CN219660002U

CN219660002U - Circuit board assembly and electronic equipment

Info

Publication number: CN219660002U
Application number: CN202223472507.6U
Authority: CN
Inventors: 谢维亮
Original assignee: Yibin Tianlong Communication Co ltd; Shenzhen Tinno Mobile Technology Co Ltd; Shenzhen Tinno Wireless Technology Co Ltd
Current assignee: Yibin Tianlong Communication Co ltd; Shenzhen Tinno Mobile Technology Co Ltd; Shenzhen Tinno Wireless Technology Co Ltd
Priority date: 2022-12-23
Filing date: 2022-12-23
Publication date: 2023-09-08
Anticipated expiration: 2032-12-23
Also published as: WO2024130806A1

Abstract

The utility model discloses a circuit board assembly and electronic equipment, and belongs to the technical field of electronic equipment. The circuit board assembly comprises a circuit board and an electronic element, wherein a plurality of bonding pads are arranged on the circuit board, the electronic element comprises a plurality of pins, and the pins are welded on the bonding pads so as to electrically connect the electronic element with the circuit board; the pads corresponding to at least two electrically connected adjacent pins are in communication with each other to communicatively solder the at least two electrically connected adjacent pins to the pads. According to the circuit board assembly provided by the utility model, the bonding pads corresponding to the at least two adjacent pins which are electrically connected are communicated with each other, so that the at least two adjacent pins which are electrically connected are communicated and welded on the bonding pads, and the welding area and the tin coating amount are increased, so that the welding between the pins and the bonding pads is firmer.

Description

Circuit board assembly and electronic equipment

Technical Field

The present utility model relates to the field of electronic devices, and in particular, to a circuit board assembly and an electronic device.

Background

Pins of the electronic component are welded on bonding pads of the circuit board through solder paste, and the electronic device cannot be used because the electronic component is large in size and small in size, so that the welding is not firm enough, and when the electronic device falls down or is subjected to stress impact in use, the welding positions of the bonding pads and the pins are cracked, and signals connected with the bonding pads and the pins are opened, so that the electronic device cannot be used. Therefore, providing a circuit board assembly with a firmly soldered pad and pin is a technical problem to be solved.

Disclosure of Invention

The utility model provides a circuit board assembly which can solve the problem of weak welding between a bonding pad and a pin.

In order to solve the technical problems, the utility model provides a circuit board assembly, which comprises a circuit board and an electronic element, wherein a plurality of bonding pads are arranged on the circuit board, the electronic element comprises a plurality of pins, and the pins are welded on the bonding pads so as to electrically connect the electronic element with the circuit board; the pads corresponding to at least two electrically connected adjacent pins are in communication with each other to communicatively solder the at least two electrically connected adjacent pins to the pads.

The utility model provides an electronic device, which comprises the circuit board assembly and a shell; the shell is provided with a containing space, the circuit board assembly is arranged in the containing space, and the circuit board assembly is used for controlling the working state of the electronic equipment.

According to the circuit board assembly provided by the utility model, the bonding pads corresponding to the at least two adjacent pins which are electrically connected are communicated with each other, so that the at least two adjacent pins which are electrically connected are communicated and welded on the bonding pads, and the welding area and the tin coating amount are increased, so that the welding between the pins and the bonding pads is firmer.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a circuit board assembly according to an embodiment of the present utility model;

FIG. 2 is a schematic view of a circuit board assembly according to an embodiment of the present utility model;

fig. 3 is a schematic view showing a partial cross-sectional structure of a circuit board assembly according to an embodiment of the utility model

FIG. 4 is a schematic view of another embodiment of a circuit board assembly according to the present utility model;

FIG. 5 is a schematic diagram of an embodiment of an electronic device according to the present utility model;

FIG. 6 is a schematic cross-sectional view of the electronic device at C-C in the embodiment of FIG. 5;

fig. 7 is a block diagram schematically illustrating the structural composition of an embodiment of the electronic device of the present utility model.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is specifically noted that the following examples are only for illustrating the present utility model, but do not limit the scope of the present utility model. Likewise, the following examples are only some, but not all, of the examples of the present utility model, and all other examples, which a person of ordinary skill in the art would obtain without making any inventive effort, are within the scope of the present utility model.

