CN212115762U - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
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- CN212115762U CN212115762U CN201922051301.8U CN201922051301U CN212115762U CN 212115762 U CN212115762 U CN 212115762U CN 201922051301 U CN201922051301 U CN 201922051301U CN 212115762 U CN212115762 U CN 212115762U
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- circuit board
- reinforcement
- board assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The embodiment of the application provides a circuit board assembly and electronic equipment, electronic equipment can include the cell-phone, the panel computer, the notebook computer, super mobile personal computer (UMPC), handheld computer, the intercom, the netbook, the POS machine, Personal Digital Assistant (PDA), the vehicle event data recorder, removal or fixed terminal such as virtual reality equipment, through set up bridging portion between two adjacent laminating portions at the reinforcement, and form the clearance that supplies the top layer wiring to pass between bridging portion and the circuit board, circuit board top layer wiring can follow bridging portion below and pass like this, can not take place to interfere with the reinforcement. When the circuit board receives mechanical external force such as falling or bending, because laminating portion and the bridging portion of reinforcement still are a whole, avoided the sectional type reinforcement to have the drawback in reinforcement weak area, consequently reinforcement intensity is higher, can reduce the fracture risk of circuit board.
Description
Technical Field
The application relates to the technical field of terminals, in particular to a circuit board assembly and an electronic device.
Background
The circuit board is an important electronic component in electronic equipment, is a support body of an electronic component in the electronic equipment, and is also a carrier for electrical connection of the electronic component. With the trend of precision of electronic equipment, in order to ensure the rigidity of the circuit board and reduce the risk of fracture of the circuit board in the scenes of impact, falling and the like, a reinforcement design needs to be performed on the circuit board.
At present, the design of circuit board reinforcement is generally to weld a reinforcing steel sheet directly on the surface of the circuit board, and the reinforcing steel sheet is generally made of stainless steel. For example, referring to fig. 1, a reinforcing design is performed for a slender area of a slender circuit board, the reinforcing steel sheet needs to be reinforced along a long side of the circuit board 70, on the circuit board 70, a radio frequency functional area 71 is located at a left side position of the circuit board 70, a coaxial line seat 73 is located at a substantially middle position, wherein a coaxial line 72 is used for leading out a radio frequency signal, and an end of the coaxial line 72 is plugged on the coaxial line seat 73. In order to ensure the rf performance, the surface rf functional area 71 must be led out to the position of the coaxial line seat 73 through the surface layer trace 74, and in order to prevent the reinforcing steel sheet from interfering and overlapping the surface layer trace 74 and causing the failure of wire outgoing, a segmented reinforcing manner may be adopted, for example, the reinforcing steel sheet includes a first reinforcing steel sheet 75 and a second reinforcing steel sheet 76 spaced apart from each other, and the spaced position between the first reinforcing steel sheet 75 and the second reinforcing steel sheet 76 may be used to set the surface layer trace 74.
However, as described above, the circuit board is reinforced by using the sectional reinforcement method, and only each local region can be reinforced, and the whole circuit board cannot be reinforced as a whole, so that the reinforcing strength is poor, and the risk of breaking the circuit board is increased.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a circuit board assembly and electronic equipment, through set up bridging portion between two adjacent laminating portions at the reinforcement, and form the clearance that supplies top layer wiring to pass between bridging portion and the circuit board, top layer wiring can follow bridging portion below and pass like this, can not take place to interfere with the reinforcement. On the other hand, when the circuit board is subjected to mechanical external forces such as falling or bending, the joint part and the bridge part of the reinforcing part are still integrated, so that the defect that the sectional type reinforcing part has a reinforcing weak area is avoided, the reinforcing strength is higher, and the fracture risk of the circuit board can be reduced.
The first aspect of the embodiment of the application provides a circuit board assembly, be applied to in the electronic equipment, including circuit board and reinforcement, the circuit board surface is equipped with the top layer wiring, and the reinforcement is used for carrying out the reinforcement to the circuit board, and the reinforcement includes bridge portion and a plurality of laminating portion, and the laminating of laminating portion is on the circuit board surface, and bridge portion's both ends link to each other and bridge portion unsettled setting on the circuit board with two adjacent laminating portions respectively, form the clearance that supplies the top layer wiring to pass between bridge portion and the circuit board.
Through set up bridging portion between two adjacent laminating portions, and form the clearance that supplies top layer wiring to pass between bridging portion and the circuit board, different with laminating portion attached on the circuit board surface, bridging portion is raised from the circuit board surface and is predetermine the distance, and top layer wiring can be followed bridging portion below and passed like this, though takes place the overlap with the reinforcement, nevertheless can not interfere each other. On the other hand, when the circuit board is subjected to mechanical external forces such as falling or bending, the attaching part and the bridging part of the reinforcing part are still integrated, so that the defect of a reinforcing weak area of the sectional type reinforcing part is avoided, the reinforcing strength is higher, and the fracture risk of the circuit board can be reduced.
In a possible implementation mode, the flexible printed circuit board is further included, the flexible printed circuit board is connected with the circuit board, a connection port is further arranged on the circuit board, the connection port is used for being connected with an external plug lead, a reinforcing piece is arranged between the connection port and the flexible printed circuit board, the reinforcing piece comprises a stopping structure, and the height of the stopping structure is larger than that of the connection port.
Through being equipped with the reinforcement between connection port and flexible circuit board, set up backstop structure on the reinforcement, backstop structure can keep off to establish between connection port and flexible circuit board like this, when the operator pegs graft outside lead wire tip on connection port, even when leading wire tip to the side when sliding because the misoperation, also can be because the height that highly is greater than connection port of backstop structure, backstop portion can block the further slip of lead wire tip, prevent its fish tail flexible circuit board, cause the malfunction.
In one possible implementation, a bridge is provided between the connection port and the flexible circuit board, the bridge being formed as a stop structure.
