CN211831335U

CN211831335U - Antistatic circuit board structure and electronic equipment

Info

Publication number: CN211831335U
Application number: CN202020976704.3U
Authority: CN
Inventors: 简宪军
Original assignee: Guangdong Genius Technology Co Ltd
Current assignee: Guangdong Genius Technology Co Ltd
Priority date: 2020-06-01
Filing date: 2020-06-01
Publication date: 2020-10-30
Anticipated expiration: 2030-06-01

Abstract

An antistatic circuit board structure and electronic equipment, wherein the antistatic circuit board structure is connected with an equipment mainboard, the antistatic circuit board structure comprises a flexible circuit board and a reinforcing plate pressed with the flexible circuit board, and the flexible circuit board comprises at least two circuit layers; the circuit configuration on the first circuit layer on one side where the flexible circuit board and the reinforcing plate are pressed together is a ground wire, the ground wire is connected with a ground terminal of the equipment mainboard, and the circuits on other circuit layers are configured to be a data line or a power supply positive line. By adjusting the laminated layout of the circuits, all the circuit layers pressed by the flexible circuit board and the reinforcing plate are designed as ground wires, other circuits are not designed, and the ground wires are connected with the ground of the equipment mainboard to establish a ground plane, the ground plane has very strong static discharge capacity, so that the device is prevented from being damaged by static electricity entering from the outside, and meanwhile, the reinforcing steel sheet is not grounded, so that the cost is not increased.

Description

Antistatic circuit board structure and electronic equipment

Technical Field

The application belongs to the technical field of circuit board design, especially relates to an antistatic circuit board structure and electronic equipment.

Background

Generally, some component adapter boards need to be installed around the housing of products such as tablet computers and mobile phone devices, for example, in the assembly of microphones, a Flexible Printed Circuit (FPC) semi-finished product with a microphone is bonded or fixed on the housing of a machine by other methods, and an FPC and a steel sheet are needed for reinforcement, so that the structural strength is enhanced, and devices on the FPC are protected from deformation and loss caused by external force.

In the application process, static electricity is discharged to the steel sheet reinforcing plate through the gap of the shell, the static electricity on the steel sheet reinforcing plate is coupled to the FPC top layer circuit, components connected on the circuit generally cannot directly bear static impact of more than 8KV, the 8KV exceeds the limit of the components, and the components are failed, and at present, the following measures are mainly adopted for solving the problem:

1. through at FPC top layer pressfitting steel sheet, make the hourglass copper on FPC top layer pass through the steel sheet ground connection, but this kind of pressfitting mode, there is the difference in height at FPC top layer hourglass copper position and the part that has the covering circuit, and ground resistance is greater than 10 ohm or contact failure usually, can not satisfy the demand of good ground connection.

2. On the basis of the scheme 1, the top layer of the FPC is filled with conductive adhesive before lamination, and then the steel sheet is laminated for reinforcement, but in the laminating mode, the grounding resistance can meet the requirement of good grounding, and the conductive adhesive, the production process and the cost are increased.

3. The discharge tube is added at the interface of the device, but the layout is compact, no adapter plate for reserving the position of the discharge tube is reserved, and the discharge tube is arranged on the equipment mainboard, so that the discharge tube cannot smoothly discharge static electricity due to large resistance of a circuit, and the protection effect cannot be achieved.

SUMMERY OF THE UTILITY MODEL

An object of this application is to provide an antistatic circuit board structure and electronic equipment, aim at solving the antistatic design of traditional circuit board and have unreliable and problem with high costs.

A first aspect of an embodiment of the present application provides an antistatic circuit board structure, which is connected to an equipment motherboard, where the antistatic circuit board structure includes a flexible circuit board and a reinforcing plate pressed on the flexible circuit board, and the flexible circuit board includes at least two circuit layers;

the circuit configuration on the first circuit layer on one side where the flexible circuit board and the reinforcing plate are pressed together is a ground wire, the ground wire is connected with a ground terminal of the equipment mainboard, and the circuits on other circuit layers are configured to be a data line or a power supply positive line.

The antistatic circuit board structure is characterized in that the laminated layout of the circuits is adjusted, all circuit layers of the flexible circuit board and the reinforcing plate are designed into ground wires, other circuits are not designed, the flexible circuit board and the reinforcing plate are connected with the ground of the equipment mainboard to form a ground plane, the ground plane has very strong static electricity discharge capacity, static electricity entering from the outside is prevented from damaging devices, meanwhile, the reinforcing steel sheet does not need to be grounded, and the cost is not increased.

In one embodiment, the stiffening plate is a sheet of insulating material.

In one embodiment, the reinforcing plate is a metal plate.

In one embodiment, the metal plate is electrically connected to a pad on the wiring layer, and the pad is electrically connected to the ground line.

In one embodiment, the pad is connected to the metal plate by a conductive paste.

