CN203746830U - Module power packaging structure using double-side heat dissipation of water-cooled radiator - Google Patents
Module power packaging structure using double-side heat dissipation of water-cooled radiator Download PDFInfo
- Publication number
- CN203746830U CN203746830U CN201420044781.XU CN201420044781U CN203746830U CN 203746830 U CN203746830 U CN 203746830U CN 201420044781 U CN201420044781 U CN 201420044781U CN 203746830 U CN203746830 U CN 203746830U
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- China
- Prior art keywords
- water
- power
- radiator
- terminal
- filled radiator
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- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 4
- 238000004806 packaging method and process Methods 0.000 title abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000001746 injection moulding Methods 0.000 claims abstract description 4
- 230000005855 radiation Effects 0.000 claims description 16
- 238000003466 welding Methods 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005457 optimization Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A module power packaging structure using double-side heat dissipation of a water-cooled radiator comprises a flat-shaped water-cooled radiator with a water inlet and a water outlet. Upper and lower surfaces of the water-cooled radiator are packaged with power device units. A power terminal located on a shell surface is made into a shape which is convenience for nut fixation. A signal terminal which is located on a shell surface is specially made into a shape which has a good welding property and is good for PCB fixation and a clamping position function. The water-cooled radiator is directly and fixedly connected with an insulation substrate of the power device unit or is fixedly connected with the insulation substrate of the power device through a buffer material layer. The power terminal and the signal terminal are directly welded to a surface metal layer of the insulation substrate through an ultrasonic welding mode. The shell is fixedly connected with the radiator. The signal terminal and the power terminal are directly fixed to the shell in an injection molding mode. The structure has the characteristics that the structure is reasonable; usage and installation are convenient; a heat dissipation capability of the water-cooled radiator is fully used; a maximized power density is obtained and so on.
Description
Technical field
The utility model relates to a kind of modular power encapsulating structure that utilizes water-filled radiator two-side radiation, belong to electric automobile power module package technical field.
Background technology
Enter 21 century, automobile is more and more huger for the mankind's impact, and the conflict of its positive and negative is also day by day obvious.On the one hand, automobile brings convenient and swift, reliable and stable serviceability, brings huge facility to human lives, is also changing the mankind's life style.On the other hand, the fuel oil type of drive of orthodox car, is subject to gradually the mankind and pays close attention to, and floating and Continued of international oil price makes again the soaring of automobile cost of use for the seriously polluted property of atmosphere.Therefore, the development of electric automobile is more and more subject to people's concern and thinking.
The core controller of electric automobile, is the ability of power device, comprises power density, heat radiation, reliability and encapsulation ease for use etc.On the one hand, the development of automobile, required power device overall power density constantly promotes, i.e. the lifting of power to volume ratio.This miniaturization for controller, integrated of great advantage.On the other hand, the height vibrations environment for use of electric automobile, requires again power device to have more reliable anti-vibration ability.And, the framework of automobile engine nacelle, also the encapsulation of required power device has the terminal design layout of miniaturization, otherwise, will greatly take additional space configuration driven, power inlet wire etc., bring difficult point for densification and the rational deployment of enging cabin.
Utility model content
The purpose of this utility model is to overcome the deficiency that prior art exists, and provide a kind of rational in infrastructure, easy to install and use, fully apply the heat-sinking capability of water-filled radiator, obtain the modular power encapsulating structure that utilizes water-filled radiator two-side radiation of maximized power density.
The purpose of this utility model is achieved by the following technical solution, the described modular power encapsulating structure that utilizes water-filled radiator two-side radiation, it comprises a flat water-filled radiator with water inlet and delivery port, described water-filled radiator on two surfaces, be packaged with power device unit up and down, the power terminal being positioned in case surface is made into the shape that facilitates nut fixing, is positioned at equally signal terminal in case surface and is made specially good welds performance and be conducive to the shape of the fixing and clamping function of pcb board.
Directly or be fixedly connected with the dielectric substrate of power device unit by one deck cushioned material layer, described power terminal and signal terminal are directly welded in ultrasonic bonding mode on the surface metal-layer of dielectric substrate described water-filled radiator; Described shell is fixedly connected with radiator, and described signal terminal and the direct injection moulding of power terminal are fixed on shell.
