CN206040628U - IGBT module radiator - Google Patents
IGBT module radiator Download PDFInfo
- Publication number
- CN206040628U CN206040628U CN201620844664.0U CN201620844664U CN206040628U CN 206040628 U CN206040628 U CN 206040628U CN 201620844664 U CN201620844664 U CN 201620844664U CN 206040628 U CN206040628 U CN 206040628U
- Authority
- CN
- China
- Prior art keywords
- igbt module
- radiator
- accommodating cavity
- liquid outlet
- dividing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 10
- 230000037361 pathway Effects 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 239000004411 aluminium Substances 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010426 asphalt Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a IGBT module radiator, includes, the radiator body, be formed with the holding recess for holding IGBT module on the top surface of radiator body, this internal holding cavity that has defined of radiator, has the baffle just in the holding cavity the baffle will liquid inlet channel and liquid channel that the holding cavity is separated into parallel arrangement and is communicate each other, liquid inlet channel reaches it has the cooling post to equally divide cloth in the liquid channel, the intercommunication has on the side of radiator body liquid inlet channel's inlet and intercommunication liquid channel's liquid outlet. The utility model has the advantages of: can be according to actual power requirement, compatible multiple different power specifications to realize the universalization, improve product quality, reduce cost. Simultaneously, because that epoxy resin sealing is passed through to the IGBT module is fixed, small, power density is high, DBC and aluminium radiator beading, contact heat resistance greatly reduced, the radiating effect is good.
Description
Technical field
This utility model is related to electricity field, more particularly to the heat dissipation technology of electronic component, particularly a kind of IGBT module
Radiator.
Background technology
IGBT has obtained increasingly being widely applied in modern power electronics technology, in the big or middle power of upper frequency
Leading position is occupied using in.Which has become the core devices in new energy vehicle controller, at present just towards miniaturization, height
Power density develops.
IGBT module mainly covers copper by chip, directly（DBC）Ceramic layer and substrate are constituted, and interlayer is welded by solder, base
Plate is generally required and is connected with radiator by heat-conducting silicone grease.Sealing is needed above chip, conducting terminal, gate terminal, lead
Material seal.
In prior art, due to the coefficient of conductivity of the heat-conducting silicone grease between substrate and radiator it is relatively low so that IGBT module
Thermal resistance it is larger, affect IGBT module normal work.Additionally, existing heat spreader structures are both for a certain fixation mostly
Designed by IGBT module, lack versatility, and the specification of IGBT needed for new-energy automobile is more.
Utility model content
The purpose of this utility model is the problem for overcoming radiating effect difference of the prior art, there is provided a kind of new IGBT
Module heat radiator.
In order to realize this purpose, the technical solution of the utility model is as follows：A kind of IGBT module radiator, includes,
Radiator body, is formed with the containing groove to house IGBT module, the radiator on the top surface of the radiator body
This defines the accommodating cavity to house coolant in vivo, has dividing plate in the accommodating cavity and the dividing plate is by the appearance
It is empty chamber and separates the feed pathway and liquid outlet channel, the feed pathway and the liquid outlet channel for being in a parallel set and being interconnected
Cooling column is inside distributed with, on the side of the radiator body, has the inlet of the connection feed pathway and connection described
The liquid outlet of liquid outlet channel.
Used as a kind of preferred version of IGBT module radiator, the accommodating cavity has relative first end and second
End, the dividing plate begin to the second extreme direction of the accommodating cavity to extend from the end face of the first end of the accommodating cavity, described
Gap is left between the end face at the second end of dividing plate and the accommodating cavity, thereby, the feed pathway and the liquid outlet channel reality
It is interconnected described in existing；The inlet and the liquid outlet may be contained within the first end position of the accommodating cavity.
Used as a kind of preferred version of IGBT module radiator, the dividing plate system is extended in corrugated mode.
Used as a kind of preferred version of IGBT module radiator, the radiator body is by upper half-shell and housing lower half
Composition, the upper half-shell is mutually fixably coupled in the way of friction welding with the housing lower half, the dividing plate and described cold
But post is fixedly coupled in the upper half-shell.
As a kind of preferred version of IGBT module radiator, the cooling column system cylinder or cone.
As a kind of preferred version of IGBT module radiator, there is on the housing lower half turn-up portion, the turn-up portion
With secure bond hole.
Compared with prior art, advantage of the present utility model at least that：Can be required according to actual power, it is compatible various
Different capacity specification, so that realize generalization, improve product quality, reduces cost.Simultaneously as IGBT module passes through asphalt mixtures modified by epoxy resin
Fat sealing is fixed, and small volume, power density are high.DBC is directly welded with aluminium radiator, and thermal contact resistance is substantially reduced, radiating effect
It is good.
Description of the drawings
Structural representations of the Fig. 1 for one embodiment of this utility model.
Structural representations of the Fig. 2 for one embodiment of this utility model（Without IGBT module）.
Fig. 3 is the structural representation of upper half-shell in one embodiment of this utility model.
Specific embodiment
Accompanying drawing is combined below by specific embodiment to be described in further detail this utility model.
Fig. 1 to 3 is referred to, shown in figure is a kind of IGBT module radiator.The IGBT module 1 is main by leading terminal
11st, igbt chip 12, diode chip for backlight unit 13, DBC directly cover the compositions such as copper 14 and NTC temperature detection critesistor 15 of ceramics.Institute
State radiator to be mainly made up of the radiator body 2 of aluminium material making.
