KR102289734B1 - Display module and glass with undercut plastic frame - Google Patents

Abstract

An electronic device having a display assembly is disclosed. Several layers may be combined to form a display assembly. For example, a display assembly may include a touch-sensitive layer (or touch detection layer), a display layer that presents visual information, and a force-sensitive layer (or force detection layer). The display layer may include a flexure or flexure that allows a portion of the display layer to flex around the force-sensitive layer. Also, connectors (providing electrical and mechanical connections) may be positioned at different locations in the layers. For example, the display layer can include a connector on a first edge region, and the force-sensitive layer can include a connector on a second edge region perpendicular or at least substantially perpendicular to the first edge region. . By positioning the connectors on the vertical edge regions, the display assembly can reduce its footprint.

Description

DISPLAY MODULE AND GLASS WITH UNDERCUT PLASTIC FRAME

The following description relates to electronic devices. In particular, the following relates to an electronic device comprising a display assembly having several active layers. The display assembly is designed to bend or flex around the force-sensitive layer. Also, to increase the amount of space available in the electronic device, the electrical and mechanical connections of the active layers are positioned at different locations.

The electronic device may include a display assembly. When a display assembly includes multiple layers, the volume occupied by the display assembly increases, which may result in engineering and design changes to accommodate the increased volume. In addition, each of the layers requires electrical and mechanical connections. Additional design challenges can arise when electrical and mechanical connections are stacked on top of or close to each other.

In one aspect, a display assembly for an electronic device is described. The display assembly may include a touch-sensitive layer capable of detecting a touch input capable of controlling an electronic device. The display assembly may further include a force-sensitive layer capable of detecting an amount of force applied to the touch-sensitive layer. The display assembly may further include a display layer capable of presenting visual information. The display layer may be positioned at least partially between the touch-sensitive layer and the force-sensitive layer. In some embodiments, the display layer is at least partially curved around the force-sensitive layer.

In another aspect, an electronic device is described. The electronic device may include a protective layer formed of a transparent material. The electronic device may further include a display assembly covered by a protective layer. The display assembly may include a force-sensitive layer capable of detecting an amount of force applied to the protective layer. The display assembly may further include a display layer between the touch-sensitive layer and the force-sensitive layer. In some embodiments, the display is bent at least partially around the force-sensitive layer defining a bend. The electronic device may further include a frame supporting the protective layer. The frame may include a notch that at least partially receives the display at the bend.

In another aspect, a method of forming a display assembly for an electronic device is described. The method may include positioning the display layer between the touch-sensitive layer and the force-sensitive layer. The touch-sensitive layer may be configured to detect a touch input that controls the electronic device. The force-sensitive layer may be configured to detect an amount of force applied to the touch-sensitive layer. The method may further include bending the display layer such that the display layer is at least partially curved around the force-sensitive layer.

Other systems, methods, features and advantages of the embodiments will be or will become apparent to one of ordinary skill in the art upon examination of the following drawings and detailed description. It is intended that all such additional systems, methods, features and advantages be included within this specification and this summary, be within the scope of embodiments, and be protected by the following claims.

BRIEF DESCRIPTION OF THE DRAWINGS The present disclosure will be better understood by the following detailed description in conjunction with the accompanying drawings, in which like reference numerals designate like structural elements.
1 shows a front isometric view of one embodiment of an electronic device in accordance with some described embodiments.
FIG. 2 shows a rear isometric view of the electronic device shown in FIG. 1 , further showing additional features of the electronic device;
3 shows a partially exploded view of the electronic device shown in FIG. 1 , showing various components of the electronic device;
FIG. 4 shows a partially exploded view of the electronic device shown in FIG. 1 , further showing additional components of the electronic device;
FIG. 5 shows a cross-sectional view of the electronic device shown in FIG. 1 taken along line AA of FIG. 1 ;
6 shows a cross-sectional view of an alternative embodiment of an electronic device in accordance with some described embodiments.
FIG. 7 shows a cross-sectional view of the electronic device shown in FIG. 1 taken along line BB of FIG. 1 .
8 shows a cross-sectional view of an alternative embodiment of an electronic device in accordance with some described embodiments.
9 shows a top view of one embodiment of a frame in accordance with some described embodiments.
FIG. 10 shows a cross-sectional view of the frame shown in FIG. 9 taken along line AA.
11 depicts a cross-sectional view of an alternative embodiment of a frame, showing a surface of the frame with protruding features, in accordance with some described embodiments.
12 shows a cross-sectional view of one embodiment of an electronic device, showing the electronic device having a frame and a support element partially embedded within the frame and extending substantially into the frame;
13 shows a cross-sectional view of one embodiment of an electronic device, showing the electronic device having a protective cover and a sidewall component extending to provide additional support for the protective cover, in accordance with some described embodiments.
14 depicts a cross-sectional view of one embodiment of an electronic device, showing the electronic device with various structural enhancements, in accordance with some described embodiments.
15 depicts a top view of one embodiment of an electronic device, showing a plate positioned within an enclosure of the electronic device, in accordance with some described embodiments.
FIG. 16 shows a partial side view of the electronic device shown in FIG. 15 , further showing the display assembly and a first extension of the secured plate;
17 depicts a cross-sectional view of one embodiment of an electronic device, showing the electronic device having an enclosure and a support structure integrally formed with the enclosure, in accordance with some described embodiments.
18 shows a top view of one embodiment of a protective cover in accordance with some described embodiments.
19 shows a cross-sectional view of the protective cover shown in FIG. 18 taken along line BB, further showing a notch formed in the protective cover.
20 depicts a cross-sectional view of one embodiment of an electronic device, showing an enclosure and a secured protective cover (shown in FIGS. 18 and 19 ), in accordance with some described embodiments.
21 shows a cross-sectional view of one embodiment of an electronic device, showing a protective cover extending over the frame and positioned proximate to a sidewall component, in accordance with some described embodiments.
22 shows an exploded view of a battery in accordance with some described embodiments.
FIG. 23 shows a plan view of the first electrode shown in FIG. 22 .
24 shows a top view of an alternative embodiment of an electrode suitable for use in a battery assembly, in accordance with some described embodiments.
25 shows a top view of an alternative embodiment of an electrode suitable for use in a battery assembly, in accordance with some described embodiments.
26 shows a top view of an alternative embodiment of an electrode suitable for use in a battery assembly, in accordance with some described embodiments.
27 illustrates an embodiment of a battery of an electronic device, wherein the battery is shaped to receive an internal component of the electronic device, in accordance with some described embodiments.
28 illustrates an alternative embodiment of a battery assembly of an electronic device, wherein the battery assembly is shaped to receive multiple internal components of the electronic device, in accordance with some described embodiments.
29 illustrates an alternative embodiment of a battery assembly of an electronic device, wherein the battery assembly has an opening to receive an internal component of the electronic device, in accordance with some described embodiments.
30 illustrates an alternative embodiment of a battery assembly of an electronic device, wherein the battery assembly is positioned within an enclosure (of the electronic device) over a first internal component of the electronic device, in accordance with some described embodiments.
FIG. 31 shows a cross-sectional view of the electronic device shown in FIG. 30 taken along line CC of FIG. 30 .
32 shows an exploded view of the circuit board assembly shown in FIG. 4 in accordance with some described embodiments.
33 shows a cross-sectional view of the circuit board assembly shown in FIG. 32 showing various internal components of the circuit board assembly;
34 shows an alternative embodiment of a circuit board assembly, showing a modified circuit board assembly for ingress protection.
35 illustrates an alternative embodiment of a circuit board assembly, showing a circuit board assembly having a flex circuit electrically coupled with a circuit board of the circuit board assembly, in accordance with some described embodiments.
Fig. 36 shows a cross-sectional view of the circuit board assembly shown in Fig. 35, showing the flexible circuit extending between the circuit boards;
37 depicts a cross-sectional view of an alternative embodiment of a circuit board assembly showing internal components of the circuit board assembly having a corresponding geometry, in accordance with some described embodiments.
38 depicts a cross-sectional view of an alternative embodiment of a circuit board assembly, showing a circuit board assembly having several solder masks used to support the circuit board, in accordance with some described embodiments.
39 shows an isometric view of one embodiment of an audio module in accordance with some described embodiments.
FIG. 40 shows a cross-sectional view of the audio module shown in FIG. 39 taken along line DD of FIG. 39, showing several internal features;
41 shows a cross-sectional view of an electronic device, showing an audio module positioned within the electronic device;
42 shows an exploded view of a heat distribution assembly in accordance with some described embodiments.
43 shows a partial cross-sectional view of the electronic device shown in FIG. 1 showing a heat distribution assembly positioned within the electronic device;
44 illustrates a side view of an alternative embodiment of a heat distribution assembly in accordance with some described embodiments.
45 depicts an isometric view of an alternative embodiment of a heat distribution assembly, showing the heat distribution assembly modified to receive a component, in accordance with some described embodiments.
46 shows an isometric view of an alternative embodiment of a heat distribution assembly in accordance with some described embodiments.
47 shows a flow diagram illustrating a method of forming a display assembly for an electronic device in accordance with some described embodiments.
48 shows a flow diagram illustrating a method of forming a battery assembly for an electronic device in accordance with some described embodiments.
49 shows a flow diagram illustrating a method of forming a circuit board assembly in accordance with some described embodiments.
50 shows a flow diagram illustrating a method of assembling an electronic device including an enclosure defining an interior volume, in accordance with some described embodiments.
51 shows a flow diagram illustrating a method of manufacturing a heat distribution assembly for removing heat from a heat-generating component in an electronic device having an enclosure sidewall, in accordance with some described embodiments.
It is common practice for those skilled in the art, in accordance with common practice, that the various features of the drawings discussed below are not necessarily drawn to scale, and that the dimensions of the various features and elements in the drawings can be compared to the embodiments of the invention described herein. It will be appreciated and understood that it may be enlarged or reduced to illustrate more clearly.

Reference will now be made in detail to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalents that may be included within the spirit and scope of the described embodiments as defined by the appended claims.

DETAILED DESCRIPTION In the following detailed description, reference is made to the accompanying drawings, which form a part of the description and in which specific embodiments in accordance with the described embodiments are shown by way of illustration. Although these embodiments have been described in sufficient detail to enable a person skilled in the art to practice the described embodiments, these examples are not limiting, so that other embodiments may be used, and the spirit and scope of the described embodiments It is understood that changes may be made without departing from.

The following disclosure relates to an electronic device. Electronic devices may include several enhancements over traditional devices. For example, an electronic device may include an enclosure that defines an interior volume of the electronic device. The electronic device can further include a display that extends to the enclosure at at least some locations, thereby increasing the size of the display. The display may be part of a display assembly that further includes a touch-sensitive layer and a force-sensitive layer. To accommodate the increased display size, the electronic device may include a border (or frame) surrounding the display, wherein the frame has a reduced size. However, without specific modifications, the reduced size of the boundary may expose electrical and mechanical connections between the display assembly components (in the electronic device) and the flexible circuits. In this regard, some components of the display assembly may be electrically and mechanically coupled with their respective circuitry (including flexible circuits) at different locations throughout the electronic device to hide electrical and mechanical connections from view. there is. For example, the touch-sensitive layer and the display may electrically and mechanically couple their respective circuitry at one location inside the electronic device, while the force-sensitive layer may be the touch-sensitive layer, the display, and their respective individual circuitry. electrically and mechanically engage circuitry at a different location away from the electrical and mechanical connections between the flexible circuits of Also, by routing the electrical and mechanical connections to different locations, the volume occupied by the display assembly (and its components) can be reduced, and additional space in the internal volume of the electronic device is available for different component(s) within the electronic device. can be used by

The electronic device may further include a circuit board assembly designed to occupy less space within the electronic device. For example, the circuit board assembly may be divided into a first circuit board stacked on a second circuit board. A stacked configuration of multiple circuit boards (one stacked on top of the other) can reduce the footprint of a circuit board assembly in two dimensions. Further, the circuit boards described above may include operative components (such as integrated circuits or processor circuits) positioned on multiple opposing surfaces. In addition, the circuit board assembly comprises several interposers or mutually designed to transfer signals between the first and second circuit boards such that the first and second circuit boards (as well as their respective operating components) communicate with each other. Connections may be included.

In some cases, the stacked circuit board assembly includes an operative component (located on one of the circuit boards) that includes a recess, and an additional operative component that includes a protrusion (or protruding feature) partially positioned within the recess. (located on one of the other circuit boards). In this way, the circuit boards may be positioned closer together based on the recess to receive a portion of the additional operative component, thereby further reducing the footprint of the stacked circuit board assembly. Also, in some cases, operating components may be electrically coupled to each other. For example, the recess may include a connector and the protrusion may include a connector that electrically couples to a connector in the recess. As a result of the electrical connection between the operative components, the circuit boards may also be in electrical communication with each other. This may reduce the requirement for separate dedicated electrical connectors used to electrically couple the circuit boards.

The electronic device may further include a battery assembly or an internal power source. Due in part to modifications of the display assembly and circuit board assembly that create additional space within the enclosure, the battery assembly may increase in size and occupy at least a portion of the additional space, thereby increasing the charging capacity of the battery assembly. can In addition, the battery assembly may include a shape other than the conventional straight shape. For example, the battery assembly may include an L-shaped configuration formed by die cutting several electrodes into an L-shaped configuration similar to the L-shaped configuration of the battery assembly to form the battery assembly. Additionally, additional components such as antennas and circuitry may be repositioned in the electronic device to increase the size of the battery assembly. The battery assembly may also include modifications, such as channels, designed to accommodate flexible circuits routed across the battery assembly, particularly across channels.

Also, in some cases, the enclosure may include a metal band that engages a transparent protective layer (eg, a cover glass) covering the display assembly. The metal band may comprise a metal such as aluminum or a metal alloy comprising aluminum. The enclosure may further include an additional protective layer associated with the metal band. The additional protective layer may include a non-metallic material such as glass, sapphire, plastic, or the like. The additional protective layer may substantially define a back or bottom wall of the electronic device. Therefore, the ability of the enclosure to dissipate and dissipate heat from the electronic device is limited as the amount of metal used in the enclosure is limited to the metal band, and glass contains a significantly lower thermal conductivity compared to the metal forming the metal band. can be

When one or more components (eg, integrated circuits) of an electronic device generate heat, it may be necessary to remove heat from the interior volume to prevent damage to the component (or components) of the electronic device. . In this regard, the electronic device may include a heat distribution assembly disposed relative to or near the additional protective layer. The heat distribution assembly is designed to dissipate (or redistribute) the thermal energy generated from the heat-generating component(s) to the metal band so that the thermal energy is dissipated in the electronic device. The heat distribution assembly may include several metal layers, one of which may include a relatively high thermal conductivity (as compared to the rest of the layers). Accordingly, the electronic device may include an enclosure having a bottom wall made of glass, which may improve the overall aesthetic of the electronic device, while the temperature inside the electronic device may increase to cause any of the electronic device's internal components. It also has the ability to remove heat from the electronic device before causing damage to the components. In addition, the layers of relatively low thermal conductivity may prevent or limit heat energy reaching the user of the electronic device while maintaining the electronic device by preventing heat transfer to the glass bottom wall.

Further, when a user interacts with the display assembly, the force-sensitive layer may determine an amount of force applied on the display to generate a command according to the determined amount of force. However, a force applied to the display assembly (via the protective layer covering the display assembly) may bend the display assembly and the protective layer, thereby reducing the interior volume and increasing the interior air pressure. The increased internal air pressure may affect other components, such as an audio module, designed to generate acoustic energy. In order to shield the audio module from increased atmospheric pressure, the audio module includes a housing or enclosure that encloses the components of the audio module including the rear volume of the audio module, providing shielding from air within the interior volume of the electronic device, thus It is possible to shield the rear volume of the audio module from pressure changes within the electronic device. In this way, the audio module is unaffected by pressure changes within the electronic device and generates acoustic energy without disturbance due to pressure changes.

