CN107529327A - Micro-move device active heat radiating device and the electronic equipment with the heat abstractor - Google Patents
Micro-move device active heat radiating device and the electronic equipment with the heat abstractor Download PDFInfo
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- CN107529327A CN107529327A CN201710999647.3A CN201710999647A CN107529327A CN 107529327 A CN107529327 A CN 107529327A CN 201710999647 A CN201710999647 A CN 201710999647A CN 107529327 A CN107529327 A CN 107529327A
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- diaphragm
- heat radiating
- delivery port
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 229910002804 graphite Inorganic materials 0.000 claims description 16
- 239000010439 graphite Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002923 metal particle Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 description 11
- 238000006073 displacement reaction Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 230000003321 amplification Effects 0.000 description 5
- 238000003199 nucleic acid amplification method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of micro-move device active heat radiating device and with the heat abstractor electronic equipment, belong to small-sized electronic product technical field of heat dissipation.The micro-move device active heat radiating device includes Micropump, the first delivery port and the first water inlet are provided with Micropump, first delivery port is connected with heat exchanger and heat dissipation pipeline in turn between the first water inlet, Micropump includes hydraulic cavities, hydraulic cavities are from bottom to up that cylindric and described first paragraph, second segment and the 3rd section of diameter are sequentially reduced successively including first paragraph, second segment and the 3rd section；3rd section is provided with upper diaphragm, and upper piston is provided with above upper diaphragm, and upper piston is located in a water cavity, and water cavity is cylindric, and the first water inlet and the first delivery port are located on water cavity；First paragraph is provided with lower diaphragm, and piezoelectric ceramics is provided with below lower diaphragm.The present invention can realize the active heat removal of small-sized electronic product, can be very good rapidly to distribute heat caused by CPU, improve the performance of small-sized electronic product.
Description
Technical field
The present invention relates to small-sized electronic product technical field of heat dissipation, particularly relates to a kind of micro-move device active heat radiating device and tool
There is the electronic equipment of the heat abstractor.
Background technology
The small-sized electronic product of currently the majority all uses the scheme of graphite radiating, and general principle is all identical, different factories
Family can do some adjustment for oneself product design.CPU caloric values are big, and graphite heat radiation fin dissipates on the encapsulated layer of these chips
The another side of backing can be attached in fuselage above the metallic plate of centre.The another side of metallic plate typically also has one block of graphite
Fin, it is corresponding to connect cell phone back cover.Behind screen and CPU heat all can by centre metal level mutually transmit,
Due to the more outstanding heat-sinking capability of graphite heat radiation fin, plus outstanding thickness and plasticity, finally heat is uniformly divided
Radiated after cloth and by the flowing of air, can also be survived inside narrow and small mobile phone space.But CPU dominant frequency is got over
Come higher, the task of execution is more and more numerous and diverse, and this method does not reach cooling requirements increasingly.
In addition, following several heat dissipating methods also be present at present：(1) ice nest scheme, actually in graphite radiating scheme
Improved, using the ice nest cooling system with exclusive patent.This system is that a species is added between chip and graphite
The metal material of liquid, it is solid-state usually, when treating that chip heating increases, it will absorb heat and become liquid, improve heat
Transmission efficiency.The scheme of this improvement does not reach expected radiating effect.(2) micro heat pipe scheme, this heat sink conception
Using flat hot pipe, there is heat diffusion ability, reduce the heat flow density of radiating surface, reduce the thermal resistance in chip cooling path, this
Heat dissipation technology of the kind scheme from computer and notebook.For small-sized electronic product the inside, it is necessary to heat pipe is miniaturized, only
Small-sized electronic product radiating could be used for by realizing after heat pipe is miniaturized.It is confined to super-thin small electronic product and develops this side
Method is difficult application.
The content of the invention
The present invention provides a kind of micro-move device active heat radiating device and the electronic equipment with the heat abstractor, and it can be realized
It the active heat removal of small-sized electronic product, can be very good rapidly to distribute heat caused by CPU, improve small-sized electronic product
Performance.
