CN107731766A - A kind of self-loopa fluid means for systems-on-a-chip radiating - Google Patents
A kind of self-loopa fluid means for systems-on-a-chip radiating Download PDFInfo
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- CN107731766A CN107731766A CN201710825338.4A CN201710825338A CN107731766A CN 107731766 A CN107731766 A CN 107731766A CN 201710825338 A CN201710825338 A CN 201710825338A CN 107731766 A CN107731766 A CN 107731766A
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- micropump
- liquid
- fluid channel
- fluid
- radiator
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Reciprocating Pumps (AREA)
Abstract
The invention belongs to field of fluid machinery, and in particular to a kind of self-loopa fluid means for systems-on-a-chip radiating, including fluid channel radiator, cooling device, liquid conduits and Micropump.The present invention spreads/shunk tubular construction using 2 Micropumps using it first, this poor characteristic of caused net flow, liquid is flowed in one direction；Micropump a, Micropump b are connected by liquid conduits with fluid channel radiator 1, fluid channel radiator 2, liquid is formed one-way circulation flowing.Conveying power is used as by Micropump, the fluid temperature rise flowed through from thermal source die terminals, and flow through cooling device reduces fluid temperature, and high-temp liquid and Normal Atmospheric Temperature Liquid are separated, reach more preferable radiating effect；A piece of vibrating diaphragm is shared secondly by the main cavity of two Micropumps, simpler efficient driving liquid flowing.Radiating efficiency of the present invention is more preferable, can integrated level height.
Description
Technical field
The invention belongs to field of fluid machinery, and in particular to a kind of self-loopa fluid dress for systems-on-a-chip radiating
Put.
Background technology
With the development of electronic technology so that the application of electronic device gradually tends to advanced and miniaturization.Especially silicon
The appearance of integrated circuit so that the integrated level of circuit is drastically raised for the higher chip of these integrated levels, caused by it
Heat sharply increases, and causes the rise of heat flow density, and then causes electronic equipment temperature to raise, so that electronic equipment fails.
According to statistics, in many factors of electronic equipment failure and service life reduction are caused, temperature is too high to occupy significant proportion；And then because
Overheat and caused by electronic equipment fail, can decline equipment performance, cause not expected consequence.Experiment shows with research：
The temperature of single semiconductor element often raises 10 DEG C, and system reliability will reduce by 50%, the failure of the electronic equipment more than 55%
It is due to that temperature is too high to cause.By taking IC chip as an example, crash rate of the operating temperature at 90 DEG C is operating temperature 40
DEG C when 75 times.As can be seen here, the heat dissipation problem of integrated-optic device has become the key of electronic equipment normal operation.
It is the effective means for avoiding electronic device from causing because of overheat failure to the rational thermal design of electronic equipment.Electronics is set
Structure design and cooling technology used by standby thermal design is included to the heating element in electronic equipment and whole system,
To ensure their normal working temperature, so as to ensure the normal work of electronic equipment or even whole system and operation.
Have been widely used at present and more conventional Electronic cooling technology mainly includes natural air cooled, air blast cooling, leaching
Do not cool down, forced fluid it is cold, in addition, radiation cooling, Phase cooling, the technology such as thermoelectric cooling are also in the cooling of electronic equipment
Occupy critical role.In existing electronic device cooling mode, traditional natural cooling and forced air cooling can not meet greatly
The thermal control requirement of power component, and force liquid-cooling heat radiation ability higher compared to forced air cooling.Liquid-cooling heat radiation is forced there are many sides
Formula, but according to current comprehensive study from the point of view of, fluid channel radiating be a kind of relatively good cold mode of liquid, if but fluid channel fluid
By external fluid loop feed flow, cost will necessarily be increased, it is also difficult to the separate modular of cooling system is formed, so,
Need to add to out the liquid driven source of fluid channel.
Important execution unit of the miniature Micropump as micro-flow system, carry the transmission of reagent, the conduction of Pulsating Flow, pressure
The tasks such as the generation of difference, the movement of cooling fluid, the transmission of suspended particles or cell.Its performance directly affects whole micrometeor
The working characteristics of system.In increasing high-grade, precision and advanced sciemtifec and technical sphere, miniature Micropump has also obtained the extensive concern of researcher.
Some driving sources that presently, there are include：Electrostatic drive, hot gas driving Micropump, electromagnetic drive Micropump, shape memory
Alloy Micropump, electroactive polymer driving Micropump, electrohydraulic dynamic Micropump, driven by electroosmosis Micropump, magneto hydrodynamic Micropump, electricity infiltration
Decline pump.
The content of the invention
In view of the shortcomings of the prior art, the radiating efficiency of thermal source chip, and reduce cooling system in order to better improve
Volume, increase integrated level, obtain more preferable radiating effect, the invention provides a kind of self-loopa for systems-on-a-chip radiating
Fluid means.