These and other embodiments are discussed below with reference to FIGS. 1-51 . However, those skilled in the art will readily recognize that the specific details for carrying out the invention provided herein with respect to these drawings are for illustrative purposes only and should not be construed as limiting.

1 shows a front isometric view of one embodiment of an electronic device 100 in accordance with some described embodiments. In some embodiments, electronic device 100 is a tablet computer device. In other embodiments, the electronic device 100 is a wearable electronic device including one or more straps (not shown) designed to wrap around an appendage (such as a wrist) of a user to secure the electronic device 100 to the user. It is a device. In the embodiment shown in FIG. 1 , the electronic device 100 is a mobile communication device such as a smartphone. Accordingly, the electronic device 100 enables wireless communication in the form of, as non-limiting examples, cellular network communication, Bluetooth communication (2.4 GHz), and/or wireless local area network (WLAN) communication (2.4 GHz to 5 GHz). can do it As shown, the electronic device 100 can include a display assembly 102 that includes a display layer designed to present visual information in the form of text information, still images, and/or video information. Although not shown, the display assembly 102 may further include a touch-sensitive layer designed to detect touch input to the display assembly 102 , for example, to control information presented on the display assembly 102 . there is. In addition, the display assembly 102 may further include a force-sensitive layer designed to detect an amount of force applied to the display assembly 102 . The determined amount of force may correspond to a particular input or command to processor circuitry (not shown) that controls the display assembly 102 . For example, different amounts of detected force may correspond to different or separate commands.

To protect the display assembly 102 , the electronic device 100 may include a first protective layer 104 that overlays the display assembly 102 . A second protective layer (not shown) of the electronic device 100 will be shown and discussed below. The first protective layer 104 may include transparent material(s) including, but not limited to, glass, sapphire, or plastic. As shown, the first protective layer 104 may include openings that facilitate user interaction with the electronic device 100 . For example, the first protective layer 104 may include a first opening 106 and a second opening 108 . The electronic device 100 may include an image capture device (not shown) that captures an image (or images) through the first opening 106 . The electronic device 100 may further include an audio module (not shown) that generates acoustic energy in the form of an audible sound that exits the electronic device 100 through the second opening 108 .

Further, the electronic device 100 may include a band 110 defining an outer periphery of the electronic device 100 . In general, the band 110 includes a shape similar to that of a four-sided ring. However, other shapes are possible. The band 110 may also define a plurality of sidewalls and openings to at least partially receive and secure the first protective layer 104 and the second protective cover (not shown) thereto. In some embodiments, band 110 comprises a metal such as aluminum or an alloy comprising aluminum. In this regard, band 110 may provide a rigid support structure for electronic device 100 . Also, when band 110 is formed of metal, band 110 may include several sidewalls, some of which are used to support wireless communication. For example, band 110 may include a first sidewall component 112 that forms a U-shaped design as well as a second sidewall component 114 that also forms a U-shaped design. The first sidewall component 112 and the second sidewall component 114 function together with wireless circuitry (not shown) of the electronic device 100 , respectively, to provide the first sidewall component 112 and the second sidewall component 114 , respectively. each may form at least part of an antenna for their respective radio circuits. For example, the first sidewall component 112 may function in conjunction with a WLAN radio circuit and the second sidewall component 114 may function in conjunction with a cellular network radio circuit.

Further, the band 110 may further include a third sidewall component 116 and a fourth sidewall component 118 , wherein the third sidewall component 116 and the fourth sidewall component 118 are divided into divided regions. separated from both the first sidewall component 112 and the second sidewall component 114, or from the opening by For example, the band 110 may include a first divided region 122 and a second divided region that combine to separate the third sidewall component 116 from the first sidewall component 112 and the second sidewall component 114 . 124) may be included. The band 110 also has a third divided region 126 and a fourth divided region 128 that combine to separate the fourth sidewall component 118 from the first sidewall component 112 and the second sidewall component 114 . may include. The aforementioned partitions may be filled with a non-metallic material, such as molded plastic (or other non-conductive material), to provide a coplanar surface flush with the various portions of the band 110 . Once the first sidewall component 112 and the second sidewall component 114 are electrically insulated from the third sidewall component 116 and the fourth sidewall component 118, the first sidewall component 112 and the second sidewall component ( 114 can function as part of an antenna, while third sidewall component 116 and fourth sidewall component 118 are electrically coupled with third sidewall component 116 and fourth sidewall component 118, respectively. May serve as an electrical ground for one or more internal components (not shown). Further, each of the first sidewall component 112 , the second sidewall component 114 , the third sidewall component 116 , and the fourth sidewall component 118 each provides a protective structural component for at least some internal components as well. Rather, it may provide heat dissipation and heat removal for some heat-generating components (not shown) of the electronic device 100 , wherein the heat-generating components are thermally coupled with at least one of the aforementioned components. that is provided Further, the first sidewall component 112 , the second sidewall component 114 , the third sidewall component 116 , and the fourth sidewall component 118 are respectively a first sidewall, a second sidewall, a third sidewall, and a second sidewall component. At least a portion of the 4 sidewalls may each be represented.

The electronic device 100 may further include one or more input devices. For example, the electronic device 100 includes a first button 130 designed to generate an input when pressed. The input can generate an electrical signal that is sent to processor circuitry (not shown) in the electronic device 100 to change the visual information presented on the display assembly 102 . As shown, the first button 130 is positioned along the third sidewall component 116 . However, other positions are possible. Also, although not shown, the electronic device 100 may include a switch designed to provide an additional user input function.

In addition, the electronic device 100 may further include a data port 132 designed to receive and electrically couple a cable assembly (not shown). The data port 132 may receive data/communications from the cable assembly as well as electrical energy for charging a battery assembly (not shown) located in the electronic device 100 . In addition, the electronic device 100 may include an additional opening designed for various user interactions. For example, the electronic device 100 can include an audio module (not shown) positioned near an opening 134 or a through hole, formed in the second sidewall component 114 . The opening 134 allows acoustic energy generated from the audio module to exit the electronic device 100 . Further, the electronic device 100 can further include a microphone (not shown) positioned near the opening 136 or through hole, formed in the second sidewall component 114 . The microphone may be positioned to receive acoustic energy through the opening 136 .

FIG. 2 shows a rear isometric view of the electronic device 100 shown in FIG. 1 , further illustrating additional features of the electronic device 100 . As shown, the electronic device 100 may include a band 110 and a fixed second protective layer 144 . The second protective layer 144 may be combined with the band 110 to form an enclosure including, by way of non-limiting examples, an interior volume or cavity that houses several internal components such as circuit boards, integrated circuits, and a battery assembly. can be defined In this regard, the band 110 may include a first edge region that receives the first protective layer 104 (shown in FIG. 1 ) as well as a second edge region that receives the second protective layer 144 . where the first edge region and the second edge region are opposite to the band 110 , or at opposing positions. The second protective layer 144 may also be referred to as a bottom wall or a back wall.

In general, the second protective layer 144 may include a material (or materials) that provides an aesthetic finish, such as glass, sapphire, or plastic. Also, in some cases, the material composition of the second protective layer 144 is such that radio frequency (“RF”) communication generated from internal wireless circuits (not shown) of the electronic device 100 is achieved by the second protective layer 144 . ) through which it can be permeated. In this way, the electronic device 100 may wirelessly communicate with other devices (not shown) via RF communication that is not substantially suppressed by the second protective layer 144 .

In addition, the second protective layer 144 may include openings that facilitate user interaction with the electronic device 100 . For example, the second protective layer 144 may include a first opening 146 and a second opening 148 . The electronic device 100 may include an image capture device (not shown) that captures an image (or images) through the first opening 146 . The electronic device 100 may further include a flash module (not shown) aligned with the second opening 148 , wherein the flash module enhances the image quality of the image(s) captured by the image capture device. to generate light energy passing through the second aperture 148 during an image capture event from the image capture device. Also, in addition to the first button 130 (shown in FIG. 1 ), the electronic device 100 has a second button 150 designed to generate an input when pressed in a manner similar to that for the first button 130 . ) may be additionally included. As shown, the second button 150 is positioned along the fourth sidewall component 118 . However, other positions are possible.

FIG. 3 shows a partially exploded view of the electronic device 100 shown in FIG. 1 , showing various components of the electronic device 100 . Several features of electronic device 100 are not shown for simplicity. As shown, the first protective layer 104 may overlay the display assembly 102 . In addition, the first protective layer 104 may be adhesively fixed to the display assembly 102 by an adhesive layer (not shown).

As shown, the display assembly 102 includes a touch-sensitive layer 202 designed to receive touch input, a display layer 204 designed to present visual information, and a first protective layer 104 , the touch-sensitive layer. 202 , and a force-sensitive layer 206 designed to detect an amount of force applied to or applied to the display layer 204 by a force applied to at least one of the display layers 204 . can Also, although not shown, the display assembly 102 is configured to adhesively secure the touch-sensitive layer 202 with the display layer 204 and for adhesively secure the display layer 204 with the force-sensitive layer 206 . Adhesive layers may be included.

The touch-sensitive layer 202 is designed to receive a touch input, for example, when a user (not shown) presses the first protective layer 104 . The touch-sensitive layer 202 may include capacitive touch-sensitive technology. For example, the touch-sensitive layer 202 may include a layer of a capacitive material that retains an electric charge. The layer of capacitive material is designed to form part of a plurality of capacitive parallel plates throughout the location corresponding to the display layer 204 . In this regard, when the user touches the first protective layer 104 , the user forms one or more capacitors. In addition, the user causes a voltage drop across the one or more capacitors, which in turn causes the charge of the capacitive material to change at a particular point (or points) of contact that corresponds to the location of the user's touch input. The capacitance change and/or voltage drop may be measured by the electronic device 100 to determine the location of the touch input. In addition, the touch-sensitive layer 202 can include an edge region 226 that includes a connector (described below).

In some embodiments, the display layer 204 includes a liquid crystal display (“LCD”) that relies on a backlight to present visual information. 3 , the display layer 204 comprises an organic light emitting diode (“OLED”) display designed to illuminate individual pixels when needed. When the display layer 204 includes OLED technology, the display layer 204 may include a reduced form factor compared to the form factor of an LCD display. In this regard, the display assembly 102 may include a smaller footprint, thereby creating more space for other components, such as a battery assembly (shown below). Also, when the display layer 204 comprises OLED technology, the display layer 204 can be bent or bent without causing damage to the display layer 204 . For example, as shown in FIG. 3 , the display layer 204 includes a bend 208 . The bend 208 may include a 180 degree bend or an approximately 180 degree bend. The bend 208 causes the display layer 204 to bend or flex around at least a portion of the force-sensitive layer 206 , as shown in FIG. 3 . In addition, the display layer 204 is a flexible circuit (not shown) that electrically couples a circuit board assembly (shown below) and a connector (shown below) used to electrically and mechanically couple the display layer 204 . not included), wherein the flex circuitry places the display layer 204 in communication with the circuit board assembly. Further, in some embodiments, the display layer 204 may include an active matrix organic light emitting diode (“AMOLED”) display. Also, as shown in FIG. 3 , the edge region 226 of the touch-sensitive layer 202 is the edge region 210 of the display layer 204 even when the display layer 204 includes a bend 208 . parallel or at least substantially parallel to

The force-sensitive layer 206 may operate by determining an amount of force or pressure applied to the first protective layer 104 , the touch-sensitive layer 202 , and/or the display layer 204 . In this regard, the force-sensitive layer 206 may distinguish between different amounts of force applied to the electronic device 100 . Different amounts of force may correspond to different user inputs. The force-sensitive layer 206 may include a plurality of parallel capacitor plate arrays, with one plate of each capacitor plate array having a charge. If the force on the first protective layer 104, the distance between the first protective layer 104 and the one or more pairs of the parallel plate capacitor is reduced, thereby reducing the change in capacitance between the one or more pairs of the parallel plate capacitor. cause The amount of change in capacitance corresponds to the amount of force applied to the first protective layer 104 . Also, as shown in the enlarged view, the force-sensitive layer 206 may include a connector 218 positioned on an edge region 220 of the force-sensitive layer 206 , with the edge region 220 . ) is perpendicular or at least substantially perpendicular to the edge region 210 of the display layer 204 and the edge region 226 of the touch-sensitive layer 202 . Accordingly, the connector 218 may be positioned perpendicular or at least substantially perpendicular to the connector (shown below) of the display layer 204 .

Further, to support the first protective layer 104 and to facilitate assembling the first protective layer 104 with the band 110 (shown in FIG. 1 ), the electronic device 100 includes the first protective layer and a frame 154 that receives and secures 104 therewith by an adhesive layer 166 . Accordingly, the frame 154 may include a size and shape that conforms to the size and shape of the first protective layer 104 . Frame 154 may be positioned at least partially between first protective layer 104 and band 110 . Frame 154 may be formed of a polymer material, such as plastic, and may also include a metal ring (not shown) partially embedded in the polymer material during an insert molding operation. In this regard, the frame 154 may structurally support the first protective layer 104 as well as one or more components of the display assembly 102 . This will be shown below.

FIG. 4 shows a partially exploded view of the electronic device 100 shown in FIG. 1 , further showing additional components of the electronic device 100 . Several features of electronic device 100 are not shown for simplicity. As shown, the band 110 and the second protective layer 144 can be combined to provide an interior volume 152 for several internal components. For example, the electronic device 100 may include a battery assembly 160 designed to distribute current to operating components of the electronic device 100 . Battery assembly 160 may include a rechargeable battery designed to receive current during recharging. For example, the electronic device 100 may include an inductive receiver coil 162 (formed from a metal such as steel) electrically coupled to a battery assembly 160 . The inductive receiver coil 162 may receive an induced current from the alternating magnetic field when placed in proximity to an alternating magnetic field from a device (not shown) external to the electronic device. The induced current from the inductive receiver coil 162 passes through a transformer to convert alternating current to direct current, which is then used to charge (or recharge) the battery assembly 160 . In addition, the second protective layer 144 provides little or no impedance to the external magnetic field, thereby allowing the alternating magnetic field to reach the inductive receiver coil 162 .

In addition, the battery assembly 160 may further include a channel 164 comprising a reduced dimension (eg, from Cartesian coordinates to a z-dimension), whereby a flexible circuit (not shown) and The same component extends along the battery assembly 160 and passes over the battery assembly 160 along the channel 164 . Due in part to the increased space provided by the channel 164 , other internal components, such as an antenna element (not shown), may be repositioned in the internal volume 152 of the electronic device 100 , whereby the battery It may create additional space for assembly 160 . In this way, the volume (size) of the battery assembly 160 can be increased, and the increased volume causes the battery assembly 160 to increase its electrical storage capacity, so that the electronic device 100 can increase the battery assembly 160 . may provide for longer use of the electronic device 100 between charging events of

The electronic device 100 can further include a circuit board assembly 170 that includes a number of operative components. As shown, the circuit board assembly 170 may include a first circuit board 172 and a second circuit board 174 , wherein the first circuit board 172 is above the second circuit board 174 . are stacked In this way, the circuit board assembly 170 may conserve space in the x- and y-dimensions within the interior volume 152 . Additionally, the first circuit board 172 and the second circuit board 174 may include multiple surfaces, each of which is designed to support one or more components (eg, processor circuits). . Various features of circuit board assembly 170 will be discussed below.

The electronic device 100 may further include a first audio module 182 and a second audio module 184 both designed to generate acoustic energy in the form of audible sound. Each of the audio modules may include an opening for emitting acoustic energy. However, each audio module is designed to include an acoustic volume (defined by their respective audio modules) that is isolated from the internal volume 152 of the electronic device 100 . In this way, the inner volume 152 changes by pressing and bending the first protective layer 104 (shown in FIG. 3 ), for example, to provide touch input and/or force input to the electronic device 100 . When done, the audio modules are not affected (acoustically) from changes in the internal volume 152 and the associated increased air pressure within the internal volume 152 . This will be discussed further below.

The electronic device 100 may further include a heat distribution assembly 190 . Although not shown, the heat distribution assembly 190 may include several layers of material. In some embodiments, the material layers are different. For example, some layers are formed of a first type of material, while other layers are formed of a second type of material that is different from the first type of material. The first type of material may include a material having a relatively high thermal conductivity. As an example, a first type of material may include copper, which is known to have a thermal conductivity of approximately 400 W/m*K (watts per meter per Kelvin). Alternatively, the first type may include graphite, which is known to have a thermal conductivity of about 170 W/m*K. Thus, the first type material is very useful in facilitating removal of thermal energy from electronic device 100 by receiving thermal energy and transferring or distributing thermal energy from one location of electronic device 100 to another. Suitable. The second type of material may include a more robust material such as stainless steel. In this regard, the second type of material may comprise a relatively lower thermal conductivity. However, the second type of material may include 1) a protective cover for the first type material, 2) structural support for the electronic device 100 , and/or 3) the heat distribution assembly 190 , for example by a welding operation. can be used to provide a workable surface for fixing components (not shown). The various layers of the heat distribution assembly 190 will be described further below.

The heat distribution assembly 190 is designed to redirect or redistribute heat generated within the electronic device 100 . For example, circuit board assembly 170 may include operational components such as integrated circuits that are known to convert electrical energy (supplied by battery assembly 160 ) into thermal energy during operation. The heat distribution assembly 190 may be thermally coupled to the circuit board assembly 170 by contact between the heat distribution assembly 190 and the circuit board assembly 170 by way of non-limiting example. In addition, the heat distribution assembly 190 may be thermally coupled to the band 110 such that thermal energy received by the heat distribution assembly 190 from the circuit board assembly 170 may be at least partially transferred to the band 110 . can Accordingly, at least some of the thermal conductivity lost by using the second protective layer 144 (non-metal) by using the heat distribution assembly 190 is restored. Further, the heat distribution assembly 190 may include a size and shape according to the second protective layer 144 such that the heat distribution assembly 190 covers or at least substantially covers the surface of the second protective layer 144 . . For example, the x-dimensions and y-dimensions of the heat distribution assembly 190 may be the same or substantially similar to the x-dimensions and y-dimensions of the second protective layer 144 , respectively.

Although not shown, the electronic device 100 may include additional components such as, as non-limiting examples, a haptic engine and an internal antenna. Also, although not shown, the electronic device 100 includes several components that place electronic components (eg, the display assembly 102 , the circuit board assembly 170 ) in electrical communication with each other as well as the battery assembly 160 . It may include flexible circuits.

FIG. 5 shows a cross-sectional view of the electronic device 100 shown in FIG. 1 taken along line A-A of FIG. 1 . As shown, the layers of the display assembly 102 - the touch-sensitive layer 202 , the display layer 204 , and the force-sensitive layer 206 - are assembled. Although not shown, the display assembly 102 includes an adhesive layer for adhesively securing the touch-sensitive layer 202 with the display layer 204 and adhesively securing the display layer 204 with the force-sensitive layer 206 . may include

The touch-sensitive layer 202 is designed to receive a touch input, for example, when a user (not shown) presses the first protective layer 104 . Touch input is received from the touch-sensitive layer 202 by a first flexible circuit 212 electrically and mechanically coupled to the touch-sensitive layer 202 by a connector 222 of the touch-sensitive layer 202 . may be relayed to the circuit board assembly 170 (shown in FIG. 4 ). The connector 222 may be positioned on the edge region 226 (shown in FIG. 3 ) of the touch-sensitive layer 202 . As shown, the first flexible circuit 212 can be bent or curved around the display layer 204 and the force-sensitive layer 206 to electrically and mechanically couple the touch-sensitive layer 202 . there is.

Frame 154 may include design considerations to accommodate display assembly 102 . For example, the frame 154 may include a notch 156 or undercut region designed to at least partially receive the first flexible circuit 212 and/or the display layer 204 . As shown in FIG. 5 , the notch 156 includes a size and shape to accommodate both the flex/curve region of the first flexible circuit 212 as well as the display layer 204 . The notch 156 generally includes a curvature corresponding to the curvature of the first flex circuit 212 and display layer 204 , although other shapes including a straight edge are possible for the notch 156 . Also, the notch 156 may be formed during the forming operation of the frame 154 . Alternatively, the notch 156 may be formed after a forming operation, for example by a cutting operation.

The frame 154 is also adhesively secured with the first protective layer 104 (of the band 110 shown in FIG. 1 ) and the second sidewall component 114 by adhesive layers (unlabeled). The frame 154 may include a support element 158 partially embedded within the frame 154 . In some embodiments, support element 158 includes a ring formed of a metallic material that extends continuously around display assembly 102 along frame 154 . However, the support element 158 may also be discontinuous and thus may be selectively embedded within the frame 154 . As shown, support element 158 may extend along frame 154 to support display assembly 102 and first protective layer 104 . Also, the first flexible circuit 212 may be adhesively secured to the support element 158 by an adhesive layer (unlabeled).

5 further shows some components of the display assembly 102 coupled with the flex circuits in one location, but not other components. For example, the touch-sensitive layer 202 is electrically and mechanically coupled to the first flexible circuit 212 by a connector 222 , and the display layer 204 is a second flexible circuit 212 by a connector 224 . Electrically and mechanically coupled to the sex circuit 214 , with the connector 222 and connector 224 positioned adjacent the second sidewall component 114 (in a U-shaped configuration as shown in FIG. 1 ). defined). Connectors 218 (shown in FIG. 3 ) of force-sensitive layer 206 are positioned along different edge regions of force-sensitive layer 206 (see FIG. 3 ). In addition, connector 222 and connector 224 electrically and mechanically engage first flex circuit 212 and second flex circuit 214 at positions proximate to notch 156 in frame 154 , respectively. However, the force sensitive layer 206 is not. Also, the connector 222 may be positioned parallel or at least substantially parallel to the connector 224 . The force-sensitive layer 206 may electrically and mechanically couple electrically and mechanically to a flex circuit (not shown) at another discrete location (such as the connector 218 on the edge region 220 shown in FIG. 3 ). there is. This will be shown and described below.

6 shows a cross-sectional view of an alternative embodiment of an electronic device 250 in accordance with some described embodiments. Electronic device 250 may include any feature(s) or component(s) previously described for an electronic device. For example, the electronic device 250 can include a display assembly 252 that includes a touch-sensitive layer 262 , a display layer 264 , and a force-sensitive layer 266 . However, as shown in FIG. 6 , the display layer 264 may comprise a substantially planar configuration throughout the display layer 264 , wherein the flex circuit 274 is electrically connected to the display layer 264 . and bent around the force-sensitive layer 266 to mechanically engage.

FIG. 7 shows a cross-sectional view of the electronic device 100 shown in FIG. 1 taken along line B-B of FIG. 1 . As shown, the connector 218 (also shown in FIG. 3) of the force-sensitive layer 206 is a third flexible circuit (shown in FIG. 4) that electrically couples with the circuit board assembly 170 (shown in FIG. Electrically and mechanically couple 216 and force-sensitive layer 206 to place force-sensitive layer 206 in communication with circuit board assembly 170 . Additionally, the third flexible circuit 216 may be adhesively secured to the support element 158 by an adhesive layer (unlabeled).

As shown in Figure 7, only the force-sensitive layer 206 includes electrical and mechanical connections with the flex circuit. In other words, the connector 218 that provides electrical and mechanical connections between the force-sensitive layer 206 and the third flex circuit 216 is the connector 222 of the touch-sensitive layer 202 (shown in FIG. 5 ). in a different location of the electronic device 100 compared to the connector 224 (shown in FIG. 5 ) of the display layer 204 ). Further, based on the positions of the respective edge regions, the connector 218 of the force-sensitive layer 206 is connected to the connector 222 of the touch-sensitive layer 202 and the connector 224 of the display layer 204 . positioned perpendicular or at least substantially perpendicular to the

The connector 218 also includes a third sidewall component 116 (also shown in FIG. 1 ) defined in part as a sidewall that is perpendicular or approximately perpendicular to a portion of the second sidewall component 114 (shown in FIGS. 1 and 5 ). shown in ) is close to As a result, frame 154 may not require notch 156 (shown in FIG. 5 ) to receive display layer 204 and first flex circuit 212 (shown in FIG. 5 ). there is. Accordingly, frame 154 may include an asymmetric frame. Additionally, the additional material of the frame 154 may allow for additional structural rigidity to support the display assembly 102 and the first protective layer 104 .

8 shows a cross-sectional view of an alternative embodiment of an electronic device 300 in accordance with some described embodiments. Electronic device 300 may include any feature(s) or component(s) previously described for electronic devices. For example, the electronic device 300 may include a display assembly 302 and a fixed first protective layer 304 , and a frame 354 supporting the first protective layer 304 . However, the first protective layer 304 can include an extension 306 that extends at least partially radially outwardly from the first protective layer 304 in a circumferential fashion. To receive the extension 306 , the frame 354 may include a notch 366 to receive the extension 306 . The extensions 306 provide additional structural profile to the first protective layer 304 , and may also provide additional surface area for adhesively bonding the first protective layer 304 to the frame 354 . For example, as shown in FIG. 8 , the first protective layer 304 includes an extension 306 in an area defined in part by the interface between the frame 354 and the first protective layer 304 . It is adhesively secured to the frame 354 by an adhesive layer 362 extending through it. Further, the distance or gap between the frame 354 and the first protective layer 304 (including the extension 306 ) may cause the adhesive layer 362 to extend through the interface region by capillary force. . As a result, the frame 354 has a first protective layer with multiple (vertical) surfaces to form a stronger adhesive bond that opposes or offsets a force against the electronic device 300 in multiple directions. (304) and adhesively fixed.

9 shows a top view of one embodiment of a frame 454 in accordance with some described embodiments. As shown, frame 454 can include a support element 458 that can include a metal ring molded into frame 454 . Frame 454 may be implemented with one or more of the electronic devices described herein, and may include any of the features previously described for the frame. To improve adhesion between an adhesive (not shown) and the surface 462 of the frame 454, the surface 462 may include certain modifications. For example, as shown in the enlarged view, surface 462 can include textured regions 464 designed to increase the surface tension or surface energy of surface 462 . The textured area 464 is formed between the frame 454 and the transparent cover (eg, the first protective layer 104 shown in FIG. 5 ) by an adhesive (eg, the adhesive layer 166 shown in FIG. 5 ). Adhesive bonding can be improved.

FIG. 10 shows a cross-sectional view of frame 454 shown in FIG. 9 taken along line A-A. As shown, textured region 464 may include a number of dimples or divots formed in frame 454 along surface 462 . The textured area 464 provides additional surface area for the adhesive described above. Several different processes may be used to form the textured region 464 . For example, a forming tool (not shown) used to form frame 454 may include protruding features that include a shape corresponding to the shape of textured region 464 . Alternatively, frame 454 may be formed with a forming tool that does not include protruding features, and following a forming operation to form frame 454 , for example, surface 462 may be etched by a laser to A textured region 464 may be formed. Also, while textured region 464 defines several dimples or divots formed in frame 454 , several shapes other than dimples or divots are possible. For example, textured region 464 may include several recesses, linear and/or non-linear.

11 shows a cross-sectional view of an alternative embodiment of frame 554 , showing surface 562 of frame 554 with protruding features 564 , in accordance with some described embodiments. Frame 554 may include any of the features previously described for the frame. In this regard, surface 562 may be used to receive a transparent cover (eg, first protective layer 104 shown in FIG. 5 ) with an adhesive (eg, adhesive layer 166 shown in FIG. 5 ). there is. As shown, protruding features 564 may extend from surface 562 . The frame 554 , particularly the protruding features 564 , may be formed by a forming tool (not shown) that includes an insert designed to withdraw a portion of the forming material (used to form the frame 554 ) and , thereby causing the protruding features 564 to extend from the surface 562 . The protruding features 564 provide additional surface area for the adhesive described above.

12 shows an electronic device 700 having a frame 754 and a support element 758 that is partially embedded within the frame 754 and extends substantially into the frame 754 . A cross-sectional view of an embodiment is shown. Electronic device 700 may include any of the features described herein for an electronic device. Also similar to previous embodiments, the support element 758 may include a ring formed of a metallic material that extends around the display assembly 702 of the electronic device 700 and along the frame 754 . As shown, the support element 758 can extend beyond the display assembly 702 and beyond the protective cover 704 in the z-dimension (with the first protective layer 104 shown in FIG. 1 ). similar).

To further extend the support element 758 in the z-dimension, the frame 754 can be widened in the y-dimension. Further, the dimensions of the sidewall component 714 (similar to the second sidewall component 114 shown in FIG. 1 ) of the electronic device 700 may be reduced in y-dimension to offset the increased dimension of the frame 754 . there is. Further, the material(s) forming the frame 754 may be modified to accommodate the support element 758 . For example, the frame 754 may include a nylon material mixed with a glass filler that enhances the overall strength and stiffness of the frame 754 . However, in some embodiments, frame 754 is formed of ceramic. In this regard, sidewall component 714 as well as any remaining sidewall components may also be formed of ceramic.

When the support element 758 extends in the manner described, other factors must be considered. For example, in some cases sidewall component 714 forms part of an antenna assembly (not shown) that includes an antenna component designed to provide wireless communication for electronic device 700 . The support element 758 may cause some interference with the antenna component when formed from metal. This may include forming a parallel plate capacitor between the antenna assembly (including the sidewall component 714 ) and the support element 758 . Accordingly, the size, shape, material, and location of the support element 758 should be considered to avoid unwanted interference. It should be noted that additional techniques may be used to optimize the size of the support element 758 proximate the sidewall component 714 . This may include, for example, reducing the z-dimension of the support element 758 and/or providing an opening or discontinuity in the support element 758 .

The electronic device 700 can include a surface 762 that receives and adhesively engages the protective cover 704 . Surface 762 may include dimensions 766 that provide a generally flat surface. However, in some embodiments, surface 762 is modified to improve adhesive bonding with protective cover 704 . The frame 754 also includes a notch 756 formed in the frame 754 that allows the frame 754 to receive the display assembly 702 including the flexible circuits and flexible layers of the display assembly 702 or It may contain undercuts. The notch 756 may be resized (eg, increased) based on the increased dimensions of the frame 754 . However, by increasing the size (in the y-dimension) of the notch 756 , additional material of the frame 754 may be removed at a location below the surface 762 . It should be noted that additional techniques are used to optimize the size of the notch 756 using the dimension 766 of the surface 762 .

Further, to secure the frame 754 using the sidewall component 714 , the electronic device 700 can include an adhesive 768 that bonds the frame 754 to the sidewall component 714 . As shown, the amount of adhesive 768 used generally causes sidewall component 714 , frame 754 , and protective cover 704 to form a generally continuous and planar configuration, which is described above. As shown, the edges of the portion are aligned with each other. However, to provide additional protection to the protective cover 704 by the sidewall component 714 , the amount of adhesive 768 used may be reduced, causing the protective cover 704 to z relative to the sidewall component 714 . - Make it smaller in size. In this way, the sidewall component 714 may additionally cover a portion of the protective cover 704 and may provide additional protection to the protective cover 704 from forces having a y-dimensional force component. Additional techniques to optimize the amount of adhesive 768 used as well as size the frame 754 , sidewall component 714 , and protective cover 704 to maintain a generally continuous and planar configuration. It should be noted that this may be used.

13 shows an electronic device 800 having a protective cover 804 and a sidewall component 814 extending to provide additional support for the protective cover 804 , in accordance with some described embodiments. A cross-sectional view of one embodiment of a device 800 is shown. Electronic device 800 may include any of the features described herein for an electronic device. Compared to previous embodiments, the sidewall component 814 includes an outer perimeter 824 raised or raised in the z-dimension. As a result, the material (in the y-dimension) forming the sidewall component 814 increases to provide additional support for the protective cover 804 . In addition, the sidewall component 814 can include an edge 826 that is parallel or at least substantially parallel to the surface 806 of the protective cover 804 . As a result, the sidewall component 814 can further provide additional support to the protective cover 804 and the frame 854 between the protective cover 804 and the sidewall component 814 .

14 depicts a cross-sectional view of one embodiment of an electronic device 900 , showing the electronic device 900 with various structural enhancements, in accordance with some described embodiments. Electronic device 900 may include any of the features described herein for an electronic device. Similar to previous embodiments, the electronic device 900 includes a touch-sensitive layer 912 designed to receive touch input, a display layer 914 designed to present visual information, and a touch-sensitive layer 912 , A force designed to detect the amount of force applied to or applied to the display layer 914 by a force applied to at least one of the display layer 914 and the protective cover 904 overlying the display assembly 902 . can include a display assembly 902 that includes a sensitive layer 916 . The display assembly 902 can further include a plate 918 secured to the force-sensitive layer 916 . As shown, plate 918 is below force sensitive layer 916 . However, in some embodiments (not shown), plate 918 is positioned between display layer 914 and force-sensitive layer 916 .

Plate 918 may include a rigid material such as metal or plastic. Plate 918 may provide structural support and rigidity to display assembly 902 . As a result, the plate 918 can protect the display assembly 902 from impact due to other components (not shown) within the electronic device 900 when the electronic device 900 falls. In addition, the plate 918 may prevent bending of the layers of the display assembly 902 , which in turn may prevent the layers from overcoming the adhesive bond and peeling from each other.

In some embodiments, the electronic device includes a flexible circuit coupled to the touch input layer. To limit movement of the flex circuit, an adhesive is applied to the support element (embedded within the frame) to bond the flex circuit with the support element. However, adhesives are known to shrink upon curing. The shrinking effect of the adhesive can provide a pulling force to the flex circuit, which in turn causes an unwanted pulling force on other components, which can change the position of some components or even damage some components.

In general, the amount of shrinkage of an adhesive (from an uncured state to a cured state) depends on the amount of adhesive used. To reduce the pulling force caused by shrinkage, the electronic device can be modified to limit the amount of adhesive required. For example, FIG. 14 shows a plate positioned between a flex circuit 922 (similar to the first flex circuit 212 shown in FIG. 5 ) and a support element 958 embedded in a frame 954 . An electronic device 900 with 928 is shown. The plate 928 may be positioned between the support element 958 and the adhesive 930 disposed on the support element 958 . Plate 928 may include a metal plate used as a shim that may be secured to flex circuit 922 . Plate 928 may occupy space between flex circuit 922 and support element 958 that would otherwise be occupied by adhesive 930 . In this way, the amount of adhesive 930 used can be reduced, and thus the shrinkage effect caused by the adhesive 930 is also reduced. Also, the plate 928 is designed and positioned to absorb some force that would otherwise impact the display assembly 902 . As a result, plate 928 may limit or prevent visual problems, such as display artifacts, when display assembly 902 is on and presenting visual information.

Similar to previous embodiments, the display layer 914 extends beyond the force-sensitive layer 916 and includes a bend. However, as shown in FIG. 14 , the display layer 914 may include a first material 932 covering the surface of the display layer 914 . The first material 932 may include a potting material that protects the display layer 914 , particularly the bent area of the display layer 914 , from external forces. To supply the first material, a needle (not shown) may be inserted at a location within the bend region of the display layer 914 . The needle may disperse material while being withdrawn from the electronic device 900 .

The display layer 914 further includes a second material 934 covering the surface of the display layer 914 and may include several metal traces (unlabeled). The second material 934 is designed to prevent damage to the metal traces by providing a compressive force to the metal traces and preventing a tensile force acting on the metal traces. In addition, the second material 934 may provide rigidity and structural support to the display layer 914 .

15 shows a top view of one embodiment of electronic device 1000 , showing plate 1018 positioned within enclosure 1010 of electronic device 1000 , in accordance with some described embodiments. For illustrative purposes, several features - including the transparent cover and display assembly - are removed. Electronic device 1000 , enclosure 1010 , and plate 1018 may each include any of the features described herein for the electronic device, enclosure, and plate, respectively. Plate 1018 is designed for use with a display assembly (not shown). In this regard, plate 1018 may include any of the features previously described for plate 918 (shown in FIG. 14 ).

The plate 1018 may include a notch 1020 designed to receive a portion of the display assembly. By way of example, the notch 1020 may be a display assembly (similar to the display assembly 102 shown in FIG. 5 ) and/or a flexible (such as the first flexible circuitry 212 shown in FIG. 5 ) associated with the display assembly. It can accommodate the bend regions of the circuits. In other words, the curved regions associated with the display assembly may bend around the plate 1018 along the planar edge 1022 of the plate 1018 to avoid contact with the enclosure 1010 . Accordingly, the notch 1020 may be referred to as the cut-out area of the plate 1018 .

Plate 1018 may also include extensions such as first extension 1024 and second extension 1026 . As shown, the first extension 1024 and the second extension 1026 extend beyond the planar edge 1028 of the plate 1018 . A display assembly (not shown) may include flex regions and flex circuits that bend around a planar edge 1028 in the manner described above, between the first extension 1024 and the second extension 1026 . can be positioned in A first extension 1024 and a second extension 1026 extend the plate 1018 in the y-dimension. In this way, an external force applied to the electronic device 1000 as a force component in the y-dimension causes the plate 1018 (and the display assembly carried by the plate 1018) to move relative to the enclosure 1010 in the y-dimension. can do it However, the first extension 1024 and the second extension 1026 may be removed from the enclosure 1010 (shown in FIG. It is designed to engage a sidewall component 1014 (similar to the second sidewall component 114 ). As a result, damage and/or electrical disconnection of the display assembly can be prevented.

FIG. 16 shows a partial side view of the electronic device 1000 shown in FIG. 15 , further showing the display assembly 1002 and the first extension 1024 of the fixed plate 1018 . As shown, the display assembly 1002 can be curved around the plate 1018 . Further, the plate 1018 may extend laterally beyond the display assembly 1002 in the y-dimension and the frame 1054 securing the protective cover 1004 over the display assembly 1002 . Consequently, the first extension 1024 and the second extension 1026 (shown in FIG. 15 ) cause the display assembly to move toward the sidewall component 1014 (labeled in FIG. 15 ) of the enclosure 1010 . may be combined to provide a buffer for the display assembly 1002 against forces applied to the display assembly 1002 . Frame 1054 , protective cover 1004 , and display assembly 1002 may each include a frame, protective cover, and any of the features previously described for the display assembly.

17 is an embodiment of an electronic device 1100 , showing the electronic device 1100 having an enclosure 1110 and a support structure 1120 integrally formed with the enclosure 1110 , in accordance with some described embodiments. A cross-sectional view of an example is shown. For simplicity, some features and components of electronic device 1100 are not shown. However, electronic device 1100 and enclosure 1110 may each include any of the features described herein for electronic device and enclosure, respectively. Unlike previous embodiments of an electronic device having a frame secured to the enclosure, the support structure 1120 may be part of the enclosure 1110 . In some embodiments, enclosure 1110 is formed of a metal, such as aluminum or an alloy comprising aluminum. In the embodiment shown in Figure 17, enclosure 1110 is formed of ceramic. The ceramic material may provide a robust housing while also minimizing the effects of RF interference on the antenna assembly (not shown) of the electronic device 1100 .

The support structure 1120 can receive and support a protective cover 1104 (similar to the first protective layer 104 shown in FIG. 1 ). In addition, the support structure 1120 may include a notch 1156 designed to accommodate the flex regions of the display assembly 1102 and/or flex regions of the flex circuit 1112 used with the display assembly 1102 . there is. A notch 1156 may extend circumferentially around the display assembly 1102 . Accordingly, the notch 1156 may be integrated into the enclosure 1110 . This may reduce the cost associated with the use of the frame and the associated manufacturing time.

18 shows a top view of one embodiment of a protective cover 1204 in accordance with some described embodiments. Protective cover 1204 may include any of the features described herein for a protective cover and/or protective layer. Accordingly, the protective cover 1204 may include a transparent material such as glass, sapphire, plastic, or the like. In this regard, the protective cover 1204 is designed to overlay the display assembly (not shown). Protective cover 1204 may include a base portion and a notch (shown below) defined in part by dashed line 1206 .

19 shows a cross-sectional view of the protective cover 1204 shown in FIG. 18 taken along line B-B, further showing a notch 1208 formed in the protective cover 1204 . The notch 1208 may define a cavity that extends partially into the material forming the protective cover 1204 . In this way, the notch may receive, or at least partially receive, the display assembly. This will be shown further below. Protective cover 1204 may also include a base portion 1212 extending around notch 1208 .

20 shows a cross-sectional view of one embodiment of an electronic device 1200 , showing an enclosure 1210 and a secured protective cover 1204 (shown in FIGS. 18 and 19 ), in accordance with some described embodiments. do. For simplicity, some features and components of electronic device 1200 are not shown. However, the electronic device 1200 may include any of the features described herein with respect to the electronic device. As shown, the electronic device 1200 can include a display assembly 1202 secured to the protective cover 1204 and positioned within the notch 1208 . The display assembly 1202 may partially fit the notch 1208 or fully fit the notch 1208 , depending on the desired configuration. By fitting the display assembly 1202 into the notch 1208 of the protective cover 1204 , the protective cover 1204 increases the protection provided to the display assembly 1202 by covering multiple dimensions of the display assembly 1202 . can do it Consequently, the impact force on the electronic device 1200 may be absorbed or at least partially absorbed by the protective cover 1204 prior to any impact on the display assembly 1202 . Also, by modifying the protective cover 1204 , design modifications to other components can be limited, which reduces manufacturing and engineering costs. Also, frame 1254 may not require a notch (such as notch 156 shown in FIG. 5 ), thus providing additional support to protective cover 1204 .

21 shows a cross-sectional view of one embodiment of an electronic device 1300 , showing a protective cover 1304 extending over a frame 1354 and positioned proximate a sidewall component 1314 , in accordance with some described embodiments do. Electronic device 1300 , sidewall component 1314 , and frame 1354 may each include any of the features described herein for the electronic device, sidewall component, and frame, respectively. As shown, frame 1354 can be modified and reduced in size such that protective cover 1304 extends over frame 1354 to abut sidewall component 1314 . This is in contrast to the frame 1354 extending between the sidewall component 1314 and the protective cover 1304 (as shown in other embodiments), to accommodate protection directly from the sidewall component 1314 , Allows for curvature 1306 of cover 1204 , particularly protective cover 1304 . In addition, protective cover 1304 may define an extended protective cover having a relatively greater length in the y-dimension. This may allow modifications to the display assembly 1302 of the electronic device 1300 to also increase the size of the y-dimension. Alternatively, or in combination, the extended length of the protective cover 1304 and the display assembly 1302 may facilitate a symmetric-shape display assembly, which may facilitate a display frame (not shown) partially covering the symmetric-shape display assembly. ) can also be modified. By providing a symmetrical display assembly, the overall appearance of the electronic device 1300 may be improved.

22 shows an exploded view of a battery assembly 160 in accordance with some described embodiments. As shown, the battery assembly 160 may include a first cover element 1402 and a second cover element 1404 , wherein the first cover element 1402 is sealed with a second cover element 1404 . to form a housing that shields the internal components of the battery assembly 160 . The housing formed by the first cover element 1402 and the second cover element 1404 may define a cavity that receives and surrounds the interior components. For example, the battery assembly 160 provides some physical insulation between the first electrode 1406 and the second electrode 1408 while still providing some physical insulation between the first electrode 1406 and the second electrode 1408 . Separate from first electrode 1406 and first electrode 1406 (such that first electrode 1406 and second electrode 1408 each comprise a single piece electrode), with separator 1410 allowing flow A second electrode 1408 may be further included.

As is commonly known in the art of batteries, one of the first electrode 1406 and the second electrode 1408 includes an anode, while the other electrode (of the first electrode 1406 and the second electrode 1408) including a cathode. Also, as is commonly known, electrodes may be used to convert chemical energy into electricity for use by an electronic device (eg, electronic device 100 shown in FIG. 1 ). Further, the battery assembly 160 , and the battery assembly described herein, may include a rechargeable battery assembly designed for subsequent reuse after the battery assembly 160 that receives electrical energy from an external source. Battery assembly 160 may further include a circuit board 1412 comprising one or more circuits designed to monitor current in and out of battery assembly 160 . Also, circuit board 1412 as well as components of circuit board 1412 may be in electrical communication with circuit board assembly 170 (shown in FIG. 4 ).

In addition, the first cover element 1402 can form a channel 164 that provides additional space in the z-dimension for a component (not shown), such as a flex circuit. In other words, the dimension (eg, height) of the battery assembly 160 is reduced in a position corresponding to the channel 164 , while still providing sufficient space for the circuit board 1412 to be positioned below the channel 164 . . In this way, a component can be positioned across the channel 164 , allowing repositioning of other components within the electronic device 100 (shown in FIG. 1 ) to create additional space for the battery assembly 160 . . As a result, the battery assembly 160 may include a larger size corresponding to a larger charging capacity. The first cover element 1402 and the second cover element 1404 may provide a shield comprising an electrical shield, although the aforementioned cover elements may allow for some electrical connections. For example, the first cover element 1402 can include an opening 1414 proximate the circuit board 1412 . Also, although not shown, the first cover element 1402 and/or the second cover element 1404 may include additional openings that allow an additional component (or components) to electrically couple with the battery assembly 160 . there is. While conventional battery electrodes generally include a straight shape, the electrodes in battery assembly 160 , and the battery assemblies described herein, may include different shapes. For example, as shown in FIG. 22 , first electrode 1406 and second electrode 1408 include an “L-shaped configuration” wherein at least one surface includes six different sides. This will be discussed further below.

FIG. 23 shows a top view of the first electrode 1406 shown in FIG. 22 . As shown, the first electrode 1406 includes an L-shaped configuration. In this regard, the first electrode 1406 may include a first portion 1420 , or a first rectangular portion, and a second portion 1422 , or a second rectangular portion, extending from the first portion 1420 . can The dotted line indicates the interface region between the first portion 1420 and the second portion 1422 . In some embodiments (not shown), the size of the first portion 1420 is the same as or substantially similar to the size of the second portion 1422 . However, in the embodiment shown in FIG. 23 , the size of the first portion 1420 is greater than the size of the second portion 1422 .

The first electrode 1406 can also be characterized as including a first wall 1434 having a first dimension 1444 and a second wall 1436 having a second dimension 1446 . As shown, the first wall 1434 is parallel or at least substantially parallel to the second wall 1436 , and the second dimension 1446 is less than the first dimension 1444 . The first electrode 1406 also has a third wall 1438 (separating the first wall 1434 from the second wall 1436) having a third dimension 1448 and a fourth dimension 1450 A fourth wall 1440 may be included. As shown, third wall 1438 is parallel or at least substantially parallel to fourth wall 1440 , and fourth dimension 1450 is less than third dimension 1448 . In addition, the first electrode 1406 can include a fifth wall 1442 parallel or at least substantially parallel to the third wall 1438 . The fifth wall 1442 can include a fifth dimension 1452 that is less than the third dimension 1448 . 23 , the fourth dimension 1450 and the fifth dimension 1452 may be combined to be the same as the third dimension 1448 . Also, the third wall 1438 is perpendicular or at least substantially perpendicular to the first wall 1434 and the second wall 1436 . In some embodiments (not shown), first dimension 1444 is equal to second dimension 1446 . Still, in some embodiments (not shown), the first dimension 1444 is smaller than the second dimension 1446 . In addition, the second electrode 1408 (shown in FIG. 22 ) and any additional electrode(s) and separator(s) included in the battery assembly 160 (shown in FIG. 22 ) may include the first electrode 1406 . It should be noted that it may include the same size and shape as the size and shape of, or a size and shape substantially similar thereto.

