CN100423244C - Integration computer chip liquid cooler - Google Patents
Integration computer chip liquid cooler Download PDFInfo
- Publication number
- CN100423244C CN100423244C CNB2005100172916A CN200510017291A CN100423244C CN 100423244 C CN100423244 C CN 100423244C CN B2005100172916 A CNB2005100172916 A CN B2005100172916A CN 200510017291 A CN200510017291 A CN 200510017291A CN 100423244 C CN100423244 C CN 100423244C
- Authority
- CN
- China
- Prior art keywords
- radiator
- heat
- piezoelectric pump
- water inlet
- computer chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a liquid cooler for integrated computer chips, which belongs to a liquid cooling system for computer chips. A water outlet of a heat absorption block is connected with a water inlet of a radiator through a connecting pipe, the radiator is fixedly connected in an integrated box, and a piezoelectric pump is also fixedly connected in the integrated box. A water inlet of the piezoelectric pump is connected with a water outlet of the radiator through a connecting pipe, and the water outlet of the piezoelectric pump is connected with a water inlet of the heat absorption block through a connecting pipe. The present invention has the advantages of no need of water tanks, decreased volume of the system, easy integration, high integrated levels, easy installation, convenient use, decreased temperature of the chips and increased stability of computers, and the noise brought by the computers, which is caused by high-speed fans, can also be decreased.
Description
Technical field
The present invention relates to a kind of computer chip liquid-cooling system.
Background technology
As everyone knows, heat dissipation problem is related to the stability of computer run, all becomes the focus that computer manufacturer pays close attention to all the time.According to Moore's Law, computer chip just will be upgraded once in per 18 months, chip production technology has reached 0.09 micron, radiator fan reaches more than 7000 rev/mins, the heating problem that brings thus and the noise of radiator fan, it is technical to make that people transfer to computer to dissipate heat with focus, and various heat sinking technology become the focus of people's research.Because the powerful heat-carrying capacity of liquid and can controlledly make heat finish directed transfer itself, liquid cools becomes the first-selected type of cooling of high-performance computer gradually, and its advantage is: can utilize that less power consumption reaches the circulating of liquid, work noise is very little, can utilize multiple mode to finish the heat radiation process.The heat load ability of liquid-cooling system is very big, be equivalent to 5 times of air cooling system, so the CPU working temperature is low and stable.
The traditional water cold heat sink generally is made up of immersible pump, storage box, bucket, water pipe etc.After system connected, the water pump energising was injected storage box with the bucket inner cold water, and cold water is taken away computer heat generating member heat and is back in the bucket in the storage box, forms boiler water circulation thus the computer chip heat is taken away.Existing water-cooling heat radiating system improves to some extent on this basis, replaces bucket with water tank, and immersible pump is imbedded in the water tank, and radiator adopts the heat radiation type structure to dispel the heat, and utilizes fan to strengthen radiating rate.The shortcoming of whole system is a complex structure, bulky, is not easy to integratedly, is not easy to install and use in computer, is subjected to more restriction in the application.The modern computer Highgrade integration is to the miniaturization of water-cooling system, the high integrated more harsh requirement that proposed.
Summary of the invention
The invention provides a kind of integration computer chip liquid-cooling system, to solve the problem that present computer chip liquid-cooling system adopts the separate type design.The technical scheme that the present invention takes is:
The heat-absorbing block delivery port is connected with water inlet of radiator by tube connector, this radiator is fixedly connected in the integrated box, also fixedly connected piezoelectric pump in this integrated box, the water inlet of this piezoelectric pump is connected by tube connector with radiator outlet, and the delivery port of this piezoelectric pump is connected by tube connector with the heat-absorbing block water inlet.
In one embodiment of this invention: integrated box internal fixation connects fan.
In one embodiment of this invention: integrated box internal fixation connects fan, and this number of fans is 1～3.
In one embodiment of this invention: heat-absorbing block quantity is 1～5.
The present invention adopts the piezoelectric pump of high pressure, big flow as the liquid circulation power set, its output pressure height, flow are big, do not resemble the inlet of pump to be imbedded in the water and could be worked the immersible pump, thereby this device do not need water tank, reduced system bulk, be easy to integrated.Whole device integrated level height, installation and easy to use easily.
This device each several part connects and guarantees that reliably cooling fluid do not have leakage, can the regular replenishment cooling fluid, and can not leak and cause damage computer chip or other hardware because of cooling fluid.The rotation speed of the fan that device adopts is lower, and noise is little, adopts this liquid-cooling system, has reduced the noise that computer brings because of high speed fan, and chip temperature has also reduced, and has improved computer stability.
Description of drawings
Fig. 1, structural principle block diagram of the present invention;
The structural representation of Fig. 2, the embodiment of the invention one, lid does not draw among the figure;
The left view of Fig. 3, Fig. 2;
Fig. 4, the present invention have the theory diagram of fan;
The structural representation of Fig. 5, the embodiment of the invention two, lid does not draw among the figure;
The left view of Fig. 6, Fig. 5;
The structural representation of Fig. 7, the embodiment of the invention three,
The left view of Fig. 8, Fig. 7;
Fig. 9, the present invention heat spreader structures schematic diagram;
Figure 10, the present invention piezoelectric pump structural representation;
Figure 11, the present invention heat-absorbing block internal structure schematic diagram.
1, heat-absorbing block, 2, piezoelectric pump, 3, radiator, 4, integrated box, 5, flexible pipe, 6, fan, 7, drive circuit, 8, integrated lid, 9, fin, 10, U type pipe, 11, the pump housing, 12, piezoelectric ceramic piece, 13, import valve block, 14, the outlet valve block, 15, cavity, 16, piezoelectric pump water inlet, 17, piezoelectric pump delivery port, 18, connecting duct.
Embodiment
The present invention adopts piezoelectric pump to realize the circulation of cooling fluid, and piezoelectric pump mainly is made up of the pump housing, piezoelectric ceramic and import and export valve block etc., and when piezoelectric pump was worked under given signal, piezoelectric ceramic produced flexural vibrations, and the pump chamber volume back and forth changes.When the pump chamber volume became big, piezoelectric pump sucked cooling fluid from radiator; During the pump chamber smaller volume, piezoelectric pump pumps into heat-absorbing block to cooling fluid from delivery port, and under the effect of piezoelectric pump output pressure, cooling fluid enters radiator from heat-absorbing block, and so forth, realizes the circulation of cooling fluid.The present invention has adopted 200ml/min～1200ml/min flow, the piezoelectric pump of 10Kpa～70Kpa pressure.
The radiator that the present invention adopts is made up of fin, U type pipe, U type tube connector and radiator fixed head, and the U type pipe of radiator constitutes the coolant flow pipeline, enters radiator from water inlet, enters piezoelectric pump from delivery port, and fin has increased area of dissipation.This heat spreader structures is simple, and is easy to make, can design the pipeline direction as required.
The present invention is divided into two parts, and a part is for mounting heat-absorbing block on the computer chip, another part be one with CD-ROM integrated box of a size, the drive circuit of piezoelectric pump, radiator, fan and piezoelectric pump and fan is housed in this box.Couple together with flexible pipe between heat-absorbing block and the integrated box, box can be installed in optical driver of computer floppy drive or the hard disk expansion slot or by the user and freely place.
Embodiment one:
Referring to Fig. 1, Fig. 2, Fig. 3, Fig. 9, Figure 10, Figure 11, heat-absorbing block 1 delivery port is connected with radiator 3 water inlets by connecting flexible pipe 5, this radiator is fixedly connected in the integrated box 4, also fixedly connected piezoelectric pump 2 in this integrated box, the water inlet of this piezoelectric pump connects by being connected flexible pipe with radiator outlet, the delivery port of this piezoelectric pump connects by being connected flexible pipe with the heat-absorbing block water inlet, and drive circuit 7 is fixedly connected in the integrated box, is piezoelectric pump, fan power supply.
Embodiment two:
In conjunction with Fig. 4, Fig. 5, Fig. 6, Fig. 9, Figure 10, shown in Figure 11, comprise heat-absorbing block 1, integrated box 4 two parts, link to each other with connecting flexible pipe 5 between them, integrated box 4 internal fixation connect piezoelectric pump 2,3,3 fans 6 of radiator, drive circuit 7, the delivery port 17 of piezoelectric pump 2 links to each other with heat-absorbing block 1, the another one mouth of the water inlet of radiator 3 and heat-absorbing block 1 links to each other, the delivery port of radiator 3 links to each other with the water inlet of piezoelectric pump 16, thus, just be linked to be a unidirectional cooling liquid circulation circuit with connecting flexible pipe 5 between heat-absorbing block 1, piezoelectric pump 2, the radiator 3; Wherein the fan group is fixedly connected on the top of integrated box.Piezoelectric pump 2 is by piezoelectric ceramic piece 12, import valve block 13, outlet valve block 14, delivery port 17, water inlet 16, and the pump housing 11 is formed, by piezoelectric ceramic piece 12, the pump housing 11 and valve block 13,14 have surrounded the cavity 15 of piezoelectric pump 2 jointly, and piezoelectric ceramic piece 12 double vibrations under the drive signal effect makes cavity 15 change in volume, cooling fluid is under the acting in conjunction of valve block 13,14, flow into from water inlet 16, flow out, form one-way flow from delivery port 17.
Its operation principle is as follows: when piezoelectric pump 2 is started working, cooling fluid just circulates according to the pipeline of piezoelectric pump 2 → heat-absorbing block 1 → radiator 3 → piezoelectric pump 2, fan 6 is arranged in the front end of integrated box 4, leave air duct on integrated box 4 front panels and side and the rear board, during fan work, box 4 outer cold wind are blowed to radiator 3, form forced convertion.
The process of exchange heat and transfer is as follows: the coolant temperature that flows to piezoelectric pump 2 from radiator 3 is lower, under the effect of piezoelectric pump 2, cryogenic liquid pumped into heat-absorbing block 1, cooling fluid is a high temperature coolant through heat-absorbing block 1 internal duct circulation back inflow radiator 3, high temperature coolant circulates in the U of radiator 3 type pipeline 10, the one, by fin 9 heat is distributed, in addition also under the forced convertion effect of fan 6, rapidly heat is distributed, after being reduced, coolant temperature flows to piezoelectric pump 2, cooling fluid circulates and so forth, has reached the effect that reduces chip temperature.
This device has improved level of integrated system with in boxes 4 of integrated installation such as piezoelectric pump 2, radiator 3, fan 6, drive circuit 7.As long as the user is inserted into this box 7 in the suitable expansion slot, heat-absorbing block 1 is withheld on the chip of needs cooling, drive circuit 7 external computer power supplies, system just can operate as normal.
Embodiment three
On the basis of embodiment two, can use 3 heat-absorbing blocks 1, be connected with radiator 3 with connecting flexible pipe 5 respectively, this method of attachment is this area method commonly used, can cool off computer CPU chip, south bridge and north bridge, and is respond well.
Embodiment four:
In conjunction with Fig. 4, Fig. 7, Fig. 8, Fig. 9, Figure 10, shown in Figure 11, the computer chip liquid-cooling system comprises heat-absorbing block 1, integrated box 4 two parts, links to each other with connecting flexible pipe 5 between them.Be furnished with piezoelectric pump 2, radiator 3, fan 6, drive circuit 7 in the box 4, the delivery port 17 of piezoelectric pump 2 links to each other with heat-absorbing block 1, the another one mouth of the water inlet of radiator 3 and heat-absorbing block 1 links to each other, the delivery port of radiator 3 links to each other with the water inlet of piezoelectric pump 16, thus, just be linked to be a unidirectional cooling liquid circulation circuit with flexible pipe 5 between heat-absorbing block 1, piezoelectric pump 2, the radiator 3, fan is fixedly connected on inner surface of box, on box lid 8, it can be dried to spreader surface in the present embodiment.
Embodiment five
On the basis of embodiment four, can use 5 heat-absorbing blocks 1, be connected with radiator 3 with hose connector 5 respectively.Can cool off computer CPU chip, video card chip, south bridge and north bridge, respond well.
Claims (4)
1. integration computer chip Control device of liquid cooling, the delivery port that mounts the heat-absorbing block on the computer chip is connected with water inlet of radiator by tube connector, it is characterized in that: this radiator is fixedly connected in the integrated box, also fixedly connected piezoelectric pump in this integrated box, the water inlet of this piezoelectric pump is connected by tube connector with radiator outlet, and the delivery port of this piezoelectric pump is connected by tube connector with the heat-absorbing block water inlet.
2. integration computer chip Control device of liquid cooling according to claim 1 is characterized in that: integrated box internal fixation connects fan.
