WO2021103725A1

WO2021103725A1 - Circuit board assembly and electronic device

Info

Publication number: WO2021103725A1
Application number: PCT/CN2020/112673
Authority: WO
Inventors: 史洪宾; 刘振威; 陈曦
Original assignee: 华为技术有限公司
Priority date: 2019-11-25
Filing date: 2020-08-31
Publication date: 2021-06-03
Also published as: CN113455108A; CN212115762U

Abstract

Provided in the embodiments of the present application are a circuit board assembly and an electronic device. The electronic device may comprise a mobile phone, a tablet computer, a notebook computer, an ultra mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a driving recorder, a virtual reality device and other mobile or fixed terminals. A bridging part is provided between two adjacent bonding parts of a reinforcing member, and a gap for a surface wiring to pass through is formed between the bridging part and a circuit board, so that the surface wiring of the circuit board may pass below the bridging part without interfering with the reinforcing member. When the circuit board is subject to mechanical external forces such as falling or bending, since the bonding parts and the bridging part of the reinforcing member are still an integral body, the disadvantage of the segmented reinforcing member having a weakened reinforcement region is avoided. Therefore, the reinforcement strength is relatively high, which may reduce the risk of breaking the circuit board.

Description

Circuit board assembly and electronic equipment

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 201922051301.8, and the application name is "a circuit board assembly and electronic equipment" on November 25, 2019, the entire content of which is incorporated into this application by reference in.

Technical field

This application relates to the field of terminal technology, and in particular to a circuit board assembly and electronic equipment.

Background technique

Circuit board is an important electronic component in electronic equipment. It is the support of electronic components in electronic equipment and the carrier of electrical connection of electronic components. As electronic devices become more sophisticated, in order to ensure the rigidity of the circuit board and reduce the risk of breaking the circuit board in scenarios such as impact and drop, it is necessary to carry out a reinforcement design for the circuit board.

At present, the reinforcement design for the circuit board is generally to directly weld the reinforcing steel sheet on the surface of the circuit board, and the reinforcing steel sheet is generally made of stainless steel. For example, referring to Figure 1, the reinforcement design is for the slender strip area of the slender strip circuit board. The reinforcement steel sheet needs to be reinforced along the long side of the circuit board 70. On the circuit board 70, the radio frequency function The area 71 is located at the left side of the circuit board 70, and the coaxial cable holder 73 is located at approximately the middle position. The coaxial cable 72 is used to lead out radio frequency signals, and the end of the coaxial cable 72 is inserted into the coaxial cable holder 73. on. In order to ensure the radio frequency performance, the surface radio frequency functional area 71 must be led out to the position of the coaxial cable seat 73 through the surface wiring 74. To prevent the reinforcing steel sheet from interfering with the surface wiring 74 and causing failure to exit, segmentation can be used. Reinforcement method, for example, the reinforced steel plate includes a first reinforced steel piece 75 and a second reinforced steel piece 76 spaced apart from each other, and the spacing position between the first reinforced steel piece 75 and the second reinforced steel piece 76 Can be used to set the surface wiring 74.

However, as mentioned above, the use of segmented reinforcement to reinforce the circuit board can only reinforce each local area separately, and cannot reinforce the entire circuit board as a whole, so the reinforcement strength is relatively high. Poor, the risk of circuit board breakage also increases.

Utility model content

The embodiments of the present application provide a circuit board assembly and electronic equipment. A bridge portion is provided between two adjacent bonding portions of a reinforcing member, and a surface wiring is formed between the bridge portion and the circuit board. Clearance, so that the surface wiring can pass under the bridging part without interference with the reinforcement. On the other hand, when the circuit board is subjected to mechanical external forces such as falling or bending, since the bonding part and the bridge part of the reinforcement are still integrated, the disadvantages of the segmented reinforcement of the weakened area of the reinforcement are avoided. The reinforcement strength is high, which can reduce the risk of breakage of the circuit board.

The first aspect of the embodiments of the present application provides a circuit board assembly, which is applied to electronic equipment, and includes a circuit board and a reinforcing member. The surface of the circuit board is provided with surface wiring, and the reinforcing member is used to reinforce the circuit board. The parts include a bridge part and a plurality of bonding parts, the bonding part is bonded to the surface of the circuit board, the two ends of the bridge part are respectively connected with two adjacent bonding parts, and the bridge part is suspended on the circuit board. A gap is formed between the bridge portion and the circuit board for the surface wiring to pass through.

By providing a bridging part between two adjacent bonding parts, and forming a gap between the bridging part and the circuit board for the surface wiring to pass through, unlike the bonding part attached to the surface of the circuit board, the bridging part is self-contained The surface of the circuit board is raised by a preset distance, so that the surface wiring can pass under the bridge portion, although it overlaps with the reinforcement, but does not interfere with each other. On the other hand, when the circuit board is subjected to mechanical external forces such as falling or bending, since the bonding part and the bridging part of the reinforcing member are still as a whole, the disadvantages of the weakened area of the reinforcing member in the segmented reinforcing member are avoided. Therefore, the reinforcement strength is high, which can reduce the risk of breakage of the circuit board.

In a possible implementation, it also includes a flexible circuit board, which is connected to the circuit board, and the circuit board is also provided with a connection port, which is used to connect to an external plug-in lead, and the connection port is connected to the flexible circuit board. A reinforcing piece is arranged between the circuit boards, and the reinforcing piece includes a stop structure, and the height of the stop structure is greater than the height of the connection port.

By providing a reinforcing piece between the connection port and the flexible circuit board, a stop structure is provided on the reinforcing piece, so that the stop structure can be set between the connection port and the flexible circuit board. When the lead end is inserted into the connection port, even if the lead end slips sideways due to improper operation, the height of the stop structure will be greater than the height of the connection port, and the stop will block the further of the lead end. Slipping to prevent it from scratching the flexible circuit board and causing malfunction.

In a possible implementation manner, a bridge portion is provided between the connection port and the flexible circuit board, and the bridge portion forms a stop structure.

In the case that the bridging part is located between the connection port and the flexible circuit board, the entire bridging part directly forms the stop structure. The height of the bridging part is greater than the height of the connecting port, so that the bridging part is used as a reinforcing member. At the same time, it is also used as a stop structure, which can make the structure of the reinforcement member simpler.

In a possible implementation manner, a bridge portion is provided between the connection port and the flexible circuit board, and a local area of the bridge portion is raised to form a stop structure.

When the bridging part is located between the connection port and the flexible circuit board, the stop structure is directly formed by the local area of the bridging part. For example, the bridging part is formed as a step structure, and the height of the raised part is greater than that of the connection The height of the port enables the bridging part to be used as a reinforcing member while also serving as a stop structure, which makes the structure of the reinforcing member simpler.

In a possible implementation manner, a bonding part is provided between the connection port and the flexible circuit board, and the bonding part is connected with a protruding part, and the protruding part forms a stop structure.

When the bonding part is located between the connection port and the flexible circuit board, the protrusion is directly connected to the bonding part to form a stop structure. The height of the protrusion is greater than the height of the connection port, so that the bonding part is in the As a reinforcing member, it also serves as a stop structure, which can make the structure of the reinforcing member simpler.

In a possible implementation, the connection port is a coaxial cable connector or a board-to-board connector port.

The type of connection port can be set according to the actual needs of the circuit board.

In a possible implementation manner, a cable management clip is further included, and the cable management clip is connected to the attaching part.

Set the cable management clip on the bonding part to facilitate the storage of the coaxial cable and other leads.

In a possible implementation manner, a fitting portion protruding toward the surface of the circuit board is provided on the bonding portion, a recessed portion is provided on the surface of the circuit board corresponding to the fitting portion, and the fitting portion can be inserted into the recessed portion.

The fitting part provided on the bonding part can be fitted into the recessed part of the circuit board to act as an anchor, which can enhance the reliability of the connection between the reinforcing member and the circuit board and prevent the two from being easily separated.

In a possible implementation, the connecting part of the bridging part and the fitting part has a chamfered structure.

Prevent damage to the operator or other parts, such as leads.

In a possible implementation, the bridging part and the fitting part are integrally formed.

In this way, the strength of the entire reinforcement can be higher, and the reinforcement effect on the circuit board is also better.

In a possible implementation manner, the circuit board is a printed circuit board PCB or a flexible printed circuit board FPC.

The above-mentioned scheme is applicable to the reinforcement of rigid circuit boards and flexible circuit boards at the same time.

In a possible implementation manner, a plurality of bridge portions spaced apart from each other are connected between two adjacent bonding portions.

When the size of the bonding part is relatively large, it is conceivable that a plurality of bridge parts are connected in front of a pair of adjacent two bonding parts.

A second aspect of the embodiments of the present application provides an electronic device, which includes at least a display screen, a middle frame, a back cover, and the above-mentioned circuit board assembly. The display screen and the back cover are respectively located on both sides of the middle frame, and the circuit board assembly is located on the display screen and In the cavity enclosed by the middle frame, or the circuit board assembly is located in the cavity enclosed by the back cover and the middle frame.

By setting a bridging part between two adjacent bonding parts, and forming a gap between the bridging part and the circuit board for the surface wiring to pass through, so that the surface wiring can pass through under the bridging part without compensating for it. Strong parts interfere. On the other hand, when the circuit board in the electronic device is subjected to mechanical external forces such as falling or bending, since the fitting part and the bridge part of the reinforcing member are still as a whole, it is avoided that the segmented reinforcing member has a weakened area of reinforcement Therefore, the strength of the reinforcement is relatively high, which can reduce the risk of breakage of the circuit board, and make the reliability of the electronic device relatively high.

Description of the drawings

Fig. 1 is a schematic diagram of a prior art circuit board reinforcement design structure;

FIG. 2 is a schematic diagram of a three-dimensional structure of an electronic device provided by an embodiment of the application

FIG. 3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the application;

4 is a schematic diagram of the structure of the circuit board assembly of the electronic device installed on the middle frame according to an embodiment of the application;

5 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device provided by an embodiment of the application;

6 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device provided by an embodiment of the application;

FIG. 7 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the application;

FIG. 8 is a schematic diagram of a pressing simulation model in a circuit board assembly of an electronic device provided by an embodiment of the application;

FIG. 9 is a schematic diagram of the stress distribution on the top surface of the circuit board assembly of the electronic device according to an embodiment of the application in the pressing simulation;

FIG. 10 is a schematic diagram of stress distribution on the bottom surface of a circuit board assembly of an electronic device according to an embodiment of the application in a pressing simulation;

11 is a schematic diagram of the stress distribution on the top surface of a circuit board adopting segmented reinforcement in the prior art in the compression simulation;

FIG. 12 is a schematic diagram of the stress distribution on the bottom surface of a circuit board adopting segmented reinforcement in the prior art in the compression simulation;

