CN2657080Y - Cooling device for computer heating element - Google Patents

Cooling device for computer heating element Download PDF

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Publication number
CN2657080Y
CN2657080Y CN 200320112734 CN200320112734U CN2657080Y CN 2657080 Y CN2657080 Y CN 2657080Y CN 200320112734 CN200320112734 CN 200320112734 CN 200320112734 U CN200320112734 U CN 200320112734U CN 2657080 Y CN2657080 Y CN 2657080Y
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CN
China
Prior art keywords
pump
water
water tank
cooling device
computing machine
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Expired - Fee Related
Application number
CN 200320112734
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Chinese (zh)
Inventor
彭太江
刘九龙
阚君武
刘国君
孙晓峰
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Jilin University
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Jilin University
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Priority to CN 200320112734 priority Critical patent/CN2657080Y/en
Application granted granted Critical
Publication of CN2657080Y publication Critical patent/CN2657080Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model, which relates to a cooling device of a computer heating element, is a close-loop liquid cooling system which consists of a water tank connected by pipeline, a piezoelectric driving pump, a heat exchanger and a radiator. The piezoelectric driving pump is fixedly arranged in the water tank. A water outlet of the pump is directly communicated with the pipeline by an outlet on the water tank; a water inlet is directly communicated with a cavity of the water tank. By adopting the piezoelectric driving pump as the power plant for the circulation of coolant and being integrated with the water tank, the utility model has a compact system structure so as to reduce the volume of the whole cooling system. Furthermore, the radiator can be placed anywhere without restrictions of the inside space of the computer. The utility model with an elegant exterior is practical and can be widely used in all kinds of computers.