24 shows a top view of an alternative embodiment of an electrode 1506 suitable for use in a battery assembly, in accordance with some described embodiments. As shown, electrode 1506 may include a “C-shaped configuration”. In this regard, electrode 1506 may include a first portion 1520 or a first rectangular portion. The electrode 1506 further comprises a second portion 1522 or a second rectangular portion that extends both perpendicularly or substantially perpendicular to the first portion 1520 , and a third portion 1524 or a third rectangular portion may include The dotted line indicates interface regions between the first portion 1520 and the second portion 1522 as well as between the first portion 1520 and the third portion 1524 . In some embodiments (not shown), the size of the first portion 1520 is the same as or substantially similar to the size of the second portion 1522 and the third portion 1524 . However, in the embodiment shown in FIG. 24 , the size of the first portion 1520 is greater than the size of the second portion 1522 , and also greater than the size of the third portion 1524 . Also, as shown in FIG. 24 , the size of the second portion 1522 is the same as or substantially similar to the size of the third portion 1524 . However, in some embodiments (not shown), the size of the second portion 1522 may be different from the size of the third portion 1524 . For example, the size of the second portion 1522 may be greater or smaller than the size of the third portion 1524 .

Electrode 1506 can also be characterized as comprising a first wall 1534 having a first dimension 1544 and a second wall 1536 having a second dimension 1546 . As shown, the first wall 1534 is parallel or at least substantially parallel to the second wall 1536 , the second dimension 1546 being equal to or at least substantially parallel to the length of the first dimension 1544 . with similar lengths. The electrode 1506 also has a third wall 1538 (separating the first wall 1534 from the second wall 1536 ) having a third dimension 1548 , and a fourth wall 1538 having a fourth dimension 1550 . a wall 1540 , and a fifth wall 1542 having a fifth dimension 1552 . As shown, third wall 1538 is parallel or at least substantially parallel to fourth wall 1540 and fifth wall 1542 . Also, each of the fourth dimension 1550 and the fifth dimension 1552 is smaller than the third dimension 1548 . Also, the third wall 1538 is perpendicular or at least substantially perpendicular to the first wall 1534 and the second wall 1536 . 24 , the first dimension 1544 is the same as the second dimension 1546 . However, the first dimension 1544 may be different from the second dimension 1546 , such as smaller or larger than that. Electrode 1506 may also include a sixth wall 1562 parallel or at least substantially parallel to third wall 1538 . The sixth wall 1562 can include a sixth dimension 1572 that is smaller than the third dimension 1548 . 24 , the fourth dimension 1550 , the fifth dimension 1552 , and the sixth dimension 1572 may be combined to be the same as the third dimension 1548 . Further, any additional electrode(s) and separator(s) included in the battery assembly (not shown) may include the same size and shape as the size and shape of electrode 1506 , or a size and shape substantially similar to that of electrode 1506 . It should be noted that there is

25 shows a top view of an alternative embodiment of an electrode 1606 suitable for use in a battery assembly, in accordance with some described embodiments. As shown, electrode 1606 may include an “I-shaped configuration”. In this regard, the electrode 1606 may include a first portion 1620 or a first rectangular portion, a second portion 1622 or a second rectangular portion, and a third portion 1624 or a third rectangular portion. . The dotted line indicates interface regions between the first portion 1620 and the second portion 1622 as well as between the first portion 1620 and the third portion 1624 . As shown, both the second portion 1622 and the third portion 1624 extend perpendicular or substantially perpendicular to the first portion 1620 . Similar to a shape similar to the letter “I”, first portion 1620 may be centered or substantially centered relative to second portion 1622 and third portion 1624 . As shown, the size of the first portion 1620 is the same as or substantially similar to the size of the second portion 1622 and the third portion 1624 . However, in some embodiments (not shown), the size of the first portion 1620 is different from the size of the second portion 1622 and also different from the size of the third portion 1624 . Also, as shown in FIG. 25 , the size of the second portion 1622 is the same as or substantially similar to the size of the third portion 1624 . However, in some embodiments (not shown), the size of the second portion 1622 may be different from the size of the third portion 1624 . For example, the size of the second portion 1622 may be greater or smaller than the size of the third portion 1624 . Also, in some embodiments, third portion 1624 is removed from electrode 1606 such that electrode 1606 comprises a “T-shaped configuration”.

The electrode 1606 can also be characterized as including a first wall 1634 having a first dimension 1644 and a second wall 1636 having a second dimension 1646 . As shown, the first wall 1634 is parallel or at least substantially parallel to the second wall 1636 , the second dimension 1646 being equal to or at least substantially parallel to the length of the first dimension 1644 . of similar length. Electrode 1606 can also include a third wall 1638 comprising a third dimension 1648 . The third wall 1638 may be perpendicular or at least substantially perpendicular to the first wall 1634 and the second wall 1636 , the third dimension 1648 being the first dimension 1644 and the second dimension ( 1646), or at least substantially similar length.

The electrode 1606 can be further characterized as having a first portion 1620 aligned with and symmetrically disposed about a first longitudinal axis 1652 extending through the first portion 1620 . . As used throughout this specification and claims, the term “longitudinal” refers to a direction extending along a major axis of a component, wherein the “major” dimension corresponds to the largest (longest) dimension of a portion or portion of an electrode. . Electrode 1606 also includes second and third portions 1622 and 1624 aligned with and symmetrically disposed about second longitudinal axis 1654 and third longitudinal axis 1656, respectively. can do. The second longitudinal axis 1654 may be aligned parallel to the third longitudinal axis 1656 . Also, the first longitudinal axis 1652 may be perpendicular to the second longitudinal axis 1654 and the third longitudinal axis 1656 . Further, any additional electrode(s) and separator(s) included in the battery assembly (not shown) may include the same size and shape as the size and shape of electrode 1606 , or a size and shape substantially similar to that of electrode 1606 . It should be noted that there is

26 shows a top view of an alternative embodiment of an electrode 1706 suitable for use in a battery assembly, in accordance with some described embodiments. As shown, electrode 1706 can include an “L-shaped configuration” similar to that of first electrode 1406 (shown in FIG. 23 ). In this regard, the electrode 1706 includes a first portion 1720 , or a first rectangular portion, and a second portion 1722 , or a second rectangular portion, that extends from the first portion 1720 in a vertical manner. can do. The dotted line indicates the interface region between the first portion 1720 and the second portion 1722 . In some embodiments (not shown), the size of the first portion 1720 is the same as or substantially similar to the size of the second portion 1722 . However, in the embodiment shown in FIG. 26 , the size of the first portion 1720 is greater than the size of the second portion 1722 . Further, electrode 1706 can further include an opening 1730 defining a void or space within electrode 1706 . The opening 1730 includes an electrode 1706 as well as other electrodes having a size and shape similar to that of the electrode 1706 to position a component (not shown) in a position corresponding to the opening 1730 . A battery assembly (not shown) may be acceptable. In this way, the battery assembly can receive a component through the opening 1730 when the openings of the electrode and separator are aligned with each other to form a continuous through hole through the electrode and separator layers of the battery assembly. This will be discussed further below. Also, although an opening 1730 is shown in the electrode 1706, other embodiments, such as the embodiments of the electrode shown in FIGS. 23-25, may include an opening.

The various embodiments of the electrodes shown and described in FIGS. 23-26 may be formed by a cutting operation including die cutting. The die cutting operation may include an electrode sheet that is subjected to a cutting operation using a die of a predetermined size and shape. The die may include a size and shape corresponding to the size and shape of the electrodes shown in FIGS. 23-26 . It should be noted that the separators may be die cut in a similar manner. Accordingly, the shape of the electrodes described herein may include other linear shapes. In this regard, the battery assembly may include sizes and shapes depending on the electrodes and separators such that the battery assembly may take on a variety of sizes and shapes to increase the battery assembly size and/or to accommodate other internal components of the electronic device. .

27-29 illustrate various embodiments of a battery assembly suitable for use with an electronic device described herein. Some components of the electronic devices shown in FIGS. 27-29 are removed for illustration. The die cutting operation (described above) used to form the electrodes for the battery assembly described herein can be cut into a variety of sizes and shapes. In this regard, the battery assembly may take on different sizes and shapes. Further, the electronic device and battery assembly shown in FIGS. 27-29 may include any component(s) and feature(s) previously described for the electronic device. Also, although a separate number of embodiments of a battery assembly are shown, several other configurations are possible.

27 shows an embodiment of a battery assembly 1860 of an electronic device 1800 , wherein the battery assembly 1860 includes an internal component 1870 of the electronic device 1800 , in accordance with some described embodiments. It has a shape that accepts it. As shown, battery assembly 1860 may include a C-shaped configuration for receiving internal components 1870 that may include a circuit board assembly (described previously). The term “accommodating” refers to a component (eg, battery assembly 1860) to avoid or mitigate modifying the size, shape, and/or position of another component (eg, internal component 1870) within electronic device 1800 . ) may refer to modifying the size and shape of For example, the battery assembly shown and described herein may accommodate other component(s) by providing space that would otherwise be occupied by a conventional straight battery. In addition, any electrode(s) and separator(s) of battery assembly 1860 also include a C-shaped configuration having a shape similar to that of electrode 1506 (shown in FIG. 24 ). Accordingly, battery assembly 1860 may include a housing defined by one or more cover elements comprising a C-shaped configuration.

28 illustrates an alternative embodiment of a battery assembly 1960 of an electronic device 1900 , wherein the battery assembly 1960 includes a number of internal components of the electronic device 1900 , in accordance with some described embodiments. It has a shape that accepts it. As shown, battery assembly 1960 may include an “I-shaped” configuration to accommodate both first internal component 1970 and second internal component 1972 . Each of the first internal component 1970 and the second internal component 1972 may represent a component, such as a circuit board, audio module, flexible circuit, or similar component. 28 further shows a first internal component 1970 and a second internal component 1972 positioned in different spaces between the extensions of the battery assembly 1960 . In addition, any electrode(s) and separator(s) of battery assembly 1960 also include an I-shaped configuration having a shape similar to that of electrode 1606 (shown in FIG. 25 ). Accordingly, battery assembly 1960 may include a housing defined by one or more cover elements comprising an I-shaped configuration.

29 shows an alternative embodiment of a battery assembly 2060 of an electronic device 2000 , wherein the battery assembly 2060 is an internal component 2072 of the electronic device 2000 , in accordance with some described embodiments. has an opening 2062 to receive As shown, the opening 2062 can include a size and shape such that the internal component 2072 can be positioned at a perimeter of the opening 2062 . While opening 2062 includes a generally circular opening, opening 2062 may take the form of other shapes including, but not limited to, three-sided and four-sided shapes. 29 , battery assembly 2060 includes an L-shaped configuration (although other aforementioned shapes are possible) for receiving internal components 2070 (which may include circuit board assemblies). and may also include an opening 2062 . The L-shaped configuration of battery assembly 2060 allows internal component 2070 to be positioned at least partially between edges of battery assembly 2060 , such as first edge 2064 and second edge 2066 . In addition, the battery assembly including the L-shaped configuration as well as the opening (similar to the opening 2062) is aligned with each other and the electrodes and separators having a shape similar to that of the electrode 1706 (shown in FIG. 26). may include In other words, any electrode(s) and separator(s) of battery assembly 2060 also include an L-shaped configuration having an opening similar to that of electrode 1706 (shown in FIG. 26 ). Accordingly, battery assembly 2060 may include an opening as well as a housing defined by one or more cover elements comprising an L-shaped configuration.

In addition to having various sizes and shapes (other than conventional straight shapes), the battery assemblies described herein may include additional features. For example, FIG. 30 illustrates an alternative embodiment of a battery assembly 2160 of an electronic device 2100 , wherein the battery assembly 2160 is a second embodiment of the electronic device 2100 , in accordance with some described embodiments. 1 is positioned within the enclosure 2102 (of the electronic device 2100 ) above the internal component 2172 (as shown by dashed lines). Due in part to the additional space provided by the display layer 204 (shown in FIG. 5 ), the battery assembly 2160 may cover or overlay some components, such as the first internal component 2172 . Further, to accommodate the circuit board assembly 2170 within the enclosure 2102 , the battery assembly 2160 may include an L-shaped configuration. In this way, the battery assembly 2160 provides a location for receiving a portion of the circuit board assembly 2170 (which also includes an L-shaped configuration, as shown herein), while otherwise straight-forward to the battery. cannot accommodate the circuit board assembly 2170 . As shown in FIG. 30 , circuit board assembly 2170 can “match” with battery assembly 2160 similar to puzzle pieces. In addition, battery assembly 2160 may further include a channel 2162 defining a reduced dimension of battery assembly 2160 . In this manner, electronic device 2100 passes along channel 2162 over battery assembly 2160 and flex circuit 2164 electrically couples circuit board assembly 2170 as well as second internal component 2174 . may include an operating component (eg, as a non-limiting example, an audio module) to place the second internal component 2174 in electrical communication with the circuit board assembly 2170 . Although the flex circuit 2164 has been described as being electrically coupled to the second internal component 2174 , the flex circuit 2164 may also be electrically coupled to a third internal component (not shown), such as an antenna. . In either case, the channel 2162 formed in the battery assembly 2160 allows for the relocation of various internal components. Further, because the battery assembly 2160 can be positioned over the first internal component 2172 , the battery assembly 2160 can include an increased size corresponding to the increased electrical storage capacity.

FIG. 31 shows a cross-sectional view of the electronic device 2100 shown in FIG. 30 taken along line C-C of FIG. 30 . Due in part to a die cutting operation for the electrodes and separators (described above), the battery assembly 2160 can pass over the first internal component 2172 . Also, as shown in FIG. 31 , a portion of the battery assembly 2160 may lie flat on the enclosure 2102 , while another portion of the battery assembly 2160 covers the first internal component 2172 . In other words, the battery assembly 2160 may rise above the first internal component 2172 , and may also at least partially conform to the size and shape of the first internal component 2172 . Further, the electrodes may also pass over the first internal component 2172 . For example, battery assembly 2160 includes first electrode 2182 and second electrode 2184 , with separator 2186 positioned between first electrode 2182 and second electrode 2184 . do. 31 , first electrode 2182 , second electrode 2184 , and separator 2186 can pass over first internal component 2172 . Further, the die cutting operation may form the first electrode 2182 and the second electrode 2184 such that the electrodes terminate before entering a location in the battery assembly 2160 corresponding to the channel 2162 , thereby forming the channel 2162 . ) to reduce the dimensions of the battery assembly 2160 to accommodate the flex circuit 2164 . Although not shown, the channel 2162 is sized to receive two or more flexible circuits to electrically couple additional internal components (not shown) with the circuit board assembly 2170 (shown in FIG. 30 ). and shapes. Accordingly, the flex circuit 2164 (or additional flex circuits) need not be positioned around the perimeter of the battery assembly 2160 .

