CN111818770A - Liquid cooling heat dissipation module, liquid cooling heat dissipation system and electronic equipment - Google Patents

Abstract

The invention relates to the technical field of heat dissipation systems, in particular to a liquid cooling heat dissipation module which comprises a power pump and a pressure regulating module, wherein the power pump provides power for a heat dissipation loop, the pressure regulating module and the power pump are connected in series on the heat dissipation loop, and when the liquid cooling heat dissipation module works, the sum of the volume variation of a pump cavity caused by the power pump and the volume variation of a pressure regulating cavity of the pressure regulating module approaches to zero at the same moment, so that the pressure in a pipeline is in a balanced state, the problem of sudden stop of working medium circulation caused by clamping stagnation of a single power pump is avoided, and meanwhile, the occurrence of flow channel vibration is avoided. Meanwhile, the liquid storage tank is omitted, so that the problems of large volume and low integration degree of the traditional liquid cooling heat dissipation module are effectively solved, the volume of a heat dissipation system is smaller, and the miniaturization of a product is facilitated.

Description

Liquid cooling heat dissipation module, liquid cooling heat dissipation system and electronic equipment

Technical Field

The invention relates to the technical field of heat dissipation systems, in particular to a liquid-cooled heat dissipation module, a liquid-cooled heat dissipation system and electronic equipment.

Background

With the vigorous development in the fields of microelectronics, micromachines, micro-optics and the like and the development and application of large-scale and super-large-scale integrated circuits, the power consumption of products is continuously increased, and the problems of heat conduction and heat dissipation in narrow spaces are increasingly prominent.

The current heat dissipation technology mainly includes metal heat dissipation, air-cooled heat dissipation, liquid-cooled heat dissipation, and gas-liquid phase change heat dissipation, wherein the liquid cooling is better to provide higher cooling power by using the circulation working medium thereof far larger than the unit volume heat capacity of gas, and will also become the mainstream heat dissipation mode in the future heat dissipation field. Traditional liquid cooling heat dissipation module generally all includes power pump, radiator, heat exchanger (liquid reserve tank) and pipeline, because traditional power pump itself is difficult for the miniaturization, dispels the heat simultaneously and heat exchange module separation, leads to whole cooling system bulky, and the integrated level is not high, is difficult for arranging narrow and small heat dissipation space. Therefore, the micropump becomes a better choice in a narrow space heat dissipation system, but a single micropump is very easy to block in a circulating cooling process to cause the phenomenon of sudden stop of working medium circulation, and meanwhile, the single-pump system is severe in vibration.

Disclosure of Invention

The invention aims to provide a liquid cooling heat dissipation module to solve the problems that a heat dissipation system in the prior art is large in size and low in integration level, and a single micro pump is very easy to clamp in a circulating cooling process to cause sudden stop of working medium circulation.

In order to achieve the purpose, the invention provides the following technical scheme: a liquid cooling heat dissipation module includes:

at least one power pump for providing power for the heat dissipation loop;

at least one pressure regulating module, the pressure regulating module with the power pump is established ties on heat dissipation loop's runner, and the during operation, at same moment, the pump chamber volume variation that the power pump arouses with the sum of the pressure regulating chamber volume variation of pressure regulating module approaches to zero.

According to one embodiment of the invention, the power pump comprises:

the pump chamber of claim 1, the pump chamber being provided with a liquid inlet and a liquid outlet in communication with the flow passage;

a vibration plate covering the pump chamber, the vibration plate pressing the liquid in the pump chamber by vibration;

and the control valves are arranged at the liquid inlet and the liquid outlet of the pump cavity and are used for controlling the unidirectional flow of the fluid.

According to one embodiment of the invention, the pressure regulating module is an active pressure regulating structure, and the active pressure regulating structure is the same as the structure of the power pump.

According to an embodiment of the present invention, the voltage regulating module is an active voltage regulating structure, and the active voltage regulating structure includes:

the cavity is configured to be the pressure regulating cavity and is communicated with the flow passage;

the part of the driving plate opposite to the containing cavity can vibrate in a bending mode.

According to an embodiment of the present invention, the voltage regulating module is a passive voltage regulating structure, and the passive voltage regulating structure includes:

an elastic diaphragm formed into a curved configuration at least in an operating state, a concave surface of the curved configuration forming an elastic cavity;

an elastic cavity configured as the pressure regulating cavity, the elastic cavity in communication with the flow passage.

