CN109074190A - Display module and glass with undercutting plastic frame - Google Patents
Display module and glass with undercutting plastic frame Download PDFInfo
- Publication number
- CN109074190A CN109074190A CN201780020811.XA CN201780020811A CN109074190A CN 109074190 A CN109074190 A CN 109074190A CN 201780020811 A CN201780020811 A CN 201780020811A CN 109074190 A CN109074190 A CN 109074190A
- Authority
- CN
- China
- Prior art keywords
- layer
- electronic equipment
- display
- edge region
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
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- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
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- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2220/00—Batteries for particular applications
- H01M2220/30—Batteries in portable systems, e.g. mobile phone, laptop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Telephone Set Structure (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a kind of electronic equipments with display assembly.Several layers are in combination with to form display assembly.For example, display assembly may include touch-sensitive layer (or touch sensing layer), the display layer and power photosensitive layer (or power detection layers) that visual information is presented.Display layer may include allowing a part of display layer around the curved bending section of power photosensitive layer or bending part.In addition, connector (providing electrically and mechanically) can be positioned at the different location of layer.For example, display layer may include the connector on first edge region, and power photosensitive layer may include the connector on second edge region, the second edge region perpendicular to or be at least substantially orthogonal to first edge region.By the way that connector to be located on vertical edge region, display assembly can reduce its occupied area.
Description
Technical field
It is described below and is related to electronic equipment.Specifically, electronic equipment is below related to, which includes having with several
The display assembly of active layer.Display assembly is designed to be bent or bend around power photosensitive layer.In addition, in order to increase electronic equipment
In available space amount, active layer is electrically and mechanically positioned at various locations.
Background technique
Electronic equipment may include display assembly.When display assembly includes multiple layers, occupied by display assembly
Volume increases, this can cause engineering design changes to accommodate increased volume.In addition, each of layer layer needs to be electrically connected and machine
Tool connection.When electrically and mechanically stack on top of each other or it is located adjacent one another when, can lead to additional design challenge.
Summary of the invention
In one aspect, a kind of display assembly for electronic equipment is described.Display assembly may include touch-sensitive layer,
The touch-sensitive layer is able to detect the touch input for capableing of controlling electronic devices.Display assembly, which may also include to be able to detect, is applied to touching
The power photosensitive layer of the size of the power of photosensitive layer.Display assembly may also include the display layer that visual information can be presented.Display layer can be extremely
It is partially located between touch-sensitive layer and power photosensitive layer.In some embodiments, display layer is at least partly around power photosensitive layer
Bending.
On the other hand, a kind of electronic equipment is described.Electronic equipment may include the protective layer formed by transparent material.Electricity
Sub- equipment may also include the display assembly covered by protective layer.Display assembly may include being able to detect to be applied to protective layer
The power photosensitive layer of the size of power.Display assembly may also include the display layer between touch-sensitive layer and power photosensitive layer.In some implementations
In scheme, display is bent at least partly around the power photosensitive layer for limiting bending section.Electronic equipment may also include carrying protection
The frame of layer.Frame may include the recess that display is at least partly received at bending section.
On the other hand, a kind of method of display assembly for being used to form electronic equipment is described.This method may include
Display layer is located between touch-sensitive layer and power photosensitive layer.The touch that the touch-sensitive layer can be configured to detection controlling electronic devices is defeated
Enter.The power photosensitive layer can be configured to the size that detection is applied to the power of touch-sensitive layer.This method may also include bending display layer, so that
Display layer is bent at least partly around power photosensitive layer.
When one skilled in the relevant art checks the following drawings and detailed description, the other systems of embodiment, side
Method, feature and advantage will be or will become obviously.All such spare systems, method, feature and advantage are intended to
In this specification and the content of present invention, in the range of being included in these embodiments, and protected by following claims
Shield.
Detailed description of the invention
By the detailed description below in conjunction with attached drawing, the disclosure will readily appreciate that, wherein similar reference label refers to class
As structural detail, and wherein:
Fig. 1 shows the isometric front view of the embodiment of the electronic equipment according to some embodiments；
Fig. 2 shows the isometric back views of electronic equipment shown in Fig. 1, and which further illustrate the attached of electronic equipment
Add features；
Fig. 3 shows the partial exploded view of electronic equipment shown in Fig. 1, and it illustrates the various portions of electronic equipment
Part；
Fig. 4 shows the partial exploded view of electronic equipment shown in Fig. 1, and which further illustrate the attached of electronic equipment
Made component；
Fig. 5 shows the cross-sectional view of the line A-A interception in Fig. 1 of electronic equipment shown in Fig. 1；
Fig. 6 shows the cross-sectional view of the alternative embodiment of the electronic equipment according to some embodiments；
Fig. 7 shows the cross-sectional view of the line B-B interception in Fig. 1 of electronic equipment shown in Fig. 1；
Fig. 8 shows the cross-sectional view of the alternative embodiment of the electronic equipment according to some embodiments；
Fig. 9 shows the plan view of the embodiment of the frame according to some embodiments；
Figure 10 shows the cross-sectional view of the interception of A-A along the line of the frame shown in Fig. 9；
Figure 11 shows the cross-sectional view of the alternative embodiment of the frame according to some embodiments, and it illustrates this
The surface of frame has prominent features portion；
Figure 12 shows the cross-sectional view of the embodiment of electronic equipment, and it illustrates the electronic equipments to have frame and portion
Divide in ground insertion frame and extends substantially into the support component in frame；
Figure 13 shows the cross-sectional view of the embodiment of the electronic equipment according to some embodiments, and it illustrates this
Electronic equipment has protection covering and is extended to provide the side member of additional support for protection covering；
Figure 14 shows the cross-sectional view of the embodiment of the electronic equipment according to some embodiments, and it illustrates this
Electronic equipment has various structural reinforcements；
Figure 15 shows the plan view of the embodiment of the electronic equipment according to some embodiments, and it illustrates quilts
The plate being located in the shell of the electronic equipment；
Figure 16 shows the partial side view of electronic equipment shown in figure 15, and which further illustrate the first extensions of plate
It is fixed together with display assembly；
Figure 17 shows the cross-sectional views according to the embodiment of the electronic equipments of some embodiments, and it illustrates this
The support construction that electronic equipment has shell and is formed integrally with the shell；
Figure 18 shows the plan view of the embodiment of the protection covering according to some embodiments；
Figure 19 shows the cross-sectional view of the interception of B-B along the line of the protection covering shown in Figure 18, further shows
The recess being formed in protection covering；
Figure 20 shows the cross-sectional view of the embodiment of the electronic equipment according to some embodiments, and it illustrates guarantors
Shield covering (as shown in Figure 18 and Figure 19) is fixed together with shell；
Figure 21 shows the cross-sectional view of the embodiment of the electronic equipment according to some embodiments, and it illustrates guarantors
Shield covering extends above frame and adjacent sidewall positioning parts；
Figure 22 shows the exploded view of the battery according to some embodiments；
Figure 23 shows the plan view of first electrode shown in Figure 22；
Figure 24 show according to some embodiments be suitable in battery component used in electrode alternative implementation
The plan view of scheme；
Figure 25 show according to some embodiments be suitable in battery component used in electrode alternative implementation
The plan view of scheme；
Figure 26 show according to some embodiments be suitable in battery component used in electrode alternative implementation
The plan view of scheme；
Figure 27 shows the embodiment of the battery being located in electronic equipment according to some embodiments, wherein should
Battery has the shape for the internal part for accommodating electronic equipment；
Figure 28 shows the alternative embodiment party of the battery component being located in electronic equipment according to some embodiments
Case, wherein the battery component has the shape for the multiple internal parts for accommodating electronic equipment；
Figure 29 shows the alternative embodiment party of the battery component being located in electronic equipment according to some embodiments
Case, wherein the battery component has the opening for the internal part for accommodating electronic equipment；
Figure 30 shows the alternative embodiment party of the battery component being located in electronic equipment according to some embodiments
Case, wherein the battery component is positioned in (electronic equipment) shell, above the first internal part of electronic equipment；
Figure 31 shows the cross-sectional view of the line C-C interception in Figure 30 of the electronic equipment shown in Figure 30；
Figure 32 show according to some embodiments in Fig. 4 shown in circuit board assemblies exploded view；
Figure 33 shows the cross-sectional view of the circuit board assemblies shown in Figure 32, and it illustrates the various interior of circuit board assemblies
Portion's component；
Figure 34 shows the alternative embodiment of circuit board assemblies, it illustrates the circuit board assemblies be modified to for into
Enter protection；
Figure 35 shows the alternative embodiment of the circuit board assemblies according to some embodiments, and it illustrates the electricity
Road board group part has the flexible circuit with the circuit board electric coupling of the circuit board assemblies；
Figure 36 shows the cross-sectional view of circuit board assemblies shown in Figure 35, and it illustrates flexible circuits to prolong between circuit board
It stretches；
Figure 37 shows the cross-sectional view of the alternative embodiment of the circuit board assemblies according to some embodiments, shows
The internal part for having gone out circuit board assemblies has corresponding geometry；
Figure 38 shows the cross-sectional view of the alternative embodiment of the circuit board assemblies according to some embodiments, shows
Having gone out the circuit board assemblies has several solder masks for being used to support circuit board；
Figure 39 shows the isometric views of the embodiment of the audio-frequency module according to some embodiments；
Figure 40 shows the cross-sectional view of the line D-D interception in Figure 39 of the audio-frequency module shown in Figure 39, shows
Several inner features；
Figure 41 shows the cross-sectional view of electronic equipment, and it illustrates the audio-frequency modules to be positioned in electronic equipment；
Figure 42 shows the exploded view of the hot allocation component according to some embodiments；
Figure 43 shows the partial sectional view of electronic equipment shown in FIG. 1, and it illustrates hot allocation components to be positioned in electricity
In sub- equipment；
Figure 44 shows the side view of the alternative embodiment of the hot allocation component according to some embodiments；
Figure 45 shows the isometric views of the alternative embodiment of the hot allocation component according to some embodiments,
It shows hot allocation component and is modified to be able to receiving part；
Figure 46 shows the isometric views of the alternative embodiment of the hot allocation component according to some embodiments；
Figure 47, which is shown, is used to form the display assembly of electronic equipment according to showing for some embodiments
The flow chart of method；
Figure 48, which is shown, is used to form the side of the battery component of electronic equipment according to showing for some embodiments
The flow chart of method；
Figure 49, which is shown, is used to form the process of the method for circuit board assemblies according to showing for some embodiments
Figure；
Figure 50 shows the flow chart according to some embodiments, and the flow diagrams illustrate be used for assembling electronic equipment
Method, the electronic equipment include limit inner chamber shell；And
Figure 51 shows the process for showing the method for making hot allocation component according to some embodiments
Figure, the hot allocation component remove heat for the heat generating components from the electronic equipment with housing sidewall.
Those skilled in the art will understand and appreciate that traditionally, the various features for the attached drawing being discussed below are not
Must be drawn to scale, and the various features of attached drawing and the size of element can be expanded or shunk, to more clearly illustrate herein
The embodiments of the present invention.
Specific embodiment
It now will be referring particularly to the representative embodiment being shown in the accompanying drawings.It is not intended to it should be appreciated that being described below
Embodiment is limited to a preferred embodiment.On the contrary, it is intended to cover can be included in be defined by the following claims
The embodiment spirit and scope in alternate forms, modification and equivalent form.
In the following detailed description, with reference to the attached drawing for forming part of specification, and in the accompanying drawings with illustration
Mode shows the specific embodiment according to the embodiment.Although these embodiments are described in detail enough so that
The embodiment can be practiced by obtaining those skilled in the art, but it is to be understood that these embodiments are not limiting, and are made
Other embodiments must can be used and change can be made in the case where not departing from the spirit and scope of the embodiment.
Following disclosure is related to a kind of electronic equipment.The electronic equipment may include several enhancings better than traditional equipment
Part.For example, the electronic equipment may include the shell for limiting the inner chamber of electronic equipment.The electronic equipment may additionally include at least one
The display of shell is extended in a little positions, to increase the size of display.The display can be further include touch-sensitive layer and power
A part of the display assembly of photosensitive layer.In order to accommodate the display sizes of increase, which may include surrounding display
Frame (or frame), wherein the frame have reduced size.However, without specific modification, frame
Reduced size can expose between display assembly component and (in electronic equipment) flexible circuit electrically and mechanically
Connection.In this regard, some components of display assembly can be corresponding to its electric at the different location in entire electronic equipment
Road (including flexible circuit) electric coupling and mechanical coupling, to hide electrically and mechanically.For example, touch-sensitive layer and display
Can at a position in electronic equipment with its related circuit electric coupling and it is mechanical couple, and power photosensitive layer be located away it is touch-sensitive
At another different location electrically and mechanically between layer, display and its respective flexible circuits simultaneously with circuit electric coupling
Machinery coupling.In addition, by different locations to being electrically and mechanically routed, can make display assembly (and its
Component) volume that occupies reduces, and the additional space in the inner chamber of electronic equipment can in electronic device another or
Multiple and different components use.
The electronic equipment may also include the circuit board assemblies for being designed to occupy less space in the electronic device.For example,
The circuit board assemblies, which can be divided into, is stacked on first circuit board above second circuit board.The stacking configuration of multiple circuit boards
(one stacks on the other side) can reduce the occupied area of circuit board assemblies on two dimensions.In addition, aforementioned circuit plate
It may include the operating member (for example, integrated circuit or processor circuit) being positioned on multiple apparent surfaces.In addition, the circuit
Board group part may include being designed to transmit signal between first circuit board and second circuit board so that first circuit board and the
The interpolater or connectors that two circuit boards (and its corresponding operation component) communicate with one another.
In some cases, it includes recessed portion that the circuit board assemblies of stacking, which may include (being located in one of on circuit board),
Operating member and (on another circuit board) include that the protruding portion that is partly positioned in recessed portion is (or prominent
Features) additional operations component.In this way, receiving a part of additional operations component based on recessed portion, circuit board can be positioned
It obtains closer to be further reduced the occupied area of the circuit board assemblies of stacking.In addition, in some cases, operation portion
Part can be electrically coupled to each other.For example, recessed portion may include connector, and protruding portion may include the connector for being electrically coupled to recessed portion
Connector.Due to the electrical connection between operating member, circuit board can also be electrically connected each other.This can be reduced to for electric coupling electricity
The demand of the independent and dedicated electric connector of road plate.
The electronic equipment may also include battery component or internal electric source.Partially due to display assembly and circuit board group
Part is modified to form additional space in the housing, and battery component can dimensionally increase and occupy at least the one of additional space
Part, to increase the charge capacity of battery component.In addition, the battery component may include the shape in addition to traditional line shape
Shape.For example, battery component may include L-shape configuration, the L-shape configuration is and being die cut several electrodes in L-shape configuration
It is formed, to form battery component, the L-shape configuration of several electrodes is similar with battery component L-shape configuration.In addition, can be in electronics
Additional component such as antenna and circuit are relocated in equipment, to increase the size of battery component.In addition, the battery component can
Including modification, such as channel, the channel is designed to accommodate across battery component and specifically across the flexible circuit of channel routing.
In addition, in some cases, shell may include and the transparent protective layer of covering display assembly (such as covering glass
Glass) coupling metal tape.The metal tape may include metal such as aluminium, or the metal alloy comprising aluminium.The shell may also include with
The additional protective layers of metal tape coupling.The additional protective layers may include nonmetallic materials, glass, sapphire, plastics etc..It should
Additional protective layers can substantially limit the rear wall or bottom wall of electronic equipment.Therefore, heat is distributed and is consumed from electronic equipment by shell
Scattered ability can be restricted, because the amount of the metal for shell is confined to metal tape, and compared to formation metal tape
Metal, glass have significant lower thermal conductivity.
When one or more components (such as integrated circuit) in electronic equipment generate heat, it may be necessary to which removal is internal
The heat of chamber, it is impaired to avoid one or more components in electronic equipment.In this regard, electronic equipment may include against
Or the hot allocation component being arranged close to additional protective layers.The hot allocation component is designed to make from one or more heat generating components
Generated thermal dissipation (or redistribution) arrives metal tape, so that thermal energy be allowed to dissipate from electronic equipment.The hot allocation component
It may include several metal layers, one of metal layer can have relatively high thermal conductivity (compared to remainder layer).Therefore, the electricity
Sub- equipment may include the shell with the bottom wall made of glass, which can improve the overall aesthetic degree of electronic equipment, simultaneously
It can also be increased in the temperature in electronic equipment and remove electronic equipment before causing any internal part of electronic equipment to damage
In heat.In addition, the relatively low layer of thermal conductivity can prevent heat transfer to glass bottom wall, thus in the user of electronic equipment
Thermal energy is prevented or limited when holding electronic equipment reaches user.
In addition, power photosensitive layer, which can determine, is applied power over the display when user and display assembly interact
Size, to generate order according to the size of identified power.However, being applied (by the protective layer for covering display assembly)
The power for being added on display assembly can be such that display assembly and protective layer is bent, to reduce inner chamber and increase air pressure inside.Increase
Big air pressure inside can influence other component, such as be designed to the audio-frequency module of generation sound energy.In order to by audio-frequency module and increase
Big air pressure is kept apart, the audio-frequency module may include encapsulate audio-frequency module component (back cavity including audio-frequency module) shell or
Shell, and the shielding case of the air in insulating electron equipment inner chamber is provided, and therefore by the back cavity of audio-frequency module and electricity
Pressure change in sub- equipment is kept apart.In this way, audio-frequency module would not be influenced by pressure change in electronic equipment, and
The generation sound energy in the case where not interfered by pressure change.
These embodiments and other embodiments are discussed below with reference to Fig. 1-51.However, those skilled in the art will
It is readily appreciated that, herein in relation to detailed description given by these attached drawings merely for illustrative purpose, and should not be construed as
It is restrictive.