This is used for the self-loopa fluid means of systems-on-a-chip radiating, including fluid channel radiator, cooling device, liquid are led
Pipe and Micropump.
Fluid channel radiator has two, and the gateway of fluid channel radiator 1 is drawn by two liquid conduits, respectively with it is micro-
Pump a outlet is connected with Micropump b entrance；The gateway of fluid channel radiator 2 is drawn by two liquid conduits, respectively with
Micropump b outlet is connected with Micropump a entrance；The surface of fluid channel radiator 1 is connected with intended heat chip, fluid channel
The surface of radiator 2 is connected with cooling device.
Cooling device is air cooling equipment, submergence cooling, radiation cooling or thermoelectric cooling.
Micropump has two, and its structure is identical, by Micropump body, main cavity, entrance diffusion/collapsible tube, exports diffusion/contraction
Pipe, entrance side cavity, outlet side cavity, vibrating diaphragm composition.Micropump a outlet and Micropump b entrance respectively by liquid conduits with
The gateway of fluid channel radiator 1 is connected, and the outlet of Micropump a entrance and Micropump b is dissipated by liquid conduits and fluid channel respectively
The gateway of hot device 2 is connected.
Micropump a, Micropump b, fluid channel radiator 1,2,4 liquid conduits of fluid channel radiator, form an one-way circulation
System.When the liquid that Micropump a Micropumps go out flows through the fluid channel radiator 1 of thermal source die terminals, heat caused by thermal source chip is taken away,
Simultaneously fluid temperature rise, now Micropump b continue provide power the high-temp liquid flowed out from fluid channel radiator 1 is transported to it is micro-
Runner radiator 2, after cooling of the liquid through apparatus for supercooling, temperature reduces, then is conveyed to fluid channel radiating through Micropump a
Device 1, thermal source chip is radiated again, so moved in circles, form the chip cooling system of a self-loopa.
Further, the main cavity of described two Micropumps shares a vibrating diaphragm, when vibrating diaphragm produces deformation under external force driving
When make two cavity volumes while produce change, due to special contraction/diffusion tubular construction of Micropump, driving liquid that can be more efficient
Circulated.
Further, the material of the fluid channel radiator is glass or silicon.
Further, the Micropump Micropump body material is metal or glass.
Further, the type of drive of the vibrating diaphragm is piezoelectricity, pneumatically, electrostatic or electromagnetism.
The present invention spreads/shunk tubular construction using 2 Micropumps using it first, this poor characteristic of caused net flow, makes
Liquid flows in one direction；Micropump a, Micropump b are connected by liquid conduits with fluid channel radiator 1, fluid channel radiator 2
Connect, liquid is formed one-way circulation flowing.Conveying power, the fluid temperature flowed through from thermal source die terminals are used as by Micropump
Rise, and flow through cooling device reduces fluid temperature, so that high-temp liquid and Normal Atmospheric Temperature Liquid are separated, improves liquid
Cycle efficieny, reach more preferable radiating effect.
Liquid driven source is used as by Micropump, standalone module can be formed, it is only necessary to which externally fed is without other external moulds
Block；Can integrated level height.
A piece of vibrating diaphragm is shared secondly by the main cavity of two Micropumps, when vibrating diaphragm starts vibration, diaphragm oscillations are once
The main cavity of two Micropumps is set to produce change, simpler driving liquid flowing, and caused motive force is for entirely following
Loop system is Complete Synchronization, and the Micropump of than the two independent vibrating diaphragms of use of liquid circulation effect realizes the effect of synchronous motive force more
It is good.
In summary, compared with traditional radiating mode, radiating efficiency of the present invention is more preferable, while can integrated level height.
Brief description of the drawings
Fig. 1 is the 3-D view of embodiment；
Fig. 2 is the three-dimensional perspective of embodiment；
Fig. 3 is the profile of embodiment；
Fig. 4 is cross-sectional schematic Fig. 1 of embodiment；
Fig. 5 is cross-sectional schematic Fig. 2 of embodiment；
Reference：
Micropump a main cavity -1a, Micropump a entrance side cavity -2a, Micropump a outlet side cavity -3a, Micropump a anemostat -4a,
Micropump a collapsible tube -5a, Micropump b main cavity -1b, Micropump b entrance side cavity -2b, Micropump b outlet sides cavity -3b, Micropump b diffusion
Pipe -4b, Micropump b collapsible tubes -5b；
Simulation thermal source chip -1c, fluid channel radiator 1-2c, cooling device -3c, fluid channel radiator 2-4c, vibrating diaphragm -
5c；
The 1st section of -1d of liquid conduits, the 2nd section of -2d of liquid conduits, the 3rd section of -3d of liquid conduits, the 4th section of -4d of liquid conduits.
Embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.
Embodiment
As depicted in figs. 1 and 2, a kind of self-loopa fluid means for systems-on-a-chip radiating, including simulation thermal source core
Piece -1c, runner radiator 1-2c, cooling device -1c, fluid channel radiator 2-4c, Micropump a；Micropump b；Micropump a and Micropump b are total to
Vibrating diaphragm -5c；First paragraph liquid conduits -1d, second segment liquid conduits -2d, the 3rd section of liquid conduits -3d, the 4th section of liquid
Conduit -4d.
As shown in figure 3, Micropump a is by Micropump a main cavity -1a, Micropump a entrance side chamber -2a, Micropump a outlet side cavity -3a,
Micropump a entrance sides diffusion/collapsible tube -4a, Micropump a outlet sides diffusion/collapsible tube -5a compositions.Micropump b by Micropump b main cavities-
1b, Micropump b entrance side chamber -2b, Micropump a outlet sides cavity -3b, Micropump b entrance side diffusion/collapsible tube -4b, Micropump b outlet sides
Diffusion/collapsible tube -5b compositions.Its operation principle is as shown in Figure 4 and Figure 5, micro- when vibrating diaphragm -5c is started deformation by external force driving
Pump a and Micropump b main cavities volume can produce change.
As shown in figure 4, when Micropump a main cavity -1a volumes increase, liquid by Micropump a main cavity -1a through two diffusions/
Shrink to both sides cavity and flow, what now Micropump a entrances contraction/diffusion -4a had been managed is anemostat effect, and liquid can be easy to
Micropump a main cavity -1a are flowed into by it, and what now Micropump a exit constrictions/anemostat -5a play a part of is collapsible tube, liquid
When flowing into main cavity -1a by it, whirlpool can be formed in Micropump a exit constrictions/anemostat -5a and main cavity -1a joining places
And turbulent flow, so as to slow down the flowing of liquid, therefore flow into from Micropump a entrances contraction/anemostat -4a Micropump a main cavities -1a liquid
Body volume is more than the liquid volume that Micropump a main cavities -1a is flowed into from Micropump a exit constrictions/anemostat -5a.At the same time, Micropump
B main cavity -1b volumes then reduce, and the liquid in Micropump b main cavities -1b is pressed through two contractions/anemostat -4b, 5b
Flowed into two side chamber body -2b, 3b in the liquid conduits -3d and -4d of both sides, due to the special angle structure of contraction/anemostat, this
When Micropump b exit constriction/anemostat -5b serves is anemostat, liquid can be easy to flow into Micropump b outlets by it
What side chamber body -3b, Micropump b entrance side contraction/anemostat -4b play a part of is collapsible tube, and liquid enters by its inflow Micropump b
During mouthful side chamber body -6b, can Micropump b exit constrictions/anemostat -4b and Micropump b outlet side cavity -2b joining places formed whirlpool and
Turbulent flow, so as to slow down the flowing of liquid, therefore flow through from Micropump b main cavities -1b Micropump b exit constrictions/anemostat -5b liquid
Volume is more than the liquid volume for flowing through Micropump b entrances contraction/anemostat -4b.So the flow direction of liquid can be such as arrow in Fig. 4
Shown in direction.
And as shown in figure 5, when Micropump a main cavity -1a volumes reduce, the increase of Micropump b main cavity -1b volumes is and above-mentioned
Same principle can be released, and liquid flow direction can be as shown in the direction of arrow in Fig. 5.
It follows that when liquid flows out from Micropump a, when liquid flows through thermal source die terminals fluid channel -2c, you can take away
Heat caused by thermal source chip -1c, at the same fluid temperature raise, now Micropump b continue produce power will be from fluid channel radiator
The high-temp liquid Micropump of 2-2c outflows enters fluid channel radiator 2-4c, after cooling of the liquid herein through apparatus for supercooling -3c, temperature
Degree is reduced, and now the liquid pump to have cooled is entered fluid channel radiator 1-2c by Micropump a, continues to take away caused by thermal source chip -1c
Heat, so move in circles, just form the cooling system of self-loopa.
It is to sum up shown, it is seen that the present invention can realize the abundant radiating to thermal source chip, and the system can be used as one
Standalone module, also it is beneficial to integrated.Radiating efficiency can preferably be improved.