FIG. 32 shows an exploded view of the circuit board assembly 170 shown in FIG. 4 , in accordance with some described embodiments. As shown, the circuit board assembly 170 may include a first circuit board 172 and a second circuit board 174 . In some embodiments, each of the first circuit board 172 and the second circuit board 174 includes a printed circuit board. Also, the first circuit board 172 may be secured and positioned over the second circuit board 174 in a stacked configuration. 32 , the first circuit board 172 includes the same size and shape as, or at least substantially similar to, the size and shape of the second circuit board 174 . However, in some embodiments (not shown), the first circuit board 172 includes at least some differences compared to the second circuit board 174 with respect to size and/or shape. The stacked configuration of the circuit board assembly 170 increases the footprint of the circuit board assembly 170 in the electronic device 100 (shown in FIG. 1 ) in the z-dimension, whereas the stacked configuration of the circuit board assembly 170 reduces the footprint of in both the x- and y-dimensions. The additional space provided by stacking the circuit boards described above may provide additional space in the electronic device 100 for other components such as the battery assembly 160 (shown in FIG. 4 ). Additionally, the additional space provided by the reduced dimensions of the display assembly 102 (shown in FIG. 5 ) provides space for the circuit board assembly 170 . In other words, the additional space in the z-dimension due in part to the reduced dimensions of the display assembly 102 allows for a stacked configuration of the circuit board assembly 170 . Although not shown, circuit board assembly 170 may include three or more circuit boards in a stacked configuration and in electrical communication with each other.

The first circuit board 172 and/or the second circuit board 174 may include several operational components. “Operating component” may refer to a component, such as an integrated circuit or processor circuit, that performs an operation (or operations), such as executing instructions from a software application stored on a memory circuit. An operating component may also refer to a transistor. Operating components on one of the first circuit board 172 and/or the second circuit board 174 may convert electrical energy into thermal energy during operation. However, a heat distribution assembly (not shown) is designed to remove thermal energy from the circuit board assembly 170 . This will be discussed below. As shown in FIG. 32 , circuit boards may include operative components on multiple surfaces. For example, the first circuit board 172 can include a first mounting surface 2202 and a second mounting surface 2204 opposite the first mounting surface 2202 , with the first mounting surface 2202 . ) has a first operative component 2212 and the second mounting surface 2204 has a second operative component 2214 (shown in dashed lines). 32 , both the first mounting surface 2202 and the second mounting surface 2204 may include additional operational components. It should also be noted that the operational components on the first circuit board 172 are in electrical communication with each other. The communication means may include, for example, at least one via (not shown) extending through the first circuit board 172 .

The second circuit board 174 can include a first mounting surface 2206 that includes several operative components, such as an operative component 2216 . The second circuit board 174 also includes a second mounting surface 2208 opposite the first mounting surface 2206 . In some embodiments, the second mounting surface 2208 includes an operative component (or components) in electrical communication with operative components located on the first mounting surface 2206 . It should also be noted that when the circuit board assembly 170 is assembled, the second circuit board 174 is overlaid (or covered) by the first circuit board 172 in a stacked configuration. However, it should be noted that the first circuit board 172 is still separated from the second circuit board 174 by at least some gap or space. Also, when the circuit board assembly 170 is assembled, the first mounting surface 2206 of the second circuit board 174 faces the second mounting surface 2204 of the first circuit board 172 , and vice versa. So is it.

The first circuit board 172 may be mechanically connected to the second circuit board 174 by several standoffs connected by rivets. For example, as shown in FIG. 32 , the second circuit board 174 includes a first standoff 2222 designed to connect with a first rivet 2224 positioned on the first circuit board 172 . do. Each of the remaining standoffs (unlabeled) shown in FIG. 19 may be connected with a rivet (unlabeled) shown in FIG. 32 . The standoffs are designed to maintain a desired distance between the first circuit board 172 and the second circuit board 174 as well as provide a mechanical connection on the second mounting surface 2204 of the first circuit board 172 . The components do not (physically) interfere with the components on the first mounting surface 2206 of the second circuit board 174 and vice versa. Also, the positioning of the standoffs and rivets may be reversed such that the first circuit board 172 includes the standoffs and the second circuit board 174 includes the rivets.

To electrically couple the first circuit board 172 with the second circuit board 174 , several interposers are used to route electrical signals between the first circuit board 172 and the second circuit board 174 . can be used For example, as shown in FIG. 32 , the second circuit board 174 includes several interposers, such as an interposer 2232 electrically coupled to the second circuit board 174 by, for example, a soldering operation. may include Several additional interposers (unlabeled) are shown. Also, although not shown, the second circuit board 174 may include several metal traces that electrically couple the interposers to one or more operative components on the second circuit board 174 . Further, when the first circuit board 172 is electrically coupled to the second circuit board 174 , each of the interposers may be connected to one or more metal traces on the second mounting surface 2204 of the first circuit board 172 . (not shown) may be electrically coupled to.

The circuit board assembly 170 may include several shielding elements that shield the components of the circuit board assembly 170 from electromagnetic interference (“EMI”). For example, the circuit board assembly 170 can include a first shielding element 2242 that covers components located on the first mounting surface 2202 of the first circuit board 172 . The first shielding element 2242 can include a metal-based material designed to provide EMI shielding to components on the first mounting surface 2202 . The circuit board assembly 170 is configured to provide EMI shielding to components located on the second mounting surface 2204 of the first circuit board 172 and the first mounting surface 2206 of the second circuit board 174 . It may further include a designed second shielding element 2244 . The second shielding element 2244 may include a metal such as copper or brass. The second shielding element 2244 may be secured to (and between) the first circuit board 172 and the second circuit board 174 by several solder joints disposed on each circuit board. For example, FIG. 32 shows a second circuit board 174 with a first solder joint 2250 positioned around an outer perimeter of the second circuit board 174 . Several additional solder joints are shown but not labeled in addition to the first solder joint 2250 . The first circuit board 172 may also include solder joints (not shown) at positions corresponding to the solder joints on the second circuit board 174 . In some embodiments, the second shielding element 2244 includes several discrete structural elements. 32 , the second shielding element 2244 may comprise a single continuous structural component designed to extend along the outer perimeter of the circuit board assembly 170 . Alternatively, the second shielding element 2244 may include several shielding element parts that combine with each other to form the second shielding element 2244 .

The circuit board assembly 170 can further include a third shielding element 2246 positioned on the second mounting surface 2208 of the second circuit board 174 . The third shielding element 2246 is designed to combine with the first shielding element 2242 and the second shielding element 2244 to provide EMI shielding to the circuit board assembly 170 . Further, the second mounting surface 2208 of the second circuit board 174 may include metal traces (over the second mounting surface 2208). In this regard, in addition to forming an EMI shield, since the third shielding element 2246 is electrically connected to the second mounting surface 2208 by metal traces, the third shielding element 2246 is a circuit board assembly. At least a portion of an electrical ground path to 170 may be defined. Further, when a component (or components) of circuit board assembly 170 generates EMI during operation, the shielding elements described above are external to electronic device 100 (shown in FIG. 1 ) with respect to circuit board assembly 170 . may shield the components of the circuit board assembly 170 from EMI generated by the component(s) of the circuit board assembly 170 .

FIG. 33 shows a cross-sectional view of the circuit board assembly 170 shown in FIG. 32 , showing various internal components of the circuit board assembly 170 . As shown, the first circuit board 172 may be separated from the second circuit board 174 by standoffs 2226 . Also, to mechanically couple the first circuit board 172 with the second circuit board 174 , standoffs 2226 may be mechanically coupled with rivets 2228 , with standoffs 2226 and rivets. 2228 is electrically isolated from the components of the first circuit board 172 and the second circuit board 174 .

The first circuit board 172 may include vias 2218 formed of metal to provide an electrical connection between the first operative component 2212 and the second operative component 2214 . Also, the first circuit board 172 may be in electrical communication with the second circuit board 174 through the interposer 2234 . As shown, interposer 2234 can electrically and mechanically connect with first solder joint 2262 located on first circuit board 172 , and interposer 2234 located on second circuit board 174 . It may also connect electrically and mechanically with the second solder joint 2264 . In addition to interposer 2234, several additional interposers (not shown) may be used to pass signals between circuit boards. The first circuit board 172 can include a second operative component 2214 as well as a first metal trace 2272 in electrical connection with a via 2218 , the second circuit board 174 being a second circuit board and a second metal trace 2274 in electrical connection with a third operative component 2220 located on 174 . In this manner, third operative component 2220 may be in electrical communication with second operative component 2214 via interposer 2234 and metal traces. The third operative component 2220 can be in electrical communication with the first operative component 2212 via vias 2218 , interposer 2234 , and metal traces. Circuit board assembly 170 may use several additional metal traces, vias, and solder joints to provide additional electrical communication paths.

34 shows an alternative embodiment of a circuit board assembly 2370, showing a modified circuit board assembly 2370 for ingress protection. Circuit board assembly 2370 may include any of the components and features previously described for a circuit board assembly, such as first circuit board 2372 and second circuit board 2374 . However, as shown in FIG. 34 , circuit board assembly 2370 includes potting material 2390 embedded in circuit board assembly 2370 between first circuit board 2372 and second circuit board 2374 . can do. The potting material 2390 may include a resin that cures to form a liquid-resistant shield for various operational components of the circuit board assembly 2370 , such as the operational component 2314 . In this regard, the potting material 2390 may prevent damage caused by liquid ingress into the circuit board assembly 2370 , particularly the components of the circuit board assembly 2370 . In addition, potting material 2390 may extend to first shielding element 2342 and second shielding element 2344 of circuit board assembly 2370 to prevent corrosion to components such as standoff 2326 . there is. The potting material 2390 may be used with the circuit assembly described herein.

35 shows an alternative circuit board assembly 2470 , showing a circuit board assembly 2470 having a flex circuit 2402 electrically coupled with a circuit board of the circuit board assembly, in accordance with some described embodiments. Examples are shown. Circuit board assembly 2470 may include any of the components and/or features previously described for circuit board assembly. For example, as shown, circuit board assembly 2470 can include a first circuit board 2472 and a second circuit board 2474 . The circuit board assembly 2470 can further include a first shielding element 2442 disposed over the first circuit board 2472 and at least some of its components. The circuit board assembly 2470 can further include a second shielding element 2444 covering the gap between the first circuit board 2472 and the second circuit board 2474 . The circuit board assembly 2470 can further include a third shielding element 2446 disposed over the second circuit board 2474 . However, rather than using interposers for electrical communication between the first circuit board 2472 and the second circuit board 2474 (and their respective components), the circuit board assembly 2470 of FIG. The flex circuit 2402 is used for communication of electrical signals between the operative components disposed on the circuit board 2472 and/or the second circuit board 2474 .

The flex circuit 2402 may electrically and mechanically couple with the first circuit board 2472 , and may form a loop that electrically and mechanically couples with the second circuit board 2474 . Electrical and mechanical bonding may be performed using a hot bar soldering operation. A thermode (not shown) is used to supply thermal energy to the flex circuit 2402 and to soldering elements (not shown) on the first circuit board 2472 and the second circuit board 2474 . It can be used as a heated “hot bar,” which allows the flex circuit 2402 to be electro-mechanically coupled to the first circuit board 2472 and the second circuit board 2474 . It should be noted that a number of hot bar soldering operations may be used to couple the flex circuit 2402 with the first circuit board 2472 and the second circuit board 2474 .

FIG. 36 shows a cross-sectional view of the circuit board assembly 2470 shown in FIG. 35 taken along line D-D, showing the flex circuit 2402 extending between the circuit boards. As shown, flex circuit 2402 is electrically coupled with first solder joint 2412 and second solder joint 2414 positioned on first circuit board 2472 and second circuit board 2474, respectively. mechanically coupled. Also, the first solder joint 2412 may electrically couple with the first metal trace 2422 on the first circuit board 2472 , and the second solder joint 2414 may be connected to the second solder joint 2414 on the second circuit board 2474 . 2 may be electrically coupled to metal traces 2424 . As a result, flex circuit 2402 may electrically couple several operative components (not shown), some of which are electrically coupled with first metal trace 2422 and first circuit board 2472 . ), some of which are electrically coupled with the second metal traces 2424 and located on the second circuit board 2474 .

37 depicts a cross-sectional view of an alternative embodiment of circuit board assembly 2570 , showing internal components of circuit board assembly 2570 having corresponding geometries, in accordance with some described embodiments. Circuit board assembly 2570 may include any of the components and/or features previously described for circuit board assembly. For example, the circuit board assembly 2570 may include a first circuit board 2572 and a second circuit board 2574 , wherein the first circuit board 2572 is coupled to a second circuit board 2520 via an interposer 2520 . in electrical communication with a circuit board 2574 . Additional interposers (not shown) may electrically couple the first circuit board 2572 (and components thereon) to the second circuit board 2574 (and components thereon). The first circuit board 2572 includes a first operative component 2512 including a second operative component 2514 electrically coupled to metal traces (unlabeled) and a second mounting surface 2504 (first mounting surface). and a first mounting surface 2502 (opposite 2502 ). The second circuit board 2574 can also include a third operative component 2516 electrically coupled to a metal trace (unlabeled), wherein the third operative component 2516 and the metal trace are connected to the second circuit It is located on the first mounting surface 2506 of the board 2574 .

As shown in FIG. 37 , the second operative component 2514 and the third operative component 2516 may be in a nested configuration. For example, the third operative component 2516 can include a protrusion 2518 that extends at least partially into the recess 2522 of the second operative component 2514 . The corresponding geometry between the second operative component 2514 and the third operative component 2516 allows for a reduced dimension (or reduced height) of the circuit board assembly 2570 , thereby providing a circuit board assembly 2570 within the electronic device. ) reduces the total space occupied by (not shown). In other words, the separation or gap between the first circuit board 2572 and the second circuit board 2574 is in the manner of the second operative component 2514 and the third operative component 2516 compared to the previous embodiments. may decrease due to the corresponding or nested configurations of the components of the first circuit board 2572 and the second circuit board 2574 in a similar manner.

Also, in some cases, components on different circuit boards may be electrically and mechanically coupled to each other by direct means. For example, FIG. 37 shows a fourth operative component 2534 positioned on the second mounting surface 2504 , and a fifth operative component positioned on the first mounting surface 2506 of the second circuit board 2574 . A first circuit board 2572 with 2536 is further shown. The fourth operative element 2534 can include a recess 2542 and a connector 2544 positioned within the recess 2542 . The fifth operative component 2536 can also include a protrusion 2538 extending into the recess 2542 . The protrusion 2538 can include a connector 2554 that electrically and mechanically engages the connector 2544 . In this manner, the fourth operative component 2534 is electrically and mechanically coupled with the fifth operative component 2536 .

Further, when the circuit board assembly 2570 includes operative components such as a fourth operative component 2534 and a fifth operative component 2536 , the first circuit board 2572 includes the fourth operative component 2534 and the fifth operative component 2536 . 5 may be electrically coupled to the second circuit board 2574 via the operative component 2536 . As a result, circuit board assembly 2570 may not require interposers (eg, interposer 2520 ) to provide electrical communication between first circuit board 2572 and second circuit board 2574 . can Also, as shown in FIG. 37 , first circuit board 2572 may include metal traces (unlabeled) as well as vias 2546 electrically coupled with fourth operative component 2534 . In this manner, first operative component 2512 can electrically connect to fifth operative component 2536 via metal traces, vias 2546 , and fourth operative component 2534 . In some embodiments, the circuit board assembly 2570 is one of a combination of a second operative component 2514 and a third operative component 2516 , and a combination of a fourth operative component 2534 and a fifth operative component 2536 . Note that it contains one.

