CN219919033U - Circuit board assembly, camera module and electronic equipment - Google Patents
Circuit board assembly, camera module and electronic equipment Download PDFInfo
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- CN219919033U CN219919033U CN202320419037.2U CN202320419037U CN219919033U CN 219919033 U CN219919033 U CN 219919033U CN 202320419037 U CN202320419037 U CN 202320419037U CN 219919033 U CN219919033 U CN 219919033U
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- 239000002184 metal Substances 0.000 claims abstract description 96
- 229910052751 metal Inorganic materials 0.000 claims abstract description 96
- 238000007747 plating Methods 0.000 claims abstract description 68
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 230000000712 assembly Effects 0.000 claims description 18
- 238000000429 assembly Methods 0.000 claims description 18
- 238000001465 metallisation Methods 0.000 claims description 8
- 238000009751 slip forming Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 9
- 239000003351 stiffener Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Abstract
The utility model discloses a circuit board assembly, a camera module and electronic equipment, wherein one end of a flexible board is connected with a connector in the circuit board assembly; the other end of the soft board is connected with the hard board; the metal coating is formed at least on the side surface of the hard board and is used for shielding interference signals. The utility model is to plate metal plating on the side of the hard board, and the mode of forming shielding holes on the hard board is not used for shielding signal interference. Thus, the diameter of the shielding hole and the edge distance between the shielding hole and the hard plate can be eliminated, so that the width of the hard plate is reduced, the size of the camera assembly is reduced, the size of the electronic equipment is reduced, and the miniaturization requirement is met.
Description
Technical Field
The present utility model relates to the field of terminal devices, and in particular, to a circuit board assembly, a camera module, and an electronic device.
Background
Camera modules are common devices in electronic equipment (e.g., cell phones, notebook computers, tablet computers, etc.). In recent years, as electronic devices continue to be thinner and miniaturized, the miniaturization requirement of camera modules is also increasing.
In electronic equipment, in order to prevent external signals from interfering with the camera module, a plurality of shielding holes may be disposed on a circuit board assembly of the camera module to shield external signals. However, the size of the circuit board assembly is increased due to the shielding hole, so that the size of the camera module is increased, and the miniaturization requirement cannot be met.
Disclosure of Invention
The utility model provides a circuit board assembly, a camera module and electronic equipment, and aims to solve the problem that the camera module cannot meet the miniaturization requirement due to the circuit board assembly.
In a first aspect, the present utility model provides a circuit board assembly comprising: a connector; one end of the soft board is connected with the connector; the hard plate is connected with the other end of the soft plate; and the metal coating is formed at least on the side surface of the hard board and is used for shielding interference signals. Like this, replace the mode shielding interference signal that adopts the shielding hole by adopting the mode of metal coating, because of need not to set up the shielding hole on the hard board, can eliminate the diameter of shielding hole and the marginal distance of hard board, and then can reduce the width of hard board for the size of circuit board subassembly reduces.
In some embodiments of the utility model, the metal plating layer includes a first metal plating layer, a second metal plating layer, and a third metal plating layer; the first metal coating is continuously formed on the side surface of the hard plate along the thickness direction of the hard plate; the second metal coating is formed on the front surface of the hard plate, one end of the second metal coating is connected with the first metal coating, and the other end of the second metal coating forms a first preset width towards the center direction of the hard plate; the third metal coating is formed on the back of the hard plate, one end of the third metal coating is connected with the first metal coating, and the other end of the third metal coating forms a second preset width towards the center direction of the hard plate. Therefore, the side face and the adjacent front face and back face of the hard board can be wrapped by the metal coating, and the interference signal shielding effect is improved.
In some embodiments of the present utility model, the first metal plating layer, the second metal plating layer, and the third metal plating layer have the same thickness. In this way, interference signal shielding of the same effect can be achieved.
In some embodiments of the utility model, the side of the stiffener includes a first side and a second side that are connected; the first side surface and the second side surface are different in direction and form a corner at the joint; the metal coating passes through the corner from the first side surface and extends to the second side surface. Thus, the interference signal shielding effect at each corner of the hard board can be improved.
In some embodiments of the utility model, the metal coating is a plurality of metal coatings, and the plurality of metal coatings are distributed at intervals around the hard plate. Therefore, the structure of the hard board and the connection requirements of other devices can be adapted, and the same interference signal shielding effect can be achieved.