In order to solve the above technical problems, present invention offer technical scheme is as follows：
On the one hand, the present invention provides a kind of micro-move device active heat radiating device, including Micropump, and first is provided with the Micropump
Delivery port and the first water inlet, first delivery port are connected with heat exchanger and heat dissipation pipeline in turn between the first water inlet,
Wherein：
The Micropump includes hydraulic cavities, and the hydraulic cavities are from bottom to up successively including first paragraph, second segment and the 3rd section, institute
State first paragraph, second segment and the 3rd section are that cylindric and described first paragraph, second segment and the 3rd section of diameter are sequentially reduced；
Described 3rd section is provided with upper diaphragm, and upper piston is provided with above the upper diaphragm, and the upper piston is located at one
In water cavity, the water cavity is cylindric, and first water inlet and the first delivery port are located on the water cavity；
The first paragraph is provided with lower diaphragm, and piezoelectric ceramics is provided with below the lower diaphragm.
Further, the heat exchanger includes microchannel, lower connecting plate, the lower connecting plate being provided with below the microchannel
On be provided with for heat transfer copper billet of the CPU heat transfer to microchannel, one end of the microchannel to be provided with into the second water inlet
Mouthful, the other end of the microchannel is provided with the second delivery port, is provided with above the microchannel and is fixed with the lower connecting plate
The top board of connection.
Further, the piezoelectric ceramics is stacking piezoelectric ceramics.
Further, the thickness of the upper diaphragm is less than the thickness of the lower diaphragm, and the upper diaphragm is rubber membrane, described
Lower diaphragm is copper sheet.
Further, the upper diaphragm thickness is 0.05mm~0.25mm, and the lower diaphragm thickness is 0.4mm~0.6mm.
Further, the upper piston include piston only and be arranged on piston only lower section and with the upper diaphragm
The connecting rod of contact, the piston only and connecting rod are cylindric, and the diameter of the piston only is more than the straight of the connecting rod
Footpath.
Further, the diameter of the water cavity is equal to the diameter of the first paragraph.
Further, the heat dissipation pipeline is coiled pipe, and the water containing metal particle, institute are added with the heat dissipation pipeline
State the one-way cock that the first water inlet and the first delivery port use Integral opening-closing type.
On the other hand, the present invention also provides a kind of electronic equipment, including above-mentioned micro-move device active heat radiating device, described to change
Hot device is close to the CPU surfaces of the electronic equipment, and the heat dissipation pipeline is close to dissipating on the inside of the shell of the electronic equipment
In hot graphite linings.
Further, the heat exchanger is bonded in CPU surface by heat conductive silica gel.
The invention has the advantages that：
The micro-move device active heat radiating device of the present invention and the electronic equipment with the heat abstractor, micro-move device active heat removal dress
Put including Micropump, be provided with the first delivery port and the first water inlet on Micropump, the first delivery port between the first water inlet successively
It is connected with heat exchanger and heat dissipation pipeline, Micropump includes hydraulic cavities, and hydraulic cavities include first paragraph, second segment and the successively from bottom to up
Three sections, the first paragraph, second segment and the 3rd section be cylindric and described first paragraph, second segment and the 3rd section of diameter successively
Reduce, displacement is increased by the way of this isometric variable area forms amplification cavity, utilize the high frequency of piezoelectric ceramics by Micropump
Vibration displacement, lower diaphragm is promoted to be vibrated, lower diaphragm vibration is by hydraulic cavities and then drives the vibration of upper diaphragm, due to hydraulic pressure
The three-stage design of chamber, has larger dynamic vibration multiplication factor, so as to realize upper piston larger displacement under dither
Reciprocating motion, the liquid circulation in circulation line is got up, constantly dissipated electronic equipment CPU heat by the flowing of liquid
Send out.The present invention can realize the active heat removal of small-sized electronic product, can be very good rapidly to distribute heat caused by CPU
Go out, improve the performance of small-sized electronic product.
Brief description of the drawings
Fig. 1 is the sectional view of the Micropump of the micro-move device active heat radiating device of the present invention；
Fig. 2 is the assembling schematic diagram of the micro-move device active heat radiating device of the present invention；
Fig. 3 is the structural representation of the heat exchanger of the micro-move device active heat radiating device of the present invention；
Fig. 4 is the explosive view of the heat exchanger of the micro-move device active heat radiating device of the present invention；
Fig. 5 is the schematic diagram of the microchannel of the heat exchanger shown in Fig. 4；
Fig. 6 is the schematic diagram of the piezoelectric ceramics of the Micropump shown in Fig. 1；
Fig. 7 is the first water inlet of Micropump and the valve schematic diagram of the first delivery port shown in Fig. 1；
Fig. 8 is the system amplitude-frequency response and dynamic modeling analogous diagram of the micro-move device active heat radiating device of the present invention.