The utility model is fully applied the heat-sinking capability of water-filled radiator, utilizes its two-sided heat radiation of carrying out power device, by its heat-sinking capability optimization, thereby obtains maximized power density.
The utility model, by water-filled radiator two-side radiation package power module, is directly welded in water-filled radiator surface by the insulating substrate of power device; The bottom of water-filled radiator Facing material and power device insulating lining, realizes direct or indirect solder joint by processing, and has similar thermal coefficient of expansion and realizes water-cooling and power module design requirement; In encapsulation, the utility model uses injection casing, directly power terminal, signal terminal ultrasonic bonding is fixed, flat outer cover height design etc., and the power density that realizes power device maximizes.
The utility model is the power module package requirement for high power density according to electric automobile etc., the two-sided power model that carries out of application water-filled radiator directly dispels the heat, the radiating efficiency of water-filled radiator is maximized, reduce to encapsulate additional devices, as heat-radiating substrate etc., thereby make the utlity model has rational in infrastructure, easy to install and use, fully the heat-sinking capability of application water-filled radiator, obtains the features such as maximized power density.
Brief description of the drawings
Fig. 1 is the schematic perspective view of water-filled radiator two-side radiation encapsulating structure described in the utility model.
Fig. 2 is the structural representation of water-filled radiator described in the utility model.
Fig. 3 is the combination schematic diagram of water-filled radiator described in the utility model surface and power device insulating substrate.
Fig. 4 is the ultrasonic bonding schematic diagram of signal terminal described in the utility model and power terminal.
Fig. 5 is the schematic diagram that is fixed of power device shell described in the utility model and water-filled radiator.
Fig. 6 is module terminals distribution schematic diagram described in the utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail: Fig. 1, shown in 2, the modular power encapsulating structure that utilizes water-filled radiator two-side radiation described in the utility model, it comprises a flat water-filled radiator 5 with water inlet 6 and delivery port 7, described water-filled radiator 5 on two surfaces, be packaged with power device unit 1 up and down, 8, be positioned at the lip-deep power terminal 2 of shell 1, 3 are made into the shape that facilitates nut fixing, be positioned at equally the lip-deep signal terminal 4 of shell 1 and made specially good welds performance and be conducive to the shape of the fixing and clamping function of pcb board.
Shown in Fig. 3,4,5, directly or be fixedly connected with the dielectric substrate of power device unit 1,8 by one deck cushioned material layer, described power terminal and signal terminal are directly welded in ultrasonic bonding mode on the surface metal-layer of dielectric substrate described water-filled radiator 5; Described shell is fixedly connected with radiator, and described signal terminal and the direct injection moulding of power terminal are fixed on shell.
Embodiment:
The utility model is optimized design to the power model integral type encapsulation of water-filled radiator two-side radiation, has realized the optimization of water-cooling ability and the maximization of power density encapsulation, for the application scenario of high power density, is significant.
As shown in Figure 1, the power model integral type encapsulation of water-filled radiator two-side radiation, there is single water-filled radiator 5, and be directly packaged in the power device unit 1,8 on upper and lower two surfaces, the upper and lower surface of water-filled radiator is respectively two power device unit heat radiations, realizes the optimization of heat radiation.The water inlet 6 of water-filled radiator and delivery port 7, lay respectively at the two ends, left and right of water-cooling, and its position is optimized adjustment according to the distributing position of power device thermal source, radiator heat-dissipation ability.Signal terminal 4 and power terminal 2,3, lay respectively at case surface.Power terminal shape facilitates nut to fix,
And signal terminal shape aims at pcb board welding design, there is good welding performance, and pcb board is fixed, clamping function.As seen from Figure 2, the power model of water-cooling double-faced packaging structure, what water-filled radiator adopted is flat radiator, has one or more flow inlets 6, one or more water exports 7.The entrance and exit of current distributes and size, need to distribute in conjunction with the package power size of power device and thermal source.The surface of water-filled radiator, all needs enough roughness requirements at tow sides, after special processing, can carry out the welding of power device dielectric substrate, carries out thus the fixing of power model.