In another aspect of the present invention, a liquid-cooled heat dissipation system is further provided, which includes the above liquid-cooled heat dissipation module.

According to an embodiment of the invention, the flow channel comprises:

the flow channel layer comprises a substrate and a flow guide groove formed on the substrate;

the panel layer comprises at least one layer of panel, and the panel covers the diversion trench.

According to one embodiment of the invention, the power pump and the pressure regulating module are arranged on the panel layer.

According to one embodiment of the present invention, the panel layer is provided with a liquid injection port communicating with the flow passage, and the liquid injection port is sealed by a cover plate.

According to one embodiment of the invention, the number of flow channels is at least one.

According to an embodiment of the present invention, the flow guide groove is a through groove, the panel layer includes a first panel and a second panel, the flow guide layer is disposed between the first panel and the second panel, and the first panel, the second panel and the through groove cooperate to form the flow guide.

According to an embodiment of the present invention, the guiding groove is a groove, and the panel layer includes a panel, and the panel and the groove cooperate to form the flow channel.

According to one embodiment of the invention, the flow guide groove is a through groove and/or a groove, and the flow guide groove and the panel are matched to form the flow passage.

In another aspect of the present invention, an electronic device is further provided, which includes the above liquid cooling heat dissipation system.

According to one embodiment of the invention, the flow channel is formed as a patch that is attached to the electronic product to dissipate heat from its internal components.

Compared with the prior art, the invention has the beneficial effects that:

1) the heat dissipation loop in this application adopts pressure regulating module and power pump series arrangement, and the during operation is at same moment, the pump chamber volume change volume that the power pump arouses with the sum of the pressure regulating chamber volume change volume of pressure regulating module approaches to zero, makes the pressure in the pipeline be in balanced state, can effectively solve single micropump very easily the jamming and the problem that working medium circulation suddenly stopped appears in the circulative cooling in-process, avoids the appearance of runner tremble simultaneously. Meanwhile, as the liquid storage tank is omitted, the problems of large volume and low integration level of the traditional liquid cooling heat dissipation module are effectively solved, so that the heat dissipation system is smaller in volume and beneficial to miniaturization of products;

2) the power pump adopted in the application is a miniature piezoelectric diaphragm pump, the heat transfer and radiation function module and the flow channel are highly integrated, a heat exchanger (a liquid storage tank) and an external pipeline do not need to be arranged independently, the structure is compact, and the power pump is suitable for the use requirement of a narrow radiation space;

3) the liquid-cooled heat dissipation module has the advantages that the main body adopts a laminated film or thin plate structure, can be bent and shaped, ensures the close adhesion of a heat dissipation system and a surface heat source or a body heat source, and can effectively improve the heat transfer performance and the heat dissipation performance;

4) simple process, easy batch production and low cost.

Drawings

FIG. 1 is a schematic structural diagram of a power pump according to a first embodiment of the present invention;

FIG. 2 is a schematic diagram illustrating a suction state of the power pump according to the first embodiment of the present invention;

FIG. 3 is a schematic diagram illustrating a scheduling status of the power pump according to one embodiment of the present invention;

FIG. 4 is a schematic diagram of a combination of a power pump and a pressure regulating module according to a first embodiment of the present invention;

FIG. 5 is a schematic structural view of an integral dual chamber pump according to a first embodiment of the present invention;

FIG. 6 is a schematic structural view of a combined dual chamber pump according to a first embodiment of the present invention;

FIG. 7 is a schematic diagram of an integral vibrating plate structure according to a first embodiment of the present invention;

FIG. 8 is a schematic diagram of a split-type vibrating plate structure according to a first embodiment of the present invention;

FIG. 9 is a schematic structural diagram of a power valve according to a first embodiment of the present invention;

fig. 10 is a schematic view of a combination of a power pump and an active pressure regulating module according to a second embodiment of the present invention;

fig. 11 is a schematic diagram of a combination of a power pump and a passive pressure regulating module according to a third embodiment of the present invention;

FIG. 12 is a schematic view of a through-groove runner structure according to a fourth embodiment of the present invention;

fig. 13 is a schematic diagram of a groove flow channel structure in the fourth embodiment of the present invention;

FIG. 14 is a schematic view of a flow channel structure of a mixing tank according to a fourth embodiment of the present invention;

FIG. 15 is a schematic view of a flow channel structure of a multilayer mixing tank according to a fourth embodiment of the present invention;

fig. 16 is a schematic structural view of a flexible flow channel according to a fifth embodiment of the present invention;

fig. 17 is a schematic view of an application structure of a flow channel in the fifth embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

