CN109347340A - A kind of power module of high-performance and high intense - Google Patents
A kind of power module of high-performance and high intense Download PDFInfo
- Publication number
- CN109347340A CN109347340A CN201811415232.8A CN201811415232A CN109347340A CN 109347340 A CN109347340 A CN 109347340A CN 201811415232 A CN201811415232 A CN 201811415232A CN 109347340 A CN109347340 A CN 109347340A
- Authority
- CN
- China
- Prior art keywords
- power module
- copper bar
- copper
- intense
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 60
- 239000010949 copper Substances 0.000 claims abstract description 58
- 229910052802 copper Inorganic materials 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 15
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000005611 electricity Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Abstract
The present invention relates to power semiconductor and power module application field, in particular to the power module of a kind of high-performance and high intense.Plastic casing including being molded with copper bar, is fixed with current sensor, insulating substrate and radiating bottom plate in the shell；The copper bar bottom is combined together by the positive copper clad layers of ultrasonic bond or welding connecting mode and insulating substrate；The back side copper clad layers of the insulating substrate are combined together by welding manner and radiating bottom plate.High-performance and high intense power module of the invention realizes the compactedness of system application using plastic casing integrated current sensors, module running current is improved using the radiator structure with wing needle, hoisting module electrical property, power module compactedness, Miniaturization Design are realized using internal three-dimensional, stack bus bar arrangement, busbar stray inductance is reduced by laminated bus bar structure simultaneously, improve power module working voltage, hoisting module electrical property.
Description
(1) technical field
The present invention relates to power semiconductor and power module application field, in particular to the function of a kind of high-performance and high intense
Rate module.
(2) background technique
In face of increasingly depleted petroleum resources and the immense pressure of environmental protection, new energy vehicle shows huge advantage and wide
Development prospect.
The fast development of new energy vehicle has driven the quick application of vehicle-used inverter.Key core in vehicle-used inverter
Component is power module, which realizes electrical power conversion by switch motion, is alternating current by DC power conversion, or will exchange
Electricity is transformed to direct current.
Power module in vehicle-used inverter has the requirement of high-performance and high intense.High performance requirements power module can be transported
For row under higher voltage or electric current, high intense requires power module volume as small as possible, to improve the power density of application
With the flexibility of application.
Currently, all using plane arrangement structure inside power module, high-performance is by single side direct water-cooling or two-sided
Connect/direct water-cooling realizes that promoting running current after strengthening heat dissipation realizes, but do not influence on operation higher voltage.High intense
It is also to reduce heat dissipation area by optimizing thermal solution and reach what reduction module volume was realized.
Patent document 1(application number: 200510076308.5；Denomination of invention: power stack) describe a kind of integrated cooling
IGBT power modules structure, for the mould group using the IGBT power module of two-sided indirect water-cooling, laminating cooler need to be by module
Cooling surface is completely covered that be just able to achieve module cooling, though this construction module is small, plus refrigerating module laminate cooler after
Volume is just relatively large, causes the compactedness of application system not high, which mainly passes through reinforcing heat dissipation and improve module operation electricity
Stream, but influenced less on working voltage is improved.
(the application number: 201310240571.8 of patent document 2；Denomination of invention: function power inverter, power module and vehicle
With power inverter) describe a kind of power module and the power inverter using the power module, the device are adopted
It is the IGBT power module of the two-sided direct water-cooling of tubular, module is immersed in the cooling cavities with cartridge type cooling bath,
This radiator height depends on the height of module, therefore greatly very than single side indirect water-cooling or the cooler of single side direct water-cooling
More, the volume for directly resulting in application system is larger, and system compact type is not high, which mainly passes through reinforcing heat dissipation and improve module fortune
Row electric current, but influenced less on working voltage is improved.
(the application number: 201210069142.4 of patent document 3；Denomination of invention: power module) describe a kind of power module
Device, the device are attached using single side direct water-cooling IGBT power module, module in spreader surface, this radiating mode
Heat dissipation effect is poor, therefore more much larger than the cooler of single side direct water-cooling or two-sided indirect/direct water-cooling, directly results in application
The volume of system is larger, and system compactness is not high, while it is poor to radiate, and module electrical property is general.
Therefore, running current and the high used in new energy vehicles novel package structure of voltage electrical property, compactedness can be improved simultaneously
Power module become urgent demand.
(3) summary of the invention
In order to compensate for the shortcomings of the prior art, the present invention provides the power modules of a kind of high-performance and high intense.
The present invention is achieved through the following technical solutions:
A kind of power module of high-performance and high intense, the plastic casing including being molded with copper bar, in the shell also
There are current sensor, insulating substrate and radiating bottom plate；The copper bar bottom is by connection types such as ultrasonic bond or welding and absolutely
The positive copper clad layers of edge substrate are combined together；The back side copper clad layers of the insulating substrate pass through welding manner and radiating bottom plate knot
It is combined.