In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. The terms "first," "second," "third," and the like in embodiments of the present utility model are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature. All directional indications (such as up, down, left, right, front, back … …) in embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular gesture (as shown in the drawings), and if the particular gesture changes, the directional indication changes accordingly. The terms "comprising" and "having" and any variations thereof in embodiments of the present utility model are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may alternatively include other steps or elements not listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the utility model. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

The utility model provides a circuit board assembly. Referring to fig. 1 to 3, the circuit board assembly 100 may include a circuit board 10 and an electronic component 20, wherein the circuit board 10 is provided with a plurality of pads 11, the electronic component 20 includes a plurality of pins 21, and the pins 21 are soldered on the pads 11 so as to electrically connect the electronic component 20 with the circuit board 10.

The circuit board 10 may include a solder mask layer 12, a core 13, a plurality of working layers 14, and a semi-cured layer 15 disposed corresponding to the working layers 14. The solder mask layer 12 can prevent the non-soldering points from being contaminated with solder during soldering to cause short circuit of the circuit, and can also play a role of dampproof protection circuit. The core 13 is used for supporting the working layer 14 and the semi-cured layer 15, and the core 13 can be copper/epoxy glass cloth or phenolic resin glass cloth, and all the materials have excellent electrical performance and processing performance.

A plurality of blind holes 16 may be disposed on the semi-cured layer 15 corresponding to the outermost working layer of the circuit board 10, for connecting the outermost working layer with an adjacent working layer. A plurality of buried holes 17 can be correspondingly formed on the semi-cured layer 15 or the core plate 13 of the circuit board 10 for connecting any two working layers except the outermost working layer. The circuit board 10 may also be provided with a plurality of through holes 18 for fixedly mounting connectors or communicating with a plurality of working layers.

More and more functions of the electronic device, the electronic component 20 of the electronic device is generally larger in size, and the pad 11 is small in size, resulting in insufficient bonding between the lead 21 of the electronic component 20 and the pad 11. To solve the above-mentioned problems, the circuit board assembly 100 provided by the present utility model connects the pads 11 corresponding to at least two electrically connected adjacent pins 21 to each other, so that at least two electrically connected adjacent pins 21 are soldered to the pads 11. Since at least two bonding pads 11 are communicated with each other, the welding area and tin loading amount between the pins 21 and the bonding pads 11 are increased, so that the welding between the pins 21 and the bonding pads 11 is firmer.

The number of interconnected pads 11 may be 2, 3 or more, and the interconnection between the plurality of pads 11 may further improve the reliability of the soldering between the leads 21 and the pads 11, but if the number of interconnected pads 11 is too large, the design flexibility of the circuit board 10 will be limited, and the amount of solder is increased, so that the number of interconnected pads 11 should be determined according to the actual requirement of the circuit board 10.

In some embodiments, the shape of the pad 11 before the non-communication may be one of a circle, an ellipse, a polygon, or a square. For via pads, a circular pad is typically used, and there is a proportional relationship between the size of the pad 11 and the size of the via 18, e.g., the size of the pad 11 is typically twice the size of the via 18. The rectangular pads are mainly used as the leads 21 of the surface mount electronic component 20, and the size thereof is related to the size of the corresponding leads 21 of the electronic component 20.

At least two mutually communicating pads 11 may be arranged in a straight line on the circuit board 10 as shown in fig. 2; the plurality of interconnected pads 11 may also be arranged in an L-shape on the circuit board 10, as shown in fig. 4, and fig. 4 is a schematic structural diagram of another embodiment of the circuit board assembly according to the present utility model.

With continued reference to fig. 2 and 4, in some embodiments, the plurality of pads 11 are connected to form a square, a racetrack, or a dumbbell shape, and the shape of the plurality of pads 11 after connection can be determined according to the actual requirements of the circuit board 10.

Referring to fig. 5 and fig. 6 together, fig. 5 is a schematic structural diagram of an embodiment of the electronic device provided by the present utility model, and fig. 6 is a schematic structural sectional view of the electronic device at C-C in the embodiment of fig. 5. The electronic device 200 may include the circuit board assembly 100 and the housing 210 as described above. The housing 210 forms a receiving space 211, the circuit board assembly 100 is disposed in the receiving space 211, and the circuit board assembly 100 is used for controlling the working state of the electronic device 200. In addition, the detailed technical features of the other hardware portion structures of the electronic device 200 are within the understanding scope of those skilled in the art, and will not be described herein.