The conventional liquid cooling heat dissipation module generally comprises a power pump, a radiator, a heat exchanger (liquid storage tank) and a pipeline, and the conventional power pump is difficult to miniaturize, and meanwhile, the heat dissipation module and the heat exchange module are separated, so that the whole heat dissipation system is large in size, not high in integration level and difficult to arrange a narrow heat dissipation space. Therefore, the micropump becomes a better choice in a narrow space heat dissipation system, however, a single micropump is very easy to be blocked in a circulating cooling process, so that the phenomenon of sudden stop of working medium circulation occurs, and meanwhile, the single-pump system is severe in vibration.

The first embodiment is as follows:

referring to fig. 1-4, the liquid cooling heat dissipation module provided in this embodiment includes a power pump 1 and a pressure regulating module 2, the power pump 1 provides power for a heat dissipation loop, the pressure regulating module 2 and the power pump 1 are connected in series on the heat dissipation loop, and when the liquid cooling heat dissipation module works, at the same time, the sum of the volume variation of the pump cavity 12 caused by the power pump 1 and the volume variation of the pressure regulating cavity of the pressure regulating module 2 approaches zero, specifically, when the power pump 1 is a suction stroke, the pressure regulating module 2 is scheduled, a fluid flows in a flow channel 3 in a unidirectional manner, the volume increase of the pump cavity 12 of the power pump 1 is substantially equal to the volume decrease of the pressure regulating module 2, so that the sum of the volume variation of the pump cavity 12 caused by the power pump 1 and the volume variation of the pressure regulating cavity of the pressure regulating module 2 approaches zero, otherwise, when the power pump 1 is scheduled, the pressure regulating module 2 acts on the same principle of the, the phenomenon that when only the power pump 1 exists in the liquid cooling heat dissipation module, clamping stagnation occurs to further cause sudden stop of working medium circulation is avoided, and system vibration is eliminated. Meanwhile, the problem of air lock is solved, and the liquid storage tank can be correspondingly eliminated, so that the size of the heat dissipation system is smaller, and the miniaturization of the product is facilitated.

It should be noted that, in the present embodiment, the power pump 1 may provide power independently, or may provide auxiliary power, that is, the heat dissipation loop uses thermal driving as main power, for example, a heat source and a cold source are respectively applied to two ends of the heat dissipation loop to generate thermal driving.

According to one embodiment of the present invention, the power pump 1 includes a vibration plate 11, a control valve 15 and a pump chamber 12, wherein, the pump cavity 12 is provided with a liquid inlet 13 and a liquid outlet 14 which are communicated with the flow passage 3, the vibration plate 11 is covered on the pump cavity 12, by vibrating and extruding the liquid in the pump cavity 12, furthermore, a control valve 15 is respectively arranged on the liquid inlet 13 and the liquid outlet 14 of the pump cavity 12, the control valve 15 arranged on the liquid inlet 13 only allows the liquid to flow into the pump cavity 12 in one direction, the control valve 15 arranged on the liquid outlet 14 only allows the liquid to flow out of the pump cavity 12 in one direction, firstly, a blocking part for blocking the liquid inlet 13 and the liquid outlet 14 is arranged on the flow channel 3, so that the liquid in the two flows in one direction can not interfere with each other, the specific operation principle is as shown in fig. 2 and 3, the volume of the pump chamber 12 is changed by the reciprocating motion of the vibration plate 11 and the fluid is directionally flowed in cooperation with the control valve 15. The operation of the micro pump can be divided into two processes of suction and discharge. When the vibrating plate 11 bends upwards, the volume of the pump cavity 12 increases, the pressure in the cavity decreases, the control valve 15 at the liquid inlet 13 is opened, the control valve 15 at the liquid outlet 14 is closed, and the fluid flows into the pump cavity 12 through the control valve 15 at the liquid inlet 13 under the action of the pressure difference between the two sides, so that the fluid suction is completed; when the vibration plate 11 bends downward, the volume of the pump cavity 12 decreases, the pressure in the cavity increases, the control valve 15 at the liquid outlet 14 is opened, the control valve 15 at the liquid inlet 13 is closed, and the fluid discharging process is completed. When a continuous alternating signal is applied to the vibrating plate 11, the micro pump completes continuous suction and drainage, and unidirectional fluid flow is realized.

