CN207340290U - Circuit board assemblies, electronic equipment and circuit board assemblies for electronic equipment - Google Patents
Circuit board assemblies, electronic equipment and circuit board assemblies for electronic equipment Download PDFInfo
- Publication number
- CN207340290U CN207340290U CN201721209785.9U CN201721209785U CN207340290U CN 207340290 U CN207340290 U CN 207340290U CN 201721209785 U CN201721209785 U CN 201721209785U CN 207340290 U CN207340290 U CN 207340290U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic equipment
- layer
- component
- functional unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2220/00—Batteries for particular applications
- H01M2220/30—Batteries in portable systems, e.g. mobile phone, laptop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Telephone Set Structure (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
It the utility model is related to the circuit board assemblies, electronic equipment and circuit board assemblies for electronic equipment.The utility model discloses a kind of circuit board assemblies being located in electronic device.The circuit board assemblies include：First circuit board with the first installation surface；The first functional unit being positioned in first installation surface, first functional unit include concave part；The second circuit board of the first circuit board is electrically coupled to, the second circuit board has the second installation surface；With the second functional unit being positioned in second installation surface, second functional unit has protuberance, wherein the first circuit board is positioned relative to the second circuit board so that the protuberance is extended at least partly into the concave part.
Description
Technical field
It is described below and is related to electronic equipment.Specifically, it is described below and is related to the electronic equipment including circuit board assemblies.The electricity
Road plate component may include one or more circuit boards, wherein at least one circuit board be stacked on another circuit board and and its
Communicate.
Background technology
Electronic equipment may include the circuit board for being mounted with several integrated circuits., need to as electronic equipment ability improves
Want attaching integrated circuits.And this just needs additional circuit boards space.It is however, necessary by increasing circuit board size, miscellaneous part
Reduce, so as to which circuit board is fitted in electronic equipment.For example, battery may need the size reduced, this can cause battery
Relatively low charge storage capacity.
Utility model content
In one aspect, a kind of circuit board assemblies for electronic equipment are described.The circuit board assemblies may include have
The first circuit board of first installation surface.The circuit board assemblies may also include the first operation portion in the first installation surface
Part.First functional unit may include concave part.The circuit board assemblies may also include the second electricity for being electrically coupled to first circuit board
Road plate.The second circuit board may include the second installation surface.The circuit board assemblies may also include in the second installation surface
Second functional unit.Second functional unit may include protuberance.In some embodiments, the first circuit board is relative to
Two circuit boards position so that protuberance is extended at least partly into concave part.
On the other hand, a kind of electronic equipment is described.The electronic equipment may include the housing for limiting internal volume.The electricity
Sub- equipment may include to be arranged on the circuit board assemblies in internal volume.The circuit board assemblies may include to carry on the first surface
The first circuit board of first functional unit.The first circuit board can also carry second on the second surface opposite with first surface
Functional unit.The circuit board assemblies may also include by the overlapping second circuit board of first circuit board.The second circuit board can be in face
The 3rd functional unit is carried on to the 3rd surface of second surface.The circuit board assemblies may also include the first shielding element, this
One shielding element covers first circuit board and provides the first electromagnetic interference (EMI) shielding case for the first functional unit.The circuit
Plate component may also include the secondary shielding element being positioned between first circuit board and second circuit board.The secondary shielding element
2nd EMI shielding cases can be provided for second component.
On the other hand, a kind of circuit board assemblies are described.The circuit board assemblies can include：Including bottom wall and side wall
Housing, the side wall combines with the bottom wall to limit internal volume.The circuit board assemblies can be included in the side wall
Place and the transparency protected covering of housing coupling.The circuit board assemblies can also include being arranged on institute at least in part
The display assembly in internal volume is stated, the display assembly is configured as preventing visual information from can pass through the transparent guarantor
Shield covering is seen.And the circuit board assemblies can also include being positioned in circuit board assemblies in the internal volume.
The circuit board assemblies include：First circuit board, the first circuit board have the first installation surface and are mounted to described the
First integrated circuit of one installation surface, and the second circuit with the second installation surface towards first installation surface
Plate, the second circuit board have the second integrated circuit for being mounted to second installation surface.
On the other hand, a kind of method for forming circuit board assemblies is described.This method, which may include to provide, includes the
The first circuit board of one functional unit.First functional unit may include concave part.This method may also include second circuit board
It is fixed together with first circuit board so that first circuit board is overlapping with second circuit board.The second circuit board may include second
Functional unit, second functional unit include protuberance.This method, which may also include, is positioned at protuberance in concave part.
When one skilled in the relevant art checks the following drawings and is described in detail, other of these embodiments are
System, method, feature and advantage will be or will become obviously.It is intended to all such spare systems, method, feature and advantage quilt
It is included in this specification and the utility model content, is included in the range of these embodiments, and by following right
Claim is protected.
Brief description of the drawings
By the embodiment below in conjunction with attached drawing, the disclosure will be apparent from, wherein similar drawing reference numeral refers to
Show similar structural detail, and wherein：
Fig. 1 shows the isometric front view of the embodiment of the electronic equipment according to some embodiments；
Fig. 2 shows the isometric back view of electronic equipment shown in Fig. 1, which further illustrates the attached of electronic equipment
Add features；
Fig. 3 shows the partial exploded view of electronic equipment shown in Fig. 1, and it illustrates the various portions of electronic equipment
Part；
Fig. 4 shows the partial exploded view of electronic equipment shown in Fig. 1, which further illustrates the attached of electronic equipment
Made component；
Fig. 5 shows the sectional view intercepted along the line A-A in Fig. 1 of electronic equipment shown in Fig. 1；
Fig. 6 shows the sectional view of the alternative embodiment of the electronic equipment according to some embodiments；
Fig. 7 shows the sectional view intercepted along the line B-B in Fig. 1 of electronic equipment shown in Fig. 1；
Fig. 8 shows the sectional view of the alternative embodiment of the electronic equipment according to some embodiments；
Fig. 9 shows the plan of the embodiment of the frame according to some embodiments；
Figure 10 shows the sectional view of the interceptions of A-A along the line of frame shown in fig.9；
Figure 11 shows the sectional view of the alternative embodiment of the frame according to some embodiments, and it illustrates this
The surface of frame has prominent features portion；
Figure 12 shows the sectional view of the embodiment of electronic equipment, and it illustrates the electronic equipment to have frame and portion
Divide in the embedded frame in ground and extend substantially into the support component in frame；
Figure 13 shows the sectional view of the embodiment of the electronic equipment according to some embodiments, and it illustrates this
Electronic equipment has protection covering and is extended to provide the side member of additional support for protection covering；
Figure 14 shows the sectional view of the embodiment of the electronic equipment according to some embodiments, and it illustrates this
Electronic equipment has various structural reinforcements；
Figure 15 shows the plan of the embodiment of the electronic equipment according to some embodiments, and it illustrates quilt
The plate being positioned in the housing of the electronic equipment；
Figure 16 shows the partial side view of the electronic equipment shown in Figure 15, which further illustrates the first extension of plate
It is fixed together with display assembly；
Figure 17 shows the sectional view of the embodiment of the electronic equipment according to some embodiments, and it illustrates this
The housing of electronic equipment and the supporting structure being formed integrally with the shell；
Figure 18 shows the plan of the embodiment of the protection covering according to some embodiments；
Figure 19 shows the sectional view of the interceptions of B-B along the line of protection covering shown in figure 18, it further shows
The recess being formed in protection covering；
Figure 20 shows the sectional view of the embodiment of the electronic equipment according to some embodiments, and it illustrates guarantor
Shield covering (as shown in Figure 18 and Figure 19) is fixed together with housing；
Figure 21 shows the sectional view of the embodiment of the electronic equipment according to some embodiments, and it illustrates guarantor
Shield covering extends above frame and adjacent sidewall positioning parts；
Figure 22 shows the exploded view of the battery according to some embodiments；
Figure 23 shows the plan of the first electrode shown in Figure 22；
Figure 24 shows the alternative embodiment of the electrode suitable for battery component according to some embodiments
Plan；
Figure 25 shows the alternative embodiment of the electrode suitable for battery component according to some embodiments
Plan；
Figure 26 shows the alternative embodiment of the electrode suitable for battery component according to some embodiments
Plan；
The embodiment that Figure 27 shows the battery being located in electronic equipment according to some embodiments, wherein should
Battery has the shape for the internal part for adapting to electronic equipment；
Figure 28 shows the alternative embodiment party of the battery component being located in electronic equipment according to some embodiments
Case, the wherein battery component have the shape for the multiple internal parts for adapting to electronic equipment；
Figure 29 shows the alternative embodiment party of the battery component being located in electronic equipment according to some embodiments
Case, the wherein battery component have the opening for the internal part for adapting to electronic equipment；
Figure 30 shows the alternative embodiment party of the battery component being located in electronic equipment according to some embodiments
Case, the wherein battery component are positioned in (electronic equipment) housing above the first internal part of electronic equipment；
Figure 31 shows the sectional view intercepted along the line C-C in Figure 30 of electronic equipment shown in fig. 30；
Figure 32 shows the exploded view of the circuit board assemblies shown in Fig. 4 according to some embodiments；
Figure 33 shows the sectional view of the circuit board assemblies shown in Figure 32, and it illustrates the various interior of circuit board assemblies
Portion's component；
Figure 34 shows the alternative embodiment of circuit board assemblies, it illustrates the circuit board assemblies be directed to enter protect into
Modification is gone；
Figure 35 shows the alternative embodiment of the circuit board assemblies according to some embodiments, and it illustrates the electricity
Road plate component has the flexible circuit with the circuit board electric coupling of the circuit board assemblies；
Figure 36 shows the sectional view of the circuit board assemblies shown in Figure 35, prolongs it illustrates flexible circuit between circuit board
Stretch；
Figure 37 shows the sectional view of the alternative embodiment of the circuit board assemblies according to some embodiments, it shows
The internal part for having gone out circuit board assemblies has corresponding geometry；
Figure 38 shows the sectional view of the alternative embodiment of the circuit board assemblies according to some embodiments, it shows
Having gone out the circuit board assemblies has several solder masks for being used to support circuit board；
Figure 39 shows the isometric views of the embodiment of the audio-frequency module according to some embodiments；
Figure 40 shows the sectional view intercepted along the line D-D in Figure 39 of the audio-frequency module shown in Figure 39, it shows
Several inner features；
Figure 41 shows the sectional view of electronic equipment, and it illustrates the audio-frequency module to be positioned in the electronic device；
Figure 42 shows the exploded view of the hot allocation component according to some embodiments；
Figure 43 shows the partial sectional view of the electronic equipment shown in Fig. 1, and it illustrates hot allocation component to be positioned in electricity
In sub- equipment；
Figure 44 shows the side view of the alternative embodiment of the hot allocation component according to some embodiments；
Figure 45 shows the isometric views of the alternative embodiment of the hot allocation component according to some embodiments, its
Show that hot allocation component is modified to be able to receiving part；
Figure 46 shows the isometric views of the alternative embodiment of the hot allocation component according to some embodiments；
Figure 47 is shown according to the display assemblies shown for forming electronic equipment of some embodiments
The flow chart of method；
Figure 48 shows the side for showing the battery component for forming electronic equipment according to some embodiments
The flow chart of method；
Figure 49 shows the flow for showing the method for forming circuit board assemblies according to some embodiments
Figure；
Figure 50 shows the flow chart for showing method for assembling an electronic device according to some embodiments,
The electronic equipment includes the housing for limiting internal volume；And
Figure 51 shows the flow for showing the method for making hot allocation component according to some embodiments
Figure, the hot allocation component are used to remove heat from the heat generating components in the electronic equipment with housing sidewall.
Those skilled in the art will understand and appreciate that traditionally, the various features portion for the attached drawing being discussed below is not
Must be drawn to scale, and the various features portion of attached drawing and the size of element can be expanded or shunk, to be shown more clearly that herein
The embodiment of described the utility model.
Embodiment
Now by referring particularly to the representative embodiment being shown in the drawings.It should be appreciated that not purport is described below
Embodiment is being limited to a preferred embodiment.Limited on the contrary, it is intended to be included in by appended claims
Alternative form, modification and equivalents in the spirit and scope of the fixed embodiment.
In the following detailed description, it with reference to be formed the attached drawing of part for specification, and in the accompanying drawings to illustrate
Bright mode shows the specific embodiment according to the embodiment.Although it describe in detail these embodiments enough
So that those skilled in the art can put into practice the embodiment, it is to be understood that, these examples are not limiting, because
Other embodiments can be used in this, and change can be made in the case where not departing from the spirit and scope of the embodiment.
Disclosure below is related to a kind of electronic equipment.The electronic equipment may include several enhancings better than traditional equipment
Part.For example, the electronic equipment may include the housing for limiting the internal volume of electronic equipment.The electronic equipment, which may also include, to be extended to
Display at least some positions of housing, so as to increase the size of display.The display can be further include touch-sensitive layer and
A part for the display assembly of power photosensitive layer.In order to accommodate the display sizes of increase, which may include around display
The frame (or frame) of device, the wherein frame have the size reduced.However, in the case of without specific modification, frame
The size of reduction can expose being electrically connected between display assembly component and (in electronic equipment) flexible circuit and machine
Tool connects.In this regard, electricity corresponding to its at the diverse location that some components of display assembly can be in the electronic device
Road (including flexible circuit) electric coupling and machinery coupling, to hide electrically and mechanically.For example, touch-sensitive layer and display
It can be coupled at a position of electronic equipment internal with its related circuit electric coupling and machinery, and power photosensitive layer is being located away touching
At another diverse location electrically and mechanically between photosensitive layer, display and its respective flexible circuits with circuit electric coupling
And machinery coupling.In addition, by, to electrically and mechanically connecting up, can make at diverse location display assembly (and
Its component) volume that occupies reduces, and that the additional space in the internal volume of electronic equipment can be in electronic device is another
A or multiple and different components use.
The electronic equipment may also include the circuit board assemblies for being designed to occupy less space in the electronic device.For example,
The circuit board assemblies, which can be divided into, is stacked on first circuit board above second circuit board.The stacking configuration of multiple circuit boards
(one stacks on the other side) can reduce the occupied area of circuit board assemblies on two dimensions, so as to be miscellaneous part
And/or the battery component with increased in size provides additional space.In addition, aforementioned circuit plate may include to be positioned in it is multiple opposite
Functional unit (for example, integrated circuit or processor circuit) on surface.In addition, the circuit board assemblies may include to be designed to
Signal is transmitted between first circuit board and second circuit board and causes first circuit board and second circuit board (and its corresponding operation portion
Part) several interpolaters for communicating with one another or connectors.
In some cases, the circuit board assemblies of stacking may include and (be located in one of on circuit board) to include concave part
Functional unit and (on another circuit board) protuberance for including partly being positioned in concave part it is (or prominent
Features) additional operations component.In this way, receiving a part for additional operations component based on concave part, circuit board can be determined
Position is obtained closer to so as to further reduce the occupied area of the circuit board assemblies of stacking.In addition, in some cases, operation
Component can be electrically coupled to each other.For example, concave part may include connector, and protuberance may include the connection that is electrically coupled to concave part
The connector of device.Due to the electrical connection between functional unit, circuit board can also communicate with one another.This can be reduced to for electric coupling electricity
The demand of the single and dedicated electric connector of road plate.
The electronic equipment may also include battery component or internal electric source.Partially due to display assembly and circuit board assemblies
The modification for forming additional space in the housing, battery component can dimensionally increase and occupy at least one of additional space
Point, so as to increase the charge capacity of battery component.In addition, the battery component may include the shape in addition to traditional line shape.
For example, battery component may include the L-shape configuration formed in the following manner：Several electrodes are die-cut to similar with battery component
L-shape configuration, to form battery component.In addition, additional component such as antenna and circuit can be repositioned in the electronic device, with
Just the size of battery component is increased.In addition, the battery component may include to be designed to accommodate across battery component and specifically across
The modification of the flexible circuit of channel routing such as passage.
In addition, in some cases, housing may include with the transparent protective layer of covering display assembly (for example, covering glass
Glass) coupling metal tape.The metal tape can include metal such as aluminium, or the metal alloy comprising aluminium.The housing may also include with
The additional protective layers of metal tape coupling.The additional protective layers can include nonmetallic materials, glass, sapphire, plastics etc..Should
Additional protective layers can substantially limit the rear wall or bottom wall of electronic equipment.Therefore, heat is distributed and consumed from electronic equipment by housing
Scattered ability may be restricted, because the amount of metal for housing is confined to metal tape, and compared to formation metal tape
Metal, glass have notable lower thermal conductivity.
When one or more of electronic equipment component (such as integrated circuit) produces heat, it may be necessary to remove internal
The heat of volume, is damaged to avoid one or more of electronic equipment component.In this regard, electronic equipment may include to
The hot allocation component leaned on or set close to additional protective layers.The hot allocation component is designed to make from one or more heating parts
Thermal dissipation caused by part (or redistributing) arrives metal tape, so as to allow thermal energy to dissipate from electronic equipment.The hot distribution group
Part may include several metal layers, and one of metal layer can have of a relatively high thermal conductivity (compared to remainder layer).Cause
This, which may include the housing with the bottom wall made of glass, which can improve the overall beautiful of electronic equipment
Degree, at the same can also raise in the temperature of electronic equipment internal and cause electronic equipment any internal part damage before remove
Heat in electronic equipment.In addition, the relatively low layer of thermal conductivity can prevent heat transfer to glass bottom wall, so as to be set in electronics
Standby user prevents or limits thermal energy and reaches user when gripping electronic equipment.