Shown in Fig. 3, described heat-radiating substrate 5 on linking, needs in addition cushioning layer material 12 with power device dielectric substrate 9.Although the upper and lower surface material 10 of dielectric substrate, its thermal coefficient of expansion is consistent with heat-radiating substrate 5, but because power device is operated under higher junction temperature, for water-filled radiator, its heat-radiating substrate and power device junction temperature are more approaching, temperature is higher, and especially power device is in the time of inversion operating state, and the fluctuation of power device junction temperature is very violent.Violent temperature fluctuation, deposits the strength of connection at the end for heat-radiating substrate and insulation, is great test, must cushion, to extend its working life.
Shown in Fig. 4, the power terminal 13 of whole module and signal terminal 4, with the form of ultrasonic bonding, be directly welded in the upper surface metal level 10 of power device dielectric substrate.The form of ultrasonic bonding, can make the anti-vibration ability of power model greatly strengthen, and is more suitable for the contour vibrations occasion of electric automobile and uses.
Shown in Fig. 5, described radiator 5 is fixing with shell 1, is to carry out nut 14 lockings by the screw boss 15 on base plate of radiator surface with the shrinkage pool of shell relevant position to realize.
Figure 6 shows that the power model upper surface distribution map of radiator two-side radiation encapsulation, this upper surface distribution three phase full bridge circuit, but be three half-bridge structures independently.Therefore, three-phase alternating current lead-out terminal 13 is positioned at a side, and DC side inlet wire 2,3 is distributed in opposite side.Such distribution, can facilitate system installation power line to walk, and for DC side inlet wire distributes, can facilitate busbar design, the installation of low inductance.This applies for powerful power electronic system, is very important.
Claims (2)
1. one kind is utilized the modular power encapsulating structure of water-filled radiator two-side radiation, it comprises a flat water-filled radiator with water inlet and delivery port, it is characterized in that: described water-filled radiator on two surfaces, be packaged with power device unit up and down, the power terminal being positioned in case surface is made into the shape that facilitates nut fixing, is positioned at equally signal terminal in case surface and is made specially good welds performance and be conducive to the shape of the fixing and clamping function of pcb board.
2. the modular power encapsulating structure that utilizes water-filled radiator two-side radiation according to claim 1, it is characterized in that: directly or be fixedly connected with the dielectric substrate of power device unit by one deck cushioned material layer, described power terminal and signal terminal are directly welded in ultrasonic bonding mode on the surface metal-layer of dielectric substrate described water-filled radiator; Described shell is fixedly connected with radiator, and described signal terminal and the direct injection moulding of power terminal are fixed on shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420044781.XU CN203746830U (en) | 2014-01-24 | 2014-01-24 | Module power packaging structure using double-side heat dissipation of water-cooled radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420044781.XU CN203746830U (en) | 2014-01-24 | 2014-01-24 | Module power packaging structure using double-side heat dissipation of water-cooled radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203746830U true CN203746830U (en) | 2014-07-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420044781.XU Expired - Lifetime CN203746830U (en) | 2014-01-24 | 2014-01-24 | Module power packaging structure using double-side heat dissipation of water-cooled radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203746830U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103779294A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Power module packaging structure with water-cooled heat sink used for two-sided cooling |
| CN106558560A (en) * | 2015-09-29 | 2017-04-05 | 比亚迪股份有限公司 | Power model and the vehicle with which |
-
2014
- 2014-01-24 CN CN201420044781.XU patent/CN203746830U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103779294A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Power module packaging structure with water-cooled heat sink used for two-sided cooling |
| CN106558560A (en) * | 2015-09-29 | 2017-04-05 | 比亚迪股份有限公司 | Power model and the vehicle with which |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171222 Address after: Jiaxing City, Zhejiang province 314006 Nanhu District Branch Road No. 988 Patentee after: STARPOWER SEMICONDUCTOR Ltd. Address before: Jiaxing City, Zhejiang province 314006 Ring Road No. 18 Sidalu Patentee before: JIAXING STARPOWER MICROELECTRONICS Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140730 |