Fig. 1 shows the isometric front view of the embodiment of the electronic equipment 100 according to some embodiments.One
In a little embodiments, electronic equipment 100 is tablet computer equipment.In other embodiments, electronic equipment 100 is wearable electricity
Sub- equipment, the wearable electronic include being designed to wind the adjunct (for example, wrist) of user with by electronic equipment 100
The one or more band (not shown) being fixed together with user.In the embodiment depicted in fig. 1, electronic equipment 100 is
Mobile communication equipment such as smart phone.Therefore, as non-limiting example, electronic equipment 100 can realize cellular network communication
Wireless communication, Bluetooth communication (2.4GHz), and/or the WLAN (WLAN) of form communicate (2.4GHz to 5GHz).Such as figure
Shown, electronic equipment 100 may include display assembly 102, which includes being designed to text information, static map
The display layer of visual information is presented in the form of picture, and/or video information.Although not shown in the drawings, but display assembly 102 may be used also
Including touch-sensitive layer, which is designed to detect the touch input in display assembly 102, for example to control in display
The information presented on component 102.In addition, display assembly 102, which may also include to be designed to detect, is applied to display assembly
The power photosensitive layer of the size of 102 power.The size of identified power can correspond to processor circuit (not shown) for controlling
The specific input or order of display assembly 102.For example, detected different size of power can correspond to it is different or unique
Order.
In order to protect display assembly 102, electronic equipment 100 may include the first protective layer for covering display assembly 102
104.Second protective layer (not shown) of the electronic equipment 100 will be shown below and discuss.As non-limiting example,
One protective layer 104 may include one or more transparent materials, including glass, sapphire or plastics.As shown, the first protective layer
104 may include promoting to carry out the opening that user interacts with electronic equipment 100.For example, the first protective layer 104 may include the first opening
106 and second opening 108.The electronic equipment 100 may include that the image for capturing one or more images by the first opening 106 is caught
Obtain equipment (not shown).The electronic equipment 100 may also include the audio-frequency module (not shown) for generating the sound energy of audible sound form, should
Sound can leave electronic equipment 100 via the second opening 108.
In addition, electronic equipment 100 may include the band 110 for limiting the outer periphery of electronic equipment 100.In general, band 110 wraps
Include the shape similar with four side rings.However, other shapes are also possible.In addition, band 110 can limit multiple side walls and one is opened
Mouthful, at least partly to receive the first protective layer 104 and the second protective layer (not shown) and be fixed on one with the two protective layers
It rises.In some embodiments, band 110 includes metal, such as aluminium or the alloy comprising aluminium.In this regard, band 110 can be
Electronic equipment 100 provides rigidity supporting structure.In addition, band 110 may include several side walls, several when band 110 is formed by metal
Some side walls in side wall are for supporting wireless communication.For example, band 110 may include the first side wall component to form U-shaped design
112, and it is similarly formed the second sidewall component 114 of U-shaped design.The first side wall component 112 and second sidewall component 114 can be each
Radio circuit (not shown) in self-bonding electronic equipment 100 plays a role, so that the first side wall component 112 and second sidewall
At least part of the antenna of 114 each self-forming its corresponding radio circuit of component.For example, the first side wall component 112 is combinable
WLAN radio circuit plays a role, and second sidewall component 114 plays a role in combination with cellular network radio circuit.
In addition, band 110 may also include third side member 116 and the 4th side member 118, wherein third side member
116 and the 4th side member 118 by cut zone or opening separated with the first side wall component 112 and second sidewall component 114.
For example, band 110 may include the first cut zone 122 and the second cut zone 124, first cut zone and the second cut zone
It combines, third side member 116 and the first side wall component 112 and second sidewall component 114 is separated.In addition, band 110 can
Including third cut zone 126 and the 4th cut zone 128, the third cut zone and the 4th cut zone are combined, will
4th side member 118 and the first side wall component 112 and second sidewall component 114 separate.Previous segmentation region can be filled with non-
Metal material, such as molded plastics (or other non-conducting materials), to provide the coplanar table flushed for each section of band 110
Face.It is electrically isolated in the first side wall component 112 and second sidewall component 114 and third side member 116 and the 4th side member 118
In the case where, the first side wall component 112 and second sidewall component 114 can be used as a part of antenna, and third side member 116
It can be used as one or more with 118 electric coupling of third side member 116 and the 4th side member respectively with the 4th side member 118
The electrically grounded portion of a internal part (not shown).In addition, the first side wall component 112, second sidewall component 114, third sidewall portion
Each of part 116 and the 4th side member 118 can provide protective structures component, Yi Jiwei at least some internal parts
Some heat generating components (not shown) of electronic equipment 100 provide heat dissipation and heat removes function, on condition that heat generating components is with before
State at least one component thermal coupling in component.In addition, the first side wall component 112, second sidewall component 114, third sidewall portion
Part 116 and the 4th side member 118 can respectively indicate the first side wall, second sidewall, third side wall and the 4th side wall extremely
Few a part.
Electronic equipment 100 may also include one or more input equipments.For example, electronic equipment 100 includes being designed to work as
The first button 130 of input is generated when being pressed.The input produces the processor circuit being sent in electronic equipment 100 (not
Show) electric signal, to change the visual information presented on display assembly 102.As shown, 130 edge of the first button
Third side member 116 positions.However, other positions are also possible.In addition, although not shown in the drawings, but electronic equipment 100
It may include the switch for being designed to provide further user input function.
In addition, electronic equipment 100 may also include be designed to receive CA cable assembly (not shown) and with the CA cable assembly electricity
The data port 132 of coupling.Data port 132 can receive data/communication from CA cable assembly, and receive electric energy with electric to being located at
Battery component (not shown) charging in sub- equipment 100.In addition, electronic equipment 100 may include being designed to various users to hand over
Mutual additional opening.For example, electronic equipment 100 may include the opening 134 being formed in second sidewall component 114 or through-hole
Neighbouring audio-frequency module (not shown).The opening 134 allows the sound caused by the audio-frequency module that can leave electronic equipment 100.Separately
Outside, electronic equipment 100 may also include the microphone near the opening 136 being formed in second sidewall component 114 or through-hole
(not shown).Microphone, which can be positioned so that through opening 136, receives sound energy.
Fig. 2 shows the isometric back views of electronic equipment 100 shown in Fig. 1, and which further illustrate electronic equipments
100 additional features.As shown, electronic equipment 100 may include the second protective layer 144 being fixed together with band 110.The
Two protective layers 144 can be combined with band 110, to limit the shell for including inner chamber or cavity, if the inner chamber or cavity receive
Dry internal part, as non-limiting example, such as circuit board, integrated circuit and battery component.In this regard, band 110
It may include receiving the first edge region of the first protective layer 104 (as shown in Figure 1), and receive the second of the second protective layer 144
Fringe region, wherein first edge region and second edge region are located at the opposite or opposite position of band 110.In addition, the
Two protective layers 144 are referred to alternatively as bottom wall or rear wall.
In general, the second protective layer 144 may include providing one or more materials of beautiful finish, such as glass,
Sapphire or plastics.In addition, in some cases, the material composition of the second protective layer 144 is allowed from electronic equipment 100
Radio frequency (" the RF ") communication that internal radio circuit (not shown) generates penetrates the second protective layer 144.In this way, electronic equipment 100
It can be communicated by the RF not inhibited by the second protective layer 144 substantially and be carried out wireless communication with other equipment (not shown).
In addition, the second protective layer 144 may include promoting to carry out the opening that user interacts with electronic equipment 100.For example, second
Protective layer 144 may include the first opening 146 and the second opening 148.Electronic equipment 100 may include by 146 capture of the first opening
The image capture device (not shown) of one or more images.Electronic equipment 100 may also include the sudden strain of a muscle being aligned with the second opening 148
Optical module (not shown), wherein flash module is generated during the image capture event from image capture device and is opened across second
The luminous energy of mouth 148, to enhance the picture quality of the one or more images obtained by image capture device.In addition, removing first
Except button 130 (as shown in Figure 1), electronic equipment 100 may also include the second button 150, which is designed in quilt
Input is generated in the mode similar with the first button 130 when pressing.As shown, the second button 150 is along the 4th side member 118
Positioning.However, other positions are also possible.
Fig. 3 shows the partial exploded view of electronic equipment 100 shown in Fig. 1, and it illustrates each of electronic equipment 100
Kind component.For simplicity, several features of electronic equipment 100 are not shown.As shown, the first protective layer 104 can cover
Display assembly 102.In addition, the first protective layer 104 can by adhesive phase (not shown) with display assembly 102 be bonded side
Formula is fixed together.
As shown, display assembly 102 may include being designed to receive the touch-sensitive layer 202 of touch input, being designed to
The display layer 204 of visual information is presented and is designed to detection by applying a force to the first protective layer 104, touch-sensitive layer 202
The power photosensitive layer 206 of the size of the power on display layer 204 is applied in or acted on at least one of display layer 204.Separately
Outside, although not shown in the drawings, but display assembly 102 may include for consolidating touch-sensitive layer 202 and display layer 204 with bonding way
It is scheduled on the adhesive phase being fixed together with bonding way together and by display layer 204 and power photosensitive layer 206.
Touch-sensitive layer 202 is designed to receive touch input when for example user's (not shown) presses the first protective layer 104.Touching
Photosensitive layer 202 may include condenser type Touch technologies.For example, touch-sensitive layer 202 may include the capacitance material layer for keeping charge.The capacitor material
The bed of material is designed to form a part of multiple condenser type parallel-plates in position corresponding with display layer 204.With regard to this point
Speech, when user touches the first protective layer 104, user forms one or more capacitors.In addition, user causes across one or more
The voltage drop of a capacitor, this then causes the charge of capacitance material at one corresponding with the position of user's touch input or more
Change at a specific contact point.Capacitor changes and/or voltage drop can be measured by electronic equipment 100, to determine the position of touch input
It sets.In addition, touch-sensitive layer 202 may include fringe region 226, which includes connector (showing later).
In some embodiments, display layer 204 includes the liquid crystal display for relying on backlight visual information is presented
("LCD").In embodiment shown in fig. 3, display layer 204 includes being designed to illuminate having for each pixel when needed
Machine light emitting diode (" OLED ") display.When display layer 204 includes OLED technology, compared to LCD display, display layer
204 can have the form factor of reduction.In this regard, display assembly 102 can have lesser occupied area, to be
Other component such as battery component (showing later) provides more spaces.In addition, when display layer 204 includes OLED technology,
Display layer 204 can bend or be bent in the case where not damaging to display layer 204.For example, as shown in figure 3, display layer 204
Including bending section 208.Bending section 208 may include the bending section of 180 degree or the bending section of about 180 degree.Bending section 208 allows to show
Show at least part bending or bending of the layer 204 around power photosensitive layer 206, as shown in Figure 3.In addition, display layer 204 may include having
The fringe region 210 of connector (not shown), the connector is not for (showing display layer 204 with circuit board assemblies are electrically coupled to
Flexible circuit (not shown) electric coupling and mechanical coupling out), wherein flexible circuit carries out display layer 204 and circuit board assemblies
Communication.In addition, in some embodiments, display layer 204 may include active matrix organic light-emitting diode (" AMOLED ") aobvious
Show device.In addition, as shown in figure 3, the fringe region 226 of touch-sensitive layer 202 relative to the fringe region 210 of display layer 204 it is parallel or
It is at least substantially parallel, even if being also such when display layer 204 includes bending section 208.
Power photosensitive layer 206 can by determine be applied to the first protective layer 104, touch-sensitive layer 202 and/or display layer 204 power or
The size of pressure operates.In this regard, power photosensitive layer 206, which can be distinguished, is applied in the different size of of electronic equipment 100
Power.Different size of power can correspond to different user's inputs.Power photosensitive layer 206 may include multiple parallel capacitor plates arrangement side
Formula a, wherein plate in each condenser armature arrangement has charge.When applying a force to the first protective layer 104, the
One protective layer 104 reduces the distance between one or more pairs of plane-parallel capacitors, so as to cause one or more pairs of parallel-plates
The variation of capacitor between capacitor.The knots modification of the capacitor corresponds to the size for acting on the power on the first protective layer 104.Separately
Outside, as shown in enlarged view, power photosensitive layer 206 may include the connector 218 on the fringe region 220 of power photosensitive layer 206, wherein
Fringe region 220 is relative to the fringe region 210 of display layer 204 and the fringe region 226 of touch-sensitive layer 202 be vertical or at least base
It is vertical in sheet.Therefore, connector 218 (can show later) perpendicular positioning or at least basic relative to the connector of display layer 204
On be vertically oriented.
In addition, in order to support the first protective layer 104 and promote assembling of first protective layer 104 with band 110 (such as Fig. 1 institute
Show), electronic equipment 100 may include receiving the first protective layer 104 and being fixed together by adhesive phase 166 and the first protective layer
Frame 154.Therefore, frame 154 can have and the consistent size and shape of the first protective layer 104.Frame 154 can be at least partly
Ground is positioned between the first protective layer 104 and band 110.Frame 154 can be formed by polymer material such as plastics, and may be used also
Including the becket (not shown) being partially embedded into during being insert molded operation in polymer material.In this regard, frame
Frame 154 can be in the first protective layer of structural support 104 and one or more components of display assembly 102.This will below
In show.
Fig. 4 shows the partial exploded view of electronic equipment 100 shown in Fig. 1, and which further illustrate electronic equipments
100 additional component.For simplicity, several features of electronic equipment 100 are not shown.As shown, band 110 and second is protected
Sheath 144 is combinable, to provide inner chamber 152 for several internal parts.For example, electronic equipment 100 may include be designed to by
Electric current is assigned to the battery component 160 of the operating member of electronic equipment 100.The battery component 160 may include being designed to again
The rechargeable battery of electric current is received during charging.For example, electronic equipment 100 may include the sense for being electrically coupled to battery component 160
Answer receiver coil 162 (being formed by metal such as steel).(do not show when being placed on from the equipment for being located at electronic device exterior
When near alternating magnetic field out), inducing receiver coil 162 can receive induced current from alternating magnetic field.From inducing receiver
The induced current of coil 162 is by transformer, (or again to convert alternating current to be used subsequently to charge to battery component 160
Charging) direct current.In addition, the second protective layer 144 provides minimum impedance to external magnetic field or does not provide impedance, so that alternation
Magnetic field reaches inducing receiver coil 162.
In addition, battery component 160 may also include with reduced size (for example, on z-dimension of Cartesian coordinate)
Channel 164, so that component such as flexible circuit (not shown) be allowed to extend along battery component 160 and along channel 164 in battery pack
Pass through above part 160.Partially due to the space that channel 164 provides increases, other internal parts such as antenna element (does not show
It can be relocated in the inner chamber 152 of electronic equipment 100 out), to form additional space for battery component 160.In this way, electric
The volume (size) of pond component 160 can increase, and the volume increased allows battery component 160 to increase electric memory capacity, so that
Electronic equipment 100 provides longer electronic equipment 100 between the charge event of battery component 160 and uses the time.
Electronic equipment 100 may also include the circuit board assemblies 170 with multiple operating members.As shown, circuit board group
Part 170 may include first circuit board 172 and second circuit board 174, and wherein first circuit board 172 is stacked on second circuit board 174
Top.In this way, circuit board assemblies 170 can save the space on x dimension and y-dimension in inner chamber 152.In addition, the first circuit
Plate 172 and second circuit board 174 may include multiple surfaces, wherein each surface in multiple surface is designed to carrying one
Or multiple components (for example, processor circuit).The various features of circuit board assemblies 170 are discussed below.
Electronic equipment 100 may also include the sound that is designed to generate audible sound form can the first audio-frequency module 182 and the
Two audio-frequency modules 184.Each audio-frequency module in the audio-frequency module may include the opening for issuing sound energy.However, each sound
Frequency module is designed to include the acoustic cavity (being limited by its respective audio module) being isolated with the inner chamber 152 of electronic equipment 100.
In this way, when for example, by pressing and being bent the first protective layer 104 (as shown in Figure 3) to provide touch input and/or power input
To electronic equipment 100 come when changing inner chamber 152, audio-frequency module (acoustically) the not change by inner chamber 152 and inside
The influence of the related air pressure increased in chamber 152.This will be discussed further below.
The electronic equipment 100 may also include hot allocation component 190.Although not shown in the drawings, but hot allocation component 190 can wrap
Include several material layers.In some embodiments, which is different.For example, some layers are formed by first kind material,
And other layers are formed by the Second Type material for being different from first kind material.First kind material may include have it is relatively high
The material of thermal conductivity.For example, first kind material may include the known heat with about 400W/m*K (watts/meter/Kelvin)
The copper of conductance.Alternatively, the first kind may include the graphite of the known thermal conductivity with about 170W/m*K.Therefore, the first kind
Profile material is very suitable for receiving thermal energy and transmits or be assigned to another position from a position in electronic equipment 100 for thermal energy
It sets, to promote to remove the thermal energy in electronic equipment 100.Second Type material may include more robust material, such as stainless steel.
In this regard, Second Type material can have relatively low thermal conductivity.However, Second Type material can be 1) for first
Types of material, which provides, protects covering, and 2) it is that electronic equipment 100 provides structural support and/or 3) provides a mean for for example welding
Connect operation by component (not shown) and hot allocation component 190 be fixed together can working surface.Heat is discussed further below
Each layer of allocation component 190.
Hot allocation component 190 is designed to reboot or redistribute the heat generated in electronic equipment 100.Example
Such as, which may include becoming known for that (being provided by battery component 160) electric energy is converted into heat during operation
The operating member of energy, such as integrated circuit.As non-limiting example, hot allocation component 190 can by hot allocation component 190 with
Contact between circuit board assemblies 170 comes and 170 thermal coupling of circuit board assemblies.In addition, hot allocation component 190 can be with 110 heat of band
Coupling, so that can at least partly be passed to band 110 from the received thermal energy of circuit board assemblies 170 by hot allocation component 190.Cause
This, at least partly thermal conductivity lost due to using the second protective layer 144 (nonmetallic) by using hot allocation component 190 and by
It regains.In addition, hot allocation component 190 can have with the consistent size and shape of the second protective layer 144 so that hot distribution group
Part 190 covers or at least substantially covers the surface of the second protective layer 144.For example, the x dimension and y-dimension of hot allocation component 190
Can be identical, or it is substantially similar to the x dimension and y-dimension of the second protective layer 144 respectively.