In addition, when user and display assembly interact, power photosensitive layer, which can determine that, is applied in power over the display
Amount, to generate order according to the amount of identified power.However, (by the protective layer for covering display assembly) is put on
The power of display assembly can bend display assembly and protective layer, so as to reduce internal volume and increase air pressure inside.Increase
Air pressure inside can influence miscellaneous part, be such as designed to produce acoustic energy audio-frequency module.In order to by audio-frequency module with increase
Air pressure keep apart, the audio-frequency module may include encapsulate audio-frequency module component (the rear volume for including audio-frequency module) shell or
Housing, and the shielding case of the air in insulating electron equipment internal volume is provided, and therefore by the rear volume of audio-frequency module
Keep apart with the pressure change in electronic equipment.In this way, audio-frequency module would not be influenced be subject to pressure change in electronic equipment,
And acoustic energy is produced in the case where being disturbed from pressure change.
These and other embodiments are discussed below with reference to Fig. 1 to Figure 51.However, those skilled in the art will be easy
Ground understands, herein in relation to the detailed description given by these attached drawings merely for illustrative purpose, and should not be construed as limiting
Property processed.
Fig. 1 shows the isometric front view of the embodiment of the electronic equipment 100 according to some embodiments.One
In a little embodiments, electronic equipment 100 is tablet computer equipment.In other embodiments, electronic equipment 100 is wearable electricity
Sub- equipment, the wearable electronic include being designed to adjunct (for example, wrist) around user by electronic equipment 100
The one or more band (not shown) being fixed together with user.In the embodiment depicted in fig. 1, electronic equipment 100 is
Mobile communication equipment such as smart mobile phone.Therefore, cellular network communication can be realized as non-limiting example, electronic equipment 100
Wireless communication, Bluetooth communication (2.4GHz), and/or WLAN (WLAN) communication (2.4GHz to 5GHz) of form.Such as figure
Shown, electronic equipment 100 may include display assembly 102, which includes being designed to text message, static map
The display layer of visual information is presented in the form of picture, and/or video information.Although not shown in the drawings, but display assembly 102 may be used also
Including touch-sensitive layer, which is designed to detect the touch input in display assembly 102, for example to control in display
The information presented on component 102.In addition, display assembly 102 may also include and be designed to detection and be applied to display assembly
The power photosensitive layer of the amount of 102 power.The amount of identified power may correspond to be used for control display to processor circuit (not shown)
The specific input or order of device assembly 102.For example, the not same amount of detected power may correspond to different or distinguishing life
Order.
In order to protect display assembly 102, electronic equipment 100 may include first protection overlapping with display assembly 102
Layer 104.Second protective layer (not shown) of the electronic equipment 100 will be shown below and discuss.First protective layer 104 can wrap
Containing one or more transparent materials, as non-limiting example, including glass, sapphire or plastics.As shown in the figure, the first protection
Layer 104 may include to promote the opening for carrying out user mutual with electronic equipment 100.For example, the first protective layer 104 may include that first opens
106 and second opening 108 of mouth.The electronic equipment 100 may include the image by the one or more images of 106 capture of the first opening
Capture device (not shown).The electronic equipment 100 may also include the audio-frequency module (not shown) for the acoustic energy for producing audible sound form,
The acoustic energy leaves electronic equipment 100 via the second opening 108.
In addition, electronic equipment 100 may include the band 110 for limiting the neighboring of electronic equipment 100.In general, band 110 wraps
Include the shape similar with four side rings.However, other shapes are also possible.In addition, band 110 can limit multiple side walls and one is opened
Mouthful, to receive the first protective layer 104 and the second protective layer (not shown) at least in part and be fixed on one with the two protective layers
Rise.In some embodiments, band 110 includes metal, such as aluminium or the alloy comprising aluminium.In this regard, band 110 can be
Electronic equipment 100 provides rigidity supporting structure.In addition, when band 110 is formed by metal, band 110 can be used for supporting wireless communication.
For example, band 110 may include to form the first side wall component 112 of U-shaped design, and it is similarly formed the second sidewall portion of U-shaped design
Part 114.The first side wall component 112 and second sidewall component 114 can respectively be self-bonded radio circuit in electronic equipment 100 (not
Show) play a role so that 114 each self-forming its corresponding radio circuit of the first side wall component 112 and second sidewall component
At least a portion of antenna.For example, the first side wall component 112 can play a role with reference to WLAN radio circuits, and second sidewall
Component 114 can play a role with reference to cellular network radio circuit.
In addition, band 110 may also include the 3rd side member 116 and the 4th side member 118, wherein the 3rd side member
116 and the 4th side member 118 divided by cut zone or opening with the first side wall component 112 and second sidewall component 114
Separate.For example, band 110 may include the first cut zone 122 and the second cut zone 124, first cut zone and second point
Cut region to be combined, the 3rd side member 116 is separated with the first side wall component 112 and second sidewall component 114.Separately
Outside, band 110 may include the 3rd cut zone 126 and the 4th cut zone 128, the 3rd cut zone and the 4th cut zone phase
With reference to i, the 4th side member 118 is separated with the first side wall component 112 and second sidewall component 114.Previous segmentation area
Domain can be filled with nonmetallic materials, such as molded plastics (or other non-conducting materials), to be provided together for each several part of band 110
Flat coplanar surface.In the first side wall component 112 and 114 and the 3rd side member 116 of second sidewall component and the 4th side of sidewall portion
In the case that part 118 is electrically isolated, the first side wall component 112 and second sidewall component 114 can be used as a part for antenna, and the 3rd
116 and the 4th side member 118 of side member can be used as respectively with the 3rd side member 116 and 118 thermocouple of the 4th side member
The electrically grounded portion of the one or more internal part (not shown) connect.In addition, the first side wall component 112, second sidewall component
114th, each of the 3rd side member 116 and the 4th side member 118 can provide protectiveness at least some internal parts
Structure member, and provide heat dissipation and heat remove function, premise for some heat generating components (not shown) of electronic equipment 100
It is the heat generating components and at least one component thermal coupling in above-mentioned parts.In addition, the first side wall component 112, second sidewall
Component 114, the 3rd side member 116 and the 4th side member 118 can each represent the first side wall, second sidewall, the 3rd respectively
At least a portion of side wall and the 4th side wall.
Electronic equipment 100 may also include one or more input equipments.For example, electronic equipment 100 includes being designed to work as
First button 130 of generation input when being pressed.The input can generate the processor circuit being sent in electronic equipment 100 (not
Show) electric signal, to change the visual information presented on display assembly 102.As shown in the figure, 130 edge of the first button
3rd side member 116 positions.However, other positions are also possible.In addition, although not shown in the drawings, but electronic equipment 100
It may include the switch for being designed to provide further user input function.
In addition, electronic equipment 100 may also include be designed to receive CA cable assembly (not shown) and with the CA cable assembly electricity
The data port 132 of coupling.Data port 132 can receive data/communication from CA cable assembly, and receive electric energy to be pointed to electricity
Battery component (not shown) charging in sub- equipment 100.In addition, electronic equipment 100 may include that being designed to various users hands over
Mutual additional opening.For example, electronic equipment 100 may include the opening 134 being formed in second sidewall component 114 or through hole
Neighbouring audio-frequency module (not shown).The opening 134 allows to exit electronic equipment 100 from acoustic energy caused by audio-frequency module.Separately
Outside, electronic equipment 100 may also include the microphone near the opening 136 being formed in second sidewall component 114 or through hole
(not shown).Microphone can be positioned so that by opening 136 to receive acoustic energy.
Fig. 2 shows the isometric back view of electronic equipment 100 shown in Fig. 1, which further illustrates electronic equipment
100 additional features.As shown in the figure, electronic equipment 100 may include the second protective layer 144 being fixed together with band 110.The
Two protective layers 144 can be combined with band 110, and to limit the housing for including internal volume or cavity, the internal volume or cavity connect
Several internal parts are received, as non-limiting example, such as circuit board, integrated circuit and battery component.In this regard,
Band 110 may include the first edge region for receiving the first protective layer 104 (as shown in Figure 1), and receive the second protective layer 144
Second edge region, wherein first edge region and second edge region are located at the opposite or opposite position of band 110.Separately
Outside, the second protective layer 144 is referred to alternatively as bottom wall or rear wall.
In general, the second protective layer 144 can include the one or more materials for providing beautiful finish, such as glass,
Sapphire or plastics.In addition, in some cases, the material composition of the second protective layer 144 is permissible from electronic equipment 100
Radio frequency (" the RF ") communication of internal radio circuit (not shown) generation penetrates the second protective layer 144.In this way, electronic equipment 100
Wireless communication can be carried out with other equipment (not shown) by the RF communications substantially suppressed from the second protective layer 144.
In addition, the second protective layer 144 may include to promote the opening for carrying out user mutual with electronic equipment 100.For example, second
Protective layer 144 may include the first opening 146 and the second opening 148.Electronic equipment 100 may include by 146 capture of the first opening
The image capture device (not shown) of one or more images.Electronic equipment 100 may also include the sudden strain of a muscle being aligned with the second opening 148
Optical module (not shown), wherein flash module are produced during the image capture event from image capture device and opened through second
The luminous energy of mouth 148, to strengthen the picture quality of the one or more images obtained by image capture device.In addition, except first
Outside button 130 (as shown in Figure 1), electronic equipment 100 may also include the second button 150, second button when pressed with
Generate and input with 130 similar mode of the first button.As shown in the figure, the second button 150 is positioned along the 4th side member 118.So
And other positions are also possible.
Fig. 3 shows the partial exploded view of electronic equipment 100 shown in Fig. 1, and it illustrates each of electronic equipment 100
Kind component.For simplicity, several features of electronic equipment 100 are not shown.As shown in the figure, the first protective layer 104 can be with
Display assembly 102 is overlapping.In addition, the first protective layer 104 can pass through adhesive phase (not shown) and 102 cementation of display assembly
Together.
As shown in the figure, display assembly 102 may include to be designed to the touch-sensitive layer 202 of reception touch input, be designed to
The display layer 204 of visual information is presented and is designed to detection by applying a force to the first protective layer 104, touch-sensitive layer 202
The power photosensitive layer 206 of the amount of the power on display layer 204 is applied in or acts on at least one of display layer 204.In addition,
Although not shown in the drawings, but display assembly 102 may include be used for by touch-sensitive layer 202 together with 204 cementation of display layer and
By adhesive phase of the display layer 204 together with 206 cementation of power photosensitive layer.
Touch-sensitive layer 202 is designed to receive touch input when for example user's (not shown) presses the first protective layer 104.Touch
Photosensitive layer 202 may include condenser type Touch technologies.For example, touch-sensitive layer 202 may include the capacitance material layer for keeping electric charge.The capacitance material
The bed of material is designed in the part with forming multiple condenser type parallel-plates at 204 corresponding position of display layer.With regard to this point
Speech, when user touches the first protective layer 104, user forms one or more capacitors.In addition, user causes across one
Or the voltage drop of multiple capacitors, this then causes the electric charge of capacitance material at one of the position correspondence with user's touch input
Or change at multiple specific contact points.Capacitance changes and/or voltage drop can be measured by electronic equipment 100, to determine touch input
Position.In addition, touch-sensitive layer 202 may include fringe region 226, which includes connector (showing later).
In some embodiments, display layer 204 includes relying on backlight the liquid crystal display of visual information is presented
(“LCD”).In figure 3 in shown embodiment, display layer 204 includes being designed to illuminate having for each pixel when needed
Machine light emitting diode (" OLED ") display.When display layer 204 includes OLED technology, compared to LCD display, display layer
204 can have the form factor reduced.In this regard, display assembly 102 can have less occupied area, so as to be
Miscellaneous part such as battery component (showing later) provides more spaces.In addition, when display layer 204 includes OLED technology,
Display layer 204 can bending or bending in the case where not causing damage to display layer 204.For example, as shown in figure 3, display layer 204
Including bending section 208.Bending section 208 may include the bending section or the about bending section of 180 degree of 180 degree.Bending section 208 allows to show
Show at least a portion bending or bending of the layer 204 around power photosensitive layer 206, as shown in Figure 3.In addition, display layer 204 may include have
The fringe region 210 of connector (not shown), the connector are used to being electrically coupled to circuit board assemblies (not show display layer 204
Go out) flexible circuit (not shown) electric coupling and machinery coupling, wherein flexible circuit carry out display layer 204 and circuit board assemblies
Communication.In addition, in some embodiments, display layer 204 may include that active matrix organic light-emitting diode (" AMOLED ") is aobvious
Show device.In addition, as shown in figure 3, the fringe region 226 of touch-sensitive layer 202 relative to the fringe region 210 of display layer 204 it is parallel or
It is at least substantially parallel, even if being also such when display layer 204 includes bending section 208.
Power photosensitive layer 206 can by determine to put on the first protective layer 104, touch-sensitive layer 202 and/or display layer 204 power or
The amount of pressure operates.In this regard, power photosensitive layer 206 can distinguish the not same amount for the power for being applied in electronic equipment 100.Power
Not same amount may correspond to different user's inputs.Power photosensitive layer 206 may include multiple parallel capacitor plate arrangements, wherein each electricity
A plate in container panel arrangement has electric charge.When applying a force to the first protective layer 104, the first protective layer 104 is so that one
Pair or the distance between multipair plane-parallel capacitor reduce, rolled so as to cause between the one or more pairs of plane-parallel capacitors of sky i
The change of capacitance.The knots modification of the capacitance corresponds to the amount of the power acted on the first protective layer 104.In addition, such as enlarged view
Shown, power photosensitive layer 206 may include the connector 218 on the fringe region 220 of power photosensitive layer 206, wherein fringe region 220
It is vertical or at least substantially vertical relative to the fringe region 210 of display layer 204 and the fringe region 226 of touch-sensitive layer 202.Cause
This, connector 218 (can show) perpendicular positioning or at least substantially vertically fixed later relative to the connector of display layer 204
Position.
In addition, in order to support the first protective layer 104 and promote assembling of first protective layer 104 with band 110 (such as Fig. 1 institutes
Show), electronic equipment 100 may include to receive the first protective layer 104 and is fixed together by adhesive phase 166 and the first protective layer
Frame 154.Therefore, frame 154 can have the size and dimension consistent with the first protective layer 104.Frame 154 can be at least partly
Ground is positioned between the first protective layer 104 and band 110.Frame 154 can be formed by polymeric material such as plastics, and may be used also
Including in the becket (not shown) being partially embedded into during insert molding operates in polymeric material.In this regard, frame
Frame 154 can be in one or more components of the first protective layer of structural support 104, and display assembly 102.This will below
In show.
Fig. 4 shows the partial exploded view of electronic equipment 100 shown in Fig. 1, which further illustrates electronic equipment
100 additional component.For simplicity, several features of electronic equipment 100 are not shown.As shown in the figure, band 110 and second
Protective layer 144 can combine, to provide internal volume 152 for several internal parts.For example, electronic equipment 100 may include to be set
Count into the battery component 160 for the functional unit that electric current is assigned to electronic equipment 100.The battery component 160 may include to be designed
Into the rechargeable battery that electric current is received during recharging.For example, electronic equipment 100 may include to be electrically coupled to battery component
160 inducing receiver coil 162 (being formed by metal such as steel).Inducing receiver coil 162 is located at electronics in close come from
The alternating magnetic field of the equipment (not shown) of device external can receive sensing electric current when placing from alternating magnetic field.From inducing receiver
The induced electricity stream of coil 162 is by transformer, so as to convert alternating current to be used subsequently to charge to battery component 160 (or again
Charging) direct current.In addition, the second protective layer 144 provides external magnetic field minimum impedance or does not provide impedance so that alternation
Magnetic field reaches inducing receiver coil 162.
In addition, battery component 160 may also include with the size (for example, on z-dimension of Cartesian coordinate) reduced
Passage 164, so as to allow component such as flexible circuit (not shown) to extend along battery component 160 and along passage 164 in battery pack
The top of part 160 passes through.Partially due to the space increase that passage 164 provides, other internal parts such as antenna element (do not show
Go out) it can be repositioned in the internal volume 152 of electronic equipment 100, so as to form additional space for battery component 160.In this way,
The volume (size) of battery component 160 can increase, and the volume increased allows battery component 160 to increase electric memory capacity, makes
Obtain electronic equipment 100 and longer 100 usage time of electronic equipment is provided between the charge event of battery component 160.
Electronic equipment 100 may also include the circuit board assemblies 170 with multiple functional units.As shown in the figure, circuit board group
Part 170 may include first circuit board 172 and second circuit board 174, and wherein first circuit board 172 is stacked on second circuit board 174
Top.In this way, circuit board assemblies 170 can save the space on x dimension and y-dimension in internal volume 152.In addition, the first electricity
Road plate 172 and second circuit board 174 may include multiple surfaces, wherein each surface in the plurality of surface is designed to carrying one
A or multiple components (for example, processor circuit).The various features portion of circuit board assemblies 170 is discussed below.
