WO2022007562A1

WO2022007562A1 - Refrigerant-type chip cooler

Info

Publication number: WO2022007562A1
Application number: PCT/CN2021/098330
Authority: WO
Inventors: 戴丁军; 卓宏强; 孙旭光; 颜爱斌; 陈挺辉
Original assignee: 宁波市哈雷换热设备有限公司
Priority date: 2020-03-06
Filing date: 2021-06-04
Publication date: 2022-01-13
Also published as: CN111769083A; CN212084986U

Abstract

A refrigerant-type chip cooler, comprising a cooler main body (100), the cooler main body (100) comprising an upper heat conduction plate (1) and a lower heat conduction plate (2), two liquid inlet/outlet notches (11) being correspondingly press-formed at an outer edge of the upper heat conduction plate (1), a communication channel (12) being correspondingly formed between the two liquid inlet/outlet notches (11) at a plate surface of the upper heat conduction plate (1), an outer edge of the lower heat conduction plate (2) being at least provided with a lower flange (21) sealing the liquid inlet/outlet notches (11), the lower flange (21) being provided with mounting ports (211), the upper heat conduction plate (1) being in a sealed fit with the lower heat conduction plate (2) so that a refrigerant channel is formed between the communication channel (12) and the lower heat conduction plate (2), liquid inlet/outlet channels being formed between the two liquid inlet/outlet notches (11) and a plate surface of the lower heat conduction plate (2). The cooler has a simple and reasonable structure, and liquid inlet/outlet connecting tubes (200) can be conveniently connected at the mounting ports (211) of the lower flange (21), thereby simplifying the connections of the liquid inlet/outlet connecting tubes (200), and ensuring the connection effect of the cooler main body (100) and the liquid inlet/outlet connecting tubes (200).

Description

A refrigerant chip cooler

technical field

The invention relates to the technical field of chip coolers, in particular to a refrigerant type chip cooler.

Background technique

At present, the drive module chips are mostly cooled by a refrigerant cooler. The refrigerant cooler includes a refrigerant channel for receiving the refrigerant and guiding the flow of the refrigerant. The heat of the chip is quickly taken away by the refrigerant to achieve rapid cooling and cooling, so as to avoid the chip temperature being too high and burning. ; At present, the refrigerant passage of the refrigerant cooler is generally directly defined by the pipe body or formed by the combination of the grooves on the two heat-conducting plates, and the inlet and outlet pipes are connected to the inlet and outlet formed by the two heat-conducting plates. The inlet and outlet pipes are generally regular round pipes, so in order to ensure the sealing connection between the inlet and outlet pipes and the inlet and outlet, it is necessary to match the notches at the outer edges of the two heat-conducting plates to form a regular, suitable for the inlet and outlet pipes. The circular shape ensures the connection effect between the two, but it greatly increases the difficulty of processing, and is prone to deformation during the manufacturing process, which reduces the matching accuracy of the inlet, outlet, and inlet and outlet nozzles, making it difficult to guarantee the two The connection between the seals has room for improvement.

SUMMARY OF THE INVENTION

In order to overcome the above-mentioned defects in the prior art, the present invention provides a refrigerant type chip cooler, in which the liquid inlet and outlet pipes can be easily joined at the installation port of the lower flange, which greatly simplifies the connection between the liquid inlet and outlet pipes and the main body of the cooler. Install.

In order to achieve the above object, the present invention provides a refrigerant-type chip cooler, which is used for chip cooling by being mounted on a chip, and includes a cooler body, and the cooler body includes an upper heat-conducting plate and a lower heat-conducting plate, wherein the lower heat-conducting plate is The thermal conductive plate is attached to the chip;

The plate body of the upper heat-conducting plate is extruded corresponding to its outer edge with two liquid inlet and outlet slots recessed from the lower surface to the upper surface and connecting the inside and outside of the plate body. The surface is concave to the upper surface and is connected to the communication channel of the two inlet and outlet slots;

The outer edge of the lower heat-conducting plate is provided with a lower flange that is folded upward to cover the liquid inlet and outlet slots at least corresponding to the liquid inlet and outlet slots, and a mounting port communicated with the liquid inlet and outlet slots is arranged on the lower flange;

The upper heat-conducting plate is sealed and attached to the lower heat-conducting plate, so that the communication channel on the upper heat-conducting plate and the plate surface of the lower heat-conducting plate cooperate to form a refrigerant channel for refrigerant to flow. Two liquid inlet and outlet channels are formed in cooperation between the liquid inlet and outlet slots and the plate surface of the lower heat conducting plate.