Under the condition that the bridge part is positioned between the connecting port and the flexible circuit board, the stop structure is directly formed by the whole bridge part, and the height of the bridge part is greater than that of the connecting port, so that the bridge part can be used as a reinforcing part and also used as the stop structure, and the structure of the reinforcing part can be simpler.
In one possible implementation, a bridge is provided between the connection port and the flexible circuit board, and a local area of the bridge protrudes to form a stop structure.
When the bridge part is positioned between the connecting port and the flexible circuit board, the stopping structure is formed by directly protruding a local area of the bridge part, for example, the bridge part is formed into a step structure, and the height of the protruding part is greater than that of the connecting port, so that the bridge part is used as a reinforcing piece and also used as the stopping structure, and the structure of the reinforcing piece can be simpler.
In one possible implementation, a fitting portion is provided between the connection port and the flexible circuit board, and a protruding portion is connected to the fitting portion and forms a stopper structure.
Under the condition that the attaching part is positioned between the connecting port and the flexible circuit board, the protruding part is directly connected on the attaching part to form a stop structure, and the height of the protruding part is greater than that of the connecting port, so that the attaching part can be used as a reinforcing piece and also used as the stop structure, and the structure of the reinforcing piece can be simpler.
In one possible implementation, the connection port is a coaxial jack socket, or a board-to-board connector port.
The type of connection port may be set according to the actual needs of the circuit board.
In a possible implementation mode, the wire arranging clamp is further included, and the wire arranging clamp is connected to the attaching portion.
The wire arranging clamp is arranged on the attaching part, so that the lead wires such as the coaxial wire can be accommodated conveniently.
In one possible implementation manner, the attaching portion is provided with a fitting portion extending toward the circuit board surface, the circuit board surface is provided with a recessed portion corresponding to the fitting portion, and the fitting portion can be clamped into the recessed portion.
The embedding part arranged on the attaching part can be embedded into the concave part on the circuit board to play a role of anchoring, so that the connection reliability of the reinforcing part and the circuit board can be enhanced, and the reinforcing part and the circuit board are not easy to separate.
In one possible implementation, the connecting portion of the bridge portion and the fitting portion has a chamfered structure.
Preventing damage to the operator or other components, such as the lead wires.
In one possible implementation, the bridge portion and the abutment portion are integrally formed.
Therefore, the strength of the whole reinforcing piece is higher, and the reinforcing effect on the circuit board is better.
In one possible implementation, the circuit board is a printed circuit board PCB, or a flexible printed circuit board FPC.
The scheme is suitable for reinforcing the rigid circuit board and the flexible circuit board at the same time.
In a possible implementation manner, a plurality of bridge parts spaced from each other are connected between two adjacent attaching parts.
When the bonded portions are relatively large in size, it is conceivable that a plurality of bridge portions are connected to a pair of adjacent bonded portions.
A second aspect of the embodiments of the present application provides an electronic device, which at least includes a display screen, a middle frame, a rear cover, and the circuit board assembly, where the display screen and the rear cover are respectively located at two sides of the middle frame, and the circuit board assembly is located in a cavity surrounded by the display screen and the middle frame, or the circuit board assembly is located in a cavity surrounded by the rear cover and the middle frame.
Through set up bridging portion between two adjacent laminating portions, and form the clearance that supplies the top layer wiring to pass between bridging portion and the circuit board, top layer wiring can pass from bridging portion below like this, can not take place to interfere with the reinforcement. On the other hand, when the circuit board in the electronic equipment is subjected to mechanical external force such as falling or bending, the attaching part and the bridging part of the reinforcing part are still integrated, so that the defect that the sectional type reinforcing part has a reinforcing weak area is avoided, the reinforcing strength is higher, the fracture risk of the circuit board can be reduced, and the reliability of the electronic equipment is higher.
Drawings
FIG. 1 is a schematic diagram of a reinforcement design structure of a circuit board in the prior art;
fig. 2 is a schematic perspective view of an electronic device according to an embodiment of the present disclosure
Fig. 3 is an exploded schematic view of an electronic device according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram illustrating a circuit board assembly of an electronic device mounted on a middle frame according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the present disclosure;
fig. 8 is a schematic diagram of a simulation model of pressing in a circuit board assembly of an electronic device according to an embodiment of the present application;
fig. 9 is a schematic diagram illustrating a top surface stress distribution of a circuit board assembly of an electronic device in a pressing simulation according to an embodiment of the present application;
fig. 10 is a schematic diagram illustrating a bottom stress distribution of a circuit board assembly of an electronic device in a press simulation according to an embodiment of the present application;
FIG. 11 is a schematic diagram illustrating top surface stress distribution in a press simulation of a circuit board with segmented reinforcement according to the prior art;
FIG. 12 is a schematic diagram of the bottom stress distribution of a circuit board with segmented reinforcement in press simulation according to the prior art;
fig. 13 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the present application;
fig. 14 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the present application;
fig. 15 is a schematic diagram illustrating a back side structure of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the present application;
fig. 16 is a schematic diagram illustrating a back side structure of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the present disclosure;
fig. 17 is a schematic structural diagram of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the present application;
fig. 18 is a left side view of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the present application;
FIG. 19 is a front view of FIG. 18;
FIG. 20 is a top view of FIG. 18;
fig. 21 is a left side view of a circuit board in a circuit board assembly of an electronic device according to an embodiment of the present application;
FIG. 22 is a front view of FIG. 21;
fig. 23 is a top view of fig. 21.