Electronic equipment 100 may also include the first audio-frequency module 182 and for the acoustic energy for being designed to produce audible sound form
Two audio-frequency modules 184.Each audio-frequency module in the audio-frequency module may include the opening for sending acoustic energy.However, each sound
The acoustic volume that frequency module is designed to include to isolate with the internal volume of electronic equipment 100 152 (is limited by its respective audio module
It is fixed).In this way, when internal volume 152 is for example, by pressing and bending the first protective layer 104 (as shown in Figure 3) with by touch input
And/or power input provide to electronic equipment 100 to change when, audio-frequency module (acoustically) from internal volume 152 change
And in internal volume 152 air pressure of related increase influence.This will be discussed further below.
The electronic equipment 100 may also include hot allocation component 190.Although not shown in the drawings, but hot allocation component 190 can wrap
Include several material layers.In some embodiments, which is different.For example, some layers are by first kind material shape
Into, and other layers are formed by the Second Type material different from first kind material.First kind material, which can include, to be had relatively
The material of higher heat-conductivity.For example, first kind material can have about 400W/m*K (watts/meter/Kelvin) comprising known
Thermal conductivity copper.Alternatively, the first kind can include the graphite of the known thermal conductivity with about 170W/m*K.Therefore,
One types of material is very suitable for receiving thermal energy and thermal energy is transmitted or is assigned to another from a position in electronic equipment 100
A position, so as to promote to remove the thermal energy in electronic equipment 100.Second Type material can include firmer material, such as not
Become rusty steel.In this regard, Second Type material can have relatively low thermal conductivity.However, Second Type material can be with 1)
There is provided for first kind material and protect covering, 2) it is that electronic equipment 100 provides structural support, and/or 3) offer can work
Make surface so that component (not shown) and hot allocation component 190 to be fixed together for example, by welding operation.Hereafter will be further
Discuss each layer of hot allocation component 190.
Hot allocation component 190 is designed to reboot or redistributes the heat that is produced in electronic equipment 100.Example
Such as, which may include to become known for (being provided by battery component 160) electric energy is converted into heat during operation
The functional unit of energy, such as integrated circuit.As non-limiting example, hot allocation component 190 can by hot allocation component 190 with
Contact between circuit board assemblies 170 comes and 170 thermal coupling of circuit board assemblies.In addition, hot allocation component 190 can be with the heat of band 110
Coupling so that the thermal energy received by hot allocation component 190 from circuit board assemblies 170 can be delivered to band 110 at least in part.Cause
This, because at least part thermal conductivity lost using the second protective layer 144 (nonmetallic) is weighed by using hot allocation component 190
It is new to obtain.In addition, hot allocation component 190 can have the size and dimension consistent with the second protective layer 144 so that hot allocation component
190 coverings or the surface at least substantially covering the second protective layer 144.For example, the x dimension and y-dimension of hot allocation component 190 can
It is identical, or the x dimension and y-dimension of the second protective layer 144 are substantially similar to respectively.
Although not shown in the drawings, but electronic equipment 100 may include additional component, as non-limiting example, such as tactile
Engine and inside antenna.In addition, although not shown in the drawings, but electronic equipment 100 may include to make electronic unit (for example, display
Component 102, circuit board assemblies 170) it is electrically connected each other and several flexible circuits for being electrically connected with battery component 160.
Fig. 5 shows the sectional view intercepted along the line A-A in Fig. 1 of electronic equipment 100 shown in Fig. 1.As schemed
Show, the layer of assembled display component 102, i.e. touch-sensitive layer 202, display layer 204 and power photosensitive layer 206.It is although not shown in the drawings, but aobvious
Show that device assembly 102 may include to be used for by touch-sensitive layer 202 together with 204 cementation of display layer and by display layer 204 and power photosensitive layer
The adhesive phase of 206 cementations together.
The touch-sensitive layer 202 is designed to receive touch input when for example user's (not shown) presses the first protective layer 104.
Touch input can be relayed to circuit board assemblies 170 (as shown in Figure 4) by the first flexible circuit 212 from touch-sensitive layer 202, this
One flexible circuit is coupled by the connector 222 of touch-sensitive layer 202 with 202 electric coupling of touch-sensitive layer and machinery.Connector 222 can be determined
Position is on the fringe region 226 (as shown in Figure 3) of touch-sensitive layer 202.As shown in the figure, the first flexible circuit 212 can surround display layer
204 and power photosensitive layer 206 bend or bend, with 202 electric coupling of touch-sensitive layer and machinery couple.
Frame 154 may include that the design for accommodating display assembly 102 considers.For example, frame 154 may include to be designed to
Partially receive the recess 156 or undercut area of the first flexible circuit 212 and/or display layer 204.As shown in figure 5, recess
156 have the size and dimension in the bending/bending region for being used to receive 204 and first flexible circuit 212 of display layer.Although recess
156 have the curvature being generally corresponding to the first flexible circuit 212 and display layer 204, but for recess 156, including straight flange
Other shapes including edge are also possible.In addition, recess 156 can be formed during the molded operation of frame 154.Alternatively,
Recess 156 can be formed after molded operation for example, by cutting operation.
In addition, frame 154 by adhesive phase (not indicating) and with 114 (band of the first protective layer 104 and second sidewall component
110 second sidewall component, as shown in Figure 1) cementation is together.Frame 154 may include the support being partially embedded into frame 154
Element 158.In some embodiments, which includes the ring formed by metal material, and the ring is according to frame 154
Continuously extend around display assembly 102.However, support component 158 can also be discontinuous, and therefore optionally
In embedded frame 154.As shown in the figure, support component 158 can extend along frame 154, to support display assembly 102 and first to protect
Sheath 104.In addition, the first flexible circuit 212 can be by adhesive phase (not indicating) together with 158 cementation of support component.
Fig. 5 also shows some components of display assembly 102, some components at a position with flexible circuit coupling
Connect, and miscellaneous part does not couple then.For example, touch-sensitive layer 202 by connector 222 and with 212 electric coupling of the first flexible circuit simultaneously
Machinery coupling, and display layer 204 is coupled by connector 224 with 214 electric coupling of the second flexible circuit and machinery, wherein connecting
Device 222 and connector 224 is connect to position and (limited by U-shaped configuration, as shown in Figure 1) adjacent to second sidewall component 114.Power photosensitive layer 206
Connector 218 (as shown in Figure 3) positioned along another different fringe regions of power photosensitive layer 206 (referring to Fig. 3).In addition, connector
222 and recess 156 of the connector 224 in neighbouring frame 154 position at it is flexible with the first flexible circuit 212 and second respectively
214 electric coupling of circuit and machinery coupling, and power photosensitive layer 206 is not then such.In addition, connector 222 can be flat relative to connector 224
Row ground at least substantially abreast positions.Power photosensitive layer 206 can be in another individually position (for example, the company on fringe region 220
Device 218 is connect, as shown in Figure 3) place's electric coupling and it is mechanically coupled to flexible circuit (not shown).This will be shown below and retouches
State.
Fig. 6 shows the sectional view of the alternative embodiment of the electronic equipment 250 according to some embodiments.Electronics
Equipment 250 may include previously for any features or component described in electronic equipment.For example, electronic equipment 250 may include to show
Show device assembly 252, which includes touch-sensitive layer 262, display layer 264 and power photosensitive layer 266.It is however, as shown in fig. 6, aobvious
Show that layer 264 may include the substantially flat configuration on whole display layer 264, wherein flexible circuit 274 is curved around power photosensitive layer 266
Song, to be coupled with 264 electric coupling of display layer and machinery.
Fig. 7 shows the sectional view intercepted along the line B-B in Fig. 1 of electronic equipment 100 shown in Fig. 1.As schemed
Show, the connector 218 (also as shown in Figure 3) of power photosensitive layer 206 makes power photosensitive layer 206 and 216 electric coupling of the 3rd flexible circuit and machinery
Coupling, the 3rd flexible circuit and circuit board assemblies 170 (as shown in Figure 4) electric coupling, so that power photosensitive layer 206 and circuit board assemblies
170 communicate.In addition, the 3rd flexible circuit 216 can cement in one by adhesive phase (not indicating) and support component 158
Rise.
As shown in fig. 7, only power photosensitive layer 206 is included with flexible circuit electrically and mechanically.In other words, compared to
The connector 222 (as shown in Figure 5) of touch-sensitive layer 202 and the connector 224 (as shown in Figure 5) of display layer 204, in power photosensitive layer 206
The connector 218 provided between the 3rd flexible circuit 216 electrically and mechanically is located at another difference of electronic equipment 100
At position.In addition, the position based on respective edges region, the connector 218 of power photosensitive layer 206 relative to touch-sensitive layer 202 connection
The connector 224 of device 222 and display layer 204 is vertical or at least substantially vertically positions.
In addition, connector 218 is adjacent to the 3rd side member 116 (also as shown in Figure 1), the 3rd side member partly by
The side wall a part of vertical or substantially vertical with second sidewall component 114 (as shown in Figure 1 and Figure 5) limits.Therefore, frame
154 can be not required recess 156 (as shown in Figure 5) to accommodate 204 and first flexible circuit 212 (as shown in Figure 5) of display layer.Cause
This, frame 154 may include asymmetric frame.In addition, the additional materials of frame 154 allow additional structural rigidity to support display
102 and first protective layer 104 of device assembly.
Fig. 8 shows the sectional view of the alternative embodiment of the electronic equipment 300 according to some embodiments.Electronics
Equipment 300 may include previously for any features or component described in electronic equipment.In addition, electronic equipment 300 may include with
The frame 354 for the first protective layer 304 of the first protective layer 304 and carrying that display assembly 302 is fixed together.In addition, the
One protective layer 304 may include the extension 306 to extend radially outwardly at least in part from the first protective layer 304 in a manner of circumferential.
In order to accommodate extension 306, frame 354 may include the recess 366 for receiving extension 306.Extension 306 is the first protection
Layer 304 provides additional structure profile, and may also provide additional surface area, by the first protective layer 304 and 354 cementability of frame
Ground is combined together.For example, as shown in figure 8, the first protective layer 304 by adhesive phase 362 together with 354 cementation of frame,
The adhesive phase is extended through partly by the boundary between 354 and first protective layer 304 (including extension 306) of frame
The region of restriction.In addition, the distance between 354 and first protective layer 304 (including extension 306) of frame or gap can pass through hair
Spy exerts oneself to make adhesive phase 362 extend through juncture area.Therefore, frame 354 passes through multiple (vertical) surfaces and first
The stronger of the power for putting on electronic equipment 300 is resisted or offset to 304 cementation of protective layer in a plurality of directions together, to be formed
Bond.
Fig. 9 shows the plan of the embodiment of the frame 454 according to some embodiments.As shown in the figure, frame
Frame 454 may include support component 458, which may include the becket being molded onto in frame 454.Frame 454 can be implemented
Into one or more electronic equipments as described herein, and may include previously for any features described in frame.In order to
Improve the bonding force between adhesive (not shown) and the surface 462 of frame 454, surface 462 may include some modifications.For example,
As shown in enlarged view, surface 462 may include the veining for being designed to increase the surface tension or surface energy on surface 462
Region 464.Textured ones 464 can strengthen frame 454 and transparent cover (for example, first protective layer 104 shown in Fig. 5) it
Between by adhesive (for example, adhesive phase 166 shown in Fig. 5) carry out bonding.
Figure 10 shows the sectional view of the interceptions of A-A along the line of frame 454 shown in fig.9.As shown in the figure, veining area
Domain 464 may include to form the multiple pits or indenture in frame 454 along surface 462.Textured ones 464 are aforementioned adhesion agent
Additional surface area is provided.Several different techniques can be used to form textured ones 464.For example, it is used for molded frame 454
Molding tool (not shown) may include prominent features portion, the prominent features portion have it is corresponding with the shape of textured ones 464
Shape.Alternatively, frame 454 can be formed with the molding tool for not including prominent features portion, and in the mould for forming frame 454
After modeling operation, surface 462 can be etched by such as laser to form textured ones 464.In addition, though textured ones
464 limit and are formed to several pits or indenture in frame 454, but several shapes in addition to pit or indenture be also can
Can.For example, textured ones 464 may include several linear and/or non-linear impressions.
Figure 11 shows the sectional view of the alternative embodiment of the frame 554 according to some embodiments, it shows
The surface 562 of frame 554 has a prominent features portion 564.Frame 554 may include previously for any feature described in frame
Portion.In this regard, surface 562 can be used for transparent to receive by adhesive (for example, adhesive phase 166 shown in Fig. 5)
Covering (for example, first protective layer 104 shown in Fig. 5).As shown in the figure, prominent features portion 564 can extend from surface 562.Frame
Frame 554 and specifically, prominent features portion 564 can be formed by the molding tool (not shown) including insert, the insert quilt
It is designed to that extraction section (is used to form frame 554) moulding material, so that prominent features portion 564 extends from surface 562.
Prominent features portion 564 provides additional surface area for aforementioned adhesion agent.
Figure 12 shows the sectional view of the embodiment of electronic equipment 700, and it illustrates electronic equipment 700 to have frame
754 and it is partially embedded into frame 754 and extends substantially into the support component 758 in frame 754.Electronic equipment 700 can
Including herein for any features described in electronic equipment.In addition, similar to previous embodiment, support component 758 can
Including the ring formed by metal material, which surrounds the display assembly 702 of electronic equipment 700 and is extended according to frame 754.Such as
Shown in figure, support component 758 can extend through display assembly 702 on z-dimension, and also extend through protection 704 (class of covering
It is similar to the first protective layer 104 shown in Fig. 1).
In order to which further extension support component 758, frame 754 can be widened on y-dimension on z-dimension.In addition, electronics is set
The size of standby 700 side member 714 (being similar to the second sidewall component 114 shown in Fig. 1) can reduce on y-dimension, with to
Disappear frame 754 increase size.In addition, one or more materials for forming frame 754 can be changed, to accommodate support member
Part 758.For example, frame 754 may include the nylon material mixed with glass filled material, glass filled material enhancing frame
754 bulk strength and rigidity.However, in some embodiments, frame 754 is formed by ceramics.In this regard, side wall
Component 714 and remaining any side member can also be formed by ceramics.
When support component 758 extends in this way, other factors are considered as.For example, in some cases, side wall
714 form a part for antenna module (not shown), which includes being configured to the offer channel radio of electronic equipment 700
The antenna element of letter.When formed of metal, support component 758 can cause some interference to antenna element.This may include
Plane-parallel capacitor is formed between antenna module (including side member 714) and support component 758.Therefore, it is considered as support member
Size, shape, material and the position of part 758, to prevent undesirable interference.It should be pointed out that supplementary technology can be used
Optimize the size of support component 758 and the degree of approach with side member 714.This may include the z for for example reducing support component 758
Size, and/or opening or discontinuous portion are provided in support component 758.
Electronic equipment 700 may include the surface for receiving protection covering 704 and being combined with the protection covering cementability
762.Surface 762 may include the size 766 for providing the surface of general planar.However, in some embodiments, 762 quilt of surface
Modification, to strengthen and protect the bonding of covering 704.In addition, frame 754 may include to be formed recess 756 in frame 754 or
Undercut portions, the recess or undercut portions allow frame 754 to receive display assembly 702, it includes the flexible electrical of display assembly 702
Road and flexible layer.The size of recess 756 can the size based on the increase of frame 754 and be adjusted (for example, increase).It is however, logical
The size (on y-dimension) of increase recess 756 is crossed, the additional materials of frame 754 can be removed at the position below surface 762.
It should be pointed out that supplementary technology can be used to utilize the size 766 on surface 762 to optimize the size of recess 756.
In addition, in order to make frame 754 be fixed together with side member 714, electronic equipment 700 may include frame 754
It is bonded to the adhesive 768 of side member 714.As shown in the figure, the amount of used adhesive 768 generally allows for side member
714th, frame 754 and protection covering 704 form substantially continuous and flat configuration, such as edge of aforementioned components aligned with each other
Shown.However, in order to provide supplementary protection to protection covering 704 by side member 714, used bonding can be reduced
The amount of agent 768, so that protection covering 704 is relatively low relative to side member 714 on z-dimension.In this way, side member 714
Can additionally covering protection covering 704 a part, and provide supplementary protection to protection covering 704, be subject to avoid it
There is the power of force component on y-dimension.It should be pointed out that supplementary technology can be used to optimize used adhesive 768
Amount and adjustment frame 754, the side member 714 and size for protecting covering 704, to keep substantially continuous and flat structure
Type.
Figure 13 shows the sectional view of the embodiment of the electronic equipment 800 according to some embodiments, it shows
Electronic equipment 800 has protection covering 804 and is extended to provide the side wall of additional support for protection covering 804
Component 814.The electronic equipment 800 may include herein for any features described in electronic equipment.Compared to previous implementation
Scheme, side member 814 are included in raised on z-dimension or elevated neighboring 824.Therefore, the material of side member 814 is formed
(on y-dimension) increases and provides additional support for protection covering 804.In addition, side member 814 may include relative to guarantor
Protect the parallel or at least substantially parallel edge 826 in the surface 806 of covering 804.Therefore, side member 814 can also be to protection
Covering 804 and the frame 854 between protection covering 804 and side member 814 provide additional support.
Figure 14 shows the sectional view of the embodiment of the electronic equipment 900 according to some embodiments, it shows
Electronic equipment 900 has a various structural reinforcements.The electronic equipment 900 may include herein for any described in electronic equipment
Features.Similar to previous embodiment, electronic equipment 900 may include display assembly 902, which includes quilt
It is designed to receive the touch-sensitive layer 912 of touch input, is designed to that the display layer 914 of visual information is presented and is designed to examine
Survey by applying a force in touch-sensitive layer 912, display layer 204 and the protection covering 904 overlapping with display assembly 902 extremely
Lack one and be applied in or act on the power photosensitive layer 916 of the amount of the power on display layer 914.The display assembly 902 can also wrap
Include the plate 918 fixed to power photosensitive layer 916.As shown in the figure, plate 918 is located at the lower section of power photosensitive layer 916.However, in some embodiments
In (not shown), plate 918 is positioned between display layer 914 and power photosensitive layer 916.
Plate 918 can include rigid material, such as metal or plastics.Plate 918 can be that display assembly 902 provides structural support
And hardness.Therefore, when electronic equipment 900 drops, plate 918 can be such that display assembly 902 masks because another in electronic equipment 900
Impact caused by one component (not shown).In addition, plate 918 can prevent the layer of display assembly 902 from bending, this can then prevent layer
Overcome and bond and peel off each other.
In some embodiments, electronic equipment includes the flexible circuit for being coupled to touch input layer.In order to limit flexibility
The movement of circuit, applies adhesive to support component (insertion is in the frame), flexible circuit and support component is adhered to
Together.Shunk however, adhesive is known when curing.The blockage effect of adhesive provides pulling force to flexible circuit, this is then
Miscellaneous part is caused to be subject to undesirable pulling force, so as to change the position of some components or even damage some components.
In general, the amount of contraction of adhesive (from its uncured state to solid state) depends on used adhesive
Amount.In order to reduce the pulling force caused by contraction, electronic equipment can be changed to limit required amount of binder.For example, Figure 14 is by electricity
Sub- equipment 900 is shown as with plate 928, which is positioned in flexible circuit 922 and (is similar to the first flexible circuit shown in Fig. 5
212) between the support component 958 that is embedded in frame 954.Plate 928 can be positioned in support component 958 and be arranged on branch
Between adhesive 930 on support element 958.Plate 928 may include the metal for being used as being fixed to the gasket of flexible circuit 922
Plate.The script that plate 928 can be taken between flexible circuit 922 and support component 958 will be by 930 the space occupied of adhesive.In this way,
The amount of adhesive 930 used in can reducing, and therefore can also reduce the blockage effect of adhesive 930.In addition, plate 928
It is designed and is positioned to absorb some power of script will display assembly 902 influenced.Therefore, when display assembly 902 is opened simultaneously
And when visual information is just presented, visual problem can be restricted or prevented in plate 928, such as show artifact.
Similar to previous embodiment, display layer 914 extends through exertin photosensitive layer 916 and including bending section.However, such as
Shown in Figure 14, display layer 914 may include the first material 932 for covering the surface of display layer 914.First material 932 may include to fill
Closure material, Embedding Material protection display layer 914 and specifically the bending region comprising display layer 914 are against external force.For
First material is provided, pin (not shown) can be inserted into the position in the bending region of display layer 914.The pin is from electronics
Dispersible materials when equipment 900 is extracted.
Display layer 914 may also include second material 934 on the surface of covering display layer 914, which includes some
A metal trace (not being labeled).Second material 934 is designed to provide compression stress to metal trace and prevents tensile force
Act in metal trace, so as to prevent metal trace to be damaged.In addition, the second material 934 can be display layer 914 provide hardness and
Structural support.
Figure 15 shows the plan of the embodiment of the electronic equipment 1000 according to some embodiments, it shows
The plate 1018 being positioned in the housing 1010 of electronic equipment 1000.For illustrative purposes, eliminate including transparent covering
Several of part and display assembly features.Electronic equipment 1000, housing 1010 and plate 1018 may include to be directed to respectively herein
Any features described in electronic equipment, housing and plate.Plate 1018 is designed to together with display assembly (being presently shown)
Use.In this regard, plate 1018 may include previously any features described in for plate 918 (being shown in Figure 14).
Plate 1018 may include the recess 1020 for being designed to receive a part for display assembly.For example, recess 1020 can
Receive display assembly (be similar in Figure 5 shown display assembly 102) bending region and/or with display assembly phase
Associated flexible circuit (all the first flexible circuits 212 as shown in FIG. 5).In other words, it is associated with display assembly
Bending region can surround plate 1018 along plate 1018 planar edge 1022 bend and avoid contact with housing 1010.Therefore, it is recessed
Mouth 1020 is referred to alternatively as the cut-away area of plate 1018.
In addition, plate 1018 may include extension, such as the first extension 1024 and the second extension 1026.As shown in the figure,
First extension 1024 and the second extension 1026 extend through the planar edge 1028 of plate 1018.Display assembly (not shown)
It may include that bend region and flexible circuit, the flexible circuit bends around planar edge 1028 and can in the manner previously described
It is positioned between the first extension 1024 and the second extension 1026.First extension 1024 and the second extension 1026 are in y
Expansion board 1018 in dimension.In this way, plate can be made by being applied to the external force with force component on y-dimension of electronic equipment 1000
1018 (and the display assemblies carried by plate 1018) shift on y-dimension relative to housing 1010.However, the first extension
1024 and second extension 1026 be designed to the bending region of display assembly and/or flexible circuit engagement housing 1010 it
The side member 1014 (being similar to the second sidewall component 114 shown in Fig. 1) of preceding engagement housing 1010.It is therefore possible to prevent display
Device assembly is damaged and/or is electrically connected disconnection.
Figure 16 shows the partial side view of the electronic equipment 1000 shown in Figure 15, which further illustrate plate 1018 with
The first extension 1024 that display assembly 1002 is fixed together.As shown in the figure, display assembly 1002 can surround plate 1018
Bending.In addition, plate 1018 can extend laterally through display assembly 1002 on y-dimension and fix protection covering 1004
Frame 1054 above display assembly 1002.Therefore, the first extension 1024 and the second extension 1026 (show in Figure 15
Go out) it can be combined, should to provide the bolster for the power that display assembly 1002 is applied to for the resistance of display assembly 1002
Power causes the side member 1014 of display assembly towards housing 1010 (being indicated in Figure 15) to move.Frame 1054, protection covering
Part 1004 and display assembly 1002 may include previously respectively for frame, protect covering and any described in display assembly
Features.
Figure 17 shows the sectional view of the embodiment of the electronic equipment 1100 according to some embodiments, it shows
There is housing 1110 and the electronic equipment 1100 of the supporting structure 1120 that is integrally formed with housing 1110.Risen to be simple
See, some features and component of electronic equipment 1100 are not shown.However, electronic equipment 1100 and housing 1110 may include herein
Respectively for electronic equipment and housing described in any features.There is the elder generation of the frame fixed to housing different from electronic equipment
Preceding embodiment, supporting structure 1120 can be a part for housing 1110.In some embodiments, housing 1110 is by metal shape
Into the metal such as alloy for aluminium or comprising aluminium.In the embodiment shown in Figure 17, housing 1110 is formed by ceramics.Pottery
Ceramic material can provide firm shell, while also farthest reduce and the antenna module (not shown) of electronic equipment 1100
RF interference effects.
Supporting structure 1120 can receive and support protection covering 1104 and (be similar to the first shown in Fig. 1 protective layer
104).In addition, supporting structure 1120 may include recess 1156, which is designed to receive the buckled zone of display assembly 1102
Domain and/or the bending region for the flexible circuit 1112 being used together with display assembly 1102.The recess 1156 can surround display
Device assembly 1102 extends circumferentially over upon.Therefore, which can be integrated into housing 1110.This can reduce associated cost simultaneously
Reduce and use associated manufacturing time with frame.
Figure 18 shows the plan of the embodiment of the protection covering 1204 according to some embodiments.Protection
Covering 1204 may include any features described in herein for protection covering and/or protective layer.Therefore, covering is protected
1204 can include transparent material, glass, sapphire, plastics etc..In this regard, protection covering 1204 is designed to
It is overlapping with display assembly (not shown).Protection covering 1204 may include body portion and partly be limited by dotted line 1206
Recess (being illustrated below).
Figure 19 shows the sectional view of the interceptions of B-B along the line of protection covering 1204 shown in figure 18, its is further
Show the recess 1208 being formed in protection covering 1204.The recess 1208 can extend to characterizing portion to form protection
Cavity in the material of covering 1204.In this way, recess can receive or receive at least in part display assembly.This will be below
Further show.In addition, protection covering 1204 may include the body portion 1212 extended around recess 1208.
Figure 20 shows the sectional view of the embodiment of the electronic equipment 1200 according to some embodiments, it shows
Protection covering 1204 (shown in Figure 18 and Figure 19) is fixed together with housing 1210.For the sake of simplicity, electronics is not shown
Some features and component of equipment 1200.However, electronic equipment 1200 may include herein for any described in electronic equipment
Features.As shown in the figure, electronic equipment 1200 may include to be fixed to protection covering 1204 and be positioned in recess 1208
In display assembly 1202.Display assembly 1202 can be partly coupled in recess 1208, or can be fully mated into recessed
In mouth 1208, this is specifically dependent upon required configuration.By the way that display assembly 1202 is coupled to the recessed of protection covering 1204
In mouth 1208, protection covering 1204 can be provided to display by covering multiple dimensions of display assembly 1202 to increase
The protection of component 1202.Therefore, before display assembly 1202 is subject to any impact, it is applied to rushing for electronic equipment 1200
Hitting power can be absorbed by protection covering 1204 or absorb at least in part.In addition, protecting covering 1204 by changing, can limit
Design modification to miscellaneous part, so as to reduce manufacture and engineering design cost.In addition, frame 1254 can be not required recess (all
Recess 156 as shown in Figure 5), and therefore can provide additional support to protection covering 1204.
Figure 21 shows the sectional view of the embodiment of the electronic equipment 1300 according to some embodiments, it shows
The protection covering 1304 that extension and adjacent sidewall component 1314 position above frame 1354.Electronic equipment 1300, side
Wall components 1314 and frame 1354 may include herein respectively for electronic equipment, side member and frame described in any feature
Portion.As shown in the figure, frame 1354 can be changed and reduce size, to allow to protect covering 1304 above frame 1354 to prolong
Stretch and with 1314 border of side member.This allows the bending part protected covering 1204 and specifically protect covering 1304
1306 are divided to be subject to the direct protection from side member 1314, this between side member 1314 and protection covering 1304 with prolonging
The frame 1354 stretched is opposite (as shown in other embodiments).In addition, protection covering 1304 can be limited on y-dimension and have
There is the protection covering of the extension of relatively large length.This allows the display assembly 1302 of electronic equipment 1300 being modified as
Also size is increased on y-dimension.Alternatively or in combination, the development length of covering 1304 and display assembly 1302 is protected
It can promote to realize the symmetrical display assembly of appearance, this may also allow for modification partly to cover the symmetrical display assembly of appearance
Display frames (not shown).By providing symmetrical display assembly, the overall appearance of electronic equipment 1300 can strengthen.
Figure 22 shows the exploded view of the battery component 160 according to some embodiments.As shown in the figure, battery component
160 may include the first cladding element 1402 and the second cladding element 1404, wherein the first cladding element 1402 and the second covering member
Part 1404 is sealed, to form the shell of the internal part of shielding battery component 160.By the first cladding element 1402 and
The shell that two cladding elements 1404 are formed can limit the cavity for receiving and encapsulating internal part.For example, battery component 160 is also
It may include first electrode 1406 and the second electrode separated with first electrode 1406 1408 (so that first electrode 1406 and second
Each of electrode 1408 includes monomer electrode), provided wherein having between first electrode 1406 and second electrode 1408
Certain physically-isolated shim 1410, the shim also allow at the same time electric charge first electrode 1406 and second electrode 1408 it
Between flow.As commonly known in field of batteries, one of first electrode 1406 and second electrode 1408 include anode,
And (in first electrode 1406 and second electrode 1408) remaining electrode includes cathode.In addition, as commonly known,
Electrode can be used for converting chemical energy into electric power used in electronic device (all electronic equipments 100 as shown in FIG. 1).
In addition, battery component 160 and battery component as described herein may include to be designed in battery component 160 from external source
Receive the rechargeable battery assembly reused after electric energy.Battery component 160 may also include circuit board 1412, the circuit board
The one or more circuits for flowing in and out the electric current of battery component 160 including being designed to monitoring.In addition, circuit board 1412 with
And the component of circuit board 1412 can be electrically connected with circuit board assemblies 170 (being shown in Fig. 4).
In addition, the first cladding element 1402 may be formed on z-dimension provided for component (not shown) such as flexible circuit it is attached
Add the passage 164 in space.In other words, the size (such as height) of battery component 160 subtracts with 164 corresponding position of passage
It is small, while still sufficient space is provided to be positioned in the circuit board 1412 of the lower section of passage 164.In this way, component can be across passage
164 positioning, so as to allow to rearrange the miscellaneous part in electronic equipment 100 (showing in Fig. 1), to create for battery component 160
Build additional space.Therefore, battery component 160 may include large scale corresponding with larger charge capacity.Although the first cladding element
1402 and second cladding element 1404 shielding case for including electrical shielding cover can be provided, but foregoing covering allows some to be electrically connected
Connect.For example, the first cladding element 1402 may include the opening 1414 close to circuit board 1412.In addition, although not shown in the drawings, but
First cladding element 1402 and/or the second cladding element 1404 may include additional opening, to allow one or more additional components
With 160 electric coupling of battery component.Although conventional batteries electrode includes the shape of generally straight line, battery component 160 and sheet
Electrode in the text battery component may include different shapes.For example, as shown in figure 22, first electrode 1406 and second electrode
1408 include " L-shape configuration ", and wherein at least one surface includes six different sides.This will be discussed further below.
Figure 23 is the plan of first electrode 1406 shown in fig. 22.As shown in the figure, first electrode 1406 includes L-shaped
Configuration.In this regard, first electrode 1406 may include 1420 or first rectangle part of Part I and from Part I
1422 or second rectangle part of Part II of 1420 extensions.Dotted line represent positioned at Part I 1420 and Part II 1422 it
Between juncture area.In some embodiment (not shown), the size of Part I 1420 it is identical with Part II 1422 or
It is substantially similar.However, in the embodiment shown in Figure 23, the size of Part I 1420 is more than the ruler of Part II 1422
It is very little.
The feature of first electrode 1406 can also be to include the first wall 1434 with first size 1444 and with
Second wall 1436 of two sizes 1446.As shown in the figure, the first wall 1434 is parallel or at least substantially put down relative to the second wall 1436
OK, and the second size 1446 is less than first size 1444.In addition, first electrode 1406 may include with the 3rd size 1448
3rd wall 1438 (separating the first wall 1434 and the second wall 1436) and the 4th wall 1440 with the 4th size 1450.Such as
Shown in figure, the 3rd wall 1438 is parallel or at least substantially parallel relative to the 4th wall 1440, and the 4th size 1450 is less than the
Three sizes 1448.In addition, first electrode 1406 may include relative to the 3rd wall 1438 the parallel or at least substantially parallel the 5th
Wall 1442.5th wall 1442 may include the 5th size 1452 less than the 3rd size 1448.As shown in figure 23, the 4th size
1450 and the 5th size 1452 can be combined with equal to the 3rd size 1448.In addition, the 3rd wall 1438 is relative to 1434 He of the first wall
Second wall 1436 is vertical or at least substantially vertical.In some embodiment (not shown), 1444 and second ruler of first size
Very little 1446 is identical.In addition, in some embodiment (not shown), first size 1444 is less than the second size 1446.In addition, should
When, it is noted that second electrode 1408 (being shown in Figure 22) and times being included in battery component 160 (being shown in Figure 22)
What one or more supplementary electrode and one or more shim may include it is identical with the size and dimension of first electrode 1406 or
Substantially similar size and dimension.
Figure 24 is shown according to some embodiments suitable for the alternative of the electrode 1506 that is used in battery component
The plan of embodiment.As shown in the figure, electrode 1506 may include " C-shaped configuration ".In this regard, electrode 1506 may include
1520 or first rectangle part of Part I.Electrode 1506 may also include 1522 or second rectangle part of Part II, Yi Ji
1524 or the 3rd rectangle part of three parts, both the Part II and the Part III relative to Part I 1520 vertically or
Substantially perpendicularly extend.Dotted line represent positioned at Part I 1520 and Part II 1522 between and Part I 1520 and
Juncture area between Part III 1524.In some embodiment (not shown), the size of Part I 1520 and second
Part 1522 and Part III 1524 are identical or substantially similar.However, in the embodiment shown in Figure 24, Part I
1520 size is more than the size of Part II 1522 and also greater than the size of Part III 1524.In addition, as shown in figure 24,
The size of Part II 1522 is identical or substantially similar with the size of Part III 1524.However, in some embodiments (not
Show) in, the size of Part II 1522 can be different from the size of Part III 1524.For example, the size of Part II 1522
The size of Part III 1524 can be more than or less than.