It is further arranged that: the upper heat conducting plate is formed with a sealing lip extending at least corresponding to the mouth edge of the liquid inlet and outlet slots.

It is further set as follows: the lower heat-conducting plate is provided with continuous or spaced lower flanging along its outer edge, the lower heat-conducting plate is matched with the lower flanging at the outer edge to form a grommet, and the upper heat-conducting plate is embedded in the inset formed by the lower heat conducting plate.

It is further provided that: the upper heat conducting plate is provided with upper flanges arranged continuously or at intervals along its outer edge, and the sealing lip is a part of the upper flanges.

It is further arranged that: the cooler main body also includes at least one matching plate stacked on the upper heat conducting plate, and the adjacent matching plates and the upper heat conducting plate or between the two adjacent matching plates are sealed and matched A refrigerant expansion cavity communicated with the refrigerant passage is formed.

It is further set as follows: the plate body of the matching plate corresponds to the communication channel and the liquid inlet and outlet slots by extruding a matching channel and a matching slot recessed from the lower surface to the upper surface, and the upper heat conduction plate corresponds to the liquid inlet and outlet slots. A communication port passing through the plate body is provided.

It is further arranged that a convex hull structure formed by the depression of the lower surface to the upper surface is extruded on the plate surface of the lower heat conducting plate corresponding to the communication channel and/or the liquid inlet and outlet slots.

It is further arranged that the recessed depth of the liquid inlet and outlet slots on the upper heat conducting plate is greater than the recessed depth of the communication channel, and the connection between the two has a transition surface arranged at an inclination or an arc.

It is further arranged that: the two liquid inlet and outlet slots on the upper heat conducting plate can be selectively arranged on the same side or on different sides.

It is further arranged that the communication channels on the upper heat conducting plate are of multi-channel structure or arranged in a meandering serpentine shape.

Compared with the prior art, the invention has the advantages of simple structure, convenient manufacture, and is suitable for mass production; the device is formed with a refrigerant channel through the combination of the upper and lower heat conducting plates, and the heat of the chip is effectively taken away by the refrigerant flowing in the refrigerant channel. In order to avoid overheating damage to the core and ensure the stable operation of the chip; at the same time, the lower flanging formed by the upward folding of the lower heat-conducting plate closes the ports of the liquid inlet and outlet channels, and the lower flanging is provided with an installation port for the installation of the liquid inlet and outlet pipes, which greatly simplifies The connection between the inlet and outlet pipes and the connection effect of the inlet and outlet pipes and the cooler body are guaranteed.

Description of drawings

1 is a schematic three-dimensional structure diagram of Embodiment 1 of a refrigerant-type chip cooler of the present invention;

Fig. 2 is the separation structure schematic diagram of the chip cooler of Fig. 1;

3 is a schematic perspective view of the second embodiment of the chip cooler;

FIG. 4 is a schematic diagram of the separation structure of the third embodiment of the chip cooler.

The following reference numbers are marked thereon in conjunction with the accompanying drawings:

100. Cooler main body; 1. Upper heat-conducting plate; 11. Liquid inlet and outlet slot; 111. Transition surface; 112. Connecting port; 12. Connecting channel; 13. Upper flanging; 2. Lower heat-conducting plate; 21. Lower Flanging; 211, installation port; 22, convex hull; 3, matching plate; 31, matching groove; 32, matching notch; 200, inlet and outlet connection.

detailed description

A specific embodiment of the present invention will be described in detail below with reference to the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiment.

A refrigerant-type chip cooler of the present invention is shown in Figures 1 and 4. It is used for the heat dissipation of the chip. It is cooled by being connected in series with the refrigerant pipeline and directly attached to the surface of the chip. For example, it is used in inverter air conditioners. The cooling on the chip includes a cooler main body 100 and two liquid inlet and outlet pipes 200 connected to the cooler main body 100; wherein, the cooler main body 100 has a refrigerant channel, and the two liquid inlet and outlet pipes 200 are respectively installed in the refrigerant channel The inlet and outlet of the air conditioner are connected to the refrigerant pipeline in the air conditioner through the liquid inlet and outlet pipe 200, so that the refrigerant channel in the cooler body 100 can receive the refrigerant in the air conditioner refrigerant pipeline and guide the refrigerant in the refrigerant channel in the cooler body 100. It can quickly take away the heat of the air-conditioning chip, so as to ensure that the air-conditioning chip is always in a lower temperature range and avoid overheating and burning of the air-conditioning chip.