It should be noted that the power pump 1 in this embodiment may be a single-chamber pump, or may be a multi-chamber pump, such as an integral dual-chamber pump as shown in fig. 5, or a combined dual-chamber pump as shown in fig. 6.

The power pump 1 of this embodiment is preferably miniature piezoelectric diaphragm pump, and heat transfer, heat dissipation function module and runner 3 of miniature piezoelectric diaphragm pump can highly integrated, need not to set up heat exchanger liquid reserve tank and external pipeline alone, and compact structure adapts to the user demand in narrow and small heat dissipation space.

As shown in fig. 7-8, the vibrating plate 11 of the present embodiment may be configured in an integral type or a separate type, referring to fig. 7, the excitation unit 111a of the integral type vibrating plate 11 is closely attached to the vibrating plate 112a, and the excitation unit 111a drives the vibrating plate 112b to generate vertical reciprocating deformation, referring to fig. 8, the excitation unit 111b and the vibrating plate 112b of the separate type vibrating plate 11 are connected by a connecting portion 113, specifically, one end of the excitation unit 111b is fixedly supported, and the other end is hinged to the vibrating plate 112b by the connecting portion 113, and a periodic ac signal is applied to the excitation unit 111b, so that one end of the excitation unit 111b connected to the vibrating plate 112b generates upward and downward periodic bending deformation, thereby driving the vibrating plate 112b to generate vertical reciprocating deformation, and further generating periodic change in the volume of the pump chamber 12.

The control valve 15 in this embodiment is preferably a cantilever beam type check valve, but other valve bodies, such as the power valve shown in fig. 9, may be used, as long as the check flow of the fluid can be controlled, and the valve body is not limited thereto. Of course, the control valve 15 may be designed in one or more ways according to different control modes, and is not limited thereto.

The pressure regulating module 2 of this embodiment is an active pressure regulating structure, the active pressure regulating structure is the same as the structure of the power pump 1, that is, in this embodiment, the pressure regulating module 2 is also a power pump, as shown in fig. 4, the two power pumps are respectively a first power pump 1a and a second power pump 1b, the first power pump 1a and the second power pump 1b work simultaneously, and the working principle is as follows: when the radiator starts to work, the first power pump 1a and the second power pump 1b work simultaneously, and the phase difference of the electric signals applied by the first power pump 1a and the second power pump 1b is matched with the vibration form of the vibration plate 11, specifically: when the vibration plate 11 of the first power pump 1a deforms upward, the vibration plate 11 of the second power pump 1b deforms downward, at this time, the first power pump 1a is in a suction stroke, the second power pump 1b is in a schedule, the fluid flows in the flow passage 3 in a single direction, the volume increase amount of the pump cavity 12 of the first power pump 1a is equal to the volume decrease amount of the second power pump 1, that is, the sum of the volume change amounts of the pump cavity 12 caused by the vibration plates 11 of the first power pump 1a and the second power pump 1b approaches zero.

In the embodiment, the number of the power pumps 1 is preferably two, although a plurality of power pumps 1 may be selected and used in combination according to actual requirements, and preferably, the sum of the numbers of the power pumps 1 and the pressure regulating modules 2 arranged in the flow passage 3 is an even number.

Example two:

as shown in fig. 10, the present embodiment has substantially the same structure as the first embodiment, except that: the pressure regulating module 2 is an active pressure regulating structure, the active pressure regulating structure comprises a containing cavity 21a and an active plate 22a, the containing cavity 21a is configured to be a pressure regulating cavity, the containing cavity 21a is communicated with the flow channel 3, and the part, opposite to the containing cavity 21a, of the active plate 22a can be subjected to bending vibration, so that fluid in the containing cavity 21a is driven to enter and exit. The working principle is the same as that of the first embodiment, and is not described herein.

Example three:

as shown in fig. 11, the structure of this embodiment is substantially the same as that of the first embodiment, except that: the pressure regulating module 2 is a passive pressure regulating structure, the passive pressure regulating structure comprises an elastic diaphragm 22b and an elastic cavity 21b, the elastic diaphragm 22b is at least formed into a bending structure in a working state, and the concave surface of the bending structure forms the elastic cavity 21 b;

an elastic chamber 21b is configured as the pressure-regulating chamber, the elastic chamber 21b communicating with the flow passage 3. Thus, the elastic cavity 21b can be adaptively changed along with the suction stroke and schedule of the power pump 1, thereby playing a role in balancing the pressure of the flow passage.