The feature of electrode 1506 can also be to include the first wall 1534 with first size 1544 and with the second ruler
Very little 1546 the second wall 1536.As shown in the figure, the first wall 1534 is parallel or at least substantially parallel relative to the second wall 1536, and
And second size 1546 include the length identical or at least substantially similar with the length of first size 1544.In addition, electrode
1506 may include the 3rd wall 1538 (separating the first wall 1534 and the second wall 1536) with the 3rd size 1548, with the 4th
4th wall 1540 of size 1550 and the 5th wall 1542 with the 5th size 1552.As shown in the figure, the 3rd wall 1538 is opposite
It is parallel or at least substantially parallel in the 4th wall 1540 and the 5th wall 1542.In addition, the 4th size 1550 and the 5th size 1552
Each of be less than the 3rd size 1548.In addition, the 3rd wall 1538 relative to the first wall 1534 and the second wall 1536 it is vertical or
It is at least substantially vertical.As shown in figure 24, first size 1544 is identical with the second size 1546.However, first size 1544 can
The second size 1546 is not used in, such as less than or greater than the second size.In addition, electrode 1506 may include relative to the 3rd wall 1538
The 6th parallel or at least substantially parallel wall 1562.6th wall 1562 may include the 6th size less than the 3rd size 1548
1572.As shown in figure 24, the 4th size 1550, the 5th size 1552 and the 6th size 1572 can be combined with equal to the 3rd size
1548.Moreover, it is noted that any supplementary electrode and shim that are included in battery component (not shown) may include
The identical or substantially similar size and dimension with the size and dimension of electrode 1506.
Figure 25 shows the alternative implementation of the electrode 1606 suitable for battery component according to some embodiments
The plan of scheme.As shown in the figure, electrode 1606 may include " I shapes configuration ".In this regard, electrode 1606 may include first
1624 or the 3rd rectangle of 1620 or first rectangle part of part, 1622 or second rectangle part of Part II and Part III
Part.Dotted line represents between Part I 1620 and Part II 1622 and Part I 1620 and Part III 1624
Between juncture area.As shown in the figure, Part II 1622 and Part III 1624 both perpendicular to or substantially perpendicular to the
A part 1620 extends.Similar to the shape similar to alphabetical " I ", Part I 1620 can be relative to Part II 1622 and the
Three parts 1624 and it is centrally located or substantially at center.As shown in the figure, the size and Part II of Part I 1620
1622 and Part III 1624 it is identical or substantially similar.However, in some embodiment (not shown), Part I 1620
Size be different from Part II 1622 size and also different from the size of Part III 1624.In addition, as shown in figure 25,
The size of Part II 1622 is identical or substantially similar with the size of Part III 1624.However, in some embodiments (not
Show) in, the size of Part II 1622 can be different from the size of Part III 1624.For example, the size of Part II 1622
The size of Part III 1624 can be more than or less than.In addition, in some embodiments, Part III is removed from electrode 1606
1624 so that electrode 1606 includes " T-shaped configuration ".
The feature of electrode 1606 can also be to include the first wall 1634 with first size 1644 and with the second ruler
Very little 1646 the second wall 1636.As shown in the figure, the first wall 1634 is parallel or at least substantially parallel relative to the second wall 1636, and
And second size 1646 include the length identical or at least substantially similar with the length of first size 1644.In addition, electrode
1606 may include the 3rd wall 1638 with the 3rd size 1648.3rd wall 1638 can be relative to the first wall 1634 and the second wall
1636 is vertical or at least substantially vertical, and the 3rd size 1648 includes the length with 1644 and second size 1646 of first size
Spend identical or at least substantially similar length.
The feature of electrode 1606 can also be that with Part I 1620 Part I is with extending through Part I
1620 first longitudinal direction axis 1652 is aligned and is set around the first longitudinal direction axisymmetrical.In whole embodiment
And used term " longitudinal direction " refers to along the direction of the main shaft extension of component, wherein " master " size pair in detail in the claims
Should be in maximum (most long) size of a part for electrode.Electrode 1606 may also include Part II 1622 and Part III 1624,
The Part II and the Part III are aligned with 1654 and the 3rd longitudinal axis 1656 of second longitudinal direction axis and surround respectively respectively
The second longitudinal direction axis and the 3rd longitudinal axis are symmetrical arranged.Second longitudinal direction axis 1654 can be relative to the 3rd longitudinal axis
1656 are abreast aligned.In addition, first longitudinal direction axis 1652 can be relative to 1654 and the 3rd longitudinal axis of second longitudinal direction axis
1656 is vertical.Moreover, it is noted that any supplementary electrode and shim that are included in battery component (not shown) can
Including the size and dimension identical or substantially similar with the size and dimension of electrode 1606.
Figure 26 shows the alternative implementation of the electrode 1706 suitable for battery component according to some embodiments
The plan of scheme.As shown in the figure, electrode 1706 may include " L-shape configuration ", it (shows similar to first electrode 1406 in Figure 23
Go out) L-shape configuration.In this regard, electrode 1706 may include 1720 or first rectangle part of Part I and with vertical
1722 or second rectangle part of Part II that mode extends from Part I 1720.Dotted line represent positioned at Part I 1720 with
Juncture area between Part II 1722.In some embodiment (not shown), the size of Part I 1720 and second
Part 1722 is identical or substantially similar.However, in the embodiment shown in Figure 26, the size of Part I 1720 is more than the
The size of two parts 1722.In addition, electrode 1706 may additionally include the opening 1730 that gap or space are limited in electrode 1706.Open
The permissible battery components for including electrode 1706 and there are other similarly sized and shape electrodes with electrode 1706 of mouth 1730
(not shown) by component (not shown) be positioned in at 1730 corresponding position of opening.In this way, opening and separation when electrode
Piece opening it is aligned with each other with formed through battery component electrode layer and separate lamella continuous through hole when, battery component can lead to
Cross opening 1730 and accommodate the component.This will be discussed further below.In addition, though opening 1730 is shown at electrode
In 1706, but other embodiments (embodiment such as in Figure 23 to the electrode shown in Figure 25) may also comprise opening.
In Figure 23 to shown in Figure 26 and the various embodiments of the electrode of description can pass through cutting operation (including mould
Cut) formed.Die cut operation may include to make electrode slice undergo cutting operation using the mould with preliminary dimension and shape.Mould
Tool may include size and dimension corresponding with the size and dimension in Figure 23 to the electrode shown in Figure 26.It should be pointed out that
Shim can be die cut in a similar way.Therefore, the shape of electrode as described herein may include the shape in addition to rectangular shape.
In this regard, battery component may include the size and dimension according to electrode and shim so that battery component can be in various
Size and dimension, to increase other internal parts in battery component size and/or receiving electronic equipment.
Figure 27 to Figure 29 shows the various implementations of the battery component suitable for being used together with electronic equipment as described herein
Scheme.For illustrative purposes, some components to the electronic equipment shown in Figure 29 in Figure 27 are eliminated.For being formed for this
The die cut operation (described above) for the electrode that the text battery component uses can be cut into various sizes and shape.With regard to this point
For, battery component can be in different size and dimension.In addition, in Figure 27 to the electronic equipment and battery component shown in Figure 29
It may include previously for any one or more components described in electronic equipment or one or more features portion.In addition, though show
The specific amount of embodiment of battery component is gone out, but several other configurations are also possible.
Figure 27 shows the reality of the battery component 1860 being located in electronic equipment 1800 according to some embodiments
Scheme is applied, the wherein battery component 1860 has the shape for the internal part 1870 for adapting to electronic equipment 1800.As shown in the figure, should
Battery component 1860 may include C-shaped configuration, to adapt to may include the internal part 1870 of circuit board assemblies (previously described).Term
" adaptation " can refer to the size and dimension of modification component (such as battery component 1860), to avoid or reduce modification electronic equipment
Size, shape and/or the position of another component (such as internal part 1870) in 1800.It is for example, illustrated and described herein
Battery component can by provide originally another or multiple components will be accommodated by traditional line type battery the space occupied.Separately
Outside, any one or more electrodes of battery component 1860 and one or more shims may also include C-shaped configuration, the C-shaped structure
The shape of type is similar to the shape of electrode 1506 (being shown in Figure 24).Therefore, battery component 1860 may include by one or more
The shell for including C-shaped configuration that cladding element limits.
Figure 28 show according to some embodiments be located at electronic equipment 1900 in battery component 1960 it is another
Embodiment is selected, which has the shape for the multiple internal parts for adapting to electronic equipment 1900.It is as shown in the figure, electric
Pond component 1960 may include " I shapes " configuration to accommodate the first internal part 1970 and the second internal part 1972.Inside first
Each of 1970 and second internal part 1972 of component can all represent a component, such as circuit board, audio-frequency module, flexibility
Circuit or similar not component.First internal part 1970 and the second internal part 1972 also are shown as being positioned in electricity by Figure 28
In different spaces between the extension of pond component 1960.In addition, any one or more electrodes of battery component 1960 and point
Partition may also include I shape configurations, and the shape of the I shape configurations is similar to the shape of electrode 1606 (as shown in figure 25).Therefore, battery
Component 1960 may include the shell for including I shape configurations limited by one or more cladding elements.
Figure 29 show according to some embodiments be located at electronic equipment 2000 in battery component 2060 it is another
Embodiment is selected, the wherein battery component 2060 has the opening 2062 for the internal part 2072 for adapting to electronic equipment 2000.Such as
Shown in figure, opening 2062 may include certain size and shape so that can use the periphery localization of internal component 2072 of opening 2062.Though
So opening 2062 includes the opening of automatic adjustment, but opening 2062 can be in other shapes, as non-limiting example, the shape
Including triangular shape and quadrilateral shape.In addition, as shown in figure 29, battery component 2060 may include L-shape configuration (but other foregoing shapes
Shape is also possible) to accommodate internal part 2070 (it may include circuit board assemblies), and may also include opening 2062.Battery
The L-shape configuration permission internal part 2070 of component 2060 is at least partially positioned at the edge such as first of battery component 2060
Between edge 2064 and second edge 2066.In addition, the battery component including L-shape configuration and opening (being similar to opening 2062) can
Including electrode and shim, the electrode and shim are aligned with each other and with the shape with electrode 1706 (being shown in Figure 26)
Similar shape.In other words, any one or more electrodes of battery component 2060 and shim may also include L-shape configuration,
The L-shape configuration has the opening similar with the opening of electrode 1706 (being shown in Figure 26).Therefore, battery component 2060 may include by
What one or more cladding elements limited includes L-shape configuration and the shell of opening.
In addition to various sizes and shape (except traditional line shape), battery component as described herein may include attached
Add features.Figure 30 show according to some embodiments be located at electronic equipment 2100 in battery component 2160 it is another
Embodiment is selected, the wherein battery component 2160 is positioned in the first internal part 2172 (shown in dotted line) of electronic equipment 2100
In (electronic equipment 2100) housing 2102 of top.Partially due to provided by display layer 204 (figure 5 illustrates) attached
Add space, battery component 2160 can cover or some overlapping components, such as the first internal part 2172.In addition, in order to by circuit
Plate component 2170 is contained in housing 2102, and battery component 2160 may include L-shape configuration.In this way, battery component 2160 provides appearance
The position of a part for nano circuit plate component 2170 (also including L-shape configuration, as shown here), and the linear pattern battery of script is then
Circuit board assemblies 2170 can not be accommodated.As shown in figure 30, circuit board assemblies 2170 can be with the battery component similar to puzzle piece
2160 " matings ".In addition, battery component 2160 may also include the passage 2162 of the size for the reduction for limiting battery component 2160.This
Sample, electronic equipment 2100 may include flexible circuit 2164, which passes through along passage 2162 above battery component 2160
And with circuit board assemblies 2170 and may include functional unit (as non-limiting example, such as audio-frequency module) second in
2174 electric coupling of portion's component, to make the second internal part 2174 be electrically connected with circuit board assemblies 2170.Although flexible circuit
2164 are described as being electrically coupled to the second internal part 2174, but flexible circuit 2164 also can be with the 3rd internal part (not shown)
Such as antenna electric coupling.Under any of the above-described situation, the passage 2162 being formed in battery component 2160 allows to rearrange
Various internal parts.In addition, battery component 2160 may include increased in size corresponding with the electric memory capacity increased, because battery
Component 2160 can be positioned in the top of the first internal part 2172.
Figure 31 shows the sectional view intercepted along the line C-C in Figure 30 of electronic equipment 2100 shown in fig. 30.Portion
Divide ground since the die cut operation of electrode and shim (described above), battery component 2160 can be above the first internal parts 2172
Pass through.In addition, as shown in figure 31, a part for battery component 2160 can be placed on housing 2102 by flat, and battery component
2160 another part covers the first internal part 2172.In other words, battery component 2160 can be increased to the first internal part
At least partially conform to above in the of 2172 and also the size and dimension of the first internal part 2172.In addition, electrode also can be
The top of one internal part 2172 passes through.For example, battery component 2160 includes first electrode 2182 and second electrode 2184, wherein dividing
Partition 2186 is positioned between first electrode 2182 and second electrode 2184.As shown in figure 31, the electricity of first electrode 2182, second
Pole 2184 and shim 2186 can pass through above the first internal part 2172.In addition, die cut operation can form first electrode
2182 and second electrode 2184 so that electrode in battery component 2160 is entered with before 2162 corresponding position of passage eventually
Only, so as to allow passage 2162 to reduce the size of battery component 2160 to receive flexible circuit 2164.Although not shown in the drawings, but
Passage 2162 may include the size and dimension for receiving two or more flexible circuits, so as to by additional internal components (not
Show) with circuit board assemblies 2170 electric coupling (is shown) in Figure 30.Therefore, flexible circuit 2164 (or additional flexible circuit) is not required to
The periphery that surround battery component 2160 positions.
Figure 32 shows the exploded view of the circuit board assemblies 170 shown in Fig. 4 according to some embodiments.Such as
Shown in figure, circuit board assemblies 170 may include first circuit board 172 and second circuit board 174.In some embodiments, first
Each of circuit board 172 and second circuit board 174 include printed circuit board (PCB).In addition, first circuit board 172 can stack structure
Type is fixed together with second circuit board 174 and is positioned in above second circuit board.As shown in figure 32, first circuit board 172
Including the size and dimension identical or similar at least in part with the size and dimension of second circuit board 174.However, in some realities
Apply in scheme (not shown), for size and/or shape, compared to second circuit board 174, first circuit board 172 is included extremely
Some few differences.Although the stacking configuration of circuit board assemblies 170 increases circuit board assemblies 170 in electronic equipment 100 (in Fig. 1
Show) in occupied area on z-dimension, but stacking configuration reduces the accounting on x dimension and y-dimension of circuit board assemblies 170
There is area.Can be miscellaneous part such as battery in electronic equipment 100 by the additional space for stacking aforementioned circuit plate to provide
Component 160 (figure 4 illustrates) provides additional space.In addition, the size by reducing display assembly 102 (being shown in Fig. 5)
And the additional space provided provides space for circuit board assemblies 170.In other words, on z-dimension partially due to display
The additional space that 102 size of component reduces and realizes allows the stacking configuration of circuit board assemblies 170.It is although not shown in the drawings, electric
Road plate component 170 may include three or more circuit boards for being in stacking configuration and being electrically connected each other.
First circuit board 172 and/or second circuit board 174 may include several functional units." functional unit " can be
Refer to a kind of component, such as perform the integrated circuit or processor circuit of one or more operations, such as execution comes from and is stored in
The instruction of software application on memory circuitry.Functional unit is also referred to as transistor.Positioned at first circuit board 172
And/or the functional unit on any one of second circuit board 174 can convert electric energy to thermal energy during operation.It is however, hot
Allocation component (not shown) is designed to remove thermal energy from circuit board assemblies 170.Will be discussed below.Such as Figure 32 institutes
Show, circuit board may include the functional unit on multiple surfaces.For example, first circuit board 172 may include the first installation surface
2202 and second installation surface 2204 opposite with the first installation surface 2202, wherein the first installation surface 2202 has first
Functional unit 2212 and the second installation surface 2204 has the second functional unit 2214 (shown in dotted line).As shown in figure 32,
One installation surface 2202 and the second installation surface 2204 may include additional operations component.Also, it is noted that first circuit board
Functional unit on 172 can be electrically connected each other.Communicator may include for example to extend through at least one of first circuit board 172
Hole (not shown).
Second circuit board 174 may include the first installation surface 2206, which includes several functional units
Such as functional unit 2216.Second circuit board 174 further includes second installation surface 2208 opposite with the first installation surface 2206.
In some embodiments, the second installation surface 2208 includes being electrically connected with the functional unit in the first installation surface 2206
One or more functional units.Also, it is noted that after circuit board assemblies 170 are assembled, second circuit board 174
It is overlapping (or covering) with stacking configuration by first circuit board 172.It should be noted, however, that first circuit board 172 is still electric with second
Road 174 separates at least certain gap or space.In addition, after circuit board assemblies 170 are assembled, second circuit board 174
First installation surface 2206 is towards the second installation surface 2204 of first circuit board 172, and vice versa.