Specifically, the cooler main body 100 includes at least an upper heat conduction plate 1 and a lower heat conduction plate 2, wherein the lower surface of the lower heat conduction plate 2 is a flat end surface, and the plane is arranged on the air conditioner chip; the upper heat conduction plate 1 is stamped The lower surface of the upper heat-conducting plate 1 is sealed and attached to the upper surface of the lower heat-conducting plate 2, and the plate body of the upper heat-conducting plate 1 is extruded corresponding to its outer edge with a depression from the lower surface to the upper surface and is connected The two liquid inlet and outlet slots 11 inside and outside the plate body, the plate body of the upper heat conducting plate 1 corresponding to the two liquid inlet and outlet slots 11 is formed with a communication channel 12 formed by the depression of the lower surface and the upper surface, so that the cooler The internal structure of the main body 100 forms a refrigerant channel. Specifically, the communication channel on the upper heat conduction plate 1 and the plate surface of the lower heat conduction plate 2 are combined to form a refrigerant channel. The two liquid inlet and outlet slots 11 on the upper heat conduction plate 1 are connected to the lower heat conduction plate. The plate surface of 2 cooperates to form the liquid inlet and outlet channels for the refrigerant inlet and outlet respectively; the outer edge of the lower heat conduction plate 2 corresponds to the upper heat conduction plate 1 with the liquid inlet and outlet slots 11. There is an upwardly folded lower flange 21, The edge of the upper heat-conducting plate 1 is sealed with the lower flange 21 of the lower heat-conducting plate 2 , the lower flange 21 is provided with a mounting port 211 corresponding to the liquid inlet and outlet channels, and the liquid inlet and outlet pipes 200 are inserted into the lower flange 21 The installation port 211 , which greatly simplifies the installation structure of the cooler body 100 and the liquid inlet and outlet pipes 200, effectively improves the connection effect between the two, and reduces the manufacturing cost; preferably, the upper heat conduction plate 1 corresponds to the liquid inlet and outlet grooves The mouth edge of the mouth 11 is provided with a sealing lip extending outward. The cooperation between the sealing lip and the lower flange 21 effectively increases the contact area and improves the sealing effect.

Further, the lower heat conducting plate 2 is provided with continuously arranged or spaced lower flanges 21 along its outer edge, and the lower flanges 21 cooperate to form a grommet, and the upper heat conducting plate 1 is embedded in the grommet formed by the lower heat conducting plate 2, In this way, the positioning and cooperation between the upper heat-conducting plate 1 and the lower heat-conducting plate 2 can be realized, which simplifies the connection between the two; 13. Part of the sealing lip and the upper flange 13.

Further, the surface of the lower heat conducting plate 2 corresponds to the communication channel 12 and/or the liquid inlet and outlet grooves 11 of the upper heat conducting plate 1, and is provided with a convex hull 22 structure formed by the depression of the lower surface to the upper surface. Through the convex hull 22 structure The pressure bearing capacity of the lower heat-conducting plate 2 can be effectively improved, the deformation of the lower heat-conducting plate 2 can be avoided, and the stable operation of the chip can be ensured.

Further, the recessed depth of the liquid inlet and outlet slots 11 on the upper heat conducting plate 1 is greater than the recessed depth of the communication channel 12, and the connection between the two has a transition surface 111 arranged at an inclination or an arc, which can greatly improve the The drainage effect and the pressure bearing effect of the liquid inlet and outlet channels; further preferably, the communication channel 12 is a multi-channel structure or a serpentine arrangement.

As can be seen from the comparison of FIG. 1 and FIG. 3 , the two liquid inlet and outlet slots 11 on the upper heat conducting plate 1 can be optionally arranged on the same side or on different sides.

As can be seen from the comparison of FIG. 2 and FIG. 4 , in some specific embodiments, in order to reduce the flow resistance and pressure drop inside the chip cooler, so as to ensure the stable operation of the chip cooler, the upper heat conducting plate 1 is also extended to form a Refrigerant expansion chamber; as shown in FIG. 3 , specifically, the cooler body 100 further includes at least one matching plate 3 stacked above the upper heat conducting plate 1. In the embodiment, the matching plate 3 is one piece, so that the matching plate 3 and the upper The heat-conducting plates 1 are sealed and fitted to form a refrigerant expansion cavity that communicates with the refrigerant channel. The matching channel 31 and the matching notch 32 are recessed on the upper surface. The matching channel 32 cooperates with the communication channel 12 to form a refrigerant expansion cavity. For the communication port 112, for the convenience of manufacturing and molding, the matching plate 3 and the upper heat-conducting plate 1 can adopt the same structure; similarly, two or more matching plates 3 can also be stacked above the upper heat-conducting plate 1, The matching plate 3 located between the plates in this way is provided with a communication port 112 penetrating the plate body corresponding to the matching slot 32 .