Description of reference numerals:
100-mobile phone; 10-a circuit board assembly; 11. 70-a circuit board; 12-a first functional area; 13-surface layer wiring; 14-a connection port; 15-external plug lead; 16-arranging the wire clamp; 17-a screw; 18-a stationary shaft; 19-a recess; 20-a reinforcement; 21-a bridge; 22-a bonding portion; 30-a flexible circuit board; 31-a stop structure; 32-a projection; 33-a step portion; 50-a chimeric portion; 71-radio frequency functional area; 72-coaxial line; 73-coaxial line seat; 74-surface layer routing; 75-a first reinforcing steel sheet; 76-a second reinforcing steel sheet; 81-display screen; 82-a rear cover; 83-middle frame; 85-a battery; 86-a sound producing device; 87-metal middle plate; 88-top border; 89-bottom border; 90-left border; 91-right frame; 221-a first attachment; 222-a second attachment portion; 223-third fitting part; 211-a first bridge; 212-a second bridge; 311-spring plate; 312-an avoidance portion; 313-flanging part.
Detailed Description
The terminology used in the description of the embodiments of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the application, as the embodiments of the present application will be described in detail below with reference to the accompanying drawings.
The embodiment of the present application provides an electronic device, which includes, but is not limited to, a mobile or fixed terminal having a circuit board, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, an intercom, a netbook, a POS machine, a Personal Digital Assistant (PDA), a car recorder, a wearable device, or a virtual reality device.
In this embodiment, taking the mobile phone 100 as the above-mentioned electronic device for example, fig. 2 and fig. 3 respectively show an overall structure and a splitting structure of the mobile phone 100, and as shown in fig. 3, the mobile phone 100 may include: a display 81 and a rear cover 82, and a center frame 83, a circuit board assembly 10, a battery 85 and a sound producing device 86 may be disposed between the display 81 and the rear cover 82. The circuit board assembly 10, the battery 85 and the sound producing device 86 may be disposed on the middle frame 83, for example, the circuit board assembly 10, the battery 85 and the sound producing device 86 are disposed on a surface of the middle frame 83 facing the back cover 82, so that the circuit board assembly 10 is located in a cavity enclosed by the back cover 82 and the middle frame 83; alternatively, the circuit board assembly 10, the battery 85 and the sound generating device 86 may be disposed on a side of the middle frame 83 facing the display screen 81, so that the circuit board assembly 10 is located in a cavity enclosed by the display screen 81 and the middle frame 83.
In the embodiment of the present application, when the battery 85 is disposed on the middle frame 83, for example, a battery compartment may be disposed on a surface of the middle frame 83 facing the rear cover 82, and the battery 85 is mounted in the battery compartment on the middle frame 83 (as shown by a dashed box in fig. 3). In this embodiment, the battery 85 may be connected to the charging management module and the circuit board assembly 10 via a power management module, and the power management module receives input from the battery 85 and/or the charging management module and supplies power to the processor, the internal memory, the external memory, the display 81, the camera, the communication module, and the like. The power management module may also be used to monitor parameters such as battery capacity, battery cycle number, battery state of health (leakage, impedance), etc. In other embodiments, the power management module may also be disposed in the processor of the circuit board assembly 10. In other embodiments, the power management module and the charging management module may be disposed in the same device.
In order to implement the play-out function of the mobile phone 100, as shown in fig. 3, the mobile phone 100 may further include: the sound production device 86, the sound production device 86 can convert the audio electrical signal into a sound signal, and the mobile phone 100 can play music through the sound production device 86, or realize hands-free communication. The sound producing device 86 may be disposed on a side of the middle frame 83 facing the back cover 82 such that the sound producing device 86 is formed in a cavity enclosed by the back cover 82 and the middle frame 83.
In the embodiment of the present application, a microphone (not shown), i.e., a microphone, is further disposed in the mobile phone 100, and the microphone is used for converting a sound signal into an electrical signal, so that when a user makes a call or sends a voice message, the user can approach the microphone through the mouth of the user to make a sound, and the sound signal is input into the microphone.
In the embodiment of the present application, the Display 81 may be an Organic Light-Emitting Diode (OLED) Display, or may be a Liquid Crystal Display (LCD). It should be understood that the display screen 81 may include a display for outputting display content to a user and a touch device for receiving touch events input by the user on the display screen 81.
In this embodiment, the rear cover 82 may be a metal cover, a glass cover, a plastic cover, or a ceramic cover, and the material of the rear cover 82 is not limited in this embodiment.
In the embodiment of the present application, as shown in fig. 2, the middle frame 83 may include a metal middle plate 87 and a frame, and the frame is disposed along the periphery of the metal middle plate 87 for one circle, for example, the frame may include a top frame 88 and a bottom frame 89 that are disposed oppositely, and a left frame 90 and a right frame 91 that are disposed between the top frame 88 and the bottom frame 89 and are disposed oppositely. The connection between each frame and the metal middle plate 87 includes, but is not limited to, welding, clamping, and integral injection molding.
The material of the metal middle plate 87 may be aluminum or aluminum alloy, or the material of the metal middle plate 87 may be stainless steel material. It should be noted that the material of the metal middle plate 87 includes, but is not limited to, the above materials.
Each frame (top frame 88, bottom frame 89, left frame 90 and right frame 91) may be a metal frame, a glass frame, a plastic frame or a ceramic frame.
In order to more clearly show the structure in which the circuit board assembly 10 is mounted on the middle frame 83, as shown in fig. 4, the circuit board assembly 10 and the battery 85 are sequentially disposed on the metal middle plate 87. Of course, fig. 3 illustrates an example in which the circuit board assembly 10 is located above the battery 85, and the circuit board assembly 10 may be located below, on the left side, or on the right side of the battery 85.
It should be noted that in some other examples, the mobile phone 100 may include the display 81 and a rear cover, which may be an integrally formed (Unibody) rear cover formed by the rear cover 82 and the bezel (i.e., the bezel formed by the top bezel 88, the bottom bezel 89, the left bezel 90, and the right bezel 91) in fig. 2. The circuit board assembly 10 and battery 85 are located in the cavity enclosed by the display 81 and the rear cover.