The radiator body 2 is to be made up of upper half-shell 21 and housing lower half 22.The upper half-shell 21 with it is described under
Half shell 22 is mutually fixably coupled in the way of friction welding.It is formed with the top surface of the upper half-shell 21 to accommodating described
The containing groove 210 of IGBT module 1.The radiator body 2 is placed in the containing groove 210, and the heat radiator body
Directly directly cover copper ceramics 14 with the DBC of the IGBT module 1 to be welded to connect.The radiator body 2 can substitute original
Copper base and heat-conducting silicone grease, so that thermal resistance is reduced, lift the radiating effect of IGBT module 1.
Specifically, the accommodating cavity to house coolant is defined in the radiator body 2.In the accommodating cavity
With dividing plate 213 and the dividing plate 213 the accommodating cavity is divided into the feed pathway 211 that be arranged in parallel and be interconnected and is gone out
Liquid passage 212.Cooling column 214 is distributed with the feed pathway 211 and the liquid outlet channel 212.The dividing plate 213 and institute
State cooling column 214 to be fixedly coupled in the upper half-shell 21.In the present embodiment, the cooling column 214 is cylinder.At which
In his embodiment, the cooling column 214 is circular cone post, and in top, small end is below at big end.The radiator body 2
There is on side the inlet 23 for connecting the feed pathway 211 and the liquid outlet 24 for connecting the liquid outlet channel 212.
In the present embodiment, the accommodating cavity has relative first end and the second end, and the dividing plate 213 is housed from described
The second extreme direction extension that the end face of the first end of cavity begins to the accommodating cavity, the dividing plate 213 and the accommodating cavity
The second end end face between leave distance, thereby so that the feed pathway 211 and the liquid outlet channel 212 are connected；Institute
State the first end position that inlet 23 and the liquid outlet 24 may be contained within the accommodating cavity.The dividing plate 213 is with wave
The mode of shape extends.Thereby, improve heat dispersion.
In the present embodiment, there is on the housing lower half 22 turn-up portion 25, the turn-up portion 25 has secure bond hole
250.Thereby, be connected with controller casing, compact conformation, install, it is easy to maintenance.
On the architecture basics for not changing the radiator body 2, plurality of specifications can be realized according to power demand demand
IGBT module 1 radiator generalization, concrete methods of realizing is as follows：Peak power module is selected, is customized, here basis
On, need to only change the quantity and layout of igbt chip, you can realize a kind of compatible multiple power requirements of unitized radiator
The purpose of IGBT module 1.Assume which is to do high-power specification, if necessary to smaller power specification, it is only necessary to change welding with radiating
Number of elements and layout on device, and heat spreader structures need not be changed, so as to realize generalization.
Below only express embodiment of the present utility model, its description is more concrete and in detail, but can not therefore and
It is interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, not
On the premise of departing from this utility model design, some deformations and improvement can also be made, these belong to guarantor of the present utility model
Shield scope.Therefore, the protection domain of this utility model patent should be defined by claims.
Claims (6)
1. a kind of IGBT module radiator, includes, radiator body, it is characterised in that on the top surface of the radiator body
The containing groove to house IGBT module is formed with, the accommodating sky to house coolant in the radiator body, is defined
Chamber, has dividing plate in the accommodating cavity and the accommodating cavity is separated the dividing plate entering of being in a parallel set and be interconnected
Cooling column is distributed with liquid passage and liquid outlet channel, the feed pathway and the liquid outlet channel, the radiator body
The inlet on side with the connection feed pathway and the liquid outlet for connecting the liquid outlet channel.
2. a kind of IGBT module radiator according to claim 1, it is characterised in that the accommodating cavity has relative
First end and the second end, the second end side that the dividing plate begins to the accommodating cavity from the end face of the first end of the accommodating cavity
To the second end of extension, the dividing plate and the accommodating cavity end face between leave gap, thereby, the feed pathway with it is described
Liquid outlet channel is interconnected described in realizing；The inlet and the liquid outlet may be contained within the first end position of the accommodating cavity
Put.
3. a kind of IGBT module radiator according to claim 2, it is characterised in that the dividing plate system is with corrugated side
Formula extends.
4. according to arbitrary described a kind of IGBT module radiator in claims 1 to 3, it is characterised in that the radiator sheet
System is made up of upper half-shell and housing lower half, and the upper half-shell is mutually fixed in the way of friction welding with the housing lower half
Ground is combined, and the dividing plate and the cooling column are fixedly coupled in the upper half-shell.
5. a kind of IGBT module radiator according to claim 4, it is characterised in that the cooling column system cylinder or circle
Taper.
6. a kind of IGBT module radiator according to claim 4, it is characterised in that there is on the housing lower half flange
Portion, the turn-up portion have secure bond hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620844664.0U CN206040628U (en) | 2016-08-08 | 2016-08-08 | IGBT module radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620844664.0U CN206040628U (en) | 2016-08-08 | 2016-08-08 | IGBT module radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206040628U true CN206040628U (en) | 2017-03-22 |
Family
ID=58307992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620844664.0U Active CN206040628U (en) | 2016-08-08 | 2016-08-08 | IGBT module radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206040628U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022007562A1 (en) * | 2020-03-06 | 2022-01-13 | 宁波市哈雷换热设备有限公司 | Refrigerant-type chip cooler |
-
2016
- 2016-08-08 CN CN201620844664.0U patent/CN206040628U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022007562A1 (en) * | 2020-03-06 | 2022-01-13 | 宁波市哈雷换热设备有限公司 | Refrigerant-type chip cooler |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |