CN2619076Y - Computer water cooler using micro circulation pump - Google Patents
Computer water cooler using micro circulation pump Download PDFInfo
- Publication number
- CN2619076Y CN2619076Y CN 03263430 CN03263430U CN2619076Y CN 2619076 Y CN2619076 Y CN 2619076Y CN 03263430 CN03263430 CN 03263430 CN 03263430 U CN03263430 U CN 03263430U CN 2619076 Y CN2619076 Y CN 2619076Y
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- Prior art keywords
- water
- pump
- computer
- cpu
- power supply
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 230000004089 microcirculation Effects 0.000 title claims abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 23
- 230000004087 circulation Effects 0.000 claims abstract description 9
- 239000000498 cooling water Substances 0.000 claims abstract description 7
- 230000005855 radiation Effects 0.000 claims description 18
- 230000017525 heat dissipation Effects 0.000 abstract 5
- 238000004064 recycling Methods 0.000 abstract 2
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A computer water cooling device which uses the microcirculation pump is disclosed, including a water pump, a water pump power supply, pipes, connecting pipes of each part and a water inlet interface and a water outlet interface. The characteristics are that: a heat conduction cavity for recycling water flowing is fixed inside the computer instead of a fan, and the computer casing is provided with a heat dissipation panel with recycling water inside. The device connection is: after the pump starts, the cooling water moves from the water outlet and the connecting soft pipe, and goes through by turns the heat conduction cavity, the heat dissipation panel, and then through the connecting soft pipe and the water inlet and back to the pump to form a circulation. The device can has two designs of water cooling methods. One is a water cooling device especially used for CPU heat dissipation, and the heat conduction cavity is a hollow metal cavity which can be fixed on the CPU; the other is a water cooling device used at the same time for CPU and inside-computer power supply box heat dissipation, and the heat conduction cavity is also of hollow metal cavity structure, but the position of a last steady voltage circuit of the inside-computer power supply box is close to the hollow metal cavity and fixed on it. The device has characters of low noise, good heat dissipation effect and low total cooling cost.
Description
Technical field:
The present invention is to use the computer water-cooling device of micro circulation pump, relates to a kind of mode of computer to dissipate heat.
Background technique:
Present employed computer is because the CPU level of integration is very high, crystal oscillator frequency is also very high, the heat that is produced during CPU work is very big, for CPU energy proper functioning, usually paste a metallic heat radiating plate in the front of CPU, a small-sized fans is installed on Heat sink, and the high speed rotating by fan makes air flows, take away the heat on the Heat sink, this radiating mode is called air-cooled.In addition, a fan that plays thermolysis is also arranged in the power box of desk top computer.Air-cooled shortcoming is that fan high speed rotating disturbance air can produce the offending noise of other people.In addition, along with CPU frequency is more and more higher, the heat that it produced can be multiplied, and air-cooledly can't satisfy the heat radiation requirement.
Summary of the invention:
The purpose of this utility model is to overcome the deficiency of wind-cooling heat dissipating, designs the cooling that a kind of water cooling plant is used for main high temperature spare in the computer, so that computer also can guarantee good heat radiating under the high temperature of 30-40 degree, and reaches the low noise operation.
The utility model is a kind of computer water-cooling device that uses the micro circulation pump, include water pump, pump power, pipeline, and the connecting tube of each parts and advancing, the water outlet interface, be characterised in that, need use fan-cooled component locations in computer-internal, fixed and replaced the heat conduction cavity that fan can supply circulating water to flow, and computer housing is provided with the Heat sink that can supply circulating water to flow, being connected to of whole device: behind the starting mode of pump, cooling water is through water outlet and connect flexible pipe successively through the heat conduction cavity, Heat sink, again through connecting flexible pipe, water intake flows back to water pump, finishes a circulation.
Heat sink is interior on the computer housing of the present utility model, being arranged to can be by the pectination radiating groove structure of circulating water, and the heat conduction cavity adopts can be for the mobile metal cavitg of circulating water; Structure according to computer main can design two kinds of water-cooling patterns; The water cooling plant that is exclusively used in the CPU heat radiation is characterized in that, metal cavitg is for can be fixed on metal cavitg on the CPU, behind the starting mode of pump cooling water through water outlet and connect flexible pipe successively through this metal cavitg, flow through the Heat sink of computer housing upper comb shape radiating groove structural formula, after the casing heat radiation, water outlet by the bottom, flow back to water pump through connection flexible pipe, water intake again, finish a circulation.
The water cooling plant that can be used for the heat radiation of CPU and internal power supply case simultaneously is characterized in that, internal power supply case heat conduction cavity still adopts the metal cavitg structure, position, afterbody mu balanced circuit place is near this metal cavitg in the internal power supply case, and it is fixed thereon, cooling water is through water outlet and connect flexible pipe successively through the metal cavitg of CPU position behind the starting mode of pump, the metal cavitg of internal power supply case position, flow through the Heat sink of computer housing upper comb shape radiating groove structural formula, after the casing heat radiation, water outlet by the bottom, again through connecting flexible pipe, water intake flows back to water pump, finishes a circulation.
Radiating principle of the present utility model is to utilize the micro circulation pump that water is circulated in the pipeline of sealing, after the water that temperature is lower enters the metal heat-conducting chamber that is fixed on CPU and the internal power supply case, carry out heat exchange with CPU and internal power supply case, water temperature is raise, thereby take away the heat that is produced.The water of heat enters in the pipeline that is arranged on the Heat sink on the computer housing, and heat is loose in air, reaches the purpose of heat radiation.Water after the heat radiation carries out next one circulation by the water inlet of pipeline inflow Micropump.
Main feature of the present utility model is: 1) low noise.The pyroconductivity of water is more than the air height, so the speed of current can be very low, so do not produce mobile noise substantially in flowing, uses a micropower, low-noise water pump in addition, and the noise in the computer run is descended significantly; 2) because the computer supply case also is designed to water-cooling structure, use same coolant pump water-cooled, remove two radiation fans like this, the comprehensive hardware cost of computer cooling is descended; 3) computer adopts water-cooled, can be in the medium-term and long-term work of the ambient temperature of 0-40 degree.
Description of drawings:
Fig. 1: the theory structure schematic representation that is exclusively used in the water cooling plant of CPU heat radiation
1, flexible pipe 2, water outlet 3, be fixed on metal cavitg 4, water intake on the CPU
5, the Heat sink of water pump 6, computer housing 7, pectination radiating groove formation;
Fig. 2: the theory structure schematic representation that is used for the water cooling plant of CPU and internal power supply case heat radiation simultaneously
8, be fixed on the metal cavitg of power pack one side in the computer;
Fig. 3: the water cooling plant mounting structure schematic representation in computer that is exclusively used in the CPU heat radiation
9, mainboard in CPU 10, the computer;
Fig. 4: the water cooling plant mounting structure schematic representation in computer that is used for the heat radiation of CPU and internal power supply case simultaneously
11, position, afterbody mu balanced circuit place signal in the power supply punch-out equipment in the computer.
Embodiment:
1-4 adopts conventional machining technique to carry out design and installation in conjunction with the accompanying drawings.Water pump adopts micro pump during design, uses ac power supply.Water-outlet quantity requires greater than 1L/min, and lift is placed on the lower position in the computer casing greater than 250mmH2O.Be to reduce cost, the pressure in the circulation loop is only a little more than barometric pressure, the connecting tube of pipeline use General Purpose Rubber pipe or plastic tube all can, the joint does not need special waterproof to reveal measure.
When the water cooling plant of design and installation CPU heat radiation, the height of micro pump is lower than the position of CPU; The water outlet of micro pump links to each other by flexible pipe with the CPU thermal conductive cavity.The heat conduction cavity adopts the metal cavitg structure, and height is not more than 10mm, and the long and wide size that is slightly larger than CPU is fixed on the CPU.After entering metal cavitg from the water of water pump, carry out heat exchange, take away the heat of CPU with CPU.
When water cooling plant that design and installation CPU and internal power supply case dispel the heat simultaneously, power pack thermal conductive cavity 8 structures are same as CPU thermal conductive cavity 3 except that size, in the internal power supply case position, afterbody mu balanced circuit place near this metal cavitg, and fixed thereonly carry out heat exchange, reach the purpose of heat radiation.
Claims (3)
1, a kind of computer water-cooling device that uses the micro circulation pump, include water pump, pump power, pipeline, and the connecting tube and the water-in and water-out interface of each parts, of the present utility model being characterised in that, having fixed the replacement fan in computer-internal can be for the mobile heat conduction cavity of circulating water, and computer housing is provided with the Heat sink that can supply circulating water to flow, being connected to of whole device: behind the starting mode of pump, cooling water is through water outlet and connect flexible pipe successively through heat conduction cavity, Heat sink, flow back to water pump through connection flexible pipe, water intake again, finish a circulation.
2, according to the computer water-cooling device of the use micro circulation pump shown in the claim 1, the water cooling plant that is exclusively used in the CPU heat radiation is characterized in that, the heat conduction cavity adopts structure for can be fixed on metal cavitg on the CPU, be arranged to pectination radiating groove structure on the computer housing in the Heat sink, behind the starting mode of pump cooling water through water outlet and connect flexible pipe successively through this metal cavitg, flow through the Heat sink of computer housing upper comb shape radiating groove structural formula, after the casing heat radiation, water outlet by the bottom, flow back to water pump through connection flexible pipe, water intake again, finish a circulation.
3, computer water-cooling device according to the use micro circulation pump shown in claim 1 or 2, the water cooling plant that can be used for the heat radiation of CPU and internal power supply case simultaneously is characterized in that, internal power supply case heat conduction cavity still adopts the metal cavitg structure, position, afterbody mu balanced circuit place is near this metal cavitg in the internal power supply case, and it is fixed thereon, cooling water is through water outlet and connect flexible pipe successively through the metal cavitg of CPU position behind the starting mode of pump, the metal cavitg of internal power supply case position, flow through the Heat sink of computer housing upper comb shape radiating groove structural formula, after the casing heat radiation, water outlet by the bottom, again through connecting flexible pipe, water intake flows back to water pump, finishes a circulation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03263430 CN2619076Y (en) | 2003-05-29 | 2003-05-29 | Computer water cooler using micro circulation pump |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03263430 CN2619076Y (en) | 2003-05-29 | 2003-05-29 | Computer water cooler using micro circulation pump |
Publications (1)
Publication Number | Publication Date |
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CN2619076Y true CN2619076Y (en) | 2004-06-02 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 03263430 Expired - Fee Related CN2619076Y (en) | 2003-05-29 | 2003-05-29 | Computer water cooler using micro circulation pump |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100361046C (en) * | 2005-02-23 | 2008-01-09 | 大连大学 | Noise-free clean casing |
CN101852219A (en) * | 2010-04-09 | 2010-10-06 | 江苏金通灵风机股份有限公司 | Lubricating oil cooling device of single-stage high-speed centrifugal fan |
CN103815664A (en) * | 2014-03-17 | 2014-05-28 | 上海理工大学 | Water-cooled computer desk |
CN107844176A (en) * | 2016-09-20 | 2018-03-27 | 凌今 | Passive heat dissipation type water cooling cabinet |
CN108397422A (en) * | 2018-02-08 | 2018-08-14 | 浙江希尔富电气有限公司 | A kind of passenger coach load evaporation fan of included heat sinking function |
CN109814691A (en) * | 2019-01-28 | 2019-05-28 | 合肥清若科技有限公司 | A kind of computer CPU acceleration radiator |
CN110027017A (en) * | 2019-05-28 | 2019-07-19 | 安徽延达智能科技有限公司 | A kind of central processing unit of explosion prevention robot inner-outer circulation water-cooling structure |
-
2003
- 2003-05-29 CN CN 03263430 patent/CN2619076Y/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100361046C (en) * | 2005-02-23 | 2008-01-09 | 大连大学 | Noise-free clean casing |
CN101852219A (en) * | 2010-04-09 | 2010-10-06 | 江苏金通灵风机股份有限公司 | Lubricating oil cooling device of single-stage high-speed centrifugal fan |
CN103815664A (en) * | 2014-03-17 | 2014-05-28 | 上海理工大学 | Water-cooled computer desk |
CN107844176A (en) * | 2016-09-20 | 2018-03-27 | 凌今 | Passive heat dissipation type water cooling cabinet |
CN108397422A (en) * | 2018-02-08 | 2018-08-14 | 浙江希尔富电气有限公司 | A kind of passenger coach load evaporation fan of included heat sinking function |
CN109814691A (en) * | 2019-01-28 | 2019-05-28 | 合肥清若科技有限公司 | A kind of computer CPU acceleration radiator |
CN110027017A (en) * | 2019-05-28 | 2019-07-19 | 安徽延达智能科技有限公司 | A kind of central processing unit of explosion prevention robot inner-outer circulation water-cooling structure |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |