CN105704271A - Mobile terminal - Google Patents
Mobile terminal Download PDFInfo
- Publication number
- CN105704271A CN105704271A CN201610179103.8A CN201610179103A CN105704271A CN 105704271 A CN105704271 A CN 105704271A CN 201610179103 A CN201610179103 A CN 201610179103A CN 105704271 A CN105704271 A CN 105704271A
- Authority
- CN
- China
- Prior art keywords
- hardboard
- mobile terminal
- earphone base
- conductor
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
Abstract
The invention discloses a mobile terminal which comprises a hard board with circuit wiring, and an earphone seat. The hard board is provided with a matching hole. The inside wall of the matching hole is provided with conductive members. The conductive members are electrically connected with the circuit wiring. The earphone seat is arranged in the matching hole. The outer circumferential wall of the earphone seat is provided with pins. The pins are rigid members and contact with and are connected with the conductive members. According to the mobile terminal of the invention, the dimension of the matching hole can be reduced, thereby saving surface space of the hard board, facilitating high-density device layout and high-density PCB design realization on the hard board. Furthermore, through connecting the pins on the earphone seat with a conductive board on the hard board in a contacting and conductive manner, product assembling is facilitated and SMT cost of the earphone seat is prevented.
Description
Technical field
The present invention relates to electronics field, especially relate to a kind of mobile terminal。
Background technology
Along with developing rapidly of smart electronics product, some portable electronic products progressively turn to lightening, high density structures layout designs development, and the stability of electronic product performance and the requirement of reliability is also more and more higher。
Disclosed in correlation technique, mobile phone products does thinner and thinner, and in mobile phone, the device layout density on pcb board is also increasing。Earphone stand device is the ingredient that mobile phone is important, and the interconnection mode between earphone base and pcb board is limited, and attachment structure relatively conventional at present is welding type and shrapnel contact。If any earphone base be welded on the surface of pcb board by the surface-pasted technique of SMT, the pin of some earphone bases to be welded to connect in the way of jack on pcb board, also have some earphone bases pin be formed as shell fragment。The earphone base that above-mentioned welding manner connects, processing cost is higher, and the earphone base of shrapnel contact can take the space that pcb board surface is too much, is unfavorable for the high-density device layout of Mobile phone PCB, affects the feasibility that High density of PCB design realizes。
Summary of the invention
The application is intended to the technical problem solving exist in prior art。For this, it is desirable to provide a kind of mobile terminal, this mobile terminal processing cost is relatively low, and is beneficial to the high-density device layout of inside。
Mobile terminal according to embodiments of the present invention, including: having the hardboard of circuit trace, described hardboard is provided with mating holes, and the medial wall of described mating holes is provided with electric-conductor, and described electric-conductor electrically connects with described circuit trace；Earphone base, described earphone base is located in described mating holes, and the periphery wall of described earphone base is provided with pin, and described pin is rigid member, and described pin contacts connection with described electric-conductor。
Mobile terminal according to embodiments of the present invention, by being contained in earphone base at least partially in the mating holes on hardboard, and the pin of hardboard is rigid member, the size of mating holes can reduce, save hardboard space surface, be beneficial on hardboard high-density device layout and the realization of High density of PCB design。It addition, by pin on earphone base is connected with way of contact conducting with conductive plate on hardboard, is conducive to Product Assembly, eliminates the SMT cost of earphone base。
Specifically, described pin is formed as lamellar, and described electric-conductor is also lamellar。So, not only make the frictional force that earphone base needs when hardboard moves relatively big, earphone base can be avoided to depart from hardboard, moreover it is possible to ensure the conducting quality between earphone base and hard seat, it is to avoid signal open circuit when earphone base is crooked。
More specifically, described pin and described electric-conductor are square。Thus, be conducive to making full use of the area of the medial wall of mating holes。
Alternatively, described electric-conductor is copper gold coated article。Thus, guide can have significantly high chemical stability, and ductility is good, high temperature resistant, has relatively low contact resistance, and electric conductivity is good。
In certain embodiments, described electric-conductor is welded to connect on described hardboard。Thus, structure is reliable, electric-conductor difficult drop-off。
Specifically, the surface being provided with described pin of described earphone base is formed as plane。Thus, improve the smoothness coordinated between earphone base with hardboard。
More specifically, described mating holes through described hardboard on the thickness direction of described hardboard。
Further, described mating holes is through described hardboard on the direction towards a side of described hardboard, and the earpiece holes of described earphone base is located on the side outwardly of described earphone base。
In a specific embodiment, the relative inner wall of described mating holes being respectively equipped with multiple described electric-conductor, described earphone base is provided with multiple described pins one to one。
In certain embodiments, described mobile terminal is mobile phone。
The additional aspect of the present invention and advantage will part provide in the following description, and part will become apparent from the description below, or is recognized by the practice of the present invention。
Accompanying drawing explanation
Above-mentioned and/or the additional aspect of the present invention and advantage are from conjunction with will be apparent from easy to understand the accompanying drawings below description to embodiment, wherein:
Fig. 1 is the decomposition texture schematic diagram of hardboard according to embodiments of the present invention and earphone base；
Fig. 2 is the assembling structural representation of hardboard according to embodiments of the present invention and earphone base。
Accompanying drawing labelling:
Mobile terminal 100,
Hardboard 1, mating holes 10, electric-conductor 11,
Earphone base 2, earpiece holes 20, pin 21, plane S。
Detailed description of the invention
Being described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of same or like function from start to finish。The embodiment described below with reference to accompanying drawing is illustrative of, it is intended to is used for explaining the present invention, and is not considered as limiting the invention。
Describing mobile terminal 100 according to embodiments of the present invention referring to Fig. 1-Fig. 2, mobile terminal 100 can be mobile phone, and mobile terminal 100 can be also palm PC, notebook computer etc., is not especially limited here。
Mobile terminal 100 according to embodiments of the present invention, as depicted in figs. 1 and 2, including: hardboard 1 and earphone base 2, hardboard 1 has circuit trace (not shown go out), hardboard 1 is provided with mating holes 10, and the medial wall of mating holes 10 is provided with electric-conductor 11, and electric-conductor 11 electrically connects with circuit trace。Earphone base 2 is located in mating holes 10, and the periphery wall of earphone base 2 is provided with pin 21, and pin 21 is rigid member, and pin 21 contacts connection with electric-conductor 11。
It is to say, after earphone base 2 is directly fitted in the mating holes 10 on hardboard 1, the pin 21 on earphone base 2 contacts with the electric-conductor 11 on hardboard 1, thus earphone base 2 electrically connects with the circuit trace on hardboard 1, form conducting interconnection。So, when earphone inserts the earpiece holes 20 on earphone base 2, the information flow between earphone and hardboard 1 can be completed。
It should be noted that circuit board conventional in electronic product includes printed circuit board (PCB) and FPC, printed circuit board (PCB) (PrintedCircuitBoard is called for short pcb board) may be generally referred to as hardboard。Hardboard has certain thickness and intensity, it is possible to installs electronic component and bears certain mechanical force。
Using hardboard 1 mounting ear support 2 in embodiments of the present invention, after mobile terminal 100 is impacted, hardboard 1 is unlikely to deform, it is possible to ensure that earphone base 2 is not easily disconnected from hardboard 1。
Wherein, hardboard 1 arranges mating holes 10, being contained at least partially in mating holes 10 of earphone base 2, reduce taking up room of hardboard 1 and earphone base 2, hardboard 1 space surface can be saved, be beneficial on hardboard 1 high-density device layout and the realization of High density of PCB design。
The pin 21 of earphone base 2 is with the electric-conductor 11 on hardboard 1 for contacting connection, and earphone base 2 need not be welded on the surface of hardboard 1 by SMT, it is not required that being plugged on hardboard 1 by the pin 21 on earphone base 2, assembly cost is low and efficiency of assembling is high。It addition, pin 21 is arranged to rigid member, the thickness needed for pin 21 is less, the space that pin 21 takies reduces, on hardboard 1, the size of mating holes 10 is too much without doing, and so also can save hardboard 1 space surface, is beneficial on hardboard 1 high-density device layout and the realization of High density of PCB design。
Mobile terminal 100 according to embodiments of the present invention, by by the mating holes 10 being contained at least partially on hardboard 1 of earphone base 2, and the pin 21 of hardboard 1 is rigid member, the size of mating holes 10 can reduce, save hardboard 1 space surface, be beneficial on hardboard 1 high-density device layout and the realization of High density of PCB design。It addition, by pin 21 on earphone base 2 is connected with way of contact conducting with conductive plate on hardboard 1, is conducive to Product Assembly, eliminates the SMT cost of earphone base 2。
In order to meet the demand in market, in the present embodiment, hardboard 1 can adopt single sided board, dual platen or multi-layer sheet。And the diameter of the earpiece holes 20 of earphone base 2 can be selected for 3.5mm or 2.5mm, certainly, designer selects other argument structures also dependent on actual circuit design demand。
In certain embodiments, as it is shown in figure 1, pin 21 is formed as lamellar, the thickness of pin 21 is less, and so, the space that pin 21 takies is little。Meanwhile, electric-conductor 11 is also lamellar, and the contact area between pin 21 and the electric-conductor 11 of lamellar of lamellar is bigger。So, not only make the frictional force that earphone base 2 needs when hardboard 1 moves relatively big, earphone base 2 can be avoided to depart from hardboard 1, moreover it is possible to ensure the conducting quality between earphone base 2 and hard seat, it is to avoid signal open circuit when earphone base 2 is crooked。
Specifically, pin 21 is square, such pin 21 handling ease。And owing to the thickness of hardboard 1 is substantially constant, the medial wall of mating holes 10 generally rectangle, therefore pin 21 is the square area being conducive to making full use of the medial wall of mating holes 10。
Specifically, electric-conductor 11 is also square, so, electric-conductor 11 handling ease, be conducive to making full use of the area of the medial wall of mating holes 10。
Certainly, pin 21 and the form of electric-conductor 11 can as requested different, there is different sizes and shape, for instance, pin 21 and electric-conductor 11 can be octagonal or circle etc., can be also water-drop-shaped or other profiled shape。
Alternatively, on the thickness direction of hardboard 1, the thickness being sized larger than hardboard 1 of electric-conductor 11, so can avoid the phenomenon of electric-conductor 11 and pin 21 loose contact, thus ensureing the conducting quality of electric-conductor 11 and pin 21 as far as possible。
Alternatively, on the thickness direction of hardboard 1, the thickness being sized larger than hardboard 1 of pin 1, thus also ensureing the conducting quality of electric-conductor 11 and pin 21。
In certain embodiments, electric-conductor 11 is copper gold coated article。So, guide 11 can have significantly high chemical stability, and owing to Gold plated Layer ductility is good, high temperature resistant, there is relatively low contact resistance, electric conductivity is good, it is easy to welding etc., and therefore electric-conductor 11 is best in quality。
In certain embodiments, electric-conductor 11 is welded to connect on hardboard 1, for instance electric-conductor 11 can be the solder joint formed on hardboard 1, wherein, being equivalent to make use of on hardboard 1 and form electric-conductor 11 for the connection medium welded, structure is reliable, electric-conductor 11 difficult drop-off。
In a specific embodiment, as depicted in figs. 1 and 2, the relative inner wall of mating holes 10 being respectively equipped with multiple electric-conductor 11, earphone base 2 is provided with multiple pins 21 one to one, and multiple electric-conductors 11 one_to_one corresponding in opposing sidewalls arranges formation symmetrical structure。
Alternatively, earphone base 2 also can and the medial wall of mating holes 10 between adhesive layer is set, for instance not setting electric-conductor 11 place, the medial wall of mating holes 10 can be provided with double faced adhesive tape, thus improving the connection reliability of earphone base 2 and hardboard 1。
Specifically, the surface being provided with pin 21 of earphone base 2 is formed as plane S, and for ensureing pin 21 and the abundant abutting contact of electric-conductor 11, this plane S is substantially paralleled with the respective inside wall of mating holes 10。The surface being provided with pin 21 of earphone base 2 is formed as plane S, and after mobile terminal 100 is impacted, if crooked situation occurs in earphone base 2, this plane S can only be against on the medial wall of mating holes 10, improves the smoothness coordinated between earphone base 2 with hardboard 1。
More specifically, mating holes 10 through hardboard 1 on the thickness direction of hardboard 1, so, more take full advantage of the volume of hardboard 1, and earphone base 2 can be symmetrically set in mating holes 10 on the thickness direction of hardboard 1, improve the earphone base 2 stationarity on hardboard 1。
Further, mating holes 10 is through hardboard 1 on the direction towards a side of hardboard 1, and the earpiece holes 20 of earphone base 2 is located on the side outwardly of earphone base 2。Here, refer to earpiece holes 20 outwardly and be positioned at the side that mating holes 10 opens wide, inward-pointing be and opposite direction outwardly。So, when earphone is inwardly inserted into earpiece holes 20, earphone base 2 pressure experienced can be born in the medial wall of the corresponding open ports of mating holes 10, it is to avoid earphone base 2 departs from mating holes 10。
In a concrete example, mobile terminal 100 is mobile phone, and hardboard 1 is cell phone mainboard。By arranging unlimited mating holes 10 at the side of mainboard, mating holes 10 medial wall forms the dew gold-plated solder joint of copper。When assembling, the pin 21 on earphone base 2 contacts with the gold-plated solder joint of mainboard, forms conducting interconnection。Earphone base 2 need not be welded on mainboard by SMT, can save mainboard space surface, is conducive to the high-density device layout of cell phone mainboard and the realization of High density of PCB design。
In describing the invention, it will be appreciated that, term " " center ", " thickness ", " interior ", " outward " etc. instruction orientation or position relationship be based on orientation shown in the drawings or position relationship; be for only for ease of description the present invention and simplify describe; rather than instruction or imply indication device or element must have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention。In describing the invention, except as otherwise noted, " multiple " are meant that two or more。
