CN205900530U - Small -size liquid cooling system of electricity flow force micropump driven - Google Patents
Small -size liquid cooling system of electricity flow force micropump driven Download PDFInfo
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- CN205900530U CN205900530U CN201620880936.2U CN201620880936U CN205900530U CN 205900530 U CN205900530 U CN 205900530U CN 201620880936 U CN201620880936 U CN 201620880936U CN 205900530 U CN205900530 U CN 205900530U
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- electrohydraulic dynamic
- micropump
- liquid cooling
- heat exchanger
- cooling system
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Abstract
The utility model discloses a small -size liquid cooling system of electricity flow force micropump driven, including liquid cooling piece that fills liquid medium and the heat exchanger that fills liquid medium, the import that a loop conduit connects the liquid cooling piece is passed through in the export of heat exchanger, and it has first electric flow force micropump to establish ties on a loop conduit's pipeline, the import that the 2nd loop conduit connects the heat exchanger is passed through in the export of liquid cooling piece, and it has second electricity flow force micropump to establish ties on the 2nd loop conduit's pipeline, this small -size liquid cooling system has not only solved the high -efficient heat dissipation problem of power electronic device, has solved traditional mechanical pump moreover and has had shortcomings such as bulky, that the consumption is high, the noise is big, flow control is not accurate, have that no moving part, operation are reliable, the low power dissipation, make and need not advantage such as maintenance easily to can be directly and chip or runner integrated, need not independent space. Can be by the application in fields such as electron device cooling, pharmaceutical transfer and micro -electro -mechanical system.
Description
Technical field
This utility model is related to field of fluid power and heat transfer unit (HTU), and it is little that more particularly, to a kind of electrohydraulic dynamic Micropump drives
Type liquid cooling system and method.
Background technology
With the development of electronic manufacturing technology, the integrated level more and more higher of electronic component.Moore's Law is pointed out, integrated circuit
Transistor density be increased by one times every 18 months.The integrated level of electronic component is higher, and heat flow density is bigger.Electronic component
Reliability and life-span will be increasingly dependent on the degree of perfection of thermal control system.Correlational study shows, the work temperature of electronic component
Degree often raises 10 DEG C, and the reliability of system and the life-span of electronic component will be about drop by halfs.High hot-fluid device is scattered at present
Thermal power has reached the magnitude of 10^6w/m^2, and the radiating of electronic devices and components of future generation will exceed 10^7w/m^2.These heats need
To discharge in time with the temperature ensureing chip be in the range of permission, existing air-cooled technology is impossible to meet such height
Heat flow density radiating requirements.The heat dissipation problem of great-power electronic chip has become as a bottle of microelectronic industry development
Neck, is also the key problem that current electron device package and application must solve.By the research to chip cooling, research worker
Discovery can solve the heat dissipation problem of high-power electronic device in the way of using liquid cooling.
In microelectronics field of radiating, research finds that carrying out forced convertion to working medium in micro-channel heat sink can make radiating effect
Have and significantly increase and liquid working substance can produce very high flow differential pressure, therefore the driving side of the fluid of routine in MCA
Method is infeasible in microchannel.This be accomplished by one kind neither increase heat sink volume again can steady operation provide enough fluids
The working medium driver of outlet pressure is used as the power source of Working fluid flow.Traditional mechanical pump has that volume is big, power consumption is high, noise
Greatly, flow-control not precisely the shortcomings of.
Content of the invention
The purpose of this utility model is to overcome the shortcoming and defect of above-mentioned prior art, provides a kind of process structure simple
The small-sized liquid cooling system that the high electrohydraulic dynamic Micropump of compact, radiating efficiency drives.
This utility model is achieved through the following technical solutions:
The small-sized liquid cooling system that a kind of electrohydraulic dynamic Micropump drives, including cold piece 1 of the liquid being perfused with liquid refrigerant and perfusion
There is the heat exchanger 4 of liquid refrigerant；The import by cold piece 1 of the first loop pipeline 2 connection liquid for the outlet of described heat exchanger 4, the
First electrohydraulic dynamic Micropump 3 is in series with the pipeline of one loop pipeline 2；
The outlet that cold piece 1 of described liquid connects the import of heat exchanger 4 by the second loop pipeline 21, in the second loop pipeline 21
Pipeline on be in series with the second electrohydraulic dynamic Micropump 31.