Although not shown in the drawings, but electronic equipment 100 may include additional component, as non-limiting example, such as tactile
Engine and internal antenna.In addition, although not shown in the drawings, but electronic equipment 100 may include making electronic component (for example, display
Component 102, circuit board assemblies 170) it is electrically connected each other and several flexible circuits for being electrically connected with battery component 160.
Fig. 5 shows the cross-sectional view of the line A-A interception in Fig. 1 of electronic equipment 100 shown in Fig. 1.As schemed
Show, 102 layers of display assembly i.e. touch-sensitive layer 202, display layer 204 and power photosensitive layer 206 is assembled.Although not shown in the drawings, but aobvious
Show that device assembly 102 may include for touch-sensitive layer 202 and display layer 204 to be fixed together with bonding way and by display layer
204 adhesive phases being fixed together with power photosensitive layer 206 with bonding way.
The touch-sensitive layer 202 is designed to receive touch input when for example user's (not shown) presses the first protective layer 104.
Touch input can be relayed to circuit board assemblies 170 (as shown in Figure 4) from touch-sensitive layer 202 by the first flexible circuit 212, this first
Connector 222 and touch-sensitive layer 202 electric coupling and mechanical coupling of the flexible circuit by touch-sensitive layer 202.Connector 222 can be positioned
On the fringe region 226 (as shown in Figure 3) of touch-sensitive layer 202.As shown, the first flexible circuit 212 can surround display layer 204
It is bent or bends with power photosensitive layer 206, with simultaneously machinery couples with 202 electric coupling of touch-sensitive layer.
Frame 154 may include the design consideration for accommodating display assembly 102.For example, frame 154 may include be designed to
Partially receive the recess 156 or undercut area of the first flexible circuit 212 and/or display layer 204.As shown in figure 5, recess
156 have bending/bending region size and shape for receiving display layer 204 and the first flexible circuit 212.Although recess
156 have the curvature being generally corresponding to the first flexible circuit 212 and display layer 204, but for recess 156, including straight flange
Other shapes including edge are also possible.In addition, recess 156 can be formed during the molded operation of frame 154.Alternatively,
Recess 156 can be formed after molded operation for example, by cutting operation.
In addition, frame 154 passes through adhesive phase (not indicating) and 114 (band of the first protective layer 104 and second sidewall component
110 second sidewall component, as shown in Figure 1) be fixed together with bonding way.Frame 154 may include being partially embedded into frame
Support component 158 in 154.In some embodiments, which includes the ring formed by metal material, the ring
It is extended continuously according to frame 154 around display assembly 102.However, support component 158 be also possible to it is discontinuous, and because
This is optionally embedded in frame 154.As shown, support component 158 can extend along frame 154, to support display group
Part 102 and the first protective layer 104.In addition, the first flexible circuit 212 can pass through adhesive phase (not indicating) and support component 158
It is fixed together with bonding way.
Fig. 5 also shows some components of display assembly 102, some components at a position with flexible circuit coupling
It connects, and other component does not couple then.For example, touch-sensitive layer 202 passes through connector 222 and 212 electric coupling of the first flexible circuit and machine
Tool couples, and display layer 204 is coupled by connector 224 and 214 electric coupling of the second flexible circuit and machinery, wherein connector
222 and connector 224 adjacent to second sidewall component 114 (limited by U-shaped configuration, as shown in Figure 1) positioning.The company of power photosensitive layer 206
The different fringe regions that device 218 (as shown in Figure 3) is connect along power photosensitive layer 206 position (referring to Fig. 3).In addition, connector 222 and connection
Device 224 is electric with the first flexible circuit 212 and the second flexible circuit 214 respectively at the position of the recess 156 in neighbouring frame 154
It couples and machinery couples, and power photosensitive layer 206 is not then such.In addition, connector 222 can be relative to connector 224 in parallel or extremely
It is few generally parallel to position.Power photosensitive layer 206 can another individual position (for example, the connector 218 on fringe region 220,
Electric coupling and flexible circuit (not shown) is mechanically coupled at as shown in Figure 3).This will be shown below and describes.
Fig. 6 shows the cross-sectional view of the alternative embodiment of the electronic equipment 250 according to some embodiments.Electronics
Equipment 250 may include previously for any one or more features described in electronic equipment or one or more components.For example,
Electronic equipment 250 may include display assembly 252, which includes touch-sensitive layer 262, display layer 264 and power photosensitive layer
266.However, as shown in fig. 6, display layer 264 may include the substantially flat configuration in entire display layer 264, wherein flexible
Circuit 274 is bent around power photosensitive layer 266 with simultaneously machinery couples with 264 electric coupling of display layer.
Fig. 7 shows the cross-sectional view of the line B-B interception in Fig. 1 of electronic equipment 100 shown in Fig. 1.As schemed
Show, the connector 218 (also as shown in Figure 3) of power photosensitive layer 206 makes power photosensitive layer 206 and 216 electric coupling of third flexible circuit and machinery
Coupling, the third flexible circuit 216 and circuit board assemblies 170 (as shown in Figure 4) electric coupling, so that power photosensitive layer 206 and circuit board
Component 170 is communicated.In addition, third flexible circuit 216 can by adhesive phase (not indicating) with support component 158 be bonded
Mode is fixed together.
As shown in fig. 7, only power photosensitive layer 206 include with flexible circuit electrically and mechanically.In other words, compared to
The connector 222 (as shown in Figure 5) of touch-sensitive layer 202 and the connector 224 (as shown in Figure 5) of display layer 204, in power photosensitive layer 206
The different location that connector 218 electrically and mechanically is located at electronic equipment 100 is provided between third flexible circuit 216
Place.In addition, the position based on respective edges region, connector 222 of the connector 218 of power photosensitive layer 206 relative to touch-sensitive layer 202
It vertically or is at least substantially vertically positioned with the connector 224 of display layer 204.
In addition, connector 218 is adjacent to third side member 116 (also as shown in Figure 1), 116 part of third side member
Ground is limited by the side wall of a part that is vertical or being approximately perpendicular to second sidewall component 114 (as shown in Figure 1 and Figure 5).Therefore, frame
Frame 154 can not need recess 156 (as shown in Figure 5) to accommodate display layer 204 and the first flexible circuit 212 (as shown in Figure 5).Cause
This, frame 154 may include asymmetric frame.In addition, the additional materials of frame 154 allow additional structural rigidity to support display
Device assembly 102 and the first protective layer 104.
Fig. 8 shows the cross-sectional view of the alternative embodiment of the electronic equipment 300 according to some embodiments.Electronics
Equipment 300 may include previously for any one or more features described in electronic equipment are a or multiple components.For example, electric
Sub- equipment 300 may include the first protective layer 304 of the first protective layer 304 being fixed together with display assembly 302 and carrying
Frame 354.However, the first protective layer 304 may include in a manner of circumferential at least partly from the first protective layer 304 radially outward
The extension 306 of extension.In order to accommodate extension 306, frame 354 may include the recess 366 for receiving extension 306.Prolong
Extending portion 306 is that the first protective layer 304 provides additional structure outline, and additional surface area can also be provided, by the first protection
Layer 304 is combined together with frame 354 with bonding way.For example, as shown in figure 8, the first protective layer 304 passes through adhesive phase
362 are fixed together with frame 354 with bonding way, which extends through partly by being located at frame 354 and first
The region that boundary between protective layer 304 (including extension 306) limits.In addition, frame 354 and the first protective layer 304 (including
Extension 306) the distance between or gap power the adhesive phase 362 can be made to extend through juncture area through capillary action.Cause
This, frame 354 is fixed together by multiple (vertical) surfaces with the first protective layer 304 with bonding way, more to be formed in
A side upward against or offset and be applied to the relatively strong bonding of the power of electronic equipment 300.
Fig. 9 shows the plan view of the embodiment of the frame 454 according to some embodiments.As shown, frame
Frame 454 may include support component 458, which may include the becket being molded onto frame 454.Frame 454 is implementable
It into one or more electronic equipments as described herein, and may include previously for any features described in frame.In order to
Improve the bonding force between adhesive (not shown) and the surface 462 of frame 454, surface 462 may include certain modifications.For example,
As shown in enlarged view, surface 462 may include surface tension or the veining area of surface energy for being designed to increase surface 462
Domain 464.Textured ones 464 can enhance between frame 454 and transparent cover (for example, first protective layer 104 shown in fig. 5)
The bonding carried out by adhesive (for example, adhesive phase 166 shown in fig. 5).
Figure 10 shows the cross-sectional view of the interception of A-A along the line of the frame 454 shown in Fig. 9.As shown, veining area
Domain 464 may include forming multiple pits or dent into frame 454 along surface 462.Textured ones 464 are aforementioned adhesion agent
Additional surface area is provided.Several different techniques can be used to form textured ones 464.For example, for molded frame 454
Molding tool (not shown) may include prominent features portion, which has corresponding with the shape of textured ones 464
Shape.Alternatively, frame 454 can be formed with the molding tool for not including prominent features portion, and in the molding for forming frame 454
After operation, surface 462 can be etched by such as laser to form textured ones 464.In addition, though textured ones 464
Several pits or dent formed into frame 454 are limited, but several shapes in addition to pit or dent are also possible.Example
Such as, textured ones 464 may include several linear and/or non-linear impression.
Figure 11 shows the cross-sectional view of the alternative embodiment of the frame 554 according to some embodiments, shows
The surface 562 of frame 554 has prominent features portion 564.Frame 554 may include previously for any feature described in frame
Portion.In this regard, surface 562 can be used for transparent to receive by adhesive (for example, adhesive phase 166 shown in fig. 5)
Covering (for example, first protective layer 104 shown in fig. 5).As shown, prominent features portion 564 can extend from surface 562.Frame
Frame 554, and specifically prominent features portion 564, can be by including that the molding tool (not shown) of insert is formed, the insert quilt
Extraction section (being used to form frame 554) moulding material is designed to, so that prominent features portion 564 extends from surface 562.
Prominent features portion 564 provides additional surface area for aforementioned adhesion agent.
Figure 12 shows the cross-sectional view of the embodiment of electronic equipment 700, and it illustrates electronic equipments 700 to have frame
It 754 and is partially embedded into frame 754 and extends substantially into the support component 758 in frame 754.Electronic equipment 700 can wrap
It includes herein for any features described in electronic equipment.In addition, being similar to previous embodiment, support component 758 can be wrapped
The ring formed by metal material is included, which surrounds the display assembly 702 of electronic equipment 700 and extend according to frame 754.Such as figure
Shown, support component 758 can extend beyond display assembly 702 on z-dimension, and also be more than that protection covering 704 is (similar
In the first protective layer 104 shown in FIG. 1).
In order to further extend support component 758 on z-dimension, frame 754 can be widened on y-dimension.In addition, electronics is set
The size of standby 700 side member 714 (being similar to second sidewall component 114 shown in FIG. 1) can reduce on y-dimension, to support
Disappear frame 754 increase size.In addition, the changeable one or more materials for being used to form frame 754, to accommodate support member
Part 758.For example, frame 754 may include the nylon material mixed with glass filled material, which enhances frame
754 bulk strength and rigidity.However, in some embodiments, frame 754 is formed by ceramics.In this regard, side wall
Component 714 and remaining any side member can also be formed by ceramics.
When support component 758 extends in this way, it is considered as other factors.For example, in some cases, sidewall portion
Part 714 forms a part of antenna module (not shown), which includes being configured to electronic equipment 700 to provide wirelessly
The antenna element of communication.When formed of metal, support component 758 can lead to some interference to antenna element.This may include
Plane-parallel capacitor is formed between antenna module (including side member 714) and support component 758.Therefore, it is considered as supporting
Size, shape, material and the position of element 758, to prevent undesirable interference.It should be pointed out that supplementary technology can be used
To optimize the size of support component 758 and the degree of approach with side member 714.This may include such as reduction support component 758
Z-dimension, and/or in support component 758 provide opening or discontinuous section.
Electronic equipment 700 may include the table for receiving protection covering 704 and being combined with the protection covering with bonding way
Face 762.Surface 762 may include providing the size 766 on general planar surface.However, in some embodiments, 762 quilt of surface
Modification, to enhance and protect the bonding of covering 704.In addition, frame 754 may include the recess 756 to be formed in frame 754 or
Undercutting, the recess or undercutting allow frame 754 receive display assembly 702 comprising the flexible circuit of display assembly 702 and
Flexible layer.The size of recess 756 can the size based on the increase of frame 754 and be adjusted (for example, increase).However, passing through increasing
The size (on y-dimension) of big recess 756, can remove the additional materials of frame 754 at the position below surface 762.It should
, it is noted that supplementary technology can be used optimizing using the size 766 on surface 762 size of recess 756.
In addition, electronic equipment 700 may include by frame 754 in order to make frame 754 be fixed together with side member 714
It is bonded to the adhesive 768 of side member 714.As shown, the amount of used adhesive 768 generally allows for side member
714, frame 754 and protection covering 704 are to form substantially continuous and flat configuration, such as side of aforementioned components aligned with each other
Shown in edge.However, used bonding can be reduced in order to provide supplementary protection by 714 pairs of protection coverings 704 of side member
The amount of agent 768, to make to protect covering 704 lower relative to side member 714 on z-dimension.In this way, side member 714
Can additionally covering protection covering 704 a part, and provide supplementary protection to protection covering 704, to avoid its by
With the power of force component on y-dimension.It should be pointed out that supplementary technology can be used to optimize used adhesive 768
Amount and adjustment frame 754, side member 714 and the size for protecting covering 704, to keep substantially continuous and flat structure
Type.
Figure 13 shows the cross-sectional view of the embodiment of the electronic equipment 800 according to some embodiments, shows
Electronic equipment 800 has protection covering 804 and is extended with to protect covering 804 to provide the sidewall portion of additional support
Part 814.The electronic equipment 800 may include herein for any features described in electronic equipment.Compared to previous embodiment party
Case, side member 814 include protrusion or raised outer periphery 824 on z-dimension.Therefore, the material of side member 814 is formed
(on y-dimension) increases and provides additional support for protection covering 804.In addition, side member 814 may include relative to guarantor
Protect the parallel or at least substantially parallel edge 826 in the surface 806 of covering 804.Therefore, side member 814 can also be to protection
Covering 804 and the frame 854 between protection covering 804 and side member 814 provide additional support.
Figure 14 shows the cross-sectional view of the embodiment of the electronic equipment 900 according to some embodiments, shows
Electronic equipment 900 has various structural reinforcements.Electronic equipment 900 may include herein for any spy described in electronic equipment
Sign portion.Similar to previous embodiment, electronic equipment 900 may include display assembly 902, which includes being set
It counts into and receives the touch-sensitive layer 912 of touch input, be designed to that the display layer 914 of visual information is presented and be designed to detect
At least one in protection covering 904 by applying a force to touch-sensitive layer 912, display layer 204 and covering display assembly 902
Person and the power photosensitive layer 916 for being applied in or acting on the size of power on display layer 914.The display assembly 902 may also include
Plate 918 fixed to power photosensitive layer 916.As shown, plate 918 is located at 916 lower section of power photosensitive layer.However, some embodiments (not
Show) in, plate 918 is positioned between display layer 914 and power photosensitive layer 916.
Plate 918 may include rigid material, such as metal or plastics.Plate 918 can provide structural support for display assembly 902
And hardness.Therefore, when electronic equipment 900 is fallen, plate 918 can make display assembly 902 from because another in electronic equipment 900
Impact caused by component (not shown).In addition, plate 918 can prevent the layer of display assembly 902 to be bent, this can then prevent layer gram
Clothes are bonded and are removed each other.
In some embodiments, electronic equipment includes the flexible circuit for being coupled to touch input layer.In order to limit flexibility
The movement of circuit applies adhesive to and (is embedded in the frame) support component, flexible circuit and support component are adhered to
Together.It is shunk however, adhesive is known in solidification.The blockage effect of adhesive provides pulling force to flexible circuit, this after
And cause other component by undesirable pulling force, so that the position of some components can be changed or even damage some components.
In general, the shrinkage of adhesive (from uncured state to solid state) depends on used adhesive
Amount.In order to reduce because of pulling force caused by shrinking, electronic equipment can be modified to limit the amount of required adhesive.For example, Figure 14 shows
Electronic equipment 900 has plate 928 out, which is positioned in flexible circuit 922 and (is similar to the first flexible circuit shown in fig. 5
212) between the support component 958 that is embedded in frame 954.Plate 928 can be positioned in support component 958 and be arranged on branch
It supports between the adhesive 930 on element 958.Plate 928 may include the metal for being used as to be fixed to the gasket of flexible circuit 922
Plate.Plate 928 can occupy the script between flexible circuit 922 and support component 958 will be by 930 the space occupied of adhesive.In this way,
The amount of adhesive 930 used in can reducing, and therefore can also reduce the blockage effect of adhesive 930.In addition, plate 928
It is designed and is positioned to absorb some power that will affect display assembly 902 originally.Therefore, when display assembly 902 is opened simultaneously
And when visual information is just presented, visual problem can be restricted or prevented in plate 928, such as show artifact.
Similar to previous embodiment, display layer 914 extends beyond power photosensitive layer 916 and including bending section.However, such as
Shown in Figure 14, display layer 914 may include the first material 932 for covering the surface of display layer 914.First material 932 may include filling
Closure material, the Embedding Material protect display layer 914 and specifically protect the bending region of display layer 914 from external force.In order to
First material is provided, needle (not shown) can be inserted into the position in the bending region of display layer 914.The needle is set from electronics
Dispersible materials when standby 900 extraction.
Display layer 914 may also include second material 934 on the surface of covering display layer 914, which includes several
Metal trace (is not labeled).Second material 934 is designed to providing compressing force into metal trace and prevents tensioning masterpiece
For metal trace, to prevent metal trace impaired.In addition, the second material 934 can provide hardness and knot for display layer 914
Structure support.
Figure 15 shows the plan view of the embodiment of the electronic equipment 1000 according to some embodiments, shows
The plate 1018 being positioned in the shell 1010 of electronic equipment 1000.For illustrative purposes, it eliminates including transparent covering
Several features of part and display assembly.Electronic equipment 1000, shell 1010 and plate 1018 may include herein respectively for electricity
Any features described in sub- equipment, shell and plate.Plate 1018 is designed to make together with display assembly (being presently shown)
With.In this regard, plate 1018 may include previously for any features described in plate 918 (showing in Figure 14).
Plate 1018 may include the recess 1020 for being designed to receive a part of display assembly.For example, recess 1020 can
Receive display assembly (similar to display assembly 102 shown in fig. 5) bending region and/or with display assembly phase
Associated flexible circuit (all first flexible circuits 212 as shown in FIG. 5).In other words, associated with display assembly
Bending region can around plate 1018 along plate 1018 planar edge 1022 be bent and avoid contact with shell 1010.Therefore, recessed
Mouth 1020 is referred to alternatively as the cut-away area of plate 1018.
In addition, plate 1018 may include extension, such as the first extension 1024 and the second extension 1026.As shown,
First extension 1024 and the second extension 1026 extend beyond the planar edge 1028 of plate 1018.Display assembly (not shown)
It may include that bending region and flexible circuit, the bending region and flexible circuit surround planar edge 1028 in the manner previously described
It is bent and can be positioned between the first extension 1024 and the second extension 1026.First extension 1024 and second extends
Expansion board 1018 on y-dimension of portion 1026.In this way, being applied to the outer with force component on y-dimension of electronic equipment 1000
Power can be such that plate 1018 (and the display assembly carried by plate 1018) shifts on y-dimension relative to shell 1010.However, the
One extension 1024 and the second extension 1026 are designed in the bending region of display assembly and/or flexible circuit engagement shell
The side member 1014 (being similar to second sidewall component 114 shown in FIG. 1) of shell 1010 is engaged before body 1010.Therefore, may be used
It prevents display assembly impaired and/or electrical connection disconnects.
Figure 16 shows the partial side view of electronic equipment 1000 shown in figure 15, which further illustrate plate 1018 with
The first extension 1024 that display assembly 1002 is fixed together.As shown, display assembly 1002 can surround plate 1018
Bending.In addition, plate 1018 can extend laterally beyond display assembly 1002 on y-dimension and be fixed on protection covering 1004
The frame 1054 of 1002 top of display assembly.Therefore, the first extension 1024 and the second extension 1026 (being shown in Figure 15)
It can combine, to provide the bolster for resisting the power for being applied to display assembly 1002 for display assembly 1002, which makes
The side member 1014 of display assembly towards shell 1010 (indicating in Figure 15) is mobile.Frame 1054, protection covering 1004
It may include previously respectively for any feature described in frame, protection covering and display assembly with display assembly 1002
Portion.
Figure 17 shows the cross-sectional views according to the embodiment of the electronic equipments 1100 of some embodiments, show
The support construction 1120 that electronic equipment 1100 has shell 1110 and is integrally formed with shell 1110.For the sake of simplicity,
The some features and component of electronic equipment 1100 are not shown.However, electronic equipment 1100 and shell 1110 may include dividing herein
Safety pin any features described in electronic equipment and shell.There is the previous of the frame fixed to shell different from electronic equipment
Embodiment, support construction 1120 can be a part of shell 1110.In some embodiments, shell 1110 is by metal shape
At all for example aluminium of the metal or the alloy comprising aluminium.In the embodiment shown in Figure 17, shell 1110 is formed by ceramics.Pottery
Ceramic material can provide firm shell, while also minimize RF interference to the antenna module (not shown) of electronic equipment 1100
It influences.
Support construction 1120 can receive and support protection covering 1104 (similar to the first protective layer shown in Fig. 1
104).In addition, support construction 1120 may include recess 1156, which is designed to receive the buckled zone of display assembly 1102
Domain and/or the bending region for the flexible circuit 1112 being used together with display assembly 1102.The recess 1156 can be around display
Device assembly 1102 extends circumferentially over upon.Therefore, which can be integrated into shell 1110.This can reduce associated cost simultaneously
Reduction uses associated manufacturing time with frame.
Figure 18 shows the plan view of the embodiment of the protection covering 1204 according to some embodiments.Protection
Covering 1204 may include herein for any features described in protection covering and/or protective layer.Therefore, covering is protected
1204 may include transparent material, glass, sapphire, plastics etc..In this regard, protection covering 1204 is designed to
Cover display assembly (not shown).Protection covering 1204 may include body portion and partly be limited by dotted line 1206
Recess (is illustrated below).
Figure 19 shows the cross-sectional view of the interception of B-B along the line of the protection covering 1204 shown in Figure 18, further
Show the recess 1208 being formed in protection covering 1204.The recess 1208 can extend to characterizing portion to form protection
Cavity in the material of covering 1204.In this way, recess can receive or at least partly receive display assembly.This will below
Further show.In addition, protection covering 1204 may include the body portion 1212 extended around recess 1208.
Figure 20 shows the cross-sectional view of the embodiment of the electronic equipment 1200 according to some embodiments, shows
Protection covering 1204 (shown in Figure 18 and Figure 19) is fixed together with shell 1210.For the sake of simplicity, electronics is not shown
The some features and component of equipment 1200.However, electronic equipment 1200 may include herein for any described in electronic equipment
Features.As shown, electronic equipment 1200 may include being fixed to protection covering 1204 and being positioned in recess 1208
In display assembly 1202.Display assembly 1202 can be partly cooperated in recess 1208, or can be fully mated into recessed
In mouth 1208, this is specifically dependent upon required configuration.By the way that display assembly 1202 is cooperated to the recessed of protection covering 1204
In mouth 1208, protection covering 1204 can be enhanced by covering multiple dimensions of display assembly 1202 as display assembly
1202 protections provided.Therefore, before display assembly 1202 is by any impact, it is applied to rushing for electronic equipment 1200
Hitting power can be absorbed by protection covering 1204 or at least partly absorb.In addition, can be limited by modification protection covering 1204
Design modification to other component, to reduce manufacture and engineering design cost.In addition, can not need recess (all for frame 1254
Recess 156 as shown in Figure 5), and therefore additional support can be provided to protection covering 1204.
Figure 21 shows the cross-sectional view of the embodiment of the electronic equipment 1300 according to some embodiments, shows
Protection covering 1304 extends above frame 1354 and adjacent sidewall component 1314 positions.Electronic equipment 1300, side wall
Component 1314 and frame 1354 may include herein respectively for any features described in electronic equipment, side member and frame.
As shown, size can be modified and be reduced to frame 1354, to allow that covering 1304 is protected to extend above frame 1354
And with 1314 border of side member.This allows the bending part protected covering 1204 and specifically protect covering 1304
1306 receive the direct protections from side member 1314, this with side member 1314 and protection covering 1304 between extend
Frame 1354 it is opposite (as shown in other embodiments).In addition, protection covering 1304, which can be limited on y-dimension, to be had
The protection covering of the extension of relatively large length.This allows to modify to the display assembly 1302 of electronic equipment 1300
Equally to increase size on y-dimension.Alternatively or in combination, the extension of covering 1304 and display assembly 1302 is protected
Length, which can promote, realizes the symmetrical display assembly of appearance, this may also allow for partly covering the symmetrical display assembly of appearance
Display frames (not shown) modify.By providing symmetrical display assembly, the overall appearance of electronic equipment 1300
It can enhance.
Figure 22 shows the exploded view of the battery component 160 according to some embodiments.As shown, battery component
160 may include the first cladding element 1402 and the second cladding element 1404, wherein the first cladding element 1402 and the second covering member
Part 1404 is sealed, to form the shell for the internal part for blocking battery component 160.By the first cladding element 1402 and
The shell that two cladding elements 1404 are formed can limit the cavity for receiving and encapsulating internal part.For example, battery component 160 is also
It may include first electrode 1406 and the second electrode separated with first electrode 1406 1408 (so that first electrode 1406 and the second electricity
Each of pole 1408 includes monomer electrode), wherein spacer body 1410 is between first electrode 1406 and second electrode 1408
Certain physical isolation is provided, while also charge being allowed to flow between first electrode 1406 and second electrode 1408.As battery is led
In domain it is commonly known as, one of first electrode 1406 and second electrode 1408 include anode, and (first electrode 1406
In second electrode 1408) remaining electrode includes cathode.In addition, electrode can be used for will be chemical as commonly known
It can be converted into electric power used in electronic device (all electronic equipments 100 as shown in FIG. 1).In addition, battery component 160
And battery component as described herein may include being designed to after battery component 160 receives electric energy from external source again
The rechargeable battery assembly used.Battery component 160 may also include circuit board 1412, which includes being designed to monitor
Flow in and out one or more circuits of the electric current of battery component 160.In addition, the portion of circuit board 1412 and circuit board 1412
Part can be electrically connected with circuit board assemblies 170 (showing in Fig. 4).
In addition, the first cladding element 1402 may be formed on z-dimension provided for component (not shown) such as flexible circuit it is attached
Add the channel 164 in space.In other words, the size (such as height) of battery component 160 subtracts in position corresponding with channel 164
It is small, while the circuit board 1412 still for 164 lower section of channel to be positioned in provides sufficient space.In this way, component can be across channel
164 positioning, to allow to rearrange the other component in electronic equipment 100 (showing in Fig. 1), for the wound of battery component 160
Build additional space.Therefore, battery component 160 may include large scale corresponding with larger charge capacity.Although the first cladding element
1402 and second cladding element 1404 can provide the shielding case including electrical shielding cover, but aforementioned cladding element allows some be electrically connected
It connects.For example, the first cladding element 1402 may include the opening 1414 close to circuit board 1412.In addition, although not shown in the drawings, but
First cladding element 1402 and/or the second cladding element 1404 may include additional opening, to allow one or more additional components
With 160 electric coupling of battery component.Although conventional batteries electrode includes the shape of generally straight line, battery component 160 and sheet
Electrode in the text battery component may include different shape.For example, as shown in figure 22, first electrode 1406 and second electrode
1408 include " L-shape configuration ", and wherein at least one surface includes six different sides.This will be discussed further below.
Figure 23 is the plan view of the first electrode 1406 shown in Figure 22.As shown, first electrode 1406 includes L shape
Configuration.In this regard, first electrode 1406 may include first part 1420 or the first rectangle part and from first part
1420 second parts 1422 or the second rectangle part extended.Dotted line indicate to be located at first part 1420 and second part 1422 it
Between juncture area.In some embodiment (not shown), the size of first part 1420 it is identical as second part 1422 or
It is substantially similar.However, the size of first part 1420 is greater than the ruler of second part 1422 in the embodiment shown in Figure 23
It is very little.
First electrode 1406 is also characterized by including the first wall 1434 with first size 1444 and has the second ruler
Very little 1446 the second wall 1436.As shown, the first wall 1434 is parallel or at least substantially parallel relative to the second wall 1436, and
And second size 1446 be less than first size 1444.In addition, first electrode 1406 may include having the third of third size 1448
Wall 1438 (separating the first wall 1434 and the second wall 1436) and the 4th wall 1440 with the 4th size 1450.As shown,
Third wall 1438 is parallel or at least substantially parallel relative to the 4th wall 1440, and the 4th size 1450 is less than third size
1448.In addition, first electrode 1406 may include fiveth wall 1442 parallel or at least substantially parallel relative to third wall 1438.
5th wall 1442 may include the 5th size 1452 less than third size 1448.As shown in figure 23, the 4th size 1450 and
Five sizes 1452 can be combined to be equal to third size 1448.In addition, third wall 1438 is relative to the first wall 1434 and the second wall
1436 is vertical or at least substantially vertical.In some embodiment (not shown), first size 1444 and the second size 1446
It is identical.In addition, first size 1444 is less than the second size 1446 in some embodiment (not shown).Additionally, it should point out
, second electrode 1408 (showing in Figure 22) and any one of it is included in battery component 160 (showing in Figure 22)
Or multiple additional electrodes and one or more spacer body may include identical as the size and shape of first electrode 1406 or substantially
Similar size and shape.
Figure 24 shows the electrode 1506 according to used in being suitable in battery component of some embodiments and selects else
The plan view of embodiment.As shown, electrode 1506 may include " C-shaped configuration ".In this regard, electrode 1506 may include
First part 1520 or the first rectangle part.Electrode 1506 may also include second part 1522 or the second rectangle part, Yi Ji
Three parts 1524 or third rectangle part, both the second part and the Part III relative to first part 1520 vertically or
Substantially perpendicularly extend.Dotted line indicate positioned at first part 1520 and second part 1522 between and first part 1520 and
Juncture area between Part III 1524.In some embodiment (not shown), the size of first part 1520 and second
Part 1522 and Part III 1524 are identical or substantially similar.However, in the embodiment shown in Figure 24, first part
1520 size is greater than the size of second part 1522 and also greater than the size of Part III 1524.In addition, as shown in figure 24,
The size of second part 1522 is identical or substantially similar as the size of Part III 1524.However, some embodiments (not
Show) in, the size of second part 1522 can be different from the size of Part III 1524.For example, the size of second part 1522
The size of Part III 1524 can be more than or less than.
Electrode 1506 may also be characterized as including having the first wall 1534 of first size 1544 and with the second size 1546
The second wall 1536.As shown, the first wall 1534 is parallel or at least substantially parallel relative to the second wall 1536, and second
Size 1546 includes length identical as the length of first size 1544 or at least substantially similar.In addition, electrode 1506 can wrap
It includes the third wall 1538 (separating the first wall 1534 and the second wall 1536) with third size 1548, there is the 4th size 1550
The 4th wall 1540 and the 5th wall 1542 with the 5th size 1552.As shown, third wall 1538 is relative to the 4th wall
1540 is parallel with the 5th wall 1542 or at least substantially parallel.In addition, each in the 4th size 1550 and the 5th size 1552
Person is less than third size 1548.In addition, third wall 1538 is vertical or at least basic relative to the first wall 1534 and the second wall 1536
It is upper vertical.As shown in figure 24, first size 1544 is identical as the second size 1546.However, first size 1544 may differ from
Two sizes 1546, such as less than or greater than the second size.In addition, electrode 1506 may include relative to third wall 1538 in parallel or extremely
Few the 6th substantially parallel wall 1562.6th wall 1562 may include the 6th size 1572 less than third size 1548.Such as figure
Shown in 24, the 4th size 1550, the 5th size 1552 and the 6th size 1572 can be combined to be equal to third size 1548.In addition,
It should be pointed out that being included in any one or more of battery component (not shown) additional electrode and one or more points
Spacer may include the size and shape identical or substantially similar with the size and shape of electrode 1506.
Figure 25 shows the electrode 1606 according to used in being suitable in battery component of some embodiments and selects else
The plan view of embodiment.As shown, electrode 1606 may include " I shape configuration ".In this regard, electrode 1606 may include
First part 1620 or the first rectangle part, second part 1622 or the second rectangle part and Part III 1624 or third
Rectangle part.Dotted line indicates between first part 1620 and second part 1622 and first part 1620 and Part III
Juncture area between 1624.As shown, both second part 1622 and Part III 1624 perpendicular to or substantially vertically
Extend in first part 1620.Similar to shape similar with alphabetical " I ", first part 1620 can be relative to second part 1622
It is placed in the middle or substantially placed in the middle with Part III 1624.As shown, the size of first part 1620 and second part 1622 and the
Three parts 1624 are identical or substantially similar.However, the size of first part 1620 is not in some embodiment (not shown)
It is same as the size of second part 1622 and also different from the size of Part III 1624.In addition, as shown in figure 25, second part
1622 size is identical or substantially similar as the size of Part III 1624.However, in some embodiment (not shown),
The size of second part 1622 can be different from the size of Part III 1624.For example, the size of second part 1622 can be greater than or
Less than the size of Part III 1624.In addition, in some embodiments, removing Part III 1624 from electrode 1606 and making
Electrode 1606 includes " T shape configuration ".
Electrode 1606 may also be characterized as including having the first wall 1634 of first size 1644 and with the second size 1646
The second wall 1636.As shown, the first wall 1634 is parallel or at least substantially parallel relative to the second wall 1636, and second
Size 1646 includes length identical as the length of first size 1644 or at least substantially similar.In addition, electrode 1606 can wrap
Include the third wall 1638 with third size 1648.Third wall 1638 can it is vertical relative to the first wall 1634 and the second wall 1636 or
It is at least substantially vertical, and third size 1648 includes identical as the length of first size 1644 and the second size 1646 or extremely
Few substantially similar length.
Electrode 1606 may also be characterized as having first part 1620, the first part and extend through first part 1620
First longitudinal direction axis 1652 is aligned and is arranged around the first longitudinal direction axisymmetrical.In entire specific embodiment and
Term used in claims " longitudinal direction " refers to the direction of the main shaft extension along component, wherein " master " size corresponds to electricity
Maximum (longest) size of a part of pole.Electrode 1606 may also include second part 1622 and Part III 1624, this second
Part and the Part III be aligned respectively with second longitudinal direction axis 1654 and third longitudinal axis 1656 and respectively surround this second
Longitudinal axis and the third longitudinal axis are symmetrical arranged.Second longitudinal direction axis 1654 can be parallel relative to third longitudinal axis 1656
Ground alignment.In addition, first longitudinal direction axis 1652 can be vertical relative to second longitudinal direction axis 1654 and third longitudinal axis 1656.Separately
Outside, it is noted that be included in any one or more of battery component (not shown) additional electrode and one or more
Spacer body may include the size and shape identical or substantially similar with the size and shape of electrode 1606.