Compared with the prior art, the present invention has the advantages of simple structure, convenient manufacture, and is suitable for mass production; the device forms a refrigerant channel by combining the upper and lower heat-conducting plates, and the heat of the chip is effectively taken away by the refrigerant flowing in the refrigerant channel, so as to reduce the heat of the chip. Avoid overheating damage to the core and ensure the stable operation of the chip; at the same time, the lower flanging formed by the upward folding of the lower heat-conducting plate closes the ports of the liquid inlet and outlet channels, and the lower flanging is provided with an installation port for the installation of the liquid inlet and outlet pipes, which greatly simplifies the in and out The connection of the liquid pipe and the connection effect of the inlet and outlet pipes and the main body of the cooler are guaranteed.

The above disclosure is only an embodiment of the present invention, but the present invention is not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

A refrigerant type chip cooler, which is used for chip cooling by being mounted on a chip, characterized in that it includes a cooler body, and the cooler body includes an upper heat-conducting plate and a lower heat-conducting plate, wherein the lower heat-conducting plate is attached to on the chip;

The plate body of the upper heat-conducting plate is extruded corresponding to its outer edge with two liquid inlet and outlet slots recessed from the lower surface to the upper surface and connecting the inside and outside of the plate body. The surface is concave to the upper surface and is connected to the communication channel of the two inlet and outlet slots;

The outer edge of the lower heat-conducting plate is provided with a lower flange that is folded upward to cover the liquid inlet and outlet slots at least corresponding to the liquid inlet and outlet slots, and a mounting port communicated with the liquid inlet and outlet slots is arranged on the lower flange;

The upper heat-conducting plate is sealed and attached to the lower heat-conducting plate, so that the communication channel on the upper heat-conducting plate and the plate surface of the lower heat-conducting plate cooperate to form a refrigerant channel for refrigerant to flow. Two liquid inlet and outlet channels are formed in cooperation between the liquid inlet and outlet slots and the plate surface of the lower heat conducting plate.
The refrigerant-type chip cooler according to claim 1, wherein a sealing lip is formed extending at least corresponding to the mouth edge of the liquid inlet and outlet slot of the upper heat conducting plate.
A refrigerant-type chip cooler according to claim 1 or 2, wherein the lower heat conducting plate is provided with continuously arranged or spaced lower flanges along its outer edge, and the lower heat conducting plate corresponds to the outer edge The lower flanging at the upper heat-conducting plate is fitted into the inlay formed by the lower heat-conducting plate.
The refrigerant-type chip cooler according to claim 2, wherein the upper heat conducting plate is provided with continuously arranged or spaced upper flanges along its outer edge, and the sealing lip is a part of the upper flanges .
A refrigerant-type chip cooler according to claim 1, wherein the cooler body further comprises at least one matching plate stacked on the upper heat conducting plate, and the adjacent matching plates and the upper heat conducting plate are between the adjacent matching plates. A refrigerant expansion cavity communicated with the refrigerant passage is formed in a sealing fit between the two adjacent matching plates in between or between them.
A refrigerant type chip cooler according to claim 5, characterized in that, the plate body of the matching plate is extruded and formed with a matching channel and a groove recessed from the lower surface to the upper surface corresponding to the communication channel and the liquid inlet and outlet slots. Matching the slot, the upper heat conducting plate is provided with a communication port penetrating the plate body corresponding to the liquid inlet and outlet slots.
A refrigerant-type chip cooler according to claim 1, characterized in that, a concave from the lower surface to the upper surface is extruded on the plate surface of the lower heat-conducting plate corresponding to the communication channel and/or the liquid inlet and outlet slots. The formed convex hull structure.
The refrigerant type chip cooler according to claim 1, wherein the recessed depth of the liquid inlet and outlet grooves on the upper heat conducting plate is greater than the recessed depth of the communication channel, and the connection between the two has a The transition surface of the inclined setting or the arc setting.
The refrigerant-type chip cooler according to claim 1, wherein the two liquid inlet and outlet slots on the upper heat conducting plate are optionally arranged on the same side or on different sides.
The refrigerant type chip cooler according to claim 1, wherein the communication channels on the upper heat conducting plate are of a multi-channel structure or arranged in a meandering serpentine shape.