3. integration computer chip Control device of liquid cooling according to claim 2 is characterized in that: this number of fans is 1～3.
4. according to claim 1,2 or 3 described integration computer chip Control device of liquid cooling, it is characterized in that: heat-absorbing block quantity is 1～5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100172916A CN100423244C (en) | 2005-11-18 | 2005-11-18 | Integration computer chip liquid cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100172916A CN100423244C (en) | 2005-11-18 | 2005-11-18 | Integration computer chip liquid cooler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1801484A CN1801484A (en) | 2006-07-12 |
| CN100423244C true CN100423244C (en) | 2008-10-01 |
Family
ID=36811348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100172916A Expired - Fee Related CN100423244C (en) | 2005-11-18 | 2005-11-18 | Integration computer chip liquid cooler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100423244C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650614B (en) * | 2019-09-10 | 2020-08-18 | 西安交通大学 | Electronic chip heat dissipation experimental device based on thin film evaporation |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001355574A (en) * | 2000-06-13 | 2001-12-26 | Matsushita Electric Ind Co Ltd | Piezoelectric pump and cooling device using same |
| US20030151892A1 (en) * | 2002-02-08 | 2003-08-14 | Hitachi, Ltd. | Liquid cooling system with structure for liquid supply and electric device |
| US6697253B2 (en) * | 2000-12-20 | 2004-02-24 | Hitachi, Ltd. | Liquid cooling system and personal computer using thereof |
| CN2849966Y (en) * | 2005-11-18 | 2006-12-20 | 杨志刚 | Liquid cooler for integrated computer chip |
-
2005
- 2005-11-18 CN CNB2005100172916A patent/CN100423244C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001355574A (en) * | 2000-06-13 | 2001-12-26 | Matsushita Electric Ind Co Ltd | Piezoelectric pump and cooling device using same |
| US6697253B2 (en) * | 2000-12-20 | 2004-02-24 | Hitachi, Ltd. | Liquid cooling system and personal computer using thereof |
| US20030151892A1 (en) * | 2002-02-08 | 2003-08-14 | Hitachi, Ltd. | Liquid cooling system with structure for liquid supply and electric device |
| CN2849966Y (en) * | 2005-11-18 | 2006-12-20 | 杨志刚 | Liquid cooler for integrated computer chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1801484A (en) | 2006-07-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1964610A (en) | A liquid cooling heat radiator | |
| CN207780708U (en) | A kind of server liquid-cooling heat radiator | |
| CN2849966Y (en) | Liquid cooler for integrated computer chip | |
| CN208722133U (en) | A kind of dust-proof water cooling cooling type computer case | |
| CN109388215A (en) | A kind of air-cooled combined type heat radiating system of reinforcement type liquid cooling and control method | |
| CN2741096Y (en) | Liquid-cooled radiator of computer | |
| WO2018176535A1 (en) | Novel mechanical pump liquid-cooling heat-dissipation system | |
| CN210605614U (en) | Heat abstractor for computer machine case | |
| CN210075872U (en) | Liquid cooling subrack | |
| CN100423244C (en) | Integration computer chip liquid cooler | |
| CN206773628U (en) | A kind of water-filled radiator | |
| CN2909802Y (en) | Water-cooled radiator of extendable heat absorption element | |
| CN211236835U (en) | Computer CPU heat abstractor | |
| TWM273765U (en) | Water-cooling type heat sink device also having ventilation effect for mechanical case | |
| CN205491614U (en) | Integral type cooling device | |
| CN2657080Y (en) | Cooling device for computer heating element | |
| CN2619076Y (en) | Computer water cooler using micro circulation pump | |
| CN206788780U (en) | A kind of liquid immersion type data center | |
| CN221008078U (en) | Cooling system based on liquid cooling technology in monolithic liquid crystal projector | |
| CN201210784Y (en) | Heat radiator | |
| CN218974877U (en) | Special integral type water-cooling radiator of CPU | |
| CN213365443U (en) | Three-dimensional runner cooling machine case | |
| CN221860951U (en) | Integrated water-cooling heat dissipation device | |
| CN217506471U (en) | Pump pipe integral type water-cooling radiator | |
| CN202697124U (en) | Liquid-cooled heat dissipation device used for electronic element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081001 Termination date: 20091218 |