38 shows a cross-sectional view of an alternative embodiment of circuit board assembly 2670, showing circuit board assembly 2670 having several solder masks used to support the circuit board, in accordance with some described embodiments. do. Circuit board assembly 2670 may include any of the components and/or features previously described for circuit board assembly. For example, the circuit board assembly 2670 may include a first circuit board 2672 and a second circuit board 2674 . Also, each of the first circuit board 2672 and the second circuit board 2674 may include several solder joints (unlabeled), where the interposer is soldered from the first circuit board 2672 . electrically coupled with the joint and solder joint from the second circuit board 2674 . For example, FIG. 38 shows a first interposer 2602 electrically and mechanically coupled to solder joints (unlabeled) on a first circuit board 2672 and a second circuit board 2674 , a first circuit board 2672 and a second interposer 2604 electrically and mechanically coupled with solder joints (unlabeled) on the second circuit board 2674 , and a first circuit board 2672 and a second circuit board 2674 ) shows a circuit board assembly 2670 with a third interposer 2606 electrically and mechanically coupled to a solder joint (unlabeled) on

To prevent oxidation of the solder joints and/or to prevent solder “bridges” from forming between adjacent solder joints during a soldering operation, the circuit board assembly 2670 may include several soldering masks. For example, the circuit board assembly 2670 may include a first solder mask 2622 between the first interposer 2602 and the second interposer 2604 and the second interposer 2604 and the third interposer 2606 . ) between the second solder mask 2624 . Based on these positions, the first solder mask 2622 can prevent a solder bridge from forming between the first interposer 2602 and the second interposer 2604 (and thereby (prevents unwanted electrical coupling between 2602 and second interposer 2604), second solder mask 2624 forms a solder bridge between second interposer 2604 and third interposer 2606 (this prevents unwanted electrical coupling between the second interposer 2604 and the third interposer 2606). In addition, the first solder mask 2622 and the second solder mask 2624 may provide a support structure that maintains a desired distance or separation between the first circuit board 2672 and the second circuit board 2674 . Also, in order to hold the first circuit board 2672 together with the second circuit board 2674 , both the first circuit board 2672 and the second circuit board 2674 are connected to the first solder mask 2622 and the second circuit board 2674 . It can clamp on the ends of the solder mask 2624 . The interposers, solder joints, and solder masks may each represent several additional interposers, solder joints, and solder masks.

39 shows an isometric view of one embodiment of an audio module 2700 in accordance with some described embodiments. The audio module 2700 may be used instead of the first audio module 182 (shown in FIG. 4 ). The audio module 2700 may be used as a receiver module designed to generate acoustic energy in the form of audible sound. Typically, receiver modules are used in low power applications associated with relatively low frequency outputs. However, the audio module 2700 may include modifications for improved audio performance associated with the audio speaker module.

The audio module 2700 can include an audio module housing 2702 having an audio module opening 2704 . The audio module housing 2702 may define an internal acoustic volume divided into a front volume and a rear volume. This will be shown below. The audio module housing 2702 may support a diaphragm 2706 or membrane designed to vibrate, producing acoustic energy in the form of audible sound. Accordingly, the diaphragm 2706 may be referred to as a membrane or acoustic membrane. The diaphragm 2706 may include additional thickness to handle additional vibrational energy (associated with the additional power supplied to the audio module 2700 ), and thus additional audio frequencies. Also, the audio module opening 2704 may represent a single, unaltered opening in the audio module housing 2702 , and any other opening in the audio module housing 2702 (eg, used for wiring and electrical communication). They can be air-sealed and liquid-sealed. In this regard, the diaphragm 2706 may be prevented from unwanted vibrations due to air entering the audio module housing 2702 during changes in air pressure inside the electronic device (not shown). This will be further shown below. Also, in some embodiments, diaphragm 2706 includes a fluid-resistant diaphragm (or fluid-resistant membrane) designed to withstand damage resulting from exposure to a liquid, such as water.

FIG. 40 shows a cross-sectional view of the audio module 2700 shown in FIG. 39 taken along line D-D of FIG. 39 , showing several internal features of the audio module 2700 . As shown, the audio module 2700 includes a sound coil 2708 and a magnet 2710 . The sound coil 2708 is designed to receive alternating current and form an electromagnet with alternating magnetic polarity. The alternating magnetic polarity may cause the sound coil to vibrate based on the interaction (attraction and repulsion) with the external magnetic field of the magnet 2710 .

A diaphragm 2706 is positioned in the audio module housing 2702 and separates the acoustic volume (defined in part by the audio module housing 2702 ) into a front volume 2720 and a rear volume 2722 . As shown, the front volume 2720 can open into the audio module opening 2704 , while the back volume 2722 is sealed from the audio module opening 2704 . Further, when the audio module 2700 is positioned in the electronic device 100 (shown in FIG. 1 ), the audio module housing 2702 seals the components of the audio module 2700 from air within the electronic device 100 . It may be possible, for example, that diagram 2706 is not acoustically driven or otherwise affected by changes in atmospheric pressure within electronic device 100 . As shown, the front volume 2720 and the back volume 2722 can be protected from barometric pressure changes in the electronic device 100 . However, when the diaphragm 2706 vibrates to produce acoustic energy, the acoustic energy exits the audio module opening 2704 . Also, in some embodiments, the audio module 2700 provides a rear volume 2722 (by air entering the audio module opening 2704), and the rear volume 2722 causes the barometric pressure of the outside ambient air to change. It includes an air outlet 2730 that allows air to the audio module opening 2704 out of the rear volume 2722 to equilibrate with the ambient air when evacuated. Also, the audio module 2700 may replace the first audio module 182 (shown in FIG. 4 ), while the audio module 2700 may include a different design and shape, such that the audio module 2700 is can also replace the second audio module 184 (shown in FIG. 4 ).

41 shows a cross-sectional view of the electronic device 100 , showing the audio module 2700 positioned in the electronic device 100 . As shown, the audio module 2700 , particularly the audio module opening 2704 , is aligned with at least one of the openings 134 (both shown in FIG. 1 ). In addition, mesh material 2724 may cover opening 134 and provide an aesthetic finish. Also, in some embodiments, audio module 2700 fits with bracket 2726 . Bracket 2726 may be secured with audio module 2700 by adhesive 2728 , which may include a liquid-resistant adhesive that prevents liquid from entering electronic device 100 around bracket 2726 . Bracket 2726 may also include a sealing element 2732 positioned between audio module 2700 and bracket 2726 to form an entry barrier between audio module 2700 and bracket 2726 . In this way, the audio module 2700 is positioned within the electronic device 100 such that any liquid entering the opening 134 may extend into the front volume 2720 but not into the back volume 2722 . Also, any air entering the opening 134 may extend into both the front volume 2720 and the rear volume 2722 , the latter using the air outlet 2730 to receive air. Air outlet 2730 may also allow air to escape from rear volume 2722 . Accordingly, the audio module 2700 may provide acoustic energy while preventing the liquid from flowing into the electronic device 100 . Further, any acoustic energy generated by the diaphragm 2706 can exit the audio module 2700 through the audio module opening 2704 and also the electronic device 100 through the opening 134 . there is.

Also, as shown in FIG. 41 , the audio module 2700 is configured such that the audio module opening 2704 is only exposed to ambient air (outside the electronic device 100 ) that enters the electronic device 100 through the opening 134 . It may be positioned within the electronic device 100 . In other words, the audio module housing 2702 is configured such that an internal volume change that causes a change in air pressure within the electronic device 100 by, for example, pressing on the first protective layer 104 and the display assembly 102 , causes air to be drawn into the audio module. By preventing it from entering the housing 2702, the diaphragm 2706 is sealed in a manner that prevents it from generating unwanted acoustic noise.

42 shows an exploded view of a heat distribution assembly 190 in accordance with some described embodiments. The heat distribution assembly 190 may include several layers of material that provide structural support as well as enhanced heat transfer properties. The enhanced heat transfer properties and structural support allow the heat distribution assembly 190 to have a substantially non-metallic exterior so that the electronic device has reduced heat transfer capability, such as the electronic device 100 having the second protective layer 144 ( 2) may be useful. In this regard, the heat distribution assembly 190 may be used within an electronic device to direct thermal energy from a non-metallic floor wall to other structural features of the electronic device, such as the sidewall components described above.

As shown, the heat distribution assembly 190 may include several layers of material. For example, the heat distribution assembly 190 may include a first layer 2802 formed of a first type of material, which may include a durable material such as stainless steel. The first layer 2802 may include a bottom wall 2812 along with a first sidewall 2822 and a second sidewall 2824 , both of which are separated from the bottom wall 2812 in a vertical or at least substantially vertical manner. is extended When assembled into the electronic device 100 (shown in FIGS. 1 and 2 ), the heat distribution assembly 190 and in particular the first layer 2802 provides thermal insulation to one or more heat-generating components in the electronic device 100 . is combined with At least one of the bottom wall 2812 , the first sidewall 2822 , and the second sidewall 2824 may include a contact surface that is in direct thermal contact with, or at least thermally coupled to, a heat-generating component of the electronic device. This will be shown below.

The heat distribution assembly 190 can further include a second layer 2804 designed to engage and thermally couple the first layer 2802 . The second layer 2804 may include a bottom wall 2814 along with a first sidewall 2832 and a second sidewall 2834 , both of which are separated from the bottom wall 2814 in a vertical or at least substantially vertical manner. is extended When the heat distribution assembly 190 is assembled, the bottom wall 2814 , the first sidewall 2832 , and the second sidewall 2834 of the second layer 2804 are connected to the bottom wall 2812 of the first layer 2802 . , the first sidewall 2822 and the second sidewall 2802 , respectively. In addition, the second layer 2804 is a second type of material, which may include a material having a relatively high thermal conductivity (compared to the first type of material of the first layer 2802), such as copper or graphite. can be formed. In this regard, the second layer 2804 redistributes, redirects, or otherwise redistributes thermal energy from a heat-generating component (not shown) within the electronic device when the heat-generating component is thermally coupled with the heat distribution assembly 190 . Otherwise, it is designed to spread. The second layer 2804 can receive thermal energy from the first layer 2802 as the first layer 2802 receives thermal energy from the heat-generating component(s). At least one of the bottom wall 2816 , the first sidewall 2842 , and the second sidewall 2844 can include a contact surface that is in direct thermal contact with, or at least thermally coupled to, the second layer 2804 .

Additionally, the heat distribution assembly 190 may include a third layer 2806 designed to enhance structural support and rigidity for the heat distribution assembly 190 in combination with the first layer 2802 . Accordingly, the third layer 2806 may in some cases be formed of a third type of material that is the same as or similar to that of the first type of material for the first layer 2802 . The third layer 2806 may include a bottom wall 2816 along with a first sidewall 2842 and a second sidewall 2844 , both of which are separated from the bottom wall 2816 in a vertical or at least substantially vertical manner. is extended When the heat distribution assembly 190 is assembled, the bottom wall 2816 , the first sidewall 2842 , and the second sidewall 2844 of the third layer 2806 are connected to the bottom wall 2814 of the second layer 2804 . ), the first sidewall 2832 , and the second sidewall 2834 , respectively. Further, when the heat distribution assembly 190 is positioned within the electronic device 100 (shown in FIGS. 1 and 2 ), the first sidewall 2842 and the second sidewall 2844 , the third layer 2806 The third sidewall component 116 and the fourth sidewall component 118 (shown in FIG. 1 ) may each engage and thermally couple thereto. In this manner, the heat distribution assembly 190 may be thermally coupled to portions of the band 110 (shown in FIGS. 1 and 2 ). At least one of the bottom wall 2814 , the first sidewall 2832 , and the second sidewall 2834 can include a contact surface that is in direct thermal contact with, or at least thermally coupled to, the first layer 2802 .

Based on the aforementioned material construction of the heat distribution assembly 190 , the second layer 2804 may include heat transfer properties different from those of the first layer 2802 and the third layer 2806 . For example, the second layer 2804 may be formed of a material having a relatively high thermal conductivity as compared to the material(s) forming the first layer 2802 and the third layer 2806 . Further, the first layer 2802 and the third layer 2806 may be formed of a material having a relatively high durability or stiffness as compared to the material from which the second layer 2804 is formed.

To assemble the heat distribution assembly 190 into layers of different material construction, the various layers may undergo a cladding operation designed to bond the layers together. The cladding operation may include placing each layer of material on separate rollers, then pressing the layers together as they pass through the rollers. The pressing effect can create molecular bonds between molecules of metals. It should be noted that a cladding operation may be used when the second layer 2804 includes copper. A different assembly operation may be used when the second layer 2804 comprises graphite. This will be shown and discussed below. Additionally, when the heat distribution assembly 190 is assembled, the first layer 2802 and the third layer 2806 can provide support for the second layer 2804 and also support the heat distribution assembly 190 . It may provide some structural support for the supporting electronic device (not shown). While the second layer 2804 is primarily used for heat transfer, the first layer 2802 and the third layer 2806 may also provide at least some heat transfer capabilities. Further, the first layer 2802 and the third layer 2806 are primarily used for structural support, while the second layer 2804 may also provide at least some structural support.

43 shows a partial cross-sectional view of the electronic device 100 shown in FIG. 1 , showing a heat distribution assembly 190 positioned within the electronic device 100 . For purposes of illustration, some components of the electronic device 100 are removed. As shown, the heat distribution assembly 190 allows heat generated from one or more operative components of the circuit board assembly 170 to pass from the circuit board assembly 170 to at least some layers of the heat distribution assembly 190 . It may be in direct thermal contact with the circuit board assembly 170 or at least thermally coupled thereto. For example, as shown in a first enlarged view 2850 , a heat energy flow (represented by a dashed line with an arrow) or heat flow generated from the operative components of the circuit board assembly 170 may be coupled to the first layer 2802 ) to the second layer 2804 . As shown, the contact surface of the first layer 2802 (bottom wall 2812 labeled in FIG. 42 ) is in thermal contact with the circuit board assembly 170 . Also, due in part to the relatively high thermal conductivity of the second layer 2804 (as compared to the third layer 2806 ), thermal energy extends through the first layer 2802 and into the first layer 2802 . perpendicular to, or at least partially perpendicular to, and tends to continue through the second layer 2804 rather than through the third layer 2806 . As further shown, the thermal energy flow travels parallel or at least partially parallel to the contact surface of the second layer 2804 (bottom wall 2814 labeled in FIG. 24 ). Accordingly, the relatively low thermal conductivity of the third layer 2806 may prevent thermal energy build-up, also referred to as thermal hot spots, at the location(s) near the second protective layer 144 . This will be discussed further below.

Also, as shown in FIG. 43 , the heat distribution assembly 190 may be designed to engage the band 110 . For example, as shown in the second enlarged view 2852 , the contact surface of the first sidewall 2842 of the third layer 2806 of the heat distribution assembly 190 is a third sidewall component of the band 110 . (116) can be engaged. Accordingly, the third layer 2806 may be in direct thermal contact with, or at least thermally coupled to, the third sidewall component 116 . The second layer 2804 distributes or distributes thermal energy to the third layer 2806 , particularly from the first sidewall 2832 of the second layer 2804 to the first sidewall 2842 of the third layer 2806 . towards the third sidewall component 116 , where the thermal energy can then be dissipated from the third sidewall component 116 to the ambient air. The heat distribution assembly 190 may further engage the fourth sidewall component 118 of the band 110 , in this manner, the heat distribution assembly 190 may engage in a manner similar to that of the third sidewall component 116 . Heat can be distributed to the fourth sidewall component 118 (ie, via the sidewalls of the second layer 2804 and the third layer 2806 shown in FIG. 42 ). In this way, at least one of the sidewall components as a distributed heat sink that prevents the heat generated by the circuit board assembly 170 from being trapped at or near the second protective layer 144 to form a thermal hot spot. should be prevented

In addition, the heat distribution assembly 190 allows the thermal energy within the electronic device 100 to primarily flow into the second layer 2804 because the third layer 2806 provides minimal thermal conductivity compared to the second layer 2804 . ), the second protective layer 144 may prevent or limit the reception of thermal energy generated from the operational components of the circuit board assembly 170 . In this regard, the second layer 2804 may define a thermal path or primary thermal path for thermal energy generated by the operational components of the circuit board assembly 170 . 43 shows a heat distribution assembly 190 that receives heat from component(s) of the circuit board assembly 170 , the heat distribution assembly 190 includes an electronic device thermally coupled to the heat distribution assembly 190 ( It should be noted that it may receive heat from any heat-generating component of 100). Further, the heat distribution assembly 190 may provide a rigid support structure to support the second protective layer 144 . For example, the first layer 2802 and the third layer 2806 of the heat distribution assembly 190 can extend across a major surface of the second protective layer 144 as shown in FIG. 43 .