Description

The cooling device that is used for the computing machine heat generating member
Technical field
The utility model relates to a kind of cooling device that is used for the computing machine heat generating member.
Background technology
As everyone knows, heat dissipation problem is related to the stability of computing machine, all becomes the focus that computer manufacturer pays close attention to all the time, and particularly the notebook computer heat dissipation problem is perplexing each manufacturer always.Though the CPU production technology has reached 0.09 micron, radiator fan reaches more than 7000 commentaries on classics, and the restriction that endless noise and overclocking space are subjected to becomes hard nut to crack, and the focus of problem more and more concentrates on the fan.Because the powerful heat-carrying capacity of liquid itself and can controlledly make heat finish directed transfer, liquid cooling becomes the first-selected type of cooling of high-performance computer gradually.The advantage of liquid cooling is: can utilize that less power consumption reaches the circulating of liquid, work noise is very little, can utilize multiple mode to finish the heat radiation process.The heat load ability of liquid-cooling system is very big, be equivalent to 5 times of air cooling system, so the CPU working temperature is low and stable.
The traditional water cold heat sink generally is made up of submersible pump, storage box, bucket, water pipe etc.After system connected, water pump energising was injected storage box with the bucket inner cold water, and cold water is taken away computing machine heat generating member heat and is back in the bucket in the storage box, and is simple in structure, cost is low.Existing water-cooling heat radiating system improves to some extent on this basis, replaces bucket with water tank, and heating radiator adopts the heat radiation type structure that the heat of hot water in the radiating tube is outwards shed, and utilizes fan to strengthen radiating rate.Total system complex structure, cost are higher relatively, simultaneously bulky, be difficult to have living space in the general computing machine and hold water tank and heating radiator, thereby in application, be subjected to certain limitation, be unfavorable for that computing machine is integrated, particularly notebook computer will be realized the notion challenge of " thinner ", " littler ", " lighter ", and the miniaturization of water-cooling system has been proposed more harsh requirement.
Summary of the invention
The purpose of this utility model provides the cooling device that a kind of liquid-cooled is used for the computing machine heat generating member, to solve the problems referred to above that present computing machine cooling system exists, improves practicality, the reliability of computing machine cooling system.
The cooling device of the utility model computing machine heat generating member, the water tank, water pump, heat interchanger, the heating radiator that connect by pipeline) the closed loop liquid cooling system formed, it is characterized in that described water pump is a Piezoelectric Driving pump, this pump is installed in the water tank, the water delivering orifice of its pump directly is communicated with pipeline by the outlet that is located on the water tank, and its water inlet leads directly in water tank cavity.
The utility model is owing to adopt the Piezoelectric Driving pump as the liquid circulation propulsion system, and integrate with water tank, make the system architecture compactness, reduced the volume of whole cooling system, and heating radiator can arbitrarily be placed, be not subjected to the computer-internal limited space, can be widely used in various computing machines, practical, attractive in appearance generous again.
Description of drawings
Fig. 1 is the utility model chiller system synoptic diagram;
Fig. 2 is the pump of Piezoelectric Driving shown in Fig. 19 structural representations;
Fig. 3 is the 14 another way structural representations of heating radiator shown in Fig. 1;
Fig. 4 is 26 structural representations of FOUNTAIN PUMP shown in Fig. 3;
Embodiment
The embodiment that provides below in conjunction with accompanying drawing is described in further detail the utility model cooling device.
Embodiment 1
With reference to Fig. 1,2, the cooling device of the utility model computing machine heat generating member, the closed loop liquid cooling system that water tank 10, water pump, heat interchanger 3, the heating radiator 14 that is connected by pipeline 18 formed, it is characterized in that described water pump is a Piezoelectric Driving pump 9, this pump is installed in the water tank 10, the water delivering orifice 7 of its pump directly is communicated with pipeline 18 by the outlet 6 that is located on the water tank 10, and its water inlet 8 leads directly in water tank 10 inner chambers.11 is the water filling port of water tank 10, and 12 is the inlet of water tank 10.
Piezoelectric Driving pump 9 is formed in the following manner, the two ends that film piezo-electric pottery 25 and substrate 23 are pasted the piezoelectric vibrator of forming are installed on the end walls of the pump housing 24, be connected on film piezo-electric pottery 25 and the substrate 23 being provided with 8, two automatically controlled signal lines 20 of forward and reverse each other conical water outlet 7 and water inlet on the sidewall of the pump housing 24.
Heat interchanger 3 be on a copper billet, directly process heat exchanger channels 1 and enter the mouth 5 and outlet 4 form.
Heating radiator 14 is made up of heat dissipation box 16 and the radiating tube 15 that is welded on the one side, all is covered with convection current hole 21 on other sides of heat dissipation box 16, and the going into of radiating tube 15, water delivering orifice 17,13 are connected with pipeline 18.
Its course of work is as follows: after the piezoelectric vibrator of giving Piezoelectric Driving pump 9 applies given signal, piezoelectricity shakes in the beginning flexural vibrations, pump chamber 22 volumes change, utilize the directed flow of the resistance difference formation fluid of water inlet 8 and water delivering orifice 7 convection cells, liquid coolant 19 is pumped to heat interchanger 3, temperature raises behind the heat of the liquid coolant 19 absorption computing machine heat generating members 2 in the heat interchanger 3, advance people's heating radiator 14, by radiating tube 15 heat is come out, coolant temperature reduces and circulation enters water tank 10, and so forth, realizes the circulation of liquid coolant, the heat that the computing machine heat generating member produces is taken away, reached the cooling purpose.
Embodiment 2
Press the cooling system that embodiment 1 forms, also heating radiator 14 can be made by mode shown in Figure 3, promptly the heat dissipation box 16 of heating radiator 14 is one to be marked with the water tank of liquid coolant, wherein also sets firmly a FOUNTAIN PUMP 26, the water inlet 28 of its pump places liquid coolant, and radiating tube 15 is welded on the bottom surface of heat dissipation box 16.This FOUNTAIN PUMP 26 is Piezoelectric Driving pumps of forming by mode shown in Figure 4, the two ends that film piezo-electric pottery 25 and substrate 23 are pasted the piezoelectric vibrator of forming are installed on the end walls of the pump housing 24, be connected on film piezo-electric pottery 25 and the substrate 23 being provided with 28, two automatically controlled signal lines of forward and reverse each other conical water outlet 27 and water inlet (20) on the end walls of the pump housing 24.
This heating radiator is the liquid coolant 19 that sucks the heat dissipation box 16 from its water inlet 28 by FOUNTAIN PUMP 26, and from its water delivering orifice 27 ejections, the heat that quickens high temperature coolant 19 in the radiating tube 15 sheds.The heating radiator practicality of this kind form, attractive in appearance, generous makes things convenient for the user to arrange.