FIG. 13 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device provided by an embodiment of the application;

14 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device provided by an embodiment of the application;

15 is a schematic diagram of the backside structure of the circuit board in the circuit board assembly of the electronic device provided by an embodiment of the application;

16 is a schematic diagram of the backside structure of the circuit board in the circuit board assembly of the electronic device provided by an embodiment of the application;

FIG. 17 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the application;

18 is a left side view of the circuit board in the circuit board assembly of the electronic device provided by an embodiment of the application;

Figure 19 is a front view of Figure 18;

Figure 20 is a top view of Figure 18;

FIG. 21 is a left side view of a circuit board in a circuit board assembly of an electronic device provided by an embodiment of the application;

Figure 22 is a front view of Figure 21;

Fig. 23 is a top view of Fig. 21.

Description of reference signs:

100-mobile phone; 10-circuit board assembly; 11, 70-circuit board; 12-first functional area; 13-surface wiring; 14-connection port; 15-external plug-in lead; 16-cable management clamp; 17-screw 18-fixed shaft; 19-recessed part; 20-reinforcement part; 21-bridging part; 22-fitting part; 30-flexible circuit board; 31-stop structure; 32-protruding part; 33- Step part; 50-fitting part; 71- radio frequency function area; 72- coaxial line; 73- coaxial line seat; 74- surface wiring; 75- first reinforcing steel sheet; 76- second reinforcing steel Pieces; 81-display; 82-back cover; 83-middle frame; 85-battery; 86-sounding device; 87-metal middle plate; 88-top frame; 89-bottom frame; 90-left frame; 91-right Frame; 221-first bonding part; 222-second bonding part; 223-third bonding part; 211-first bridging part; 212-second bridging part; 311-shrapnel; 312-avoiding part ; 313-Flanging.

Detailed ways

The terminology used in the implementation mode part of this application is only used to explain the specific embodiments of the application, and is not intended to limit the application. The implementation manners of the embodiments of the application will be described in detail below with reference to the accompanying drawings.

The embodiments of this application provide an electronic device, including but not limited to mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (UMPC), handheld computers, walkie-talkies, netbooks, POS machines, and personal digital assistants Mobile or fixed terminals with circuit boards such as personal digital assistant (PDA), driving recorders, wearable devices, or virtual reality devices.

In the embodiment of the present application, the mobile phone 100 is taken as the above electronic device as an example for description. Figures 2 and 3 respectively show the overall structure and the split structure of the mobile phone 100. See Figure 3, the mobile phone 100 may include: The screen 81 and the back cover 82, between the display screen 81 and the back cover 82, a middle frame 83, a circuit board assembly 10, a battery 85 and a sounding device 86 can be arranged. Wherein, the circuit board assembly 10, the battery 85 and the sound emitting device 86 can be arranged on the middle frame 83. For example, the circuit board assembly 10, the battery 85 and the sound emitting device 86 are arranged on the side of the middle frame 83 facing the rear cover 82, so that the circuit The board assembly 10 is located in the cavity enclosed by the back cover 82 and the middle frame 83; or the circuit board assembly 10, the battery 85 and the sound emitting device 86 can be arranged on the side of the middle frame 83 facing the display screen 81, so that the circuit board assembly 10 It is located in the cavity enclosed by the display screen 81 and the middle frame 83.

In the embodiment of the present application, when the battery 85 is installed on the middle frame 83, for example, a battery compartment can be arranged on the side of the middle frame 83 facing the rear cover 82, and the battery 85 is installed in the battery compartment on the middle frame 83 (as shown in Figure 3). Shown in the dashed box). In the embodiment of the present application, the battery 85 can be connected to the charging management module and the circuit board assembly 10 through the power management module. The power management module receives input from the battery 85 and/or the charging management module, and is a processor, internal memory, external memory, The display screen 81, the camera, the communication module, etc. supply power. The power management module can also be used to monitor battery capacity, battery cycle times, battery health status (leakage, impedance) and other parameters. In some other embodiments, the power management module may also be provided in the processor of the circuit board assembly 10. In other embodiments, the power management module and the charging management module may also be provided in the same device.

In order to realize the external playback function of the mobile phone 100, as shown in FIG. 3, the mobile phone 100 may further include: a sound generating device 86, which can convert an audio electric signal into a sound signal, and the mobile phone 100 can play music through the sound generating device 86, or realize Hands-free calling, etc. The sounding device 86 may be provided on the side of the middle frame 83 facing the rear cover 82 so that the sounding device 86 is formed in the cavity enclosed by the back cover 82 and the middle frame 83.

In the embodiment of the present application, a microphone (not shown), that is, a microphone, is also provided in the mobile phone 100. The microphone is used to convert sound signals into electrical signals. When making a call or sending voice information, the user can use the mouth to approach the microphone to make a sound. To input the sound signal to the microphone.

In the embodiment of the present application, the display screen 81 may be an organic light-emitting diode (OLED) display or a liquid crystal display (LCD). It should be understood that the display screen 81 may include a display and a touch control device, the display is used to output display content to the user, and the touch control device is used to receive a touch event input by the user on the display screen 81.

In the embodiment of the present application, the back cover 82 may be a metal cover, a glass cover, a plastic cover, or a ceramic cover. In the embodiment of the present application, the material of the back cover 82 is not limited.

In the embodiment of the present application, as shown in FIG. 2, the middle frame 83 may include a metal middle plate 87 and a frame. The frame is arranged one week along the outer circumference of the metal middle plate 87. For example, the frame may include a top frame 88 and a bottom frame arranged opposite to each other. 89, and a left frame 90 and a right frame 91 located between the top frame 88 and the bottom frame 89 and opposite to each other. Wherein, the connection between each frame and the metal middle plate 87 includes, but is not limited to, welding, clamping, and integral injection molding.

The material of the metal middle plate 87 may be aluminum or aluminum alloy, or the material of the metal middle plate 87 may be stainless steel. It should be noted that the material of the metal middle plate 87 includes but is not limited to the above-mentioned materials.

Among them, each frame (top frame 88, bottom frame 89, left frame 90, and right frame 91) can be a metal frame, a glass frame, or a plastic frame or a ceramic frame.

In order to show the structure of the circuit board assembly 10 mounted on the middle frame 83 more clearly, as shown in FIG. 4, the circuit board assembly 10 and the battery 85 are sequentially arranged on the metal middle plate 87. Of course, in FIG. 3, the case where the circuit board assembly 10 is located above the battery 85 is taken as an example for description. The circuit board assembly 10 may also be located at a position below, on the left side, or on the right side of the battery 85.

It should be noted that in some other examples, the mobile phone 100 may include a display screen 81 and a back cover. The back cover may be the back cover 82 and the frame in FIG. 2 (that is, the top frame 88, the bottom frame 89, the left frame 90 and A back cover formed by a unibody formed by a frame composed of a right frame 91). The circuit board assembly 10 and the battery 85 are located in a cavity enclosed by the display screen 81 and the back cover.

It is understandable that the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the mobile phone 100. In other embodiments of the present application, the mobile phone 100 may include more or fewer components than those shown in the figure, or combine certain components, or split certain components, or arrange different components. For example, the mobile phone 100 may also include a camera (such as a front camera and a rear camera) and a flashlight.

In this application, the circuit board assembly may include a circuit board. Circuit boards are classified according to their structures, and can be divided into rigid printed circuit boards (Printed Circuit Board, PCB), flexible printed circuit boards (Flexible Printed Circuit board, FPC), and rigid-flex printed circuit boards. The circuit board in this application can adopt any of the above-mentioned circuit boards, and the reinforcement design in this application can be applied to the reinforcement of rigid printed circuit boards and flexible printed circuit boards at the same time.

In the embodiments of the present application, the circuit board assembly may include multiple circuit boards, and the multiple circuit boards may be of different types. For example, some circuit boards may be flexible printed circuit boards, and some circuit boards may be rigid printed circuit boards. Circuit boards, some of the circuit boards can be rigid-flex combined printed circuit boards, and different types of circuit boards can be arranged horizontally adjacent to each other, or they can be arranged vertically.

It is understandable that the circuit board assembly of the mobile phone 100 may include multiple electronic components. In this application, the connection of some of the electronic components, such as connection ports, radio frequency functional areas, etc., and the circuit board is taken as an example for illustration. When multiple other electronic components are connected to the circuit board, other electronic components can also be connected to the circuit board in the same way, which will not be repeated here.

In the prior art, in the reinforcement design for the circuit board, if the reinforcement on the circuit board interferes with the surface wiring, it may cause the surface wiring to be unable to be set, resulting in the failure of the wiring; therefore, to achieve the surface layer For wiring, only interrupted reinforcement parts can be used, and the design of segmented reinforcement is adopted, but this will also bring about insufficient reinforcement problems and the risk of circuit board breakage, and this application can be used in adjacent bonding Elevated bridging part is set between the parts, so that the surface wiring is installed under the bridging part, so that the smooth wiring of the surface wiring can be ensured, and the reinforcement strength caused by the setting of each fitting part is avoided The question of not enough.

In the following, taking the structure of the mobile phone 100 as described above as an example, the structure of the mobile phone 100 will be described for scene 1, scene 2 and scene 3 respectively.

scene one

In the present application, as shown in FIG. 5, the circuit board assembly 10 in the present application may include a circuit board 11 and a reinforcing member 20. The circuit board 11 may be, for example, a strip-shaped circuit board 11, with the reinforcing member 20 and Correspondingly, the elongated strip area on the circuit board 11, such as the upper area of the circuit board 11 shown in FIG. 5, can be reinforced. Exemplarily, the circuit board 11 is a rigid printed circuit board.

A surface wiring 13 may be provided on the surface of the circuit board 11. The surface wiring 13 is used for electrical connections between electrical components or functional areas on the circuit board 11. The surface wiring 13 may be arranged on the circuit board due to design requirements. The surface layer of 11, or, may be required for functionality, and must be provided on the surface layer of the circuit board 11.

Exemplarily, the circuit board 11 may also be provided with a first functional area 12, the first functional area 12 may be a radio frequency functional area, and the circuit board 11 may also be provided with a connection port 14, which is used to connect to the outside. The lead 15 is connected, and the connection port 14 can be a coaxial connector or a board-to-board connector port. It is understandable that the type of the connection port 14 can be set according to the actual needs of the circuit board 11, and the external lead is plugged in. 15 can be a coaxial line. In the circuit board 11 shown in FIG. 5, the first functional area 12 and the connection port 14 can be electrically connected through the above-mentioned surface wiring 13. In fact, the connection port 14 is a coaxial cable connection seat, and the external plug-in lead 15 is When coaxial lines, in order to ensure the RF performance, the RF wiring must be led out to the position of the coaxial cable connection seat by way of surface wiring.

In the embodiment of the present application, the reinforcing member 20 includes a bridge portion 21 and a plurality of bonding portions 22. The bonding portions 22 are bonded to the surface of the circuit board 11, for example, soldered on the surface of the circuit board 11 by soldering, etc., it can be understood However, the bonding portion 22 is provided at a position on the surface of the circuit board 11 where no electrical components are provided and no electrical wiring is provided.

Both ends of the bridge portion 21 are respectively connected to two adjacent bonding portions 22, and the bridge portion 21 is suspended on the circuit board 11. For example, the bridge portion 21 has a preset distance from the surface of the circuit board 11, so that A gap for the surface wiring 13 to pass through is formed between the bridging portion 21 and the circuit board 11. In the circuit board 11 of FIG. 5, a bridging portion 21 is provided between two adjacent bonding portions 22, and a gap for the surface wiring 13 to pass through is formed between the bridging portion 21 and the circuit board 11. The part 22 is attached to the surface of the circuit board 11 differently. The bridging part 21 is raised from the surface of the circuit board 11 by a predetermined distance H, for example, 0.7-0.9 mm, so that the surface wiring 13 can pass under the bridging part 21. In a plan view, the bridging portion 21 and the surface wiring 13 overlap, but they do not interfere with each other. The bridging portion 21 may be attached to the surface wiring 13 so that there is no gap therebetween, and the bridging portion 21 may have a certain distance from the surface wiring 13.

In this way, when the circuit board 11 is subjected to mechanical external forces such as falling or bending, since the separated bonding portions 22 are connected as a whole by the bridging portion 21, the stress acting on a certain part of the circuit board 11 can pass through the bridging portion 21 and so on are uniformly dispersed to each bonding part 22, and the separated bonding part 22 is equivalent to a whole to reinforce the circuit board 11. Therefore, the reinforcing strength is relatively high and the risk of breakage of the circuit board 11 can be reduced.

In addition, the reinforcing member of the present application is formed as a three-dimensional reinforcing member. Without changing the original device layout, the area of the reinforcing member corresponding to the top of the surface wiring 13 is raised, and due to the surface wiring 13 The wires can be routed out from the bottom of the bridging portion 21 formed as a three-dimensional structure. Therefore, the wiring distance of the surface wiring 13 is short, which can ensure the good electrical performance of the first functional area 12.

The number of the bonding portions 22 on the circuit board 11 of the present application includes but is not limited to two, and other numbers may be more. It is understandable that the number of the bridging portions 21 can be based on the actual distribution of the surface wiring 13 The conditions can be set flexibly, and the bridging parts 21 may be provided between a plurality of adjacent bonding parts 22, or the bridging parts 21 may be provided between partially adjacent bonding parts 22.

In the embodiment of the present application, for example, when the external plug-in lead 15 is connected to the connection port 14, a separate cable management clip needs to be provided to accommodate the external plug-in lead 15. In the circuit board 11 shown in FIG. 6, the external A screw 17 is provided on the side of the plug-in lead 15 so that the external plug-in lead 15 can easily move to the screw 17 during the use of the circuit board 11. Sometimes it may happen that the screw 17 clamps off the external plug-in lead 15, or The shaking of the external plug lead 15 will affect the reliability of the electrical connection. In order to avoid this problem, the prior art usually solders the cable management clip directly on the circuit board 11. However, this will cause interference between the setting position of the cable management clip and the reinforcing member 20, and the corresponding reinforcing member at the setting position of the cable management clip 16 may be interrupted or installed in sections, which may cause the reinforcing member to interfere with the circuit board. The reinforcing strength is not enough. In the embodiment of the present application, the wire management clip 16 can be arranged on the bonding part 22, and the wire management clip 16 can be fixed to the bonding part 22 by laser welding, for example, so as to avoid external The plug lead 15 is clamped and broken by the screw 17, which can also solve the problem that the wire management clamp 16 affects the reinforcing strength.

In the embodiments of the present application, in order to prevent the bridging portion 21 from causing damage to the operator or other components, such as external plug-in leads 15, the connecting portion of the bridging portion 21 and the bonding portion 22 may also have a chamfered structure.

In the embodiment of the present application, in order to make the strength of the entire reinforcement member higher, the bridge portion 21 and the bonding portion 22 may be integrally formed. For example, an integral reinforcement member structure may be formed first, and then the integral reinforcement member The part of the structure that will form the bridge portion 21 is partially stamped to form the bridge portion 21. In this way, the reinforcing member 20 as an integrally formed structure has good strength and a good reinforcing effect on the circuit board 11.

In some other examples, the bridging portion 21 and the bonding portion 22 may also be formed separately, and then connected by welding or the like. This facilitates the processing of the bridging part 21 and the bonding part 22.

In the illustrations of this scene, the description is made by taking a bridging portion 21 connected between two adjacent bonding portions 22 as an example. However, the number of bridging portions 21 includes but is not limited to one, as shown in the figure. As shown in 7, in a possible implementation manner, a plurality of bridge portions 21 spaced apart from each other may also be connected between two adjacent bonding portions 22. This case can be applied to a case where the width dimension of the bonding portion 22 is relatively large, for example. It can be understood that, compared with an integrated bridge portion, the spaced-apart bridge portions 21 can reduce the weight of the reinforcing member 20, thereby reducing the weight of the circuit board assembly and the whole machine; on the other hand, multiple The heights of the bridge portions 21 spaced apart can be different to match with other internal structural parts of the whole machine.

In the embodiment of the present application, for the connection between the reinforcing member 20 and the circuit board 11, the reinforcing member 20 can be soldered to the circuit board 11 by reflow soldering, for example, solder paste is brushed on the surface of the circuit board 11, and the repair The strong part 20 is placed at the corresponding pad position on the circuit board 11 where the solder paste is printed, and then the solder paste is melted and solidified in a high-temperature reflow oven to finally solder the reinforcement part 20 to the circuit board 11. It can be understood that the soldering method of the reinforcing member 20 includes but is not limited to reflow soldering, and other soldering methods such as dip soldering can also be used.

In order to verify the reinforcement effect of the circuit board 11 in this scenario, modeling and simulation of the reinforcement effect of the circuit board 11 in the embodiment of the present application and the circuit board 11 adopting segmented reinforcement in the prior art were also performed.

Both the integrated three-dimensional reinforcement design of the present application and the segmented planar reinforcement 20 of the prior art solve the problem of interference between the surface wiring 13 and the reinforcement 20. The above simulation experiment is to compare the reinforcement effects of the two The difference, as shown in Fig. 8, taking the circuit board 11 in this scene as an example, fixing shafts 18 are added at both ends of the elongated strip area of the circuit board 11, and a pressing force of 50N is applied to the position of the connection port 14, respectively Extract the maximum strain of the circuit board 11 of the present application and the prior art circuit board.

9-12, the maximum strain of the circuit board 11 of the present application is 4676 ue, while the maximum strain of the prior art segmented reinforced circuit board is 6222 ue. In Fig. 9, the label "A" refers to The position is where the stress is greatest. In Figure 10, the position indicated by the label "B" is the position with the greatest stress. In Figure 11, the position indicated by the label "C" is the position with the greatest stress. In Figure 12, the position indicated by the label "D" is The place where the stress is greatest. It can be seen that, in the strain scenario of pressing the connection port 14, the integrated three-dimensional reinforced circuit board of the present application can reduce the strain of the circuit board by 25%, and therefore can significantly improve the risk of circuit board breakage.

Scene two

In the embodiment of the present application, as shown in FIG. 13, the circuit board assembly 10 may include a circuit board 11 and a reinforcing member 20. The surface of the circuit board 11 is provided with surface wiring 13, and the reinforcing member 20 is used to reinforce the circuit board 11. , The reinforcing member 20 includes a bridge portion 21 and a plurality of bonding portions 22, the bonding portion 22 is bonded to the surface of the circuit board 11, the two ends of the bridge portion 21 are respectively connected to two adjacent bonding portions 22, and The bridge portion 21 is suspended on the circuit board 11, and a gap for the surface wiring to pass through is formed between the bridge portion 21 and the circuit board 11.

The circuit board assembly 10 also includes a flexible circuit board 30. The flexible circuit board 30 and the circuit board 11 are connected. In some cases, the distance between the flexible circuit board 30 and the connection port 14 is relatively small, for example, 3 mm, so that the operator will When the end of the external plug-in lead 15 is plugged into the connection port 14, it is very easy to scratch the flexible circuit board 30 and cause malfunction. In order to avoid this situation, for example, in the case where a part of the structure of the reinforcing member 20 is located between the connection port 14 and the flexible circuit board 30, the reinforcing member 20 may include a stop structure 31. The height is greater than the height of the connection port 14. In this way, the stop structure 31 can be set between the connection port 14 and the flexible circuit board 30. When the operator inserts the external lead end on the connection port 14, even if the lead end is sideways due to improper operation When sliding, because the height of the stop structure 31 is greater than the height of the connection port 14, the stop part will block the further sliding of the lead end to prevent it from scratching the flexible circuit board 30 and causing malfunction.

In the embodiment of the present application, as shown in FIG. 13, a bonding portion 22 is provided between the connection port 14 and the flexible circuit board 30. The bonding portion 22 may be connected with a protruding portion 32 until the protruding portion 32 is formed.盘结构31。 Block structure 31. When the bonding portion 22 is located between the connection port 14 and the flexible circuit board 30, the projection 32 is directly connected to the bonding portion 22 to form a stop structure 31, and the height of the projection 32 is greater than that of the connection port 14. With a height of φ, the bonding portion 22 can be used as the reinforcement member 20 and also as the stop structure 31, so that the structure of the reinforcement member 20 can be simplified.

Exemplarily, the protruding portion 32 may be provided on the bonding portion 22 by means of laser welding or the like, and the location of the protruding portion 32 may be the area of the bonding portion 22 between the connection port 14 and the flexible circuit board 30. The height of the protrusion 32 may be slightly higher than that of the connection port 14, for example, 0-0.2 mm higher than the connection port 14. Illustratively, the height of the protrusion 32 is 0.7-0.9 mm.

In some other examples, as shown in FIG. 14, the reinforcing member 20 may be designed with flanging. For example, a flange portion 313 is provided at the edge of the reinforcing member 20 close to the flexible circuit board 30 as the stop structure 31. The height of the flange portion 313 is higher than that of the connection port 14 to prevent the end of the external lead from touching the flexible circuit board 30 and avoid scratching the flexible circuit board 30.

As shown in Figures 15 and 16, in order to achieve better antenna performance, an elastic piece 311 can also be provided on the back of the reinforcing member 20, such as the bonding part 22. It is understandable that at the position where the elastic piece 311 is provided, The circuit board 11 needs to be provided with an avoiding portion 312 for receiving the elastic sheet 311. The shrapnel can be welded to the reinforcing member 20 by laser spot welding, and the shrapnel 311 can be connected to the metal shell of the TYPE C connector for grounding, so as to achieve better antenna performance.

In some other examples, as shown in FIG. 17, a bridge 21 is provided between the connection port 14 and the flexible circuit board 30, and therefore, the stop structure 31 may be formed by the bridge 21. For example, in the case where the bridging portion 21 is located between the connection port 14 and the flexible circuit board 30, the entire bridging portion 21 directly forms the stop structure 31, and the setting position of the bridging portion 21 may be the position where the circuit board 11 is located. In the area between the connection port 14 and the flexible circuit board 30, the height of the bridging portion 21 may be slightly higher than that of the connection port 14, for example, 0～0.2mm higher than the connection port 14. Exemplarily, bridging The height of the portion 21 is 0.7 to 0.9 mm. In this solution, the bridge portion 21 is used as the reinforcing member 20 and also used as the stop structure 31, so that the structure of the reinforcing member 20 can be made simpler.

In the embodiment of the present application, when a part of the structure of the bridging portion 21 is disposed between the connection port 14 and the flexible circuit board 30, a partial area of the bridging portion 21 may also be raised to form the stop structure 31. As shown in FIGS. 18 to 20, a step portion 33 is formed on the bridge portion 21. As shown in FIGS.

In this solution, the stop structure 31 is directly formed by the protrusion of the partial area of the bridge 21. For example, the bridge 21 is formed as a step structure. The height of the protrusion is greater than the height of the connection port 14, so that the bridge 21 While being used as the reinforcing member 20, it is also used as the stop structure 31, so that the structure of the reinforcing member 20 can be made simpler.

The setting position of the step portion 33 may be the area of the circuit board 11 between the connection port 14 and the flexible circuit board 30, and the setting height of the step portion 33 may be slightly higher than that of the connection port 14, for example, than the connection port 14. The height is 0 to 0.2 mm. Illustratively, the height of the step portion 33 is 0.7 to 0.9 mm.

For the connection between the reinforcing member 20 and the circuit board 11, the reinforcing member 20 can be soldered to the circuit board 11 by reflow soldering, for example, solder paste is brushed on the surface of the circuit board 11, and the reinforcing member 20 is placed After the solder paste is printed, the corresponding pad positions on the circuit board 11 are passed through a high-temperature reflow oven, and the solder paste that has melted and solidified finally solders the reinforcing member 20 to the circuit board 11. It can be understood that the soldering method of the reinforcing member 20 includes but is not limited to reflow soldering, and other soldering methods such as dip soldering can also be used.

In this scene, the bridge portion 21 is a stepped three-dimensional design. By providing different overhead heights, the non-protruding bridge portion 21 can be used to avoid surface wiring 13, and the height of the stepped portion on the upper floor is 0～0.2mm higher than the connection port 14, which can prevent the external plug-in lead 15 from being buckled. Risk of scratching the flexible circuit board 30.

In addition, the non-protruding bridge portion 21 is only used to avoid the surface wiring 13, and its height can be controlled below 0.2 mm, thus further saving the longitudinal space of the circuit board.

In the embodiment of the present application, the above-mentioned three solutions of the protrusion, the step portion 33, and the bridging portion 21 as a whole form the stop portion, which can be arranged and combined arbitrarily, that is, on one circuit board 11, there are multiple reinforcements In the case where 20 is located between the connection port 14 and the flexible circuit board 30, the stop structures 31 at various locations can be implemented by randomly selecting different solutions, or all of them can be implemented by selecting the same solution. The flexible circuit board 30 may also be other components that are prone to damage when impacted by external forces and falling.

Scene three

In the embodiment of the present application, as shown in FIGS. 21 to 23, the circuit board assembly 10 may include a circuit board 11 and a reinforcing member 20. The surface of the circuit board 11 is provided with surface wiring, and the reinforcing member 20 is used to supplement the circuit board 11. Strong, the reinforcing member 20 includes a bridge 21 and a plurality of bonding parts 22, the bonding part 22 is bonded to the surface of the circuit board 11, the two ends of the bridge 21 are respectively connected to two adjacent bonding parts 22 and The bridge portion 21 is suspended on the circuit board 11, and a gap for the surface wiring to pass through is formed between the bridge portion 21 and the circuit board 11.

In a possible implementation manner, the bonding portion 22 is provided with a fitting portion 50 protruding toward the surface of the circuit board 11, and the surface of the circuit board 11 is provided with a recess 19 corresponding to the fitting portion 50, and the fitting portion The outer contour of 50 and the inner contour of the recessed portion 19 may match, so that the fitting portion 50 can be locked into the recessed portion 19.

With this arrangement, the fitting portion 50 provided on the bonding portion 22 can be fitted into the recess 19 on the circuit board 11. If the fitting portion 50 is welded into the recess 19 on this basis, the two can be more The coordination of the two functions as an anchor, which can enhance the reliability of the connection between the reinforcing member 20 and the circuit board 11, so that the two are not easily separated.

In the embodiment of the present application, the depth of the recessed portion 19 may correspond to the height of the surface copper layer of the circuit board 11, or may be deeper, or even may be a through groove. Exemplarily, a pad may be provided in the recess 19 so that the mating part 50 and the recess 19 are welded together, or a pad may not be provided in the recess 19, so that the mating part 50 is directly embedded in the recess 19 19 in.