Figure 26 shows the electrode 1706 according to used in being suitable in battery component of some embodiments and selects else
The plan view of embodiment.As shown, electrode 1706 may include " L-shape configuration ", first electrode 1406 is similar to (in Figure 23
Show) L-shape configuration.In this regard, electrode 1706 may include first part 1720 or the first rectangle part and with hang down
The second part 1722 or the second rectangle part that histogram formula extends from first part 1720.Dotted line indicates to be located at first part 1720
With the juncture area between second part 1722.In some embodiment (not shown), the size of first part 1720 and the
Two parts 1722 are identical or substantially similar.However, the size of first part 1720 is greater than in the embodiment shown in Figure 26
The size of second part 1722.In addition, electrode 1706 may also include the opening 1730 for limiting gap or space in electrode 1706.
Opening 1730 is allowed including electrode 1706 and with the battery pack with other similarly sized and shape the electrodes of electrode 1706
Component (not shown) is positioned in and is open at 1730 corresponding positions by part (not shown).In this way, when electrode opening and
Spacer body opening it is aligned with each other with formed across battery component electrode layer and separator layer continuous through-hole when, battery component
The component can be accommodated by opening 1730.This will be discussed further below.In addition, though opening 1730 is shown at
In electrode 1706, but the embodiment of other embodiments such as electrode shown in Figure 23-25 may also comprise opening.
Shown in Figure 23-26 and the various embodiments of the electrode of description can include cross cutting by cutting operation come shape
At.Die cut operation may include that electrode slice is made to undergo cutting operation using the mold with predetermined size and shape.Mold can wrap
Include size and shape corresponding with the size and shape of the electrode shown in Figure 23-26.It should be pointed out that spacer body can be with
Similar mode is die cut.Therefore, the shape of electrode as described herein may include the shape in addition to rectangular shape.With regard to this point
Speech, battery component may include the size and shape according to electrode and spacer body so that battery component can be in various sizes and shape,
To increase battery component size and/or to accommodate other internal parts in electronic equipment.
Figure 27-29 shows the various embodiment party for being suitable for the battery component being used together with electronic equipment as described herein
Case.For illustrative purposes, some components of the electronic equipment shown in Figure 27-29 are eliminated.It is used to form for this paper institute
The die cut operation (described above) for stating the electrode that battery component uses can be cut into various sizes and shape.With regard to this point
Speech, battery component can be in different size and shape.In addition, the electronic equipment shown in Figure 27-29 and battery component can wrap
It includes previously for any one or more components and one or more features portion described in electronic equipment.In addition, though showing
The specific amount of embodiment of battery component, but other several configurations are also possible.
Figure 27 shows the reality of the battery component 1860 being located in electronic equipment 1800 according to some embodiments
Scheme is applied, wherein the battery component 1860 has the shape for the internal part 1870 for accommodating electronic equipment 1800.As shown, should
Battery component 1860 may include C-shaped configuration, to accommodate the internal part 1870 that may include circuit board assemblies (previously described).Term
" receiving " can refer to the size and shape of modification component (such as battery component 1860), to avoid or reduce modification electronic equipment
Size, the shape and/or position of another component (such as internal part 1870) in 1800.For example, illustrated and described herein
Battery component can will be accommodated another or multiple components by traditional line type battery the space occupied originally by providing.Separately
Outside, any one or more electrodes of battery component 1860 and one or more spacer bodies further include C-shaped configuration, the C-shaped configuration
With the shape similar with the shape of electrode 1506 (being shown in Figure 24).Therefore, battery component 1860 may include by one or more
The shell including C-shaped configuration that a cladding element limits.
Figure 28 show according to some embodiments be located at electronic equipment 1900 in battery component 1960 it is another
Embodiment is selected, which has the shape for the multiple internal parts for accommodating electronic equipment 1900.As shown, electric
Pond component 1960 may include " I shape " configuration to accommodate the first internal part 1970 and the second internal part 1972.Inside first
Each of component 1970 and the second internal part 1972 can all indicate component, such as circuit board, audio-frequency module, flexible circuit
Or similar component.The first internal part 1970 is also shown in Figure 28 and the second internal part 1972 is positioned in battery component 1960
Extension between different spaces in.In addition, any one or more electrodes of battery component 1960 and one or more points
Spacer further includes I shape configuration, which has the shape similar with the shape of electrode 1606 (as shown in figure 25).Therefore, electric
Pond component 1960 may include the shell including I shape configuration limited by one or more cladding elements.
Figure 29 show according to some embodiments be located at electronic equipment 2000 in battery component 2060 it is another
Embodiment is selected, wherein the battery component 2060 has the opening 2062 for the internal part 2072 for accommodating electronic equipment 2000.Such as
Shown in figure, opening 2062 may include size and shape, so that the periphery of opening 2062 can be used to carry out localization of internal component 2072.Though
So opening 2062 includes the opening of automatic adjustment, but opening 2062 can be in other shapes, as non-limiting example, including three
Side shape and quadrilateral shape.In addition, as shown in figure 29, battery component 2060 may include that (but other aforementioned shapes are also L-shape configuration
It is possible) to accommodate internal part 2070 (it may include circuit board assemblies), and may also include opening 2062.Battery component
2060 L-shape configuration permission internal part 2070 is at least partially positioned at the edge such as first edge of battery component 2060
Between 2064 and second edge 2066.In addition, the battery component including L-shape configuration and opening (being similar to opening 2062) may include
Electrode and spacer body, the electrode and spacer body it is aligned with each other and have it is similar with the shape of electrode 1706 (being shown in Figure 26)
Shape.In other words, any one or more electrodes of battery component 2060 and one or more spacer bodies further include L shape structure
Type, the L-shape configuration have the opening similar with the opening of electrode 1706 (showing in Figure 26).Therefore, battery component 2060 can wrap
Include the shell including L-shape configuration and opening limited by one or more cladding elements.
In addition to various sizes and shape (except traditional line shape), battery component as described herein may include attached
Add features.Figure 30 show according to some embodiments be located at electronic equipment 2100 in battery component 2160 it is another
Embodiment is selected, wherein the battery component 2160 is positioned in the first internal part 2172 (shown in dotted line) of electronic equipment 2100
In (electronic equipment 2100) shell 2102 of top.Partially due to attached as provided by display layer 204 (being shown in FIG. 5)
Add space, battery component 2160 can cover or on cover some components, such as the first internal part 2172.In addition, in order to by circuit
Board group part 2170 is contained in shell 2102, and battery component 2160 may include L-shape configuration.In this way, battery component 2160 provides appearance
The position of a part of nano circuit board group part 2170 (also including L-shape configuration, as shown here), and the linear type battery of script is then
Nano circuit board group part 2170 can not be allowed.As shown in figure 30, circuit board assemblies 2170 can be with the battery component similar to puzzle piece
2160 " matings ".In addition, battery component 2160 may also include the channel 2162 for limiting the battery component 2160 that size reduces.This
Sample, electronic equipment 2100 may include flexible circuit 2164, which passes through above battery component 2160 along channel 2162
And with circuit board assemblies 2170 and may include operating member (as non-limiting example, such as audio-frequency module) second in
2174 electric coupling of portion's component, to make the second internal part 2174 be electrically connected with circuit board assemblies 2170.Although flexible circuit
2164 are described as being electrically coupled to the second internal part 2174, but flexible circuit 2164 can also be with third internal part (not shown)
Such as antenna electric coupling.Under any of the above-described situation, the channel 2162 being formed in battery component 2160 allows to rearrange
Various internal parts.In addition, battery component 2160 may include increased in size corresponding with the electric memory capacity increased, because of battery
Component 2160 can be positioned in 2172 top of the first internal part.
Figure 31 shows the cross-sectional view of the line C-C interception in Figure 30 of the electronic equipment 2100 shown in Figure 30.Portion
Divide ground due to the die cut operation (described above) of electrode and spacer body, battery component 2160 can be above the first internal part 2172
By.In addition, as shown in figure 31, a part of battery component 2160 can be placed on shell 2102 by flat, and battery component
2160 another part covers the first internal part 2172.In other words, battery component 2160 can be increased to the first internal part
2172 tops and the size and shape for also at least partially conforming to the first internal part 2172.In addition, electrode can also be
Pass through above one internal part 2172.For example, battery component 2160 includes first electrode 2182 and second electrode 2184, wherein dividing
Spacer 2186 is positioned between first electrode 2182 and second electrode 2184.As shown in figure 31, the 2182, second electricity of first electrode
Pole 2184 and spacer body 2186 can pass through above the first internal part 2172.In addition, die cut operation can form first electrode
2182 and second electrode 2184 so that electrode before the position corresponding with channel 2162 entered in battery component 2160 eventually
Only, so that channel 2162 be allowed to reduce the size of battery component 2160 to receive flexible circuit 2164.Although not shown in the drawings, but
Channel 2162 may include the size and shape for receiving two or more flexible circuits, so as to by additional internal components (not
Show) with circuit board assemblies 2170 electric coupling (is shown) in Figure 30.Therefore, flexible circuit 2164 (or additional flexible circuit) is not required to
It to be positioned around the periphery of battery component 2160.
Figure 32 show according to some embodiments in Fig. 4 shown in circuit board assemblies 170 exploded view.Such as
Shown in figure, circuit board assemblies 170 may include first circuit board 172 and second circuit board 174.In some embodiments, first
Each of circuit board 172 and second circuit board 174 include printed circuit board.In addition, first circuit board 172 can be to stack
Configuration and second circuit board 174 are fixed together and are positioned in above second circuit board.As shown in figure 32, first circuit board
172 include size and shape identical as the size and shape of second circuit board 174 or at least partly similar.However, one
In a little embodiment (not shown), for size and/or shape, compared to second circuit board 174, first circuit board 172 is wrapped
Include at least some differences.Although the stacking configuration of circuit board assemblies 170 increases circuit board assemblies 170 in the (figure of electronic equipment 100
Shown in 1) in occupied area on z-dimension, but stacking configuration reduces circuit board assemblies 170 on x dimension and y-dimension
Occupied area.It can be that other component is such as electric in electronic equipment 100 by stacking the additional space that aforementioned circuit plate provides
Pond component 160 (being shown in FIG. 4) provides additional space.In addition, passing through the ruler for reducing display assembly 102 (showing in Fig. 5)
Additional space that is very little and providing is that circuit board assemblies 170 provide space.In other words, on z-dimension partially due to display
102 size of device assembly reduces and the stacking configuration of the additional space permission circuit board assemblies 170 of realization.Although not shown in the drawings,
Circuit board assemblies 170 may include in stacking configuration and three or more circuit boards for being electrically connected each other.
First circuit board 172 and/or second circuit board 174 may include several operating members." operating member " can refer to
A kind of component, such as executes the integrated circuit or processor circuit of one or more operations, such as executes to come to be stored in and deposit
The instruction of software application on memory circuit.Operating member is also referred to as transistor.Positioned at first circuit board 172 and/
Or the operating member on any one of second circuit board 174 can convert electric energy to thermal energy during operation.However, heat distribution
Component (not shown) is designed to remove thermal energy from circuit board assemblies 170.Will be discussed below.As shown in figure 32,
Circuit board may include the operating member on multiple surfaces.For example, first circuit board 172 may include the first mounting surface 2202
And with opposite facing second mounting surface 2204 of the first mounting surface 2202, wherein the first mounting surface 2202 have first behaviour
Make component 2212 and the second mounting surface 2204 has the second operating member 2214 (shown in dotted line).As shown in figure 32,
One mounting surface 2202 and the second mounting surface 2204 may include additional operations component.Also, it is noted that first circuit board
Operating member on 172 can be electrically connected each other.Communication device may include at least one for for example extending through first circuit board 172
Through-hole (not shown).
Second circuit board 174 may include the first mounting surface 2206, which includes that several operating members are all
Such as operating member 2216.Second circuit board 174 further includes and opposite facing second mounting surface 2208 of the first mounting surface 2206.
In some embodiments, the second mounting surface 2208 includes being electrically connected with the operating member being located in the first mounting surface 2206
One or more operating members.Also, it is noted that after circuit board assemblies 170 are assembled, second circuit board 174
By first circuit board 172 to cover (or covering) on stacking configuration.It should be noted, however, that first circuit board 172 is still electric with second
Road 174 separates at least certain gap or space.In addition, after circuit board assemblies 170 are assembled, second circuit board 174
Second mounting surface 2204 of first mounting surface 2206 towards first circuit board 172, and vice versa.
First circuit board 172 can by several Self-Clinching Standoffs with rivet interlacement come with second circuit board 174 mechanically
Connection.For example, as shown in figure 32, second circuit board 174 includes the first rivet for being designed to being located on first circuit board 172
First Self-Clinching Standoffs 2222 of 2224 connections.Each self-clinching nut in remaining Self-Clinching Standoffs (not indicating) shown in Figure 19
Column can be connect with rivet shown in Figure 32 (not indicating).The Self-Clinching Standoffs is designed not only to provide mechanical connection, but also
Desired distance is kept between first circuit board 172 and second circuit board 174, so that the second of first circuit board 172 installs
Component on surface 2204 does not interfere the component in the first mounting surface 2206 of second circuit board 174 (physically), and
Vice versa.In addition, the positioning of Self-Clinching Standoffs and rivet can overturn so that first circuit board 172 include Self-Clinching Standoffs simultaneously
And second circuit board 174 includes rivet.
In order to can be used several interpolaters in first circuit board for first circuit board 172 and 174 electric coupling of second circuit board
Electric signal is routed between 172 and second circuit board 174.For example, as shown in figure 32, second circuit board 174 may include several interpolations
Device such as carrys out the interpolater 2232 with 174 electric coupling of second circuit board for example, by welding operation.It is shown in figure several additional
Interpolater (does not indicate).In addition, although not shown in the drawings, but second circuit board 174 may include by interpolater and second circuit board
Several metal traces of one or more operating member electric couplings on 174.In addition, when first circuit board 172 is electrically coupled to the
When two circuit boards 174, each interpolater can be with one or more in the second mounting surface 2204 of first circuit board 172
Metal trace (not shown) electric coupling.
Circuit board assemblies 170 may include several shieldings for making the member shields electromagnetic interference (" EMI ") of circuit board assemblies 170
Element.For example, circuit board assemblies 170 may include that covering is positioned in the first mounting surface 2202 of first circuit board 172
First shielding element 2242 of component.First shielding element 2242 may include being configured in the first mounting surface 2202
The material based on metal of component offer EMI shielding case.The circuit board assemblies 170 may also include secondary shielding element 2244, should
Secondary shielding element is configured in the second mounting surface 2204 of first circuit board 172 and second circuit board 174
The first mounting surface 2206 on component provide EMI shielding case.The secondary shielding element 2244 may include metal, such as copper or
Brass.The secondary shielding element 2244 can by several solder joints for being arranged on each circuit board come with first circuit board 172
(and fixing therebetween) is fixed together with second circuit board 174.For example, Figure 32, which is shown, to be had around second circuit board
The second circuit board 174 of first solder joint 2250 of 174 outer periphery positioning.If being shown in figure in addition to the first solder joint 2250
Dry additional bond-pads, but they are not indicated.First circuit board 172 may also include be located at on second circuit board 174
Solder joint (not shown) at the corresponding position of solder joint.In some embodiments, secondary shielding element 2244 does not connect including several
Continuous structural detail.In the embodiment shown in Figure 32, secondary shielding element 2244 may include being designed to along circuit board group
The single continuous structure member that the outer periphery of part 170 extends.Alternatively, secondary shielding element 2244 may include be combined with each other with
Form several shielding element parts of secondary shielding element 2244.
Circuit board assemblies 170 may also include the third being positioned in the second mounting surface 2208 of second circuit board 174
Shielding element 2246.Third shielding element 2246 is designed to and the first shielding element 2242 and 2244 groups of secondary shielding element
It closes, to provide EMI shielding case for circuit board assemblies 170.In addition, the second mounting surface 2208 of second circuit board 174 may include
Metal trace (runs through the second mounting surface 2208).In this regard, in addition to forming EMI shielding case, third shielding element
2246 can also limit at least part in the electrically grounded path of circuit board assemblies 170, because third shielding element 2246 passes through gold
Belong to trace and is electrically connected to the second mounting surface 2208.In addition, when one or more components of circuit board assemblies 170 are in the operation phase
Between when generating EMI, aforementioned shielding element can make being located at relative to circuit board assemblies 170 for electronic equipment 100 (showing in Fig. 1) outer
The member shields in portion EMI as caused by one or more components of circuit board assemblies 170.
Figure 33 shows the cross-sectional view of the circuit board assemblies 170 shown in Figure 32, and it illustrates circuit board assemblies 170
Various internal parts.As shown, first circuit board 172 can be separated by Self-Clinching Standoffs 2226 and second circuit board 174.Separately
Outside, in order to which by first circuit board 172 and the mechanical coupling of second circuit board 174, Self-Clinching Standoffs 2226 can be mechanical with rivet 2228
Coupling, wherein the component of Self-Clinching Standoffs 2226 and rivet 2228 and first circuit board 172 and second circuit board 174 is electrically isolated.
First circuit board 172 may include the through-hole 2218 formed by metal, in the first operating member 2212 and the second behaviour
Make to provide electrical connection between component 2214.In addition, first circuit board 172 can by interpolater 2234 come with second circuit board 174
It is electrically connected.As shown, interpolater 2234 can be with the first solder joint 2262 electrical connection being located on first circuit board 172 and machinery
Connection, and can also be with the second solder joint 2264 electrical connection being located on second circuit board 174 and mechanical connection.Except interpolater
Except 2234, it also can be used several additional interposer (not shown) to carry signal between circuit board.First circuit board 172 can
Including the first metal trace 2272 being electrically connected with the second operating member 2214 and through-hole 2218, and second circuit board 174
It may include the second metal trace 2274 being electrically connected with the third operating member 2220 being located on second circuit board 174.In this way, the
Three operating members 2220 can be electrically connected by interpolater 2234 and metal trace with the second operating member 2214.Third operation
Component 2220 can be electrically connected by through-hole 2218, interpolater 2234 and metal trace with the first operating member 2212.Circuit board
Several additional metal traces, through-hole and solder joint can be used to provide additional electric connection access in component 170.