Described first electrohydraulic dynamic Micropump 3 includes thering is end cover 3-1, the setting that cavity 3-3 is matched with cavity 3-3
In end cover 3-1 inner surface and extend to the matrix 3-2 within cavity 3-3, be attached to matrix 3-2 lower surface by mutual
The negative electrode of interleaved distribution and the electrod-array 3-5 of anode composition；The structure and first of described second electrohydraulic dynamic Micropump 31
Electrohydraulic dynamic Micropump 3 is identical；
Liquid refrigerant is under the driving force of the first electrohydraulic dynamic Micropump 3 and the second electrohydraulic dynamic Micropump 31 acts on, cold from liquid
The second electrohydraulic dynamic Micropump 31 that the outlet of block 1 is flowed out and passed through on the second loop pipeline 21 enters heat exchanger 4, in heat exchanger 4
Inside carry out heat exchange；Complete the liquid refrigerant after heat exchange, then flowed out by the outlet of heat exchanger 4 and pass through the first loop pipeline 2
On the first electrohydraulic dynamic Micropump 3 be back in heat exchanger 4；Constantly circulated with this.
One of described electrod-array 3-5 negative electrode and adjacent thereto anode constitute one group of electrode pair；Described electricity
After negative electrode in the array 3-5 of pole and negative electrode difference parallel connection, then by respective binding post 3-6 connect setting in end cover 3-
Binding post 3-4 on 1 connects external power source.
Described electrod-array 3-5 is comb-like electrode array.
Described heat exchanger 4 is provided with radiating fin 4-1.
Described matrix 3-2 is made up of bar shaped insulant；Described cavity 3-3 is bar shaped cavity.
It is bolted between described end cover 3-1 and cavity 3-3.
Being connected by between described end cover 3-1 and binding post 3-4 is tightly connected.
Faying face between described end cover 3-1 and cavity 3-3 is combined for hermetic seal.
A kind of heat dissipating method is as follows:
Step one: cold for liquid piece 1 is fitted tightly with extraneous thermal source to be radiated；Connect external power source, start first electro-hydraulic
Power Micropump 3 and the second electrohydraulic dynamic Micropump 31 are so as in running order；
Step 2: the liquid refrigerant that its heat transfer is flowed by thermal source to be radiated to cold piece of 1 inner loop of liquid；
Step 3: liquid refrigerant the first electrohydraulic dynamic Micropump 3 and the second electrohydraulic dynamic Micropump 31 driving force act under,
Flow out and pass through the second electrohydraulic dynamic Micropump 31 the second loop pipeline 21 from cold piece 1 of outlet of liquid and enter heat exchanger 4, changing
Carry out heat exchange in hot device 4；Complete the liquid refrigerant after heat exchange, then flowed out by the outlet of heat exchanger 4 and pass through the first loop
The first electrohydraulic dynamic Micropump 3 on pipeline 2 is back in heat exchanger 4；Liquid refrigerant is constantly circulated with this, and thermal source produces the most at last
Heat in the air is transferred to by heat exchanger 4.
This utility model, with respect to prior art, has such advantages as and effect:
This utility model heat exchanger 4, the first loop pipeline 2, cold piece of the 1, first loop pipeline 2, the first electrohydraulic dynamic of liquid are micro-
The closed circuit that pump 3, the second loop pipeline 21 and second electrohydraulic dynamic Micropump 31 etc. constitute a closed loop liquid refrigerant returns
Road.Liquid refrigerant is circulated by the driving force that electrohydraulic dynamic Micropump is provided.Liquid cooling system is subject to the external world at cold piece of liquid
The effect of thermal source, is taken to cold for the liquid piece of external heat being subject at heat exchanger by circulating of liquid refrigerant, and by changing
Hot device fin distributes heat to outside.