The copper bar inlayed in the housing and current sensor are combined into plastic casing by injection molding manner and are molded with
The plastic casing of copper bar；
The copper bar includes the first copper bar of direct current, the second copper bar of direct current, the first copper bar of exchange, the second copper bar of exchange and exchanges the
Three copper bars, the above copper bar are embedded in shell and are located at enclosure interior leakage part using naked copper structure, be located at hull outside and leak outside
Part prevents from aoxidizing using plating；
The insulating substrate includes liner plate and power semiconductor chip, and the liner plate is burnt by high-strength ceramic and upper and lower surface layers of copper
It ties.
The radiating bottom plate is using highly heat-conductive materials such as copper, and radiating bottom plate outer layer is band wing needle construction, and outer layer is using electricity
Plating prevents from aoxidizing.
Optionally, the current sensor is Hall-type contactless type or current divider touch sensor.
Optionally, the wing needle is cylindrical, diamond shape or other structures for being conducive to heat dissipation.
Optionally, the cooling bottom plate is made of copper product, aluminum material or other materials for being conducive to heat dissipation.
Compared with prior art, the present invention has at least the following advantages: high-performance and high intense power mould of the invention
Block realizes the compactedness of system application using plastic casing integrated current sensors, improves module using the radiator structure with wing needle
Running current, hoisting module electrical property realize power module compactedness, miniaturization using internal three-dimensional, stack bus bar arrangement
Design, while busbar stray inductance is reduced by laminated bus bar structure, power module working voltage is improved, hoisting module is electrical
Energy.
(4) Detailed description of the invention
The present invention will be further described below with reference to the drawings.
Fig. 1 is structural schematic diagram of the invention；
In figure, 1- plastic casing；The first copper bar of 2- direct current；The second copper bar of 3- direct current；4- exchanges the first copper bar；5- exchanges the second bronze medal
Row；6- exchanges third copper bar；7- current sensor；8- insulating substrate；9- heat-radiating substrate.
(5) specific embodiment
Attached drawing is a kind of specific embodiment of the invention.The embodiment includes being molded with current sensor 7, the first bronze medal of direct current in advance
Row 2, the second copper bar of direct current 3, the first copper bar 4 of exchange, the second copper bar 5 of exchange and the plastic casing 1 for exchanging third copper bar 6, in institute
Stating has 3 insulating substrates and heat-radiating substrate 9 in plastic casing 1, first copper bar of direct current 2, the second copper bar of direct current 3, exchange the
One copper bar 4, the second copper bar 5 of exchange and exchange 6 bottom of third copper bar pass through the connection types such as ultrasonic bond or welding and insulation base
The positive copper clad layers of plate are combined together, and the back side copper clad layers of the insulating substrate are incorporated in by welding manner and radiating bottom plate
Together；Current sensor 7 is 3, is respectively fitted over the first copper bar 4 of exchange, the second copper bar 5 of exchange and exchanges on third copper bar 6.
Wherein, plastic casing 1 includes accommodating current sensor 7, the first copper bar of direct current 2, the second copper bar of direct current 3, exchange the
One copper bar 4, the second copper bar 5 of exchange and the cavity for exchanging third copper bar 6,
High-performance and high intense power module of the invention realizes system application using plastic casing integrated current sensors
Compactedness improves module running current, hoisting module electrical property, using internal three-dimensional, folded using the radiator structure with wing needle
Layer busbar arrangement realizes power module compactedness, Miniaturization Design, while reducing busbar stray inductance by laminated bus bar structure,
Improve power module working voltage, hoisting module electrical property.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, several improvements and modifications can also be made, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (7)
1. the power module of a kind of high-performance and high intense, is characterized in that: the plastic casing including being molded with copper bar, described
Shell in be fixed with current sensor, insulating substrate and radiating bottom plate；The copper bar bottom is connected by ultrasonic bond or welding
The positive copper clad layers for connecing mode and insulating substrate are combined together；The back side copper clad layers of the insulating substrate by welding manner with
Radiating bottom plate is combined together.
2. the power module of high-performance according to claim 1 and high intense, it is characterised in that: be embedded in the shell
In the copper bar and the current sensor plastic casing for being molded with copper bar is combined by injection molding manner and plastic casing.
3. the power module of high-performance according to claim 2 and high intense, it is characterised in that: the copper bar includes straight
The first copper bar, the second copper bar of direct current, the first copper bar of exchange, the second copper bar of exchange is flowed to inlay with third copper bar, the copper bar is exchanged
In shell and it is located at enclosure interior leakage part using naked copper structure, is located at hull outside leakage part using the anti-block of plating
Change.
4. the power module of high-performance according to claim 1 and high intense, it is characterised in that: the insulating substrate packet
Liner plate and power semiconductor chip are included, the liner plate is sintered by high-strength ceramic and upper and lower surface layers of copper.