In some embodiments of the present utility model, the side of the stiffener includes at least one first region, the first region being located between any adjacent two of the metal plating layers, the first region being connected to a connection board for connecting two circuit board assemblies; the width of the first region is greater than or equal to the width of the connection plate. In this way, the first region can be utilized to form a connection plate structure with other circuit board assemblies.
In some embodiments of the present utility model, the side surface of the hard plate includes a second area, the second area is located between any two adjacent metal plating layers, and the second area is connected with the soft plate; the width of the second area is greater than or equal to the width of the flexible board. Thus, the connection of the hard board and the soft board can be facilitated.
In some embodiments of the utility model, the stiffener includes a bonding pad and a hollowed-out portion; the hollowed-out part is positioned in the middle of the hard board and is used for arranging a chip; the bonding pad is positioned at the outer side of the hollowed-out part; the hard board is electrically connected with the chip through the bonding pad. Therefore, the chip is embedded into the hollowed-out part, so that the height of the camera module can be reduced.
In some embodiments of the utility model, the distance between the metal plating layer and the bonding pad is greater than or equal to the reserved safety distance. Therefore, the distance between the metal coating and the bonding pad meets the requirement of reserving a safe distance, excessive distance is not required to be reserved, the width of the hard board can be as small as possible, and the size of the circuit board assembly is reduced.
In a second aspect, the present utility model provides a camera module, including: the lens assembly, the motor, the chip and the circuit board assembly according to the first aspect, wherein the chip is connected with the circuit board assembly, the motor is arranged above the circuit board assembly, and the lens assembly is fixed on the motor. Thus, the size of the circuit board assembly is reduced, and the size of the camera module can be further reduced.
In a third aspect, the present utility model provides an electronic device, including the camera module set in the second aspect. Therefore, the size of the camera module is reduced, the size of the electronic equipment can be further reduced, and the miniaturization requirement of the electronic equipment is met.
Drawings
In order to more clearly illustrate the technical solution of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of a camera module 30;
fig. 3 is a schematic view of a circuit board assembly 33;
FIG. 4 is a cross-sectional view A-A of FIG. 3;
fig. 5 is a schematic structural view of a circuit board assembly 33A according to an embodiment of the present utility model;
FIG. 6 is a section B-B of FIG. 5;
FIG. 7 is a first partial schematic view of a circuit board assembly 33A provided in accordance with an embodiment of the present utility model;
FIG. 8 is a second partial schematic view of a circuit board assembly 33A provided in accordance with an embodiment of the present utility model;
FIG. 9 is a side view of a hard plate 103 provided by an embodiment of the present utility model;
FIG. 10 is a schematic structural view of a connection plate structure according to an embodiment of the present utility model;
fig. 11 is a schematic structural diagram of a circuit board connecting board.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly described below with reference to the drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. Based on the embodiments of the present utility model, other embodiments that may be obtained by those of ordinary skill in the art without making any inventive effort are within the scope of the present utility model.
Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
Furthermore, in the present utility model, the terms "upper," "lower," "left," and "right," and the like, are defined with respect to the orientation in which the components in the drawings are schematically disposed, and it should be understood that these directional terms are relative concepts, which are used for descriptive and clarity with respect thereto, and which may be varied accordingly with respect to the orientation in which the components in the drawings are disposed.
The electronic device according to the embodiment of the utility model includes, but is not limited to, a mobile phone, a notebook computer, a tablet computer, a laptop computer, a personal digital assistant, or a wearable device. The following description will be made with reference to an electronic device as a mobile phone.
Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present utility model.
As shown in fig. 1, the electronic device 100 may include a device body 10 and a display screen 20, where the device body 10 includes a middle frame and a rear shell, and the display screen 20, the middle frame and the rear shell are sequentially buckled together to form a closed cavity. The enclosed cavity may include a circuit board, a battery, a speaker assembly, a camera module 30, and the like, which are not illustrated herein.
The camera modules 30 are used for realizing a shooting function, and the number of the camera modules 30 can be one or more. The camera module 30 is usually located at the top of the middle frame, and the width of the top of the middle frame needs to be adapted to the width of the camera module 30 in order to accommodate the camera module 30. It can be seen that the size of the camera module 30 affects the size of the electronic device 100.
Fig. 2 is a schematic structural diagram of a camera module 30.