Figure 34 shows the alternative embodiment of circuit board assemblies 2370, and it illustrates for the electricity for entering protection and modifying
Road board group part 2370.Circuit board assemblies 2370 may include previously being directed to any part and features described in circuit board assemblies,
Such as first circuit board 2372 and second circuit board 2374.However, as shown in figure 34, circuit board assemblies 2370 may include insertion position
The Embedding Material 2390 in circuit board assemblies 2370 between first circuit board 2372 and second circuit board 2374.Embedding Material
2390 may include resin, which is cured to be directed to each operating member such as 2314 shape of operating member of circuit board assemblies 2370
At the shielding case of resistance to liquid.In this regard, Embedding Material 2390 can prevent due to liquid enter and simultaneously to circuit board assemblies 2370
And it is specifically damaged caused by the component of circuit board assemblies 2370.In addition, Embedding Material 2390 may extend into circuit board assemblies
2370 the first shielding element 2342 and secondary shielding element 2344, to prevent component such as Self-Clinching Standoffs 2326 by corruption
Erosion.Embedding Material 2390 can be used together with circuits described herein component.
Figure 35 shows the alternative embodiment of the circuit board assemblies 2470 according to some embodiments, it illustrates
The circuit board assemblies 2470 of flexible circuit 2402 with the circuit board electric coupling with the circuit board assemblies.The circuit board assemblies
2470 may include previously for any part and/or features described in circuit board assemblies.For example, as shown, the circuit
Board group part 2470 may include first circuit board 2472 and second circuit board 2474.The circuit board assemblies 2470, which may also include, to be set
The first shielding element 2442 above first circuit board 2472 and at least some components.The circuit board assemblies 2470 may also include
Cover the secondary shielding element 2444 in the gap between first circuit board 2472 and second circuit board 2474.The circuit board group
Part 2470 may also include the third shielding element 2446 for being arranged on 2474 top of second circuit board.However, the circuit in Figure 35
Simultaneously interpolater is not used to realize first circuit board 2472 and second circuit board 2474 (and their corresponding portion in board group part 2470
Part) between electric connection, but use flexible circuit 2402 on being located at first circuit board 2472 and/or second circuit board 2474
Operating member between transmit electric signal.
The flexible circuit 2402 can with 2472 electric coupling of first circuit board and it is mechanical couple, and formed for the second electricity
The circuit of 2474 electric coupling of road plate and mechanical coupling.It is electrically coupled to and mechanical coupling can be used thermal compression welding operation to execute.It can
Thermode (not shown) is used as " thermal head ", which is heated to provide thermal energy flexible circuit 2402 and the
Soldered elements (not shown) on one circuit board 2472 and second circuit board 2474, to form flexible circuit 2402 and the first electricity
The mechatronics of road plate 2472 and second circuit board 2474.It should be noted that can be used multiple thermal compression welding operations will be flexible
Circuit 2402 is coupled together with first circuit board 2472 and second circuit board 2474.
Figure 36 shows the cross-sectional view of the interception of D-D along the line of the circuit board assemblies 2470 shown in Figure 35, it illustrates
The flexible circuit board 2402 extended between circuit board.As shown, the flexible circuit 2402 and be respectively positioned at first electricity
2414 mechatronics of the first solder joint 2412 and the second solder joint on road plate 2472 and second circuit board 2474.In addition, the first solder joint
2412 can be with 2422 electric coupling of the first metal trace on first circuit board 2472, and the second solder joint 2414 can be with second circuit
2424 electric coupling of the second metal trace on plate 2474.Therefore, which can be with several operating member (not shown)
Electric coupling, some and 2422 electric coupling of the first metal trace in operating member is simultaneously located on first circuit board 2472, and grasps
Make some and 2424 electric coupling of the second metal trace in component and is located on second circuit board 2474.
Figure 37 shows the cross-sectional view of the alternative embodiment of the circuit board assemblies 2570 according to some embodiments,
It illustrates the internal parts of circuit board assemblies 2570 to have corresponding geometry.Circuit board assemblies 2570 may include previous needle
To any part described in circuit board assemblies and/or features.For example, circuit board assemblies 2570 may include first circuit board
2572 and second circuit board 2574, wherein first circuit board 2572 is electrically connected by interpolater 2520 with second circuit board 2574.
Additional interposer (not shown) can be by first circuit board 2572 (and component thereon) and second circuit board 2574 (and portion thereon
Part) electric coupling.First circuit board 2572 may include the first mounting surface 2502 with the first operating member 2512 and (with the
One mounting surface 2502 is opposite facing) have the second of the second operating member 2514 for being electrically coupled to metal trace (not indicating) to pacify
Fill surface 2504.In addition, the second circuit board 2574 may include the third operating member for being electrically coupled to metal trace (not indicating)
2516, wherein third operating member 2516 and metal trace are located in the first mounting surface 2506 of second circuit board 2574.
As shown in figure 37, the second operating member 2514 and third operating member 2516 can be nested configuration.For example, third is grasped
Making component 2516 may include the protruding portion 2518 in the recessed portion 2522 for extend at least partly into the second operating member 2514.The
Correspondence geometry between two operating members 2514 and third operating member 2516 allows size to reduce (or height reduces)
Circuit board assemblies 2570, to reduce the overall space that circuit board assemblies 2570 occupy in electronic equipment (not shown).It changes
Word is said, since the component of first circuit board 2572 and second circuit board 2574 with the second operating member 2514 and third to operate
The similar mode of the nested configuration of component 2516 forms corresponding or nested configuration, therefore, compared to previous embodiment,
Interval or gap between first circuit board 2572 and second circuit board 2574 can reduce.
In addition, in some cases, the component in various boards can be electrically coupled to each other and mechanical by direct mode
Coupling.For example, first circuit board 2572, which is also shown, in Figure 37 has the 4th operating member being located in the second mounting surface 2504
2534 and the 5th operating member 2536 in the first mounting surface 2506 of second circuit board 2574.4th operating member
2534 may include recessed portion 2542 and the connector being positioned in recessed portion 2,542 2544.In addition, the 5th operating member
2536 may include the protruding portion 2538 extended in recessed portion 2542.Protruding portion 2538 may include connector 2554, the connector
With 2544 electric coupling of connector and mechanical coupling.In this way, the 4th operating member 2534 and 2536 electric coupling of the 5th operating member are simultaneously
Machinery coupling.
In addition, when circuit board assemblies 2570 include operating member such as the 4th operating member 2534 and the 5th operating member
When 2536, first circuit board 2572 can be electrically coupled to the second electricity by the 4th operating member 2534 and the 5th operating member 2536
Road plate 2574.Therefore, circuit board assemblies 2570 can not need interpolater (such as interpolater 2520) to provide first circuit board
Being electrically connected between 2572 and second circuit board 2574.In addition, as shown in figure 37, first circuit board 2572 may include and the 4th behaviour
Make component 2534 and metal trace (does not indicate) through-hole 2546 of electric coupling.In this way, the first operating member 2512 can pass through
Metal trace, through-hole 2546 and the 4th operating member 2534 and be electrically connected to the 5th operating member 2536.It should be noted that
In some embodiments, circuit board assemblies 2570 include the second operating member 2514 and third operating member 2516 and the 4th behaviour
Make the combination of component 2534 and the 5th operating member 2536.
Figure 38 shows the cross-sectional view of the alternative embodiment of the circuit board assemblies 2670 according to some embodiments,
It illustrates the circuit board assemblies 2670 with several solder masks for being used to support circuit board.The circuit board assemblies 2670 may include
Previously for any part and/or features described in circuit board assemblies.For example, the circuit board assemblies 2670 may include first
Circuit board 2672 and second circuit board 2674.In addition, each of first circuit board 2672 and second circuit board 2674 can wrap
Include several solder joints (not indicating), wherein inserter with from first circuit board 2672 solder joint and with come from second circuit board
2674 solder joint electric coupling.For example, Figure 38 is shown with the first interpolater 2602, the second interpolater 2604 and third interpolater
Solder joint on 2606 circuit board assemblies 2670, first interpolater and first circuit board 2672 and second circuit board 2674 is (not
Mark) simultaneously machinery couples electric coupling, and the solder joint on second interpolater and first circuit board 2672 and second circuit board 2674 is (not
Mark) simultaneously machinery couples electric coupling, and the solder joint on the third interpolater and first circuit board 2672 and second circuit board 2674 is (not
Mark) electric coupling simultaneously mechanical coupling.
Solder joint aoxidizes and/or prevents to form weldering " bridge ", circuit between adjacent welds during welding operation in order to prevent
Board group part 2670 may include several solder masks.For example, circuit board assemblies 2670 may include being located at the first interpolater 2602 and second
The first solder mask 2622 between interpolater 2604 and between the second interpolater 2604 and third interpolater 2606
Two solder masks 2624.Based on their position, the first solder mask 2622 can be prevented in the first interpolater 2602 and the second interpolater
Weldering bridge (thus preventing the undesirable electric coupling between the first interpolater 2602 and the second interpolater 2604) is formed between 2604,
And the second solder mask 2624 can prevent from being formed weldering bridge between the second interpolater 2604 and third interpolater 2606 (to prevent
Undesirable electric coupling between second interpolater 2604 and third interpolater 2606).In addition, the first solder mask 2622 and second
Solder mask 2624 may be provided between first circuit board 2672 and second circuit board 2674 support for keeping desired distance or interval
Structure.In addition, in order to keep first circuit board 2672 and second circuit board 2674, first circuit board 2672 and second circuit board
Both 2674 can be clamped on the end of the first solder mask 2622 and the second solder mask 2624.Interpolater, solder joint and solder mask
Several additional interposers, solder joint and solder mask can be respectively indicated.
Figure 39 shows the isometric views of the embodiment of the audio-frequency module 2700 according to some embodiments.The sound
Frequency module 2700 can be used for replacing the first audio-frequency module 182 (showing in Fig. 4).The audio-frequency module 2700 can be used as being designed to produce
The receiver module of the sound energy of raw audible sound form.In general, receiver module is used for the output phase relatively low with frequency
In associated low power applications.However, the audio-frequency module 2700 may include to enhancing associated with audio tweeter module
The modification of audio performance.
The audio-frequency module 2700 may include the audio-frequency module shell 2702 with audio-frequency module opening 2704.The audio-frequency module
Shell 2702 can limit the inside operatic tunes for being divided into ante-chamber and back cavity.This will be shown below.The audio-frequency module shell
2702 can carry the diaphragm 2706 or film of the sound energy for being designed to vibrate to generate audible sound form.Therefore, the diaphragm 2706
It is referred to alternatively as film or sound film.The diaphragm 2706 may include additional thickness to handle (with the additional electrical provided to audio-frequency module 2700
Power is associated) extraneous vibration energy, and therefore handle supplemental audio frequency.In addition, audio-frequency module opening 2704 can indicate sound
Single unmodified opening in frequency module shell 2702, and in audio-frequency module shell 2702 (such as wiring and be electrically connected
Logical) any other opening can carry out air encapsulation process and hydraulic seal is handled.In this regard, electronic equipment (not
Show) in air pressure change during, can prevent diaphragm 2706 from being generated by because air enters audio-frequency module shell 2702
Undesirable vibration.This will be further elucidated hereinbelow.In addition, in some embodiments, diaphragm 2706 includes being designed
At the diaphragm of resistance to liquid (or resistance to liquid film) being resistant to because being damaged caused by being exposed to liquid such as water.
Figure 40 shows the cross-sectional view of the line D-D interception in Figure 39 of audio-frequency module 2700 shown in Figure 39, it illustrates
Several inner features of audio-frequency module 2700.As shown, the audio-frequency module 2700 includes sound coil 2708 and magnet
2710.The sound coil 2708 is designed to receive alternating current, to form the electromagnet with alternating magnetic polarities.The alternation magnetic
Polarity may make interaction (attract and repel) of the sound coil based on the external magnetic field with magnet 2710 and vibrate.
The diaphragm 2706 is positioned in audio-frequency module shell 2702 and (will partly be limited by audio-frequency module shell 2702
) operatic tunes is separated into ante-chamber 2720 and back cavity 2722.As shown, ante-chamber 2720 can lead to audio-frequency module opening 2704, then
Chamber 2722 is opened with 2704 seal isolation of audio-frequency module opening.In addition, when audio-frequency module 2700 is positioned in 100 (Fig. 1 of electronic equipment
In show) in when, audio-frequency module shell 2702 can make audio-frequency module 2700 component and electronic equipment 100 in air sealing every
It leaves, so that for example diaphragm 2706 is not by the acoustics driving of air pressure variations in electronic equipment 100 or the shadow of other modes
It rings.As shown, ante-chamber 2720 and back cavity 2722 can be made to mask the variation of the pressure in electronic equipment 100.However, working as diaphragm
When 2706 vibrations are to form sound energy, sound can leave audio-frequency module opening 2704.In addition, in some embodiments, audio-frequency module
2700 include air scoop 2730, after which allows air (in such a way that air enters audio-frequency module opening 2704) to enter
It in chamber 2722, and leaves back cavity 2722 and reaches audio-frequency module opening 2704, so that the air pressure when ambient air outside changes
When change, back cavity 2722 can be balanced with surrounding air.In addition, though alternative first audio-frequency module, the 182 (Fig. 4 of audio-frequency module 2700
In show), but audio-frequency module 2700 may include different design and shape, so that also alternative second audio of audio-frequency module 2700
Module 184 (is shown) in Fig. 4.
Figure 41 shows the cross-sectional view of electronic equipment 100, and it illustrates the audio-frequency modules being positioned in electronic equipment 100
2700.As shown, (the two is shown in Fig. 1 with opening 134 for audio-frequency module 2700 and specifically audio-frequency module opening 2704
At least one of out) opening alignment.In addition, Web materials 2724 can cover opening 134 and provide beautiful facial ornament.In addition,
In some embodiments, audio-frequency module 2700 is equipped with bracket 2726.Bracket 2726 can pass through adhesive 2728 and audio-frequency module
2700 are fixed together, which may include resistance to bonding agent, to prevent liquid from entering electronic equipment from 2726 surrounding of bracket
100.In addition, bracket 2726 may include sealing element 2732, which is positioned in audio-frequency module 2700 and bracket 2726
Between between audio-frequency module 2700 and bracket 2726 formed enter barrier.In this way, audio-frequency module 2700 is positioned in electronics
In equipment 100, so that entering any liquid of opening 134 may extend into ante-chamber 2720, but do not extend in back cavity 2722.Separately
Outside, it may extend into 2722 the two of ante-chamber 2720 and back cavity into any air of opening 134, wherein back cavity uses air scoop
2730 receive air.Air scoop 2730 may also allow for air to leave back cavity 2722.Therefore, audio-frequency module 2700 can prevent liquid
Offer sound energy when body enters electronic equipment 100.In addition, the sound generated by diaphragm 2706 can be open via audio-frequency module 2704 from
Audio-frequency module 2700 is opened, and can also leave electronic equipment 100 via opening 134.
In addition, as shown in figure 41, audio-frequency module 2700 can be positioned in electronic equipment 100, so that audio-frequency module is open
2704 are only exposed to enter the surrounding air of electronic equipment 100 (outside electronic equipment 100) by opening 134.In other words,
Audio-frequency module shell 2702 is sealed in a certain way, so that for example, by the first protective layer 104 of pressing and display assembly 102
Air will not be made to enter audio-frequency module shell to cause the inner chamber of the air pressure variations in electronic equipment 100 to change
2702, to prevent diaphragm 2706 from generating undesirable acoustic noise.
Figure 42 shows the exploded view of the hot allocation component 190 according to some embodiments.Hot allocation component 190 can
Including not only providing the heat transfer characteristic of enhancing but also providing several material layers of structural support.The heat transfer characteristic of enhancing and
Structural support comes in handy in a case where: hot allocation component 190 is for substantially nonmetallic outside and therefore
In electronic equipment with reduced thermal heat transfer capability, such as electronic equipment with the second protective layer 144 (being shown in FIG. 2)
100.In this regard, hot allocation component 190 can be used in electronic equipment, to guide thermal energy towards another structure of electronic equipment
Features such as aforementioned lateral wall component is far from nonmetallic bottom wall.
As shown, hot allocation component 190 may include several material layers.For example, hot allocation component 190 may include by first
The first layer 2802 that types of material is formed, which may include durable material, such as stainless steel.First layer 2802
It may include bottom wall 2812 and the first side wall 2822 and second sidewall 2824, both the first side wall and second sidewall are with vertical
Or at least substantially vertical mode extends from bottom wall 2812.When being assembled into electronic equipment 100 (being shown in Fig. 1 and Fig. 2)
When, hot allocation component 190 and specifically first layer 2802 are thermally couple to one or more heating parts in electronic equipment 100
Part.At least one of bottom wall 2812, the first side wall 2822 and second sidewall 2824 may include and the heating part in electronic equipment
Part directly thermally contacts or the contact surface of at least thermal coupling.This will be shown below.
Hot allocation component 190 may also include the second layer 2804 that is designed to engage and be thermally couple to first layer 2802.
The second layer 2804 may include bottom wall 2814 and the first side wall 2832 and second sidewall 2834, the first side wall and second sidewall
The two is extended in vertical or at least substantially vertical mode from bottom wall 2814.When hot allocation component 190 has been assembled, second
Bottom wall 2814, the first side wall 2832 and the second sidewall 2834 of layer 2804 can engage the bottom wall 2812 of first layer 2802, the respectively
One side wall 2822 and second sidewall 2824.In addition, the second layer 2804 can be formed by Second Type material, which can
Material including (compared to the first kind material of first layer 2802) with relatively high thermal conductivity, such as copper or graphite.Just
For this point, the second layer 2804 is designed to divide thermal energy again when heat generating components and hot 190 thermal coupling of allocation component
Match, reboot or is otherwise propagated far from the heat generating components (not shown) in electronic equipment.When first layer 2802 from one
When a or multiple heat generating components receive thermal energy, the second layer 2804 can receive thermal energy from first layer 2802.Bottom wall 2816, the first side wall
At least one of 2842 and second sidewall 2844 may include and the directly thermo-contact or the contact of at least thermal coupling of the second layer 2804
Surface.