5. the power module of high-performance according to claim 1 and high intense, it is characterised in that: the radiating bottom plate is adopted
With highly heat-conductive materials such as copper, radiating bottom plate outer layer is band wing needle construction, and outer layer prevents from aoxidizing using plating.
6. the power module of high-performance according to claim 5 and high intense, it is characterised in that: the wing needle is cylinder
Shape, diamond shape.
7. the power module of high-performance according to claim 1 and high intense, it is characterised in that: the current sensor
For Hall-type contactless type or current divider touch sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811415232.8A CN109347340A (en) | 2018-11-26 | 2018-11-26 | A kind of power module of high-performance and high intense |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811415232.8A CN109347340A (en) | 2018-11-26 | 2018-11-26 | A kind of power module of high-performance and high intense |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109347340A true CN109347340A (en) | 2019-02-15 |
Family
ID=65317959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811415232.8A Pending CN109347340A (en) | 2018-11-26 | 2018-11-26 | A kind of power module of high-performance and high intense |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109347340A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112510000A (en) * | 2020-11-17 | 2021-03-16 | 扬州国扬电子有限公司 | Power module with low parasitic inductance of driving loop |
| CN112564476A (en) * | 2020-12-01 | 2021-03-26 | 复旦大学 | Three-phase silicon carbide power semiconductor module integrating current sampling and EMI filtering |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201408759Y (en) * | 2009-05-07 | 2010-02-17 | 深圳市禾望电气有限公司 | IGBT power module |
| CN203056827U (en) * | 2012-12-26 | 2013-07-10 | 北京科诺伟业科技有限公司 | IGBT power module |
| CN203339967U (en) * | 2013-05-31 | 2013-12-11 | 深圳市大地和电气有限公司 | MOS controller |
| CN203352457U (en) * | 2013-06-13 | 2013-12-18 | 国家电网公司 | Power module unit of energy storage converter |
| CN203504429U (en) * | 2013-10-23 | 2014-03-26 | 北京京铁信达铁路设备有限公司 | Auxiliary conversion inverter module |
| CN206864933U (en) * | 2017-05-24 | 2018-01-09 | 深圳巴斯巴科技发展有限公司 | A kind of plastic high voltage distribution box plastic casing of copper bar |
| CN206948231U (en) * | 2017-05-18 | 2018-01-30 | 北京锋锐新源电驱动科技有限公司 | A kind of 144V electric machine controllers |
| CN108122871A (en) * | 2016-11-28 | 2018-06-05 | 中车株洲电力机车研究所有限公司 | A kind of H bridge arms two-side radiation power module |
| CN108231714A (en) * | 2016-12-14 | 2018-06-29 | 株洲中车时代电气股份有限公司 | A kind of power module and preparation method thereof |
| CN211151835U (en) * | 2018-11-26 | 2020-07-31 | 滨州学院 | High-performance and high-compactness power module |
-
2018
- 2018-11-26 CN CN201811415232.8A patent/CN109347340A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201408759Y (en) * | 2009-05-07 | 2010-02-17 | 深圳市禾望电气有限公司 | IGBT power module |
| CN203056827U (en) * | 2012-12-26 | 2013-07-10 | 北京科诺伟业科技有限公司 | IGBT power module |
| CN203339967U (en) * | 2013-05-31 | 2013-12-11 | 深圳市大地和电气有限公司 | MOS controller |
| CN203352457U (en) * | 2013-06-13 | 2013-12-18 | 国家电网公司 | Power module unit of energy storage converter |
| CN203504429U (en) * | 2013-10-23 | 2014-03-26 | 北京京铁信达铁路设备有限公司 | Auxiliary conversion inverter module |
| CN108122871A (en) * | 2016-11-28 | 2018-06-05 | 中车株洲电力机车研究所有限公司 | A kind of H bridge arms two-side radiation power module |
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| CN206948231U (en) * | 2017-05-18 | 2018-01-30 | 北京锋锐新源电驱动科技有限公司 | A kind of 144V electric machine controllers |
| CN206864933U (en) * | 2017-05-24 | 2018-01-09 | 深圳巴斯巴科技发展有限公司 | A kind of plastic high voltage distribution box plastic casing of copper bar |
| CN211151835U (en) * | 2018-11-26 | 2020-07-31 | 滨州学院 | High-performance and high-compactness power module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112510000A (en) * | 2020-11-17 | 2021-03-16 | 扬州国扬电子有限公司 | Power module with low parasitic inductance of driving loop |
| CN112510000B (en) * | 2020-11-17 | 2024-04-09 | 扬州国扬电子有限公司 | Power module with low parasitic inductance of driving loop |
| CN112564476A (en) * | 2020-12-01 | 2021-03-26 | 复旦大学 | Three-phase silicon carbide power semiconductor module integrating current sampling and EMI filtering |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190215 |