Claims (6)

1. cooling device that is used for the computing machine heat generating member, the closed loop liquid cooling system that water tank (10), water pump, heat interchanger (3), the heating radiator (14) that is connected by pipeline (18) formed, it is characterized in that described water pump is a Piezoelectric Driving pump (9), this pump is installed in the water tank (10), the water delivering orifice of its pump (7) directly is communicated with pipeline (18) by the outlet (6) that is located on the water tank (10), and its water inlet (8) leads directly in water tank (10) inner chamber.
2. the cooling device that is used for the computing machine heat generating member according to claim 1, it is characterized in that described Piezoelectric Driving pump (9) forms in the following manner, the two ends that film piezo-electric pottery (25) and substrate (23) are pasted the piezoelectric vibrator of forming are installed on the end walls of the pump housing (24), be provided with forward and reverse each other conical water outlet (7) and water inlet (8) on the sidewall of the pump housing (24), two automatically controlled signal lines (20) are connected on film piezo-electric pottery (25) and the substrate (23).
3. the cooling device that is used for the computing machine heat generating member according to claim 1, it is characterized in that described heating radiator (14) is made up of heat dissipation box (16) and the radiating tube (15) that is welded on the one side, all be covered with convection current hole (21) on other sides of heat dissipation box (16), the going into of radiating tube (15), water delivering orifice (17), (13) are connected with pipeline (18).
4. the cooling device that is used for the computing machine heat generating member according to claim 1 is characterized in that described heat interchanger (3) is directly to process heat exchanger channels (1) and inlet (5) and outlet (4) to form on a copper billet.
5. the cooling device that is used for the computing machine heat generating member according to claim 1, the heat dissipation box (16) that it is characterized in that described heating radiator (14) is one to be marked with the water tank of liquid coolant, wherein also set firmly a FOUNTAIN PUMP (26), the water inlet of its pump (28) places liquid coolant, and radiating tube (15) is welded on the bottom surface of heat dissipation box (16).
6. the cooling device that is used for the computing machine heat generating member according to claim 1, it is characterized in that described FOUNTAIN PUMP (26) forms in the following manner, the two ends that film piezo-electric pottery (25) and substrate (23) are pasted the piezoelectric vibrator of forming are installed on the end walls of the pump housing (24), be provided with forward and reverse each other conical water outlet (27) and water inlet (28) on the end walls of the pump housing (24), two automatically controlled signal lines (20) are connected on film piezo-electric pottery (25) and the substrate (23).
CN 200320112734 2003-11-14 2003-11-14 Cooling device for computer heating element Expired - Fee Related CN2657080Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200320112734 CN2657080Y (en) 2003-11-14 2003-11-14 Cooling device for computer heating element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200320112734 CN2657080Y (en) 2003-11-14 2003-11-14 Cooling device for computer heating element

Publications (1)

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CN2657080Y true CN2657080Y (en) 2004-11-17

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100372107C (en) * 2005-01-10 2008-02-27 富准精密工业(深圳)有限公司 Liquid-cooled heat sink
WO2013061250A1 (en) * 2011-10-25 2013-05-02 International Business Machines Corporation Cooling unit
CN104699209A (en) * 2015-04-03 2015-06-10 肖海蓉 Spiral cooling structure of computer
WO2017088840A1 (en) * 2015-11-12 2017-06-01 深圳市研派科技有限公司 Liquid cooling radiation system and liquid radiator thereof
CN107983718A (en) * 2017-12-28 2018-05-04 徐工集团工程机械有限公司 Fused salt ULTRASONIC COMPLEX cleaning system
CN115235275A (en) * 2022-06-30 2022-10-25 歌尔股份有限公司 Loop heat pipe structure and electronic equipment

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100372107C (en) * 2005-01-10 2008-02-27 富准精密工业(深圳)有限公司 Liquid-cooled heat sink
WO2013061250A1 (en) * 2011-10-25 2013-05-02 International Business Machines Corporation Cooling unit
US8711563B2 (en) 2011-10-25 2014-04-29 International Business Machines Corporation Dry-cooling unit with gravity-assisted coolant flow
GB2514263A (en) * 2011-10-25 2014-11-19 Ibm Cooling unit
US9013872B2 (en) 2011-10-25 2015-04-21 International Business Machines Corporation Dry-cooling unit with gravity-assisted coolant flow
GB2514263B (en) * 2011-10-25 2017-12-27 Ibm Cooling unit
CN104699209A (en) * 2015-04-03 2015-06-10 肖海蓉 Spiral cooling structure of computer
CN104699209B (en) * 2015-04-03 2017-11-21 陕西理工大学 Computer spiral heat dissipation structure
WO2017088840A1 (en) * 2015-11-12 2017-06-01 深圳市研派科技有限公司 Liquid cooling radiation system and liquid radiator thereof
CN107983718A (en) * 2017-12-28 2018-05-04 徐工集团工程机械有限公司 Fused salt ULTRASONIC COMPLEX cleaning system
CN115235275A (en) * 2022-06-30 2022-10-25 歌尔股份有限公司 Loop heat pipe structure and electronic equipment

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C19 Lapse of patent right due to non-payment of the annual fee
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