CN214279964U - Chip cooler - Google Patents

Chip cooler Download PDF

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Publication number
CN214279964U
CN214279964U CN202120563603.8U CN202120563603U CN214279964U CN 214279964 U CN214279964 U CN 214279964U CN 202120563603 U CN202120563603 U CN 202120563603U CN 214279964 U CN214279964 U CN 214279964U
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CN
China
Prior art keywords
main body
body part
base plate
substrate
refrigerant pipe
Prior art date
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Active
Application number
CN202120563603.8U
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Chinese (zh)
Inventor
颜爱斌
戴丁军
卓宏强
孙旭光
陈挺辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Hrale Plate Heat Exchanger Co ltd
Original Assignee
Ningbo Hrale Plate Heat Exchanger Co ltd
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Application filed by Ningbo Hrale Plate Heat Exchanger Co ltd filed Critical Ningbo Hrale Plate Heat Exchanger Co ltd
Priority to CN202120563603.8U priority Critical patent/CN214279964U/en
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Publication of CN214279964U publication Critical patent/CN214279964U/en
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Abstract

The utility model discloses a chip cooler, which comprises a base plate and a refrigerant pipe which is arranged on the base plate in a laminating way; the refrigerant pipe comprises a main body part and connecting pipe parts, wherein the main body part is in contact connection with the substrate, the connecting pipe parts are positioned at two ends of the main body part, the main body part is of a steamed bun-shaped structure, and the bottom plane of the main body part is attached to the substrate plane and is welded to the substrate plane. The utility model has the advantages of simple and reasonable structure, it is lower to make convenience and cost, welds the refrigerant pipe direct plane laminating of steamed bun shape on the base plate, so ensured contact effect and area between refrigerant pipe and the base plate, the base plate can improve the bearing capacity of refrigerant pipe simultaneously.