In describing the invention, unless otherwise clearly defined and limited, term " being connected ", " connection ", " fixing " should be interpreted broadly, for instance, it is possible to it is fixing connection, it is also possible to be removably connect, or integral；Can be mechanically connected, it is also possible to be electrical connection；Can be joined directly together, it is also possible to be indirectly connected to by intermediary, it is possible to be connection or the interaction relationship of two elements of two element internals。For the ordinary skill in the art, it is possible to concrete condition understands above-mentioned term concrete meaning in the present invention。
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " example " etc. means in conjunction with this embodiment or example describe are contained at least one embodiment or the example of the present invention。In this manual, the schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example。And, the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example。
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: these embodiments can being carried out multiple change, amendment, replacement and modification when without departing from principles of the invention and objective, the scope of the present invention is limited by claim and equivalent thereof。
Claims (10)
1. a mobile terminal, it is characterised in that including:
Having the hardboard of circuit trace, described hardboard is provided with mating holes, and the medial wall of described mating holes is provided with electric-conductor, and described electric-conductor electrically connects with described circuit trace；
Earphone base, described earphone base is located in described mating holes, and the periphery wall of described earphone base is provided with pin, and described pin is rigid member, and described pin contacts connection with described electric-conductor。
2. mobile terminal according to claim 1, it is characterised in that described pin is formed as lamellar, described electric-conductor is also lamellar。
3. mobile terminal according to claim 1, it is characterised in that described pin and described electric-conductor are square。
4. mobile terminal according to claim 1, it is characterised in that described electric-conductor is copper gold coated article。
5. mobile terminal according to claim 1, it is characterised in that described electric-conductor is welded to connect on described hardboard。
6. mobile terminal according to claim 1, it is characterised in that the surface being provided with described pin of described earphone base is formed as plane。
7. mobile terminal according to claim 1, it is characterised in that described mating holes is through described hardboard on the thickness direction of described hardboard。
8. mobile terminal according to claim 1, it is characterised in that described mating holes is through described hardboard on the direction towards a side of described hardboard, and the earpiece holes of described earphone base is located on the side outwardly of described earphone base。
9. the mobile terminal according to any one of claim 1-8, it is characterised in that be respectively equipped with multiple described electric-conductor on the relative inner wall of described mating holes, described earphone base is provided with multiple described pins one to one。
10. mobile terminal according to claim 1, it is characterised in that described mobile terminal is mobile phone。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610179103.8A CN105704271A (en) | 2016-03-24 | 2016-03-24 | Mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610179103.8A CN105704271A (en) | 2016-03-24 | 2016-03-24 | Mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105704271A true CN105704271A (en) | 2016-06-22 |
Family
ID=56232813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610179103.8A Pending CN105704271A (en) | 2016-03-24 | 2016-03-24 | Mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105704271A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410454A (en) * | 2016-11-02 | 2017-02-15 | 广东虹勤通讯技术有限公司 | PCB and mobile terminal including the same |
| CN106954112A (en) * | 2017-03-28 | 2017-07-14 | 上海与德科技有限公司 | Terminal device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050115771A (en) * | 2004-06-05 | 2005-12-08 | 엘지전자 주식회사 | Uim/sim card connect device for mobile phone |
| CN201336478Y (en) * | 2008-11-07 | 2009-10-28 | 浙江春生电子有限公司 | Earphone socket |
| CN102324629A (en) * | 2011-08-31 | 2012-01-18 | 惠州Tcl移动通信有限公司 | Cell phone, earphone socket, and welding and fixing structure thereof |
| CN104134907A (en) * | 2014-06-27 | 2014-11-05 | 小米科技有限责任公司 | Earphone socket component and electronic equipment |
| CN204031388U (en) * | 2014-08-08 | 2014-12-17 | 希姆通信息技术（上海）有限公司 | The syndeton of earphone base and mainboard |
-
2016
- 2016-03-24 CN CN201610179103.8A patent/CN105704271A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050115771A (en) * | 2004-06-05 | 2005-12-08 | 엘지전자 주식회사 | Uim/sim card connect device for mobile phone |
| CN201336478Y (en) * | 2008-11-07 | 2009-10-28 | 浙江春生电子有限公司 | Earphone socket |
| CN102324629A (en) * | 2011-08-31 | 2012-01-18 | 惠州Tcl移动通信有限公司 | Cell phone, earphone socket, and welding and fixing structure thereof |
| CN104134907A (en) * | 2014-06-27 | 2014-11-05 | 小米科技有限责任公司 | Earphone socket component and electronic equipment |
| CN204031388U (en) * | 2014-08-08 | 2014-12-17 | 希姆通信息技术（上海）有限公司 | The syndeton of earphone base and mainboard |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410454A (en) * | 2016-11-02 | 2017-02-15 | 广东虹勤通讯技术有限公司 | PCB and mobile terminal including the same |
| CN106954112A (en) * | 2017-03-28 | 2017-07-14 | 上海与德科技有限公司 | Terminal device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160622 |