As shown in fig. 2, the camera module 30 may include: lens assembly 31, motor 32, circuit board assembly 33, chip 34, analog power supply, motor power supply, and the like. The chip 34 is connected with the circuit board assembly 33, the motor 32 is disposed above the circuit board assembly 33, the lens assembly 31 is fixed on the motor 32, and the analog power supply and the motor power supply are disposed in the circuit board assembly 33.
Fig. 3 is a schematic diagram of a circuit board assembly 33. Fig. 4 is a sectional view A-A in fig. 3.
As shown in fig. 3 and 4, the circuit board assembly 33 may include a power supply connector 331, a flexible circuit board 332, and a printed circuit board 333. One end of the flexible circuit board 332 is connected to the power supply connector 331, and the other end of the flexible circuit board 332 is connected to the printed circuit board 333. For example, an analog power supply and a motor power supply may be provided in the printed circuit board 333.
In order to reduce the height of the camera module 30 to achieve the thinning of the electronic device 100, a hollowed-out area 336 may be formed in the middle of the printed circuit board 333. The hollowed-out area 336 may penetrate the upper and lower surfaces of the printed circuit board 333, or may be formed by inwardly recessing one surface of the printed circuit board 333, so as to embed the chip 34 into the hollowed-out area 336. The printed circuit board 333 is provided with a wire 334, the wire 334 is located at one side of the hollowed-out area 336, and the wire 334 is used for realizing connection between the chip 34 and the printed circuit board 333.
In the camera module 30, in order to prevent interference of external signals, a plurality of shielding holes 335 may be provided on the printed circuit board 333, and copper may be plated in the shielding holes 335 to shield interference signals. The diameter of the shielding hole 335 is L 1 The shielding hole 335 is spaced from the edge of the printed circuit board 333 by a distance L 2 . Thus, to accommodate the shielding holes 335, the width W of the printed circuit board 333 1 At least increase L 1 +L 2 Thereby leading to camera dieThe size of the group 30 increases, the overall space occupied by the electronic device 100 increases, and the miniaturization requirement of the electronic device 100 cannot be satisfied.
In order to reduce the width of the camera module 30, the embodiment of the present utility model provides a circuit board assembly 33A, which is implemented by plating metal layers on the side surfaces of the printed circuit board 333 instead of providing the shielding holes 335 on the printed circuit board 333 to shield signal interference, so that the width of the printed circuit board 333 can be reduced, and the size of the electronic device 100 can be further reduced.
Fig. 5 is a schematic structural diagram of a circuit board assembly 33A according to an embodiment of the present utility model.
As shown in fig. 5, in some embodiments, the circuit board assembly 33A may include: connector 101, flexible board 102, hard board 103, and metal plating 104. One end of the flexible board 102 is connected to the connector 101, the other end of the flexible board 102 is connected to the hard board 103, and the metal plating layer 104 is formed at least on the side surface of the hard board 103 for shielding interference signals.
For example, the metal plating layer 104 may be made of copper material, and the metal plating layer 104 may be formed on the side of the hard plate 103 by copper plating.
In the embodiment of the present utility model, the metal plating layer 104 is used to shield the interference signal, so that the hard board 103 does not need to be provided with the shielding hole 335, and therefore, the width of the hard board 103 does not need to be increased for providing the shielding hole 335, so that the width of the hard board 103 can be reduced.
Illustratively, the stiffener 103 has a width W 2 The width of each side of the stiffener 103 may be reduced by at least L without changing the size and layout of other devices in the circuit board assembly 333A 1 +L 2 Thus W is 2 <W 1 。
In some embodiments, the stiffener 103 may include a pad 106 and a hollowed out portion 107. The hollowed-out portion 107 is located in the middle of the hard board 103, the hollowed-out portion 107 may penetrate through the upper surface and the lower surface of the hard board 103, or may be formed by inward recessing of one surface of the hard board 103, and the hollowed-out portion 107 is used for setting the chip 34. The number of the bonding pads 106 can be two, the two bonding pads 106 are located on the hard board 103 and located on two sides of the hollowed-out portion 107, and the hard board 103 and the chip 34 form a loop electric connection through the bonding pads 106. Thus, the chip 34 is embedded in the hard board 103, so that the height of the camera module 30 can be reduced to realize thinning of the electronic device 100.