Embodiment
To make the technical problem to be solved in the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and tool
Body embodiment is described in detail.
On the one hand, the present invention provides a kind of micro-move device active heat radiating device, as shown in Fig. 1~Fig. 8, including Micropump 1, Micropump
The first delivery port 2 and the first water inlet 3 are provided with 1, heat exchange is connected with turn between first the 2 to the first water inlet of delivery port 3
Device 4 and heat dissipation pipeline 5, wherein：
Micropump 1 includes hydraulic cavities 6, and hydraulic cavities 6 include first paragraph 6-1, second segment 6-2 and the 3rd section of 6- successively from bottom to up
3, first paragraph 6-1, second segment 6-2 and the 3rd section of 6-3 is cylindric and first paragraph 6-1, second segment 6-2 and the 3rd section of 6-3
Diameter is sequentially reduced；
3rd section of 6-3 is provided with upper diaphragm 7, and the top of upper diaphragm 7 is provided with upper piston 8, and upper piston 8 is located at a water cavity 9
Interior, water cavity 9 is cylindric, and the first water inlet 3 and the first delivery port 2 are located on water cavity 9；
First paragraph 6-1 is provided with lower diaphragm 10, and the lower section of lower diaphragm 10 is provided with piezoelectric ceramics 11.
The micro-move device active heat radiating device of the present invention, including Micropump, the first delivery port and the first water inlet is provided with Micropump
Mouthful, the first delivery port includes hydraulic cavities, hydraulic cavities to heat exchanger and heat dissipation pipeline, Micropump is connected between the first water inlet in turn
From bottom to up successively including first paragraph, second segment and the 3rd section, the first paragraph, second segment and the 3rd section are cylindric and institute
State first paragraph, second segment and the 3rd section of diameter to be sequentially reduced, Micropump forms amplification cavity using this isometric variable area
Mode, displacement is increased, using the dither displacement of piezoelectric ceramics, promote lower diaphragm to be vibrated, lower diaphragm vibration passes through
Hydraulic cavities and then the vibration for driving upper diaphragm, because the three-stage of hydraulic cavities designs, larger dynamic is had under dither
Multiplication factor is vibrated, so as to realize the reciprocating motion of upper piston larger displacement, the liquid circulation in circulation line is got up, passed through
The flowing of liquid constantly distributes electronic equipment CPU heat.The present invention can realize that the active of small-sized electronic product dissipates
Heat, it can be very good rapidly to distribute heat caused by CPU, improve the performance of small-sized electronic product.
The present invention is with piezoelectric ceramics as power source, and small volume, High power output, power consumption is small, and noise is small.Whole system cloth
Flexibly, noiseless, overall volume is small, will not take the very big space of electronic equipment for office.The dual chamber of the present invention reduces liquid
By the impact of large area to small area.The diameter proportion of three sections of hydraulic cavities is preferably in the present invention：First paragraph：Second segment：3rd
Section=6:3:1, and specifically, it is preferable to be：First paragraph diameter 3mm or so, second segment diameter 1.5mm or so, the 3rd section of diameter 0.5mm
Left and right.
Micropump in the present invention is preferably disposed on the side of circuit board, is controlled by voltage oscillating circuit on circuit board, specifically
Circuit control structure existing ripe circuit on the market, be not belonging to the innovative point of the present invention, here is omitted.
Further, as shown in Fig. 3~Fig. 5, heat exchanger 4 includes microchannel 12, and the lower section of microchannel 12, which is provided with down, to be connect
Plate 13, it is provided with lower connecting plate 13 for by heat transfer copper billet 14 of the CPU heat transfer to microchannel 12, one end of microchannel 12
Be provided with the second water inlet 15, the other end of microchannel 12 is provided with the second delivery port 16, the top of microchannel 12 be provided with
The top board 17 that lower connecting plate 13 is fixedly connected.Heat exchanger is used for the CPU surfaces for being close to electronic equipment, using copper as material, uses
Microchannel, increase heat exchange efficiency.