First circuit board 172 can be by several Self-Clinching Standoffs with rivet interlacement come mechanical with second circuit board 174
Ground connects.For example, as shown in figure 32, second circuit board 174 includes being designed to and the first riveting on first circuit board 172
First Self-Clinching Standoffs 2222 of the connection of nail 2224.Each spiral shell that presses in remaining Self-Clinching Standoffs (not indicating) shown in Figure 19
Female column can be connected with the rivet (not indicating) shown in Figure 32.The Self-Clinching Standoffs is designed not only to provide mechanical connection, and
Desired distance is also kept between first circuit board 172 and second circuit board 174 so that the second peace of first circuit board 172
The component in the first installation surface 2206 of the component and second circuit board 174 on surface 2204 is filled not disturb (physically), and
And vice versa.In addition, the positioning of Self-Clinching Standoffs and rivet can overturn so that first circuit board 172 includes Self-Clinching Standoffs
And second circuit board 174 includes rivet.
In order to which by first circuit board 172 and 174 electric coupling of second circuit board, several interpolaters can be used in the first circuit
Electric signal is route between plate 172 and second circuit board 174.For example, as shown in figure 32, second circuit board 174 may include several
Interpolater, such as carrys out the interpolater 2232 with 174 electric coupling of second circuit board for example, by welding operation.Shown in figure some
A additional interposer (not indicating).In addition, although not shown in the drawings, but second circuit board 174 may include interpolater and second
Several metal traces of one or more functional unit electric couplings on circuit board 174.In addition, when the electricity of first circuit board 172
When being coupled to second circuit board 174, each interpolater can be with one in the second installation surface 2204 of first circuit board 172
Bar or a plurality of metal trace (not shown) electric coupling.
Circuit board assemblies 170 may include several for the member shields power down magnetic disturbance (" EMI ") for making circuit board assemblies 170
Shielding element.For example, circuit board assemblies 170 may include that covering is positioned in the first installation surface 2202 of first circuit board 172
On component the first shielding element 2242.First shielding element 2242 can include and be configured to the first installation surface 2202
On component provide EMI shielding cases the material based on metal.The circuit board assemblies 170, which may also include, to be configured to be positioned
Portion in the second installation surface 2204 of first circuit board 172 and in the first installation surface 2206 of second circuit board 174
Part provides the secondary shielding element 2244 of EMI shielding cases.The secondary shielding element 2244 can include metal, such as copper or brass.
The secondary shielding element 2244 can by several solder joints for being arranged on each circuit board come with first circuit board 172 and
Two circuit boards 174 are fixed together (and fixing therebetween).For example, Figure 32 is shown with around second circuit board 174
The second circuit board 174 of first solder joint 2250 of neighboring positioning.Several in addition to the first solder joint 2250 are shown in figure
Additional bond-pads, but they are not indicated.First circuit board 172, which may also include, to be located at and the weldering on second circuit board 174
Solder joint (not shown) at the corresponding position of point.In some embodiments, secondary shielding element 2244 does not connect including several
Continuous structural detail.In the embodiment shown in Figure 32, secondary shielding element 2244 may include to be designed to along circuit board group
The single continuous structure member of the neighboring extension of part 170.Alternatively, secondary shielding element 2244 may include be combined with each other with
Form several shielding element parts of secondary shielding element 2244.
Circuit board assemblies 170 may also include the 3rd be positioned in the second installation surface 2208 of second circuit board 174
Shielding element 2246.3rd shielding element 2246 is designed to and 2244 groups of the first shielding element 2242 and secondary shielding element
Close, to provide EMI shielding cases for circuit board assemblies 170.In addition, the second installation surface 2208 of second circuit board 174 may include
Metal trace (runs through the second installation surface 2208).In this regard, in addition to EMI shielding cases are formed, the 3rd shielding element
2246 can also limit at least a portion in the electrical grounding path of circuit board assemblies 170, because the 3rd shielding element 2246 passes through
Metal trace and be electrically connected to the second installation surface 2208.In addition, when one or more components of circuit board assemblies 170 are being grasped
During work produce EMI when, foregoing shielding element can make electronic equipment 100 (being shown in Fig. 1) relative to circuit board assemblies 170 at
Fall the EMI as caused by one or more components of circuit board assemblies 170 in exterior member shields.
Figure 33 shows the sectional view of the circuit board assemblies 170 shown in Figure 32, and it illustrates circuit board assemblies 170
Various internal parts.As shown in the figure, first circuit board 172 can be separated by Self-Clinching Standoffs 2226 and second circuit board 174.Separately
Outside, in order to which first circuit board 172 and second circuit board 174 are mechanically coupled to, Self-Clinching Standoffs 2226 can be with 2228 machine of rivet
Couple tool, wherein the component electricity of Self-Clinching Standoffs 2226 and rivet 2228 and first circuit board 172 and second circuit board 174 every
From.
First circuit board 172 may include the hole 2218 formed by metal, with the first functional unit 2212 and the second operation
Electrical connection is provided between component 2214.In addition, first circuit board 172 can be by interpolater 2234 come electric with second circuit board 174
Connection.As shown in the figure, interpolater 2234 can electrically and mechanically connect with the first solder joint 2262 on first circuit board 172
Connect, and can be also electrically and mechanically connected with the second solder joint 2264 on second circuit board 174.Except interpolater 2234
Outside, it also several additional interposer (not shown) can be used to carry signal between circuit board.First circuit board 172 can wrap
The first metal trace 2272 being electrically connected with the second functional unit 2214 and hole 2218 is included, and second circuit board 174 can wrap
Include the second metal trace 2274 being electrically connected with the 3rd functional unit 2220 being positioned on second circuit board 174.In this way, the
Three functional units 2220 can be electrically connected by interpolater 2234 and metal trace with the second functional unit 2214.3rd operation
Component 2220 can be electrically connected by hole 2218, interpolater 2234 and metal trace with the first functional unit 2212.Circuit board group
Several additional metal trace, hole and solder joints can be used to provide additional electrical communication paths for part 170.
Figure 34 shows the alternative embodiment of circuit board assemblies 2370, and it illustrates what is changed for entrance protection
Circuit board assemblies 2370.Circuit board assemblies 2370 may include previously to be directed to the described any part of circuit board assemblies and feature
Portion, such as first circuit board 2372 and second circuit board 2374.However, as shown in figure 34, circuit board assemblies 2370 may include embedding
Enter the Embedding Material 2390 in the circuit board assemblies 2370 between first circuit board 2372 and second circuit board 2374.Embedding material
Material 2390 may include to be cured forms resistance to liquid shielding with such as functional unit 2314 of each functional unit for circuit board assemblies 2370
The resin of cover.In this regard, Embedding Material 2390 can prevent because liquid enter and caused by damage circuit board assemblies 2370, and
And the specifically component of circuit board assemblies 2370.In addition, Embedding Material 2390 may extend into the first screen of circuit board assemblies 2370
Element 2342 and secondary shielding element 2344 are covered, to prevent that component such as Self-Clinching Standoffs 2326 from being corroded.Embedding Material
2390 can be used together with circuits described herein component.
Figure 35 shows the alternative embodiment of the circuit board assemblies 2470 according to some described embodiments, it shows
There are the circuit board assemblies 2470 with the flexible circuit 2402 of the circuit board electric coupling of the circuit board assemblies.The circuit board assemblies
2470 may include previously to be directed to the described any part of circuit board assemblies and/or features.For example, as shown in the figure, circuit
Plate component 2470 may include first circuit board 2472 and second circuit board 2474.The circuit board assemblies 2470, which may also include, to be set
The first shielding element 2442 above first circuit board 2472 and its at least some components.The circuit board assemblies 2470 can also wrap
Include the secondary shielding element 2444 in gap of the covering between first circuit board 2472 and second circuit board 2474.The circuit board
Component 2470 may also include the 3rd shielding element 2446 for being arranged on the top of second circuit board 2474.However, the electricity in Figure 35
Road plate component 2470 is simultaneously not used interpolater (and theirs is corresponding to realize first circuit board 2472 and second circuit board 2474
Component) between electric connection, but be positioned in first circuit board 2472 and/or second circuit using flexible circuit 2402
Electric signal is transmitted between functional unit on plate 2474.
The flexible circuit 2402 can electrically and mechanically be coupled with first circuit board 2472, and formed and be used for and second
The circuit that circuit board 2474 electrically and mechanically couples.Electrically and mechanically hot pressing can be used to melt tin welding operation to hold for coupling
OK.Thermode (not shown) can be used as " thermal head ", thermal head be heated to by thermal energy provide flexible circuit 2402 with
And the soldered elements (not shown) on first circuit board 2472 and second circuit board 2474, so as to form flexible circuit 2402 to
One circuit board 2472 is connected with the electricapparatus of second circuit board 2474.It should be noted that multiple hot pressing can be used to melt tin welding
Flexible circuit 2402 and first circuit board 2472 and second circuit board 2474 are coupled together by operation.
Figure 36 shows the sectional view of the interceptions of D-D along the line of the circuit board assemblies 2470 shown in Figure 35, it illustrates
The flexible PCB 2402 extended between circuit board.As shown in the figure, the flexible circuit 2402 is with being respectively positioned at the first electricity
Road plate 2472 is connected with the first solder joint 2412 on second circuit board 2474 with 2414 electricapparatus of the second solder joint.In addition, first
Solder joint 2412 can be with 2422 electric coupling of the first metal trace on first circuit board 2472, and the second solder joint 2414 can be with second
2424 electric coupling of the second metal trace on circuit board 2474.Therefore, which can be with several functional units (not
Show) electric coupling, some described functional units and 2422 electric coupling of the first metal trace and it is positioned in first circuit board
On 2472, and some described functional units and 2424 electric coupling of the second metal trace and it is positioned in second circuit board 2474
On.
Figure 37 shows the section view of the alternative embodiment of the circuit board assemblies 2570 according to some described embodiments
Figure, it illustrates the internal part with corresponding geometry of circuit board assemblies 2570.Circuit board assemblies 2570 may include elder generation
It is preceding to be directed to the described any part of circuit board assemblies and/or features.For example, circuit board assemblies 2570 may include the first circuit
Plate 2572 and second circuit board 2574, wherein first circuit board 2572 are electrically connected by interpolater 2520 and second circuit board 2574
It is logical.Additional interposer (not shown) can by first circuit board 2572 (and component thereon) and second circuit board 2574 (and
Component thereon) electric coupling.First circuit board 2572 may include with the first functional unit 2512 the first installation surface 2502,
It is and (opposite with the first installation surface 2502) with the second functional unit 2514 for being electrically coupled to metal trace (not indicating)
The second installation surface 2504.In addition, the second circuit board 2574 may include to be electrically coupled to the 3rd of metal trace (not indicating)
Functional unit 2516, wherein the 3rd functional unit 2516 and metal trace are positioned in the first installation table of second circuit board 2574
On face 2506.
As shown in figure 37, the second functional unit 2514 and the 3rd functional unit 2516 can be in nested configuration.For example, the 3rd behaviour
Making component 2516 may include to extend at least partly into protuberance 2518 in the concave part 2522 of the second functional unit 2514.The
Correspondence geometry between two functional units 2514 and the 3rd functional unit 2516 allows the reduction of circuit board assemblies 2570
Size (or reduce height) so that reduce circuit board assemblies 2570 taken in electronic equipment (not shown) it is overall empty
Between.In other words, due to the component of first circuit board 2572 and second circuit board 2574 with the second functional unit 2514 and
The nested configuration similar mode of three functional units 2516 forms corresponding or nested configuration, therefore compared to previous implementation
Scheme, interval or gap between first circuit board 2572 and second circuit board 2574 can reduce.
In addition, in some cases, the component in various boards can be each other electrically and mechanical by direct mode
Ground couples.For example, first circuit board 2572 is also shown as with the 4th be positioned in the second installation surface 2504 by Figure 37
Functional unit 2534 and the 5th functional unit 2536 being positioned in the first installation surface 2506 of second circuit board 2574.
The connector 2544 that 4th functional unit 2534 may include concave part 2542 and be positioned in concave part 2542.In addition, the
Five functional units 2536 may include to extend in protuberance 2542 and electrically and mechanically be coupled with connector 2554 prominent
Go out portion 2538.In this way, the 4th functional unit 2534 is just electrically and mechanically coupled with the 5th functional unit 2536.
In addition, when circuit board assemblies 2570 include functional unit such as the 4th functional unit 2534 and the 5th functional unit
When 2536, first circuit board 2572 can be electrically coupled to second by the 4th functional unit 2534 and the 5th functional unit 2536
Circuit board 2574.Therefore, circuit board assemblies 2570 can be not required interpolater (such as interpolater 2520) to provide first circuit board
Being electrically connected between 2572 and second circuit board 2574.In addition, as shown in figure 37, first circuit board 2572 may include and the 4th behaviour
Make component 2534 and metal trace (does not indicate) hole 2546 of electric coupling.In this way, the first functional unit 2512 can pass through gold
Belong to trace, 2546 and the 4th functional unit 2534 of hole and be electrically connected to the 5th functional unit 2536.It should be noted that at some
In embodiment, circuit board assemblies 2570 include the second functional unit 2514 and the 3rd functional unit 2516 and the 4th operation portion
The combination of 2534 and the 5th functional unit 2536 of part.
Figure 38 shows the section view of the alternative embodiment of the circuit board assemblies 2670 according to some described embodiments
Figure, it illustrates the circuit board assemblies 2670 with several solder masks for being used to support circuit board.The circuit board assemblies 2670
It may include previously to be directed to the described any part of circuit board assemblies and/or features.For example, the circuit board assemblies 2670 can wrap
Include first circuit board 2672 and second circuit board 2674.It is in addition, each in first circuit board 2672 and second circuit board 2674
Person may include several solder joints (not indicating), and wherein inserter is with the solder joint from first circuit board 2672 and from the second electricity
The solder joint electric coupling of road plate 2674.For example, Figure 38 is shown with the first interpolater 2602, the second interpolater 2604 and the 3rd
Insert the circuit board assemblies 2670 of device 2606, first interpolater and the solder joint on first circuit board 2672 and second circuit board 2674
(not indicating) electrically and mechanically couples, second interpolater and the weldering on first circuit board 2672 and second circuit board 2674
Point (not indicating) electrically and mechanically couples, on the 3rd interpolater and first circuit board 2672 and second circuit board 2674
Solder joint (not indicating) electrically and mechanically couples.
Solder joint aoxidizes and/or prevents to form scolding tin " bridge " between adjacent welds during operation is welded in order to prevent, electricity
Road plate component 2670 may include several solder masks.For example, circuit board assemblies 2670 may include positioned at the first interpolater 2602 with
The first solder mask 2622 between second interpolater 2604 and between the second interpolater 2604 and the 3rd interpolater 2606
The second solder mask 2624.Based on their position, the first solder mask 2622 can be prevented in the first interpolater 2602 and second
Formation solder bridge is (so as to prevent the undesirable electricity between the first interpolater 2602 and the second interpolater 2604 between plugging in device 2604
Coupling), and the second solder mask 2624 can prevent from forming solder bridge between the second interpolater 2604 and the 3rd interpolater 2606
(so that preventing the undesirable electric coupling between the second interpolater 2604 and the 3rd interpolater 2606).In addition, the first solder mask
2622 and second solder mask 2624 may be provided between first circuit board 2672 and second circuit board 2674 and keep desired distance
Or the supporting structure at interval.In addition, in order to keep first circuit board 2672 and second circuit board 2674,2672 He of first circuit board
Both second circuit boards 2674 can be clamped on the end of the first solder mask 2622 and the second solder mask 2624.Interpolater, weldering
Point and solder mask each can represent several additional interposers, solder joint and solder mask.
Figure 39 shows the isometric views of the embodiment of the audio-frequency module 2700 according to some described embodiments.Should
Audio-frequency module 2700 can be used for the first audio-frequency module 182 (being shown in Fig. 4) of substitution.The audio-frequency module 2700 can be used as being designed to
Produce the receiver module of the acoustic energy of audible sound form.In general, receiver module is used for the output relatively low with frequency
In associated low power applications.However, the audio-frequency module 2700 may include a pair enhancing associated with audio tweeter module
Audio performance modification.
The audio-frequency module 2700 may include the audio-frequency module shell 2702 with audio-frequency module opening 2704.The audio-frequency module
Shell 2702 can limit the inside sound volume for being divided into front volume and rear volume.This will be shown below.The audio-frequency module
Shell 2702, which can carry, is designed to vibration so as to produce the membrane 2706 or film of the acoustic energy of audible sound form.Therefore, the membrane
2706 are referred to alternatively as film or sound film.The membrane 2706 may include additional thickness to handle (with providing to the attached of audio-frequency module 2700
Power-up power is associated) extraneous vibration energy, and therefore handle supplemental audio frequency.In addition, audio-frequency module opening 2704 can generation
Single unmodified opening in watch sound frequency module shell 2702, and in audio-frequency module shell 2702 (such as wiring and
It is electrically connected) any other opening can carry out aeroseal processing and hydraulic seal is handled.In this regard, in electronic equipment
During air pressure inside (not shown) changes, can prevent membrane 2706 be subject to because air enters audio-frequency module shell 2702 and
The undesirable vibration produced.This will be further explained below.In addition, in some embodiments, membrane 2706 includes quilt
It is designed to the membrane of resistance to liquid (or resistance to liquid film) that tolerance damages caused by exposed to liquid such as water.
