulic type, an electromagnetic type, a bimetal type, a memory alloy type, or the like. As long as the patch structure can be realized, the specific structure of the power pump is not limited.

The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims (10)

1. A liquid cooling heat dissipation module is characterized by comprising at least one power pump (1), wherein the power pump is arranged on a flow channel (3) of a heat dissipation loop, and the power pump and/or the flow channel (3) are/is formed into a patch structure.

2. A liquid-cooled heat dissipation module according to claim 1, characterized in that the power pump (1) comprises:

the pump cavity (12), the pump cavity (12) is at least one, the pump cavity (12) is provided with a fluid inlet (13) and a fluid outlet (14) which are communicated with the flow passage (3);

at least one vibration plate (11), wherein the vibration plate (11) covers the pump cavity (12), and the vibration plate (11) presses fluid in the pump cavity (12) through vibration;

and the fluid valve (15) is arranged at the fluid inlet (13) and the fluid outlet (14) of the pump cavity (12) and is used for controlling the unidirectional flow of the fluid.

3. A liquid-cooled heat dissipation module according to claim 1, wherein the flow channel (3) comprises:

a flow channel layer (31), wherein the flow channel layer (31) comprises a substrate (312) and a flow guide groove (311) formed on the substrate (312);

the panel layer (32), panel layer (32) includes at least one layer of panel, the guide groove (311) is covered by the panel.

4. The liquid-cooled heat dissipation module according to claim 3, wherein the panel layer (32) is provided with a liquid injection port (51) communicated with the flow channel (3), and the liquid injection port (51) is sealed by a cover plate (52).

5. The liquid-cooled heat dissipation module according to claim 3, wherein the number of the flow guide grooves (311) is at least one.

6. The liquid-cooled heat dissipation module according to claim 3, wherein the flow guide grooves (311) are through grooves (311a), the panel layer (32) includes a first panel (32a) and a second panel (32b), the flow channel layer (31) is disposed between the first panel (32a) and the second panel (32b), and the first panel (32a), the second panel (32b) and the through grooves (311a) cooperate to form the flow channel (3).

7. A liquid-cooled heat dissipation module according to claim 3, wherein the flow guide grooves (311) are grooves (311b), the panel layer (32) comprises a panel, and the panel and the grooves (311b) cooperate to form the flow channels (3).

8. The liquid-cooled heat dissipation module according to claim 3, wherein the flow guide grooves (311) comprise through grooves (311a) and/or grooves (311b), and the flow guide grooves (311) and the panel layer (32) cooperate to form the flow channels (3).

9. An electronic device comprising a liquid-cooled heat dissipation module as recited in any of claims 1-8.

10. An electronic device according to claim 9, characterized in that the flow channel (3) is attached to the electronic device to dissipate heat from its internal components.

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