This utility model not only solves high-power electronic device high efficiency and heat radiation problem, and solves traditional mechanical pump tool
Have the shortcomings that volume is big, power consumption is high, noise is big, flow-control is not accurate；This utility model electrohydraulic dynamic Micropump has without motion
The advantages of part, reliable, low in energy consumption, easy making and Maintenance free, and can be directly integrated with chip or runner, no
Need separate space.The small-sized liquid cooling system that electrohydraulic dynamic Micropump drives has small volume, reliable, low in energy consumption, heat power
Big the advantages of, the fields such as electronic device cooling, drug delivery and MEMS can be used in.
Brief description
Fig. 1 is the structural representation of the small-sized liquid cooling system that this utility model electrohydraulic dynamic Micropump drives.
Fig. 2 is this utility model electrohydraulic dynamic micro-pump structure schematic diagram.
Fig. 3 is the structure distribution schematic diagram of this utility model matrix and electrod-array.
Specific embodiment
With reference to specific embodiment, this utility model is more specifically described in detail.
Embodiment
As shown in Figures 1 to 3.The utility model discloses the small-sized liquid cooling system that a kind of electrohydraulic dynamic Micropump drives, including
Cold piece 1 of liquid being perfused with liquid refrigerant and the heat exchanger 4 being perfused with liquid refrigerant；The first ring is passed through in the outlet of described heat exchanger 4
The import that cold piece 1 of road pipeline 2 connection liquid, is in series with the first electrohydraulic dynamic Micropump 3 on the pipeline of the first loop pipeline 2；Described
The outlet that cold piece 1 of liquid connects the import of heat exchanger 4 by the second loop pipeline 21, connects on the pipeline of the second loop pipeline 21
There is the second electrohydraulic dynamic Micropump 31.
Described first electrohydraulic dynamic Micropump 3 includes thering is end cover 3-1, the setting that cavity 3-3 is matched with cavity 3-3
In end cover 3-1 inner surface and extend to the matrix 3-2 within cavity 3-3, be attached to matrix 3-2 lower surface by mutual
The negative electrode of interleaved distribution and the electrod-array 3-5 of anode composition.Described negative electrode and anode are downwardly convex, and with cavity 3-3
Inner bottom wall contact or gap cooperation.The import of described cavity 3-3 and the region of outlet, are respectively equipped with the heavy of concave downward
Groove, the turnover for liquid refrigerant provides a relief area, to improve the flow efficiency of liquid refrigerant.
The structure of described second electrohydraulic dynamic Micropump 31 is identical with the first electrohydraulic dynamic Micropump 3；Described electrod-array 3-5 is
Comb-like electrode array, requires can also be other arbitrary shapes according to concrete application certainly.
Liquid refrigerant is under the driving force of the first electrohydraulic dynamic Micropump 3 and the second electrohydraulic dynamic Micropump 31 acts on, cold from liquid
The second electrohydraulic dynamic Micropump 31 that the outlet of block 1 is flowed out and passed through on the second loop pipeline 21 enters heat exchanger 4, in heat exchanger 4
Inside carry out heat exchange；Complete the liquid refrigerant after heat exchange, then flowed out by the outlet of heat exchanger 4 and pass through the first loop pipeline 2
On the first electrohydraulic dynamic Micropump 3 be back in heat exchanger 4；Constantly circulated with this.
One of described electrod-array 3-5 negative electrode and adjacent thereto anode constitute one group of electrode pair；Described electricity
After negative electrode in the array 3-5 of pole and negative electrode difference parallel connection, then by respective binding post 3-6 connect setting in end cover 3-
Binding post 3-4 on 1 connects external power source.
Described heat exchanger 4 is provided with radiating fin 4-1.Described matrix 3-2 is made up of bar shaped insulant；Described cavity 3-
3 is bar shaped cavity.It is bolted between described end cover 3-1 and cavity 3-3.Described end cover 3-1 and binding post
Being connected by between 3-4 is tightly connected.Faying face between described end cover 3-1 and cavity 3-3 is combined for hermetic seal.