In the embodiment of the present application, due to the cooperation of the recessed portion 19 and the fitting portion 50, the circuit board and the corresponding position of the two are recessed downward, so that there is an extra space above the circuit board for accommodating components Therefore, the Z-direction space requirements of other structural parts at the location can be met without affecting the reinforcement effect.

In the embodiment of the present application, for the connection mode of the reinforcing member 20 and the circuit board 11, the reinforcing member 20 can be soldered to the circuit board 11 by reflow soldering, for example, brushing on the surface of the circuit board 11 and in the recess 19 Solder paste, and place the reinforcing member 20 on the corresponding pad position on the circuit board 11 where the solder paste is printed, and then pass it through a high temperature reflow oven, and the solidified solder paste after melting will finally solder the reinforcing member 20 to the circuit board 11 on. It can be understood that the soldering method of the reinforcing member 20 includes but is not limited to reflow soldering, and other soldering methods such as dip soldering can also be used.

In the embodiment of the present application, as shown in FIG. 22, the circuit board 11 is provided with three bonding portions 22 and two bridging portions 21, and the three bonding portions 22 may be a first bonding portion 221, a second bonding portion 221, and a second bonding portion 22. The bonding portion 222, the third bonding portion 223, the bridge portion 21 may be the first bridge portion 211 and the second bridge portion 212, and the two ends of the first bridge portion 211 are respectively connected to the first bonding portion 221, the second bonding portion 222, the two ends of the second bridge portion 212 are respectively connected to the second bonding portion 222 and the third bonding portion 223, in this way, the first bridge portion 211 and the circuit Surface wiring (not shown) may be provided between the surfaces of the board 11, and surface wiring may be provided between the second bridge portion 212 and the surface of the circuit board 11. Of course, it can be understood that the illustrations in this application all illustrate the case of a single-sided circuit board. For the case of a double-sided circuit board and a multi-sided circuit board, the connection surfaces of each device of the corresponding circuit board can be respectively The reinforcement 20 in this application is provided.

In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection or Indirect connection through an intermediate medium can be the internal communication between two elements or the interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the embodiments of the present application can be understood according to specific circumstances.

The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and It does not have to be used to describe a specific order or sequence.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, not to limit them; although the embodiments of the present application are described in detail with reference to the foregoing embodiments, those of ordinary skill in the art It should be understood that it is still possible to modify the technical solutions described in the foregoing embodiments, or equivalently replace some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the embodiments of this application. The scope of the technical solution of each embodiment.

Claims

A circuit board assembly applied to electronic equipment, characterized in that it comprises a circuit board and a reinforcing member, the surface of the circuit board is provided with surface wiring, and the reinforcing member is used to reinforce the circuit board, The reinforcing member includes a bridge part and a plurality of bonding parts, the bonding part is bonded to the surface of the circuit board, and both ends of the bridge part are respectively connected to two adjacent bonding parts The bridge portion is suspended on the circuit board, and a gap for the surface wiring to pass through is formed between the bridge portion and the circuit board.
The circuit board assembly according to claim 1, further comprising a flexible circuit board, the flexible circuit board is connected to the circuit board, the circuit board is further provided with a connection port, the connection port It is used to connect with an external plug-in lead. The reinforcing member is provided between the connection port and the flexible circuit board. The reinforcing member includes a stop structure, and the height of the stop structure is greater than the height of the stop structure. The height of the connection port.
The circuit board assembly according to claim 2, wherein the bridge portion is provided between the connection port and the flexible circuit board, and the bridge portion is formed as the stop structure.
The circuit board assembly according to claim 2, wherein the bridge portion is provided between the connection port and the flexible circuit board, and a local area of the bridge portion protrudes to form the stop unit.
The circuit board assembly according to claim 2, wherein the bonding part is provided between the connection port and the flexible circuit board, and a protruding part is connected to the bonding part, the The protruding part is formed as the stop structure.
The circuit board assembly according to any one of claims 2-5, wherein the connection port is a coaxial cable connection base or a board-to-board connector port.
7. The circuit board assembly according to any one of claims 1 to 6, further comprising a wire management clip, and the wire management clip is connected to the attaching part.
The circuit board assembly according to any one of claims 1-7, wherein the bonding portion is provided with a fitting portion protruding toward the surface of the circuit board, and the surface of the circuit board is Correspondingly, a recessed portion is provided in the portion, and the fitting portion can be inserted into the recessed portion.
8. The circuit board assembly according to any one of claims 1-8, wherein the connecting portion of the bridge portion and the bonding portion has a chamfered structure.
8. The circuit board assembly according to any one of claims 1-8, wherein the bridge portion and the bonding portion are integrally formed.
The circuit board assembly according to any one of claims 1-8, wherein the circuit board is a printed circuit board (PCB) or a flexible printed circuit board (FPC).
8. The circuit board assembly according to any one of claims 1-8, wherein a plurality of bridge portions spaced apart from each other are connected between two adjacent bonding portions.
An electronic device, comprising at least a display screen, a middle frame, a back cover, and the circuit board assembly according to any one of claims 1-12, the display screen and the back cover are located in the middle frame respectively On both sides of the, the circuit board assembly is located in the cavity enclosed by the display screen and the middle frame, or,

The circuit board assembly is located in a cavity enclosed by the back cover and the middle frame.