CN204335149U - Pad structure and circuit board - Google Patents
Pad structure and circuit board Download PDFInfo
- Publication number
- CN204335149U CN204335149U CN201420646153.9U CN201420646153U CN204335149U CN 204335149 U CN204335149 U CN 204335149U CN 201420646153 U CN201420646153 U CN 201420646153U CN 204335149 U CN204335149 U CN 204335149U
- Authority
- CN
- China
- Prior art keywords
- pad
- auxiliary
- pad structure
- main
- main pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A kind of pad structure and the circuit board being provided with this pad structure, pad structure comprises main pad, be opened in this main pad center and for the pin jack of installing pin and the multiple auxiliary pad be located in around described main pad, described auxiliary pad has the fillet connected with described main pad.Foregoing circuit plate and pad structure thereof by arranging multiple auxiliary pad around main pad, when grafting electronic component pin is welded to above-mentioned pad structure, multiple auxiliary pads can increase the bonding area of tin cream, can be that on pad, tin is thick when carrying out wave-soldering, be not easy dry joint and solder skip, make the welding of pin more firm, avoid manual repair to add tin, and affect product quality.
Description
Technical field
The utility model relates to printed-board technology, particularly relates to a kind of pad structure and circuit board.
Background technology
In household electrical appliances electronic product, PCB (Printed Circuit Board, Chinese is printed circuit board) on load the larger power device of weight, pad on corresponding PCB and device pin jack also will increase, when PCB pad and jack excessive time to carry out there will be tin in wave soldering process thin, the problems such as Wuxi, local, and full solder joint cannot be formed.So, power device weight is large, and during work, temperature is higher, and pad is in for a long time and is heated and stress, and scolding tin easily ftractures, come off, and causes product reliability to reduce, shortens the life cycle of product.
Utility model content
Based on this, be necessary to provide a kind of and effectively can avoid being formed full solder joint, pad structure that reliability is high.
A kind of pad structure, comprises main pad, is opened in this main pad center and for the pin jack of installing pin and the multiple auxiliary pad be located in around described main pad, described auxiliary pad has the fillet connected with described main pad.
Further, described main pad is circular, oval or polygon.
Further, described auxiliary pad is triangle, rectangle, square, rectangle and semicircular combination or square and semicircular combination.
Further, described main pad has the width being at least greater than 3 millimeters.
Further, described pin jack has the width being at least greater than 1.2 millimeters.
Further, the interval between the multiple described auxiliary pad being located in the surrounding of described main pad is even.
Further, the described fillet of adjacent two described auxiliary pads is connected.
Further, the plurality of auxiliary pad forms Central Symmetry shape, and the center superposition of the center of the plurality of auxiliary pad and described main pad.
In addition, additionally provide a kind of circuit board, comprise electronic component and above-mentioned pad structure, described electronic component is installed on this pad structure.
Further, described electronic component is one or more combinations wherein of IGBT, rectifier bridge, electrochemical capacitor and connector socket.
Foregoing circuit plate and pad structure thereof by arranging multiple auxiliary pad around main pad, when grafting electronic component pin is welded to above-mentioned pad structure, multiple auxiliary pads can increase the bonding area of tin cream, can be that on pad, tin is thick when carrying out wave-soldering, be not easy dry joint and solder skip, make the welding of pin more firm, avoid manual repair to add tin, and affect product quality.
Accompanying drawing explanation
Figure 1A is the structural representation of pad structure in the utility model first embodiment;
Figure 1B is the structural representation of pad structure in the utility model second embodiment;
Fig. 1 C is the structural representation of pad structure in the utility model the 3rd embodiment;
Fig. 1 D is the structural representation of pad structure in the utility model the 4th embodiment;
Fig. 1 E is the structural representation of pad structure in the utility model the 5th embodiment;
Fig. 2 is the size indication figure of main pad and auxiliary pad in each embodiment of the utility model;
Fig. 3 is the structural representation of circuit board in the utility model embodiment.
Embodiment
In order to make the technical problems to be solved in the utility model, technical scheme and beneficial effect clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Figure 1A to Fig. 1 E, in the utility model preferred embodiment, pad structure 100 comprises main pad 110, pin jack 120 and multiple auxiliary pad 130.Pin jack 120 is opened in this main pad 110 center and for the pin of installing electronic elements, multiple auxiliary pad 130 is located in around described main pad 110, and auxiliary pad 130 has the fillet connected with main pad 110.
Generally, the interval between the multiple auxiliary pad 130 being located in the surrounding of main pad 110 is even.Wherein, the fillet of adjacent two auxiliary pads 130 (i.e. above-mentioned and main pad 110 connect fillet) can connect or not connect.Namely multiple auxiliary pad 130 is surroundings' (please contrast with reference to Figure 1A and Figure 1B) that mutually can be located in main pad 110 closely or with a gap.And according to actual conditions needs, auxiliary pad 130 can not be located in main pad 110 evenly and at intervals around.Main pad 11 is one-body molded making with auxiliary pad 130; Also can make respectively.