It is to be understood that the illustrated structure of the embodiment of the present application does not specifically limit the mobile phone 100. In other embodiments of the present application, the handset 100 may include more or fewer components than shown, or some components may be combined, some components may be separated, or a different arrangement of components may be used. For example, the handset 100 may also include a camera (e.g., front camera and rear camera) and a flash.
In the present application, the circuit board assembly may include a circuit board. The Circuit Board is classified into a rigid Printed Circuit Board (PCB), a Flexible Printed Circuit Board (FPC), and a rigid-flex Printed Circuit Board according to the structure. The circuit board in this application can adopt any one of the above-mentioned circuit boards, and the reinforcement design in this application can be applicable to the reinforcement of rigid printed circuit board and flexible printed circuit board simultaneously.
In the embodiment of the application, the number of the circuit boards included in the circuit board assembly may be multiple, and the multiple circuit boards may be of different types, for example, a part of the circuit boards may be flexible printed circuit boards, a part of the circuit boards may be rigid-flexible printed circuit boards, and the circuit boards of different types may be transversely adjacent to each other or longitudinally overlapped.
It is understood that the circuit board assembly of the mobile phone 100 may include a plurality of electronic components, in this application, a connection between some of the electronic components, such as the connection port, the radio frequency functional area, and the like, and the circuit board is taken as an example for description, and for the case where a plurality of other electronic components are connected to the circuit board, the other electronic components may be connected to the circuit board in the same manner, and details are not described here.
In the prior art, in the reinforcement design for the circuit board, if the reinforcement part on the circuit board interferes with the surface layer wire, the surface layer wire may not be set, and the wire may not be led out; consequently walk the line for realizing the top layer, can only adopt and break the reinforcement, and adopt the mode design of segmentation reinforcement, but this can bring the not enough problem of reinforcement and the cracked risk of circuit board simultaneously, and this application can be through setting up the bridge portion of lifting between adjacent laminating portion, makes the top layer walk the line and pass the below of bridge portion and set up, consequently can enough guarantee walking the line smoothly of walking the line on top layer, avoids the not enough problem of reinforcement intensity that each laminating subsection set up and leads to again.
Taking the structure of the mobile phone 100 as an example, the structure of the mobile phone 100 will be described with respect to a scene one, a scene two, and a scene three.
Scene one
In the present application, as shown in fig. 5, the circuit board assembly 10 in the present application may include a circuit board 11 and a reinforcing member 20, the circuit board 11 may be, for example, an elongated circuit board 11, and the reinforcing member 20 may correspondingly reinforce an elongated region on the circuit board 11, for example, an upper region of the circuit board 11 shown in fig. 5. Illustratively, the circuit board 11 is a rigid printed circuit board.
The surface layer wiring 13 may be provided on the surface of the circuit board 11, the surface layer wiring 13 is used for electrical connection between each electrical element or each functional region on the circuit board 11, and the surface layer wiring 13 may be disposed on the surface layer of the circuit board 11 as required by design, or may be necessary for functionality and must be provided on the surface layer of the circuit board 11.
Illustratively, the circuit board 11 may further be provided with a first functional area 12, the first functional area 12 may be a radio frequency functional area, the circuit board 11 may further be provided with a connection port 14, the connection port 14 is configured to be connected to an external plug lead 15, the connection port 14 may be a coaxial connector socket, or a board-to-board connector port, it is understood that the type of the connection port 14 may be set according to actual needs of the circuit board 11, and the external plug lead 15 may be a coaxial line. In the circuit board 11 shown in fig. 5, the first functional area 12 and the connection port 14 can be electrically connected by the surface layer wiring 13, and actually when the connection port 14 is a coaxial line connection socket and the external plug lead 15 is a coaxial line, in order to ensure the radio frequency performance, the radio frequency wiring must be led out to the position of the coaxial line connection socket by the surface layer wiring.
In the embodiment of the present application, the reinforcing member 20 includes a bridge portion 21 and a plurality of attaching portions 22, and the attaching portions 22 are attached to the surface of the circuit board 11, for example, soldered on the surface of the circuit board 11 by soldering or the like, and it can be understood that the attaching portions 22 are disposed on the surface of the circuit board 11 at positions where no electrical component is disposed and no electrical trace is disposed.
The bridge 21 is connected to two adjacent attaching portions 22 at two ends thereof, and the bridge 21 is suspended above the circuit board 11, for example, the bridge 21 is spaced from the surface of the circuit board 11 by a predetermined distance, so that a gap for the surface layer wiring 13 to pass through is formed between the bridge 21 and the circuit board 11. In the circuit board 11 of fig. 5, the bridge 21 is disposed between two adjacent attaching portions 22, and a gap for the surface layer wiring 13 to pass through is formed between the bridge 21 and the circuit board 11, unlike the attaching portions 22 attached to the surface of the circuit board 11, the bridge 21 is raised from the surface of the circuit board 11 by a predetermined distance H, for example, 0.7 to 0.9mm, so that the surface layer wiring 13 can pass through below the bridge 21. The bridge portion 21 overlaps the surface layer wiring 13 in a plan view, but does not interfere with each other. The bridge portion 21 may be bonded to the surface layer wiring 13 with no gap therebetween, or the bridge portion 21 may be spaced apart from the surface layer wiring 13 by a predetermined distance.
In this way, when the circuit board 11 is subjected to a mechanical external force such as dropping or bending, since the separated bonded portions 22 are connected as a whole by the bridge portion 21, stress acting on a certain portion of the circuit board 11 can be uniformly dispersed to the respective bonded portions 22 through the bridge portion 21 and the like, and the separated bonded portions 22 reinforce the circuit board 11 as a whole, so that the reinforcing strength is high, and the risk of breaking the circuit board 11 can be reduced.