In addition, hot allocation component 190 may include third layer 2806, which combines with first layer 2802 and enhances heat
The structural support and rigidity of allocation component 190.Therefore, third layer 2806 can be formed by third types of material, the third class profile
Expect same or like with the first kind material of first layer 2802 in some cases.Third layer 2806 may include bottom wall 2816,
And the first side wall 2842 and second sidewall 2844, both the first side wall and second sidewall are with vertical or at least substantially vertical
Mode from bottom wall 2816 extend.When hot allocation component 190 has been assembled, bottom wall 2816, the first side wall of third layer 2806
2842 and second sidewall 2844 can engage the bottom wall 2814, the first side wall 2832 and second sidewall 2834 of the second layer 2804 respectively.
In addition, when hot allocation component 190 is positioned in electronic equipment 100 (showing in Fig. 1 and Fig. 2), the first of third layer 2806
Side wall 2842 and second sidewall 2844 can engage respectively and be thermally couple to third side member 116 and the 4th side member 118
(being shown in Fig. 1).In this way, hot allocation component 190 can be thermally couple to the part of band 110 (showing in Fig. 1 and Fig. 2).Bottom wall
2814, at least one of the first side wall 2832 and second sidewall 2834 may include directly thermally contacting with first layer 2802 or at least
The contact surface of thermal coupling.
Previous materials composition based on hot allocation component 190, the second layer 2804 may include and first layer 2802 and third layer
The different heat transfer characteristic of 2806 heat transfer characteristic.For example, compared to the one kind for forming first layer 2802 and third layer 2806
Or multiple material, the second layer 2804 can be formed by the material with relatively high thermal conductivity.In addition, compared to the second layer is formed
2804 material, first layer 2802 and third layer 2806 can be formed by the material with relatively high durability or rigidity.
In order to which hot allocation component 190 is fitted together with different materials combination layer, each layer can undergo be designed to by
The combined cladding operation of layer.The cladding operation may include each material layer being placed in independent rollers, and then work as layer
Lamination is combined when passing through roller.Pressing effect can form molecular link between the molecule of metal.It should be noted that coating is grasped
Make to use when the second layer 2804 includes copper.When the second layer 2804 includes graphite, different assembly operations can be used.This will
It shows and discusses below.In addition, first layer 2802 and third layer 2806 can be second when hot allocation component 190 is assembled
Layer 2804 provides support, and can also provide certain structure branch to carry the electronic equipment (not shown) of hot allocation component 190
Support.Although the second layer 2804 is mainly used for hot transmitting, first layer 2802 and third layer 2806 also can provide at least some heat and pass
Pass ability.In addition, though first layer 2802 and third layer 2806 are mainly used for structural support, but the second layer 2804 also can provide to
Few some structural supports.
Figure 43 shows the partial sectional view of electronic equipment 100 shown in FIG. 1, and it illustrates be positioned in electronic equipment
Hot allocation component 190 in 100.For illustrative purposes, some components of electronic equipment 100 are eliminated.As shown, heat point
Distribution assembly 190 can directly be thermally contacted with circuit board assemblies 170 or at least thermal coupling so that from one of circuit board assemblies 170 or
The heat that multiple operating members generate can be transmitted at least some layers of hot allocation component 190 from circuit board assemblies 170.For example,
As shown in the first enlarged view 2850, the thermal energy stream generated from the operating member of circuit board assemblies 170 is (by dotted line with the arrow
Indicate) or hot-fluid may pass through first layer 2802 reach the second layer 2804.As shown, contact surface (the bottom wall of first layer 2802
Marked in 2812, Figure 42) it is thermally contacted with circuit board assemblies 170.In addition, partially due to the second layer 2804 is (compared to third
Layer relatively high thermal conductivity 2806), thermal energy be intended to extend through first layer 2802 and perpendicular to or at least partly hang down
Directly in first layer 2802, and continues across the second layer 2804 and be not passed through third layer 2806.As further shown in Figure, thermal energy stream
Contact surface (bottom wall 2814, Figure 24 marked in) relative to the second layer 2804 is moved in parallel or at least partly parallel is moved
It is dynamic.Therefore, the relatively low thermal conductivity of third layer 2806 can prevent one or more positions near the second protective layer 144
The thermal energy buildup (being also known as hot spot) at place.This will be discussed further below.
In addition, as shown in figure 43, hot allocation component 190 is designed to bonding ribbon 110.For example, such as the second enlarged view
Shown in 2852, the third of the engageable band 110 of the contact surface of the first side wall 2842 of the third layer 2806 of hot allocation component 190
Side member 116.Therefore, third layer 2806 can directly thermally contact or at least thermal coupling with third side member 116.The second layer
Thermal energy can be distributed or be re-introduced to third layer 2806 by 2804, and specifically, from the first side wall 2832 of the second layer 2804
The first side wall 2842 of third layer 2806 is distributed or is re-introduced to, so that thermal energy is assigned to third side member 116, at this
At third side member, which then can be dissipated to surrounding air from third side member 116.The hot allocation component 190 is also
4th side member 118 of engageable band 110, the side that allocation component 190 hot in this way can be similar with third side member 116
Formula (that is, by side wall of the second layer 2804 and third layer 2806, shown in Figure 42) is by heat distribution to the 4th side member
118.In this way, being trapped within the distribution at or near the second protective layer 144 as the heat for preventing circuit board assemblies 170 from generating
At least one of radiator side member must be prevented from forming hot spot.
In addition, hot allocation component 190 can prevent or limit operation of the second protective layer 144 reception from circuit board assemblies 170
The thermal energy that component generates, because third layer 2806 provides the smallest thermal conductivity compared to the second layer 2804, so that electronic equipment 100
In thermal energy mainly carried by the second layer 2804.In this regard, the second layer 2804 can be limited by the behaviour of circuit board assemblies 170
Make the hot path or primary thermal path of the thermal energy of component generation.Although Figure 43 shows hot allocation component 190 from circuit board assemblies 170
One or more operating members receive heat, it is to be noted that, hot allocation component 190 can be from the thermal coupling of electronic equipment 100
Any heat generating components for being connected to hot allocation component 190 receives heat.In addition, hot allocation component 190 can provide and be used to support second
The rigidity supporting structure of protective layer 144.For example, the first layer 2802 and third layer 2806 of hot allocation component 190 can be protected across second
The main surface of sheath 144 extends, as shown in figure 43.
Figure 44 shows the side view of the alternative embodiment of the hot allocation component 2900 according to some embodiments.
Hot allocation component 2900 may include previously for any one or more of material described in hot allocation component and/or one or more
A features.Hot allocation component 2900 may include first layer 2902, the second layer 2904 (being shown as dotted line) and third layer 2906,
The middle second layer 2904 is embedded between first layer 2902 and third layer 2906.As shown, the second layer 2904 can be by first layer
2902 and third layer 2906 be completely covered.This can prevent the second layer 2904 from moving relative to first layer 2902 and/or third layer 2906
Dynamic or displacement.It should be noted, however, that the second layer 2904 can still receive the heat across first layer 2902 and/or third layer 2906
Amount.
Figure 45 shows the isometric view of the alternative embodiment of the hot allocation component 3000 according to some embodiments
Figure, it illustrates the hot allocation components 3000 for being modified to receiving part 3010.Hot allocation component 3000 may include previously being directed to
Any one or more of material and/or one or more features portion described in hot allocation component.As shown, hot allocation component
3000 may include first layer 3002, the second layer 3004 and third layer 3006, wherein the second layer 3004 be embedded in first layer 3002 with
Between third layer 3006.
However, the second layer 3004 can be modified to reduce the size of hot allocation component 3000.For example, the one of the second layer 3004
Part can locally be removed in desired position, so that a part of hot allocation component 3000 only includes first layer 3002 and third
Layer 3006, so that (locally) reduces the size of the hot allocation component 3000 without the second layer 3004.It, should since size reduces
Hot allocation component 3000 may include the first passage 3012 of receiving part 3010.The hot allocation component 3000 may also include receivable
The second channel 3014 of second component (not shown).It should be noted that the position pair of first passage 3012 and second channel 3014
The position of the second layer 3004 is not present in Ying Yu.However, at first passage 3012 and/or second channel 3014 with hot allocation component
3000 any one or more components being fixed together can be thermally couple to the second layer 3004, so that being produced by one or more components
Raw thermal energy can pump to the second layer 3004 from one or more components.
As non-limiting example, component 3010 can pass through welding, soldering or adherency (passing through adhesive) and hot distribution group
Part 3000 is fixed together.In addition, the size of first passage 3012 allows component 3010 to be placed in hot allocation component 3000,
So that component 3010 is at least coplanar relative to first layer 3002 and is embedded in slightly in some cases.It should be noted that the
The size in two channels 3014 allows second component (not shown) to be placed in hot allocation component 3000, so that second component phase
It is at least coplanar for third layer 3006 and be embedded in slightly in some cases.In addition, as non-limiting example, component
3010 can indicate one or more components, such as aforementioned heat generating components, audio-frequency module, bracket or connector.Alternatively, component 3010
It may include the heat-conducting layer for being designed to receive (and to dissipate) thermal energy from hot allocation component 3000.
Figure 46 shows the isometric view of the alternative embodiment of the hot allocation component 3100 according to some embodiments
Figure.Hot allocation component 3100 may include previously for any one or more of material described in hot allocation component and/or one
Or multiple features.As shown, hot allocation component 3100 may include first layer 3102, the second layer 3104 and third layer 3106,
Wherein the second layer 3104 is positioned between first layer 3102 and third layer 3106.
In some embodiments, the second layer 3104 includes metal, such as copper.In the embodiment shown in Figure 46, the
Two layer 3104 includes graphite.In order to which the second layer 3104 and first layer 3102 and third layer 3106 are combined together, hot distribution group
Part 3100 can undergo welding to operate.For example, as shown in figure 46, hot allocation component 3100 includes several weld seams, such as the first weld seam
3112 and second weld seam 3114, both first weld seam and second weld seam indicate to be located at first layer 3102 and the second layer 3104 it
Between several weld seams.In addition, hot allocation component 3100 may include between third layer 3106 and the second layer 3104 by third
Several weld seams that weld seam 3116 indicates.By the way that the second layer 3104 and first layer 3102 and third layer 3106 are welded together, the
The shearing force that will be displaced the second layer 3104 relative to first layer 3102 and third layer 3106 originally can be resisted for two layer 3104, especially
It is even more so when the second layer 3104 includes granular materials such as graphite.
Figure 47 shows the flow chart 3200 according to some embodiments, and the flow diagrams illustrate be used to form electronics
The method of the display assembly of equipment.Electronic equipment may include portable electronic device, such as including smart phone or wearable
The mobile radio communication apparatus of electronic equipment.
In step 3202, display layer is located between touch-sensitive layer and power photosensitive layer.The touch-sensitive layer is configured as detection control
The touch input of electronic equipment processed.The power photosensitive layer is configured as the size that detection is applied to the power of touch-sensitive layer.It is display layer, touch-sensitive
Each of layer and power photosensitive layer may include fringe region, which includes at least one connector.In addition, having one
Or some fringe regions of multiple connectors can be perpendicular or parallel to other fringe regions.For example, touch-sensitive layer may include having
The fringe region of connector, and display layer may include the fringe region with connector, wherein preceding edge region relative to
It is parallel to each other or at least substantially parallel.In addition, touch-sensitive layer may include fringe region, which includes connector.However,
The fringe region of power photosensitive layer can relative to display layer fringe region and/or touch-sensitive layer fringe region vertically or at least substantially
Vertically.
In step 3204, display layer is bent, so that display layer is bent at least partly around power photosensitive layer.In some feelings
Under condition, display layer is pre-bent.In addition, (bearer connection device) fringe region of display can be with the main portion of display layer
It separates.The major part of display layer refer to limit display layer most surface, and the secondary part of display layer refer to it is logical
Cross a part that bending section and major part separate.Edge with connector point can be positioned in secondary part or by secondary
Part carries.
Figure 48 shows the flow chart 3300 according to some embodiments, and the flow diagrams illustrate be used to form electronics
The method of the battery component of equipment.Battery component can be used for providing in electric current several inside portions being positioned in electronic equipment
Part (integrated circuit, audio-frequency module, camera, illumination component etc.).
In step 3302, shell is provided.If the dry part that the shell is configured to battery provides shell.The shell can
Including the first cladding element, after component is positioned between the first cladding element and the second cladding element, the first covering member
Part is sealed with the second cladding element.In addition, shell can be in one of several different shapes shape.With regard to this point
Speech, the shape based on electrode and spacer body, shell may include that L-shape configuration, I shape configuration or C-shaped configuration (show as non-limiting
Example).In addition, any previous configuration may include being designed to accommodate the internal part of electronic equipment or providing for the internal part
The opening or through-hole in space.
In step 3304, multiple electrodes are inserted into shell.Multiple electrode may include multiple anodes to and cathode
It is right.In addition, each pair of electrode is by for separating electrode to spacer body physically isolated from one another, while still allowing charge in electrode
It is flowed between.In addition, each electrode can undergo die cut operation, to form the electrode with specific dimensions and shape.Size
With the size and shape that shape may include according to shell.In this regard, as each of non-limiting example, electrode centering
Electrode may include L shape, C-shape or I shape.In addition, when shell includes opening, each spacer body and electrode centering it is every
A electrode may include aforementioned opening, to provide through-hole in battery component.
In step 3306, channel is formed in the shell.Channel can limit the reduced size in shell.With regard to this point
Speech, shell can (substantially) include the first height.However, shell may include high less than first at position corresponding with channel
Second height of degree.The channel is designed to that the shape of battery component is thinned, so that additional component (such as flexible circuit) can hold
It changes places and passes through above battery along channel.In this regard, channel allows to relocate the appendix in the electronic device
Part.However, the shell of battery still can at the position in (or in channel) corresponding with channel receiving part, such as circuit board.
Figure 49 shows the flow chart 3400 according to some embodiments, and the flow diagrams illustrate be used to form circuit
The method of board group part.The circuit board assemblies are designed to carry several operating members.The circuit board assemblies may include stacking configuration,
Wherein first circuit board and second circuit board stack, or alternatively second circuit board by being covered on first circuit board.When being positioned
When in the shell or shell of electronic equipment, stacking configuration can reduce the occupied overall space of circuit board assemblies (in multiple dimensions
On degree).
In step 3402, first circuit board is provided.The first circuit board may include the first operating member.First operation
Component includes recessed portion.In addition, first circuit board may include multiple (opposite facing) surfaces, wherein each surface is designed to hold
Multiple operating members are carried, some operating members are electrically connected each other by metal trace and/or through-hole.
In step 3404, second circuit board and first circuit board are fixed together, so that first circuit board covering the
Two circuit boards.The second circuit board may include second operating member with protruding portion.
In step 3406, the protruding portion of the second operating member is positioned in (or being at least partially positioned at) recessed portion
In.In this way, the first operating member will pass through recessed portion and protruding portion and the second operating member " mating ".This can reduce the first circuit
Gap between plate and second circuit board, because of the first operating member and the positioning closer to each other of the second operating member, this and nothing
The operating member that method is coupled each other is opposite.Therefore, circuit board assemblies may include relatively thin shape and occupy in the electronic device
Less space.
Figure 50 shows the flow chart 3500 according to some embodiments, and the flow diagrams illustrate for assembling electronics
The method of equipment, the electronic equipment include the shell for limiting inner chamber.The shell may include the through-hole towards inner chamber.In step
In 3502, audio-frequency module is arranged in inner chamber.The audio-frequency module may include the audio-frequency module shell for carrying diaphragm.The audio
Module may also include the audio-frequency module opening being formed in audio-frequency module shell and with through-hole alignment.In addition, removing audio mould
Except block opening, audio-frequency module shell can not have additional opening, or alternatively, it may include by airtight and liquid-tight close
One or more openings of sealing covering, are protected so that audio-frequency module shell is limited with the air in the inner chamber as defined by shell
Hold the separated operatic tunes (including ante-chamber and back cavity).
In step 3504, a part around audio-frequency module shell carrys out locating support.For example, bracket can be at least partly
A part associated with audio-frequency module opening of surround audio module housing, to provide additional branch to audio-frequency module shell
Support.In addition, bracket can be fixed together at or near through-hole with shell with bonding way.For securing the stand to shell
Adhesive may include resistance to bonding agent.
In step 3506, sealing element keeps apart bracket and housing seal in through hole.The sealing element can be determined
Position between the bracket and the shell, and also engageable bracket and shell.In this regard, in audio-frequency module shell and inner chamber
Air seal isolation open, and can by diaphragm in inner chamber air seal off open.In addition, audio-frequency module shell is determined
It position and is designed to receive from the external environment outside electronic equipment and air or exhausts air to the external environment, the air is such as
For the air for entering through-hole.In addition, diaphragm can be used to issue the sound energy for leaving audio-frequency module opening and through-hole in the audio-frequency module.
Figure 51 shows the flow chart 3600 according to some embodiments, and the flow diagrams illustrate for making heat point
The method of distribution assembly, the hot allocation component are used to remove thermal energy from the heat generating components being located in the electronic equipment with housing sidewall
It removes.The hot allocation component is configured to electronic equipment and provides structural support, especially when the glass bottom for being coupled to housing sidewall
Wall limits even more so when the shell of electronic equipment.
In step 3602, first layer and the second layer are fixed together.The first layer may include the first bottom wall and from
The first side wall that first bottom wall extends.The second layer may include the second bottom wall for engaging the first bottom wall.In addition, the second layer may be used also
Second sidewall including extending and engaging the first side wall from the second bottom wall.In some cases, first layer includes the first kind
Material, such as steel (including stainless steel), in order to provide structural support.In addition, in some cases, the second layer includes Second Type
Material, such as copper or graphite, the Second Type material are designed to enhance the thermal conductivity of hot allocation component.In addition, first layer and
The second layer can respectively include additional sidewall.