44 shows a side view of an alternative embodiment of a heat distribution assembly 2900 in accordance with some described embodiments. Heat distribution assembly 2900 may include any material(s) and/or feature(s) previously described for heat distribution assembly. The heat distribution assembly 2900 can include a first layer 2902 , a second layer 2904 (shown in dashed lines), and a third layer 2906 , wherein the second layer 2904 is a first It is buried between the layer 2902 and the third layer 2906 . As shown, the second layer 2904 may be completely covered by the first layer 2902 and the third layer 2906 . This may prevent movement or movement of the second layer 2904 relative to the first layer 2902 and/or the third layer 2906 . It should be noted, however, that the second layer 2904 may still receive heat passing through the first layer 2902 and/or the third layer 2906 .

45 shows an isometric view of an alternative embodiment of heat distribution assembly 3000 , showing heat distribution assembly 3000 modified to receive component 3010 , in accordance with some described embodiments. Heat distribution assembly 3000 may include any material(s) and/or feature(s) previously described for heat distribution assembly. As shown, the heat distribution assembly 3000 may include a first layer 3002 , a second layer 3004 , and a third layer 3006 , wherein the second layer 3004 is the first layer. It is buried between 3002 and the third layer 3006 .

However, the second layer 3004 may be modified to reduce the dimensions of the heat distribution assembly 3000 . For example, a portion of the second layer 3004 may be locally removed at a desired location such that a portion of the heat distribution assembly 3000 includes only the first layer 3002 and the third layer 3006, such that the second layer ( 3004 ) may reduce (locally) dimensions of the non-existent heat distribution assembly 3000 . As a result of the reduced dimensions, the heat distribution assembly 3000 can include a first channel 3012 that receives a component 3010 . The heat distribution assembly 3000 can further include a second channel 3014 that can receive a second component (not shown). It should be noted that the positions of the first channel 3012 and the second channel 3014 correspond to positions where the second layer 3004 is not present. However, any component(s) secured with the heat distribution assembly 3000 in the first channel 3012 and/or the second channel 3014 may be dependent on the thermal energy generated by the component(s) may be thermally coupled to the second layer 3004 to be withdrawn from the second layer 3004 .

Component 3010 may be secured to heat distribution assembly 3000 by welding, soldering, or gluing (with adhesive), as non-limiting examples. Further, the dimensions of the first channel 3012 are such that the component 3010 is at least coplanar with respect to the first layer 3002 and, in some cases, sub-flush, so that the component 3010 is a heat distribution assembly ( 3000) to be seated. The dimensions of the second channel 3014 are such that the second component (not shown) is at least coplanar with, and in some cases lower than, the third layer 3006 so that the second component rests on the heat distribution assembly 3000 . Care should be taken to make Component 3010 may also represent one or more components, such as, but not limited to, the heat-generating component, audio module, bracket, or joint described above as non-limiting examples. Alternatively, component 3010 may include a thermally conductive layer designed to receive (and thereby dissipate) thermal energy from heat distribution assembly 3000 .

46 shows an isometric view of an alternative embodiment of a heat distribution assembly 3100 in accordance with some described embodiments. Heat distribution assembly 3100 may include any material(s) and/or feature(s) previously described for heat distribution assembly. As shown, the heat distribution assembly 3100 can include a first layer 3102 , a second layer 3104 , and a third layer 3106 , wherein the second layer 3104 is the first layer. It is positioned between 3102 and the third layer 3106 .

In some embodiments, the second layer 3104 includes a metal such as copper. 46, the second layer 3104 comprises graphite. To bond the second layer 3104 with the first layer 3102 and the third layer 3106 , the heat distribution assembly 3100 may be subjected to a welding operation. For example, as shown in FIG. 46 , the heat distribution assembly 3100 includes a first weld 3112 and a second weld 3112 representing several welds between the first layer 3102 and the second layer 3104 . 3114), including several welds. Further, the heat distribution assembly 3100 may include several welds between the third layer 3106 and the second layer 3104 as represented by the third weld 3116 . By welding the second layer 3104 with the first layer 3102 and the third layer 3106, especially when the second layer 3104 comprises a granular material such as graphite, the second layer 3104 does not otherwise it can resist shear forces that can displace the second layer 3104 for the first layer 3102 and the third layer 3106 .

47 shows a flow diagram 3200 illustrating a method of forming a display assembly for an electronic device in accordance with some described embodiments. Electronic devices may include portable electronic devices such as smart phones or mobile wireless communication devices including wearable electronic devices.

In step 3202, a display layer is positioned between the touch-sensitive layer and the force-sensitive layer. The touch-sensitive layer is configured to detect a touch input that controls the electronic device. The force-sensitive layer is configured to detect an amount of force applied to the touch-sensitive layer. Each of the display layer, the touch-sensitive layer, and the force-sensitive layer can include an edge region comprising at least one connector. Also, some edge regions with connector(s) may be perpendicular or parallel to other edge regions. For example, the touch-sensitive layer may include an edge region having a connector, and the display layer may include an edge region having a connector, wherein the edge regions described above are parallel or at least substantially parallel to each other. do. Additionally, the force-sensitive layer may include an edge region comprising a connector. However, the edge region of the force-sensitive layer may be perpendicular or at least substantially perpendicular to the edge region of the display layer and/or the edge region of the touch-sensitive layer.

At 3204 , the display layer is bent such that the display layer at least partially curves around the force-sensitive layer. In some cases, the display layer is pre-bent. Also, the edge area of the display (bearing the connector) can be separated from the main part of the display layer. The major portion of the display layer refers to the surface that defines a substantial majority of the display layer, while the minor portion of the display layer refers to the portion separated from the major portion by a bend. The edge region with the connector may be positioned on or supported by the minor portion.

48 shows a flow diagram 3300 illustrating a method of forming a battery assembly for an electronic device in accordance with some described embodiments. The battery assembly may be used to supply current to several internal components (eg, integrated circuits, audio modules, cameras, lighting elements, etc.) located in the electronic device.

In step 3302, a housing is provided. The housing is designed to provide an enclosure for several components of the battery. The housing may include a first cover element that is sealed with the second cover element after the components are positioned between the first and second cover elements. Further, the housing may take the form of one of several different shapes. In this regard, the housing may include an L-shape configuration, an I-shape configuration, or a C-shape configuration (as non-limiting examples) based on the shape of the electrodes and separators. Additionally, any of these aforementioned configurations may include an opening or through hole designed to receive or provide space for an internal component of the electronic device.

In step 3304, a number of electrodes are inserted into the housing. Multiple electrodes may include a pair of anodes and cathodes. Additionally, each pair of electrodes is separated by a separator that physically insulates the electrode pairs from each other while still allowing the flow of charge between the electrode pairs. Additionally, each electrode may undergo a die cutting operation to form electrodes having a specific size and shape. The size and shape may include the size and shape depending on the housing. In this regard, each electrode of the electrode pair may include, as non-limiting examples, an L-shape, a C-shape, or an I-shape. Further, each separator and each electrode of the electrode pair may include an opening when the housing also includes the aforementioned opening to provide a through hole in the battery assembly.

In step 3306, a channel is formed in the housing. The channel may define a reduced dimension within the housing. In this regard, the housing may (substantially) comprise a first height. However, at a position corresponding to the channel, the housing may include a second height that is lower than the first height. The channel is designed to lower the profile of the battery assembly so that additional components (eg, flex circuitry) can easily pass along the channel and over the battery. In this regard, the channel may allow for repositioning of additional components within the electronic device. However, the housing of the battery may still accommodate components such as circuit boards at positions corresponding to (or within) the channels.

49 shows a flowchart 3400 illustrating a method for a method of forming a circuit board assembly in accordance with some described embodiments. The circuit board assembly is designed to support several operative components. The circuit board assembly may include a second circuit board or a stacked configuration in which the first circuit board is stacked, or alternatively the second circuit board may be overlaid by the first circuit board. When positioned in an enclosure or housing of an electronic device, the stacked configuration can reduce the overall space (in multiple dimensions) occupied by the circuit board assembly.

In step 3402, a first circuit board is provided. The first circuit board may include a first operative component. The first operative component includes a recess. Further, the first circuit board may include a plurality of (opposite) surfaces, each surface designed to support a plurality of operative components, some of which are electrically connected to each other via metal traces and/or vias. communicate with

In step 3404, the second circuit is secured with the first circuit board such that the first circuit overlays the second circuit board. The second circuit board may include a second operative component having a protrusion.

At step 3406 , the protrusion of the second operative component is positioned within the recess (or at least partially positioned within the recess). In this matter, the first operative component is “mated” with the second operative component through the recess and protrusion. This can reduce the gap between the first circuit board and the second circuit board as the first and second operative components are positioned closer to each other, as opposed to operative components that cannot be mated with each other. As a result, the circuit board assembly may include a lower profile and occupy less space in the electronic device.

50 shows a flow diagram 3500 illustrating a method of assembling an electronic device including an enclosure defining an interior volume, in accordance with some described embodiments. The enclosure may include a through hole that opens into an internal volume. In step 3502, the audio module is placed in the internal volume. The audio module may include an audio module housing carrying the diaphragm. The audio module may further include an audio module opening formed in the audio module housing and aligned with the through hole. Also, apart from the audio module opening, the audio module housing may have no additional openings, or alternatively may include an opening (or openings) that is sealed and covered by a liquid-tight seal, such that the audio module housing Defines the acoustic volume (including the front and rear volumes) that is kept separate from the air inside the interior volume defined by the enclosure.

In step 3504, a bracket is positioned around a portion of the audio module housing. For example, the bracket may at least partially surround a portion of the audio module housing associated with the audio module opening, thereby providing additional support to the audio module housing. Additionally, the bracket may be adhesively secured to the enclosure at or near the through hole. The adhesive used to secure the bracket to the enclosure may include a liquid resistant adhesive.

In step 3506, the sealing element seals the bracket against the enclosure in the through hole. The sealing element may be positioned between the bracket and the enclosure and may also engage the bracket and the enclosure. In this regard, the audio module housing may be sealed from the air within the interior volume, thereby sealing the diaphragm from the air within the interior volume. In addition, the audio module housing is positioned and designed to receive or release air from an external environment external to the electronic device, such as air entering a through hole. Also, using the diaphragm, the audio module can emit acoustic energy that exits the audio module opening and through hole.

FIG. 51 shows a flow diagram 3600 illustrating a method of manufacturing a heat distribution assembly for removing thermal energy from a heat-generating component in an electronic device having an enclosure sidewall, in accordance with some described embodiments. The heat distribution assembly is designed to provide structural support to the electronic device, particularly when the glass bottom wall coupled to the enclosure sidewall defines the electronic device's enclosure.

In step 3602, the first layer is secured with the second layer. The first layer may include a first bottom wall and a first sidewall extending from the first bottom wall. The second layer may include a second bottom wall that engages the first bottom wall. Also, the second layer can further include a second sidewall extending from the second bottom wall and engaging the first sidewall. In some cases, the first layer includes a first type of material such as steel (including stainless steel) to provide structural support. Also, in some cases, the second layer includes a second type of material, such as copper or graphite, designed to improve the thermal conductivity of the heat distribution assembly. Additionally, the first and second layers may each include additional sidewalls.

In step 3604, the third layer is secured with the second layer. The third layer may include a third bottom wall that engages the second bottom wall. The third layer may further include a third sidewall extending from the third bottom wall and engaging the second sidewall and the enclosure sidewall. The third layer may include a third type of material, such as steel (including stainless steel). In this regard, the third layer may be combined with the first layer to provide additional structural support. Also, the first and third layers may completely cover the second layer such that the second layer is not visible by the first and third layers.

When the heat distribution assembly is assembled and positioned in the electronic device, the first layer is designed to distribute thermal energy from the heat-generating component to the second layer. The second layer is also designed to distribute thermal energy throughout the various locations of the second layer such that the thermal energy can reach the third layer and be distributed to the enclosure sidewalls.

The various aspects, embodiments, implementations or features of the described embodiments may be used individually or in any combination. Various aspects of the described embodiments may be implemented by software, hardware, or a combination of hardware and software. The described embodiments may also be implemented as computer readable code on a computer readable medium for controlling manufacturing operations or as computer readable code on a computer readable medium for controlling a manufacturing line. A computer-readable medium is any data storage device that can store data that can be later read by a computer system. Examples of computer-readable media include read-only memory, random access memory, CD-ROMs, HDDs, DVDs, magnetic tape, and optical data storage devices. The computer readable medium may also be distributed over networked computer systems so that the computer readable code is stored and executed in a distributed fashion.

The foregoing description, for purposes of explanation, has used specific nomenclature to provide a thorough understanding of the described embodiments. However, it will be apparent to one skilled in the art that the specific details are not essential to practice the described embodiments. Accordingly, the foregoing descriptions of specific embodiments described herein are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teachings.

Claims (20)

An electronic device comprising:
a protective layer formed of a transparent material;
a display assembly covered by the protective layer, the display assembly comprising:
a touch-sensitive layer capable of detecting a touch input applied to the protective layer; and
a display layer defining a bend positioned at a periphery of the display assembly;
a frame supporting said protective layer, said frame defining an undercut region at least partially receiving said display layer at said bend; and
and a band defining an outer periphery of the electronic device, wherein the frame is coupled to the band. According to claim 1,
the display layer includes a first edge region having a first electrical connector;
wherein the touch-sensitive layer includes a second edge region having a second electrical connector, the second edge region being parallel to the first edge region. The electronic device of claim 2 , further comprising a flexible electrical connector coupled to the second electrical connector and surrounding the bend. The electronic device of claim 3 , wherein the flexible electrical connector is disposed between the frame and the display layer. delete The electronic device of claim 1 , wherein the band comprises a first portion and a second portion. The electronic device of claim 6 , wherein the first portion is electrically isolated from the second portion. The electronic device of claim 1 , wherein the frame further comprises a support element extending from the frame and positioned below the bend. The electronic device of claim 8 , further comprising an adhesive securing the display layer to the support element. A display assembly comprising:
a touch-sensitive layer comprising a first edge region having a first electrical connector;
a display layer for presenting visual information, the display layer comprising a bend region and a second edge region having a second electrical connector; and
a flex circuit coupled to the first electrical connector
wherein the flex circuit surrounds a perimeter of the bend region and extends parallel to the second electrical connector. 11. The method of claim 10,
the flexible circuit comprising a first flexible circuit;
and the display assembly includes a second flexible circuit coupled to the second electrical connector. The display assembly of claim 11 , wherein the second flexible circuit is positioned adjacent to at least a portion of the first flexible circuit. The display assembly of claim 10 , wherein the first edge region is parallel to the second edge region. The display assembly of claim 10 , wherein the display layer is disposed between the touch-sensitive layer and the flexible circuit. 11. The display assembly of claim 10, wherein the display layer comprises a light emitting diode display. 16. The display assembly of claim 15, wherein the display layer comprises an organic light emitting diode display. An electronic device comprising:
transparent protective layer;
a display assembly covered by the protective layer, the display assembly comprising:
force-sensitive layer; and
a display layer positioned at least partially between the protective layer and the force-sensitive layer, the force-sensitive layer positioned at least partially between a first portion of the display layer and a second portion of the display layer become -; and
enclosure bonded to the protective layer
wherein the enclosure is sized to receive the display assembly. The electronic device of claim 17 , wherein the enclosure comprises a metal band. The electronic device of claim 18 , wherein the metal band comprises sidewall components separated by a non-metallic material. The electronic device of claim 17 , wherein the enclosure defines a surface having a shape corresponding to a shape of an edge region of the display assembly.

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