In addition, the reinforcing member of the present application is formed as a three-dimensional reinforcing member, and the region of the reinforcing member corresponding to the upper portion of the surface layer wiring 13 is raised in a targeted manner without changing the original device layout, and since the surface layer wiring 13 can be led out from the bottom of the bridge portion 21 formed in a three-dimensional structure, the routing distance of the surface layer wiring 13 is short, and good electrical performance of the first functional region 12 can be ensured.
The number of the attaching portions 22 on the circuit board 11 of the present application includes, but is not limited to, 2, and may also be more, and it can be understood that the number of the bridge portions 21 may be flexibly set according to the distribution condition of the actual surface layer wiring 13, the bridge portions 21 may be provided between a plurality of adjacent attaching portions 22, and the bridge portions 21 may also be provided between some adjacent attaching portions 22.
In the embodiment of the present application, for example, when the external plug lead 15 is connected to the connection port 14, a wire management clip needs to be separately provided to accommodate the external plug lead 15, and as shown in fig. 6, a screw 17 is provided on a side of the external plug lead 15 in the circuit board 11, so that the external plug lead 15 is easily moved to the screw 17 when the circuit board 11 is in use, and sometimes the screw 17 pinches off the external plug lead 15, or the external plug lead 15 shakes to affect the reliability of the electrical connection. To avoid this problem, the prior art typically soldered the wire management clip directly to the circuit board 11. However, this may cause the installation position of the wire arranging clip to interfere with the reinforcing member 20, so that the reinforcing member corresponding to the installation position of the wire arranging clip 16 is broken or installed in sections, and the reinforcing strength of the circuit board by the reinforcing member is insufficient, but in the embodiment of the present application, the wire arranging clip 16 may be installed on the attaching portion 22, and the wire arranging clip 16 may be fixed to the attaching portion 22 by, for example, laser welding, so that the external insertion lead 15 may be prevented from being pinched off by the screw 17, and the problem that the wire arranging clip 16 affects the reinforcing strength may also be solved.
In the embodiment of the present application, in order to prevent the bridge portion 21 from damaging an operator or other components, such as the external plug lead 15, the connecting portion between the bridge portion 21 and the fitting portion 22 may have a chamfered structure.
In the embodiment of the present application, in order to make the strength of the whole reinforcing member higher, the bridge portion 21 and the attaching portion 22 may be integrally formed, for example, an integral reinforcing member structure may be formed first, and then a portion of the integral reinforcing member structure where the bridge portion 21 is to be formed may be locally stamped to form the bridge portion 21, so that the reinforcing member 20 is formed as an integrally formed structure, and the strength is better, and the reinforcing effect on the circuit board 11 is also better.
In other examples, the bridge portion 21 and the fitting portion 22 may be formed separately and then connected by welding or the like. This facilitates the processing of the bridge portion 21 and the attachment portion 22.
In the illustration of the present scenario, one bridge 21 is connected between two adjacent attaching portions 22, however, the number of the bridge 21 includes, but is not limited to, one, as shown in fig. 7, and in a possible implementation manner, a plurality of bridges 21 spaced apart from each other may also be connected between two adjacent attaching portions 22. This is applicable to a case where the width of the bonded portion 22 is relatively large, for example. It will be appreciated that such spaced apart bridges 21 reduce the weight of the stiffener 20, and hence the weight of the circuit board assembly and the complete machine, compared to integral bridges; on the other hand, the height of the plurality of spaced apart bridge parts 21 may be varied to match other structural members within the overall machine.
In the embodiment of the present application, as for the connection mode between the reinforcing member 20 and the circuit board 11, the reinforcing member 20 may be soldered to the circuit board 11 by reflow soldering, for example, solder paste is applied on the surface of the circuit board 11, the reinforcing member 20 is placed at the corresponding pad position on the circuit board 11 on which the solder paste is printed, and then the solder paste is melted and solidified to finally solder the reinforcing member 20 to the circuit board 11 in a high temperature reflow oven. It is understood that the welding method of the reinforcement member 20 includes, but is not limited to, reflow welding, and other welding methods such as dip welding.
In order to verify the reinforcing effect of the circuit board 11 in this scenario, modeling simulation is also performed on the reinforcing effects of the circuit board 11 of the embodiment of the present application and the circuit board 11 adopting segmented reinforcement in the prior art.
The problem that the surface layer wiring 13 and the reinforcement 20 interfere is solved by the integrated three-dimensional reinforcement design of the present application and the sectional planar reinforcement 20 of the prior art, and in order to compare the difference of the reinforcement effects between the two in the above simulation experiment, as shown in fig. 8, taking the circuit board 11 of the present scenario as an example, the fixing shafts 18 are added at the two ends of the elongated region of the circuit board 11, and 50N pressing force is applied to the position of the connection port 14, so as to extract the maximum strain values of the circuit board 11 of the present application and the circuit board of the prior art respectively.
Referring to fig. 9 to 12, the maximum strain value of the circuit board 11 of the present application is 4676ue, while the maximum strain value of the sectional type reinforcing circuit board of the related art is 6222ue, where the portion indicated by the reference numeral "a" in fig. 9 is the maximum stress, the portion indicated by the reference numeral "B" in fig. 10 is the maximum stress, the portion indicated by the reference numeral "C" in fig. 11 is the maximum stress, and the portion indicated by the reference numeral "D" in fig. 12 is the maximum stress. Therefore, in a strain scene of pressing the connection port 14, the integrated three-dimensional reinforced circuit board can reduce the strain of the circuit board by 25%, so that the risk of breaking the circuit board can be obviously improved.
Scene two
In the embodiment of the present application, as shown in fig. 13, the circuit board assembly 10 may include a circuit board 11 and a reinforcing member 20, a surface layer wiring 13 is disposed on a surface of the circuit board 11, the reinforcing member 20 is used for reinforcing the circuit board 11, the reinforcing member 20 includes a bridge portion 21 and a plurality of attaching portions 22, the attaching portions 22 are attached to the surface of the circuit board 11, two ends of the bridge portion 21 are respectively connected to two adjacent attaching portions 22, the bridge portion 21 is suspended on the circuit board 11, and a gap for the surface layer wiring to pass through is formed between the bridge portion 21 and the circuit board 11.