In some embodiments, the distance L between the metal plating 104 and the pad 106 3 Greater than or equal to the reserved safety distance, the reserved safety distance can avoid the contact between the metal coating 104 and the bonding pad 106, and abnormal signal transmission between the hard board 103 and the chip 34 occurs. In this way, the distance between the metal coating 104 and the bonding pad 106 can meet the preset safety distance without reserving excessive distance, thereby enabling the width W of the hard board 103 to be smaller 2 The size of the circuit board assembly 33A, and thus the size of the camera module 30, can be reduced as small as possible to achieve miniaturization of the electronic device 100.
Fig. 6 is a sectional view of B-B in fig. 5.
As shown in fig. 6, in some embodiments, the metal plating layer 104 may include a first metal plating layer 1041, a second metal plating layer 1042, and a third metal plating layer 1043.
The first metal plating layer 1041 is continuously formed on the side surface of the hard sheet 103 in the thickness direction of the hard sheet 103; the second metal plating layer 1042 is formed on the front surface of the hard plate 103, one end of the second metal plating layer 1042 is connected with the first metal plating layer 1041, and the other end forms a first preset width towards the center direction of the hard plate 103; a third metal plating layer 1043 is formed on the back surface of the hard plate 103, one end of the third metal plating layer 1043 is connected to the first metal plating layer 1041, and the other end forms a second predetermined width toward the center direction of the hard plate 103. Thus, the side surface and the adjacent front surface and back surface of the hard board 103 can be wrapped by the metal plating layer 104, and the interference signal shielding effect is improved.
In some embodiments, the thickness h of the first metal plating 1041 1 Thickness h of second metal plating 1042 2 Thickness h of third metal plating layer 1043 3 In this way, the same effect of interference signal shielding can be achieved. Exemplary, h 1 、h 2 And h 3 May be 35 μm. The first preset width and the second preset width can be the same or different, and when the first preset width and the second preset width are the same, the preset widths W can be adopted 3 . Pre-preparationSet width W 3 The present embodiment is not particularly limited, and is exemplified by a predetermined width W, provided that the positional relationship and functions of other devices provided on the hard board 103 are not affected 3 May be 35 μm.
Fig. 7 is a first partial schematic view of a circuit board assembly 33A according to an embodiment of the present utility model.
As shown in fig. 7, in some embodiments, the stiffener 103 may be a polygonal structure, such as a quadrilateral structure, a pentagonal structure, a hexagonal structure, or the like.
It will be appreciated that the hard plate 103 of the polygonal structure includes a plurality of differently oriented sides. For ease of description, any two sides of the stiffener 103 that are connected are referred to herein as a first side and a second side, respectively. The first side and the second side are oriented differently so as to form a corner at the junction thereof.
In some embodiments, the metal plating 104 may be a plurality of metal plating 104 spaced around the hard plate 103. In this way, the structure of the hard board 103 and the connection requirements with other devices can be adapted, and the same interference signal shielding effect can be achieved.
Wherein at least one metallization layer 104 is located at the corner. For example: the metallization 104 may extend from the first side, through the corner lambda, and to the second side.
Illustratively, taking the hard plate 103 as an example of a rectangular structure, the plurality of metal plating layers 104 may include a metal plating layer 104-1, a metal plating layer 104-2, a metal plating layer 104-3, and a metal plating layer 104-4.
The metal coating 104-1 passes through the corner lambda from the side 103-1 1 And extends to side 103-2. The metal coating 104-2 passes through the corner lambda from the side 103-2 2 And extends to side 103-3. The metal coating 104-3 passes through the corner lambda from the side 103-3 3 And extends to side 103-4. The metal coating 104-4 passes through the corner lambda from the side 103-4 4 And extends to side 103-1. Each metal coating 104 can wrap each corner lambda of the hard board 103, and can improve the interference signal shielding effect of each corner of the hard board 103.
Fig. 8 is a second partial schematic view of a circuit board assembly 33A according to an embodiment of the present utility model.
Fig. 9 is a side view of a hard plate 103 provided by an embodiment of the present utility model.
As shown in fig. 8 and 9, in some embodiments, the sides of the stiffener 103 include at least one first region 1051, the first region 1051 being located between any adjacent two of the metallization layers 104. By way of example, the first region 1051 may be located between the metallization layer 104-1 and the metallization layer 104-4.
Likewise, the first region 1051 may also be located between the metal plating layer 104-1 and the metal plating layer 104-2, and the first region 1051 may also be located between the metal plating layer 104-2 and the metal plating layer 104-3.
Fig. 10 is a schematic structural diagram of a connection board structure according to an embodiment of the present utility model.