Example four:

as shown in fig. 12 to 15, the present embodiment provides a liquid-cooled heat dissipation system, which includes the above-mentioned liquid-cooled heat dissipation module, and the present embodiment is mainly designed for a flow channel 3 to form different types of liquid-cooled heat dissipation systems, specifically, the flow channel 3 of the present embodiment includes a flow channel layer 31 and a panel layer 32, the flow channel layer 31 includes a substrate 312 and a diversion trench 311 formed on the substrate 312, the panel layer 32 includes at least one panel, and the panel covers the diversion trench 311.

The number of the guiding grooves 311 in this embodiment is at least one, when the number of the guiding grooves 311 is multiple, the multiple guiding grooves 311 may be mutually communicated and configured with a set of liquid cooling heat dissipation module, the multiple guiding grooves 311 may also be mutually independent, each guiding groove 311 is configured with a set of liquid cooling heat dissipation module, as long as the heat dissipation effect can be achieved, and the specific layout manner is not limited.

According to an embodiment of the flow channel 3 of the present invention, the flow guide slot 311 is a through slot 311a, the panel layer 32 includes a first panel 32a and a second panel 32b, the flow channel layer 31 is disposed between the first panel 32a and the second panel 32b, and the first panel 32a, the second panel 32b and the through slot 311a cooperate to form the flow channel 3. Specifically, the runner 3 is a basic runner 3 formed by sequentially laminating and bonding three layers of thin plates, and the first panel 32a, the runner layer 31 and the second panel 32b are respectively a runner upper plate, a through groove layer and a runner lower plate, wherein the runner upper plate is provided with a liquid inlet 13, a liquid outlet 14, a liquid injection port 51 and a cover plate 52; the through groove 311a is provided with a communicated groove which is completely formed in a through mode; the lower plate of the runner 3 is a thin plate without any features. Working medium is injected into the flow passage 3 through the injection port 51, then the working medium is sealed by the cover plate 52, and the power pump 1 is communicated with the flow passage 3 to form a closed whole filled with the working medium.

According to another embodiment of the flow channel 3 of the present invention, the guiding groove 311 is a groove 311b, and the panel layer 32 includes a panel, and the panel and the groove 311b cooperate to form the flow channel 3. The flow channel 3 is a basic flow channel formed by sequentially laminating and bonding a panel and a flow channel layer 31, the panel and the flow channel layer 31 are respectively a flow channel upper plate and a flow channel groove plate, wherein the flow channel upper plate is provided with a liquid inlet 13, a liquid outlet 14, a liquid injection port 51 and a cover plate 52, and the flow channel groove plate is provided with a communicated groove 311b with a certain depth. Working medium is injected into the flow passage 3 through the injection port 51, the flow passage is sealed by the cover plate 52 after being filled with the working medium, and the micro pump is communicated with the flow passage 3 to form a closed whole filled with the working medium.

Of course, in this embodiment, two kinds of flow channel 3 structures may be combined to also play a role in guiding flow. The mixing tank runner 3 is a basic runner formed by sequentially laminating and bonding three layers of thin plates. The three layers of thin plates are respectively a flow channel upper plate, a through groove layer and a flow channel groove plate, wherein the flow channel upper plate is provided with a liquid inlet 13, a liquid outlet 14, a liquid injection port 51 and a cover plate 52, one side close to the through groove layer can be provided with a communicated groove 311b with a certain depth or not, the shape of the groove 311b is consistent with that of the groove of the through groove 311a layer, and the through groove layer is provided with a communicated groove formed by complete penetration; the runner duct plate is provided with a continuous recess 311b of a certain depth, and the shape of the recess 311b is identical to the groove penetrating the layer of the recess 311 a.

Of course, as shown in fig. 15, the flow channels 3 may be arranged as a composite of a plurality of layers of the basic flow channels 3.

The substrate 312 and/or the panel in this embodiment are thin plates or thin films, the thin plates or the thin films may be made of metal materials, polymer materials, composite materials, preferably polymer materials, such as PP, PPs, PET, and the like, and when the polymer materials are preferentially adopted for use in communication equipment or electromagnetic products, interference and shielding of communication signals and electromagnetic signals can be effectively avoided, and the application environment of current 5G signal transmission is matched.