Description

Chip cooler
Technical Field
The utility model relates to a cooling arrangement technical field, in particular to chip cooler.
Background
At present, the chip of the driving module is cooled through a refrigerant cooler, the refrigerant cooler comprises a refrigerant channel used for receiving a refrigerant and guiding the refrigerant to flow, the heat of the chip is taken away through the refrigerant quickly so as to realize quick cooling, and the chip is prevented from being burnt due to overhigh temperature.
The refrigerant passageway of present refrigerant cooler is generally injectd by the body directly and is formed or is involutory by the recess on two heat-conducting plates and form, and the body of the refrigerant cooler that is injectd by the body directly that nevertheless current is injectd by the body is mostly pipe or elliptical tube, and is fixed through two plate body centre grippings, if the china utility model patent of having authorized earlier: heat sink (201420475152.2) of a drive module of a variable frequency air conditioner: the utility model provides a drive module's heat abstractor of inverter air conditioner, it includes drive module, its characterized in that: it still includes two heat dissipation aluminum plate (1) and a heat dissipation copper pipe (2) that supply the refrigerant circulation of drawing forth from outdoor heat exchanger, and drive module fixes the surface at heat dissipation aluminum plate (1), and two heat dissipation aluminum plate (1) reciprocal anchorage, heat dissipation copper pipe (2) are cliied to two internal surfaces of two heat dissipation aluminum plate (1), and the clearance intussuseption of two heat dissipation aluminum plate (1) is filled with heat dissipation silica gel layer (3). The technical scheme has the advantages of complex structure, troublesome manufacture, higher cost and improved space.
SUMMERY OF THE UTILITY MODEL
The utility model relates to an overcome defect among the above-mentioned prior art, provide a chip cooler, through the refrigerant pipe beading with steamed bread shape on the base plate, simplified the structure greatly for it is simpler to make production, and the cost is cheaper, can effectively guarantee the area of contact of refrigerant pipe and base plate simultaneously, guarantees the heat dissipation cooling effect, and the base plate also can improve the bearing capacity of refrigerant pipe greatly simultaneously, guarantees stability in use.
In order to achieve the above object, the present invention provides a chip cooler, which comprises a substrate and a coolant pipe attached to the substrate;
the refrigerant pipe comprises a main body part and connecting pipe parts, wherein the main body part is in contact connection with the substrate, the connecting pipe parts are positioned at two ends of the main body part, the main body part is of a steamed bun-shaped structure, and the bottom plane of the main body part is attached to the substrate plane and is welded to the substrate plane.
Further setting the following steps: the refrigerant pipe corresponds the connecting pipe portion at both ends and is the setting of bending with the main part and the port that connects the pipe portion at both ends is the mouth structure that expands.
Further setting the following steps: at least one group of opposite outer edges of the base plate are turned upwards to form turned edges used for limiting and clamping the refrigerant pipes.
Further setting the following steps: the substrate is provided with a through hole for installation.
Compared with the prior art, the utility model discloses a with the refrigerant pipe lug weld of steamed bun shape on the base plate, simplified the structure greatly for manufacturing production is simpler, and the cost is cheaper, can effectively guarantee the area of contact of refrigerant pipe and base plate simultaneously, guarantees the heat dissipation cooling effect, and the base plate also can improve the bearing capacity of refrigerant pipe greatly simultaneously, guarantees stability in use.
Drawings
Fig. 1 is a schematic perspective view of a chip cooler according to the present invention;
FIG. 2 is a schematic diagram of a lateral cross-sectional configuration of the chip cooler of FIG. 1;
fig. 3 is a schematic longitudinal sectional view of the chip cooler of fig. 1.
The following reference numerals are marked thereon in conjunction with the accompanying drawings:
1. a substrate; 11. flanging; 12. a through hole; 2. a refrigerant pipe; 21. a main body portion; 22. a pipe receiving part; 221. and (5) opening expansion.
Detailed Description
In the following, an embodiment of the present invention will be described in detail with reference to the drawings, but it should be understood that the scope of the present invention is not limited by the embodiment.
The chip cooler of the present invention is shown in fig. 1 to 3, and includes a substrate 1 and a coolant pipe 2 welded to the substrate 1; the refrigerant pipe 2 comprises a main body part 21 connected with the base plate 1 in a contact manner and connecting pipe parts 22 positioned at two ends of the main body part 21, the pipe section of the main body part 21 is of a steamed bread-shaped structure, so that the bottom plane of the main body part 21 can be better attached to the base plate 1, the welding between the main body part and the base plate 1 is convenient, meanwhile, the contact area between the refrigerant pipe 2 and the base plate 1 can be effectively increased, the heat transfer efficiency between the refrigerant pipe 2 and the base plate 1 is improved, and the heat dissipation and cooling effects are further improved; meanwhile, the pressure-bearing capacity of the steamed bun-shaped main body part 21 is poor, and the pressure-bearing capacity of the main body part 21 can be improved by welding the steamed bun-shaped main body part on the base plate 1.
In the above scheme, in order to facilitate the connection of the connection pipe portion 22 of the refrigerant pipe 2 and the external pipe body, preferably, the pipe body of the connection pipe portion 22 is of a circular pipe structure, and the port of the connection pipe portion is formed with an expansion port 221 structure through inflation, so that the connection of the external pipe body can be facilitated.
In the above solution, in order to increase the contact area between the base plate 1 and the refrigerant pipe 2, at least two opposite outer edges of the base plate 1 are turned upwards to form the turned edges 11 for limiting the clamping main body 21, preferably, the peripheral outer edges of the base plate 1 are turned upwards to form the continuous turned edges 11; further, the substrate 1 is provided with a through hole 12 for mounting, so that the mounting can be facilitated.
Compared with the prior art, the utility model discloses a with the refrigerant pipe lug weld of steamed bun shape on the base plate, simplified the structure greatly for manufacturing production is simpler, and the cost is cheaper, can effectively guarantee the area of contact of refrigerant pipe and base plate simultaneously, guarantees the heat dissipation cooling effect, and the base plate also can improve the bearing capacity of refrigerant pipe greatly simultaneously, guarantees stability in use.
The above disclosure is only for the embodiment of the present invention, however, the present invention is not limited thereto, and any changes that can be considered by those skilled in the art should fall within the protection scope of the present invention.

Claims (4)

1. The chip cooler is characterized by comprising a substrate and a refrigerant pipe which is attached to the substrate;
the refrigerant pipe comprises a main body part and connecting pipe parts, wherein the main body part is in contact connection with the substrate, the connecting pipe parts are positioned at two ends of the main body part, the main body part is of a steamed bun-shaped structure, and the bottom plane of the main body part is attached to the substrate plane and is welded to the substrate plane.
2. The chip cooler according to claim 1, wherein the pipe connecting portions at the two ends of the refrigerant pipe corresponding to the main body portion are bent, and the end openings of the pipe connecting portions at the two ends are both of an expanded structure.
3. The chip cooler according to claim 1, wherein at least one set of opposing outer edges of the base plate are folded upward to form flanges for spacing and clamping the coolant pipes.
4. The chip cooler according to claim 1 or 3, wherein the substrate is provided with a through hole for mounting.
CN202120563603.8U 2021-03-18 2021-03-18 Chip cooler Active CN214279964U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120563603.8U CN214279964U (en) 2021-03-18 2021-03-18 Chip cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120563603.8U CN214279964U (en) 2021-03-18 2021-03-18 Chip cooler

Publications (1)

Publication Number Publication Date
CN214279964U true CN214279964U (en) 2021-09-24

Family

ID=77798424

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120563603.8U Active CN214279964U (en) 2021-03-18 2021-03-18 Chip cooler

Country Status (1)

Country Link
CN (1) CN214279964U (en)

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