As shown in fig. 10, in some embodiments, the first region 1051 is connected with a connection board 108, the connection board 108 being used to connect two circuit board assemblies 33A.
In performing the board connection operation, adjacent two of the plurality of circuit board assemblies 33A are connected by the connection board 108. Taking four circuit board assemblies 33A connected to form a connection board structure as an example, the four circuit board assemblies 33A are a first circuit board assembly 33A1, a second circuit board assembly 33A2, a third circuit board assembly 33A3, and a fourth circuit board assembly 33A4, respectively.
One end of the connection plate 108 is connected to the first region 1051 of the first circuit board assembly 33A1 on the upper side, and the other end is connected to the connector of the second circuit board assembly 33 A2. Likewise, the first region 1051 of the first circuit board assembly 33A1 on the right side is connected to the first region 1051 of the third circuit board assembly 33A3 on the left side by the second connection board 108. The first region 1051 of the second circuit board assembly 33A2 on the right side is connected to the first region 1051 of the fourth circuit board assembly 33A4 on the left side by the third connection board 108. The first region 1051 of the upper side of the third circuit board assembly 33A3 is connected with the connector of the fourth circuit board assembly 33A4 by the fourth connection board 108. Thus, the connecting plate structure can be formed, and the connecting plate operation is convenient.
The width of the first region 1051 is greater than or equal to the width of the connection board 108, and no metal plating 104 is present at the first region 1051, so that the circuit board assembly 33A forms a connection board structure by connecting the first region 1051 with the connection board 108 and with other circuit board assemblies 33A.
Referring again to fig. 8, in some embodiments, the sides of the stiff plate 103 may include a second area 1052, the second area 1052 being located between the two metal plating layers 104, the second area 1052 being connected with the flexible plate 102. Illustratively, the second region 1052 is located between the metallization layer 104-3 and the metallization layer 104-4. Thus, the width of the second area 1052 is greater than or equal to the width of the flexible board 102, and no metal plating 104 is provided at the second area 1052 to facilitate connection of the rigid board 103 to the flexible board 102.
The first area 1051 and the second area 1052 may exist at the same time so that the hard board 103 may be connected with the soft board 102 and other circuit board assemblies 33A. The first area 1051 and the second area 1052 may be located on different sides of the hard plate 103 or may be located on the same side of the hard plate 103.
Fig. 11 is a schematic structural diagram of a circuit board connecting board.
As shown in fig. 11, in some embodiments, circuit board assembly 33A, when prepared, includes: a circuit board connection board is obtained, which includes a plurality of circuit board assemblies 33, and two adjacent circuit board assemblies 33 are connected by a first connection portion 51, and a plurality of circuit board assemblies are connected by a second connection portion 52. One end of the first connection portion 51 is connected to the power supply connector 331 of one circuit board assembly 33, and the other end is connected to the printed circuit board 333 of the other circuit board assembly 33. The second connection portion 52 may be an abnormal board, scrap, or the like for connecting the plurality of circuit board assemblies 33.
When the individual circuit board assemblies 33 are obtained, the first connection portions 51 to which the circuit board assemblies 33 are connected are cut off, and the second connection portions 52 between the circuit board assemblies 33 and the other plurality of circuit board assemblies are cut off, resulting in the individual circuit board assemblies 33. Next, the left and right sides of the printed circuit board 333 of the circuit board assembly 33 are cut away by a predetermined distance to obtain a circuit board assembly body. Wherein, the preset distance is equal to the diameter L of the shielding hole 335 1 And a distance L between the shielding hole 335 and the edge of the printed circuit board 333 2 In relation, L can be reduced on one side 1 +L 2 Then the two sides can be reduced by 2 x (L 1 +L 2 ) Is a width of (c). Finally, the side of the printed circuit board 333 after cutting off both sides is plated with the metal plating 104 to obtain the hard board 103. The width of the hard board 103 is smaller than the width of the printed circuit board 333, resulting in a reduced width circuit board assembly 33A.
According to the circuit board assembly, the camera module and the electronic equipment provided by the embodiment of the utility model, the metal plating 104 is plated on the side surface of the hard board 103 in the circuit board assembly, so that the shielding of external interference signals is realized, and the shielding hole 335 is not used for shielding signal interference any more. Because the hard plate 103 does not need to be provided with the shielding holes 335, the diameter L of the shielding holes 335 can be eliminated 1 And an edge distance L between the shielding hole 335 and the printed circuit board 333 2 This reduces the width of the hard board 103, and thus reduces the size of the camera module 30, to further reduce the size of the electronic device 100.