Example five:

as shown in fig. 17, the present embodiment provides an electronic device, where the liquid cooling heat dissipation system is adopted, the flow channel 3 of the liquid cooling heat dissipation system of the present embodiment is formed as a flexible patch, the patch is attached to the housing 4 of the electronic device to dissipate heat of internal components thereof, the heat conduction, dissipation and heat insulation areas can be freely planned according to application scenarios, a metal film can be applied to the area requiring heat conduction and dissipation, and a heat insulation film can be applied to the area requiring heat insulation.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (15)

1. The utility model provides a liquid cooling heat dissipation module which characterized in that includes:

at least one power pump (1) for powering the heat dissipation circuit;

at least one pressure regulating module (2), pressure regulating module (2) with power pump (1) is established ties on heat dissipation loop's runner (3), and the during operation is at same moment, pump chamber (12) volume variation that power pump (1) arouses with the sum of the pressure regulating chamber volume variation of pressure regulating module (2) approaches to zero.

2. A liquid-cooled heat dissipation module according to claim 1, characterized in that the power pump (1) comprises:

the pump chamber (12) as claimed in claim 1, the pump chamber (12) being at least one, the pump chamber (12) being provided with a liquid inlet (13) and a liquid outlet (14) communicating with the flow channel (3);

at least one vibration plate (11), wherein the vibration plate (11) covers the pump cavity (12), and the vibration plate (11) presses the liquid in the pump cavity (12) through vibration;

and the control valve (15) is arranged at the liquid inlet (13) and the liquid outlet (14) of the pump cavity (12) and is used for controlling the unidirectional flow of the fluid.

3. The liquid-cooled heat dissipation module as claimed in claim 2, wherein the pressure regulating module (2) and the power pump (1) are identical in structure.

4. The liquid-cooled heat dissipation module according to claim 1, wherein the pressure regulating module (2) is an active pressure regulating structure, and the active pressure regulating structure comprises:

a cavity (21a), wherein the cavity (21a) is configured as the pressure regulating cavity, and the cavity (21a) is communicated with the flow passage (3);

and the part of the active plate (22a) opposite to the cavity (21a) can vibrate in a bending way.

5. The liquid-cooled heat dissipation module according to claim 1, wherein the voltage regulation module (2) is a passive voltage regulation structure, and the passive voltage regulation structure comprises:

an elastic diaphragm (22b), the elastic diaphragm (22b) being formed in a curved configuration at least in the operating state, the concave surface of the curved configuration forming an elastic cavity (21 b);

an elastic chamber (21b), the elastic chamber (21b) being configured as the pressure regulating chamber, the elastic chamber (21b) being in communication with the flow passage (3).

6. A liquid-cooled heat dissipation system, comprising at least one set of liquid-cooled heat dissipation modules according to any one of claims 1-6.

7. A liquid-cooled heat dissipation system according to claim 6, wherein the flow channel (3) comprises:

a flow channel layer (31), wherein the flow channel layer (31) comprises a substrate (312) and a flow guide groove (311) formed on the substrate (312);

the panel layer (32), panel layer (32) includes at least one layer of panel, the guide groove (311) is covered by the panel.

8. A liquid-cooled heat dissipation system according to claim 7, characterized in that the power pump (1) and the pressure regulating module (2) are arranged on the panel layer (32).

9. A liquid-cooled heat dissipation system as claimed in claim 7, wherein the panel layer (32) is provided with a liquid injection port (51) communicating with the flow channel (3), and the liquid injection port (51) is sealed by a cover plate (52).

10. A liquid-cooled heat dissipation system as claimed in claim 7, wherein the number of the flow guide grooves (311) is at least one.

11. The liquid-cooled heat dissipation system according to claim 7, wherein the flow guide groove (311) is a through groove (311a), the panel layer (32) includes a first panel (32a) and a second panel (32b), the flow channel layer (31) is disposed between the first panel (32a) and the second panel (32b), and the first panel (32a), the second panel (32b) and the through groove (311a) cooperate to form the flow channel (3).

12. A liquid-cooled heat dissipation system as claimed in claim 7, wherein the flow-guiding channel (311) is a groove (311b), the panel layer (32) comprises a panel, and the panel and the groove (311b) cooperate to form the flow channel (3).

13. A liquid-cooled heat dissipation system as claimed in claim 7, wherein the flow-guiding grooves (311) are through grooves (311a) and/or grooves (311b), and the flow-guiding grooves (311) and the panel layer (32) cooperate to form the flow channels (3).

14. An electronic device comprising a liquid-cooled heat dissipation system as recited in any one of claims 1-14.

15. An electronic device according to claim 15, characterized in that the flow channel (3) is formed as a patch, which is attached to the electronic device to dissipate heat from its internal components.

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