Referring to fig. 7, fig. 7 is a schematic block diagram illustrating the structural components of an embodiment of the electronic device according to the present utility model, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, a wearable device, etc., and the embodiment illustrates the mobile phone as an example. The structure of the electronic device may include an RF circuit 91, a memory 92, an input unit 93, a display unit 94, a sensor 95, an audio circuit 96, a wifi module 97, a processor 98 (which may be a circuit board assembly 100 in the foregoing embodiment), a power supply 99, and the like. Wherein the RF circuit 91, the memory 92, the input unit 93, the display unit 94, the sensor 95, the audio circuit 96, and the wifi module 97 are respectively connected with the processor 98; the power supply 99 is used to supply power to the entire electronic device 200.

Specifically, the RF circuit 91 is configured to receive a signal; memory 92 is used to store data instruction information; the input unit 93 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 94 may include a display panel 941 and the like; the sensor 95 includes an infrared sensor, a laser sensor, etc. for detecting a user proximity signal, a distance signal, etc.; the speaker 961 and microphone 962 are coupled to the processor 98 through the audio circuit 96 for receiving and transmitting audio signals; the wifi module 97 is used for receiving and transmitting wifi signals, and the processor 98 is used for processing data information of the electronic device. For specific structural features of the electronic device, please refer to the related description of the above embodiment, and detailed description thereof will not be provided herein.

The circuit board assembly provided by the utility model has the advantages that at least the bonding pads 11 corresponding to at least two adjacent pins 21 which are electrically connected of the circuit board assembly 100 are communicated with each other, at least two adjacent pins 21 which are electrically connected can be communicated and welded on the bonding pads 11, the welding area and tin loading amount between the pins 21 and the bonding pads 11 are increased, the welding between the pins 21 and the bonding pads 11 is firmer, and the cracking of the welding positions of the bonding pads 11 and the pins 21 when the electronic equipment falls down or is subjected to stress impact in use can be effectively prevented.

The foregoing description is only a partial embodiment of the present utility model, and is not intended to limit the scope of the present utility model, and all equivalent devices or equivalent processes using the descriptions and the drawings of the present utility model or directly or indirectly applied to other related technical fields are included in the scope of the present utility model.

Claims

1. A circuit board assembly, comprising:

the electronic component comprises a circuit board and an electronic component, wherein a plurality of bonding pads are arranged on the circuit board, the electronic component comprises a plurality of pins, and the pins are welded on the bonding pads so as to enable the electronic component to be electrically connected with the circuit board;

and the bonding pads corresponding to the adjacent pins of at least two electrical connections are communicated with each other, so that the adjacent pins of at least two electrical connections are communicated and welded on the bonding pads.

2. The circuit board assembly of claim 1, wherein at least two interconnected pads are arranged in a straight line on the circuit board.

3. The circuit board assembly of claim 1, wherein a plurality of interconnected pads are arranged in an L-shape on the circuit board.

4. The circuit board assembly of claim 1, wherein the pads have one of a circular, oval, polygonal, or square shape prior to non-communication.

5. The circuit board assembly of claim 1, wherein a plurality of said pads are square, racetrack or dumbbell shaped after communication.

6. The circuit board assembly of claim 1, wherein the circuit board includes a solder mask layer to prevent solder contamination of the non-solder joints during soldering from shorting the circuit.

7. The circuit board assembly of claim 6, wherein the circuit board comprises a core board, a plurality of working layers, and a semi-cured layer disposed corresponding to the working layers, the core board for supporting the working layers and the semi-cured layer.

8. The circuit board assembly according to claim 7, wherein a plurality of blind holes are formed in the semi-cured layer corresponding to the outermost working layer of the circuit board for connecting the outermost working layer with the adjacent working layer;

and a plurality of buried holes are correspondingly formed in part of the semi-cured layer or the core plate of the circuit board and are used for connecting any two working layers except the outermost working layer.

9. The circuit board assembly of claim 7, wherein the circuit board is provided with a plurality of through holes for fixedly mounting the connectors or communicating with a plurality of the working layers.

10. An electronic device, comprising:

the circuit board assembly of any one of claims 1-9, and a housing;

the shell is provided with a containing space, the circuit board assembly is arranged in the containing space, and the circuit board assembly is used for controlling the working state of the electronic equipment.