Figure 40 shows the sectional view intercepted along the line D-D in Figure 39 of audio-frequency module 2700 shown in Figure 39, it illustrates
Several inner features of audio-frequency module 2700.As shown in the figure, the audio-frequency module 2700 includes sound coil 2708 and magnet
2710.The sound coil 2708 is designed to receive alternating current, to form the electromagnet with alternating magnetic polarities.The alternation magnetic
Polarity may be such that interaction (attract and repel) of the sound coil based on the external magnetic field with magnet 2710 and vibrate.
The membrane 2706 is positioned in audio-frequency module shell 2702 and (will partly be limited by audio-frequency module shell 2702
) sound volume is separated into front volume 2720 and rear volume 2722.As shown in the figure, front volume 2720 can be to audio-frequency module opening 2704
Open, then volume 2722 is opened with the seal isolation of audio-frequency module opening 2704.In addition, when audio-frequency module 2700 is positioned in electronics
When in equipment 100 (being shown in Fig. 1), audio-frequency module shell 2702 can make in the component and electronic equipment 100 of audio-frequency module 2700
Aeroseal keep apart so that such as membrane 2706 be not subject to air pressure variations in electronic equipment 100 acoustics drive or
The influence of other modes.As shown in the figure, can make front volume 2720 and rear volume 2722 masks pressure in electronic equipment 100
Change.However, when membrane 2706 is vibrated to form acoustic energy, acoustic energy exits audio-frequency module opening 2704.In addition, in some implementations
In scheme, audio-frequency module 2700 includes air scoop 2730, which allows air (to enter audio-frequency module opening 2704 with air
Mode) enter in rear volume 2722, and leave rear volume 2722 and reach audio-frequency module opening 2704 so that work as external rings
When the air pressure of border air changes, rear volume 2722 can be balanced with surrounding air.In addition, though audio-frequency module 2700 is alternative
First audio-frequency module 182 (being shown in Fig. 4), but audio-frequency module 2700 may include different design and shapes so that audio-frequency module
2700 also alternative second audio-frequency modules 184 (being shown in Fig. 4).
Figure 41 shows the sectional view of electronic equipment 100, and it illustrates the audio-frequency module being positioned in electronic equipment 100
2700.As shown in the figure, audio-frequency module 2700 and specifically audio-frequency module opening 2704 are with opening 134, (both show in Fig. 1
Go out) at least one opening alignment.In addition, Web materials 2724 can cover opening 134 and provide beautiful facial ornament.In addition,
In some embodiments, audio-frequency module 2700 is equipped with stent 2726.Stent 2726 can pass through adhesive 2728 and audio-frequency module
2700 are fixed together, which may include resistance to bonding agent, to prevent liquid from entering electronic equipment from 2726 surrounding of stent
100.In addition, stent 2726 may include sealing element 2732, which is positioned in audio-frequency module 2700 and stent 2726
Between between audio-frequency module 2700 and stent 2726 formed enter barrier.In this way, audio-frequency module 2700 is just positioned in electricity
In sub- equipment 100 so that any liquid into opening 134 may extend into front volume 2720, but cannot extend into rear volume
In 2722.In addition, any air into opening 134 may extend into both front volume 2720 and rear volume 2722, wherein after
Volume receives air using air scoop 2730.Air scoop 2730 may also allow for air to exit rear volume 2722.Therefore, audio mould
Block 2700 can prevent liquid from providing acoustic energy when entering electronic equipment 100.In addition, the acoustic energy produced by membrane 2706 can be via sound
Frequency module opening 2704 and exit audio-frequency module 2700, and can also exit electronic equipment 100 via opening 134.
In addition, as shown in figure 41, audio-frequency module 2700 can be positioned in electronic equipment 100 so that audio-frequency module opening
2704 are only exposed to the surrounding air that (outside electronic equipment 100) enters electronic equipment 100 by opening 134.In other words,
Audio-frequency module shell 2702 is sealed in a certain way so that for example, by pressing the first protective layer 104 and display assembly 102
To cause the change of the internal volume of the air pressure variations in electronic equipment 100 will not be so that air enters audio-frequency module shell
2702, so as to prevent membrane 2706 from producing undesirable acoustic noise.
Figure 42 shows the exploded view of the hot allocation component 190 according to some described embodiments.Hot allocation component 190
It may include the heat transfer characteristic that enhancing is not only provided, but also several material layers of structural support be provided.The heat transfer of enhancing
Characteristic and structural support come in handy in a case where：Hot allocation component 190 is used for having substantially nonmetallic outside simultaneously
And therefore have in the electronic equipment of the thermal heat transfer capability reduced, the electronic equipment is such as with the second protective layer 144 (in Fig. 2
In show) electronic equipment 100.In this regard, hot allocation component 190 can be used in electronic equipment, to guide thermal energy court
Another architectural feature portion such as aforementioned lateral wall component of electronic equipment is away from nonmetallic bottom wall.
As shown in the figure, hot allocation component 190 may include several material layers.For example, hot allocation component 190 may include by
The first layer 2802 that one types of material is formed, the first kind material may include durable material, such as stainless steel.First layer
2802 may include bottom wall 2812 and the first side wall 2822 and second sidewall 2824, both the first side wall and second sidewall with
Vertical or at least substantially vertical mode extends from bottom wall 2812.(show when being assembled into electronic equipment 100 in Fig. 1 and Fig. 2
Go out) in when, hot allocation component 190 and specifically first layer 2802 be thermally couple to one or more of electronic equipment 100 hair
Thermal part.At least one of bottom wall 2812, the first side wall 2822 and second sidewall 2824 may include and the hair in electronic equipment
Thermal part directly thermally contacts or at least contact surface of thermal coupling.This will be shown below.
Hot allocation component 190 may also include the second layer 2804 for being designed to engage and being thermally couple to first layer 2802.
The second layer 2804 may include bottom wall 2814 and the first side wall 2832 and second sidewall 2834, the first side wall and second sidewall
Both are extended in a manner of vertical or is at least substantially vertical from bottom wall 2814.When hot allocation component 190 has assembled, the second layer
2804 bottom wall 2814, the first side wall 2832 and second sidewall 2834 can engage the bottom wall 2812, first of first layer 2802 respectively
Side wall 2822 and second sidewall 2824.In addition, the second layer 2804 can be formed by Second Type material, which can wrap
Including (compared to the first kind material of first layer 2802) has the material of of a relatively high thermal conductivity, such as copper or graphite.With regard to this
For a bit, the second layer 2804 is designed to when heat generating components and hot 190 thermal coupling of allocation component, thermal energy is redistributed,
Reboot or otherwise propagated away from the heat generating components (not shown) in electronic equipment.When first layer 2802 from one or
When multiple heat generating components receive thermal energy, the second layer 2804 can receive thermal energy from first layer 2802.Bottom wall 2816, the first side wall 2842
It may include and the directly thermo-contact of the second layer 2804 or at least contact surface of thermal coupling with least one of second sidewall 2844.
In addition, hot allocation component 190 may include third layer 2806, which combines with first layer 2802 and strengthens heat
The structural support and rigidity of allocation component 190.Therefore, third layer 2806 can be formed by the 3rd types of material, the three classes section bar
Expect the first kind material identical or similar with first layer 2802 in some cases.Third layer 2806 may include bottom wall 2816,
And the first side wall 2842 and second sidewall 2844, both the first side wall and second sidewall are with vertical or at least substantially vertical
Mode extend from bottom wall 2816.When hot allocation component 190 has assembled, bottom wall 2816, the first side wall of third layer 2806
2842 and second sidewall 2844 can engage the bottom wall 2814, the first side wall 2832 and second sidewall 2834 of the second layer 2804 respectively.
In addition, when hot allocation component 190 is positioned in electronic equipment 100 (being shown in Fig. 1 and Fig. 2), the first of third layer 2806
Side wall 2842 and second sidewall 2844 can respectively engage and be thermally couple to the 3rd side member 116 and the 4th side member 118
(being shown in Fig. 1).In this way, hot allocation component 190 can be thermally couple to the part of band 110 (being shown in Fig. 1 and Fig. 2).Bottom wall
2814th, at least one of the first side wall 2832 and second sidewall 2834 may include directly to thermally contact with first layer 2802 or at least
The contact surface of thermal coupling.
Previous materials composition based on hot allocation component 190, the second layer 2804 may include and first layer 2802 and third layer
The different heat transfer characteristic of 2806 heat transfer characteristic.For example, compared to the one kind for forming first layer 2802 and third layer 2806
Or multiple material, the second layer 2804 can be formed by the material with of a relatively high thermal conductivity.In addition, compared to the formation second layer
2804 material, first layer 2802 and third layer 2806 can be formed by the material with of a relatively high durability or rigidity.
In order to which hot allocation component 190 is fitted together with different materials combination layer, each layer can undergo be designed to by
The cladding operation that layer is combined together.The cladding operation may include each material layer being placed in independent rollers, and then work as
Lamination is combined by layer when passing through roller.Pressing effect can form molecular link between the molecule of metal.It should be noted that coating
Operation can be used when the second layer 2804 includes copper.When the second layer 2804 includes graphite, different assembly operations can be used.This
It will be shown below and discuss.In addition, when hot allocation component 190 is assembled, first layer 2802 and third layer 2806 can be
The second layer 2804 provides support, and can also provide certain knot to carry the electronic equipment (not shown) of hot allocation component 190
Structure supports.Although the second layer 2804 is mainly used for heat transfer, first layer 2802 and third layer 2806 can also provide at least some
Thermal heat transfer capability.In addition, though first layer 2802 and third layer 2806 are mainly used for structural support, but the second layer 2804 can also carry
For at least certain structural support.
Figure 43 shows the partial sectional view of the electronic equipment 100 shown in Fig. 1, and it illustrates be positioned in electronic equipment
Hot allocation component 190 in 100.For illustrative purposes, some components of electronic equipment 100 are eliminated.As shown in the figure, heat point
Distribution assembly 190 can directly be thermally contacted with circuit board assemblies 170 or at least thermal coupling so that from one of circuit board assemblies 170 or
The heat that multiple functional units produce can be delivered at least some layers of hot allocation component 190 from circuit board assemblies 170.For example,
As shown in the first enlarged view 2850, the thermal energy stream produced from the functional unit of circuit board assemblies 170 is (by void with the arrow
Line represent) or hot-fluid may pass through first layer 2802 reach the second layer 2804.As shown in the figure, the contact surface (bottom of first layer 2802
Wall 2812, marked in Figure 42) thermally contacted with circuit board assemblies 170.In addition, partially due to the second layer 2804 is (compared to
Three layers of of a relatively high thermal conductivity 2806), thermal energy stream are intended to extend through first layer 2802 and vertical with first layer 2802
Or it is vertical at least in part, and continue across the second layer 2804 and be not passed through third layer 2806.As further shown in FIG., it is hot
Can stream moved in parallel relative to the contact surface (bottom wall 2814, Figure 24 marked in) of the second layer 2804 or parallel at least in part
It is mobile.Therefore, the relatively low thermal conductivity of third layer 2806 can prevent thermal energy buildup close to the position of the second protective layer 144
Place.This will be discussed further below.
In addition, as shown in figure 43, hot allocation component 190 is designed to bonding ribbon 110.For example, such as the second enlarged view
Shown in 2852, the 3rd of the contact engageable band 110 in surface of the first side wall 2842 of the third layer 2806 of hot allocation component 190 the
Side member 116.Therefore, third layer 2806 can directly thermally contact or at least thermal coupling with the 3rd side member 116.The second layer
Thermal energy can be distributed or be re-introduced to third layer 2806 by 2804, and specifically, from the first side wall 2832 of the second layer 2804
Distribute or be re-introduced to the first side wall 2842 of third layer 2806 so that thermal energy is assigned to the 3rd side member 116, at this
At 3rd side member, which then can be dissipated to surrounding air from the 3rd side member 116.The hot allocation component 190 is also
4th side member 118 of engageable band 110, the side that so hot allocation component 190 can be similar with the 3rd side member 116
Formula (that is, by the second layer 2804 and the side wall of third layer 2806, shown in Figure 42) is by heat distribution to the 4th side member
118.In this way, dissipated as the distribution that the heat for preventing circuit board assemblies 170 from producing is trapped at or near the second protective layer 144
At least one side member of hot device must be prevented from forming hot spot.
In addition, hot allocation component 190, which can prevent or limit the second protective layer 144, receives operation from circuit board assemblies 170
The thermal energy that component produces, because third layer 2806 provides minimum thermal conductivity compared to the second layer 2804 so that electronic equipment 100
In thermal energy mainly carried by the second layer 2804.In this regard, the second layer 2804 can limit the behaviour from circuit board assemblies 170
Make the hot path or primary thermal path of the thermal energy of component generation.Although hot allocation component 190 is shown as from circuit board group by Figure 43
One or more functional units of part 170 receive heat, it is to be noted that, hot allocation component 190 can be from electronic equipment 100
Any heat generating components for being thermally couple to hot allocation component 190 receives heat.In addition, hot allocation component 190 can provide for supporting
The rigidity supporting structure of second protective layer 144.For example, the first layer 2802 and third layer 2806 of hot allocation component 190 can be across
The main surface extension of two protective layers 144, as shown in figure 43.
Figure 44 shows the side view of the alternative embodiment of the hot allocation component 2900 according to some described embodiments
Figure.Hot allocation component 2900 may include previously to be directed to the described any one or more of material of hot allocation component and/or feature
Portion.Hot allocation component 2900 may include first layer 2902, the second layer 2904 (being shown as dotted line) and third layer 2906, wherein second
Layer 2904 is embedded between first layer 2902 and third layer 2906.As shown in the figure, the second layer 2904 can be by 2902 He of first layer
Third layer 2906 is completely covered.This can prevent the second layer 2904 from moving or moving relative to first layer 2902 and/or third layer 2906
Position.It should be noted, however, that the second layer 2904 can still receive the heat through first layer 2902 and/or third layer 2906.
Figure 45 shows the isometric of the alternative embodiment of the hot allocation component 3000 according to some described embodiments
View, it illustrates the hot allocation component 3000 for being modified to receiving part 3010.Hot allocation component 3000 may include previous pin
Described to hot allocation component any one or more of material and/or features.As shown in the figure, hot allocation component 3000 can wrap
First layer 3002, the second layer 3004 and third layer 3006 are included, the wherein second layer 3004 is embedded in first layer 3002 and third layer
Between 3006.
However, the second layer 3004 can be changed, to reduce the size of hot allocation component 3000.For example, the second layer 3004
A part can partly be removed in desired position so that a part for hot allocation component 3000 only includes first layer 3002 and the
Three layer 3006, so that the size of hot allocation component 3000 of (partly) reduction without the second layer 3004.Since size reduces,
The hot allocation component 3000 may include the first passage 3012 of receiving part 3010.The hot allocation component 3000 may also include and can connect
Receive the second channel 3014 of second component (not shown).It should be noted that the position of first passage 3012 and second channel 3014
Corresponding to there is no the position of the second layer 3004.However, at first passage 3012 and/or second channel 3014 with hot distribution group
Any one or more components that part 3000 is fixed together can be thermally couple to the second layer 3004 so that by one or more components
The thermal energy of generation can pump to the second layer 3004 from one or more components.
As non-limiting example, component 3010 can be distributed by welding, soldering or adhesion (passing through adhesive) with heat
Component 3000 is fixed together.In addition, the size of first passage 3012 allows component 3010 to be positioned in hot allocation component 3000
In so that component 3010 relative at least copline of first layer 3002 and in some cases under it is embedding.It should be noted that second
The size of passage 3014 allows second component (not shown) to be positioned in hot allocation component 3000 so that second component is opposite
It is embedding under at least copline of third layer 3006 and in some cases.In addition, as non-limiting example, component 3010 can generation
Table one or more component, such as foregoing heat generating components, acoustic component, stent or connector.Alternatively, component 3010 may include by
It is designed to receive the heat-conducting layer of (and so as to dissipate) thermal energy from hot allocation component 3000.
Figure 46 shows the isometric of the alternative embodiment of the hot allocation component 3100 according to some described embodiments
View.Hot allocation component 3100 may include previously to be directed to the described any one or more of material of hot allocation component and/or spy
Sign portion.As shown in the figure, hot allocation component 3100 may include first layer 3102, the second layer 3104 and third layer 3106, wherein this
It is positioned between first layer 3102 and third layer 3106 for two layer 3104.
In some embodiments, the second layer 3104 includes metal, such as copper.In the embodiment shown in Figure 46, the
Include graphite for two layer 3104.In order to which the second layer 3104 and first layer 3102 and third layer 3106 are combined together, hot distribution group
Part 3100 can undergo welding operation.For example, as shown in figure 46, hot allocation component 3100 includes several weld seams, the such as first weldering
3112 and second weld seam 3114 of seam, both first weld seam and second weld seam are represented positioned at first layer 3102 and the second layer 3104
Between several weld seams.In addition, hot allocation component 3100 may include between third layer 3106 and the second layer 3104 by
Several weld seams that 3rd weld seam 3116 represents.By the way that the second layer 3104 and first layer 3102 and third layer 3106 are welded on one
Rise, the second layer 3104 can be resisted will make shearing of the second layer 3104 relative to 3106 displacement of first layer 3102 and third layer originally
Power, it is especially even more so when the second layer 3104 includes granular materials such as graphite.