Claims (6)
1. a kind of self-loopa fluid means for systems-on-a-chip radiating, including fluid channel radiator, cooling device, liquid are led
Pipe and Micropump, it is characterised in that：
The fluid channel radiator has two, and the gateway of fluid channel radiator 1 is drawn by two liquid conduits, respectively with it is micro-
Pump a outlet is connected with Micropump b entrance；The gateway of fluid channel radiator 2 is drawn by two liquid conduits, respectively with
Micropump b outlet is connected with Micropump a entrance；The surface of fluid channel radiator 1 is connected with intended heat chip, fluid channel
The surface of radiator 2 is connected with cooling device；
The Micropump has two, and its structure is identical, by Micropump body, main cavity, entrance diffusion/collapsible tube, exports diffusion/contraction
Pipe, entrance side cavity, outlet side cavity, vibrating diaphragm composition；Micropump a outlet and Micropump b entrance respectively by liquid conduits with
The gateway of fluid channel radiator 1 is connected, and the outlet of Micropump a entrance and Micropump b is dissipated by liquid conduits and fluid channel respectively
The gateway of hot device 2 is connected；
Micropump a, Micropump b, fluid channel radiator 1,2,4 liquid conduits of fluid channel radiator, form an one-way circulation system.
2. the self-loopa fluid means for systems-on-a-chip radiating as claimed in claim 1, it is characterised in that：It is described two micro-
The main cavity of pump shares a vibrating diaphragm.
3. the self-loopa fluid means for systems-on-a-chip radiating as claimed in claim 1, it is characterised in that：The cooling dress
It is set to air cooling equipment, submergence cooling, radiation cooling or thermoelectric cooling.
4. the self-loopa fluid means for systems-on-a-chip radiating as claimed in claim 1, it is characterised in that：The fluid channel
The material of radiator is glass or silicon.
5. the self-loopa fluid means for systems-on-a-chip radiating as claimed in claim 1, it is characterised in that：The vibrating diaphragm
Type of drive is piezoelectricity, pneumatic, electrostatic or electromagnetism.
6. the workflow of the self-loopa fluid means to be radiated as claimed in claim 1 for systems-on-a-chip, specific as follows：
When the liquid that Micropump a Micropumps go out flows through the fluid channel radiator 1 of thermal source die terminals, heat caused by thermal source chip is taken away,
Simultaneously fluid temperature rise, now Micropump b continue provide power the high-temp liquid flowed out from fluid channel radiator 1 is transported to it is micro-
Runner radiator 2, after cooling of the liquid through apparatus for supercooling, temperature reduces, then is conveyed to fluid channel radiating through Micropump a
Device 1, thermal source chip is radiated again, so moved in circles, form the chip cooling system of a self-loopa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710825338.4A CN107731766A (en) | 2017-09-14 | 2017-09-14 | A kind of self-loopa fluid means for systems-on-a-chip radiating |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710825338.4A CN107731766A (en) | 2017-09-14 | 2017-09-14 | A kind of self-loopa fluid means for systems-on-a-chip radiating |
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| CN107731766A true CN107731766A (en) | 2018-02-23 |
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| CN201710825338.4A Pending CN107731766A (en) | 2017-09-14 | 2017-09-14 | A kind of self-loopa fluid means for systems-on-a-chip radiating |
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Cited By (7)
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| CN110364501A (en) * | 2019-06-17 | 2019-10-22 | 中国科学院微电子研究所 | A kind of fluid channel radiator structure, manufacturing method and electronic device |
| CN110798965A (en) * | 2019-11-13 | 2020-02-14 | 重庆大学 | Controllable active fluid heat dissipation system of electronic component integrated on PCB |
| CN111030418A (en) * | 2019-12-03 | 2020-04-17 | 广州大学 | Double-cavity micropump based on electrowetting phenomenon |
| CN111477596A (en) * | 2019-01-24 | 2020-07-31 | 南宁富桂精密工业有限公司 | Heat sink device |
| CN112040723A (en) * | 2020-08-17 | 2020-12-04 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Integrated micro radiator and radiating system |
| CN112367806A (en) * | 2020-10-28 | 2021-02-12 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Resistance-reducing type micro-thin channel liquid cooling radiator |
| CN113873849A (en) * | 2021-10-12 | 2021-12-31 | 西北工业大学 | Self-adaptive adjustment semi-immersed liquid cooling heat dissipation cavity, circulation system and application |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112040723B (en) * | 2020-08-17 | 2022-10-28 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Integrated micro radiator and radiating system |
| CN112367806A (en) * | 2020-10-28 | 2021-02-12 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Resistance-reducing type micro-thin channel liquid cooling radiator |
| CN112367806B (en) * | 2020-10-28 | 2022-03-29 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Resistance-reducing type micro-thin channel liquid cooling radiator |
| CN113873849A (en) * | 2021-10-12 | 2021-12-31 | 西北工业大学 | Self-adaptive adjustment semi-immersed liquid cooling heat dissipation cavity, circulation system and application |
| CN113873849B (en) * | 2021-10-12 | 2022-10-11 | 西北工业大学 | Self-adaptive adjustment semi-immersed liquid cooling heat dissipation cavity, circulation system and application |
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