The circuit board assembly 10 further includes a flexible circuit board 30, and the flexible circuit board 30 is connected to the circuit board 11, and in some cases, the flexible circuit board 30 is spaced from the connection port 14 by a small distance, for example, 3mm, so that when an operator inserts the end of the external insertion lead 15 into the connection port 14, the flexible circuit board 30 is easily scratched, resulting in poor function. To avoid this, for example, in the case where a partial structure of the reinforcement member 20 is located between the connection port 14 and the flexible circuit board 30, the reinforcement member 20 may include a stopper structure 31, and the height of the stopper structure 31 is greater than the height of the connection port 14. Thus, the stopping structure 31 can be arranged between the connection port 14 and the flexible circuit board 30 in a blocking manner, when an operator inserts the external lead end into the connection port 14, even if the lead end slides sideways due to improper operation, the stopping structure 31 is higher than the connection port 14, and the stopping part can block the lead end from further sliding, so that the flexible circuit board 30 is prevented from being scratched, and the function is not good.
In the embodiment of the present application, as shown in fig. 13, an attaching portion 22 is disposed between the connection port 14 and the flexible circuit board 30, and a protruding portion 32 may be connected to the attaching portion 22, and the protruding portion 32 is formed as a stopper 31. When the bonded portion 22 is located between the connection port 14 and the flexible printed circuit 30, the stopper structure 31 is formed by directly connecting the protruding portion 32 to the bonded portion 22, and the height of the protruding portion 32 is larger than the height of the connection port 14, so that the bonded portion 22 is used as the reinforcement 20 and also as the stopper structure 31, and the structure of the reinforcement 20 can be simplified.
For example, the protrusion 32 may be disposed on the attaching portion 22 by laser welding or the like, the disposition position of the protrusion 32 may be an area of the attaching portion 22 between the connection port 14 and the flexible circuit board 30, and the disposition height of the protrusion 32 may be slightly higher than the connection port 14, for example, 0 to 0.2mm higher than the connection port 14, and for example, the height of the protrusion 32 is 0.7 to 0.9 mm.
In other examples, as shown in fig. 14, the reinforcing member 20 may be flanged, for example, a flanged portion 313 is provided at the edge of the reinforcing member 20 close to the flexible circuit board 30 as the stop structure 31, and the flanged portion 313 is provided at a height higher than the connection port 14 to block the external lead end from hitting the flexible circuit board 30, so as to avoid scratching the flexible circuit board 30.
As shown in fig. 15 and 16, in order to achieve better antenna performance, an elastic sheet 311 may be further disposed on the back surface of the reinforcing member 20, for example, the attaching portion 22, and it can be understood that, at the position where the elastic sheet 311 is disposed, a relief portion 312 needs to be disposed on the circuit board 11 for accommodating the elastic sheet 311. The shell fragment can be through laser spot welding on reinforcement 20, and shell fragment 311 can the bullet meet the position ground connection such as TYPE C connector metal casing to realize better antenna performance.
In other examples, as shown in fig. 17, a bridge 21 is provided between the connection port 14 and the flexible circuit board 30, and thus, the bridge 21 may be formed as a stopper 31. For example, in the case where the bridge 21 is located between the connection port 14 and the flexible circuit board 30, the stop structure 31 is directly formed by the whole bridge 21, the bridge 21 may be located at a position in the area of the circuit board 11 between the connection port 14 and the flexible circuit board 30, and the bridge 21 may be located at a height slightly higher than the connection port 14, for example, 0 to 0.2mm higher than the connection port 14, and illustratively, the bridge 21 has a height of 0.7 to 0.9 mm. In this embodiment, the bridge portion 21 is used as the reinforcing member 20 and also as the stopper structure 31, so that the structure of the reinforcing member 20 can be simplified.
In the embodiment of the present application, in the case where a partial structure of the bridge 21 is provided between the connection port 14 and the flexible circuit board 30, a stopper structure 31 may be formed by projecting a partial region of the bridge 21. As shown in fig. 18 to 20, a stepped portion 33 is formed on the bridge portion 21.
In this embodiment, the stopper structure 31 is formed by directly projecting a local region of the bridge portion 21, for example, the bridge portion 21 is formed in a stepped structure, and the height of the projecting portion is larger than the height of the connection port 14, so that the bridge portion 21 is used as the reinforcing material 20 and also as the stopper structure 31, and the structure of the reinforcing material 20 can be simplified.
The step 33 can be disposed at a position between the connection port 14 and the flexible circuit board 30 of the circuit board 11, and the height of the step 33 can be slightly higher than the connection port 14, for example, 0 to 0.2mm higher than the connection port 14, and exemplarily, the height of the step 33 is 0.7 to 0.9 mm.
As for the connection manner of the reinforcing member 20 and the circuit board 11, the reinforcing member 20 may be soldered to the circuit board 11 by reflow soldering, for example, a solder paste is applied to the surface of the circuit board 11, the reinforcing member 20 is placed at a corresponding pad position on the circuit board 11 on which the solder paste is printed, and then the solder paste is melted and solidified in a high temperature reflow oven, so that the reinforcing member 20 is finally soldered to the circuit board 11. It is understood that the welding method of the reinforcement member 20 includes, but is not limited to, reflow welding, and other welding methods such as dip welding.
In this scenario, the bridge 21 is designed to be stepped. By providing different overhead heights, the bridge part 21 which is not protruded can be used for avoiding the surface layer wiring 13, and the height of the step part positioned at the high layer is 0-0.2 mm higher than the connecting port 14, so that the risk of scratching the flexible circuit board 30 when the external plug lead 15 is buckled can be avoided.