Preferably, as shown in fig. 6, piezoelectric ceramics 11 is stacking piezoelectric ceramics.The top of stacking piezoelectric ceramics is provided with convex
Rise.Fig. 6 indicates drive signal with stacking the mode of connection of piezoelectric ceramics.Piezoelectric ceramics is stacked, there is larger carry-out bit
Move, stacking piezoelectric ceramics maximum displacement of the invention can arrive 10um, and frequency can arrive 40KHz.
In order to obtain larger output displacement, the thickness of upper diaphragm 7 is less than the thickness of lower diaphragm 10, and upper diaphragm 7 is preferably
Rubber membrane, lower diaphragm 10 are preferably copper sheet.
Further, the thickness of upper diaphragm 7 is 0.05mm~0.25mm, preferably 0.1mm, and the lower thickness of diaphragm 10 is 0.4mm
~0.6mm, preferably 0.5mm.
In the present invention, upper piston 8 includes piston only and is arranged on piston only lower section and the company contacted with upper diaphragm 7
Bar, piston only and connecting rod are cylindric, and the diameter of piston only is more than the diameter of connecting rod.
Maximized to export, the diameter of water cavity 9 is equal to first paragraph 6-1 diameter.
Preferably, heat dissipation pipeline 5 is coiled pipe, and the water containing metal particle is added with heat dissipation pipeline 5, as shown in fig. 7,
First water inlet 3 and the first delivery port 2 use the one-way cock of Integral opening-closing type, and the first water inlet 3 and the first delivery port 2 are anti-
To symmetrical.Heat dissipation pipeline bends and for being affixed on radiating graphite linings, quickly can distributed heat.Snakelike tubular construction letter
Single, low cost, operational administrative are also convenient for；And high pressure can be born in coiled pipe, relatively it is suitable for use in needing heat transfer area is little to set
Make heat exchange component for interior.The water containing metal particle is added with heat dissipation pipeline, to increase the heat transfer property of water.First water inlet
The one-way cock of Integral opening-closing type is used with the first delivery port, it is possible to achieve high frequency folding.
On the other hand, the present invention also provides a kind of electronic equipment, including above-mentioned micro-move device active heat radiating device, heat exchanger
4 are close to the CPU surfaces of electronic equipment, and heat dissipation pipeline is close in the radiating graphite linings on the inside of the shell of the electronic equipment.
Electronic equipment can be mobile phone or other small-sized electronic products, and the present invention is applicable.
The present invention is made up of three parts:The Micropump of inverse piezoelectric effect and micro displacement magnifying mechanism based on piezoelectric ceramics；
Structure connection CPU and the circulation microchannel tubing for the graphite linings that radiate under microchannel；Microfluidic control technical controlling Micropump
Work, make in microchannel tubing fluid flow stable.Three parts form a cycle cooling system, hot caused by CPU
Amount takes graphite linings radiating to.
The present invention small-sized electronic product radiating in by way of active heat removal, by the flowing of liquid CPU's
Heat constantly distributes.When liquid in microchannel passes through CPU, heat exchange can be produced with CPU, and the efficiency of microchannel is remote
Radiated much larger than air, the most heats of CPU can be taken away by liquid, when flowing to contact graphite linings area of liquid, same meeting
For the substantial amounts of heat transfer that itself is carried in graphite linings, it is outside that graphite linings reject heat to electronic equipment (such as mobile phone) again.It is such
One cyclic process causes the most heat of electronic equipment constantly to distribute.
Further, heat exchanger 4 is bonded in CPU surface by heat conductive silica gel.The heat conductive silica gel coefficient of heat conduction compares air
Height, heat can be made more efficiently to be transferred to from CPU in radiating graphite linings.
Present disclosure can be further illustrated by following simulation result：
As shown in figure 8, it is system amplitude-frequency response and dynamic modeling analogous diagram.Ordinate is multiplication factor in figure, horizontal
Coordinate is the ratio of incoming frequency and intrinsic frequency.According to theory deduction, the multiplication factor of Systems Theory and incoming frequency/intrinsic
Shown in solid in the relation such as Fig. 8 of frequency, small triangle point is to emulate obtained multiplication factor, simulation value and reason in the point
It is more or less the same by value, both are mutually authenticated.The piezoelectric ceramics output of the present invention can be according to the difference of voltage, and output frequency can be with
Regulation, obtains, when output frequency is 6.9kHz, there is maximum amplification 60.5 from theory, reaches the intrinsic frequency of amplification system
Rate, at this moment amplification system have maximum displacement output.