The first aspect of the embodiment of the application provides an electronic device, include the casing and locate equipment mainboard in the casing, set up the through-hole of inside and outside intercommunication on the casing, still include as above antistatic line board structure, the stiffening plate with the through-hole is relative.

The static electricity of the electronic equipment is discharged to the reinforcing plate of the antistatic circuit board structure through the through hole of the shell, the static electricity on the reinforcing plate is coupled to the ground plane formed by the first circuit layer of the flexible circuit board, and the static electricity is discharged through the ground plane and greatly reduced to the static electricity residual voltage coupled to the device arranged in the through hole, so that the static electricity damage of the device is avoided, the static electricity is reliably released, parts such as conductive adhesive do not need to be added, and the cost is reduced.

Drawings

Fig. 1 is a schematic structural diagram of an antistatic circuit board structure provided in an embodiment of the present application.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the present application and to simplify description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Fig. 1 shows a schematic structural diagram of an electronic device provided in an embodiment of the present application, and for convenience of description, only parts related to the embodiment are shown, which are detailed as follows:

electronic equipment includes casing 100 and locates the equipment mainboard 101 in casing 100, offers the through-hole 102 of inside and outside intercommunication on the casing 100, still includes antistatic circuit board structure 10 as above, and antistatic circuit board structure 10 includes flexible circuit board 11 and the stiffening plate 12 with the pressfitting of flexible circuit board 11, and stiffening plate 12 is relative with through-hole 102, and antistatic circuit board structure 10 is connected with equipment mainboard 101.

The flexible circuit board 11 includes at least two circuit layers, the circuit configuration on the first circuit layer 111 on the side where the flexible circuit board 11 and the reinforcing plate 12 are pressed together is a ground line, the ground line is connected with a ground terminal of the device main board 101, and the circuit configuration on the other circuit layer 112 is a data line or a power positive line.

Thus, by adjusting the circuit laminated layout, the circuit layers laminated by the flexible circuit board 11 and the reinforcing plate 12 are all designed as ground wires, other circuits are not designed, and the ground wires are connected with the ground of the equipment main board 101 to establish a ground plane, and the ground plane has very strong static electricity discharge capability, so that static electricity entering from the outside is prevented from damaging devices, static electricity discharge is reliable, parts such as conductive adhesive and the like do not need to be added, and meanwhile, the reinforcing steel sheet does not need to be grounded, so that the cost is not increased.

When the electrostatic protection circuit is applied to an electronic device, static electricity is discharged to the reinforcing plate 12 of the antistatic circuit board structure 10 through the through hole 102 of the casing 100 of the electronic device (such as a mobile phone and a wearable device), the static electricity on the reinforcing plate 12 is coupled to the ground plane formed by the first circuit layer 111 of the flexible circuit board 11, and the static electricity is discharged through the ground plane, so that the static electricity residual voltage is greatly reduced to the static electricity residual voltage coupled to a device (such as a microphone, a loudspeaker, an earphone interface or a USB interface) arranged in the through hole 102, and the electrostatic damage of the device is avoided.

Taking the double-layer flexible circuit board 11 as an example, the top circuit layer 111 is designed as a ground wire and is pressed with the reinforcing plate 12, the bottom circuit layer 112 is designed as a pin lead of a component, such as a data wire or a power supply positive wire, if the requirement of changing the layer to the top layer is needed, the wire is routed to the outside of the reinforcing plate 12 and then punched, and the layer is changed.

In some embodiments, the stiffener 12 is a sheet of insulating material, such as FR4 material. In other embodiments, the stiffener 12 is a metal plate, and the stiffener 12 is not grounded in this embodiment, so that the cost is not increased. In a further embodiment, the metal plate is electrically connected with a pad on the circuit layer, and the pad is electrically connected with a ground wire, so that the ground resistor can meet the requirement of good grounding. Specifically, the pad is soldered to the metal plate by a conductive paste.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims

1. An antistatic circuit board structure is connected with an equipment mainboard, and comprises a flexible circuit board and a reinforcing plate pressed with the flexible circuit board, and is characterized in that the flexible circuit board comprises at least two circuit layers;

2. The antistatic wiring board structure of claim 1, wherein the reinforcing plate is a plate of insulating material.

3. The antistatic wiring board structure of claim 1, wherein the reinforcing plate is a metal plate.

4. The antistatic circuit board structure of claim 3, wherein the metal plate is electrically connected to a pad on the first circuit layer, the pad being electrically connected to the ground line.

5. The antistatic circuit board structure of claim 4, wherein the pads are connected to the metal plate by a conductive paste.

6. An electronic device, comprising a casing and a device main board arranged in the casing, wherein the casing is provided with a through hole communicated with the inside and the outside, the electronic device is characterized by further comprising the antistatic circuit board structure of any one of claims 1 to 5, and the reinforcing plate is opposite to the through hole.