In the present embodiment, main pad 110 has the width being at least greater than 3 millimeters, and/or when pin jack 120 has the width being at least greater than 1.2 millimeters, needs around it, add auxiliary pad 130.
Further, the plurality of auxiliary pad 130 forms Central Symmetry shape, and the center of the plurality of auxiliary pad 130 and the center superposition of main pad 110.
Main pad 110 can be circular 110a (referring to figs. 1A to 1D), oval or polygon 110b (round rectangle with reference in figure 1E).So, when main pad 110 is circular main pad 110a, above-mentioned width and diameter; When main pad 110 is oval, above-mentioned width and minor axis length; When main pad 110 is polygon main pad 110b, the length of above-mentioned width and polygonal minor face.In the present embodiment, auxiliary pad 130 can be triangle (with reference to Figure 1A, 1B, 1E), rectangle (with reference to figure 1C), square (with reference to figure 1C), rectangle and semicircular combination (with reference to figure 1D) or square and semicircular combination (with reference to figure 1D).
Composition graphs 2 (1) and Fig. 2 (4), the design parameter of pad 130a assisted by triangle: the long a1 of triangle base approximates the 1/3-1/10 of main pad 110a diameter d; Triangle height h1 approximates the 1/3-1/10 of the diameter d of main pad 110a; Triangle assists the area of pad 130a to be about the 1/15-1/150 of main pad 110a area.In the present embodiment, with reference to Figure 1A, 1B, main pad 110a diameter is the diameter of 5mm, pin jack 120a is 1.2mm.Auxiliary pad 130a preferred size: the long a1 of triangle base is 1.4mm, and triangle height h1 is 1mm.The area of auxiliary pad 130a is about 0.7mm
2, main pad 110a area is about 19.6mm
2.The area of single auxiliary pad 130 is about 1/28 of the area of main pad 110.
Composition graphs 2 (2) and Fig. 2 (4), the design parameter of the auxiliary pad 130b of polygon (square or rectangle): polygonal long a2 approximates the 1/3-1/10 of circular main pad 110a diameter d; Polygonal wide b1 approximates the 1/3-1/10 of the diameter d of circular main pad 110a; Polygonal area is about the area of circular main pad 110a: 1/10-1/80.In the present embodiment, with reference to figure 1C, circular main pad 110a diameter is 5mm, pin jack 120a is 1.2mm.Polygon assists the long a2 of pad 130b to be 1.25mm, and wide b1 is 1.2mm.Area is about 1.5mm; The area of circular main pad 110a is about 19.6mm
2.Single polygon assists pad 130b area to be about 1/13 of the area of circular main pad 110a.
Composition graphs 2 (2) and Fig. 2 (3), the design parameter of the auxiliary pad 130c of polygon and semicircle composition: assist long a2 about 1/2 place of pad 130b to arrange the semicircle that diameter equals the wide b2 of polygon at polygon, wide b2 and polygon assist the wide b1 size value of pad 130b identical.
The Combination Design mode of circular main pad 110a and the auxiliary pad 130c that pad 130a assisted by triangle, polygon assists pad 130b and polygon and semicircle form: with circle main pad 110a central point for round dot, assist the limit of the base of pad (130a, 130b, 130c) and main pad 110a tangent, auxiliary pad (130a, 130b, 130c) quantity is about: 4-30, place by certain angle.As: when being 30 ° by two adjacent auxiliary pad (130a, 130b, 130c) centers with the angle of circular line, auxiliary pad (130a, 130b, 130c) quantity is 12; When two adjacent auxiliary pad 130a centers are 45 ° with the angle of circular line, auxiliary pad (130a, 130b, 130c) quantity is 8.
When main pad 110 is for having the rectangle of fillet, the method to set up of auxiliary pad 130.Composition graphs 1E and Fig. 2 (1), pad 130a is assisted to be illustrated for triangle: the four edges of triangle base a1 and the main pad 110b of rectangle is tangentially around placement, quantity 8-40 of auxiliary pad 130a, the area of auxiliary pad 130a is about main pad 110b area: 1/10-1/150.The present embodiment: leg-of-mutton bottom side length a is 1.4mm, triangle height h1 is 1mm.Auxiliary pad 130a area is about 0.7mm
2; The long edge lengths of main pad 110b is 6mm, and minor face width is 4mm, and area is about 24mm
2.Single auxiliary pad 130b area is about 1/34 of the area of main pad 110b.
In addition, with reference to figure 3, additionally provide a kind of circuit board 10, comprise electronic component and above-mentioned pad structure 100, described electronic component is installed on this pad structure 100.Electronic component is IGBT (Insulated GateBipolar Transistor, insulated gate bipolar transistor), rectifier bridge BR1, electrochemical capacitor E1 and connector socket CN1 one or more combinations wherein.