In addition, the non-protruding bridge part 21 is only free from the surface layer wiring 13, and the height thereof can be controlled below 0.2mm, so that the longitudinal space of the circuit board can be further saved.
In the embodiment of the present application, the three solutions of the stopping portions formed by the protruding portion, the stepped portion 33 and the bridge portion 21 can be arranged and combined arbitrarily, that is, in the case that there are a plurality of reinforcing members 20 located between the connection port 14 and the flexible circuit board 30 on one circuit board 11, the stopping structures 31 at various positions can be implemented by selecting different solutions arbitrarily, or by selecting the same solution entirely. The flexible circuit board 30 may also be another component that is susceptible to damage when impacted by an external force and dropped.
Scene three
In the embodiment of the present application, as shown in fig. 21 to 23, the circuit board assembly 10 may include a circuit board 11 and a reinforcing member 20, a surface layer wiring is disposed on a surface of the circuit board 11, the reinforcing member 20 is used for reinforcing the circuit board 11, the reinforcing member 20 includes a bridge portion 21 and a plurality of attaching portions 22, the attaching portions 22 are attached to the surface of the circuit board 11, two ends of the bridge portion 21 are respectively connected to two adjacent attaching portions 22, the bridge portion 21 is suspended on the circuit board 11, and a gap for the surface layer wiring to pass through is formed between the bridge portion 21 and the circuit board 11.
In a possible implementation manner, the fitting portion 22 is provided with a fitting portion 50 protruding toward the surface of the circuit board 11, the surface of the circuit board 11 is provided with a recessed portion 19 corresponding to the fitting portion 50, and the outer contour of the fitting portion 50 and the inner contour of the recessed portion 19 may be matched to enable the fitting portion 50 to be clamped into the recessed portion 19.
With such an arrangement, the fitting portion 50 provided on the attaching portion 22 can be fitted into the recess 19 of the circuit board 11, and if the fitting portion 50 is welded into the recess 19, the fitting of the two portions can be further anchored, so that the connection reliability between the reinforcing member 20 and the circuit board 11 can be enhanced, and the two portions are not easily separated.
In the embodiment of the present application, the depth of the recess 19 may correspond to the height of the surface copper layer of the circuit board 11, or may be deeper, or even may be a through groove. For example, a pad may be provided in the recess 19 so that the fitting portion 50 and the recess 19 are welded together, or the fitting portion 50 may be directly fitted in the recess 19 without providing a pad in the recess 19.
In the embodiment of the present application, due to the matching between the concave portion 19 and the fitting portion 50, the circuit board is concave downward at the corresponding position between the circuit board and the fitting portion, so that a space for accommodating components is provided above the circuit board, and the Z-direction space requirement of other structural members at the position can be met on the premise of not influencing the reinforcing effect.
In the embodiment of the present application, as for the connection mode between the reinforcing member 20 and the circuit board 11, the reinforcing member 20 may be soldered to the circuit board 11 by reflow soldering, for example, solder paste is applied on the surface of the circuit board 11 and in the recess 19, the reinforcing member 20 is placed at the corresponding pad position on the circuit board 11 on which the solder paste is printed, and then the solder paste is melted and then cured to finally solder the reinforcing member 20 to the circuit board 11. It is understood that the welding method of the reinforcement member 20 includes, but is not limited to, reflow welding, and other welding methods such as dip welding.
In the embodiment of the present application, as shown in fig. 22, three bonding portions 22 and two bridge portions 21 are provided on the circuit board 11, the three bonding portions 22 may be a first bonding portion 221, a second bonding portion 222, and a third bonding portion 223, the bridge portion 21 may be a first bridge portion 211 and a second bridge portion 212, two end portions of the first bridge portion 211 are respectively connected to the first bonding portion 221 and the second bonding portion 222, and two end portions of the second bridge portion 212 are respectively connected to the second bonding portion 222 and the third bonding portion 223, so that a surface layer wiring (not shown) may be provided between the first bridge portion 211 and the surface of the circuit board 11, and a surface layer wiring may be provided between the second bridge portion 212 and the surface of the circuit board 11. Of course, it is understood that the case of a single-sided circuit board is illustrated in the drawings of the present application, and in the case of a double-sided circuit board and a multi-sided circuit board, the reinforcing member 20 of the present application may be provided on each of the device connection faces of the corresponding circuit boards, respectively.
In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (13)
1. The utility model provides a circuit board assembly, is applied to among the electronic equipment, its characterized in that, including circuit board and reinforcement, the circuit board surface is equipped with the top layer wiring, the reinforcement is used for right the circuit board reinforces, the reinforcement includes bridging portion and a plurality of laminating portion, laminating portion laminating is in the circuit board surface, the both ends of bridging portion respectively with adjacent two the laminating portion links to each other just bridging portion is in the overhead setting on the circuit board, bridging with form the confession between the circuit board the clearance that the top layer wiring passed.
2. The circuit board assembly according to claim 1, further comprising a flexible circuit board, wherein the flexible circuit board is connected to the circuit board, the circuit board further comprises a connection port, the connection port is used for connecting to an external plug lead, the reinforcing member is arranged between the connection port and the flexible circuit board, the reinforcing member comprises a stop structure, and the height of the stop structure is greater than that of the connection port.
3. The circuit board assembly of claim 2, wherein the bridge is disposed between the connection port and the flexible circuit board, the bridge forming the stop.
4. The circuit board assembly of claim 2, wherein the bridge is disposed between the connection port and the flexible circuit board, and wherein a local area of the bridge protrudes to form the stop.
5. The circuit board assembly of claim 2, wherein the attachment portion is disposed between the connection port and the flexible circuit board, and a protrusion is attached to the attachment portion and forms the stop.
6. A circuit board assembly according to any of claims 2 to 5, wherein the connection port is a coaxial connector socket or a board-to-board connector port.