In step 3604, third layer and the second layer are fixed together.Third layer may include engage the second bottom wall the
Three bottom walls.Third layer may also include the third side wall for extending and engaging second sidewall and housing sidewall from third bottom wall.Third
Layer may include third types of material, such as steel (including stainless steel).In this regard, third layer can be combined with first layer, with
Additional structural supports are provided.In addition, the second layer can be completely covered in first layer and third layer, so that the second layer is by first layer and third
Layer is hidden.
When hot allocation component has been assembled and has been positioned in electronic equipment, first layer is designed to thermal energy from hair
Thermal part is assigned to the second layer.In addition, the second layer is designed to distribute thermal energy in each position of the second layer, so that thermal energy arrives
Up to third layer and it can be assigned to that housing sidewall.
It can come individually or in any combination using the various aspects of the embodiment, embodiment, specific reality
It applies or feature.The various aspects of the embodiment can be realized by the combination of software, hardware or hardware and software.The implementation
Scheme can also be implemented as being used to control the computer-readable code of production operation on computer-readable medium, or be carried out
For the computer-readable code for being used to control production line on computer-readable medium.Computer-readable medium is can storing data
Any data storage device, can be read by computer system after the data.The example of computer-readable medium includes read-only
Memory, random access memory, CD-ROM, HDD, DVD, tape and optical data storage device.Computer-readable medium is also
It can be distributed in the computer system of network-coupled, so that computer-readable code is stored and executed in a distributed way.
In the foregoing description, for purposes of explanation, used specific name is provided to the thorough of the embodiment
Understand.However, it is evident that, practicing the embodiment for a person skilled in the art and not needing these tools
Body details.Therefore, it for the purpose for illustrating and describing, presents and the aforementioned of specific embodiment as described herein is retouched
It states.It is that they are not intended to exhaustive or embodiment is limited to disclosed precise forms.For the common of this field
It is evident that, content, many modifications and variations are possible according to the above instruction for technical staff.
Claims (60)
1. a kind of display assembly for electronic equipment, the display assembly include:
Touch-sensitive layer, the touch-sensitive layer are able to detect the touch input that can control the electronic equipment；
Power photosensitive layer, the power photosensitive layer are able to detect the size for being applied to the power of the touch-sensitive layer；With
Display layer, the display layer can be presented visual information, the display layer be positioned at least partially at the touch-sensitive layer and
Between the power photosensitive layer, wherein the display layer is bent at least partly around the power photosensitive layer.
2. display assembly according to claim 1, in which:
The display layer includes first edge region, and the first edge region has can be with the first flexible circuit electric coupling simultaneously
First connector of machinery coupling,
The power photosensitive layer includes second edge region, and the second edge region has can be with the second flexible circuit electric coupling simultaneously
Second connector of machinery coupling, and
The first edge region is vertical relative to the second edge region.
3. display assembly according to claim 2, wherein the touch-sensitive layer includes third fringe region, the third side
Edge region have can with the third connector of third flexible circuit electric coupling and mechanical coupling, wherein the third fringe region
It is vertical relative to the second edge region.
4. display assembly according to claim 3, wherein the first edge region is relative to the third marginal zone
Domain is parallel.
5. display assembly described in any one of -4 according to claim 1, wherein the display layer includes organic hair of bending
Optical diode display.
6. a kind of electronic equipment, comprising:
Protective layer, the protective layer are formed by transparent material；
Display assembly, the display assembly are covered by the protective layer, and the display assembly includes:
Power photosensitive layer, the power photosensitive layer are able to detect the size for being applied to the power of the protective layer, and
Display layer, the display layer are arranged above the power photosensitive layer, wherein the display layer is curved at least partly around limiting
The power photosensitive layer of pars convoluta is bent；With
Frame, the frame carry the protective layer, and the frame includes recess, the recess at least portion at the bending section
Ground is divided to receive the display layer.
7. electronic equipment according to claim 6, further includes:
Touch-sensitive layer, the touch-sensitive layer are positioned in above the display layer, the touching that the touch-sensitive layer detection passes through the protective layer
Input is touched, the touch-sensitive layer includes connector；With
Flexible circuit, the flexible circuit are couple to the touch-sensitive layer at the connector, described in the flexible circuit winding
Display layer and the power photosensitive layer, wherein the recess receives at least part of the flexible circuit.
8. electronic equipment according to claim 6, in which:
The display layer includes first edge region, and the first edge region has and the first flexible circuit electric coupling and machinery
First connector of coupling,
The power photosensitive layer includes second edge region, and the second edge region has and the second flexible circuit electric coupling and machinery
Second connector of coupling, and
The first edge region is vertical relative to the second edge region.
9. electronic equipment according to claim 8 further includes band, the band is formed by metal, and the band includes first
Point and second part, wherein first connector than second connector closer to the first part, and wherein institute
The second connector is stated than first connector closer to the second part.
10. electronic equipment according to claim 9, wherein the band further includes Part III and Part IV, and its
Described in first part, the second part, the Part III and the Part IV it is electrically isolated from one.
11. electronic equipment according to claim 8 further includes touch-sensitive layer, wherein the touch-sensitive layer includes third marginal zone
Domain, the third fringe region have the third connector with third flexible circuit electric coupling and mechanical coupling, wherein described the
Three fringe regions are vertical relative to the second edge region.
12. electronic equipment according to claim 11, wherein the first edge region is relative to the third marginal zone
Domain is parallel.
13. electronic equipment according to claim 8, further includes:
Support component, the support component are embedded in the frame, and the support component extends from the frame；With
Adhesive, for described adhesive between the support component and the power photosensitive layer, described adhesive is flexible by described first
Circuit is fixed together with the support component.
14. electronic equipment according to claim 13, wherein second flexible circuit by second adhesive with it is described
Support component is fixed together with bonding way.
15. the electronic equipment according to any one of claim 6-14, wherein the frame includes the second recess, and its
Described in protective layer include the extension being positioned in second recess.
16. a kind of method for the display assembly for being used to form electronic equipment, which comprises
Display layer is located between touch-sensitive layer and power photosensitive layer, the touch-sensitive layer is configured as detection and controls the electronic equipment
Touch input, the power photosensitive layer are configured as the size that detection is applied to the power of the touch-sensitive layer；And
It is bent the display layer, so that the display layer is bent at least partly around the power photosensitive layer.
17. according to the method for claim 16, in which:
The display layer includes first edge region, and the first edge region has can be with the first flexible circuit electric coupling simultaneously
First connector of machinery coupling,
The power photosensitive layer includes second edge region, and the second edge region has can be with the second flexible circuit electric coupling simultaneously
Second connector of machinery coupling, and
The first edge region is vertical relative to the second edge region.
18. according to the method for claim 17, wherein the touch-sensitive layer includes third fringe region, the third marginal zone
Domain have can with the third connector of third flexible circuit electric coupling and mechanical coupling, wherein the third fringe region is opposite
It is vertical in the second edge region.
19. according to the method for claim 18, wherein the first edge region is flat relative to the third fringe region
Row.
20. method described in any one of 6-19 according to claim 1, wherein position the display layer include will bend it is organic
Light emitting diode indicator is located between the touch-sensitive layer and the power photosensitive layer.
21. a kind of display assembly for electronic equipment, the display assembly include:
Touch-sensitive layer, the touch-sensitive layer detection control the touch input of the electronic equipment；
Power photosensitive layer, the power photosensitive layer detection are applied to the size of the power of the touch-sensitive layer；With
Display layer, the display layer are presented visual information, and the display layer is positioned at least partially at the touch-sensitive layer and described
Between power photosensitive layer, the display layer further includes bending section so that the display layer be based on the bending section at least partly around
The power photosensitive layer bending.
22. display assembly according to claim 21, in which:
The display layer includes first edge region, and the first edge region has can be with the first flexible circuit electric coupling simultaneously
First connector of machinery coupling,
The power photosensitive layer includes second edge region, and the second edge region has can be with the second flexible circuit electric coupling simultaneously
Second connector of machinery coupling, and
The first edge region is vertical relative to the second edge region.
23. display assembly according to claim 22, wherein the touch-sensitive layer includes third fringe region, the third
Fringe region have can with the third connector of third flexible circuit electric coupling and mechanical coupling, wherein the third marginal zone
Domain is vertical relative to the second edge region.
24. display assembly according to claim 23, wherein the first edge region is relative to the third edge
Region is parallel.
25. the display assembly according to any one of claim 21-24, wherein the display layer includes the organic of bending
Light emitting diode indicator.
26. a kind of electronic equipment, comprising:
First protective layer；
Metal tape, the metal tape and first protective layer couple；
Second protective layer, second protective layer and the metal tape couple, wherein the metal tape and second protective layer
Limit inner chamber；
Display assembly, the display assembly be positioned at least partially in the inner chamber and with the first protective layer coupling
It connects, the display assembly includes:
Touch input layer, the touch input layer are configured as detecting to the touch input of first protective layer,
Display layer, the display layer are configured as that visual information is presented by first protective layer, and
Power photosensitive layer, the power photosensitive layer are configured as the size of the power detected to first protective layer.
27. electronic equipment according to claim 26, wherein the metal tape includes the side wall separated by nonmetallic materials
Component.
28. electronic equipment according to claim 27, in which:
A side member in the side member includes the opening for connector,
The display layer includes the first connector, and
The power photosensitive layer includes than first connector away from farther second connector that is open.
29. electronic equipment according to claim 26 further includes frame, the frame be couple to first protective layer and
The metal tape.
30. electronic equipment according to claim 29 further includes support component, the support component is at least partially embedded
In the frame, the support component is located in the inner chamber to support the display assembly.
31. electronic equipment according to claim 30 further includes flexible circuit, the flexible circuit and the touch input
Layer electric coupling and mechanical coupling are simultaneously coupled with the support component with bonding way.
32. the electronic equipment according to any one of claim 26-31, wherein second protective layer includes transparent material
Material.
33. the electronic equipment according to any one of claim 26-31, wherein the display layer is around the power photosensitive layer
A part bending and bending.
34. the electronic equipment according to any one of claim 26-31, wherein
The display layer includes first edge region, and the first edge region has can be with the first flexible circuit electric coupling simultaneously
First connector of machinery coupling,
The power photosensitive layer includes second edge region, and the second edge region has can be with the second flexible circuit electric coupling simultaneously
Second connector of machinery coupling, and
The first edge region is vertical relative to the second edge region.
35. a kind of electronic equipment, comprising:
Protective layer, the protective layer are formed by transparent material；
Shell, the shell limit inner chamber；With
Display assembly, the display assembly are positioned at least partially in the inner chamber and couple with the protective layer,
The display assembly includes:
Display layer, the display layer are configured as that visual information is presented by the protective layer, and the display layer includes bending section,
Power photosensitive layer, the power photosensitive layer are configured as the size of the power detected to the protective layer, wherein the display layer is based on institute
Bending section is stated to bend around the power photosensitive layer, and
Embedding Material, the Embedding Material are couple to the display layer along the bending section.
36. electronic equipment according to claim 35, further includes:
Touch input layer, the touch input layer are configured as detecting to the touch input of the protective layer；
Flexible circuit, the flexible circuit and the touch input layer electric coupling and mechanical coupling, the flexible circuit is around institute
State display layer bending；With
Second Embedding Material, second Embedding Material are couple to the display layer and are positioned in the flexible circuit and described
Between display layer.
37. electronic equipment according to claim 36, wherein the display layer includes being covered by second Embedding Material
Metal trace.
38. electronic equipment according to claim 36, wherein the flexible circuit winds the display layer and the power is quick
Layer.
39. electronic equipment according to claim 35, wherein the protective layer includes recess, the recess is at least partly
Receive the display assembly.
40. the electronic equipment according to any one of claim 35-39, further includes:
Metal tape；With
Frame, the frame and the protective layer and the metal tape couple.
41. electronic equipment according to claim 40, further includes:
Support component, the support component are partly embedded in the frame and extend from the frame to support the display
Device assembly；With
Plate, the plate be positioned between the display layer and the support component and with the display layer and the support component
It is coupled with bonding way.
42. electronic equipment according to claim 40 further includes the second recess, second recess is formed in the frame,
Second recess receives the extension of the protective layer.
43. the electronic equipment according to any one of claim 35-39, further includes plate, it is quick that the plate is couple to the power
Layer is simultaneously at least partly surround by the display layer.
44. a kind of electronic equipment, comprising:
Protective layer, the protective layer are formed by transparent material；
Metal tape, the metal tape is in conjunction with the second protective layer to limit inner chamber；
Display assembly, the display assembly are covered by the protective layer, and protective layer and component at least partly position
In the inner chamber；
Frame, the frame are coupled with the protective layer and the metal tape with bonding way；With
Plate, the plate are oriented with recess, and the recess receives the display assembly, and the plate extends laterally beyond institute
It states frame and is positioned to engage the metal tape to protect at least one of the protective layer and the display assembly.
45. electronic equipment according to claim 44, wherein the frame includes the surface for receiving the protective layer, it is described
Surface has flat site and the textured ones different from the flat site.
46. electronic equipment according to claim 44, wherein the frame includes the surface for receiving the protective layer, it is described
Surface has flat site and the prominent features portion different from the flat site.
47. the electronic equipment according to any one of claim 44-46, further includes support component, the support component portion
It is embedded in the frame with dividing, the support component extends from the frame to support the display assembly.
48. electronic equipment according to claim 44 further includes support component, the support component extends from the frame
And it is positioned to support the display assembly.
49. electronic equipment according to claim 48, wherein the metal tape includes the side wall separated by nonmetallic materials
Component.
50. electronic equipment according to claim 49, wherein the nonmetallic materials include molded plastics.
51. the electronic equipment according to any one of claim 48-50, wherein the support component prolongs in a first direction
It stretches to support the display assembly, and wherein the support component extends in a second direction, so that the support component
Extend beyond the bottom surface of the protective layer.
52. the electronic equipment according to any one of claim 44 and 48-50, wherein the protective layer includes at least partly
Ground receives the recess of the display assembly.
53. a kind of electronic equipment, comprising:
Metal tape, the metal tape limit side member；
Bottom wall, the bottom wall and the side member are coupled to limit inner chamber；
Transparency protected covering, the transparency protected covering and the side member couple；
Display assembly, the display assembly are at least partially disposed in the inner chamber, with the transparency protected covering
Part coupling, the display assembly include:
Touch input layer, the touch input layer electric coupling are simultaneously mechanically coupled to flexible circuit,
Display layer, the display layer have bending region, and
Power photosensitive layer, wherein the flexible circuit winds the display layer and the power photosensitive layer, and wherein the buckled zone domain is extremely
Partially wind the power photosensitive layer.
54. the electronic equipment according to any one of claim 53 and 54, wherein the display layer electric coupling and mechanical coupling
It is connected to the second flexible circuit, and wherein the flexible circuit winds second flexible circuit.
55. electronic equipment according to claim 54, wherein the power photosensitive layer electric coupling and being mechanically coupled to third flexibility
Circuit.
56. electronic equipment according to claim 55, in which:
The display layer includes first edge region, and the first edge region has can be with the second flexible circuit thermocouple
The first connector of simultaneously mechanical coupling is connect,
The power photosensitive layer includes second edge region, and the second edge region has can be with the third flexible circuit thermocouple
The second connector of simultaneously mechanical coupling is connect, and
The first edge region is vertical relative to the second edge region.
57. the electronic equipment according to any one of claim 53-56, wherein the bottom wall includes transparent material.
58. the electronic equipment according to any one of claim 53-56, wherein side member restriction reception is described
The support construction of bright protection covering.
59. electronic equipment according to claim 58, wherein the support construction includes recess, the recess is at least partly
Ground receives the display assembly.
60. electronic equipment according to claim 58, wherein the support construction includes recess, the recess receives completely
The display assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210533859.3A CN114967975A (en) | 2016-09-22 | 2017-09-20 | Display module and glass with undercut plastic frame |
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
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| US201662398037P | 2016-09-22 | 2016-09-22 | |
| US201662398065P | 2016-09-22 | 2016-09-22 | |
| US201662398069P | 2016-09-22 | 2016-09-22 | |
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| US62/398,045 | 2016-09-22 | ||
| US62/398,069 | 2016-09-22 | ||
| PCT/US2017/052564 WO2018057652A1 (en) | 2016-09-22 | 2017-09-20 | Display module & glass with undercut plastic frame |
Related Child Applications (1)
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|---|---|---|---|
| CN202210533859.3A Division CN114967975A (en) | 2016-09-22 | 2017-09-20 | Display module and glass with undercut plastic frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109074190A true CN109074190A (en) | 2018-12-21 |
| CN109074190B CN109074190B (en) | 2022-05-24 |
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| CN202210533859.3A Pending CN114967975A (en) | 2016-09-22 | 2017-09-20 | Display module and glass with undercut plastic frame |
| CN201721209785.9U Active CN207340290U (en) | 2016-09-22 | 2017-09-21 | Circuit board assemblies, electronic equipment and circuit board assemblies for electronic equipment |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210533859.3A Pending CN114967975A (en) | 2016-09-22 | 2017-09-20 | Display module and glass with undercut plastic frame |
| CN201721209785.9U Active CN207340290U (en) | 2016-09-22 | 2017-09-21 | Circuit board assemblies, electronic equipment and circuit board assemblies for electronic equipment |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6775596B2 (en) |
| KR (2) | KR102289734B1 (en) |
| CN (3) | CN109074190B (en) |
| WO (1) | WO2018057652A1 (en) |
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| CN207340290U (en) | 2018-05-08 |
| JP6906666B2 (en) | 2021-07-21 |
| CN109074190B (en) | 2022-05-24 |
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| JP2020191124A (en) | 2020-11-26 |
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| KR20200128172A (en) | 2020-11-11 |
| JP6775596B2 (en) | 2020-10-28 |
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