This utility model heat dissipating method can be achieved by the steps of:
Step one: cold for liquid piece 1 is fitted tightly with extraneous thermal source to be radiated；Connect external power source, start first electro-hydraulic
Power Micropump 3 and the second electrohydraulic dynamic Micropump 31 are so as in running order；
Step 2: the liquid refrigerant that its heat transfer is flowed by thermal source to be radiated to cold piece of 1 inner loop of liquid；
Step 3: liquid refrigerant the first electrohydraulic dynamic Micropump 3 and the second electrohydraulic dynamic Micropump 31 driving force act under,
Flow out and pass through the second electrohydraulic dynamic Micropump 31 the second loop pipeline 21 from cold piece 1 of outlet of liquid and enter heat exchanger 4, changing
Carry out heat exchange in hot device 4；Complete the liquid refrigerant after heat exchange, then flowed out by the outlet of heat exchanger 4 and pass through the first loop
The first electrohydraulic dynamic Micropump 3 on pipeline 2 is back in heat exchanger 4；Liquid refrigerant is constantly circulated with this, and thermal source produces the most at last
Heat in the air is transferred to by heat exchanger 4.
As described above, just can preferably realize this utility model.
Embodiment of the present utility model is simultaneously not restricted to the described embodiments, other any without departing from of the present utility model
Spirit and the change made under principle, modification, replacement, combine, simplify, all should be equivalent substitute mode, be included in
Within protection domain of the present utility model.
Claims (9)
1. a kind of electrohydraulic dynamic Micropump drives small-sized liquid cooling system it is characterised in that: the liquid including being perfused with liquid refrigerant is cold
Block (1) and the heat exchanger (4) being perfused with liquid refrigerant；
The import of the first loop pipeline (2) connection liquid cold piece (1) is passed through in the outlet of described heat exchanger (4), in the first loop pipeline
(2) the first electrohydraulic dynamic Micropump (3) is in series with pipeline；
The import that the second loop pipeline (21) connects heat exchanger (4) is passed through in the outlet of described liquid cold piece (1), in the second loop pipeline
(21) the second electrohydraulic dynamic Micropump (31) is in series with pipeline.
2. according to claim 1 electrohydraulic dynamic Micropump drive small-sized liquid cooling system it is characterised in that: described first is electro-hydraulic
End cover (3-1) that power Micropump (3) includes having a cavity (3-3) and cavity (3-3) matches, it is arranged on end cover (3-
1) inner surface and extend to the matrix (3-2) internal with cavity (3-3), be attached to matrix (3-2) lower surface by spaced
The negative electrode being interspersed and the electrod-array (3-5) of anode composition；
The structure of described second electrohydraulic dynamic Micropump (31) is identical with the first electrohydraulic dynamic Micropump (3)；
Liquid refrigerant is under the driving force of the first electrohydraulic dynamic Micropump (3) and the second electrohydraulic dynamic Micropump (31) acts on, cold from liquid
The second electrohydraulic dynamic Micropump (31) that the outlet of block (1) is flowed out and passed through on the second loop pipeline (21) enters heat exchanger (4),
Heat exchanger carries out heat exchange in (4)；Complete the liquid refrigerant after heat exchange, then flowed out by the outlet of heat exchanger (4) and pass through
The first electrohydraulic dynamic Micropump (3) on one loop pipeline (2) is back in heat exchanger (4)；Constantly circulated with this.
3. according to claim 2 electrohydraulic dynamic Micropump drive small-sized liquid cooling system it is characterised in that: described electrod-array
(3-5) one of negative electrode and adjacent thereto anode constitute one group of electrode pair；Negative electrode in described electrod-array (3-5)
After negative electrode respectively parallel connection, then the binding post on end cover (3-1) by respective binding post (3-6) connect setting
(3-4) connect external power source.