Figure 47 shows the flow chart 3200 according to some described embodiments, the flow diagrams illustrate for forming electricity
The method of the display assembly of sub- equipment.Electronic equipment may include portable electric appts, such as including smart phone or can wear
The mobile wireless communication equipment of wearing electronic equipment.
In step 3202, display layer is positioned between touch-sensitive layer and power photosensitive layer.The touch-sensitive layer is configured as detection control
The touch input of electronic equipment processed.The power photosensitive layer is configured as the amount that detection is applied to the power of touch-sensitive layer.Display layer, touch-sensitive layer
It may include fringe region with each of power photosensitive layer, which includes at least one connector.In addition, with one or
Some fringe regions of multiple connectors can be perpendicular or parallel to other fringe regions.Connect for example, touch-sensitive layer may include to have
Connect the fringe region of device, and display layer may include the fringe region with connector, and wherein preceding edge region is relative to that
This is parallel or at least substantially parallel.In addition, touch-sensitive layer may include fringe region, which includes connector.However, power
The fringe region of photosensitive layer can be vertical relative to the fringe region of display layer and/or the fringe region of touch-sensitive layer or at least substantially hangs down
Directly.
In step 3204, display layer is bent so that display layer is bent at least partly around power photosensitive layer.In certain situation
Under, display layer is pre-bent.In addition, (bearer connection device) fringe region of display can be with the major part of display layer
Separate.The major part of display layer refers to the most surface for limiting display layer, and the secondary part of display layer refers to pass through
The part that bending section and major part separate.Surface with connector can be positioned in secondary part or by secondary part
Carrying.
Figure 48 shows the flow chart 3300 according to some described embodiments, the flow diagrams illustrate for forming electricity
The method of the battery component of sub- equipment.Battery component, which can be used for providing in electric current, to be positioned in the electronic device several
Portion's component (integrated circuit, audio-frequency module, camera, illumination component etc.).
In step 3302, there is provided shell.Several components that the shell is configured to battery provide housing.The shell
It may include the first cladding element, after component is positioned between the first cladding element and the second cladding element, this first is covered
Cap member is sealed with the second cladding element.In addition, shell can be in a kind of shape in several different shapes.With regard to this
For point, the shape based on electrode and shim, shell may include L-shape configuration, I shapes configuration or C-shaped configuration (as non-limiting
Example).In addition, any previous configuration may include to be designed to the internal part of receiving electronic equipment or be carried for the internal part
For the opening or through hole in space.
In step 3304, multiple electrodes are inserted into shell.The plurality of electrode may include multiple anodes and cathode pair.
In addition, each pair electrode is separated by the shim that physically separates electrode pair each other, at the same still allow electric charge electrode pair it
Between flow.In addition, each electrode can undergo die cut operation, so as to form the electrode with specific dimensions and shape.Size and shape
Shape may include the size and dimension according to shell.In this regard, as non-limiting example, each electrode in electrode pair
It may include L shape, C-shape or I shapes.In addition, when shell includes opening, each electricity in each shim and electrode pair
Pole may also comprise foregoing opening, to provide through hole in battery component.
In step 3306, passage is formed in the shell.Passage can limit the size of the reduction in shell.With regard to this point
Speech, shell can (substantially) include the first height.However, at position corresponding with passage, shell may include high less than first
Second height of degree.The passage is designed to be thinned the shape of battery component so that additional component (such as flexible circuit) can hold
Change places and passed through along passage above battery.In this regard, passage allows to reposition the appendix in the electronic device
Part.However, the shell of battery still can at position corresponding with passage (or in passage) receiving part, such as circuit board.
Figure 49 shows the flow chart 3400 according to some described embodiments, the flow diagrams illustrate for forming electricity
The method of road plate component.The circuit board assemblies are designed to carry several functional units.The circuit board assemblies may include to stack
Configuration, wherein first circuit board are stacked with second circuit board, or alternatively second circuit board is overlapping by first circuit board.Work as quilt
When being positioned in the housing or shell of electronic equipment, stacking configuration can reduce overall space shared by circuit board assemblies (more
In a dimension).
In step 3402, there is provided first circuit board.The first circuit board may include the first functional unit.First operation
Component includes concave part.In addition, first circuit board may include multiple (opposite) surfaces, wherein each surface is designed to carry
Multiple functional units, certain operations component are electrically connected each other by metal trace and/or hole.
In step 3404, second circuit board and first circuit board are fixed together so that first circuit board and second
Circuit board is overlapping.The second circuit board may include second functional unit with protuberance.
In step 3406, the protuberance of the second functional unit is positioned in (or being at least partially positioned at) concave part
In.In this way, the first functional unit will pass through concave part and protuberance and with the second functional unit " mating ".This can reduce the first electricity
Gap between road plate and second circuit board, because the first functional unit and the second functional unit position relatively close to one anotherly, this
It is opposite with the functional unit that can not be coupled each other.Therefore, circuit board assemblies may include relatively thin shape and in the electronic device
Take less space.
Figure 50 shows the flow chart 3500 according to some described embodiments, the flow diagrams illustrate for assembling electricity
The method of sub- equipment, the electronic equipment include the housing for limiting internal volume.The housing may include to lead to internal volume opening
Hole.In step 3502, audio-frequency module is arranged in internal volume.The audio-frequency module may include the audio mould for carrying membrane
Block shell.The audio-frequency module may also include be formed in audio-frequency module shell and with the audio-frequency module opening of through-hole alignment.
In addition, in addition to audio-frequency module opening, audio-frequency module shell can not have additional opening, or alternatively, it may include by impermeable
One or more openings that the seal of gas and liquid-tight covers so that audio-frequency module shell limits what is limited with being located at housing
The sound volume (including front volume and rear volume) that air in internal container is held apart at.
In step 3504, the part around audio-frequency module shell carrys out locating support.For example, stent can be at least in part
Around a part associated with audio-frequency module opening for audio-frequency module shell, so as to provide audio-frequency module shell additional branch
Support.In addition, stent can be at or near through hole together with housing cementation.Adhesive for securing the stand to housing can wrap
Include resistance to bonding agent.
In step 3506, sealing element keeps apart stent and housing seal in through hole.The sealing element can be determined
Position between the bracket and the shell, and also engageable stent and housing.In this regard, audio-frequency module shell and internal volume
In aeroseal keep apart, and membrane and the aeroseal in internal volume can be kept apart.In addition, audio-frequency module shell
It is positioned and is designed to that the external environment condition outside electronic equipment receives air or exhausts air to the external environment condition, the air
It is such as the air of entrance through hole.It is used to exit audio-frequency module opening and leads to launch in addition, membrane can be used in the audio-frequency module
The acoustic energy in hole.
Figure 51 shows the flow chart 3600 according to some described embodiments, the flow diagrams illustrate for making heat
The method of allocation component, the hot allocation component are used for the heat generating components by thermal energy from positioned at the electronic equipment with housing sidewall
Remove.The hot allocation component is designed to provide structural support to electronic equipment, especially when the glass for being coupled to housing sidewall
Bottom wall limits even more so during the housing of electronic equipment.
In step 3602, first layer and the second layer are fixed together.The first layer may include the first bottom wall and from
The first side wall of first bottom wall extension.The second layer may include the second bottom wall for engaging the first bottom wall.In addition, the second layer may be used also
Including extending from the second bottom wall and engaging the second sidewall of the first side wall.In some cases, first layer includes the first kind
Material, such as steel (including stainless steel), in order to provide structural support.In addition, in some cases, the second layer includes Second Type
Material, such as copper or graphite, the Second Type material are designed to strengthen the thermal conductivity of hot allocation component.In addition, first layer and
The second layer can each include additional sidewall.
In step 3604, third layer and the second layer are fixed together.Third layer may include to engage the of the second bottom wall
Three bottom walls.Third layer may also include extends and engages the 3rd side wall of second sidewall and housing sidewall from the 3rd bottom wall.3rd
Layer may include the 3rd types of material, such as steel (including stainless steel).In this regard, third layer can be combined with first layer, with
Additional structural supports are provided.In addition, the second layer can be completely covered in first layer and third layer so that the second layer is by first layer and the 3rd
Layer is hidden.
When hot allocation component has been assembled and when being positioned in the electronic device, first layer is designed to thermal energy from hair
Thermal part is assigned to the second layer.In addition, the second layer is designed to each position distribution thermal energy for spreading all over the second layer so that thermal energy arrives
Up to third layer and it can be assigned to that housing sidewall.
The various aspects, embodiment, specific reality of the embodiment can be used individually or in any combination
Apply or feature.The various aspects of the embodiment can be realized by the combination of software, hardware or hardware and software.The reality
The computer-readable code for being used to control production operation that scheme can be also implemented as on computer-readable medium is applied, or by reality
Apply as the computer-readable code for being used to control production line on computer-readable medium.Computer-readable medium is that can store number
According to any data storage device, which can be read thereafter by computer system.The example of computer-readable medium is included only
Read memory, random access memory, CD-ROM, HDD, DVD, tape and optical data storage.Computer-readable medium
It can also be distributed in the computer system of network-coupled so that computer-readable code is stored and executed in a distributed fashion.
In the foregoing description, for purposes of explanation, used specific name is provided to the thorough of the embodiment
Understand.However, it is evident that, putting into practice the embodiment need not these tool for a person skilled in the art
Body details.Therefore, for the purpose for illustrating and describing, present to the described above of specific embodiment described herein.
They are not intended to exhaustion or embodiment are restricted to disclosed precise forms.For those of ordinary skill in the art
Speech is evident that content, many modifications and variations are possible according to the above instruction.
Claims (20)
1. a kind of circuit board assemblies for electronic equipment, it is characterised in that the circuit board assemblies include：
First circuit board with the first installation surface；
The first functional unit being positioned in first installation surface, first functional unit include concave part；
The second circuit board of the first circuit board is electrically coupled to, the second circuit board has the second installation surface；With
The second functional unit being positioned in second installation surface, second functional unit have protuberance, wherein
The first circuit board is positioned relative to the second circuit board so that the protuberance extends at least partly into the depression
In portion.
2. circuit board assemblies according to claim 1, further include：
The first connector being positioned in the concave part；With
The second connector being positioned on the protuberance, wherein first connector is electrically and mechanically coupled to institute
The second connector is stated, the first circuit board is electrically coupled to the second circuit board.
3. circuit board assemblies according to claim 1, wherein first installation surface is towards second installation surface,
To limit the circuit board assemblies stacked.
4. circuit board assemblies according to claim 1, further include the 3rd behaviour being positioned in first installation surface
Make component, the 3rd functional unit and at least one of first functional unit and second functional unit thermocouple
Connect.
5. circuit board assemblies according to claim 1, further include：
Be positioned between the first circuit board and the second circuit board and with the first circuit board and described second
First interpolater of circuit board electric coupling；
Be positioned between the first circuit board and the second circuit board and with the first circuit board and described second
Second interpolater of circuit board electric coupling；With
Solder mask between first interpolater and second interpolater, the solder mask prevent first interpolation
Electric coupling between device and second interpolater.
6. circuit board assemblies according to claim 1, further include the shielding element for providing electromagnetic interference (EMI) shielding case,
The shielding element includes：
First shielding element, first shielding element cover the opposite with first installation surface of the first circuit board
Installation surface；
Secondary shielding element, the secondary shielding element is around the gap between the first circuit board and the second circuit board
Extension；With
3rd shielding element, the 3rd shielding element cover the opposite with second installation surface of the second circuit board
Surface.
7. circuit board assemblies according to claim 1, further include and are arranged on the first circuit board and second electricity
Embedding Material between the plate of road, the Embedding Material cover first functional unit and second functional unit and provide
The seal for preventing liquid from entering.
8. a kind of electronic equipment, it is characterised in that the electronic equipment includes：
Limit the housing of internal volume；
The circuit board assemblies for the stacking being arranged in the internal volume, the circuit board assemblies of the stacking include：
Carry the first circuit board of the first functional unit in the first installation surface, the first circuit board is also with described first
The second functional unit is carried in the second opposite installation surface of installation surface,
By the overlapping second circuit board of the first circuit board, the second circuit board is towards the of second installation surface
The 3rd functional unit is carried in three installation surfaces,
First shielding element, first shielding element cover the first circuit board and are provided for first functional unit
First electromagnetic interference (EMI) shielding case, and
The secondary shielding element being positioned between the first circuit board and the second circuit board, the secondary shielding element
The 2nd EMI shielding cases are provided for second component.
9. electronic equipment according to claim 8, further includes the battery component being arranged in the internal volume, described
Battery component includes L-shape configuration so that the battery component accommodates the circuit board assemblies of the stacking in the internal volume.
10. electronic equipment according to claim 9, wherein the circuit board assemblies of the stacking include L-shape configuration.
11. electronic equipment according to claim 8, wherein second functional unit includes concave part, and wherein institute
Stating the 3rd functional unit includes extending at least partly into the protuberance in the concave part.
12. electronic equipment according to claim 8, further include be formed into a loop and be electrically coupled to the first circuit board and
The flexible circuit of the second circuit board.
13. electronic equipment according to claim 8, further includes and is arranged on the first circuit board, the second circuit
Embedding Material between plate and the secondary shielding element.
14. electronic equipment according to claim 8, wherein the first circuit board by Self-Clinching Standoffs and with the pressure
The rivet of riveting nut column coupling is fixed together with the second circuit board.
15. a kind of circuit board assemblies, it is characterised in that the circuit board assemblies include：
Housing including bottom wall and side wall, the side wall are combined with the bottom wall to limit internal volume；
In the side-walls and the transparency protected covering of housing coupling；
The display assembly being arranged at least in part in the internal volume, the display assembly are configured as preventing from regarding
Feel that information can be seen through the transparency protected covering；With
The circuit board assemblies being positioned in the internal volume, the circuit board assemblies include：
First circuit board, the first circuit board have the first installation surface and are mounted to the of first installation surface
One integrated circuit, and
Second circuit board with the second installation surface towards first installation surface, the second circuit board, which has, is pacified
It is attached to the second integrated circuit of second installation surface.
16. circuit board assemblies according to claim 15, further include shielding element, wherein the first circuit board with it is described
Second circuit board is separated by gap, and wherein described shielding element is positioned in the gap.
17. circuit board assemblies according to claim 15, further include：
The first functional unit being positioned in first installation surface；With
The second functional unit being positioned in second installation surface, wherein first functional unit is coupled directly to institute
State the second functional unit.
18. circuit board assemblies according to claim 15, wherein the display assembly includes：
Touch input layer；
Display layer；With
Power photosensitive layer, wherein the display layer is bent around the power photosensitive layer.
19. circuit board assemblies according to claim 15, further include and are electrically and mechanically coupled to first circuit
The flexible circuit of plate and the second circuit board.
20. circuit board assemblies according to claim 15, further include the battery component being positioned in the internal volume,
Wherein described battery component and the circuit board assemblies are each similar to L-shape configuration.
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662398045P | 2016-09-22 | 2016-09-22 | |
| US201662398059P | 2016-09-22 | 2016-09-22 | |
| US201662398065P | 2016-09-22 | 2016-09-22 | |
| US201662398037P | 2016-09-22 | 2016-09-22 | |
| US201662398069P | 2016-09-22 | 2016-09-22 | |
| US62/398,045 | 2016-09-22 | ||
| US62/398,069 | 2016-09-22 | ||
| US62/398,037 | 2016-09-22 | ||
| US62/398,065 | 2016-09-22 | ||
| US62/398,059 | 2016-09-22 |
Publications (1)
| Publication Number | Publication Date |
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| CN207340290U true CN207340290U (en) | 2018-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201780020811.XA Active CN109074190B (en) | 2016-09-22 | 2017-09-20 | Display module and glass with undercut plastic frame |
| CN202210533859.3A Pending CN114967975A (en) | 2016-09-22 | 2017-09-20 | Display module and glass with undercut plastic frame |
| CN201721209785.9U Active CN207340290U (en) | 2016-09-22 | 2017-09-21 | Circuit board assemblies, electronic equipment and circuit board assemblies for electronic equipment |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780020811.XA Active CN109074190B (en) | 2016-09-22 | 2017-09-20 | Display module and glass with undercut plastic frame |
| CN202210533859.3A Pending CN114967975A (en) | 2016-09-22 | 2017-09-20 | Display module and glass with undercut plastic frame |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6775596B2 (en) |
| KR (2) | KR102289734B1 (en) |
| CN (3) | CN109074190B (en) |
| WO (1) | WO2018057652A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2020191124A (en) | 2020-11-26 |
| CN109074190A (en) | 2018-12-21 |
| KR102289734B1 (en) | 2021-08-12 |
| JP6906666B2 (en) | 2021-07-21 |
| KR20180113219A (en) | 2018-10-15 |
| JP6775596B2 (en) | 2020-10-28 |
| CN109074190B (en) | 2022-05-24 |
| JP2019516123A (en) | 2019-06-13 |
| KR20200128172A (en) | 2020-11-11 |
| CN114967975A (en) | 2022-08-30 |
| WO2018057652A1 (en) | 2018-03-29 |
| KR102174119B1 (en) | 2020-11-04 |
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