Described above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, on the premise of principle of the present invention is not departed from, some improvements and modifications can also be made, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
- A kind of 1. micro-move device active heat radiating device, it is characterised in that including Micropump, be provided with the Micropump the first delivery port and First water inlet, first delivery port are connected with heat exchanger and heat dissipation pipeline in turn between the first water inlet, wherein：The Micropump includes hydraulic cavities, and the hydraulic cavities include first paragraph, second segment and the 3rd section successively from bottom to up, and described the One section, second segment and the 3rd section are that cylindric and described first paragraph, second segment and the 3rd section of diameter are sequentially reduced；Described 3rd section is provided with upper diaphragm, and upper piston is provided with above the upper diaphragm, and the upper piston is located at a water cavity Interior, the water cavity is cylindric, and first water inlet and the first delivery port are located on the water cavity；The first paragraph is provided with lower diaphragm, and piezoelectric ceramics is provided with below the lower diaphragm.
- 2. micro-move device active heat radiating device according to claim 1, it is characterised in that the heat exchanger includes microchannel, Lower connecting plate is provided with below the microchannel, be provided with the lower connecting plate for by CPU heat transfer to microchannel Conduct heat copper billet, and one end of the microchannel is provided with the second water inlet, and the other end of the microchannel is provided with the second delivery port, The top board being fixedly connected with the lower connecting plate is provided with above the microchannel.
- 3. micro-move device active heat radiating device according to claim 1, it is characterised in that the piezoelectric ceramics is stacking piezoelectricity Ceramics.
- 4. micro-move device active heat radiating device according to claim 1, it is characterised in that the thickness of the upper diaphragm is less than institute The thickness of lower diaphragm is stated, the upper diaphragm is rubber membrane, and the lower diaphragm is copper sheet.
- 5. micro-move device active heat radiating device according to claim 4, it is characterised in that the upper diaphragm thickness is 0.05mm ~0.25mm, the lower diaphragm thickness are 0.4mm~0.6mm.
- 6. micro-move device active heat radiating device according to claim 1, it is characterised in that the upper piston includes piston only Be arranged on the connecting rod that contacts below the piston only and with the upper diaphragm, the piston only and connecting rod are cylinder Shape, and the diameter of the piston only is more than the diameter of the connecting rod.
- 7. micro-move device active heat radiating device according to claim 1, it is characterised in that the diameter of the water cavity is equal to described The diameter of first paragraph.
- 8. micro-move device active heat radiating device according to claim 1, it is characterised in that the heat dissipation pipeline is coiled pipe, The water containing metal particle is added with the heat dissipation pipeline, first water inlet and the first delivery port use overall folding The one-way cock of formula.
- 9. a kind of electronic equipment, it is characterised in that including any described micro-move device active heat radiating devices of claim 1-8, institute The CPU surfaces that heat exchanger is close to the electronic equipment are stated, the heat dissipation pipeline is close on the inside of the shell of the electronic equipment Radiating graphite linings on.
- 10. electronic equipment according to claim 9, it is characterised in that the heat exchanger is bonded in CPU by heat conductive silica gel Surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710999647.3A CN107529327B (en) | 2017-10-24 | 2017-10-24 | Micro-driving active heat dissipation device and electronic equipment with same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710999647.3A CN107529327B (en) | 2017-10-24 | 2017-10-24 | Micro-driving active heat dissipation device and electronic equipment with same |
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| CN107529327A true CN107529327A (en) | 2017-12-29 |
| CN107529327B CN107529327B (en) | 2024-01-30 |
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| US20060207752A1 (en) * | 2005-03-15 | 2006-09-21 | Inventec Corporation | Micro liquid cooling device |
| CN104180015A (en) * | 2014-07-07 | 2014-12-03 | 宁波大学 | Micro valve and method for controlling transport of fluid by virtue of micro valve |
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-
2017
- 2017-10-24 CN CN201710999647.3A patent/CN107529327B/en active Active
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|---|---|---|---|---|
| US20060207752A1 (en) * | 2005-03-15 | 2006-09-21 | Inventec Corporation | Micro liquid cooling device |
| CN104869785A (en) * | 2014-02-20 | 2015-08-26 | 联想(北京)有限公司 | Electronic equipment |
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| Publication number | Publication date |
|---|---|
| CN107529327B (en) | 2024-01-30 |
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