It is noted that other embodiments of the utility model will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This utility model is intended to cover any variations, uses, or adaptations of the utility model following, in general, the principles of the utility model and including such departures from the present disclosure as come within known or customary practice within the art to which the utility model pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the utility model being indicated by the following claims.
It is to be understood that the utility model is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the utility model is limited only by the appended claims.
Claims (11)
1. A circuit board assembly, comprising:
a connector (101);
a flexible board (102) having one end connected to the connector (101);
a hard plate (103) connected to the other end of the soft plate (102);
and a metal plating layer (104) formed at least on the side surface of the hard plate (103) for shielding interference signals.
2. The circuit board assembly of claim 1, wherein,
the metal plating layer (104) includes a first metal plating layer (1041), a second metal plating layer (1042), and a third metal plating layer (1043);
the first metal plating layer (1041) is continuously formed on the side surface of the hard plate (103) along the thickness direction of the hard plate (103);
the second metal coating (1042) is formed on the front surface of the hard plate (103), one end of the second metal coating is connected with the first metal coating (1041), and the other end of the second metal coating forms a first preset width towards the center direction of the hard plate (103);
the third metal plating layer (1043) is formed on the back surface of the hard plate (103), one end of the third metal plating layer is connected with the first metal plating layer (1041), and the other end of the third metal plating layer forms a second preset width towards the center direction of the hard plate (103).
3. The circuit board assembly of claim 2, wherein,
the thicknesses of the first metal plating layer (1041), the second metal plating layer (1042) and the third metal plating layer (1043) are the same.
4. The circuit board assembly of claim 1, wherein,
the side of the hard board (103) comprises a first side and a second side which are connected;
the first side surface and the second side surface are different in direction and form a corner at the joint;
the metallization layer (104) extends from the first side, through the corner, and to the second side.
5. The circuit board assembly of claim 1, wherein,
the number of the metal plating layers (104) is plural, and the plurality of the metal plating layers (104) are distributed at intervals around the hard plate (103).
6. The circuit board assembly of claim 5, wherein,
the side surface of the hard board (103) comprises at least one first area (1051), wherein the first area (1051) is positioned between any two adjacent metal plating layers (104), the first area (1051) is used for being connected with a connecting plate (108), and the connecting plate (108) is used for connecting two circuit board assemblies;
the width of the first region (1051) is greater than or equal to the width of the web (108).
7. The circuit board assembly of claim 5, wherein,
the side surface of the hard plate (103) comprises a second area (1052), wherein the second area (1052) is positioned between any two adjacent metal plating layers (104), and the second area (1052) is connected with the soft plate (102);
the width of the second region (1052) is greater than or equal to the width of the flexible board (102).
8. The circuit board assembly of claim 1, wherein,
the hard board (103) comprises a bonding pad (106) and a hollowed-out part (107);
the hollowed-out part (107) is positioned in the middle of the hard board (103) and is used for arranging a chip;
the bonding pad (106) is positioned at the outer side of the hollowed-out part (107);
the hard board (103) is electrically connected with the chip through the bonding pad (106).
9. The circuit board assembly of claim 8, wherein the circuit board assembly further comprises a plurality of circuit boards,
the distance between the metal plating layer (104) and the bonding pad (106) is greater than or equal to a reserved safety distance.
10. A camera module, comprising: lens assembly (31), motor (32), chip (34) and the circuit board assembly of any one of claims 1-9, the chip (34) is connected with the circuit board assembly, the motor (32) is arranged above the circuit board assembly, and the lens assembly (31) is fixed on the motor (32).
11. An electronic device comprising the camera module of claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320419037.2U CN219919033U (en) | 2023-03-08 | 2023-03-08 | Circuit board assembly, camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320419037.2U CN219919033U (en) | 2023-03-08 | 2023-03-08 | Circuit board assembly, camera module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219919033U true CN219919033U (en) | 2023-10-27 |
Family
ID=88466395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320419037.2U Active CN219919033U (en) | 2023-03-08 | 2023-03-08 | Circuit board assembly, camera module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219919033U (en) |
-
2023
- 2023-03-08 CN CN202320419037.2U patent/CN219919033U/en active Active
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