Foregoing circuit plate and pad structure thereof by arranging multiple auxiliary pad around main pad, when grafting electronic component pin is welded to above-mentioned pad structure, multiple auxiliary pads can increase the bonding area of tin cream, can be that on pad, tin is thick when carrying out wave-soldering, be not easy dry joint and solder skip, make the welding of pin more firm, avoid manual repair to add tin, and affect product quality.
The above embodiment only have expressed several execution mode of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (10)
1. a pad structure, it is characterized in that, comprise main pad, be opened in this main pad center and for the pin jack of installing pin and the multiple auxiliary pad be located in around described main pad, described auxiliary pad has the fillet connected with described main pad.
2. pad structure according to claim 1, is characterized in that, described main pad is circular, oval or polygon.
3. pad structure according to claim 1, is characterized in that, described auxiliary pad is triangle, rectangle, square, rectangle and semicircular combination or square and semicircular combination.
4. the pad structure according to claim 1,2 or 3, is characterized in that, described main pad has the width being at least greater than 3 millimeters.
5. the pad structure according to claim 1,2 or 3, is characterized in that, described pin jack has the width being at least greater than 1.2 millimeters.
6. the pad structure according to claim 1,2 or 3, is characterized in that, the interval between the multiple described auxiliary pad being located in the surrounding of described main pad is even.
7. pad structure according to claim 5, is characterized in that, the described fillet of adjacent two described auxiliary pads is connected.
8. the pad structure according to claim 1,2 or 3, is characterized in that, the plurality of auxiliary pad forms Central Symmetry shape, and the center superposition of the center of the plurality of auxiliary pad and described main pad.
9. a circuit board, is characterized in that, comprise electronic component and the pad structure described in any one of claim 1 to 8, described electronic component is installed on this pad structure.
10. circuit board according to claim 9, is characterized in that, described electronic component is one or more combinations wherein of IGBT, rectifier bridge, electrochemical capacitor and connector socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420646153.9U CN204335149U (en) | 2014-10-31 | 2014-10-31 | Pad structure and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420646153.9U CN204335149U (en) | 2014-10-31 | 2014-10-31 | Pad structure and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204335149U true CN204335149U (en) | 2015-05-13 |
Family
ID=53171453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420646153.9U Expired - Fee Related CN204335149U (en) | 2014-10-31 | 2014-10-31 | Pad structure and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204335149U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883813A (en) * | 2015-06-10 | 2015-09-02 | 昆山市华涛电子有限公司 | Hard circuit board |
| WO2024130806A1 (en) * | 2022-12-23 | 2024-06-27 | 宜宾市天珑通讯有限公司 | Circuit board assembly and electronic device |
-
2014
- 2014-10-31 CN CN201420646153.9U patent/CN204335149U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883813A (en) * | 2015-06-10 | 2015-09-02 | 昆山市华涛电子有限公司 | Hard circuit board |
| CN104883813B (en) * | 2015-06-10 | 2018-02-06 | 昆山市华涛电子有限公司 | A kind of rigid wiring board |
| WO2024130806A1 (en) * | 2022-12-23 | 2024-06-27 | 宜宾市天珑通讯有限公司 | Circuit board assembly and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103177995A (en) | Positioning plate for one-off welding of IGBT (insulated gate bipolar transistor) | |
| CN204335149U (en) | Pad structure and circuit board | |
| CN201478299U (en) | Power module electrode and power module | |
| TW201343008A (en) | Printed circuit board structure | |
| CN102142411A (en) | Chip packaging component of printed circuit board assembly (PCBA) and welding component | |
| CN105307392A (en) | Printed circuit board and electronic equipment | |
| CN204560052U (en) | A kind of firm banking | |
| CN202364474U (en) | PCB structure for handset | |
| CN204470756U (en) | Through-hole reflow positioning fixture | |
| CN207602557U (en) | Fixing device is isolated in a kind of IGBT module | |
| CN203659302U (en) | Direct-connection combination experimental board | |
| CN104363698A (en) | Circuit board, row pin package structure thereof and package design method | |
| CN204215867U (en) | The new arrangement solder terminal that a kind of low voltage mutual inductor is special | |
| CN203590609U (en) | Steel plate structure | |
| CN204668150U (en) | A kind of bonded LED lamp capacitor | |
| CN202513225U (en) | Battery electrode contact component | |
| CN204632646U (en) | A kind of novel computer mechanical keyboard circuit board and keyboard | |
| CN104979095A (en) | Surface mount device (SMD) LED light capacitor | |
| CN205159320U (en) | Take metalwork of diode | |
| CN104900620A (en) | PCB fixing structure of plastic-packaging type IPM and fixing method thereof | |
| CN204992008U (en) | A component for power adapter | |
| CN205754195U (en) | Inductive component attachment structure for photovoltaic DC-to-AC converter | |
| CN202333185U (en) | Wiring pedestal | |
| CN204069525U (en) | Universal tool | |
| CN202523700U (en) | AAP power module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150513 Termination date: 20171031 |