7. The circuit board assembly of any of claims 1-5, further comprising a wire management clip coupled to the attachment portion.
8. The circuit board assembly according to any one of claims 1 to 5, wherein the attaching portion is provided with an engaging portion that extends toward the surface of the circuit board, the surface of the circuit board is provided with a recessed portion corresponding to the engaging portion, and the engaging portion is capable of being engaged with the recessed portion.
9. A circuit board assembly according to any one of claims 1 to 5, wherein the bridging portion and the attachment portion of the abutment portion have a chamfered configuration.
10. A circuit board assembly according to any of claims 1 to 5, wherein the bridging portion and the abutment portion are integrally formed.
11. A circuit board assembly according to any one of claims 1-5, characterised in that the circuit board is a printed circuit board, PCB, or a flexible printed circuit board, FPC.
12. A circuit board assembly according to any one of claims 1 to 5, wherein a plurality of bridging portions are connected between adjacent abutments and are spaced apart from one another.
13. An electronic device, comprising at least a display screen, a middle frame, a back cover and the circuit board assembly of any one of claims 1-12, wherein the display screen and the back cover are respectively located at two sides of the middle frame, the circuit board assembly is located in a cavity defined by the display screen and the middle frame, or,
the circuit board assembly is positioned in a cavity enclosed by the rear cover and the middle frame.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922051301.8U CN212115762U (en) | 2019-11-25 | 2019-11-25 | Circuit board assembly and electronic equipment |
| CN202080015026.7A CN113455108A (en) | 2019-11-25 | 2020-08-31 | Circuit board assembly and electronic equipment |
| PCT/CN2020/112673 WO2021103725A1 (en) | 2019-11-25 | 2020-08-31 | Circuit board assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922051301.8U CN212115762U (en) | 2019-11-25 | 2019-11-25 | Circuit board assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212115762U true CN212115762U (en) | 2020-12-08 |
Family
ID=73620505
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922051301.8U Active CN212115762U (en) | 2019-11-25 | 2019-11-25 | Circuit board assembly and electronic equipment |
| CN202080015026.7A Pending CN113455108A (en) | 2019-11-25 | 2020-08-31 | Circuit board assembly and electronic equipment |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080015026.7A Pending CN113455108A (en) | 2019-11-25 | 2020-08-31 | Circuit board assembly and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN212115762U (en) |
| WO (1) | WO2021103725A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113455108A (en) * | 2019-11-25 | 2021-09-28 | 华为技术有限公司 | Circuit board assembly and electronic equipment |
| CN113726931A (en) * | 2021-05-11 | 2021-11-30 | 荣耀终端有限公司 | Mounting equipment for support, electronic equipment and pre-tightening piece |
| WO2024061041A1 (en) * | 2022-09-24 | 2024-03-28 | 华为技术有限公司 | Electronic device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051316B (en) * | 2022-01-11 | 2022-03-22 | 龙旗电子(惠州)有限公司 | Printed circuit board |
| CN115086461B (en) * | 2022-08-23 | 2023-01-06 | 荣耀终端有限公司 | Electronic equipment |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6031730A (en) * | 1998-11-17 | 2000-02-29 | Siemens Automotive Corporation | Connector for electrically connecting circuit boards |
| JP2005011867A (en) * | 2003-06-17 | 2005-01-13 | Sankyo Seiki Mfg Co Ltd | Circuit board and optical pickup device |
| CN201340925Y (en) * | 2008-12-16 | 2009-11-04 | 宏达国际电子股份有限公司 | Electronic device and connector assembly thereof |
| CN205081304U (en) * | 2015-11-05 | 2016-03-09 | 达昌电子科技(苏州)有限公司 | Connector structure |
| CN105430881A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board and terminal |
| CN206332901U (en) * | 2016-11-10 | 2017-07-14 | 昆山华乐电子科技有限公司 | Steel disc reinforcement electric-conductor |
| CN206272927U (en) * | 2016-11-10 | 2017-06-20 | 昆山华乐电子科技有限公司 | Steel disc stiffener |
| CN207625864U (en) * | 2017-11-27 | 2018-07-17 | 瑞声科技(新加坡)有限公司 | FPC plates |
| CN208638785U (en) * | 2018-08-02 | 2019-03-22 | 瑞声科技(新加坡)有限公司 | Stiffening plate and board structure of circuit for flexible circuit board |
| CN208971201U (en) * | 2018-11-02 | 2019-06-11 | 深圳市蓝禾技术有限公司 | Mobile electronic device |
| CN210807794U (en) * | 2019-11-21 | 2020-06-19 | 青岛歌尔智能传感器有限公司 | Multifunctional reinforcing plate, circuit board assembly and electronic equipment |
| CN212115762U (en) * | 2019-11-25 | 2020-12-08 | 华为技术有限公司 | Circuit board assembly and electronic equipment |
-
2019
- 2019-11-25 CN CN201922051301.8U patent/CN212115762U/en active Active
-
2020
- 2020-08-31 WO PCT/CN2020/112673 patent/WO2021103725A1/en active Application Filing
- 2020-08-31 CN CN202080015026.7A patent/CN113455108A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113455108A (en) * | 2019-11-25 | 2021-09-28 | 华为技术有限公司 | Circuit board assembly and electronic equipment |
| CN113726931A (en) * | 2021-05-11 | 2021-11-30 | 荣耀终端有限公司 | Mounting equipment for support, electronic equipment and pre-tightening piece |
| CN113726931B (en) * | 2021-05-11 | 2023-09-26 | 荣耀终端有限公司 | Mounting equipment for bracket, electronic equipment and pretension piece |
| WO2024061041A1 (en) * | 2022-09-24 | 2024-03-28 | 华为技术有限公司 | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113455108A (en) | 2021-09-28 |
| WO2021103725A1 (en) | 2021-06-03 |
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