CN202523700U - AAP power module - Google Patents

Abstract

This utility model discloses an AAP power module, including a heat sink. From bottom to top, the heat sink comprises a DBC board, metal terminals, a bridge, a molybdenum sheet, a chip, another molybdenum sheet, and a metal connecting piece. A gate lead is located above the chip. Adjacent components of the heat sink, DBC board, metal terminals, bridge, molybdenum sheet, chip, metal connecting piece, and gate lead are soldered together with solder pads. Soldering between adjacent components significantly improves the reliability of the power module. Solder is applied at the connection point between the lower end of the gate lead and the chip gate, ensuring a more secure connection. This utility model features a simple structure, low production cost, and good heat dissipation.

Description

A kind of AAP power module

technical field

The utility model relates to the technical field of power electronics, in particular to an AAP power module.

Background technique

The power module is an electronic device necessary for the development of modern power electronics towards integration and miniaturization. It is a direction for the development of power electronics technology. In recent years, it has been increasing at a rate of 20% every year, and the development trend is still rising. The power module is the core device of the power electronic circuit and control system, and its performance parameters directly determine the efficiency and reliability of the power electronic system. The AAP power module is a power semiconductor product, and its maximum current can reach more than 100 A. The traditional AAP power module has a complex structure, high production cost, poor reliability and heat dissipation. the

Contents of the invention

Aiming at the deficiencies of the prior art, the purpose of this utility model is to provide an AAP power module with simple structure, low production cost, high reliability and good heat dissipation.

In order to solve the above technical problems, the technical solution adopted by the utility model is: an AAP power module, including a heat dissipation plate, characterized in that: a DBC board, a metal terminal, and a bridge are arranged on the heat dissipation plate from bottom to top , molybdenum sheet, chip, molybdenum sheet, metal connection sheet, the gate lead is arranged above the chip, and the heat dissipation plate, DBC board, metal terminal, bridge, molybdenum sheet, chip, metal connection sheet, gate The adjacent components in the leads are welded with solder lugs.

The aforementioned AAP power module is characterized in that solder is provided at the connection between the lower end of the gate lead and the gate of the chip.

The aforementioned AAP power module is characterized in that: there are multiple metal terminals.

The aforementioned AAP power module is characterized in that: the number of gate leads is two.

Compared with the prior art, the utility model has the advantages that soldering is used between adjacent components in the radiator plate, DBC plate, metal terminal, bridge, molybdenum sheet, chip, metal connecting sheet, and gate lead. , so that the reliability of the power module is significantly improved; solder is provided at the connection between the lower end of the gate lead and the gate of the chip, so that the connection between the gate lead and the gate of the chip is firmer. The utility model has the advantages of simple structure, low production cost and good heat dissipation.

Description of drawings

Fig. 1 is the structural representation of the utility model.

Detailed ways

In order to further reveal the technical solution of the utility model, the implementation of the utility model is described in detail in conjunction with the accompanying drawings: as shown in Figure 1, an AAP power module includes a heat sink 1, and the heat sink 1 is sequentially arranged from bottom to top There are DBC board 2, metal terminal 3, bridge 4, molybdenum sheet 5, chip 6, molybdenum sheet 5, metal connection sheet 7, gate lead 8 is arranged on the top of chip 6, the number of gate lead 8 is 2, metal The number of terminals 3 is three. Soldering pieces 10 are used to weld adjacent components in the heat dissipation plate 1, DBC plate 2, metal terminal 3, bridge 4, molybdenum sheet 5, chip 6, metal connecting piece 7, and gate lead 8. Solder 9 is provided at the joint between the lower end of the gate lead 8 and the gate of the chip 6, so that the connection between the gate lead and the chip is more firm.

The utility model uses a special mold to weld the adjacent parts of the cooling plate 1, the DBC plate 2, the metal terminal 3, the bridge 4, the molybdenum sheet 5, the chip 6, the metal connecting sheet 7, and the gate lead 8. The chip 10 is vacuum welded at one time, and since the gate lead 8 and other materials are welded at the same time, the cumbersome bonding process is omitted, and the reliability of the product is significantly improved.

   Through the introduction to the listed embodiments above, the basic idea and basic principle of the present utility model have been set forth. But the utility model is by no means limited to the embodiments listed above, and all equivalent changes, improvements, and deliberate deterioration based on the technical solutions of the utility model should fall within the scope of protection of the utility model.

Claims (4)

1. An AAP power module, comprising a heat dissipation plate, is characterized in that: a DBC plate, a metal terminal, a bridge, a molybdenum sheet, a chip, a molybdenum sheet, and a metal connecting sheet are successively arranged on the heat dissipation plate from bottom to top, The top of the chip is provided with a gate lead, and the adjacent components in the heat sink, DBC plate, metal terminal, bridge, molybdenum sheet, chip, metal connecting sheet, and gate lead are welded with soldering pieces . 2 . The AAP power module according to claim 1 , wherein solder is provided at the connection between the lower end of the gate lead and the gate of the chip. 3 . 3. The AAP power module according to claim 1, wherein the number of said metal terminals is multiple. 4. The AAP power module according to claim 1, wherein the number of said gate leads is two.

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