4. according to claim 2 electrohydraulic dynamic Micropump drive small-sized liquid cooling system it is characterised in that: described electrod-array
(3-5) it is comb-like electrode array；Described negative electrode and anode are downwardly convex, and contact with the inner bottom wall of cavity 3-3 or
Gap coordinates；The import of described cavity 3-3 is respectively equipped with the deep gouge of concave downward with the region exporting.
5. according to claim 2 electrohydraulic dynamic Micropump drive small-sized liquid cooling system it is characterised in that: described heat exchanger
(4) radiating fin (4-1) is installed.
6. according to claim 2 electrohydraulic dynamic Micropump drive small-sized liquid cooling system it is characterised in that: described matrix (3-
2) it is made up of bar shaped insulant；Described cavity (3-3) is bar shaped cavity.
7. according to claim 2 electrohydraulic dynamic Micropump drive small-sized liquid cooling system it is characterised in that: described end cover
(3-1) it is bolted and cavity (3-3) between.
8. according to claim 3 electrohydraulic dynamic Micropump drive small-sized liquid cooling system it is characterised in that: described end cover
(3-1) being connected by and binding post (3-4) between is tightly connected.
9. according to claim 3 electrohydraulic dynamic Micropump drive small-sized liquid cooling system it is characterised in that: described end cover
(3-1) faying face between cavity (3-3) is combined for hermetic seal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620880936.2U CN205900530U (en) | 2016-08-15 | 2016-08-15 | Small -size liquid cooling system of electricity flow force micropump driven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620880936.2U CN205900530U (en) | 2016-08-15 | 2016-08-15 | Small -size liquid cooling system of electricity flow force micropump driven |
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| Publication Number | Publication Date |
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| CN205900530U true CN205900530U (en) | 2017-01-18 |
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| CN201620880936.2U Expired - Fee Related CN205900530U (en) | 2016-08-15 | 2016-08-15 | Small -size liquid cooling system of electricity flow force micropump driven |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098657A (en) * | 2016-08-15 | 2016-11-09 | 华南理工大学 | The small-scale liquid cooling system of a kind of electrohydraulic dynamic Micropump driving and method |
| CN107529327A (en) * | 2017-10-24 | 2017-12-29 | 山东大学 | Micro-move device active heat radiating device and the electronic equipment with the heat abstractor |
| CN109742059A (en) * | 2019-01-07 | 2019-05-10 | 常州泰格尔电子材料科技有限公司 | One kind being applied to high-power semiconductor module " He Shi " radiator structure |
| CN115023126A (en) * | 2022-07-13 | 2022-09-06 | Oppo广东移动通信有限公司 | Electronic equipment and heat conduction system thereof |
-
2016
- 2016-08-15 CN CN201620880936.2U patent/CN205900530U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098657A (en) * | 2016-08-15 | 2016-11-09 | 华南理工大学 | The small-scale liquid cooling system of a kind of electrohydraulic dynamic Micropump driving and method |
| CN106098657B (en) * | 2016-08-15 | 2018-09-14 | 华南理工大学 | A kind of small-sized liquid cooling system and method for the driving of electrohydraulic dynamic Micropump |
| CN107529327A (en) * | 2017-10-24 | 2017-12-29 | 山东大学 | Micro-move device active heat radiating device and the electronic equipment with the heat abstractor |
| CN107529327B (en) * | 2017-10-24 | 2024-01-30 | 山东大学 | Micro-driving active heat dissipation device and electronic equipment with same |
| CN109742059A (en) * | 2019-01-07 | 2019-05-10 | 常州泰格尔电子材料科技有限公司 | One kind being applied to high-power semiconductor module " He Shi " radiator structure |
| CN109742059B (en) * | 2019-01-07 | 2020-09-15 | 常州泰格尔电子材料科技有限公司 | Heat dissipation structure applied to high-power semiconductor module |
| CN115023126A (en) * | 2022-07-13 | 2022-09-06 | Oppo广东移动通信有限公司 | Electronic equipment and heat conduction system thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170118 Termination date: 20190815 |